Data Pdsn54abt16245
Data Pdsn54abt16245
FUNCTION TABLE
(each 8-bit section)
INPUTS
OPERATION
OE DIR
L L B data to A bus
L H A data to B bus
H X Isolation
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SCBS084B − D3712, JANUARY 1991 − REVISED DECEMBER 1992
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state or power-off state, VO . . . . . . . . . . . . . −0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABT16245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABT16245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Maximum power dissipation at TA = 55°C (in still air): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.85 W
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3−2 •
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SCBS084B − D3712, JANUARY 1991 − REVISED DECEMBER 1992
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SCBS084B − D3712, JANUARY 1991 − REVISED DECEMBER 1992
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
VCC = 5 V,
FROM TO SN54ABT16245 SN74ABT16245
PARAMETER TA = 25°C UNIT
(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX MIN MAX
tPLH 1 2.2 3.4 0.5 4 1 3.9
A or B B or A ns
tPHL 1 2.1 3.8 0.5 4.6 1 4.5
tPZH 1 3.1 4.4 0.8 5.5 1 5.4
OE B or A ns
tPZL 1 3 6.1 0.9 7.3 1 7.2
tPHZ 1.3 3.5 4.7 1.3 6.3 1.3 5.5
OE B or A ns
tPLZ 1.4 3.2 4.7 1.4 5.3 1.4 5.2
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SCBS084B − D3712, JANUARY 1991 − REVISED DECEMBER 1992
500 Ω S1 Open
From Output TEST S1
Under Test GND
tPLH/tPHL Open
CL = 50 pF 500 Ω tPLZ/tPZL 7V
(see Note A) tPHZ/tPZH Open
3V 3V
Input Output
1.5 V 1.5 V 1.5 V 1.5 V
(see Note B) Control
0V 0V
tPZL
tPLH tPHL
tPLZ
VOH Output 3.5 V
1.5 V Waveform 1 1.5 V
Output 1.5 V VOL + 0.3 V
S1 at 7 V VOL
VOL
(see Note C)
tPHZ
tPHL tPLH tPZH
Output
VOH VOH
Waveform 2 VOH − 0.3 V
Output 1.5 V 1.5 V 1.5 V
S1 at Open
VOL (see Note C) [0V
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POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3−5
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77001
SCBS084B − D3712, JANUARY 1991 − REVISED DECEMBER 1992
3−6 •
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
SN74ABT16245DGGR OBSOLETE TSSOP DGG 48 TBD Call TI Call TI
SN74ABT16245DL OBSOLETE SSOP DL 48 TBD Call TI Call TI
SN74ABT16245DLR OBSOLETE SSOP DL 48 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
48 25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03) Gage Plane
0.010 (0,25)
1 24 0°–ā8°
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.004 (0,10)
0.110 (2,79) MAX 0.008 (0,20) MIN
PINS **
28 48 56
DIM
0,27
0,50 0,08 M
0,17
48 25
6,20 8,30
6,00 7,90 0,15 NOM
Gage Plane
0,25
1 24
0°– 8°
A 0,75
0,50
Seating Plane
0,15
1,20 MAX 0,10
0,05
PINS **
48 56 64
DIM
4040078 / F 12/97