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D D D D D: SN74CBT3126 Quadruple Fet Bus Switch

SN74CBT3126 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE) input is low. Pin numbers shown are for the D, DGV, and PW packages.

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0% found this document useful (0 votes)
73 views4 pages

D D D D D: SN74CBT3126 Quadruple Fet Bus Switch

SN74CBT3126 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE) input is low. Pin numbers shown are for the D, DGV, and PW packages.

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Ricky Cox
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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SN74CBT3126 QUADRUPLE FET BUS SWITCH

SCDS020E MAY 1995 REVISED MAY 1998

D D D D D

Standard 126-Type Pinout (D, DGV, and PW Packages) 5- Switch Connection Between Two Ports TTL-Compatible Input Levels Latch-Up Performance Exceeds 250 mA Per JESD 17 Package Options Include Plastic Small-Outline (D), Shrink Small-Outline (DBQ), Thin Very Small-Outline (DGV), and Thin Shrink Small-Outline (PW) Packages

D, DGV, OR PW PACKAGE (TOP VIEW)

1OE 1A 1B 2OE 2A 2B GND

1 2 3 4 5 6 7

14 13 12 11 10 9 8

VCC 4OE 4A 4B 3OE 3A 3B

description
The SN74CBT3126 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE) input is low. The SN74CBT3126 is characterized for operation from 40C to 85C.
FUNCTION TABLE (each bus switch) INPUT OE L H FUNCTION Disconnect A=B

DBQ PACKAGE (TOP VIEW)

NC 1OE 1A 1B 2OE 2A 2B GND

1 2 3 4 5 6 7 8

16 15 14 13 12 11 10 9

VCC 4OE 4A 4B 3OE 3A 3B NC

NC No internal connection

logic diagram (positive logic)


2 1A 1 1OE 2A 5 6 2B 3 1B

2OE 3A

4 9 8 3B 10 12 11 4B 13

3OE

4A

4OE

Pin numbers shown are for the D, DGV, and PW packages. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1998, Texas Instruments Incorporated

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

SN74CBT3126 QUADRUPLE FET BUS SWITCH


SCDS020E MAY 1995 REVISED MAY 1998

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127C/W DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51.

recommended operating conditions (see Note 3)


MIN VCC VIH VIL TA Supply voltage High-level control input voltage Low-level control input voltage Operating free-air temperature 40 4 2 0.8 85 MAX 5.5 UNIT V V V C

NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER VIK II ICC ICC Ci Cio(OFF) Control inputs Control inputs VCC = 4 V, VCC = 5.5 V, VCC = 5.5 V, VCC = 5.5 V, VI = 3 V or 0 VO = 3 V or 0, VCC = 4 V, ron VCC = 4.5 V TEST CONDITIONS II = 18 mA VI = 5.5 V or GND IO = 0, One input at 3.4 V, OE = GND TYP at VCC = 4 V, VI = 0 VI = 2.4 V, II = 64 mA II = 30 mA II = 15 mA II = 15 mA VI = VCC or GND Other inputs at VCC or GND 3 4 16 5 5 22 7 7 MIN TYP MAX 1.2 1 3 2.5 UNIT V A A mA pF pF

VI = 2.4 V, 10 15 All typical values are at VCC = 5 V (unless otherwise noted), TA = 25C. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals.

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

SN74CBT3126 QUADRUPLE FET BUS SWITCH


SCDS020E MAY 1995 REVISED MAY 1998

switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER tpd ten FROM (INPUT) A or B OE TO (OUTPUT) B or A A or B VCC = 4 V MIN MAX 0.35 5.4 1.6 VCC = 5 V 0.5 V MIN MAX 0.25 5.1 ns ns UNIT

tdis OE A or B 5 1 4.5 ns The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).

PARAMETER MEASUREMENT INFORMATION


7V From Output Under Test CL = 50 pF (see Note A) 500 S1 Open GND 500 Output Control (low-level enabling) tPZL Output Waveform 1 S1 at 7 V (see Note B) tPZH VOH Output 1.5 V VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) TEST tpd tPLZ/tPZL tPHZ/tPZH S1 Open 7V Open

3V 1.5 V 1.5 V 0V tPLZ 3.5 V 1.5 V tPHZ VOH VOH 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES VOL + 0.3 V VOL

LOAD CIRCUIT

3V Input 1.5 V 1.5 V 0V tPLH tPHL

1.5 V

NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH andtPHL are the same as tpd.

Figure 1. Load Circuit and Voltage Waveforms

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TIs standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (CRITICAL APPLICATIONS). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMERS RISK. In order to minimize risks associated with the customers applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TIs publication of information regarding any third partys products or services does not constitute TIs approval, warranty or endorsement thereof.

Copyright 1998, Texas Instruments Incorporated

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