GANA-000041

Ed. 00

OfficeServ 7400

Service Manual

COPYRIGHT
This manual is proprietary to SAMSUNG Electronics Co., Ltd. and is protected by copyright.
No part of this document may be copied, translated, transcribed or duplicated for any commercial purposes or
disclosed to a third party in any form without the prior written consent of SAMSUNG Electronics Co., Ltd.

TRADEMARKS
is a registered trademark of Samsung Electronics Co. Ltd.
Besides them, product names mentioned in this product may be trademarks and/or registered
trademarks of their respective companies.

This manual should be read and used as a guideline for properly installing and operating the product.
This manual may be changed for the system improvement, standardization and other technical reasons without prior
notice.
If you need updated manuals or have any questions concerning the contents of the manuals, contact our Document
Center at the following address or Web site:
Address: Document Center 18th Floor IT Center. Dong-Suwon P.O. Box 105, 416, Maetan-3dong Yeongtong-gu,
Suwon-si, Gyeonggi-do, Korea 442-600
Homepage: http://www.samsungdocs.com

2005 SAMSUNG Electronics Co., Ltd.

All rights reserved.

OfficeServ 7400 Service Manual

INTRODUCTION

Purpose
This manual introduces the overview and the specification of the OfficeServ 7400 system;
and the troubleshooting of the troubles that can occur while using the system and the
programming methods for the system maintenance.

Audience
This manual is intended for the service engineers who perform the troubleshooting of the
OfficeServ 7400 System.

Document Content and Organization

This manual is composed of seven chapters and the abbreviations, which can be
summarized as follows:
CHAPTER 1. Introduction to System describes:
The main functions, the configuration, and the specifications of OfficeServ 7400 System.
CHAPTER 2. Inside the Circuit describes:
The configurations and the features by each module in OfficeServ 7400 System.
CHAPTER 3. Troubleshooting describes:
The troubles and their troubleshootings that can occur while using OfficeServ 7400 System.
CHAPTER 4. Maintenance Programming describes:
The smart media, the Complex Programmable Logic Devices(CPLD), and the offline
programming method for maintaining the OfficeServ 7400 System.
CHAPTER 5. Parts Layout provides:
The parts layout of OfficeServ 7400 System.
Index provides main searching keywords to be found.
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CHAPTER 6. Parts Lists provides:

The overall part lists of the OfficeServ 7400 System.
CHAPTER 7. System Parts Diagram provides:
The apparatus drawing and part list of each apparatus in OfficeServ 7400 System.
ABBREVIATION
The abbreviations and the explanations to the abbreviations frequently used in this manual.

Conventions
The following types of paragraphs contain special information that must be carefully read
and thoroughly understood. Such information may or may not be enclosed in a rectangular
box, separating it from the main text, but is always preceded by an icon and/or a bold title.

WARNING
Provides information or instructions that the reader should follow in order to avoid
personal injury or fatality.

CAUTION
Provides information or instructions that the reader should follow in order to avoid
a service failure or damage to the system.

CHECKPOINT
Provides the operator with checkpoints for stable system operation.

NOTE
Indicates additional information as a reference.

Console Screen Output

II

The lined box with Courier New font will be used to distinguish between the
main content and console output screen text.

Bold Courier New font will indicate the value entered by the operator on the
console screen.

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OfficeServ 7400 Service Manual

Reference
OfficeServ 7400 System Manual
The OfficeServ 7400, and the system information necessary for understanding the system
such as the configuration, the specification, and the functions of the hardware.
OfficeServ 7400 Installation Guide
The conditions necessary for the installation of the system, the installing methods of the
system, and the checking and operating methods of the system.
OfficeServ 7400 Call Server Programming Guide
The methods of using the Man Machine Communication(MMC) that changes the system
setup by using the phone.
OfficeServ 7400 Data Server User Guide
The introduction to Data Server, which is the OfficeServ 7400 application software, and its
installation procedure and the usages.

Revision History
EDITION

DATE OF ISSUE

REMARKS

00

12. 2005.

First Edition

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This page is intentionally left blank.

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OfficeServ 7400 Service Manual

SAFETY CONCERNS

For product safety and correct operation, the following information must be given to the
operator/user and shall be read before the installation and operation.

Symbols
Caution
Indication of a general caution

Restriction
Indication for prohibiting an action for a product

Instruction
Indication for commanding a specifically required action

Warning

WARNING
After Troubleshooting the Products
Be careful so that the metal alien substances are not inserted into the products
after repairing the products. If the alien materials are removed, it can be the
cause of fire, or of the damage to the parts.

Before Troubleshooting
Be sure to disconnect the connected cable when performing the troubleshooting.
Failure to do so can be the cause of fire or electric shock.

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Caution

CAUTION
Caution when Assembling
Be careful so that there should be no gaps between the housing and the base in
the fully-assembled status by connecting the various connectors and the screws
after repairing. The gaps can be the cause of the products abnormal operation.

Caution in the Storing the Boards

Be sure not to place the boards on the place where there are metals or the
conductive substances. Placing the boards on the place where there are the
metals or the conductive substances can be the cause of the damage to the
boards.

Use of the Standardized Parts when Reparing

Use the rated standard parts when reparing the products. Failure to do so can be
the cause of the abnormal operation of the products.

Caution when Using the Smart Media Card

Use only the smart media card that is provided when purchasing the system.
If there a damage occurs in the system because of using the other products,
its blame is not to be shifted to Samsung Electronics Co. Ltd. and also the aftersales services are not provided.

Caution when Connecting the PC and the Target Board

Be sure to connect the PC and the target board only when the power is off.
If connected when the power is supplied, the parallel port of the PC of the target
board can be damaged.

Caution when Handling the Electric Parts

Put on the wrist band for preventing the static electricity so that the parts are not
damaged by the static electricity.

VI

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OfficeServ 7400 Service Manual

TABLE OF CONTENTS

INTRODUCTION

Purpose ...................................................................................................................................................... I
Audience..................................................................................................................................................... I
Document Content and Organization ....................................................................................................... I
Conventions............................................................................................................................................... II
Console Screen Output ............................................................................................................................ II
Reference ................................................................................................................................................. III
Revision History ....................................................................................................................................... III

SAFETY CONCERNS

Symbols .....................................................................................................................................................V
Warning .....................................................................................................................................................V
Caution ....................................................................................................................................................VI

CHAPTER 1. Introduction to System

1-1

1.1

Main Functions ......................................................................................................................... 1-1

1.2

System Configuration .............................................................................................................. 1-4

1.3

1.2.1

Front View.................................................................................................................................1-4

1.2.2

Rear Side ..................................................................................................................................1-5

System Specifications ............................................................................................................. 1-6

1.3.1

System Capacity.......................................................................................................................1-6

1.3.2

Electrical Specifications............................................................................................................1-9

1.3.3

Power Specifications ..............................................................................................................1-16

1.3.4

External Rectifier ....................................................................................................................1-16

1.3.5

Rings and Signal Tones .........................................................................................................1-17

1.3.6

Available Terminals.................................................................................................................1-18

1.3.7

Device Specifications .............................................................................................................1-19

CHAPTER 2. Inside the Circuit

2.1

2-1

System Structure...................................................................................................................... 2-1

2.1.1

Block Diagram ..........................................................................................................................2-1

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2.1.2

Characteristics of the Communication System between Modules ....................................... 2-3

2.2

Mother Board ............................................................................................................................ 2-4

2.3

Power Supply Module.............................................................................................................. 2-4

2.4

Control Board ........................................................................................................................... 2-5

2.5

2.4.1

MP40 Board ............................................................................................................................. 2-5

2.4.2

LP40 Board .............................................................................................................................. 2-9

Universal Board...................................................................................................................... 2-14

2.5.1

8TRK board............................................................................................................................ 2-14

2.5.2

TEPRI board .......................................................................................................................... 2-17

2.5.3

TEPRI2 board ........................................................................................................................ 2-19

2.5.4

8SLI board.............................................................................................................................. 2-23

2.5.5

16SLI board............................................................................................................................ 2-26

2.5.6

16SLI2/16MWSLI board........................................................................................................ 2-27

2.5.7

8HYB/8HYB2 board .............................................................................................................. 2-30

2.5.8

8DLI board ............................................................................................................................. 2-32

2.5.9

16DLI/16DLI2 board .............................................................................................................. 2-36

2.5.10 MGI Board ............................................................................................................................. 2-40

2.5.11 MGI64 Board.......................................................................................................................... 2-43
2.5.12 4DSL Board ........................................................................................................................... 2-46
2.5.13 4WLI Board............................................................................................................................ 2-48
2.5.14 WBS24 Base Station (To Be Released Afterwards)............................................................ 2-50
2.5.15 LIM board............................................................................................................................... 2-54
2.5.16 PLIM Board............................................................................................................................ 2-56
2.5.17 GPLIM Board......................................................................................................................... 2-59
2.5.18 GSIM Board........................................................................................................................... 2-62
2.5.19 GWIM Board..................................................................! .
2.6

2.7

Option Board (Daughter Board) ........................................................................................... 2-69

2.6.1

Modem Board ........................................................................................................................ 2-70

2.6.2

MIS Board .............................................................................................................................. 2-72

2.6.3

MFM/SCM Board................................................................................................................... 2-74

2.6.4

RCM Board ............................................................................................................................ 2-75

2.6.5

CRM Board ............................................................................................................................ 2-77

2.6.6

RCM2 Board .......................................................................................................................... 2-78

2.6.7

MGI2D Board......................................................................................................................... 2-79

2.6.8

GWIMS Board........................................................................................................................ 2-80

Terminals................................................................................................................................. 2-81
2.7.1

VIII

DPIM....................................................................................................................................... 2-81

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OfficeServ 7400 Service Manual

CHAPTER 3. Troubleshooting
3.1

3-1

Sustem Operation Diagnoses ................................................................................................. 3-1

3.1.1

Checking Basic Cabinet Power ...............................................................................................3-1

3.1.2

Checking Expansion Cabinet Power.......................................................................................3-2

3.1.3

Abnormal Battery Backup (1)...................................................................................................3-3

3.1.4

Abnormal Battery Backup (2)...................................................................................................3-4

3.1.5

MP40 Board Operation Check.................................................................................................3-5

3.1.6

LP40 Board Operation Check..................................................................................................3-6

3.1.7

Power is not Supplied to xSLI or xDLI Board Ports................................................................3-7

3.1.8

Board Failure ............................................................................................................................3-8

3.1.9

Call is not Connected (Related with Highway)........................................................................3-9

3.1.10 Call is not Connected (Related with Switching Clock) .........................................................3-10

3.1.11 Music on Hold/Background Music Source Failure ...............................................................3-11
3.1.12 External Paging is not Available ............................................................................................3-12
3.2

3.3

3.4

Mother Board .......................................................................................................................... 3-13

3.2.1

Mother Board Failure..............................................................................................................3-13

3.2.2

-54 V is not Supplied to Mother Board ..................................................................................3-14

3.2.3

DTMF Receiver of Mother Board Does not Operate............................................................3-15

Control Board ......................................................................................................................... 3-16

3.3.1

MP40 Board............................................................................................................................3-16

3.3.2

LP40 Board.............................................................................................................................3-22

Universal Board ...................................................................................................................... 3-24

3.4.1

8TRK Board ............................................................................................................................3-24

3.4.2

TEPRI Board...........................................................................................................................3-28

3.4.3

TEPRI2 Board.........................................................................................................................3-33

3.4.4

8SLI/16SLI/8HYB/8HYB2 Board ...........................................................................................3-40

3.4.5

16SLI2/16MWSLI Board ........................................................................................................3-45

3.4.6

MGI Board...............................................................................................................................3-49

3.4.7

MGI64 Board ..........................................................................................................................3-53

3.4.8

4DSL Board ............................................................................................................................3-57

3.4.9

LIM Board ...............................................................................................................................3-59

3.4.10 PLIM Board.............................................................................................................................3-60

3.4.11 GPLIM Board..........................................................................................................................3-62
3.4.12 GSIM Board............................................................................................................................3-70
3.4.13 GWIM Board...........................................................................................................................3-75
3.5

Option Board (Daughter Board)............................................................................................ 3-83

3.5.1

MODEM Board .......................................................................................................................3-83

3.5.2

MIS Board ...............................................................................................................................3-84

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3.5.3

MFM/SCM Board................................................................................................................... 3-88

3.5.4

RCM Board ............................................................................................................................ 3-91

3.5.5

CRM Board ............................................................................................................................ 3-95

3.5.6

RCM2 Board .......................................................................................................................... 3-98

CHAPTER 4. Maintenance Programming

4.1

4.2

4.3

4-1

Smart Media Programming ..................................................................................................... 4-1

4.1.1

Installing ................................................................................................................................... 4-1

4.1.2

Performing Functions .............................................................................................................. 4-3

CPLD Programming ................................................................................................................. 4-8

4.2.1

Lattice CPLD Programming .................................................................................................... 4-8

4.2.2

Altera EPLD Programming.................................................................................................... 4-14

Offline Programming ............................................................................................................. 4-16

4.3.1

Preparing................................................................................................................................ 4-16

4.3.2

Environment Configuration.................................................................................................... 4-16

4.3.3

Starting to the Offline Test Mode ........................................................................................... 4-17

CHAPTER 5. Parts Layout

5-1

5.1

MP40 Board............................................................................................................................... 5-2

5.2

LP40 Board ............................................................................................................................... 5-4

5.3

8TRK Board............................................................................................................................... 5-5

5.4

TEPRI Board ............................................................................................................................. 5-7

5.5

TEPRI2 Board ........................................................................................................................... 5-9

5.6

16SLI Board .............................................................................................................................5-11

5.7

16SLI2/16MWSLI Board ......................................................................................................... 5-13

5.8

8HYB Board ............................................................................................................................ 5-15

5.9

8HYB2 Board .......................................................................................................................... 5-17

5.10 16DLI Board ............................................................................................................................ 5-19

5.11

16DLI2 Board .......................................................................................................................... 5-21

5.12

MGI Board ............................................................................................................................... 5-23

5.13

MGI64 Board ........................................................................................................................... 5-25

5.14 4DSL Board ............................................................................................................................. 5-26

5.15 4WLI Board.............................................................................................................................. 5-28
5.16

LIM Board ................................................................................................................................ 5-29

5.17 PLIM Board.............................................................................................................................. 5-31

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OfficeServ 7400 Service Manual

5.18 GPLIM Board ........................................................................................................................... 5-33

5.19 GSIM Board ............................................................................................................................. 5-35
5.20 GWIM Board ............................................................................................................................ 5-37
5.21

MODEM Board ........................................................................................................................ 5-39

5.22

MIS Board ................................................................................................................................ 5-40

5.23

MFM/SCM Board ..................................................................................................................... 5-40

5.24 RCM Board .............................................................................................................................. 5-41

5.25 CRM Board .............................................................................................................................. 5-41
5.26 RCM2 Board ............................................................................................................................ 5-42
5.27

MGI2D Board ........................................................................................................................... 5-42

5.28

LIMD Board.............................................................................................................................. 5-43

5.29 PLIMD Board ........................................................................................................................... 5-44

5.30 GLIMD Board........................................................................................................................... 5-45
5.31 GSIMD Board........................................................................................................................... 5-46
5.32 GWIMD Board ......................................................................................................................... 5-46
5.33 GWIMS Board.......................................................................................................................... 5-47

CHAPTER 6. Parts Lists

6-1

6.1

MP40 Board ............................................................................................................................... 6-2

6.2

LP40 Board.............................................................................................................................. 6-10

6.3

8TRK Board ............................................................................................................................. 6-18

6.4

TEPRI Board............................................................................................................................ 6-20

6.5

TEPRI2 Board.......................................................................................................................... 6-25

6.6

8SLI Board............................................................................................................................... 6-32

6.7

16SLI Board............................................................................................................................. 6-39

6.8

16MWSLI Board ...................................................................................................................... 6-49

6.9

8HYB Board............................................................................................................................. 6-58

6.10 8HYB2 Board........................................................................................................................... 6-66

6.11

8DLI Board............................................................................................................................... 6-74

6.12 16DLI Board............................................................................................................................. 6-78

6.13 16DLI2 Board .......................................................................................................................... 6-82
6.14

MGI Board................................................................................................................................ 6-86

6.15

MGI64 Board............................................................................................................................ 6-92

6.16 4DSL Board ............................................................................................................................. 6-97

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6.17

LIM Board .............................................................................................................................. 6-102

6.18 PLIM Board............................................................................................................................ 6-108

6.19 PLIMD Board ..........................................................................................................................6-113
6.20 GPLIM Board..........................................................................................................................6-116
6.21 GLMD Board ......................................................................................................................... 6-127
6.22 GSIM Board ........................................................................................................................... 6-130
6.23 GSIMD Board ........................................................................................................................ 6-140
6.24 GWIM Board .......................................................................................................................... 6-142
6.25 GWIMD Board ....................................................................................................................... 6-157
6.26 GWIMS Board ....................................................................................................................... 6-158
6.27

MODEM Board ...................................................................................................................... 6-161

6.28

MIS Board.............................................................................................................................. 6-163

6.29 CRM Board ............................................................................................................................ 6-165

6.30 RCM2 Board .......................................................................................................................... 6-168
6.31

MGI2DB Board ...................................................................................................................... 6-170

6.32

MBD40 Board........................................................................................................................ 6-171

CHAPTER 7. System Parts Diagram

ABBREVIATION

7-1

A ~ D ...........................................................................................................................................................I
E ~ K ..........................................................................................................................................................II
L ~ P ..........................................................................................................................................................III
Q ~ U........................................................................................................................................................ IV
V ~ X ......................................................................................................................................................... V

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OfficeServ 7400 Service Manual

LIST OF FIGURES
Figure 1.1

Front Side of the OfficeServ 7400 Cabinet ............................................................. 1-4

Figure 1.2

Rear Side of the OfficeServ 7400............................................................................ 1-5

Figure 1.3

Signaling Method of the Trunk Line Start .............................................................. 1-9

Figure 1.4

External Rectifier ................................................................................................... 1-16

Figure 1.5

Configuration of the OfficeServ 7400 Cabinet....................................................... 1-19

Figure 2.1

Structure of the OfficeServ 7400 System ................................................................ 2-1

Figure 2.2 System Structure in the interwork between OfficeServ 7400

and OfficeServ 7200 ................................................................................................ 2-2
Figure 2.3

Block Diagram of the MP40 Board .......................................................................... 2-5

Figure 2.4

Block Diagram of the LP40 Board ........................................................................... 2-9

Figure 2.5

Block Diagram of the 8TRK Board ........................................................................ 2-14

Figure 2.6

Block Diagram of the C.O A Line Interface Circuit ................................................ 2-15

Figure 2.7

Block Diagram of the TEPRI Board....................................................................... 2-17

Figure 2.8

Block Diagram of the TEPRI2 Board..................................................................... 2-19

Figure 2.9

Block Diagram of the 8SLI Board .......................................................................... 2-23

Figure 2.10

Block Diagram of the 16SLI Board ...................................................................... 2-26

Figure 2.11 Block Diagram of the 16SLI2/16MWSLI Board ................................................... 2-28

Figure 2.12

Block Diagram of the 8HYB/8HYB2 Board DLI................................................... 2-30

Figure 2.13

Block Diagram of the 8HYB/8HYB2 Board SLI Part ........................................... 2-31

Figure 2.14

Block diagram of the 8DLI Board ........................................................................ 2-33

Figure 2.15

Basic Configuration Diagram between Digital Phone and System..................... 2-35

Figure 2.16

Data Transmission Format Diagram.................................................................... 2-36

Figure 2.17

Block Diagram of the 16DLI/16DLI2 Board ......................................................... 2-37

Figure 2.18

Block Diagram of the MGI board ......................................................................... 2-40

Figure 2.19 Block Diagram of the MGI64 Board..................................................................... 2-43

Figure 2.20

Block Diagram of the 4DSL Board....................................................................... 2-46

Figure 2.21

Block Diagram of the 4WLI Board ....................................................................... 2-48

Figure 2.22

Block Diagram of the WBS24 Base Station ........................................................ 2-50

Figure 2.23

Configuration Diagram of the Keyphone Connection ......................................... 2-51

Figure 2.24

LIM Board Block Diagram.................................................................................... 2-54

Figure 2.25

PLIM Board Block Diagram ................................................................................. 2-56

Figure 2.26

PLIM Board PoE Strap Option............................................................................. 2-58

Figure 2.27

GPLIM Board Block Diagram .............................................................................. 2-60

Figure 2.28

GSIM Board Block Diagram ................................................................................ 2-63

Figure 2.29

GWIM Board Block Diagram ............................................................................... 2-66

Figure 2.30

Modem Board Block Diagram ............................................................................. 2-70

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Figure 2.31

Modem Board PCM Interface.............................................................................. 2-71

Figure 2.32

MISC Board Block Diagram ................................................................................ 2-72

Figure 2.33

Configuration of MFM/SCM Board Highway ....................................................... 2-74

Figure 2.34

Block Diagram of RCM Board ............................................................................. 2-75

Figure 2.35

Configuration of the RCM Board Highway .......................................................... 2-76

Figure 2.36

Block Diagram of CRM Board ............................................................................. 2-77

Figure 2.37

Block Diagram of RCM2 Board ........................................................................... 2-78

Figure 2.38

Block Diagram of MGI2D Board.......................................................................... 2-79

Figure 2.39

Block Diagram of DPIM ....................................................................................... 2-81

Figure 2.40

Block Diagram of Door Phone............................................................................. 2-82

Figure 2.41

Connection of DPIM Pins .................................................................................... 2-83

Figure 4.1

Initial Screen of Smart Media Program ................................................................... 4-2

Figure 4.2

<Format Menu> Screen .......................................................................................... 4-3

Figure 4.3

Formatting SMC ...................................................................................................... 4-4

Figure 4.4

<Copy Menu> Screen ............................................................................................. 4-4

Figure 4.5

<Directory Menu> Screen ....................................................................................... 4-6

Figure 4.6

<Copy Menu> Screen ............................................................................................. 4-7

Figure 4.7

PC and Board Connection 1.................................................................................... 4-8

Figure 4.8

PC and Board Connection 2.................................................................................... 4-9

Figure 4.9

Initial Screen of ispVM Program............................................................................ 4-10

Figure 4.10

<Cable and Port Setup Selection> Screen ......................................................... 4-10

Figure 4.11 <Cable and I/O Port Setup> Screen.....................................................................4-11

XIV

Figure 4.12

<Target Board Scanning> Screen ........................................................................4-11

Figure 4.13

<Fusing File Selection> Screen .......................................................................... 4-12

Figure 4.14

<On Fusing> Screen ........................................................................................... 4-12

Figure 4.15

Initial Screen of Altera MAX + plus II Program.................................................... 4-14

Figure 4.16

Selection of Program File .................................................................................... 4-14

Figure 4.17

Selection of Data File for Programming .............................................................. 4-15

Figure 4.18

Download of Data File ......................................................................................... 4-15

Figure 5.1

MP40 Board Layout ............................................................................................... 5-3

Figure 5.2

LP40 Board Layout.................................................................................................. 5-4

Figure 5.3

8TRK Board Layout ................................................................................................. 5-6

Figure 5.4

TEPRI Board Layout................................................................................................ 5-8

Figure 5.5

TEPRI2 Board Layout ........................................................................................... 5-10

Figure 5.6

16SLI Board Layout............................................................................................... 5-12

Figure 5.7

16SLI2/16MWSLI Board Layout............................................................................ 5-14

Figure 5.8

8HYB Board Layout............................................................................................... 5-16

Figure 5.9

8HYB2 Board Layout............................................................................................. 5-18

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OfficeServ 7400 Service Manual

Figure 5.10

16DLI Board Layout............................................................................................. 5-20

Figure 5.11

16DLI2 Board Layout........................................................................................... 5-22

Figure 5.12

MGI Board Layout................................................................................................ 5-24

Figure 5.13

MGI64 Board Layout............................................................................................ 5-25

Figure 5.14

4DSL Board Layout ............................................................................................. 5-27

Figure 5.15

4WLI Board Layout .............................................................................................. 5-28

Figure 5.16

LIM Board Layout ................................................................................................ 5-30

Figure 5.17

PLIM Board Layout .............................................................................................. 5-32

Figure 5.18

GLMP Board Layout ............................................................................................ 5-34

Figure 5.19

GSIM Board Layout ............................................................................................. 5-36

Figure 5.20

GWIM Board Layout ............................................................................................ 5-38

Figure 5.21

MODEM Board Layout ........................................................................................ 5-39

Figure 5.22

MIS Board Layout ................................................................................................ 5-40

Figure 5.23

MFM Board Layout .............................................................................................. 5-40

Figure 5.24

RCM Board Layout .............................................................................................. 5-41

Figure 5.25

CRM Board Layout .............................................................................................. 5-41

Figure 5.26

RCM2 Board Layout ............................................................................................ 5-42

Figure 5.27

MGI2D Board Layout ........................................................................................... 5-42

Figure 5.28

LIMD Board Layout.............................................................................................. 5-43

Figure 5.29

PLIMD Board Layout ........................................................................................... 5-44

Figure 5.30

GLIMD Board Layout ........................................................................................... 5-45

Figure 5.31

GSIMD Board Layout........................................................................................... 5-46

Figure 5.32

GWIMD Board Layout ......................................................................................... 5-46

Figure 5.33

GWIMS Board Layout.......................................................................................... 5-47

Figure 7.1

Exploded Parts Diagram of OfficeServ 7400 .......................................................... 7-1

Figure 7.2

Front/Rear side of Power Supply Module ............................................................... 7-2

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LIST OF TABLES
Table 1.1

Boards Mountable on Slots ....................................................................................... 1-4

Table 1.2

Rear Side configuration of the OfficeServ 7400 ....................................................... 1-5

Table 1.3

Capacity of the OfficeServ 7400 System .................................................................. 1-6

Table 1.4

Trunk Line Capacity .................................................................................................. 1-7

Table 1.5

Internal Line Capacity ............................................................................................... 1-8

Table 1.6

Channel Capacity by Slots ........................................................................................ 1-8

Table 1.7

Electric Characteristics of the T1 Trunk Line ............................................................ 1-9

Table 1.8

Electric Characteristics of the E1 Trunk Line.......................................................... 1-10

Table 1.9

Electric Characteristics of the Primary Rate Interface (PRI) Trunk Line ................ 1-10

Table 1.10

Electric Characteristics of the Data Link Interface (DLI) Line................................1-11

Table 1.11 Electric characteristics of the GWIM Interface (V.35 Interface).............................1-11

XVI

Table 1.12

Electric Characteristics of the GWIM Interface (RS-232C Interface) ....................1-11

Table 1.13

Electric Characteristics of the GWIM Interface (HSSI Interface) ......................... 1-12

Table 1.14

Electric Characteristics of the LAN Interface (10 BASE-T) .................................. 1-12

Table 1.15

Electric Characteristics of the LAN Interface (100 BASE-TX).............................. 1-13

Table 1.16

Electric Characteristics of the LAN Interface (1000 BASE-FX)............................ 1-14

Table 1.17

Electric Characteristics of the VDSL Interface...................................................... 1-15

Table 1.18

I/O Voltage of the Power Supply Unit (PSU) ........................................................ 1-16

Table 1.19

Cycles of the System Rings .................................................................................. 1-17

Table 1.20

Cycles of the System Signal Tone ........................................................................ 1-18

Table 1.21

OfficeServ 7400 Compatible Terminals ................................................................ 1-18

Table 2.1

Types of Universal Boards ...................................................................................... 2-14

Table 2.2

Hybrid types by Countries....................................................................................... 2-24

Table 2.3

System Specification Synchronized with WBS24................................................... 2-52

Table 2.4

Option Board Type .................................................................................................. 2-69

Table 7.1

Parts List ................................................................................................................... 7-2

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OfficeServ 7400 Service Manual

CHAPTER 1. Introduction to System

This chapter describes the main functions, the configuration, and the specification of the
OfficeServ 7400 System.

1.1 Main Functions

OfficeServ 7400 is the communication product that is the most suitable for middle and
small sized offices using the line of less than 500 subscribers. The OfficeSErv 7400
provides the integrated functions of the voice, the data, and the internet.
OfficeServ 7400 provides the data transmission/reception function using the data network
as well as the voice call functions. The users can use conveniently the various telephone
functions and the applications in the various platforms(Digital Phone, IP Phone, Mobile
Phone, and Server, etc).
The main functions of the OfficeServ 7400 System are as follows:
Integrated Communication Environment
OfficeServ 7400 provides the data transmission service using the modules of Local Area
Network(LAN) and Wide Area Network(WAN) as well as the voice call functions.
The users can perform the convenient communication by using the integrated platform of
the wired and the wireless(Phone, PC, Serve, Wireless Phone, Peripherals) functions.
Next Generation Platform
OfficeServ 7400 provides the pure IP solution that combines the functions of the mail
server, the Session Initiation Protocol(SIP) server, Voice over IP Unified Messaging
Service(VoIP UMS) via the feature server based on IP.
The feature server based on IP, which is a Linux platform, can add constantly the feature
server modules that are to be provided afterwards.
IP Phone Functions of High Voice Quality
OfficeServ 7400 separates the data packet and the voice packet into the priority and the
grouping to secure the Quality of Service as follows:.
y

Layer 2 QoS: Priority Processing(802.1p), VLAN(802.1q)

Layer 3 QoS: CBQ(Class Based Queuing), RTP(Real-time Transmission Protocol)

Priority Queuing, On-Demand Bandwidth Control for WAN

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CHAPTER 1. ! .

WAN/LAN Function
OfficeServ 7400 has the interface module with WAN and LAN mounted so that the data
can be transmitted/received in the external internet or the internal intranet with no
additional data device.(10/100 BASE-T or 1000 BASE-TX/SX/LX interface used)
Wireless LAN Service
OfficeServ 7400 provides the wireless LAN solution for the combined services of the
wired and the wireless in the office zone. It supports the handoff and the QoS by using the
Combo AP(Access Point) that performs the service with the separation of the data and the
voice. In addition, OfficeServ 7400 uses the wireless LAN base station to use the wired and
wireless voice/data communication with no additional LAN construction. In addition, it provides
the business environment where the staff can perform their efficient and prompt businesses
anytime anywhere by using the portable terminal of the refined design.
Text-To Speech (TTS) Response Functions
OfficeServ 7400 provides the TTS response functions that converges the character
messages(e-mail) into the voice message to be heard via the phone.
Mail Server and Instant Messaging
OfficeServ 7400 provides the e-mail server and the instant message transmission/reception
function that combines the voice message and the e-mail to converge or to retransmit them
for the users convenience.
Various Application Solutions
OfficeServ 7400 provides the various application solutions such as OfficeServ News,
OfficeServ EasySet, Internet Call Center, Integrated Management of the Communication
System, Voice Mail Solution of the Built-in Board type, the integrated fax server, CloselyCombined Digital Record System, etc.

Integration(Close Combination) and the Application Solution

- Integration(Close Combination, integration) means the operation in one
integrated function by the mutual interface between the OfficeServ 7400 System
and the external solution server.
- Refer to the user manuals of each application solution for the detailed methods
of each solution.

1-2

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OfficeServ 7400 Service Manual

Installation Convenience and Extensibility

OfficeServ 7400 can install conveniently the basic cabinet and the extended cabinet in the
mode of mounting them inside the 19-inch rack, and several boards can be installed in the
universal slot.
Integration of Various Terminals and Additional Devices
OfficeServ 7400 provides the efficient and various services by connecting the various
terminals and the additional devices.
Convenient Maintenance
The system functions can be conveniently used by using the functions as follows:
y

PC(PCMMC) for programs

The PC for programming is the PC used in the maintenance of the.The various
information of the system can be retrieved, changed, and controlled by using the
menus in the PC for programming.

Web Management Program

The Web Management Program is the one used in the maintenance of the OfficeServ
7400 System. The various information of the system can be retrieved, changed, and
controlled by using the web menus.

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CHAPTER 1. ! .

1.2 System Configuration

This section introduces the configurations of the front and the rear view of OfficeServ 7400
cabinet and the slot configuration information.

1.2.1 Front View

OfficeServ 7400 is composed of three cabinets(basic/Extended) mounted on the rack 19
inch wide and the function server that operates outside.
MP40, the main control block, is installed on the basic cabinet to control generally the
OfficeServ 7400, and performs the functions of the switching, call processing, the
subscriber management. LP40, the main control block, is installed on the basic/extended
cabinet to control the various line boards, and transceives the information to MP40.
Besides, the various line boards, the power, and the fans are also the components of the
OfficeServ 7400.

0
Slot
Front Side of
Basic Cabinet

3
Slot

6
Slot 6

Slot11

Slot2 2

Slot 44

Slot5 5

Slot77

Slot 9
9

Slot10
10

Slot88

Slot11
11

Figure 1.1 Front Side of the OfficeServ 7400 Cabinet

There are 12 slots each in the basic cabinet and the extended cabinet where the boards can
be mounted.
Each slot mounts the following boards according to the configuration types of OfficeServ
7400.
Table 1.1 Boards Mountable on Slots
Cabinet

Slots

Mountable Boards

Basic Cabinets

Slot 0

Exclusively Used for LP40

(OfficeServ Access)

Slot 3

Exclusively Used for MP40

Slot 1, 2

Board excluding MP40, LP40

Slot 4~11

1-4

Extended Cabinet

Slot 0

Exclusively Used for LP40

(OfficeServ Expansion)

Slot 1~11

Boards excluding MP40 LP40

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OfficeServ 7400 Service Manual

Blank Board Functions

Blank Board is the dummy board that performs the screen of sheltering the
infiltration of the alien materials into the system when the board is not mounted on
the universal slot.

1.2.2 Rear Side

The rear side configuration of OfficeServ 7400 is shown below:

8 9
Rear side of
Basic Cabinet

12 3

5h

i 3

Figure 1.2 Rear Side of the OfficeServ 7400

Table 1.2 Rear Side configuration of the OfficeServ 7400
Rear Side Configuration of Cabinet

Functions

1 Ground Lug

Lug for grounding the system Communication

2 External Rectifier Socket

External DC Power Supply Socket for Power over

Ethernet(PoE)

3 Holders for mounting/demounting the

Power modules

Holders Used when the Power modules are mounted

or demounted.

4 Fuse Holder

Fuse for Protecting the AC input Power.

5 AC LED

Turns on when the AC Power in applied.

6 DC LED

Turns on when the DC Power is normally supplied.

7 Battery Connection Socket

Socket Connecting the external battery.

8 Power Switch

Turns on or off the Power of OfficeServ 7400.

9 Power Input/Output Connecter

Connecter for Connecting the Power Cable.

Battery Switch

Turnned on when the battery Power is supplied to the

OfficeServ 7400 or Charged OfficeServ 7400.

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CHAPTER 1. ! .

1.3 System Specifications

This section describes the capacity, the various signal specifications, the power specifications,
the ring and the signal tones, the switchable boards and terminals, and the apparatus
specifications.

1.3.1 System Capacity

OfficeServ 7400 System can operate up to 1344 lines, and the line rate of the internal and the
trunk can be adjusted according to the operators demand. The following table shows the
arrangement of the maximum line capacity that can be accommodated in OfficeServ 7400.
Table 1.3

Capacity of the OfficeServ 7400 System

System Configuration
Basic Cabinet

Maximum Accommodation Lines

- E1 Used: 600
- 8TRK Used: 80
- Internal Line Used: 160
- Maximum Used: 320(Voice)
- LAN Switch Used: 176
- Internal Power of the Physical Layer Interface Module(PLIM) Used: 32
- Very high-Data rate digital Subscriber Line(VDSL) Used: 20
- WLAN Terminal or IP Phone Phone terminal: 640
- SVMi-20E: One board Per 12(20) System
- Dual Tone Multi Frequency(DTMF): Two boards Per 12 System
- RCM(R2 CID Module): Up to Two Per R2(8) or CID(14) System(Only the trunk
Line supported)
- RCM2: R2(8) or CID(Caller Identification)(14) Up to two Per System
R2(4)/CID(6)(Bot hof trunk Line and the internal Line simultaneously
supported)
- CRM(Common Resource Module): DTMF(20)/R2(16)/CID(16)
Up to two Per system

Basic Cabinet +

- When E1 Used: 930

Extended Cabinet 1

- When 8TRK Used: 168

- When the internal Line Used: 336
- When maximum Used: 672(Voice)
- When LAN switch Used: 352
- When the internal Power of PLIM Used: 64
- When VDSL Used: 40
- WLAN terminal or IP Phone: 992
- DTMF: Four Per 12 System
- RCM: Up to four Per R2(8) or CID(14) System(Only the trunk Line is
supported)
- RCM2: Up to four Per R2(8) or CID(14) system
R2(4)/CID(6)(Both of th trunk Line and the internal Line simultaneously
supported)
- CRM: Up to four Per DTMF(20)/R2(16)/CID(16) System

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OfficeServ 7400 Service Manual

Table 1.3

Capacity of the OfficeServ 7400 System (Continued)

System Configuration

Maximum Accommodation Lines

Basic Cabinet + Extended

- When E1 Used: 1260

Cabinet 1 + Extended Cabinet 2

- When 8TRK Used: 256

- When the internal Line Used: 512
- When maximum Used: 1024(Voice)
- When LAN switch Used: 528
- When the internal Power of PLIM Used: 96
- When VDSL terminal Used: 60
- WLAN terminal or IP Phone: 1344
- DTMF: Six Per 12 System
- RCM: Up to six Per R2(8) or CID(14) System
(Only the trunk Line is supported)
- RCM2: Up to Six Per R2(8) or CID(14) system
R2(4)/CID(6)(Both of the trunk Line and the internal Line
simultaneously supported)
- CRM: Up to six Per DTMF(20)/R2(16)/CID(16) system

Trunk Line Capacity

The maximum capacity of the trunk lines that can be accommodated according to the
configuration of OfficeServ 7400.
Table 1.4 Trunk Line Capacity
System Configuration

Analog
LOOP TRK

Basic Cabinet

80

Digital
T1 TRK
480

E1 TRK
600

PRI TRK
T1: 480
E1: 600

Basic Cabinet + Extended

168

744

930

Cabinet 1
Basic Cabinet + Extended
Cabinet 1+ Extended Cabinet 2

SAMSUNG Electronics Co., Ltd.

T1: 744
E1: 930

256

1008

1260

T1: 1008
E1: 1260

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CHAPTER 1. ! .

Internal Line Capacity

The maximum capacity that can accommodate the general phones and the digital phones
according to the configuration of OfficeServ 7400.
Table 1.5
System Configuration

Internal Line Capacity

General Phones

Digital Phones

Basic Cabinet

160

160(DS-5012L: 73)

Basic Cabinet + Extended

336

336(DS-5012L: 146)

512

512(DS-5012L: 219)

Cabinet 1
Basic Cabinet + Extended
Cabinet 1 + Extended Cabinet 2

Channel Numbers
The channel number of OfficeServ 7400 by each slot and the channel number of CID
Receiver and DTMF Receiver are as follows:
Table 1.6
Classification

1-8

Channel Capacity by Slots

Slots

Channel Number

Basic Cabinet

Slot 1, 2, 4, 5, 6, 7, 8, 9, 10, 11

64

Extended Cabinet

Slot 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11

32

CID Receiver

Based on Basic Cabinet

32

DTMF Receiver

Based on Basic Cabinet

48

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OfficeServ 7400 Service Manual

1.3.2 Electrical Specifications

The signal processing protocol is the one that provides the signal method for the connection
of the trunk line/internal line and the status information.
Signaling Method of the Loop Start Trunk Line
The loop start signal processing controls the statuses of the on-hook and the off-hook by
the electric flow. The loop is the closed loop trunk circuit or the standard 2500- typed set
loop.

OPEN END

CLOSED END
GND
T

T
X

-48 VDC
(C.O.)

Key Telephone

Figure 1.3 Signaling Method of the Trunk Line Start

Signaling Method of the T1 Trunk Line

The electric characteristics of the T1 trunk line follows the standards of ITU G.703 and
G.704.
Table 1.7 Electric Characteristics of the T1 Trunk Line
Items

Specifications

Transmission Speed

1544 kbit/s 50 Ppm

Code

AMI(Alternate Mark Inversion) or B8ZS(Bipolar 8-Zero

Substitution)

Pulse Type

Regular square wave: Valid signals are displayed in accordance with

the mask(G.703) irrespective of Codes.

Transmission Media

A twisted Pair

Load Resistance

100

Display(Pulse) Nominal Peak

3.00 V

Voltage
Signal

Electric Power at

Level

772 kHz
Electric Power at

12~19 dBm
25 dB or more at the electric Power of 772 kHz or Less

1544 kHz

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CHAPTER 1. ! .

Signaling Method of the E1 Trunk Line

The electric characteristics of the E1 Trunk line follows the standards of the ITU G.703 and
G.704
Table 1.8 Electric Characteristics of the E1 Trunk Line
Items

Specifications

Transmission Speed

2048 kbit/s 50 Ppm

Code

HDB3(High Density Bipolar of order 3)

Pulse Type

Regular Square Wave: Valid signals are displayed in

accordance with the mask(G.703) irrespective of Codes.

Nominal Value and Pulse

244 ns

Jitter in the I/O Ports

Refer to G.823

Transmission Media

A twisted Pair

Load Resistance

120

Display(Pulse) Nominal Peak Voltage

3.00 V

Blank(Non-Pulse) Peak Voltage

0 0.300 V

Signaling Method of the Integrated Service Digital Network (ISDN) Interface

Transmission
The electric characteristics of the ISDN(PRI) interface follows the standards of the
ITU(International Telecommunication Union) I.431 and the ETS(Educational Testing
Service) 300 011.
Table 1.9 Electric Characteristics of the Primary Rate Interface (PRI) Trunk Line
Items

Specifications

Transmission Speed

2048 kbits/s 50 Ppm

Code

HDB3(High Density Bipolar of Order 3)

Pulse Type

Regular Square Wave: Valid signals are displayed in

accordance with mask(I.403) irrespective of Codes.

1-10

Nominal Value and Pulse

244 ns

Transmission Media

A twisted Pair

Load Resistance

120

Display(Pulse) Nominal Peak Value

3.00 V

Blank(Non-Pulse) Peak Voltage

0 0.300 V

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OfficeServ 7400 Service Manual

The electric characteristics of the Digital Line Interface are as follows:

Table 1.10 Electric Characteristics of the Data Link Interface (DLI) Line
Items

Specifications

Transmission Speed

384 kbits/s

Code

AMI

Pulse Type

Typical AMI Waveform

Electric Characteristics of the Gigabit WAN Interface Module (GWIM)

Interface
The electric characteristics in case of using the V.35 Interface are as follows:
Table 1.11 Electric characteristics of the GWIM Interface (V.35 Interface)
Items

Specifications

Maximum Transmission Speed

10 Mbit/s

Transmission Code

V.35 Driver

Number of the Transmission Lines

18 EA

Characteristics Resistance

100

Display(Pulse) Nominal Peak Voltage

2 V

Input Differential Threshold

80 mV

The electric characteristics in case of using the RS-232C(V.28) Interface are as follows:
Table 1.12 Electric Characteristics of the GWIM Interface (RS-232C Interface)
Items

Specifications

Maximum Transmission Speed

230 kbits/s

Transmission

V.28 Driver

Number of Transmission Lines

14 EA

Display(Pulse) Nominal Peak Voltage

15 V

Input Threshold

+1.2 -1.7 V

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CHAPTER 1. ! .

The electric characteristics in case of using the High-Speed Serial Interface(HSSI)

Interface are as follows:
Table 1.13 Electric Characteristics of the GWIM Interface (HSSI Interface)
Items

Specifications

Maximum Transmission Speed

50 Mbit/s

Transmission Code

HSSI Driver

Number of Transmission Lines

50 EA

Characteristics Resistance

110

Display(Pulse) Nominal Peak Voltage

1 V

Input Threshold

0.15 V

Signaling Method of LAN

10 BASE-T follows the standards of the Institute of Electrical and Electronic
Engineers(IEEE) 802.3, and its electric characteristics are as follows:
Table 1.14 Electric Characteristics of the LAN Interface (10 BASE-T)
Items

Specifications

Transmission Speed

10 Mpbs

Transmission Code

Manchester Coding(Coding method that when the

transmission data are 0 the Convergsion from the high
into the Low in the Center of the bit is made and that
when the transmission data are 1 the inversion from the
Low Level into the high Level at the Center of the bit is
made)

Access Control Method

CSMA/CD(Carrier Sense Multiple Access/Collision

Detect)

Transmission Media

UTP(Unshielded Twisted Pair) CAT3 CAT4 CAT5

STP(Shielded Twisted Pair)

1-12

Number of UTP Pair

2 Pairs

Characteristics Resistance

100

Cable Thickness

Radius 0.51 mm(24 AWG) Outer Radius 5 mm

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OfficeServ 7400 Service Manual

100 BASE-TX follows the standards of the IEEE 802.3u, and its electric characteristics are
as follows:
Table 1.15 Electric Characteristics of the LAN Interface (100 BASE-TX)
Items

Specifications

Transmission Speed

100 Mbps

Transmission Code

4B/5B + MLT-3(4 bit/5 bit Converges the four bit-data into fivebit one at the Physical Layer to be Coded and the Multi Level
Transmission-3(MLT-3) Codes the transmission data into
three Levels of High Middle and Low.

Access Control Method

CSMA/CD

Transmission Media

UTP CAT5 STP

Number of UTP Pair

Two Pairs

Characteristics Resistance

100

Cable Thickness

Radius 0.51 mm(24 AWG) Outer Radius 6 mm

UTP Cable Type

UTP cables are classified into Straight-through UTP cable and Crossover UTP
cable. Straight-through UTP cable is used for connecting the Switch module(LIM,
PLIM) and the boards(MP40, MGI, 4DSL) corresponding to terminals. Crossover
UTP cable is used only for connecting Switch module(LIM, PLIM) and Switch
module(LIM, PLIM).

Auto MDI/MDIX
The allocation of the pins in the RJ-45 connecter connected to UTP cable makes
the mutually different arrangement according to the TX and RX signal or
according to the switch module and the terminals. Therefore, for connecting the
switch module and the terminals, the Straight-through UTP cable is basically
used, and for connecting the switching module and the switching module, the
Crossover UTP cable is used. But, the Auto-MDI/MDIX function is implemented
inside the switch module in order to remove the complexity of the cable
connection like this, and by the implication the normal operation can be
performed regardless of the pin layout of the UTP cable. Among the boards
corresponding to the switch module of the OfficeServ 7400 System, LIM and
PLIM have no Auto-MDI/MDIX function, and GPLIM, GSIM, and GWIM provide
the Auto-MDI/MDIX function.

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CHAPTER 1. ! .

1000 BASE-SX/LX follows the standards of the IEEE802.3z, and its electric
characteristics are as follows:
Table 1.16 Electric Characteristics of the LAN Interface (1000 BASE-FX)
Items

Specifications

Transmission Speed

1000 Mps

Transmission Code

Encoding the 8B/10B data

The eight-bit(8B) data entered from the sublayer of the MAC on the
Upper Layer are handle in one nibble. Each nibble is Converged
into the Code of 10 bit(10B) at the Physical Layer to be transported.
The transmission speed after the Conversion into 8B/10B is
1250 Mbps.

Access Control Method

Transmission Media

CSMA/CD
SX: Multi-Moded Optic Fiber(MMF)
LX: Multi-Moded Optic Fiber/Single-Moded Optic Fiber(SMF)

Number of Optical Fiber

2 Pairs

Maximum Transmission Distance

SX: Up to 550 m
LX: Up to 5 km

Cable Thickness

Radius 0.51 mm(24 AWG) Outer Radius 6 mm

Gigabit Interface Module

Among the boards that provides the gigabit interface at the OfficeServ 7400
System, there are GPLIM, GSIM, and GWIM. These boards supports all 1000
BASE-TX/SX/LX by using the Small Form-factor Pluggable(SFP)
Connector.Therefore, The Gigabit Interface Module suitable for the configuration
that is to be used should be mounted, and their connection should be made by
the cable of the same kind.
1000 BASE-TX SFP Module-UTP Cable
1000 BASE-SX SFP Module-MMF Optic Cable
1000 BASE-LX SFP Module-SMF Optic Cable

Signaling Method of Dial Pulse Internal Line

y

Rate: 10 PPS(Pulse Per Second)

M/B Rate(Make/Break Ratio): 33%: 66%(Adjustable by software)

Minimum time between digits: 20 msec(Adjustable by software)

Signaling Method of the Internal Line in the DTMF Push Button Dialing
DTMF signaling processing follows the ITU standards, which is for the signal processing
of the transmission at the trunk line side of the digital phone and for the signal processing
of the transmission/reception telephone at the trunk line.

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OfficeServ 7400 Service Manual

Signal Method of the Very high bit rate Digital Subscriber Line (VDSL)
The electric characteristics of the VDSL for using the long-distance Ethernet are as
follows:
Table 1.17 Electric Characteristics of the VDSL Interface
Items

Specifications

Transmission Speed

1 M~16 Mbps

Modulation Code

Quadrature Amplitude Modulation(QAM)

Error Detection

Reed Solomon Encoding Method

Transmission Distance

1.0 km

Transmission Media

A twisted Pair

Characteristics Resistance

Splitter built-in

Used Frequency

138 kHz~12 MHz

Link Speed

Down Link: 30 Mbps(300 m) Up Link: 10 Mbps(300 m)

Transmission Characteristics
y

Attenuation volume
Attenuation volume between subscribers: Less than 6 dB
Attenuation volume between a subscriber and local trunk: Less than 0.5 dB

Line characteristic Resistance: 600

Valuation Noise: Less than -65 dBm

Crosstalk attenuation volume: Less than -68 dBm

Frequency bandwidth: 300 to 3400 Hz

Insulation resistance: More than 1 M

Line Conditions
y

Installation distance
Regular phone: Up to 1 km(when American Wire Gauge(AWG) #24 cable is used)
Digital phone: Up to 400 m 400 m(when AWG #24 cable is used)
Door Phone: Up to 400 m(when AWG #24 cable is used)
Button Expansion Box(AOM): Up to 400 m(when AWG #24 cable is used)
Between 4WLI and to Combo AP: Up to 600 m(when AWG #24 cable is used)

Leakage resistance between lines: More than 20 k

Leakage resistance between earths: More than 20 k

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CHAPTER 1. ! .

1.3.3 Power Specifications

OfficeServ 7400 operates by it AC input power and the battery power, and to the system
cabinet the backup power of -54 V, -5 V, +5 V, +3.3 V, +12 V, and -56 V are provided.
Table 1.18

I/O Voltage of the Power Supply Unit (PSU)

Power Supply Device

Power-Supplying Board(PSU)

Specifications

Input Power

AC 110 V, 220 V(Free Voltage)

Input Power

- DC -54 V, 6.6 A
- DC +5 V, 16 A
- DC -5.3 V, 2 A
- DC +3.3 V, 30 A
- DC +12 V, 1 A
- DC -56 V, 0.4 A(For Backup)

External Rectifier

Input Power

AC 110 V, 220 V(Free Voltage)

(Model Name: OfficeServ 7150)

Output Power

DC -54 V, 10 A

1.3.4 External Rectifier

External rectifier is the external power for supplying the power to the IP phone or to the
WBS24 connected when the boards of the PLIM and the GPLIM in the OfficeServ 7400
System. The capacity of the internal power is not enough. Therefore, the additional power
is connected in order to supply the power of -54V to the external devices as shown below:
Button using the external
battery
A

B
External
Rectifier

Red Line

Blue Line

Socket connecting the

external battery

OfficeServ
7400

Figure 1.4 External Rectifier

1-16

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OfficeServ 7400 Service Manual

Installation of the External Rectifier

Refer to OfficeServ 7400 Installation Manual for the installation of the external
rectifier.

1.3.5 Rings and Signal Tones

Ring Cycle
OfficeServ 7400 provides the trunk line ring, the internal line ring, the door ring, and the
alarm ring. The ON/OFF cycles by the ring types are shown in the table below:
Table 1.19

Cycles of the System Rings

Rings

ON/OFF Cycles

Trunk Line Ring

1000/3000 ms

Internal Line Ring

400/200/400/3000 ms

Door Ring

400/200/400/200/400/2000 ms

Alarm Ring

400/200/400/200/400/200/400/1000 ms

Cycle of the Ring ON/OFF

The ON/OFF cycles can be adjusted by changing the database values of the
system.

Signal Tone
The ring output voltage and the frequency of the OfficeServ 7400 are as follows:
y

Output Voltage: 75 V

Frequency: 20 Hz

OfficeServ 7400 provides several signal tones. Each signal tone directs the progressing
status of the function operation to the users, and performs the feedback role. ON/OFF cycle
by tone types currently set are as follows:

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CHAPTER 1. ! .

Table 1.20

Cycles of the System Signal Tone

Signal Tones

ON/OFF Cycles

Origination

1000/250 ms

Busy

500/500 ms

DND

250/250 ms

Ring Back

1000/2000 ms

Call Park

Continuous

Check/Caution/Forced Override

50/50 ms

Call Back/Hold

500/3500 ms

Connection

1000/2000 ms

Error/Unobtainable Tone

250/250 ms

Message Park Tone of Regular Phones

Continuous

1.3.6 Available Terminals

The OfficeServ 7200 can be connected to the terminals below:
Table 1.21 OfficeServ 7400 Compatible Terminals
Type

Terminal

DS-5000 Series Digital Phone

DS-5014D, DS-5021D, DS-5038D, DS-5012L

ITP-5000 Series IP Phone

ITP-5014D, ITP-5021D, ITP-5012L

Wireless LAN(WLAN)

WIP-5000M(mobile Phone), WBS24(Access Point device)

DSS

DS-64B

Digital Phone

DS-4000 series, DS-24SE, DS-24D, DS-2024E,

DS-2024E, DS-2021E, DS-3020S

AOM

DS-5064BAOM, DS-4014AOM, DS-4064AOM,

DS-24SE AOM, DS-2024EAOM, DS-3020SAOM
- Up to 16 AOMs Can inter-work with the 16DLI of the
OfficeServ 7200 system. Up to 8 AOMs with both of
the 8DLI and 8HYB.

Others

KDB-S, KDB-D, DPIM, door Phone

Compatible Terminals
All compatible terminals of the iDCS 500 Premium system can be used for the
OfficeServ 7400. For compatible terminals, contact the system operator because
a compatible terminal is subject to change according to system settings.

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1.3.7 Device Specifications

The OfficeServ 7400 is configured with one basic cabinet and two extension cabinets with
the specification below:

Extension
Cabinet

Extension
Cabinet

Basic Cabinet

Figure 1.5 Configuration of the OfficeServ 7400 Cabinet

When the system is configured with one cabinet(Basic Cabinet)

440(W) 223.8(H) 410(D) mm

When the system is configured with two cabinets(Basic Cabinet + Extension Cabinet)
440(W) 447.6(H) 410(D) mm

When the system is configured with three cabinets(Basic Cabinet + Extension Cabinet +
Extension Cabinet)
440(W) 671.4(H) 410(D) mm

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CHAPTER 2. Inside the Circuit

This chapter describes the circuit configuration by blocks and the main functions of
OfficeServ 7400 System.

2.1 System Structure

This section describes the physical structure and the communication structures between the
cabinets, of OfficeServ 7400.

2.1.1 Block Diagram

The structures of OfficeServ 7400 System are shown below:

+5 V

C#1
Basic

Power

-5 V

Mother
Board

MOD

SIO

LAN

SCM

RCM

MISC

MP40
LP40

UNIV #1

-48 V

UNIV #10

C#2
Extension

+5
+5VV
Power

-5 V
5V

Mother
Board

RCM

MFM

MISC

LP40

HDLC CABLE

UNIV #1

-48 V
UNIV #11

C#3
Extension

+5 V
Power

-5 V

Mother
Board

MFM

RCM

MISC

LP40

UNIV #1

-48 V
UNIV #11

Figure 2.1 Structure of the OfficeServ 7400 System

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CHAPTER 2. ! .

When OfficeServ 7400 System and OfficeServ 7200 System are mingled to be configured,
the physical structure using the MP40 card are shown below:

MOD

+5 V

C#3
Basic

Power

-5 V

SIO

LAN
MP40

Mother
Board

SCM

RCM

MISC

LP40

UNIV #1

-54 V

UNIV #10

C#2
Extension

Power

C
#
2
Ext
ens
sio

+5
+5VV
-5 V
5V

Mother
Board

MFM

RCM

MISC

LP40

HDLC CABLE
UNIV #1

-54 V
-48V

UNIV #11

+5 V

C#3
Extension

Power

-5 V
-48 V

LCP

Mother
Board
UNIV #1

UNIV #6

Figure 2.2 System Structure in the interwork between OfficeServ 7400 and OfficeServ 7200

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2.1.2 Characteristics of the Communication System between

Modules
The communication system mounted on the OfficeServ 7400 System has the characteristics
as follows:
Application of the Smart Media Card
y

The CPU of the MP40 board and the smart card media card are connected to each
other by the 8-bit parallel bus mode.

OfficeServ 7400 uses the standard smart media interface so that the easy upgrade into
the one of the larger capacity can be made afterwards.

The smart media card of the OfficeServ 7400 uses the power of 3.3 V.

The smart card media card can be mounted on the front side panel of the MP 40 board.

Caution in the Use of the Smart Media Card

Only the smart media card that is provided when the system is purchased should
be used. If there a damage to the system occurs by the use of other product,
Samsung Electronics Co. Ltd. is not responsible for the damage, and also the
after-sales service is not provided.

CPU Interface
y

CPU and Static Random Access Memory(SRAM) of the MP40 card are connected by
the 64-bit bus.

SCC1 of the MP40 card CPU is allocated to the LP 40 of the system basic rack,
SCC3/4 is allocated for the connection of the LP40 of the extension rack or for the
connection of the extension rack of the OfficeServ 7200 Local Control Panel(LCP)
and for the connection of the users highway channel.

FCC1 is used for the communication of the LAN.

SMC 1 is used as the debugging port for the system engineer to check the system
status. When the daughter board used for the modem is mounted, SMC2 is used for the
communication with the daughter board.

Ethernet Connection
Ethernet connection is basically provided.
Use of the Serial Input and Output (SIO) port
One debugging port is provided for the system engineer to check the system status.

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CHAPTER 2. ! .

Communication Protocol of the High Level Data Control (HDLC)

y

The frame structure of the HDLC communication protocol is as follows:

Opening Flag
Address Field
Control Field
Information Field
Frame Check Code(CRC-CCITT) Field
Closing Flag

The signals related to the HDLC communication are converged in the RS-422 mode
for the stable operation.

Module Mode Application

Each cabinet operate mutually separately, and the operation of one cabinet does not affect
that of the other cabinet. Therefore,the other cabinet can provide the normal service even
though one cabinet does not operate.

2.2 Mother Board

Mother board receives the power of -54 V, +5 V, -5 V, +3.3 V, and +12 V from the power
supply module to allocate them to each slot, and peforms the path role of connecting the
various bus signals of MP40 and LP40 and the clock signal and the voice signal of the
PCM conversion.
Power Distribution
Each slot of OfficeServ 7400 receives the various powers from the power supply module
mounted on the cabinet, and carries them to each slot.
Slot Mounting
The board mounted on each slot receives the mother board, the power and the various
signals via the 30-pin connecters, and exchanges data with other boards.

2.3 Power Supply Module

The power supply module performs the power supply to the cabinet of OfficeServ 7400.
The module operates by the AC input power or the battery power, and supplies the power
of -54 V, +5 V, -5 V, +3.3 V, +12 V to the cabinet.
When the system operates by the reception of the AC power, the current of 0.4 A is
supplied for the battery charging if there is no current remained due to the discharging of
all batteries.

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2.4 Control Board

As the control boards of the OfficeServ 7400 System System, there are the MP 40 board
that controls the overall operation and the LP40, the vice control board that controls the
basic cabinet and the extension cabinet. Each board should be mounted in accordance with
the control board slot.
The types used in OfficeServ 7400 System are as follows:
y

MP40 Main Control Board

LP40 Vice Control Board

2.4.1 MP40 Board

MP40 board performs the control of the OfficeServ 7400 Systems overall operation. MP40
board is mounted only on the private slot of MP40 in the basic cabinet.

2.4.1.1 Block Diagram

The block diagram of MP40 board is shown below:
Address
&
Control

DATA

INTERNAL
MUSIC

RTC
(RTC8564NB)
SRAM
(KM6164000x2)

SWITCH
(ZL50018)
1.5/1.8 V
Regulator

BAT

RST

Flash ROM
(Am29F800BTx1)

CPU
(MP408271/66M)

DRAM
KM416C1200CTx4

Buffer

CPLD
(LC4256V-75FC)

SMARTMEDIA
Interface

Daughter Board
Interface

ENGIN 7065

BUFFER

To Mother Board

Figure 2.3 Block Diagram of the MP40 Board

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CHAPTER 2. ! .

2.4.1.2 Main Functions

The main function of the MP40 board are as follows:
CPU (MPC8271VRMIBA)
One MPC8271 of the freescale(of Motorola) is used. MPC8271 is ad data bus, which
operates in the 64-bit mode.
The main specification of the MPC8271.
y

Dual-issue integer(G2_LE) core

Data cache of the 16 Kbytes and the instruction cache of 16 Kbytes

Memory Management Unit(MMU) supported

64-bit Dynamic Bus Controller(DBC)

32-bit Address Lines

Fast Ethernet Controller(FEC)

PCI bridge provided

RTC Interface supported

System Integration Unit(SIU) Functions built-in

Eight external interrupts and eight internal interrupts

SIO operation of the high performance can be performed by the built-in

communication processor

8 Baud Rate Generator(BRG)

Three SCCs where HDLC communication can be made are supported

Two SMCs where the asynchronous communication can be made are supported

One SPI where the serial communication can be made is supported

I2C Interface supported

DEBUG Interface supported

SCC
y

SCC1, SCC3, SCC4: Operates via the HDLC communication port for exchanging the
messages with LP40.

SMC1: A debugging port for the system engineer.

SMC2: Used for the interface with modem.

System Clock
MP40 card used 66 MHx as the main clock oscillator.

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Boot ROM (Flash ROM)

For Boot ROM, the flash ROM of 1 Mbytes(512 Kbytes 2 EA) is used. Boot ROM has
the program for the initial operation of system(system operation program), and performs
the downloading the main program from the flash ROM, which is the Smart Media Card
into the SDRAM.
SDRAM
128 Mbytes(Extension into 256 Mbytes can be made) are basically to the 256 SDRAM,
and is composed of four 32Mbytes elements. SDRAM has the main program resident to
operate, and saves the data necessary for processing the system. In addition, SDRAM is
designed to operate in No Wait for the maximum performance of the system.
SRAM
2 Mbytes are provided to SRAM, and is composed of two 1Mbytes element. SRAM can
perform the memory backup, and saves the various DB information. The various DB
information necessary for the system operation are to be saved at SRAM, but they should
be always saved also at the smart media. By doing so, the DB information can be safely
saved even when the system is critically damaged from the outside.
NAND_Flash ROM
NAND_FROM is composed of 512 Kbytes, and is used as the subsidiary memory device
of OS-7400 system. It saves various DB information.
Smart Media
Smart media is the NAND flash memory card that has saved the main program(OS) for
operating MP40 at itself. In addition, is is used as the auxiliary memory of OS-7400
System. The currently used smart media is 32 Mbytes, and 8-bit parallel bus connection
mode is used for the connection to the system, which can be used without the change of
hardware even though the capacity increases(But the change of the software is needed.)
Smart media should operate always with itself mounted on the system, and should be saved
in the vinyl packed when the card is delivered.
Engine (SAMSUNG ASIC: STL7065C)
The engine of MP40 uses one of Samsung ASIC. If the extension rack connected to MP40
is LCP, the engine provides the function by which the individual compensation for the
voice signal connected by the subscriber card is made.

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CHAPTER 2. ! .

Time Switch (ZL50018)

For Time Switch, ZL50018 of Zalink Co. The Time Switch performs the switching of
overall OS-7400 system. The capacity for the subscriber channels can be extended to
maximum 2048 2048. The voice signal of 8 Mbps stream is provided from LP40, and the
voice signal of 2Mbps is provided to LCP.
Digital Phase Locked Loop(DPLL) for the synchronization of the digital subscribers is
included into the chip inside. 8 kHz Reference clock is determined by software. If the
8 kHz Reference clock source is not designated from the outside, the clock generated inside
is used.
WATCH DOG
WATCH DOG is the function of recovering automatically the system when there an
abnormality occurs in the system.
If system abnormally operates for about five seconds, the system is designed to re-operates.
Complex Programmable Logic Device (CPLD)
CPLD uses the one of Lattice Co. CPLD is configured with the interface logic at the MP40
board, and configures the logic so that programming is made in order to change the logic. If
there a cause for the change of logic or for the upgrade occurs, the logic can be changed via
JTAG bus at the outside PC.
Real Time Clock (RTC)
For RTC, the RTC8564NB of SEIKO Co. is used, and the backup is supported by SUPER
CAP.
Internal Music
One channel is provided for the internal music of the system. For CODEC, only that of ALAW CODEC is used. In case of the U Law-using country, the software value is
automatically changed at 50018 Main Switch to operate by the concerned CODEC.
LAN Interface
LP40 card can be connected to LAN with no additional LAN card. MAC is built in the
CPU, and the maximum connection speed is 10/100 Mbps. The speed is automatically
selected when the LAN cable is connected.
Universal Asynchronous Receiver & Transmitter (UART)
UART is the element that makes the asynchronous serial communication available, and is
used also for debugging the board. The connection into the outside is made by the SIO port
on the front panel. The basic operation speed is 19.2 kbps and the speed can be changed.

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OfficeServ 7400 Service Manual

2.4.2 LP40 Board

LP40 is a vice control board that controls the overall functions of OfficeServ 7400, which
is mounted on the slot 1 of the basic cabinet and the extension cabinet. The board perform
the management of the subscriber cards and the terminals under the control of MP40, the
main control board. In addition, the board transmits the signals of the various events
generated at the subscribers card and terminals to MP40.
LP40 performs the conversion of the voice channel stream between MP40 switches and the
subscribers cards. On LP40 board, three optional boards can be mounted. The selective mounting
according to the functions by the optional boards can be available, and the option board provides
the functions of DTMF, R2, CID, Conference, MISC, etc.

2.4.2.1 Block Diagram

The block diagram of LP40 board is shown below:

Address & Control DATA

ENGINE
(STL7065Cx2)

CPLD
(LC4256V-75F256)

FROM 4MB
(SST39VF040)

Rate Conversion
(MT90863)
T90863)

Flash ROM
(Am29LV040B)

MP40

HDLC

SDRAM 16MB
K4S641632Ax2
(1Mx16x4)x2

CPU
MPC852TZT50
MII bus

LAN

PHY

BUFFER
Daughter Board
Interface

To Mother Board

Figure 2.4 Block Diagram of the LP40 Board

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CHAPTER 2. ! .

2.4.2.2 Main Functions

The main functions of LP40 board are as follows:
CPU (MPC852TZT50)
One MPC852 of Motorola Co. Ltd is used as the main processor. MPC852 is a data bus
that operates in the 32-bit mode.
The main specifications of MPC852 are as follows:
y

Embedded Power PC core

Data cache of 4 Kbytes and the instruction cache of 4 Kbytes

Memory Management Unit(MMU) supported

32-bit Dynamic Bus Controller

32-bit Address Lines

Memory Controller(8banks)

Fast Ethernet Controller(FEC)

Two 16-bit timers and one 32-bit timer

System Integration Unit Functions built-in

Seven external interrupts and 18 internal interrupts

SIP operation of the high performance can be made by the built-in communication
processor

On-chip 16x16 Multiply Accumulate Controller

2 Baud Rate Generator(BRG)

Two SCC where HDLC communication can be made are supported.

One SMC where the asynchronous communication can be made is supported.

One SPI where the serial communication can be made is supported.

PCMCIA Interface supported

DEBUG Interface supported

SCC
y

SCC3: Operates by HDLC communication port for exchanging the messages with
MP40.

SMC1: A debugging port for the system engineer.

System Clock
LP40 card uses 50MHz as the main clock oscillator.

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OfficeServ 7400 Service Manual

BOOT ROM (Flash ROM)

For Boot ROM, the flash ROM of 512 Kbytes is used. Boot ROM has the program(system
operation program) for the initial operation of the system, and performs the downloading
the main program from the flash ROM into SDRAM.
SDRAM
To SDRAM, 16 Mbytes is provided. SDRAM is configured with two elements of 8 Mbytes.
SDRAM performs the role of saving the data necessary for the system processing.
In addition, SDRAM is designed to operate in No Wait for the maximized system
performance.
Flash ROM
FROM is 4 Mbytes, and saves the main program at itself for the operation of LP40.
Engine (SAMSUNG ASIC: STL7065C)
For the Engine of LP40, two ASIC of Samsung Electronics Co. Ltd. are used. Engine
performs the detection of the DTMF signals and the conference function, and also provides
the function by which the individual compensation can be made for the voice signal
connected to the subscriber card.
Rate conversion (MT90863)
LP40 receives the voice signals of 8MBPS stream from MP40 to converge them into the voice
signals of 2 Mbps. LP40 uses the device performing the rate conversion that transmits the converged
signals to the subscriber card. LP40 board converges four 8Mbps stream into 16 2 Mbps stream.
WATCH DOG
WATCH DOG is the function of recovering automatically the system when there an
abnormality occurs in the system.
If the system operates for about five seconds, the system is designed to re-operates.
CPLD
CPLD uses the CPLS of Lattice Co. Ltd. CPLD is configured with the interface logic
between devices at the LP40 board, and composes the logic for programming by which the
logic can be changed. If there occurs the causes for the logic change or for the upgrade, the
logic can be changed via the JTAG bus at the outside PC

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CHAPTER 2. ! .

Daughter Board Interface

Daughter board is configured in order to be used by making options for the common
resources inside LP40, and up to three boards can be mounted. As the daughter boards,
there are SCM, MFM, RCM, MIS, RCM2, and CRM, and their installation are marked on
the boards.
The main functions of each daughter board are as follows:

2-12

Multi-Frequency Module(MFM): MFM is the option board that is configured with the
ASIC chips that detects the DTMF signals. The positions where the MFM boards are
mounted are LOC1 or LOC2, and the mounting positions are marked on LP40 board.
When MFM board is mounted, The DTMF signals coming from 12 channels can be
detected simultaneously.

R2 CID Module(RCM): RCM is the option board that is configured with ASIC chips detecting
the Caller Identification(CID). The module generates and detects the R2 signals, which are the
signaling signals between trunk lines. The position where RCM board is mounted on LP40 is
LOC1 or LOC2, and the mounting position is marked on LP40 board. When RCM board is
mounted, the R2 signals can be generated via 30 channels, and R2 signals of eight channels or
the CID of 14 channels can be detected. The selection of the detected signals(R2/CID) is
determined by the positions of the switch on the RCM board.

Miscellaneous(MIS): MIS is the option board mounted on L40 board. The position
mounting on LP40 is LOC 3, and the mounting positions marked on the LP40 board.
MIS provides two external held music input ports, external paging port, the loud bell
port, and the common bell port, and also provides the two dry contact ports that
connects or blocks the signal transmission or the electric power supply with the
external devices.

R2 CID Module 2(RCM2): RCM2 is the option board that can detect and generate the
Caller Identification(CID). The position where RCM2 board is mounted on LP40
board is LOC1 or LOC2, and the mounting position is marked on LP40 board.
If RCM2 board is mounted, The CID signals of 14 channels can be detected and
generated. The operation mode(Detection generation signal) and can be selected into
R2 or into CID by the switch inside RCM2 board. The support for R2 function will be
made later, the R2 function is not provided in the present.

Switch Conference Module(SCM): SCM is the option board that performs the conference
function. The position that SCM board is mounted on LP40 board is LOC1 or LOC2, and
the mounting position is marked on LP40 board. Only on one of LOC1 or LOC2, the board
can be mounted. If SCM board is mounted on, the simultaneous calling of five persons and
12 groups can be made, and DTMF signals coming from 12 channels can be detected
simultaneously.

Common Resource Module(CRM): CRM board is the option board that performs the
DTMF signal detection, R2 signal generation, CID signal generation and detection.
The position used when CRM board is mounted on LP40 board LOC1or LOC2, and
the position is marked on LP40 board.

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OfficeServ 7400 Service Manual

Caution when Daughter board is mounted

Be sure to mount the daughter board on the control board in the status of the
switch-off when mounting the board. The mounting position of the Daughter board
is marked on the board with the indication into LOC1, LOC2, and LOC3. Only on
LOC3 the MIS board can be mounted. In addition, only one SCM board can be
mounted on LOC1 or on LOC2. The rest daughter boards can be mounted on
LOC1 and LOC2 irrespective of te position and the mount.

LAN Interface
LP40 card can be connected to LAN with no additional LAN card. The MAC addresses
have built in CPU, and its maximum connection speed is 10/100 Mbps. The speed is
automatically selected when the LAN cable is connected.
Universal Asynchronous Receiver & Transmitter (UART)
UART is the element by which the asynchronous serial communication can be made, and is
also used for debugging the boards. The connection to the outside can be made by the SIO
port on the front panel. The basic operation speed is 19.2 kbps, and the speed can be
changed.

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CHAPTER 2. ! .

2.5 Universal Board

On the universal slot of the OfficeServ 7400 System, the board providing the various services can
be mounted. Universal boards can be classified into four types of voice trunk line board, the
voice internal line board, the voice application board, and the data board according to the
provided services.
Table 2.1

Types of Universal Boards

Board Types

Board Name

Voice Trunk Line Board

8TRK, TEPRI, TEPRI2

8SLI, 16SLI, 16SLI2, 16MWSLI, 8HYB, 8HYB2, 8DLI,

Voice Internal LIne Board

16DLI, 16DLI2

Voice Application Board

MGI, MGI64, 4DSL, 4WLI

Data Board

LIM, PLIM, GPLIM, GSIM, GWIM

2.5.1 8TRK board

8TRK board is the trunk line board of eight ports, which is mounted on the universal slot.
To each port, the general line or the private switch, or the general phone lines of other
keyphone system can be connected. 8TRK board performs the functions of Real driver, Ring
detection, TSAC, and CODEC control via TMC ASIC.

2.5.1.1 Block Diagram

The block diagram of 8TRK board is shown below:

Address
&
Control

DATA

ASIC
STL7053

CODEC
Part

HYB
&
Matching

Line #1
Interface

CODEC
Part

HYB
&
Matching

Line #4
Interface

CODEC
Part

HYB
&
Matching

Line #5
Interface

CODEC
Part

HYB
&
Matching

Line #8
Interface

ASIC
STL7053

MBD Interface

Figure 2.5 Block Diagram of the 8TRK Board

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2.5.1.2 Main Functions

The main functions of 8TRK board are as follows:
Configuration
The detailed block diagram of the interface circuit in C.O line is shown below:
Tip

Protection
Line

Rectifier
&
DC By-pass

Relay
Loop

Ring
Detection

Conversion
4W to 2W

Loop
Detection

Ring

Port control circuit

(Relay Drive Circuit)

Dial Pulse Generation

Circuit

Port
Status
Read
Circuit

Hybrid
Balance
Circuit
Impedance
Matching
Circuit

Base
Gain

Setup
Circuit

Low
Pass
Filter

CODEC

Low
Pass
Filter

T.S.A.C (Time Slot

Assignment Circuit)
Data & Address Bus
A.G.C (Automatic Gain
Controller)

Buffer
Circuit

Control Bus
Highway Signal

TMC (STL7053)

Figure 2.6 Block Diagram of the C.O A Line Interface Circuit

The interface circuit of the C.O line is configured with the DC current by-pass circuit, the
matching trans, the balance network, the hybrid circuit, the channel assign timing control,
the PCM CODEC, the Digital Gain Circuit Logic, etc in order to send.receive the trunk line
and the voice frequency(300~3400 Hz) In addition, the additional DC by-pass circuit is
configured in order to minimize the trans for the voice path trans.
HOS, Ring Signal Detection Circuit is built-in inside this circuit. In order to control the
highway buffer(74ABT125) of the Time slot Assign circuit, the TSAC Enable signal
generated inside the TMC is used. The Hybrid circuit for matching the impedance is
designed into the Hybrid for the line impedance 600 .

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CHAPTER 2. ! .

Voice Transmission/Reception
The surge protection function is used between the tip lead and the ring lead for preparing
the high voltage supply. In addition, the third protection circuit is configured by using the
zener diode inside the matching circuit of trans secondary impedance. The bi-directional
voice received from the C.O. is separated from the line loop feeding power, and passes
through the coupling capacitor, and is entered into the rans for voice signal.
The voice signal transmitted to the trans secondary side is divided into the transmission
path(Tx path_ and the reception path(Rx path) at the Impedance & Balance circuit In
addition, the low frequency compensation function that the resistance is matched into
600 is provided at the low frequency impedance matching & balance circuit. In the
present, its design is made into the mode of the Long Loop Impedance Matching.
The Tx voice signal converged like this is made into the Pulse code Modulation(PCM) by the
CODEC so that the corresponded channel is allocated. After them, the signal is transmitted
into the time switch by passing through the PCM highway and the digital gain control
circuit.
The Rx PCM data, the Rx voice signal, is converged into the analog signal by CODEC.
The voice signal converged like this is transmitted into the balancing circuit through the
impedance a matching circuit. And only the voice signal is supplied to the trans secondary
side to be transmitted into the line feeding power.
This signal is matched with the voice path of the C.O line Interface. By doing so, the
additional voice signal is transmitted into the additional path separately from the transmission
path.
Circuit of Sensing Ring Reception
The ring reception signal transmitted from the Central Office(C.O) is transmitted into the
reception signal in the status in which the trunk line interface is in the Hook on. The ring
signal passes through the poly-capacitor(0.47 uF/250 V) via the normal contacting point of
the loop relay to block the DC voltage. By doing so, only the ring signal of more than
certain level passes through the bridge diode. This signal passes through the resistance to
be entered into the Photo-coupler in order to generate the ring-sensing signal. A normal
status is generated as H when the ring is transmitted.
DC Current By-Pass Circuit
DC Current by-pass circuit occupies the DC loop among the trunk lines, and passes the AC
signal. This part is configured with the hybrid IC in order to minimize the mounting space.
When both ends of Tip/Ring configures the loops at the -48 V, it makes the DC path, and
fixes the resistance into 33 in order to satisfy the given specifications.
The output of the Hook-Off Sensing(HOS), a function of sensing the loop is provided to
the system by the photo-coupler till the loop is occupied by the additional function. At H,
the general status of HOS, L is sensed.
This is converged to be transmitted into the CPU data bus.

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2.5.2 TEPRI board

TEPRI board is the board used in the connection of the OfficeServ 7400 system to the
T1/E1 trunk line or to the ISDN PRI trunk line. The board can be mounted on the whole
slot of the extension cabinet among the universal slots of each cabinet.

2.5.2.1 Block Diagram

The block diagram of TEPRI board is shown below:

Address
&
Control

DATA

DRAM
(KM416C1200x1)

SIO
Interface

FROM
(AM29F800)

CPU
(MC68302)

PEB2254

RST

Line Interface

EPLD

Common Memory
(CY7C136)

Main Board

Figure 2.7 Block Diagram of the TEPRI Board

2.5.2.2 Main Functions

The main functions of TEPRI board are as follows:
Line Interface
y

The selective use of T1/E1 signaling is available by programming.

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CHAPTER 2. ! .

he resistance circuit that can satisfy both of T1(100 ) and E1(120 ) simultaneously
is used.

The surge protection in the level recommended by ITU is provided.

Output port protection by the line monitor

Jitter characteristics satisfying ITU-T I.431 and G703 is provided

The line coding mode can be selected.(HDB3, AMI)

The limit value of the Loss Of Signal(LOS) can be set.

The local loop and the remote loop are provided.

HDLC or Channel Associated Signaling(CAS) is supported via the Common Channel

Signaling(CCS).

CPU (MC68302)
y

68302FN16 used.

For CPU clock, 16.384 MHz is used, and 16 bit is used for the data bus.

For ROM, 1 Mbytes(AM29F800B) is used.

For RAM, 2 Mbytes DRAM(KM416C1200) is used, and the RAM backup is not used.

For the interrupt for Timing Reference, two general purpose timers inside the CPU are
used.

For reset, DS-1706 is used, and the reset button for testing is available.

CPLD MACH4-64/32 is used in order to accommodate the peripheral circuits of CPU.

For the IPC communication with MP40 board or with LP40, DPRAM(71C132Y) is
used. When IPC is used in the interrupt mode, CPU is connected to LP40 via the
resistance 0 . When used in the polling mode, the resistance 0 is removed. In the
present it operates in the polling mode.

Connected to CPU port so that the RY/BY signal of the flash ROM can be read.

Clock
y
y
y
y
y

Digital Phase Locked Loop(DPLL) exists inside PEB2254.

The synchronization of the system clock is performed by the PLL circuit of the MP40
board.
4.096 MHz, CLKX, and FSX are provided by mother board.
SCLKX/SCLKR of the PEB2254 is converged into 8.192 MHz to be provided by
using the delay line.
The Active signal indicating the Valid Reference clock is received at CPU port.

SIO
y
y
y

2-18

A serial port for testing is provided by using the serial communication controller of
CPU.
RJ-45 connecter can be connected at the front side of the cabinet.
Baud Rate source clock is used as the CPU master clock, and its use can be made up to
19.2 kbps, and the speed is determined by software.

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OfficeServ 7400 Service Manual

2.5.3 TEPRI2 board

TEPRI2 board is the board used in the connection of the T1/E1 trunk line or ISDN PRI
trunk line to OfficeServ 7400 System. The board can be mounted on the whole slots(1, 2,
4~11 slots) of the basic cabinet supporting 64 channels among the universal slots of each
cabinet.

2.5.3.1 Block Diagram

The block diagram of TEPRI2 board is shown below:
Address
&
Control

DATA

SIO Interface
(MAX3232E)

SDRAM
SDRAM
(K4S641632)

(K4S641632H)
CPU
(MPC852T)

BOOT FROM
(SST39VF040)

RST

APPLI. FROM
(AM29LV320)

PHY
(LXT972)

ENGINE
(STL7065)

CPLD
(LC4256V-75F)

FALC-56
FALC-56
(PEF2256H)

(PEF2256H)

LED Indicator
Line Interface

Common Memory
(IDT71321LA35PF)

Figure 2.8 Block Diagram of the TEPRI2 Board

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CHAPTER 2. ! .

2.5.3.2 Main Functions

The main functions of the TEPRI2 board as as follows:
Line Interface
y

T1/E1 signaling can be selected to be used by programming.

The interface is implemented into the register so that the impedance of the T1(100 )
and E1(120 ) can be simultaneously satisfied.

The surge protection in the level recommended by ITU is provided.

Output port protection by the line monitor.

The jitter characteristics satisfying ITU-T I. 431 and G703 are provided.

The line coding mode can be selected(HDB3, AMI).

The limit value of Loss Of Signal(LOS) can be set.

Local and the remote loop are provided.

DPLL for recovering data and clock is used.

HDLC or Channel Associated Signaling via Common Channel Signaling(CCS) is

supported

CPU (MPC852T)
One MPC852TZT50 of Motorola Co. Ltd. is used as the main processor. This is a data bus,
which operates in 32-bit mode.
The main specification of the MPC852T are as follows:

2-20

Embedded Power PC core

Data cache of 4 Kbytes and Instruction cache of 4 Kbytes

Memory Management Unit(MMU) supported.

32-bit Dynamic Bus Controller

32-bit Address Lines

Memory controller(8 banks)

Fast Ethernet Controller

Two 16-bit timers and one 32-bit timer

System Integration Unit Function is built-in

Seven external interrupts and 18 internal interrupts

2 baud rate Generator

Two SCCs where HDLC communication can be made are supported.

One SMC where the asynchronous communication can be made is supported

MAC to which 10/100 Mbps LAN can be supported is built-in.

Debugging Interface

1.8 V Core and 3.3 V I/O operation with 5 V TTL compatibility

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OfficeServ 7400 Service Manual

SCC
y

SMC1: A debugging port for the system engineer.

Clock
y

Fro CPU clock, 50 MHz is used as the main clock oscillator

The synchronization of the system clock is performed by the PLL circuit of the MP40
board.

4.096 MHz, 8.192 MHz, FOI, and FSX are provided by mother board.

4.096 MHz of the mother board is provided to SCLKX/SCLKR of the PEF2256H.

The Active signal indicating the Valid Reference clock is received at CPU port.

Boot ROM (Flash ROM)

y

For Boot ROM, Flash ROM(SST39VF040) of 512 Kbytes is used.

For Boot ROM, Socket is used, which performs the role of saving Boot program and
DB information.

Application ROM (Flash ROM)

y

For Application ROM, Flash ROM(AM29LV320D) of 4 Mbytes is used.

Application ROM is used for an application program, and saves the application code
program.

SDRAM
y

For SDRAM, DRAM(K4S641632) of 16 Mbytes is used, which is configured with

two elements of 8 Mbytes. At SDRAM, the main program resides to operate, and
saves the data necessary for the system processing. RAM backup is not performed.

The access time of SDRAM is set short for the maximized system performance.

WATCH DOG
y

WATCH DOG is the function of recovering automatically the system when there an
abnormality in the board. The restart-up is made in case of abnormal operation for
about five seconds.

LAN Interface
y

The connection to LAN is available with no additional LAN board.

CPU has the 10/100 PHY MAC addresses built-in.

The maximum connection speed is 100 Mbps.

When connected to LAN, the speed is automatically sensed(Auto Nego) to operate.

Remote Monitoring function is provided via Ethernet.

PHY operates in 10/100 Mbps Full Duplex by using the LXT972.

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CHAPTER 2. ! .

UART (Universal Asynchronous Receiver & Transmitter)

y

UART is the element that makes the asynchronous serial communication available.

Used as the system I/O port(SMDR or PCMMC).

Connected to the outside via RJ-45 connecter on the front side of the cabinet.

As the Baud Rate source clock, OSC 1.8432 MHz clock is used.
Default speed is 19.2 kbps, and the maximum operation speed can be supported to
115.2 Kbps by software.

EEPROM
y

EEPROM used for saving MAC, 3-Wire Serial 1kbit EEPROM(AT93C46, 128 byte)
is used.

The proper number of the hardware on the board is allocated when manufactured in
the early at the factory.

Serial Peripheral Interface(SPI) of CPU is connected to port to communicate.

Reset
y

For the reset chip, DS1706RESA is used.

Among the resets, there are power on reset, the push button reset, software reset, and
Watch Dog reset.

CPLD
y

CPLD configures most of logics used in the TEPRI2 board, and CPLD
LC4256V-75F of Lattice Co. Ltd. is used.

CPLD can be changed at the external PC via JTAG bus.

IPC DPRAM
y

2 Kbytes DPRAM(71C132Y) is used for the IPC communication with LP40 board.

IPC operates in the polling mode.

Engine Block
y

2-22

STL7065 is used for the gain compensation of the TX, Rx Highway of the TEPRI2
board.

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OfficeServ 7400 Service Manual

2.5.4 8SLI board

8SLI board is mounted on the universal slot of OfficeServ 7400 to process simultaneously
eight voice channels. The part can be connected to a general phone via 8SLI board, and all
data generated at 8SLI are transmitted to MCP board or to LCP board.

2.5.4.1 Block Diagram

The block diagram of the 8SLI board is shown below:

Analog parts

RJ-45 x 8
TIP, Ring Signal

PFT
relay

RING
Generator

Relay x 8

Transformer x 8

Balance
Hybrid x 2

HOS 0~7

CODEC IC
TP3057 x 8

Dual Color LED x 8

HWTx
HWRx

FSX x 8

IC ASIC
SBS 9401
CS0, CS1,
CARD ID
CDEN, Data
BD8~BD16

Decoder
Address
BA4~BA16

Digital parts

CLK

30 Pin x 2 Connectors (to Mother Board)

Figure 2.9 Block Diagram of the 8SLI Board

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CHAPTER 2. ! .

2.5.4.2 Main Functions

The main functions of the 8SLI board are as follows:
ASIC SBS9401
SBS9401 provides the function of controlling four ports of the Digital Adaptor for
Subscriber Loops(DASL) and four ports of dial pulse generation via eight ports of Time
Slot Assignment Control(TSAC) and four ports of UART, Micro Channel Control.
There are additional functions besides them, but only the modes for using SLI are
described.
As for the functions related to SLI, there are TSAC taking eight channels, battery On/Off
controlling port, Ringing Relay controlling port, Hook-Off sensing function.
Voice Path
In the voice signals(300-3400 Hz) entered from the subscribers, only the voice signals are
transmitted to the secondary side in the status where DC is supplied in the primary side of
TRANS(T5692). The voice signals pass through CODEC to be converged into PCM code
to be transmitted into the high way. As for the gain between the Balance logic and CODEC,
the output signal of the CODEC is adjusted into +2.0 dBm, and is adjusted at the reception
signal of CODEC toward the subscribers direction by -7.0 dBm.
For 8SLI board, T5692(600 ) transformer and the Hybrid IC developed by Samsung
electronics Co. Ltd. have been used. In the 8SLI board, the feedback circuit removing the
echoes generating when converged from two lines into four lines has built. The resistance
value of the Termination Network is configured so that it can be matched to the complex
resistance as well as the pure resistance such as 600 . In the local, KP0078SA is used as
the Hybrid IC. The Hybrid ICs used by each country are shown in the table below:
Table 2.2 Hybrid types by Countries
HYBRID IC Names

Countries

KP0072SA

UK, NEWZEALAND

KP0075SA

HOLLAND

KP0078SA

KOREA, USA

KP0071SA

ITALY

KP0073SA

GERMANY, AUSTRALIA

KP0077SA

CHINA

-48 V Supply
-48 V power passes through Loop Disconnect circuit, Feeding Resistor, and Power Tr to be
transmitted to the subscribers phone via TIP. And the power passes through Power TR and
Feeding Resistor again via ring to be connected to GND.

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OfficeServ 7400 Service Manual

Loop Disconnection
The -48 V power connected to each port is switched over by TR. When LD signal is LOW,
the TR turns on, and the power is supplied. If HIGH, TR turns off to stop the supply of the
power.
Ring Trip
Ring trip means the stop of the ring signal transmission by operating the relay of the
subscribers phone circuit if the subscriber performs the Hook-off when the ring is
transmitted to the subscribers phone. The ring signal output operates as ON for one second,
and as Off for two seconds. When the subscriber performs the hook-off in the On time for
one second when the ring relay is attached to the subscribers tip and the ring end, the ring
path passes through the relay to be Ground.
Ring Transmission
When the relay operates by the relay control signal coming out from SBS9401, the ring of the
80 Vrms/20~30 mA 20/25 Hz is transmitted to the subscribers line.
As the source of the ring, there are the square wave generation circuit inside 8SLI board
and the Sine wave ringer that can be mounted outside separately, and the board designated
by countries is selected to be used.
CODEC
For CODEC, 3054/3057 that has been mounted on the existing 8SLI board is used.
Balance Hybrid
Balance Hybrid has already implemented inside the Hybrid. But, it is implemented into 600 .
Therefore, the circuit that matches to the Complex resistance is mounted as the additional Hybrid
together with CODEC.
Protection
There are the primary protection and the secondary protection.
y

Primary Protection
Varistor is connected between the tip and the ring, and protects the elements connected
between the tip and the ring.

Secondary Protection
The secondary protection is performed by connecting the Zener Diodes to the TRANS
secondary side.

Ring Generator
y

DC-DC converter
Converges the 48 V DC voltage into 75~80 V DC voltage. RC filter at the input
end is used in order to remove the noise when the electric noise generated at the
ring generator is entered together with the -48 V DC power.

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CHAPTER 2. ! .

2.5.5 16SLI board

16SLI board processes simultaneously 16 voice channels, and is mounted on the universal
slot of the OfficeServ 7400. The board can be connected to the general phone via the 16SLI
board. All data generated at the 16SLI board are transmitted to the MP40 board or to Lp 40
board via the data bus.

2.5.5.1 Block Diagram

The block diagram of the 16SLI board is shown below:

Analog parts

RJ-45 x 8
TIP, Ring Signal

PFT
relay

RING
Generator

Relay x 16

Transformer x 16

Balance
Hybrid x 4

HOS 0~15

CODEC IC
TP3057 x 16

Dual Color LED x 8

HWTx
HWRx

FSX x 16

IC ASIC
SBS 9401
CS0, CS1,
CARD ID
CDEN, Data
BD8~16

Decoder
Address
BA4~16

Digital parts

CLK

30 Pin x 2 Connectors(to Mother Board)

Figure 2.10 Block Diagram of the 16SLI Board

2.5.5.2 Main Functions

For the main functions of the 16SLI board, refer to 2.5.4.2 Main functions of the 8SLI
board of this manual.

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OfficeServ 7400 Service Manual

2.5.6 16SLI2/16MWSLI board

16SLI2 board is the board that provides 16 port of the analog internal line, and provides the
voice communication function by the interwork with the general phone via the internal line.
16MWSLI board is the board where the message waiting function is added to the same
function as 16SLI2.

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CHAPTER 2. ! .

2.5.6.1 Blic Diagram

The block diagram of the 16SLI2/16MWSLI board is shown in the table below:

C.O Line
For PFT

PFT
Relay
X 4EA
Relay
MW
Relay
Relay
MW
Relay
Relay
MW
Relay
Relay
MW
Relay

PROTECTION
CCT
RELAY CCT

SLIC
DC FEED
HOS
PWM
SLIC
DC FEED
HOS
PWM
SLIC
DC FEED
HOS
PWM
SLIC
DC FEED
HOS
PWM

EPLD

EPLD
DRIVER
CCT

SLAC
CODEC, GAIN
Control,
SERIAL I/F
for
REGISTERs

PWM FREQ.

RINGER
Selection
SW

SPI/PSI
Frequency
Divider

CARD
ID

HOS Detection
Buffer x 2
RINGER
CCT

CLOCK CCT
4.096 MHz
2.048 MHz
FOI
FS
RINGER
20.25 HZ

-48 V MOTHER BD
+5 V MOTHER BD
+3.3 V MOTHER BD
MESSAGE VOLTAGE
EXT. RINGER CCT
SINE WAVE

S
Y
S
T
E
M
M
O
T
H
E
R
B
O
A
R
D

Figure 2.11 Block Diagram of the 16SLI2/16MWSLI Board

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OfficeServ 7400 Service Manual

2.5.6.2 Main Functions

The main functions of the 16SLI2/16MWSLI board are as follows:
Line Interface
Message Waiting Lamp On, Battery Feeding, Ringing Relay, and Hook-Off are included
and the protection against the surge discarded from the line is also included.
Ring Generator
The ring generator receives the Square wave of 20/25 Hz supplied from mother board,
generates the square wave ring signal, and provides them to SLT. In addition, it provides
the ring signal coming from the external sine ringer installed additionally to the line.
Message Waiting Functions
Message Waiting function is the one of turning on periodically the lamp of the MW phone
having the messages remained in the specific internal line. MW voltage is commonly used
with the internal Ringer circuit, and the output voltage is more than 100 V. In the MWSLI,
the internal Ringer circuit is needed for the use of the MW voltage even when the external
ringer is used.
The cycle of MW Lamp can be adjusted at the KMMC #511.
In the [Continuous LED], if making the lamp always turned on, and making the lamp
periodically On/Off,
1)
2)
3)

Select [INTERRUPT LED], and press the [Right] soft button.

Moves into the time cycle with [Right] soft button.
Enter the ring cycle data in the order of On time, Off time.

Le79555-2QC
Le79555 is the Subscriber Line Interface Circuit IC made by Legerity Co. Ltd.
Its package type is 32Pin QFN, and includes the Polarity Reverse function.
It performs the main functions of the subscribers by the interface with the Le58QL021
QSLAC I.C.

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CHAPTER 2. ! .

Le58QL021
Le58QL021 is the Quad Low Voltage Subscriber Line Audio Processing Circuit I.C made
by Legerity Co. Ltd. One I.C has four Codecs and filter, and is connected to four SLIC and
SPI Bus.
The following can be programmed by using the internal filter.
y

SLIC device input impedance

Transhybrid balance

Transmit and receive gains

Equalization(frequency response)

Digital I/O pins

Programmable debouncing on one input

Time slot assigner

Programmable clock slot and PCM transmit clock edge options

2.5.7 8HYB/8HYB2 board

The boards of 8HYB and 8HYB2 are the ones where 8SLI and 8DLI function can be
simultaneously used, which is mounted on the universal slot of OfficeServ 7400 to be used.

2.5.7.1 Block Diagram -DLI Part

The bock diagram of the 8HYB/8HYB2 boards DLI part is shown below:

Line #1
Interface

Line #2
Interface

Line #3
Interface

Line #4
Interface

Line #5
Interface

Line #6
Interface

QDASL(TP3404)

Line #7
Interface

Line #8
Interface

QDASL(TP3404)

Address & Control

DATA

ASIC(STS9511)

Address & Control

DATA

30 Pin x 2 Connectors(to Mother Board)

Figure 2.12 Block Diagram of the 8HYB/8HYB2 Board DLI

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OfficeServ 7400 Service Manual

2.5.7.2 Block Diagram -SLI Part

The block diagram of the 8HYB/8HYB2 boards SLI part is shown below:

Analog parts

RJ-45 x 8
TIP, Ring Signal

PFT
relay

RING
Generator

Relay x 8
* 8Port=8

Transformer x 8
* 8Port=8

Balance
Hybrid x 2

HOS 0~7

Dual Color LED x 8

* 8Port=2

CODEC IC
TP3057 x 8
* 8Port=8

HWTx
HWRx

FSX x 8

IC ASIC
SBS 9401
CS0, CS1,
CARD ID
CDEN, Data
BD8~16

Decoder
Address
BA4~16

Digital parts

CLK

30 Pin x 2 Connectors(to Mother Board)

Figure 2.13 Block Diagram of the 8HYB/8HYB2 Board SLI Part

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CHAPTER 2. ! .

2.5.7.3 Main Functions

The main functions of the 8HYB/8HYB2 board are as follows:
y

Analog internal line and the digital internal line are simultaneously provided.

20/25 Hz ring is generated.

DTMF/Dial Pulse sensing

Hook-Off sensing

Tone Generation function

Eight ports of the analog internal line and eight ports of the digital internal lines are
provided.

Eight ports of SLI and eight ports of DLI function are provided in one board Assy.

16 ports are configured by using the eight ports of RJ-45. No. 4 and no. 5 pins inside
are used in the SLI port, and no. 7 and 8 pins are used as the DLI port.

2.5.8 8DLI board

8DLI board provides eight ports and can be connected to the digital phone. One port uses
the transmission element where the interface of 2B + D(two voice channels of 64 kbps and
one signal channel) can be performed.
For the signal transmission, Alternative Marking Inversion(AMI ) of the full multiplex mode
of 144 kpbs as the code transmission mode, by which all the voice channel and the data
channel can be used in end-to-end communication. The actual transmission rate between
the 8DLI board and the digital phone is. 16 kbps is used for the synchronization among the
48 kbps, which is the part where144 kbps is excluded, and the rest 32 kbps transmits the
null data.
For the transmission path between DLI board and the digital phone, the line with the
thickness of AWG 26 is used, and the maximum transmission distance is 400m. DLI board
supplies the -48 V power to the phone, and is configured with the poly switch blocking the
excessive current and the circuits for the digital interface.
On/Off of the -48 power is controlled via the Fet inside 8DLI board.

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OfficeServ 7400 Service Manual

2.5.8.1 Block Diagram

The block diagram of the 8DLI board is shown below:
Line #1
Interface

Address
&
Control

DATA

QDASL
(TP3404)

Line #2
Interface
Line #3
Interface
Line #4
Interface

QDMC
(STI9511)

Line #5
Interface

QDASL
(TP3404)

Line #6
Interface
Line #7
Interface
Line #8
Interface

MBD Interface

Figure 2.14 Block diagram of the 8DLI Board

2.5.8.2 Main Functions

The main functions of the 8DLI board are as follows:
QDMC (STI9511)
QDMC(STI9511) is the ASIC of special use for controlling TP3404, which is the Quad
Digital Adapter for Subscriber Loops(QDASL) chip made by National Semiconductor Co.
Ltd. TP3404 controlled by this chip is the extension of the TP3401/3402/3403 that has be
used. It is the chip where the transceiver of the single-channeled Time Compression
Multiplexed(TCM) is extended into four ports and of which Micro wired control and the
other control structure are changed.
The functional characteristics of the Quantum Discrete Memoryless Channel(QDMC) are
as follows:
y

Data Transmission/Reception function in the UART format for D channel

The selectable speed of UART(2/4/8/16 kbps)

B channel of By-pass Interface function

Micro wired Serial Control(16-bit) interface

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CHAPTER 2. ! .

TP3404 2 chip control(Totally 16 channels are available.)

Recognition function of the used board and the Identification

4.096 MHz master clock

5 V operation

60 pin Quad Flat Pack(QFP)

QDASL Interface
For the D channels used in the serial data transmission, there are RxD and TxD.
D channel makes the AMI codes with B channel, and transmits them to the line. D channel
data are used in the phone control, and B channel data are used in the manufacture of voice
signals. There is the /INTD for processing the micro channel interrupts of QDSL on each port.
INT of QDSL is generated only in the access to the micro channel and the initialization of the
QDSL. As the generation conditions on this occasion, there are NO SIGNAL(CO), OUT OF
SYNC(C1), and BIPOLAR VIOLATION(C7).
INT is generated only in the first power on and in he change of the QDSL status by some
error, and is used with binding UART Tx INT and AND GATE. INT is the clock of the CH control part that sets the initial status of the ports QDSL, which is configured with
CCLK(1 MHz), CI for the control data entry, and CO for the status output. In addition,
B channel opens the hardware buffer by the hardware frame synchronization allocated to
itself, and is transmitted to QDSL. The control data is transmitted into the subtime slot slot
D-channel where 2-bit 256 channels can be allocated. The subtime slot here means to
divide B channel of 8 bits into four by 2 bits. Therefore, the data of four frames should be
received in order to receive D channel of on byte from QDSL.
Unlike that, QDMC provides 128 subtime slots.
Digital Phone Interface
AMI code is generated at QDASL(TP3404), transmitted into the general phone via TRANS.
AMI codes received at the phone via TRANS are demodulated into the serial data, and are
transmitted into QDMC. QDMC converges the entered serial data into the parallel data via
UART, and transmits them to CPU. In addition, the voice data transmits the data of
PAL(22 V10) to the highway with /TSB of QDSL.
One QDMC controls two QDASL(Totally eight ports), and adds the /TSB signals
generated at each QDSL to use them.
For the TRANS for matching, DLT-1 is used. The resistance 100 on the QDASL LO end
is for matching the impedance, and 2 F is used for reducing the noise. And two Zener
diodes(3.6 V) of the TRANS entry end is used for protecting Hazard. The -56 V power that
is provided to the phone is supplied via the poly switch in order to prevent to flow an
excessive current in the phone. Varistor on the RANS entry end is for the Hazard protection.

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OfficeServ 7400 Service Manual

Transportation Block
The transportation block is the circuit block that transmits the data(D-channel) and the
voice(B-channel) between the digital phone and the 8DLI board in the full duplex mode.
8DLI board is the master board, which operates in the slave mode. When the master
transmits the transmission data, the slave, after receiving the data, has a little guard
time(stop time), and transmits the transmission data. And the master used the ping-pong
mode receiving the data.
The -48 V DC voltage is supplied to TRANS via the poly switch, and the poly switch
performs the control the current when there a short occurs in the path, and the Zener diode
performs the protection against the outside high voltage.

2B + D(2 Wire)

Transmission
I.C (DASL)

CODEC

MCU

SYSTEM
(MASTER)

DIGITAL TELEPHONE
(SLAVE)
x8
Transmission
I.C (DASL)

DMC

PCM
HIGHWAY
TIME
SWITCH

CPU

DLI card

Figure 2.15 Basic Configuration Diagram between Digital Phone and System

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CHAPTER 2. ! .

B1 & BITS B2 & BITS

D 2b

B1 & BITS B2 & BITS

D 2b

START BIT
MASTER BURST

DATA-FORMAT
(DLI board) of the
Master Side

MASTER BURST

td + Guard Time

Guard
Time

SLAVE BURST

SLAVE BURST

td
2 FRAMES (250s)

DATA-FORMAT
of the Slave side
(Digital phone)

Figure 2.16 Data Transmission Format Diagram

2.5.9 16DLI/16DLI2 board

The boards of 16DLI and 16DLI2 provides 16 ports of the circuits of the interface with the digital
phone that is the terminal of OfficeServ 7400 system, Digital Pulse Interval Modulation(DPIM),
and uses QDSL where the interface with four 2B = 1D(two voice channels of 64 kbps and one
channel of 16 kbps) can be performed.
For the signal transmission, the AMI coding mode of 144 kbps full duplex is used. For the
ene-to-end communication, the voice channel B1 and B2, and two channels are supported,
by which two internal lines can be connected to one port.
The actual transmission between 16DLI board and the digital phone is 192 kbps, 16 kbps
for the synchronization among the 48 kbps excluding 144 kbps of 2B+1D is used, and 32
kbps is used for the Null data. For the physical transmission path between 16DLI/16DLI2
board and the digital phone, the line of the AWG 26 thickness is used, and the maximum
transmission distance is 400m.
In UART inside QDMC, there are three buffers of RX, TX composed of one byte. When
more than three buffers are used, the data are damaged. Therefore, the data should be
transmitted after the buffer status is checked. That is, when the parallel data are converged
into the serial data at QDMC to transmit them to QDSL, QDSL converges the received data
into AMI code to transmit them to the digital data. Unlike that, the signal data generated at
the digital phone converges the serial data into the parallel data at the UART Rx buffer
inside QDMC via QDSL and transmits them to CPU. On/Off of the -48 V power is
controlled via the FET inside the 16DLI board.

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OfficeServ 7400 Service Manual

2.5.9.1 Block Diagram

The block diagram of the 16DLI/16DLI2 board is shown below:

Line #1
Interface

Address
&
Control

DATA

QDASL
(TP3404)

Line #2
Interface
Line #3
Interface
Line #4
Interface

QDMC
(STI9511)

Line #5
Interface

QDASL
(TP3404)

Line #6
Interface
Line #7
Interface
Line #8
Interface

Line #9
Interface

QDASL
(TP3404)

Line #10
Interface
Line #11
Interface
Line #12
Interface

QDMC
(STI9511)

Line #13
Interface

QDASL
(TP3404)

Line #14
Interface
Line #15
Interface
Line #16
Interface

MBD Interface

Figure 2.17 Block Diagram of the 16DLI/16DLI2 Board

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CHAPTER 2. ! .

2.5.9.2 Main Functions

The main functions of the16DLI/16DLI2 board are as follows:
QDMC (STI9511)
QDMC(STI9511) is ASIC of special use for controlling TP3404, which is the Quad Digital
Adapter for Subscriber Loops(QDSL) made by National Semiconductor Co. Ltd. TP3404 is the
chip that expands the transceiver of the single-channeled Time Compression
Multiplexed(TCM) transmission mode into four ports and of which micro wired control
and other control control structure are changed.
The functional characteristics of QDMC are as follows:
y

Data transmission/reception function of UART format for D channel

Selectable UART speed(2/4/8/16 kbps)

B channel of By-pass Interface Functions

Micro wired Serial Control(16-bit) interface

Two TP3404 control layers(Totally 16 channels available)

Used board and identification recognition function

4.096 MHz master clock

5 V operation

60 QFP

QDASL Interface
As for D channel for the serial transmission, there are RxD and TXd.
AMI codes are made with B channel to be transmitted to the line. D channel data are used
for controlling the phone, and B channel data are used for making the voice signals. There
is //INTD for processing the micro interrupts of QDSL in each port. INT of QDSL are
generated only in the access to te micro cannel and the initialization of QDSL. As for the
INT generation conditions on this occasion, there are NO SIGNAL(CO), OUT OF
SYNC(C1), and BIPOLAR VIOLATION(C7).
INT is generated only when the power is firstly on and when the QDSL status is changed
by some errors. Therefore, UART Tx INT and AND gate are bound to be used. INT is the
-CH control part that sets the initial status of QDSL, which is configured with CI for the
control data entry and CO for the status output. In addition, B channel opens the hardware
buffer with itself matched with the hardware frame synchronization allocated to itself, and
is transmitted to QDSL, and the control data are transmitted into D-channel where 2-bit
256channels can be allocated. The subtime slot here means to divide the B channel of 8 bits
into four by 2 bits. Therefore, if D channel data of one byte are to be received from QDSL,
the data of four frame should be received.
Unlike that, QDMC provides 128 subtime slots.

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OfficeServ 7400 Service Manual

Digital Phone Interface

AMI codes are generated at QDASL(TP3404) to be transmitted to the general phone via
TRANS. AMI code received at the phone via TRANS are demodulated into the serial data
to be transmitted to QDMC, and QDMC converges the entered serial data into the parallel
data via UART to transmit them to CPU. In addition, the voice data of DASL are
transmitted into the high way with /TSB of.
One QDMC controls two QDASLs(totally eight ports). Therefore, /TSB signal s generated
at each QDSL are combined to be used.
For the TRANS for matching, DLT-1 is used. The resistance 100 on the QDASL LO end
is used for matching the impedance, and 2 F is used for reducing the noise. In addition,
two Zener diodes(3.6 V) of the trans input end are for the Hazard protection.
-48 V power supplied to the phone is supplied via the poly switch in order to prevent the
flow of excessive current in the phone. Varistor of the input end of TRANS is for the
Hazard protection.

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CHAPTER 2. ! .

2.5.10 MGI Board

MGI board is mounted on the universal slot of OfficeServ 7400 system, and provides the
voice communication function via IP network. MGI board is connected to 10/100 Mbps
Ethernet, and performs coding/decoding the voice data in the mode of ITU-T or G.723.1
G.729.

2.5.10.1 Block Diagram

The block diagram of the MGI board is shown below:

MBD

PCM Interface part

2.048 MHz

MBD
DATA BUS

MAIN Interface part

FIFO, 512b x 2
IDT720ILA50J

Glue Logic
BUFFER,
Card ID,
EPLD, etc
MPU
KS32 C50100,
50 MHz QFP, 208 pin

Flash, 0.5 MB, Byte

AM29LV040 x 1
RCS0
Flash, 3 MB, Word
AM29LV160 x 3
RCS1, 2, 3
Backup
Battery

SRAM, IMB, Word

684000 x 2 RCS4
SDRAM, 16MB, I, Word
KM416S4020B x 2

RS 232C
TERMINAL

RS232C INTERFACE
38.4 K UART

Ethernet
10/1000Mbp

Ethernet, 10/100BaseT
LXT972

Connector

Decoding Logic
ECS0, ECS1
Reset Logic
DS1706

4 x MGI2D

Voice/FAX
Compressing part
G.723/G.729
VOIP Processor
AC48204

MPU BUS

Figure 2.18 Block Diagram of the MGI board

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OfficeServ 7400 Service Manual

2.5.10.2

Main Functions

On the MGI board, four MGI2Ds, which is an option board configured with VoIP CODEC
AC48204 and SRAM, are mounted. The main functions of MGI board are as follows:
CODEC AC48204
y

The maximum acceptable channels are 16 EA(4CH/Chip 4 EA).

The interface between CODEC and the host is implemented into Erasable
Programming Logic Device(EPLD).

For CODEC, the one made by AudioCodes Co. Ltd. is used.

Four separate voice, fax channels per chip are supported.

H.323 voice coder that can be configured by users is used.

Soft, Field-upgradeable Functionality

Roburst Bad Frame Interpolation(BFI)

G.165/G.168 Adaptive Echo Canceller

Toll Quality Voice that lowers the bit rate to the average of 3.2 kbps by using Silence
Suppression.

TIA 464A DTMF sense/generation

MF sense/generation

Parallel host processor interface

Tone signal that can be programmed by the host

Configurable PCM Interface: PCM highway or parallel interface

On-chip PCM highway interface(G.711 -law/A-law PCM Interface where the host
configuration time slot can be allocated and selected)

Gain control

RS-232C Interface
y

UARTO inside KS32C50100 used.

Maximum 38.4 kbps UART

Used for debugging, Flash memory update, DSP program update, and test

MCP Interface
y

Two FIFO IDT7201LA50J used

512 bite each of Tx, Rx

Card ID: 7D(8 CH): 7C(16 CH)

Card ID is automatically changed when the option board is connected.

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CHAPTER 2. ! .

Power
y

3.3 V used(1.8 V Power generated at 3.3 V.)

5 V used.

The circuit for supplying2.5 V later is designed in advancement

The connection between 5 V and 3.3 V device is implemented by the insertion of the
private buffer for securing the reliability.

Ethernet Interface
y

LXT972 used: Ethernet Interface PHY transceiver

RJ-45 connector used

Reset Logic

2-42

Power On Reset
Reset when lowering the power into 3.O V or less by using the DS1706 Power
monitor chip.
When the power turns on, the reset signal is added till the power becomes stable.
After a certain time elapses, the signal is cancelled, and the normal operation starts.
Assert/RESET of KS32C50100.

DS1706 Watchdog Timer Reset

Resets when there is no change in the WATCH DOG timer for more than 1.2
seconds.(Connect the TD pin to VCC.)
Assert the /RESET.
It is implemented that, in preparation for the situation that the /AS does not come
out, WDT or CPUCLK can be selected at the status input end of DS1706 as jumper.

Manual Reset
Operates by sensing that the reset switch I pressed.
Reset switch is connected to the /RESET of KS32C50100 after it passes through
the logic of sensing EPLD by using the SR flip-flop circuit.
The output of the reset switch is connected by the push button reset entry of the
DS1706, and DS1706 is connected by entering/RESET of KS32C50100.

DSP Reset
In the initialization of the DSP, the reset of the DSP can be controlled or
maintained at random by software for downloading the kernel program. Therefore,
it is designed that the reset can be performed when a certain addresses by each
DSP are entered.
Each DSP in the main software should be reset in the software dimension when the
booting is performed after the Power On Reset.

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OfficeServ 7400 Service Manual

2.5.11

MGI64 Board

MGI64 board is mounted on the universal slot of the OfficeServ 7400 System, and makes the
voice calls via the IP network available. MGI64 board is connected to the 100 Mbps Ethernet,
and performs the coding/decoding of the voice data in the mode of the ITU-T.(G.711, G.723.1,
G.729)

2.5.11.1

Block Diagram

The block diagram of the MGI64 board is shown below:

MBD

PCM Interface part

2.048 MHz x 2

MBD
DATA BUS

MAIN Interface part

DPRAM, 512 b x 2
IDT71321LA35PF

Glue Logic
BUFFER,
Card ID,
EPLD, etc
CPU BUS

Flash, 512 KB, 8Bit

SST39VF040 x 2

Flash, 8 MB, 16 bit

TE28F640-J3C120

CPU & DSP

M82530L-14
125 MHz FPBGA,
484PIN
Voice/FAX
Compressing part
G.723/G.729
VOIP Processor

SDRAM, 64 MB, 32 bit

K4S561632E-TC60 x 2

RS 232C
TERMINAL

RS232C INTERFACE
38.4K UART

Decoding Logic
LC4256V-75F256B

Ethernet
10/1000Mbp

Ethernet, 10/100BaseT
BCM5221A4KPT

Reset Logic
DS1706

Figure 2.19 Block Diagram of the MGI64 Board

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CHAPTER 2. ! .

2.5.11.2 Main Functions

The main functions of the MGI64 board are as follows:
CODEC M82530 (MAIN CPU & DSP)
y

The maximum acceptable channels are 64.

CODEC and the host are implemented together inside the chip.

For CODEC, the one made by MindSpeed Co. Ltd is used.

64 separate voice channels per chip are supported.

Soft, Field-upgradeable Functionality

Roburst Bad Frame Interpolation(BFI)

G.165/G.168 Adaptive Echo Canceller

Toll Quality Voice that lowers the bit rate into the average of 3.2 kbps by using the
Silence Suppression.

TIA 464A DTMF sensing/generation.

MF sensing/generation.

Parallel host processor interface

Tone signal that can be programmed by the host.

Configurable PCM Interface: PCM highway or the parallel Interface

On-chip PCM highway interface(G.711 -law/A-law PCM Interface that the host
configuration time slot can be allocated and selected.)

Gain control

RS-232C Interface
y

UART0 inside M82530 used

Maximum 38.4 kbps UART

Used for debugging, DSP program update and test.

MP40 Interface

2-44

Two FIFO IDT7201LA50J DPRAM used.

2 Kbytes by combining Tx and Rx.

Card ID: 7D

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OfficeServ 7400 Service Manual

Power
y

5 V used.

The circuit for the supply of 3.3 V is implemented by using 5 V.

The circuit for the supply of 1.2 V, which is the power for CPU core is implemented
by using3.3 V.

The connection between 5 V and 3.3 V devices is implemented by the insertion of the
private buffer for securing the reliability.

Ethernet Interface
y

BCM5221 used: Ethernet Interface PHY transceiver

RJ-45 connecter used.

Reset Logic
y

Power On Reset
Reset is performed when the power is lowered into 3.0 V or less by using the
DS1706 Power monitor chip.
When the turns on, the reset signal is added till the power becomes stable. And
after a certain time elapses, the signal is cancelled, and the normal operation starts.

WATCH DOG Timer Reset

It is implemented that the board reset is generated unless the access to the specific
address inside CPUrk CPLD is made within five seconds by using the internal clock
inside OSC that is entered into CPLD.

Manual Reset
Operates by sensing that the reset switch is pressed.
Reset switch connects the reset signal inside the CPLD by using the DS1706, and
the reset signal is generated at CPU, FLASH ROM, PHY, and STL7065.

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CHAPTER 2. ! .

2.5.12

4DSL Board

4DSL board performs the data transmission/reception with the IP device long-distanced
outside from the intranet by sing the VDSL technology, and is mounted on the universal
slot of the OfficeServ 7400 System.

2.5.12.1 Block Diagram

The block diagram of the 4DSL board is shown in the table below:
VDSL line
Infineon
VDSL

SDRAN
Uplink
100 Mbps

Infineon
VDSL

Port
9-16

Galileo
GT-48315

Infineon
VDSL

Infineon
VDSL

CPLD
ACPower

Figure 2.20 Block Diagram of the 4DSL Board

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OfficeServ 7400 Service Manual

2.5.12.2

Main Functions

The characteristics of the 4DSL board b each block are as follows:

Digital Transceiver (DSP)
y

PEF 22818 Ethernet, ATM single port chipset, P-TQFP-144-10 package

10/100 M Ethernet Interface

2 ATM UTOPIA level 2 PHYs(slave), or dual master Interface

2 Mbit/s PCM Interface(on the non-interleaved(fast) channel)

External host parallel port

Serial UART Interface

EEPROM Interface(I2C)

Model initialization, monitoring, and firmware upgrade via the RS-232 port.

Reed Solomon FEC(Forward Error Correction) coding

Power: Core 1.2 V, I/O 3.3 V

Analog Front End (AFE)

y

PEF 22815, 64 pin P-TQFP package

12 MHz analog bandwidth

13 bit DAC/ 12 bit ADC

Automatic Gain Control(AGC)

Clock source: 38.88 MHz

Power: Analog, digital 1.8 V, digital I/O 3.3 V

VDSL Line Driver

y

PEF 22810, P-DSO-8-3 package

Line Driver for VDSL

14 Vp-p differential voltage swing at +/-5 V supply voltage

10 dBm transmit power on the line at +/-5 V supply voltage

Power: +/-5 V

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CHAPTER 2. ! .

2.5.13

4WLI Board

4WLI board is the one used for the system connected to the WBS24 Base Station in order
to provide the wireless LAN function. For the base station, the WBS24 board(to be release
afterwards) is used. Up to four base stations can be served at each 4WLI, and the number
of the maximum available simultaneous calls are 16, and can be used by registering 48
terminals.

2.5.13.1 Block Diagram

The block diagram of the 4WLI board shown in the figure below:.
8K, PLL SOURCE
CLOCK & SP_DTACK

EPM3064
CLOCK
GENERATER

OSC
16, 384

INT.

INT.

10 m
800 m

DPRAM
CY7C136

LINE
INTERFACE

800 ms
Synch
signal

DASL, DRX
DTX

TP3403
PWR CTL

CPU
MC68302
TP3403

//A1~23
//DO~D15

PWR CTL

UART

9600 bps

RAM

DMC

ROM

TP3403

SIO

PWR CTL

16 Kbps
Data Com

TP3403
PWR CTL

Figure 2.21 Block Diagram of the 4WLI Board

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OfficeServ 7400 Service Manual

2.5.13.2

Main Functions

The main functions of the 4WLI board are as follows:

CPU
y

For the processor, the MC68302 made by Motorola Co. Ltd is used, and heightens the
operation speed via the 16-bit Word Operation.

For the interrupt, the Dedicate mode is selected, and

LEVEL7 is used as ABORT,

LEVEL6 as DASL INT,

LEVEL4 as DASL UART Rx, Tx, 10 ms INT,

LEVEL1 as 800 ms INT.

The time point of the DASL SYNCH data transmission is controlled by using I/O port.

I/O user interface uses SCC3 inside the processor, and its transmission speed is
9600 bps. The program can be upgraded by the PC by using the flash memory of
8 Mbits(1 Mbytes) as the program memory.

Two 4 Mbits RAM(Total: 1 Mbytes) is used for Word Operation.

Base Station Connection Block

y

DMC ASIC chip performs the time slot allocation, UART data communication, micro
control for eight DASL transmission chips.

DASL transmission chip receives the frame signal with the same timing at the base
station end connected to each port via the MBS mode. In addition. Two DASLs are
connected to each base station. The first DASL supports the UART interface between
the base station and 4WLI board for the 16 kbps data communication, and as for the
second DASL, by using the DEN mode, the multi frame signals of 800 ms within the
tow cycles of the 2.048 MHz B clock are correctly transmitted into all connection base
stations.

EPLD is used for securing the space on the board PCB. Make the savage of the
PULL_UP of 1.2 k at the output end of the TTL level in order to implement the
connection with CMOS device.

The power breeding control can be performed by software by using the MOSFET at
each port.

Reset Block
Reset block uses the WATCH DOG chip to prevent the abnormal operation of the system
resulted from the voltage change, and secures Power On Reset Timing Margin. Manual
Reset switch and NMI(Non-Maskable 5)

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CHAPTER 2. ! .

2.5.14

WBS24 Base Station (To Be Released Afterwards)

Wireless Base Station 2.4 GHz(WBS24) base station is the wireless LAN access point with the system.

2.5.14.1 Block Diagram

The block diagram of the WBS24 Base Station is shown in the figure below:

DASL _Int.

DSP_Int.

Magnetic

Ethernet
10/100T

Reset
Ethernet_I/F

RJ-45

UART

25 MHz Xtal

AC/DC Adaptor
(Local Power )
AC220/DC+5 V

Power Jack

Voltage
Regulator
Input : 5 V
Output :
3.3 V/1.8 V

SIO
RS232C

RJ-45

DC/DC Power
(Remote)
-48 V/+5 V, +3.3 V

External Antenna

PCMCIA I/F(EPB)

Embedded CPU
(NetARM Core *2)

- Diversity
- Gain: 2dBi
- Dipole

3.3 V or 5.0 V

PCMCIA
Power
Controller
SDRAM
BUS
32
bits

1.8V

Serial
Boot
ROM
(512 k byte)

SDRAM
16M
byte

WLAN NIC
CARD
(802.11b)
MAC/BB/Ext.
Ant.

(3.3 V/5 V
Auto Switch)

EPB BUS
8 bits

LED
Control

Flash
ROM
4M byte
DSP_Int.(To Hest)

Reset

-48 V

HPI
8 bits
K/P I/F

RJ-45

DASL
2, 048 MHz
OSC.

BUS 16bits
HPI 8bits DSP

UART(D_Ch)

- Audio Codec
- Echo Cancellation

PCM I/F
DASL_Int.

BUS 16 bits
Reset

SRAM
64K word

Reset Control

JTAG Connector
CPLD(10pin)
CPU/DSP(14pin)

20 MHz Xtal

Figure 2.22 Block Diagram of the WBS24 Base Station

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OfficeServ 7400 Service Manual

2.5.14.2 Main Functions

WBS24 performs the inteface with the system via the 4WLI board mounted ont the
OfficeServ 7400 system as shown in the figurebelow, and provides the wireless voice/data
service to the system. In addition, the voice received from the WIP-5000M, which is the
wireless terminal privately used for the voice si transmitted to the system, and the data
received rom the wireless data terminals such as notebook, PC, etc are transmitted into the
LAN metwork.

Data Path

10/100Base-T

Internet

IEEE
802.11b
WBS24

Handover

WIP-5000M

WBS24

Wireless
IP Phone
Fixed
PDA

Power Feeding

PSTN
OfficeServ 7400 4WLI

Voice Path

Note PC

WBS24: Wireless Base Station 2.4 GHz

WLI: Wireless LAN Interface card builtin system
WIP-5000M: Wireless IP Phone Portable Termina (WLAN + VoIP)

Figure 2.23 Configuration Diagram of the Keyphone Connection

The main funnctions of the WBS24 Base Stationare as follows:

y

One maximum 4WLI is mounted on the OfficeServ 7400 System.

Up to four WBS24 interfaces per 4WLI can be performed.

Up to four voice channels per WBS24 of simultaneous calls are available.

The range of the frequency arrival is 50 m indoors(There can occur the difference
according to the frequency obstruction materials in the office), and outdoors it is
200 m or more.(when there is no obstruction to the frequency within the visible
distance.)

The -48 V power is provided from the system, and the maximum extensible wired
distance is 500 m.

The calling path formation/maintenance and the Handover function supported.

Echo Cancellation, Voice CODEC(G.729, G.711) Functions supported.

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CHAPTER 2. ! .

Table 2.3

System Specification Synchronized with WBS24

Items
RF Module

System specifications

Remarks
-

- Wireless Standard: IEEE 802.11b

- Data Rate: Up to 11 Mbps
- Security Function: WEB 64/128 Bit Encryption
- Output Power: Up to 100 mW(NIC board 70 mW)
- Channel: 13 Channel(Non Overlap Channel: 3)
- Interface: PCMCIA

Ethernet

- 10/100Base-T(IEEE802.3): RJ-45 Connecter

Power Feeding

- Local Power: AC/DC Adapter(AC 220/DC 5 V, 2 A)

- Remote Power: DC/DC Converter(-48 V/+5 V, 3.3 V, 1 A)

Antenna(External)

- Frequency: 2400-2500 MHz

The

- Antenna Gain: 2.0 dB

directinonalantenna

- Beam-Width: Omni directional(Dipole)

Can be installed

- Diversity supported

according to the
installation site.

VoIP

- Audio Codec.: G.711, G.729

- Echo Cancellation: 8~16msec

- Voice Channel: 4 Channel supported
Keyphone
Interface

- Digital Interface of National Semiconductor Co., Ltd.

(DASL): RJ-45
- Voice Channel Number: 4 Channel(DASL x 2)
- Power Feeding function via the DASL Line is available.
(Remote Power supply)
- DASL Line extnesion: Up to 500 m

Others

SIO for monitor: RS-232C

WBS24 has two types of interfaces(wired/wireless). The wired Interface is classified into
the interface that is synchronized with the system and the interface that synchronized with
the LAN, and the standards of IEEE 802.11 b are applied to the wireless interface.
Wired Interface synchronized with the System
The connection is made to the 4WLI via the Digital adapter Subscriber Loops(DASL),
which is the digital transmission of 144 kbps(2B + 1D) speed. One of WBS24 supports two
lines of DASL, and one line of DASL provides two voice channels. Thus, one of WBS24
can support tatolly four voice channels simultaneously. In addition, the D channel
information for the formatin of the voice calls are transmitted/received via the DASL line,
and its transmission speed is 16 kbps. The caoling paths are formed or maintained by
transceiving the voice packets received from tehiwreless interface into the system.
Wired Inerface synchronized with LAN
This interface is the Ethernet RJ-45 Interface to which the standards of IEEE 802.3 are
applied with 10/100BASE-T, which processes the data transmission/reception such as the
internet access excluding the voice from the wireless interface.

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OfficeServ 7400 Service Manual

Wireless Interface
This interface uses the wireless frequency bandwidth of 2.400~2.4835 GHz, to which the
standards of IEEE 802.11b are applied. As for the voice, the voice packets in the wireless
sections can be transmitted/received into the VoWLAN through the terminal privately used
for voices, and as for the data, the data packets in the wireless sections are
transmitted/received via the terminals such as notebook, PDA, etc.
In addition, as for the wireless channels used in the local areas or in U.S.A. 13 channels are
used in the local area, and 11 channels are used in U.S.A. 22MHz of bandwidth of 22 MHz
per channel are occupied, and the distnace between the center frequency is 5 MHz. Thus,
for the clear channel that gives no direct and indirect intervention to the wireless channels
each other, the distance of more than 4channels should be made.
WLAN NIC (IEEE802.11b Wireless LAN Board)
In the wireless LAN RF part of WBS24, the regularly used NIC of the PCMCIA Interface
type authenticated by WECA(Wireless Ehternet Compatibility Alliance) is used.
The wireless data transmission/reception can be made at the speed of up to 11 Mbps.
The ocnfiguratin of the wireless LAN NIC board is made with three chips of Prism 3.0
made by Intesil Co. Ltd., which is the type of the board where the external antenna can be
mounted. In the voice/data packets transmitted/received in the wireless sections, several
trminals can transmits/receives the packets in the wireless sections by using CSMA/CA(the
mode where other base stations can obtain the transmission/reception opportunities only
when the transmission/reception of the base stations that performs the first occupation is
completed if the occupation is made firstly in the AIR section).
However, though-put in the wireless sections is lowered because the more the terminals are
the less the duty factor in the Air section is. That is, if on the basis of the users of the
internet connection and the e-mails in the offices where the wireless is used, about 20
persons can use the data, via the wireless LAN, with one AP that adapts the wireless
method of the IEEE802.11b Direct Sequence Spread Spread Spectrun(DSS).
The characteristics of WLAN Nic are as folows:
y

Wireless Standard: IEEE 802.11 b

Data rate: 11/5.5/2/1 Mbps

Modulation: CCK, BPSK, QPSK

Network architecture: Ad-hoc, infrastructure

Security Functions: WEB 64/128 Bit Encryption

Output Power: Up to 100 mW(NIC board 70 mW)

Channel: 13 EA Channel(Number of Non Overlap Channel: 3)

Interface: PCMCIA

Frequency: 2400-2483.5 MHz

Antenna Gain: 2.0 dBi

Beam-Width: Omni directional(Dipole)

Diversity supported

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CHAPTER 2. ! .

2.5.15

LIM board

LIM board provides the LAN interface function to support data network to an OfficeServ
7400 system and is mounted on the universal slot of an OfficeServ 7400 system.

2.5.15.1 Block Diagram

Block diagram of a LIM board is described as follows:

EEPROM
Single
Trans

10/100
PHY

Back
Board
I/F

VT6526

Octal
PHY

16 Port
10/100 Mbits
Ethernet Controller
8 bit Local Bus
Control Communication I/f

Octal
PHY

Quad
Trans
Quad
Trans
Quad
Trans
Quad
Trans

Port
1~8

Port
9 ~16

Figure 2.24 LIM Board Block Diagram

2.5.15.2 Main Features

Main features of a LIM board are described as follows:
y

Port 10/100 Mbps Ethernet switch function

Layer-2 level management Ethernet switch function interfaced with a WIM board

Layer 2 level management/unmanagement function

Layer 2 level VLAN, 802.1D, and 802.1s functions

LIM board uses Viatech VT6526 Ethernet switch chipset. LIM board is divided into
EEPROM part that saves the information required when the a system boots, PHY that
processes digita data as analog signals through 4B5B encoding/decoding, 8 bit IDE bus
that performs management switch function interfaced with WIM, and 10/100 Mbps 1 port
Ethernet to increase the transfer rate of data traffic when interfacing with WIM.
Basically, VT6526, a chipset that enables management.unmanagement, is used. VT6526 is
classified into Bootstrap mode, EEPROM mode, and Intelligent CPU mode. Bootstrap
mode is a method that sets a physical mode according to the situation whether specific pins
are set to High or Low during initial booting while the unmanagement switch operates.
EEPROM mode is a method that configures chipset by reading register setting value from
NM24C08 connected to VT6526 during initial booting. Intelligent CPU mode is used to
interface with WIM board. This mode is a method that receives VT6526 switch chipset
register setting value through 8bit IDE bus from WIM bus and configures the setting value.
LIM board supports the three modes.

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OfficeServ 7400 Service Manual

Viatech VT6108 chipset used as 10/100 Mbps Octal PHY supports SMII, S3MII, and RMII
interfaces. S3MII interface has more reliability by adding RXCLK compared with SMII.
Thus, in this design, S3MII interface is used. VT6108 supports Auto MDI/MDIX so that
straight/cross-over cable can be used. The LED displays the link and rate of each port.
When interfacing with WIM board, 8 bit IDE bus and control signal are connected to
backplane connector through buffer to perform the management function. In addition,
separate Ethernet port is configured not to occur blocking when data is exchanged with
WIM board.

Interface between LIM and WIM Boards

Since there is no CPU in a LIM board, LIM board should interface with WIM board
so that the LIM board operates as Management Ethernet Switch. Thus, in MBD
board of OfficeServ 7200, the local bus signals between LIM and WIM boards are
connected and WIM board controls LIM board.
However, since in MBD40 board of an OfficeServ 7400, bus signal connection
does not exist, LIM board operates only through unmanagement Ethernet switch.

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CHAPTER 2. ! .

2.5.16 PLIM Board

PLIM board provides the LAN interface function to support data network to an OfficeServ
7400 system and is mounted on the universal slot of an OfficeServ 7400 system.

2.5.16.1 Block Diagram

The block diagram of a PLIM board is described as follows:

S3MII x 8

S3MII x 8

MII

SWITCH
VT6526CF(VIA)
24 Port

FE_PHY
VT6108S(VIA)
8 Port

FE_PHY
VT6108S(VIA)
8 Port

FE_PHY
LXT972LC
(Intel)

MAGNETIC
H1164(PULSE)
4 Port

MAGNETIC
H1164(PULSE)
4 Port

MAGNETIC
H1164(PULSE)
4 Port

MAGNETIC
H1102
(PULSE)

16 bit Local Bus

MAGNETIC
H1164(PULSE)
4 Port

RJ-45 Module
1116317-4(AMP)
16 Port

PSE
PD64004
4 Port

PSE
PD64004
4 Port

PSE
PD64004
4 Port

PSE
PD64004
4 Port
Daughter Board
(PLIMD)

Back Board
I/F
(WIM)

Figure 2.25 PLIM Board Block Diagram

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OfficeServ 7400 Service Manual

2.5.16.2

Main Features

Main features of a PLIM board are described as follows:

y

10/100 Mbps Ethernet switch function of 16 ports

Layer-2 level management Ethernet switch function interfaced with a WIM board

Layer 2 level management/unmanagement function

Layer 2 level VLAN, 802.1D, and 802.1s functions

Power Sourcing Equipment(PSE) function for Power over Ethernet(PoE)

PLIM board uses Viatech VT6526 Ethernet switch chipset. This board is divided into
EEPROM part that saves the information required when the a system boots, PHY that
processes digita data as analog signals through 4B5B encoding/decoding, 8 bit IDE bus
that performs management switch function interfaced with WIM, and 10/100 Mbps 1 port
Ethernet to increase the transfer rate of data traffic when interfacing with WIM.
Basically, VT6526, a chipset that enables management.unmanagement, is used. VT6526 is
classified into Bootstrap mode, EEPROM mode, and Intelligent CPU mode. Bootstrap
mode is a method that sets a physical mode according to the situation whether specific pins
are set to High or Low during initial booting while the unmanagement switch operates.
EEPROM mode is a method that sets chipset configuration by reading register setting value
from NM24C08 connected to VT6526 during initial booting. Intelligent CPU mode is used
when this board interfaces with WIM board. This mode is a method that receives VT6526
switch chipset register setting value through 8bit IDE bus from WIM bus and configures
the setting value.PLIM board supports only Bootstrap mode and Intelligent CPU mode.
Viatech VT6108 chipset used as 10/100 Mbps Octal PHY supports SMII, S3MII, and RMII
interfaces. S3MII interface has more reliability by adding RXCLK compared with SMII.
Thus, in this design, S3MII interface is used. VT6108 supports Auto MDI/MDIX so that
straight/cross-over cable can be used. The LED displays the link and rate of each port.
When interfacing with WIM board, 8 bit IDE bus and control signal are connected to
backplane connector through buffer to perform the management function. In addition,
separate Ethernet port is configured not to occur blocking when data is exchanged with
WIM board.

Interface between PLIM and WIM Boards

Since there is no CPU in a PLIM board, PLIM board should interface with WIM
board so that the PLIM board operates as Management Ethernet Switch. Thus, in
MBD board of OfficeServ 7200, the local bus signals between PLIM and WIM
boards are connected and WIM board controls PLIM board.
However, since, in MBD40 board of an OfficeServ 7400, bus signal connection
does not exist, PLIM board operates only through unmanagement Ethernet
switch.

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CHAPTER 2. ! .

Actual PoE function is implemented in PLIMD circuit, daughter board, in PLIM, and
PD64004 made by PowerDsine is used for Power Sourcing Equipment(PSE) chip. PD6004
provides power of 4 ports of each device. PLIM uses 4 PD64004s and provides the PoE
function of 16 ports.
PoE is divided into PSE that provides power through twisted pair LAN cable based on the
IEEE 802.3af standard and Powered Device(PD) that receives power from PSE. Thus,
PLIM is in charge of PSE role in PoE configuration element by providing the Ethernet
switch function that supplies power.
There are two PoE implementation methods, Alternative A that supplies DC power to data
signal of a UTP cable and Alternative B that supplies DC power to spare signal of an
Ethernet cable. In PLIM, Alternative B method is used.
Power source must be required to provide the PoE function in PLIM. For this, Power
Supply Unit(PSU) in an OfficeServ 7400 system provides -54 V. However, since this power
is used in another board as well as PLIM due to system characteristics, this board is
designed to the structure that PoE only external rectifier(-48~-54 V) can be mounted to increase
power capacity.
Thus, to provide PoE power in PLIM board, a user can select PSU power or external
rectifier power and shunt is processed on the upper right corner of the board.
y

When using PSU power: Connect J1/J2/J3 P1-P2 shunt

When external rectifier power: Connect J1/J2/J3 P2-P3 shunt

J1

J2

J3

Figure 2.26 PLIM Board PoE Strap Option

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OfficeServ 7400 Service Manual

When connecting shunt in PLIM

J1, J2, and J3 pins should be connected with the same direction to operate the
power sent to PLIM.
For example, if, in terms of shunt, J1 is connected to #1 pin and #2 pin, J2 and J3
should be connected to #1 and #2 pins, respectively.

2.5.17

GPLIM Board

GPLIM board is a board that exchanges data in Intranet. GbE interface is added to PLIM
board and 10/100 BASE-T interface 12 ports and 1000 BASE-TX/SX/LX 2 ports are
provided and this board is mounted on the universal slot of an OfficeServ 7400 system.

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CHAPTER 2. ! .

2.5.17.1 Block Diagram

The block diagram of a GPLIM board is described as follows:

SDRAM
K4S561632F-TC75 x2
(4X4Mx16bit)

BOOT ROM
SST39VF040-70
(512Kx8bit)

FLASH ROM
TE28F128J3C-150
(8Mx16bit)

RJ45

FE_PHY
LXT972LC
(INTEL)

CPU
MPC852TZT100
(Freescale)

UART

DPRAM
IDT71321LA35PF
(2Kx8bit)

PLD
LC4128V75T128-10
(LATTICE)

RS232C
MAX3232ECAE
(MAXIM)

RJ45
(Port 12)

16bit Host Bus

Fast Ethernet Switching Chip
VIA VT6526CF

MCU
PD63000
(PowerDsine)
PSE
PD64004 x 3
(PowerDsine)
GLIM

SS-SMII x 6

SS-SMII x 6

FE_PHY
VT6108 (VIA)
8 Ports

FE_PHY
VT6108 (VIA)
8 Ports

MAGNETIC
H2006AN (2 Port) x 3
6 Ports

MAGNETIC
H2006AN(2 Port) x 3
6 Ports

RJ45 Module
44170-0002(MOLEX)
12 Ports

TBI
GE_PHY
HDMP-1646A
(Agilent)

TBI
GE_PHY
HDMP-1646A
(Agilent)

SX: HFBR-5710L
LX: HFCT-5710L
TX: HBCU-5710R

LC Cage and Connector

1658391-1(AMP)
2 Ports

Figure 2.27 GPLIM Board Block Diagram

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OfficeServ 7400 Service Manual

2.5.17.2

Main Features

Main features of a GPLIM board are described as follows:

y

Fast Ethernets of 12 ports + Gigabit Ethernet switch function of 2 ports

Management layer 2 level switch function

Functions such as VLAN, 802.1D, and 802.1s

Power Sourcing Equipment(PSE) function for Power over Ethernet(PoE)

CPU (MPC852TZT100A)
One MPC852 made by Motorola as the main processor. MPC852 operates with 32bit mode
through data bus.
Main features of MPC852 are descripbed as follows:
y

Embedded Power PC core

4 Kbytes data cache and 4 Kbytes instruction cache

Supports MMU

32 bit Dynamic Bus Controller

32 bit Address Lines

Memory controller(8 banks)

Fast Ethernet Controller(FEC)

2 16 bit timers and a 32 bit timer

Build-in System Integration Unit function

7 external interrupt cases and 18 internal interrupts

High performance SIO operation due to internal communication processor

On-chip 16x16 Multiply Accumulate Controller

2 Baud Rate Generator

Supports 2 SCCs that enables HDLC communication

Supports a SMC that enables asynchronous communication

Supports a SPI that enables serial communication

PCMCIA interface

DEBUG interface

Memory
y

Boot ROM: 8 bit ROM for boot. Up to 512 Kbytes is supported.

Flash Memory: Saves OS, application program, and system parameter. Up to

16 Mbytes is supported.

SDRAM: Saves operation S/W and data. Up to 64 Mbytes is supported.

DPRAM: Communicates with MP40, main control board, and saves program related
with management.

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CHAPTER 2. ! .

Switch (VT6526)
Provides the switching function of the layer 2 level and provides 10/100 Mbps of 12 ports
and 1000 Mbps Ethernet interface of 2 ports.
FE PHY (VT6108)
PHY that supports fast Ethernet uses VT6108 made by VIA Tech. Media interface is
connected to RJ-45 and connected to VT6108, a switch chip, through SS-SMII interface.
GE PHY (HDMP16A)
PHY that supports gigabit Ethernet uses HDMP1646A made by Agilent. Media interface is
connected to SFP Cage and connected to VT6108, a switch chip, through TBI interface.
PoE
GPLIM, mother board, provides the Ethernet switch function. PoE function is provided by
GLIMD board, daughter board. Parts of PSE device and MCU to control PSE should be
made by PowerDsine.
Since PSE device 1 provides 4 ports, by using 3 chips, the PoE function of total 12 ports is
provided. PD63000, MCU, is connected to a PSE device and can read and write of
PD64004 register.
There are two PoE implementation methods, Alternative A that supplies DC power to data
signal of a UTP cable and Alternative B that supplies DC power to spare signal of an
Ethernet cable. In GPLIM, Alternative A method is used.
Power source must be required to provide the PoE function in GPLIM. For this, Power
Supply Unit(PSU) in an OfficeServ 7200 system provides -54 V. However, since this power
is used in another board as well as GPLIM due to system characteristics, this board is
designed to the structure that PoE only external rectifier(-48~-54 V) can be mounted to increase
power capacity.
Thus, to provide PoE power in GPLIM board, a user can select PSU power or external
rectifier power and shunt is processed on the upper right corner of the board.
y

When using PSU power: Connect J1/J2/J3 P1-P2 shunt

When external rectifier power: Connect J1/J2/J3 P2-P3 shunt

2.5.18

GSIM Board

Gigabit Switch Interface Module(GSIM) provides gigabit LAN interfaces of the layer 2
and 3 to support data network and is mounted on the universal slot of an OfficeServ 7400
system.

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2.5.18.1 Block Diagram

The block diagram of a GSIM board is described as follows:

SDRAM
K4S561632F-TC75 x 4
(4 x 4 M x 16 bit)

BOOT ROM
SST39VF040-70
(512 K x 8 bit)

FLASH ROM
TE28F128J3C-150 x 2
(8 M x 16 bit)

DPRAM
IDT71321LA35PF
(2 K x 8 bit)

RJ45

FE_PHY
LXT972LC
(INTEL)

CPU
MPC8247VRTIEA400
(MOT)

RS232C
MAX3232ECAE
(MAXIM)

PLD
LC4128V75T128-10
(LATTICE)

RJ45

PCI 66 MHz, 32 bit

SWITCH
BCM5696(Broadcom)
SerDes x 5

SerDes x 5
CONNECTOR
1367073-1 x 5
(AMP)

CONNECTOR
1367073-1 x 5
(AMP)
GSIMD

CAGE
1489779-1 x 5
(AMP)

CAGE
1489779-1 x 5
(AMP)

SX: HFBR-5710L
LX: HFCT-5710L
TX: HBCU-5710R

Figure 2.28 GSIM Board Block Diagram

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CHAPTER 2. ! .

2.5.18.2 Main Features

Main features of a GSIM board are described as follows:
y

L3 Unicasting Protocol

L3 Multicasting Protocol

Ethernet Switch(Compatible with the 802.3 standard)

1000 BASE-SX/LX/TX port

Packet Priority Control(802.1p)

VLAN Networking(802.1q)

Diffserv

Flow Control(802.3x)

Multicasting(IGMPv1/v2, DVMRP, PIM-SM)

CPU (MPC8247)
This main processor uses MPC8247 made by Motorola. MPC8247 is host processor that
provides 32 bits via PCI bus.
Main features of MPC8247 are described as follows:
y

Dual-issue integer core architecture

CPU frequency: Up to 400 MHz

CPM frequency: Up to 200 MHz

Bus frequency: Up to 100 MHz

Separate power supply(1.5 V) and for I/O(3.3 V)

64 bit data and 32 bit address 60x bus

32 bit data and 18 bit address local bus

Memory Controller(8 banks)

PCI Bridge

Supporting 66 MHz system frequency

Memory

2-64

Boot ROM: 8 bit ROM for boot. Up to 512 Kbytes is supported.

Flash Memory: Saves OS, application program, and system parameter. Up to

32 Mbytes is supported.

SDRAM: Saves operation S/W and data. Up to 128 Mbytes is supported.

DPRAM: Communicates with MP40, main control board, and saves program related
with management.

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OfficeServ 7400 Service Manual

Switch (BCM5696)
Provides multi-layer switching function over the layer 3 level and provides 1000 Mbps
Ethernet interface of 10 ports.
Media interface is connected to SFP Cage and interfaces with Ser/Des or SGMII interface.
y

Integrated 16K MAC address table

Integrated 8K IPv4 host table and 64k LPM routing table

IP multicast routing/forwarding

Support for jumbo frame length of 9216 bytes packets

Advanced FFP

Double tagging support for service provider VLAN

Because all GSIM boards can be mounted on the universal slot of a system, PSU capacity
may not be enough due to the increase in the number of boards. Thus, this board is
designed to the structure that PoE only external rectifier(-48~-54 V) can be mounted to increase
power capacity.
Thus, to provide -54V in GSIM board, a user can select PSU power or external rectifier
power and shunt is processed on the upper right corner of the board.
y

When using PSU power: Connect J13/J4 P1-P2 shunt

When external rectifier power: Connect J13/J4 P2-P3 shunt

2.5.19 GWIM Board

Gigabit WAN Interface Module(GWIM) provides WAN interface to support data network
to a keyphone system. GWIM supports leased line for data communication between a
keyphone system and Internet, supports xDSL/cable modem interface connection, and
provides VPN, QoS, and firewall function. The leased line is classified into the port that
supports up to E1 rate and the port that supports up to T3/E3(50 Mbps). This board has a
separate DMZ port so that firewall can be easily configured. GWIM board is mounted on
the universal slot of an OfficeServ 7400 system.

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CHAPTER 2. ! .

2.5.19.1 Block Diagram

The block diagram of a GWIM board is described as follows:
RJ45

BOOT ROM
SST39VF040-70
(512 K x 8 bit)

FLASH ROM
28F128J3C-150 x 2
(8 M x 16 bit)

PLD
LC7128V75T128-10
(LATTICE)

DPRAM
IDT71321LA35PF
(2 K x 8 bit)

UART
ST16C1551CJ28
(EXAR)

GWIMS
Security
CN1120i-350BG256
(CAVIUM)

CPU
IBM 750GX, 1 GHz
(IBM)

PCI 66MHz,
64 bit
System Controller
MV64460
(Marvell)

RS232C
MAX3232ECAE
(MAXIM)

MPSC A

T3
178238-7
(AMP)

MPSC B

V.35
748481-6
(AMP)

DDR SDRAM

64 bit, 60X Bus

GWIMD
3X TBI
GE_PHY
HDMP-1646A
(Agilent)

GE_PHY
HDMP-1646A
(Agilent)

GE_PHY
HDMP-1646A
(Agilent)

CAGE
1489779-1
(AMP)

CAGE
1489779-1
(AMP)

CAGE
1489779-1
(AMP)

DIMM 200P

SX: HFBR-5710L
LX: HFCT-5710L
TX: HBCU-5710R

Figure 2.29 GWIM Board Block Diagram

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OfficeServ 7400 Service Manual

2.5.19.2

Main Features

Main features of a GWIM board are described as follows:

y

Routing between WAN and LAN

Supports multi WAN port(leased line, xDSL/cable modem interface)

VPN, QoS, Firewall

Provides various external interfaces for exchanging data with external Internet

Provides the port to connect with an internal network

Leased line interface function through V.35 and HSSI

1000 BASE-FX Ethernet port interfaced with xDSL or cable modem

1000 BASE-TX/SX/LX Ethernet function for LAN interface

UART port for setup

Various applications like firewall and VPN

CPU (IBM25PPC750GX)
Main features of IBM25PPC750GX are described as follows:
y

1 GHz operating frequency

Branch processing unit

Floating-point units

L1 cache structure

Memory management unit

Dual PLLs

L2 cache

32 bit address bus

64 bit data bus

Up to 200 MHz 60x bus frequency

Memory
y

Boot ROM: 8 bit ROM for boot. Up to 512 Kbytes is supported.

Flash Memory: Saves OS, application program, and system parameter. Up to

32 Mbytes is supported.

DDR SDRAM: Saves operation S/W and data. Up to 512 Mbytes is supported.

DPRAM: Communicates with MP40, main control board, and saves program related
with management.

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CHAPTER 2. ! .

Network Processor (MV64460)

This network processor provides the actual switching and routing and three giga interfaces.
This processor uses MV64460 made by Marvell.
y

64 bit bus with up to 200MHz CPU Interface

DRAM Interface up to DDR400

Support up to 5 banks of devices

Support two 64 bit PCI/PCI-X

Support three Gigabit Interface

Support two MPSC Interface

Support HDLC, UART Interface

Security Processor (CN1120)

This processor is mounted on GWIMS, optional daughter board of GWIM, and performs
various application functions such as firewall and VPN. This processor is connected with
MV64460 of GWIM through 64bit/66MHz PCI bus.
y

64 bit, 66MHz PCI bus Interface

Pipelined security processor supporting security protocols

(IPSEC, PPTP, L2PP, PPP, IKE)

Symmetric key encryption(DES, Triple DES, RC4)

Authentication(SHA-1, MD5)

Compression(LZS, MPPC)

Public key processing unit

Random Number Generator

Descriptor based DMA engine

Because all GWIM boards can be mounted on the universal slot of a system, PSU capacity
may not be enough due to the increase in the number of boards. Thus, this board is
designed to the structure that PoE only external rectifier(-48~-54 V) can be mounted to increase
power capacity.
Thus, to provide 54 V in GWIM board, a user can select PSU power or external rectifier
power and shunt is processed on the upper right corner of the board.

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When using PSU power: Connect J1/J2 P1-P2 shunt

When external rectifier power: Connect J1/J2 P2-P3 shunt

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OfficeServ 7400 Service Manual

2.6 Option Board (Daughter Board)

An option board can be mounted on a specific board of an OfficeServ 7400 system. Boards
that can be mounted, mounting locations in a board, and functions of each option board
provided by an OfficeServ 7400 system are described in the following table:
Table 2.4 Option Board Type
Option

Mounted

Mounting

Board

Board

Location

MODEM

MP40

Function
Converts digital signals to analog signals to send
digital signals via a Phone Line and Converts analog
signals received to digital signals.

MIS

LP40

LOC 3

Provides Ports to Connect various external devices.

- 2 Music on Hold(MOH)/ Background Music
source(BGM) Ports
- An external Paging output Port
- A auxiliary Loud bell Port
- A Common bell Port
- 2 dry Contact Ports

MFM

LP40

LOC 1, 2

12 DSP Circuits to detect DTMF and tone

SCM

LP40

LOC 1, 2

Provides Conference function.

RCM

LP40

LOC 1, 2

Provides Caller ID detection Circuits of 14 Channels

or R2 signaling Circuits of 8 Channels.

CRM

LP40

LOC 1, 2

Provides DTMF receiver R2 sender/receiver CID

RCM2

LP40

LOC 1, 2

Provides CID Sender/Receiver function.

MGI2D

MGI

Provides Internet Phone(VoIP) Ports of 8 Channels.

GWIMS

GWIM

Provides Network Security Processing function.

sender/receiver function.

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CHAPTER 2. ! .

2.6.1 Modem Board

Modem used for an OfficeServ 7400 system is a modem that enables 2 wire full duplex and
is a board that is commonly used with the modem of an iDCS 500 system. Modem board is
mounted on LOC1 of a MP40 board. When a modem board is mounted, be careful the
mounting direction.
Modem board has an OfficeServ 7400 system and V.24 interface and uses a modem chip
for central office, which enables PCM highway interface. Modem board supports V.90
protocol. An OfficeServ 7400 system controls modem board through serial communication
method and the command used is standard AT command. This board allocates SMC2 to the
serial port of controlling a modem.

2.6.1.1 Block Diagram

The block diagram of a MODEM board is described as follows:

Addr

Serial
Host Intf.

MCU

Control

Memory

DATA

PCM
Interface

DATA

Addr

Tx/Rx

COMBO

MDP

Figure 2.30 Modem Board Block Diagram

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OfficeServ 7400 Service Manual

2.6.1.2 Main Features

Main features of a MODEM board are described as follows:
PCM Interface
Channel for modem is used by allocating channel 0 to highway 0. PCM interface is
described as follows:

FOI

FOX

CLKX

HWR

MSB

D6

D5

D4

D3

D2

D1

D0

HWX

MSB

D6

D5

D4

D3

D2

D1

D0

Hi-Z

Figure 2.31 Modem Board PCM Interface

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CHAPTER 2. ! .

2.6.2 MIS Board

MIS board provides external music, paging, auxiliary loud dell, and dry contact, and is
mounted on a selected area. Frame synchronization(Sync) signals for exchanging PCM
voice data and 2 MHz signals are created from CPLD.

2.6.2.1 Block Diagram

The block diagram of a MIS board is described as follows:

Ext music1

HWX_CM

Line
I/F

Paging

Line
I/F

Ext music2

Line
I/F

CODEC1
(TP3054
TP3057)

HWR_CM
FS1
FS2

Loud bell

4 MHz
CODEC2
(TP3054
TP3057)

Line
I/F

CPLD
FOI
BCLK

Common bell

Relay

Dry contact 1

Relay

Dry contact 2

Relay

Figure 2.32 MISC Board Block Diagram

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2.6.2.2 Main Features

Main features of a MIS board are described as follows:
External Music
For external music, 2 ports of each MIS board are supported. For codec, A-LAW codec and
U-LAW codec are supported, and one of the codecs are automatically selected in CPLD.
Thus, a user does not need to set a codec in companding type.
Paging
Paging is performed for the selected group.
Auxiliary Loud Bell
Plays ring back tone externally.
Dry Contact
Dry contact is used for the control of external equipment and up to three dry contacts are
supported.

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2.6.3 MFM/SCM Board

MFM/SCM board is an option board that provides the DTMF receiver function of up to 12
channels.
The MFM/SCM board is mounted on the LP40 board.
The configuration of the MFM/SCM board highway is as shown in the figure below:

HWR_CM

4.096M
/FOI
16.384M

HWR0
HWR1
HWR2
HWR3
HWR4
HWR5
HWR6
HWR7

4M
FS
CLK

HWR0
HWR1
HWR2
HWR3
HWR4
HWR5
HWR6
HWR7

4M
FS
CLK

HWR0
HWR1
HWR2
HWR3
HWR4
HWR5
HWR6
HWR7

4M
FS
CLK

STL7065

HWX0
HWX1
HWX2
HWX3
HWX4
HWX5
HWX6
HWX7

MFR
DSPIN

STL7065

HWX0
HWX1
HWX2
HWX3
HWX4
HWX5
HWX6
HWX7

MFR
DSPIN

STL7065

HWX0
HWX1
HWX2
HWX3
HWX4
HWX5
HWX6
HWX7

MFR
DSPIN

Figure 2.33 Configuration of MFM/SCM Board Highway

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2.6.4 RCM Board

RCM board is an option board that provides R2 or CID(Caller ID) function.
When the RCM board is as R2, the board provides up to 8 channels. When the board is as
CID, the board provides up to 14 channels. The selection of R2 and CID is performed via
the selection switch in the RCM board. Note that as many as desired numbers of the
relevant resources are designated before the selection via MMC of the phone.

2.6.4.1 Block Diagram

The block diagram of a RCM board is described as follows: Here, STB9404 is ASIC that
provides R2 or CID detection function.

Address
&
Control

DATA

Engine
(STL7065)

EPLD
R2/CID
(STB9404)

R2/CID
(STB9404)
Highway

MBD Interface

Figure 2.34 Block Diagram of RCM Board

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2.6.4.2 Highway Configuration

The configuration of the RCM board highway is as shown in the figure below:

R2 Tx gain control
HWR_CM

HWR0
HWR1
HWR2
HWR3
HWR4
HWR5
HWR6
HWR7

HWR_CNF1
HWR_CNF2
HWR_CNF3
HWR_CNF4

4.096M
/FOI
16.384M

4M
FS
CLK

STL7065

HWX_CM

HWX0
HWX1
HWX2
HWX3
HWX4
HWX5
HWX6
HWX7

HWX_CNF1
HWX_CNF2
HWX_CNF3
HWX_CNF4

MFR
DSPIN

STB9404

4M
FS
CLK

HWRX

STB9404

4M
FS
CLK

HWRX

Figure 2.35 Configuration of the RCM Board Highway

Reserved Highway
HWR_CNF1.4 and HWX_CNF1.4 are reserved highways.

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2.6.5 CRM Board

The Common Resource Module(CRM) board is an option board that is responsible for
DTMF signal detection, R2 signal generation, CID signal generation and detections.
The DSP setup of the CRM board is adjusted in MMC827, and the combination of the
above functions can be used depending on the setup condition.

2.6.5.1 Block Diagram

The block diagram of a CRM board is described as follows:

P2

Data
DSP0
(TMS320LC549)

Data
2M, FSX

ADDR

CPLD
(LC4128V)

Data

2M, FSX

HWR/X5

DSP1
(TMS320LC549)

Engine
(STL7065)
HWR/X6
HWR/X0~3
4M, FOI

P2

Figure 2.36 Block Diagram of CRM Board

2.6.5.2 Main Features

Main features of a CRM board are described as follows:
Common Function
In principle, the CRM engine provides Conference(5-party 6-group) and four DTMFR channels.
Function by the DSP Setup
According to users purpose, 2-DSP in the CRM board can be set and used in MMC827.
DTMF Receiver, R2 Sender/Receiver and CID Sender/Receiver functions are provided and
each DSP supports 8-channel regardless of the function.
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2.6.6 RCM2 Board

R2 CID Module 2(RCM2) board is an optional board that detect or generate caller
identification(CID) information. The RCM2 board is installed to LOC1 or LOC2 of a LP40
board and the position to be installed is marked in the LP40 board. The installed RCM2
board can detect or generate the CID signal of 14-channel. With the switch in the RCM2
board, the operation mode(detection or generation signals) can be selected as R2 or CID.
The R2 function is not applied at present but will be supported in the near future.

2.6.6.1 Block Diagram

The block diagram of a RCM2 board is described as follows:

J1
Data
Data
DSP0
(TMS320LC549)

BUFFER

Data

CPLD
(M4A5-64/32)
DSP1
(TMS320LC549)

2M, FSX
Control
ADDR

CM_HWR/X
4M, FOI

J3

Figure 2.37 Block Diagram of RCM2 Board

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2.6.7 MGI2D Board

MGI2D board is a board for the extension of VoIP channel supporting 4-channel VoIP port
and can be installed to the MGI board.

2.6.7.1 Block Diagram

The block diagram of a MGI2D board is described as follows:

MGI

Connector

Voice/FAX
Compressing part
G.723.1/G.729
AC48204

SRAM, Word
KM616V 1002B

Figure 2.38 Block Diagram of MGI2D Board

2.6.7.2 Main Features

Lets see the function of AC48204 Codec, which is one of main parts of the MGI2D board.
CODEC AC48204
y

Up to 16 channels can be applied.(4CH/Chip 4)

Erasable Programming Logic Device(EPLD) performs the interface between CODEC

and a host.

CODEC is provided by AudioCodes company.

Every chip supports four independent voice and fax channels.

H.323 voice coder, which can be configured by users, is supported.

Soft, Field-upgradeable Functionality

Robust Bad Frame Interpolation(RBFI)

G.165/G.168 Adaptive Echo Canceller

The bit rate of Toll Quality Voice can decrease up to average 3.2 kbps by using Silence
Compression.

Detection/generation of TIA 464A DTMF

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MF detection/generation

Parallel host processor interface

Tone signal that hosts can program

Configurable PCM interface: PCM highway of parallel interface

On-chip PCM highway interface(Host configuration time slot assignment and

selectable G.711 mu-law/A-law PCM interface)

Gain control

2.6.8 GWIMS Board

GWIMS board, an optional daughter board of the GWIM board, performs a variety of
application functions such as Firewall and VPN. The board is connected with MV64460 of
the GWIM board via 64 bit/66 MHz PCI bus.
Security Processor (CN1120)
y

64 bit, 66 MHz PCI bus Interface

Pipelined security processor supporting security protocols

(IPSEC, PPTP, L2PP, PPP, IKE)

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Symmetric key encryption(DES, Triple DES, RC4)

Authentication(SHA-1, MD5)

Compression(LZS, MPPC)

Public Key processing unit

Random Number Generator

Descriptor based DMA engine

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OfficeServ 7400 Service Manual

2.7 Terminals
This paragraph describes the block fiagram and the main features for each terminal
connected to the OfficeServ 7400 system.

2.7.1 DPIM
Door Phone Interface Module(DPIM) is a conversion relay unit that converts an analog signal of
a door phone into a digital signal or a digital signal into an analog signal to enable the present
analog door phone and the OfficeServ 7400 system to call each other.
The connectable distance between DPIM and an OfficeServ 7400 system is the maximum
400 m, and the call distance between DPIM and a door phone is the maximum 600 m.

2.7.1.1 Block Diagram of DPIM

The block diagram of a DPIM board is described as follows: DPIM uses Door Box, as it is,
that Samsungs DCS-816 Analog Keyphone system uses and consists of speaker,
microphone, and the transfer part to send/receive analog signals.

Line Interface

DASL(TP3406)

High Feature
Codec

MCU
(H8/323)

Door
Interface

Figure 2.39 Block Diagram of DPIM

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CHAPTER 2. ! .

2.7.1.2 Block Diagram of a Door Phone

The block diagram of a door phone for the OfficeServ 7400 system is as shown in the
figure below:

DPIM Interface

SPK Interface

MIC Interface

Figure 2.40 Block Diagram of Door Phone

2.7.1.3 Main Features

Main features of a DPIM board are described as follows:
Micro Controller Unit (MCU)
The signal transferred to the DPIM PCM digital transfer part is converted into analog
signals in High Feature CODEC(HFC). At this time, TL084 with excellent audio property
is used as an amplifier to amplify the output signals and the analog signals transferred from
a door box. the digital part. 100 k is used to make the input resistance of the TL084 big.
Matching Part uses T5692 like the transformer of a door box. The resistance value with the
best transfer property for two transformer is 1 k(R14). In addition, 100 k(R9, R10) is
used as a balance resistance to reduce the speaker signal entering to the microphone(pin 19)
of HFC since send/receive signals of the transformer are mixed and used together.
Door Lock Control Part
DPIM can install a locker that opens a door to visiters. In general, the locker uses AC
100 V via a relay switch. At this time, the relay control port of MCU is P10(pin 48), and
this port is a key scan port in a digital phone. The diode(1N4148, D6) of the relay control
transistor(MMBT 2222, Q1) Tx is used for the removal of counter electro-motive force and
the CAP and the resistance in both ends of the relay switch are used for the prevention of
spark that occurs in a relay contact point.

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OfficeServ 7400 Service Manual

Switch Detection Part

Visitors can call an inside person by pressing the switch in a door box. DPIM detects the
press of the switch and transfers the information via MCU port 46(pin 15). The MCU sends
the data to the D-channel of PCM transfer chip(TP 3406, U5).
The system received this data send the signal to the previsously specified port to make a call.
Since this switch detection signal is transferred via the center tap of the matching
transformer(T5692), the signal can be configured with only two lines and is not damaged
even if DC +5 V is applied to the transformer.
+12V Generation Part
DPIM uses Step UP DC converter(LT1109, U11) to generate +12 V with the input power of
+5 V by using simple peripheral circuit. LT1109-12 receives the input of +5 V and outputs
+12 V 60 mA.
33 uH(L2) inductor is used for the generation of switching, and 47 uF/35 V(C7) capacitor
is used for switching load. In addition, 33 uH(L1) inductor of Tx is used for the decrease of
switching ripple noise. When +12 V line connected to a door box is short, the poly switch
in +12 V Tx prevents overcurrent from running.
Pin Connector
y

Door Lock
Modular Pin(6P6C) 1, 6: Dry Contact(relay), Normal Open.

1 2 3 4 5 6

1 2 3 4

Figure 2.41 Connection of DPIM Pins

Door Phone
Modular Pin(6P4C) 1: L1(L1 and L2 lines are restricted to +5 V for the detection of switch
contact.)
Pin 2: L2
Pin 3: P + (+12 V)
Pin 4: P - (GND)

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OfficeServ 7400 Service Manual

CHAPTER 3. Troubleshooting

This chapter decribes various failures generated from OfficeServ 7400 and the
troubleshooting procedures.

3.1 Sustem Operation Diagnoses

This section describes problems in the general operation of the OfficeServ 7400 system and
the troubleshooting procedures.

3.1.1 Checking Basic Cabinet Power

The procedure for checking if the power of Power Supply Unit(PSU) of basic cabinet is
provided properly is as follows:
Turn on the power of
the basic cabinet

Is the RUN LED of the

MP40 card turned on?

No

Yes

Does the RUN LED of the

MP40 blink?

AC/DC LEDs are turned

on on the rear side of the
basic cabinet?
Yes

No

Replace the MP40 card

No

- Check the AC cable

- Check the fuse of PSU
- Replace the PSU if not
operated even after
throubleshooting

Yes

Does Digital Phone

operate proplery?

No

- Check if the power in the both ends

of DLI Tip/Ring is 54 V
- Replace the PSU if it is 0 V

Yes

The power of the basic

cabinet is normal.

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CHAPTER 3. ! .

3.1.2 Checking Expansion Cabinet Power

The procedure for checking if the power of Power Supply Unit(PSU) of expansion cabinet
is provided properly is as follows:
Turn on the power of
the basic cabinet

Is the RUN LED

of the LP40 card
turned on?

No

Yes

Yes

Does the RUN LED of

LP40 blink?

AC/DC LEDs are turned on on

the rear side of the basic
cabinet?

No

Replace the MP40 card

No

- Check the AC cable

- Check the fuse of PSU
- Replace the PSU if not
operated even after
throubleshooting

Yes

Is the Digital Phone

properly operated?

No

- Check if the voltage at the ends

of DLI Tip/Ring is 54 V
- If it is 0 V, replace PSU

Yes

The power of the expansion

cabinet is normal

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OfficeServ 7400 Service Manual

3.1.3 Abnormal Battery Backup (1)

When a battery backup problem occurs on the OfficeServ 7400 system, the troubleshooting
is as follows:
Analyze system battery

Are AC and DC LED turned on?

No

Check if the AC power is applied

Yes

Check the voltage of the battery

- If turning ON/OFF the battery
swithch or AC or connecting the
battery before power supply, the
system is not operated
- It is required to recharge the
battery by providing the AC
power

Is the measured value 53 V

or more?

Yes

- Check the connection connector

of the battery
- Check the connection cable for
the battery

No

Yes

Is the measured value 47 V

or less?
No

The battery backup is normal

Abnormal Battery Backup

If a failure still remains for the battery backup in spite of the above procedure,
refer to 3.1.4 Abnomal Battery Backup(2) on the next page.

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CHAPTER 3. ! .

3.1.4 Abnormal Battery Backup (2)

If a failure still remains for the battery backup even after performing the procedure of
3.1.3 Abnormal Battery Backup(1) above, check the following procedure:
Check battery power when
battery is disconnected

Connect battery and turn the

battery on.

Is the LED of the MP40 card

turned on?
Yes

No

- Check if PSU connector is

connected when system power cord
is pulled off
- If 54 V is not generated, check
battery connection
- If battery connection is proper,
check fuse of PSU

End

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3.1.5 MP40 Board Operation Check

Check if MP40 board that controls the operation of an OfficeServ 7400 system operates
properly.
Turn the power switch of the
basic cabinet on.

Does RUN LED of MP40

board turn green for about 40
seconds?(during booting)

No

- Check the insertion status of smart

media board.
- Replace smart media board.
- Check if an option board is properly
mounted on MP40 board.

Yes

After RUN LED and SM

LED blinks fast, does SM
turn green and RUN blink
again?

No

Check the program versino of smart

media board.

Yes

Check if RUN LED properly blinks

after download.

Check if a signal is loaded to

HWX(PIN11 of U1 and U2)

End

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CHAPTER 3. ! .

3.1.6 LP40 Board Operation Check

Check if LP40 board that controls the operation of the expanded cabinet of an OfficeServ
7400 system operates properly.

After LP40 board is initialized after

the power is turned on, wait until
MP40 board is initialized completely.

Does the green RUN LED

of LP40 board blink?

No

- Check the HDLC cable connection

status(Expanded cabinet)
- Replace the LP40 board.

Yes

End

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OfficeServ 7400 Service Manual

3.1.7 Power is not Supplied to xSLI or xDLI Board Ports

When power is not supplied to 16SLI, 8SLI, 8DLI, or 8HYB board port, follow the
procedure below:

Start

Do all ports of the entire

system operate properly?

No

- Replace MP40 board.

- Replace LP40 board.

Yes

Number of ports of each board:

8SLI(8), 16SLI(16), 8DLI(8), 16DLI
(16), 8HYB(16)

Check if the number of ports is proper.

- 1st power supply: 80 ports can be used.

Is power supplied to all ports?

No

- Refer to 3.1.1/2 Power Check.

- Replace MP40 and LP40 boards.
- Replace mother board.

No

If the number of ports exceed the

power capacity, decrease the number
of ports.

Yes

Is the number of ports proper

to the power capacity?
Yes

Is card ID read through MMC?

No

- Replace the board.

- Replace LP40 board(In case of
basic cabinet, replace MP40 board.)
- Replace mother board.

Yes

End

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CHAPTER 3. ! .

3.1.8 Board Failure

When a board mounted on each slot of an OfficeServ 7400 system does not operate, follow
the procedure below:
Start

Do all boards of the

system operate?

No

Replace MP40 board.

Yes

Do all boards of expanded

cabinet operate?

No

- Replace LP40 board.

- Replace mother board.

Yes

Do all boards of the group

of slot 0~5 operate?

No

Replace mother board.

Yes

End

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OfficeServ 7400 Service Manual

3.1.9 Call is not Connected (Related with Highway)

If a call is not connected due to highway when a phone is connected to an OfficeServ 7400
system, follow the procedure below:

Start

Is a link cable connected to

the expanded cabinet?

No
Connect a link cable.

Yes

Is there a board that

enables a call?

No

Perform scoping the highway of line

board, mother board, MP40 board,
and LP40 boad.

Yes

If a call cannot be established in a

specific group of slot1~11, check and
replace the board of a slot for 16
ports.

After replacing the board,

does the system operate
properly?

If the number of channels of each

slot is 64 in basic rack, # 0~31
highway are provided indirectly
through LP40 and # 32~63
highway are provided directly
through MP40.

No

Replace MP40 board.

Yes

End

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CHAPTER 3. ! .

3.1.10

Call is not Connected (Related with Switching Clock)

If a call is not connected due to switching clock when a phone is connected to an

OfficeServ 7400 system, follow the procedure below:

Start

Is the power of digital/analog

phone turned on?

No

- Refer to 3.1.1/2 Power Check.

- Check ADDR/DATA bus of MP40 or
LP40 board or mother board.

Yes

Is a link cable connected to the

expanded cabinet?

No

Connect a link cable.

Yes

Is there a board that

enables a call?

No

Perform scoping the highway of line

board, mother board, MP40 board,
and LP40 boad.

Yes

If a call cannot be established

in a specific group of slot1~11,
check and replace the board of
a slot for 16 ports.

After replacing the board,

does the system operate
properly?

No

Replace MP40 board.

Yes

End

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OfficeServ 7400 Service Manual

3.1.11 Music on Hold/Background Music Source Failure

When the music on hold/background music source of an OfficeServ 7400 system does not
operate, follow the procedure below:

Start

Is the call established properly?

(Check the time switch operation
status)

No

Repair the time switch.

Yes

Does the selected source

operate properly through
MMC 309?

No

Check MMC setting.

Yes

Are signals properly

generated from
a pin of U7?

No

Replace U7.

Yes

Is the scoping to check

if signals are generated fro pin1
of U9 normal?

No

Replace U9.

Yes

Replace MP40 board.

End

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CHAPTER 3. ! .

3.1.12

External Paging is not Available

When external paging cannot be performed, follow the procedure below:

Start

Is the call
established properly?
(Check the time switch
operation status)

No

Repair the time switch.

Yes

Does the selected

source operate
properly through
MMC 309?

No

Check MMC setting.

Yes

Are corresponding
signals(common)
generated from LP40
normal?

No

Replace mother board.

Yes

End

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OfficeServ 7400 Service Manual

3.2 Mother Board

This subsection describes the troubleshooting procedure when failures occur on the mother
board.

3.2.1 Mother Board Failure

When an error occurs in mother board, follow the procedure below:
Mount the same card to another
slot and operate the board.

Does the card

operate in the slot?

No

Mount the normal card to the

corresponding slot.

Yes
No

Does the card operate

in the slot?
Yes
Go to the corresponding card
failure item.

Do Slot1~11 of each
group operate?

No

Yes

Clock signals such as

4.096 MHz, CLKX, and
FSX normal?

No

- check if RST, EN, INTS, and

INTD signals are normal.
- Check the connection status of
30 pin connector.

Check 16 MHz and Foi signals

sent from MP40 card.

Yes

Check address, DATA BUS, RD, WR.

If address and DATA BUS are

abnormal, check which section is
abnormal to MP40 card.

End

Check 4.096 MHz, CLKX, and

FSX signals generated in
U15(STL7065) of LP40 card.

Are clock signals normal?

No

Check 4.096 MHz, CLKX, and

FSX signals generated in
U15(STL7065) of LP40 card.

Yes
- Check signals in both ends of
buffer(U35) of LP40 board.
- If buffer input is abnormal, check
from U8 to buffer.
- If buffer output is abnormal,
replace the buffer.

End

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CHAPTER 3. ! .

3.2.2 -54 V is not Supplied to Mother Board

When -54 V is not supplied to mother board, follow the procedure below:
Check if the corresponding card is
detected through MMC 859
hardware version identification

Is the card detected?

No

Check the address, DATA BUS, EN,

and WR signals of the card.

Yes
Check if the number of card ports
mounted is over the number set
according to the power standard.
Number of ports that supplies power:
Up to 80 ports

Is the number of ports proper?

No

Change the number of ports.

Yes

Is the TIP-Ring voltage

of DLI or SLI generated
below 39 V?

No

Replace PSU.

Yes

If POWER CONTROL of
the corresponding slot is
ON in DLI output?

No

Replace DLI.

Yes

Is the DRAIN-SOURCE
voltage of FET below 1 V?

No

- Replace 2 transistors that drives FET

- Replace FET.

Yes
- Replace the serial diod of -54 V.
- Replace 82 V VARISTOR.

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OfficeServ 7400 Service Manual

3.2.3 DTMF Receiver of Mother Board Does not Operate

When the DTMF receiver of LP40 board does not operate, follow the procedure below:
Start

Is the dial tone normal in SLI?

No

Check the error generated when a nation is

selected.(Check the nation setting through
nation version setting program of MMC 812)
(Check the nation setting through nation version
setting program of MMC 812)

Yes

Are 16 MHz and Foi

signals properly generated
from LP40 board?

No

Generate 16 MHz and Foi signals from LP40

board.

Yes

- Check if signals are generated from the

highway in pin110 of U15(STL7065)
- Replace U15(STL7065).

End

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CHAPTER 3. ! .

3.3 Control Board

This subsection describes the troubleshooting procedure when failures occur on the MP40
board and LP40 board.

3.3.1 MP40 Board

This subsection describes the troubleshooting procedure when failures occur on the MP40
board.

3.3.1.1 Processor Operation Failure

When an error occurs in MP40 board, follow the procedure below:
Start

At least, are one of LEDs of

MP40 board turned on?

No

- Refer to 3.1.1 Power check

- Check MP40 board mounting status

Yes

Is CPU clock normal?

No

- Y5 output is abnormal: Replace Y5.

- Y5 output is normal, but U26 output is
abnormal: Replace U26.

No

- If STEADY LOW, replace U17(DS1706).

- If VIBRATION, check CPU ADDR/DATA
bus.

Yes

Is reset signal high?

Yes

Is DTACK signal ACTIVE(LOW)?

No

By tracing DTACK source, check the

operation like clock of the source in
HIGH status
- DTACK of U10(7065)

Yes

Is initial booting performed?

No

- Check the file name of smart media board

- Perform scoping to check if ADDR/DATA
bus of MP40 board is normal.
- Replace flash memory(U11, U36)

Yes

Does the system operate

normally after booting?

No

- Perform scoping to check if ADDR/DATA

bus of MP40 board is normal.
- Replace flash memory(U11, U36)

Yes
End

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OfficeServ 7400 Service Manual

3.3.1.2 Internal Music on Hold (MOH)/Background Music Source (BGM)

Check if the setting values are properly selected through MMC. When an error occurs in
internal music on hold or background music source, follow the procedure below. At the
time, the music on hold is set to an internal music on hold.

Start

Check if the setting values

are properly selected
through MMC(309).

No

Check the MMC setting.

Yes

Is a call between ports normal?

No

Repair the port failure.

Yes

Are signals properly

generated among U7

No

Replace U7.

Yes

Is SCOPING to check if
signals are generate normal
in PIN1 of U9?

No

Replace U9.

Yes

Is SCOPING to check if
signals are generate normal
in PIN1 of U6?

No

Replace U6.

Yes

End

SAMSUNG Electronics Co., Ltd.

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CHAPTER 3. ! .

3.3.1.3 PLL Operation Failure

When an error occurs in Phase Locking Loop(PLL), follow the procedure below:
Start

Is reference clock selection

MMC selected?

No

Set s reference clock.

Yes

Is reference clock normal?

No

Check reference clocks of TEPRI

board, mother board, LP40 board,
and MP40.
- MP40: PIN 161, 164, 166 of U8.

Yes

Is the 4th~6th bit of the

corresponding address 0X300000098
000 through MMC(900)?

No

Replace MP40.

Yes

Is the 0~1st bit of the

corresponding address 0X300000098
01 through MMC(990)?

No

Replace MP40.

Yes

Is DUTY of FOI signal regular?

No

- An error occurs in TERRI if

reference clock is unstable.
- Replace MP40 if reference clock is
unstable.

Yes

End

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OfficeServ 7400 Service Manual

3.3.1.4 SIO Port Operation Failure

When an error occurs in the system UART port of the basic cabinet while MP40 board is
used, follow the procedure below:
Start

Are signals generated from

SMC1 TX pin of MP40 CPU?

No

- Check MMC.
- Check software version.
- Check if other functions are normal.
- Replace the CPU(U29).

Yes

Is TXD of U64(MAX3232)
generated?

No

Replace U64.

Yes

Check the connection of RJ-45.

End

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CHAPTER 3. ! .

3.3.1.5 Memory/Time Data Backup Failure

When an error occurs when the memory of an OfficeServ 7400 system and time data are
backed up, follow the procedure below:
Start

Are the programming memory

and time data identical with the
original value?

Yes

End

No

Is VDD(PIN24) of clock chip

maintained over 2 V?

Yes
End

No

Are S2(SWITCH)
and D8 properly
connected?

Yes
End

No

Replace the corresponding part.

End

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OfficeServ 7400 Service Manual

3.3.1.6 Smart Media Board Failure

When an error occurs in smart media board, follow the procedure below:

Start

Does SM LED of MP40 board

blink fast during booting?

No

- Insert smart media board to the slot.

- Replace smart media board.

No

- Check the program version.

- Check MP40 CPLD version.
- Check MP40 ADDR/DATA BUS.

No

Check if P13, pin of CPLD(U63), and

P5 of smart media connector are
LOW.

Yes

Check if P15, pin of CPLD, and pin4

of smart media connector are HIGH.

Yes

Does MP40 LED blink after

SM LED of MP40 board
blink fast?
Yes

Release the Write Protection function

of smart media board.

Is Write performed in smart

media board?
Yes

Set the Write Protection function of

smart media board.

Is Write performed in smart

media board?
No

End

SAMSUNG Electronics Co., Ltd.

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CHAPTER 3. ! .

3.3.2 LP40 Board

This subsection describes the troubleshooting procedure when failures occur on the LP40
board.

3.3.2.1 CPU Operation Failure

When an error occurs in LP40 board, follow the procedure below:
Start

At least, are one of LEDs

of LP40 board turned on?

No

- Check the power status.

- Check LP40 board mounting status.

Yes

Is CPU clock normal?

No

- Y1 output is abnormal: Replace Y1

- If Y1 output is normal, check clock in
R82.
- If Y1 output is abnormal, replace
LP40 board.

Yes

Is reset signal high?

No

- If STEADY LOW, replace

U18(DS1706) or check
U14(LC4256) JEDED file.
- If VIBRATION, check CPU
ADDR/DATA bus

Yes

Is DTACK signal
ACTIVE(LOW)?

No

Yes

Is initial booting performed?

No

By tracing DTACK source, check the

operation like clock of the source in
HIGH status
- Option board DTACK
- Mother board DTACK
- Time switch DTACK

- Perform scoping to check if

ADDR/DATA bus of LP40 board is
normal.
- Replace flash memory(U25).

Yes

Does the system operate

normally after booting?

No

- Check HDLC cable connection

(Expanded cabinet)
- U20 pin 89(16 Mhz), 91(8 Khz)
- If clock is abnomal, replace MP40

Yes

End

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OfficeServ 7400 Service Manual

3.3.2.2 HDLC Communication Failure

If only High level Data Link Control(HDLC) of a specific LP40 board does not operate,
follow the procedure below:
Start

Does RUN LED blink?

No

- Insert smart media board to the slot.

- Replace smart media board.

No

- Check the program version.

- Check MP40 CPLD version.
- Check MP40 ADDR/DATA BUS.

Yes

Does RX LED blink?

Yes

Does TX LED blink?

No

Yes

Check the software

version.

Does the system properly

operate?

Yes

End

No

Perform HDLC TX scoping

in MP40 board.
Use MP40: Scoping of CPU HDLC
related signal

Does the system properly

operate?
Is wave normal?

No

Yes

Check the software

version.

No

Repair MP40 board.

Yes

- U28(3486) PIN3 SCOPING

- U288(3486) PIN13 SCOPING

Trace the wave from MP40 board.

Is wave normal?

No

Repair MP40 board.

Yes
End
End

SAMSUNG Electronics Co., Ltd.

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CHAPTER 3. ! .

3.4 Universal Board

This section describes the problems that occur on various universal boards and
troubleshooting procedures.

3.4.1 8TRK Board

This subsection describes troubleshooting procedures when failures occur on 8TRK board.

3.4.1.1 8TRK Board is not Detected

When 8TRK is not detected, the troubleshooting sequence is as follows:
Check if a group does not
operate in slot groups.

Is a group normal?

Yes

Repair the MP40 board

No

Are all slots abnormal?

Yes

- Check with a normal board again

- Repair MP40 board

Yes

Check the signals of DATA BUS and

CARD ENABLE of the board

No

Does a failure
occurs only when the 8TRK
board is mounted?
No

Repair the MP40 board

End

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OfficeServ 7400 Service Manual

3.4.1.2 An External Call is not be Originated

When a call is not originated as the C.O. line is not detected, the troubleshooting sequence
is as follows:
Check if the absolute power
between TIP-RINGs exceeds
30 V in the hook-on status

Is the power normal?

Measure the power after

disconnecting the C.O line
from the board

No

Yes

When C.O. line is occupied, check if

RELAY operates by its sound.

Yes

Is the Power
between TIP-RINGs 30 V
or more?
No

Is the operation of
RELAY is normal?

No

Request to repaire
the C.O line

Check RELAY control signal

Yes
Is the RELAY
control signal
normal

Chek if the HOS signal is HIGH.

No

Yes
Replace TMC
(LINE1~4: U5, LINE 5~8: U6)

Replace the RELAY signal

Is the HOS signal HIGH?

No

Yes

Replace TMC
(LINE1~4: U5, LINE 5~8: U6)

Replace C.O. line loop

End

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CHAPTER 3. ! .

3.4.1.3 Ring is not Terminated

When C.O. line ring is not terminated, the troubleshooting sequence is as follows:
Check if the power provided to
TIP-RING is 40 VRMS or more.

Is the power provided to

ring 40 VRMS or more?

No

Request to repair the C.O. line

Yes

Is the HOS output HIGH?

No

Check if the ring path is composed of

two ZENER diods(R and C).

Yes
Replace LOOP HYBRID and
PHOTO-COUPLER

Replace TMC
(LINE1~4: U5, LINE 5~8: U6)

End

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OfficeServ 7400 Service Manual

3.4.1.4 An External Call is not be Connected

When an external call is not connected, the troubleshooting sequence is as follows:

Start

Is TX abnormal
while RX is normal?

Yes

Check Pin3 signal of the related

CODEC.

No
Is TX signal generated?

Yes

Check abnormal part by tracking

up to C.O connector

No
Check signals of HWR(PIN6 of CODEC)
and BCLKX(PIN9 and 10 of CODEC)

Check if TX is normal
while RX is abnormal?

Yes

Check PIN 14 of the related

CODEC

No
Is the RX signal supplied?

Yes

Check signals of HWX(PIN11 of

CODEC) and BCLKX(PIN9, 10 of
CODEC)

No
Check abnormal part by tracking
up to C.O connector

Check if both TX and

RX are abnormal?

Yes

Check TX and RX signals on PIN3

and PIN14 of the related CODEC

No
End

Is PIN3(TX) abnormal?

Yes

Check PIN9/10(BCLKX),
PIN5/12(FS), PIN6(HWR), and
PIN11(HWX) of CODEC

No

Yes
Is PIN14(RX) abnormal?

Check PIN9/10(BCLKX),
PIN5/12(FS), PIN6(HWR) and
PIN11(HWX) of CODEC

No

End

SAMSUNG Electronics Co., Ltd.

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CHAPTER 3. ! .

3.4.2 TEPRI Board

This subsection describes troubleshooting procedures when failures occur on TEPRI board.

3.4.2.1 TEPRI Board is not Detected

When the TEPRI board is not detected, the troubleshooting sequence is as follows:
Check if a specific group in basic
cabinet slots and expansion cabinet
slots does not operate

Is a group abnormal?

Yes

Repair the MP40/LP40 board

No

Check if all boards do not operate

Are all boards abnormal?

Yes

- Check with a normal board again

- Repair MP40 board

Yes

Check the signals of DATA BUS and

CARD ENABLE of the board

No

Does the failure occurs

only when the TEPRI board
is mounted?
No

End

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OfficeServ 7400 Service Manual

3.4.2.2 Processor Operation is Abnormal

When the processor of the TEPRI board does not properly operated, the troubleshooting
sequence is as follows:
Start

Are one or more LEDs

turned on?

No

- Refer to 3.1.1 Power Checking

- Check the connection status of the
30 PIN connector

Yes

Is the CPU clock normal?

No

Y1 output is abnormal: Reaplce Y1

Yes

No
Is the RESET signal HIGH?

- Replace with U35(DS1706) or

U39(LVT125) for STEADY LOW
- Check CPU ADDR/DATA BUS for
VIBRATION

Yes

Is the DTACK signal

ACTIVE(LOW) ?

No

If PIN12 of DPRAM (U16) is STEADY

LOW, replace U16 or upgrade to final
program

No

Repair the BUS

(SHORT, OPEN and PORT FAIL)

Yes

Check ADDRESS/DATA BUS

Is the BUS normal?

Yes

No
Is the Y4 signal normal?

Replace the Y4 signal

Yes

End

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CHAPTER 3. ! .

3.4.2.3 LED for Line Indication is Abnormal

On the TEPRI board, when the LED for line indication is abnormal, the troubleshooting
sequence is as follows:
Start

Is the LOS LED turned on?

Yes

Check signals between PIN 2/4 of

U36(FALC). If signal is not
detected, track and repair signal.

No

Is the SYN LED is turned on?

Yes

Turn off CRC from PRI option

No

Is the SYN LED on?

No

Yes

- Select clock source through

MMC 826, the program for
selecting it based on system
clock synchronization
- Check signal distortion after
identifying signals between PIN
2/4 of U36(FALC)

End

Yes
Is the AIS LED turned on?
No

- Select clock source through

MMC 826, the program for
selecting it based on system
clock synchronization
- Check signal distortion after
identifying signals between PIN
2/4 of U36(FALC)

End

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OfficeServ 7400 Service Manual

3.4.2.4 IPC LED is Abnormal

If the IPC LED of the TEPRI board blinks, it means that the TEPRI board is normal.
When the IPC LED does not blinks and turns off, the troubleshooting sequence is as
follows:

Start

Is the processor in operaton?

No

Refer to Processor Operation is

Abnormal

Yes

If another board is
mounted on same slot, processor
operates normally?

No

Repair the mother board

Yes

Is the ENIPCR signal

normal?(U24 PIN44)

No

- Check ADDRESS SA15~SA19 signal

- Check if U9 PIN27(ENPERI) is active

Yes
Are ADDRESS and
ENABLE signals active?

No

Yes
- Repair signal
Replace U9

- Check PGM version

- Replace U2

End

Are the ADDRESS,

DATA BUS, RD and
WR signals normal?

No

Replace U9

Yes

Replace U24

End

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CHAPTER 3. ! .

3.4.2.5 A Call is not Connected or There is Noise during a Call

When a call is not connected or there is noise during a call while the LED status of the
TEPRI board is normal, the troubleshooting sequence is as follows:
Start

Is 4MHz/FSX normal?

No

Repair the MP40/LP40 board

Yes

If another board is
mounted, is a call
connected?

No

Repair the MP40/LP40 board

Yes

Is the signal at each part

of highway of board is
normal?

No

Modify the abnormal part

Yes

Is 8MHz signal regenerated

from 4 MHz normal?

No

Replace DELAY LINE(U10)

Yes

End

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OfficeServ 7400 Service Manual

3.4.3 TEPRI2 Board

This subsection describes troubleshooting procedures when failures occur on TEPRI2
board2.

3.4.3.1 TEPRI2 Board is not Detected

When the TEPRI2 board is not detected, the troubleshooting sequence is as follows:
Check if a specific group in basic
cabinet slots of 1, 2, 5~11
does not operate

Is a group abnormal?

Yes

Repair the MP40/LP40 board

No

Check if all boards do not operate

Are all boards abnormal?

Yes

- Check with a normal board again

- Repair MP40 board

Yes

Check the signals of DATA BUS

(U16), CARD ENABLE(U16) and
ADDRESS(U17) on the board

No

Does the failure occurs

only when the TEPRI2 board
is mounted?
No

Repair theTEPRI2 board

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CHAPTER 3. ! .

3.4.3.2 Processor Operation is Abnormal

When the processor of the TEPRI2 board does not properly operated, the troubleshooting
sequence is as follows:
Start

Are one or more LEDs

turned on?

No

- Refer to 3.1.1 Power Checking

- Check the connection status of the

Yes

Is the CPU clock normal

No

Y2 output is abnormal: Reaplce Y2

Yes

Is the RESET signal

HIGH?

No

- Replace with U35(DS1706) or

U5(CPLD) for STEADY LOW
- Check CPU ADDR/DATA BUS for
VIBRATION

Yes

Is the DTACK signal

ACTIVE(LOW) ?

No

If PIN60 of DPRAM (U14) is STEADY

LOW, replace U14 or upgrade to final
program

Yes

Check ADDRESS/DATA BUS

Is the BUS normal?

No

Repair the BUS

(SHORT, OPEN, PORT FAIL)

Yes

No
Is the Y2 signal normal?

Replace the Y2 signal

Yes

End

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OfficeServ 7400 Service Manual

3.4.3.3 LED for Line Indication is Abnormal

On the TEPRI2 board, when the LED for line indication is abnormal, the troubleshooting
sequence is as follows:

Start

Is the LOS LED turned on?

Yes

Check signals between PIN 2/3 of

U6 and U7(FALC56). If signal is
not detected, track and repair
signal

No

Is the SYN LED

is turned on?

Yes

Turn off CRC from PRI option.

No
Is the SYN LED on?

No

Yes

- Select clock source through

MMC 826, the program for
selecting it based on system
clock synchronization
- Check signal distortion after
identifying signals between PIN
2/4 of U36(FALC)

End

Yes
Is the AIS LED turned on?
No

- Select clock source through

MMC 826, the program for
selecting it based on system
clock synchronization
- Check signal distortion after
identifying signals between PIN
2/4 of U6, U7(FALC56)

End

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CHAPTER 3. ! .

3.4.3.4 RUN LED is Abnormal

If the IPC LED of the TEPRI2 board blinks, it means that the TEPRI board is normal.
When the IPC LED does not blinks and turns off, the troubleshooting sequence is as
follows:

Start

Is the processor
in operaton?

No

Refer to Processor Operation is

Abnormal

Yes

If another board is
mounted on same slot, processor
operates normally?

No

Repair the mother board

Yes

Is the ENIPCR signal

normal?(U14 PIN55)

No

- Check the U5 J3 signal

- U12 C3(IPC_DPRAM_CS), Check if
R119 is ACTIVE

Yes
Are ENIPCR and
ENABLE signals active?

No

Yes
- Repair signal
Replace U5

- Check PGM version

- Replace U12

End

Are the ADDRESS,

DATA BUS, RD and WR signals
normal?

No

Replace U5

Yes

Replace U14

End

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OfficeServ 7400 Service Manual

3.4.3.5 A Call is not Connected or There is Noise during a Call

When a call is not connected or there is noise during a call while the LED status of the
TEPRI2 board is normal, the troubleshooting sequence is as follows:

Start

Is 4 MHz/FSX normal?

No

Repair the MP40 or LP40 board

Yes

If another board is
mounted, is a call
connected?

No

Repair the MP40 or LP40 board

Yes

Is the signal at
each part of highway of
board is normal?

No

Modify the abnormal part

Yes

Are the signals

entered into FALC(U6 and
U7) normal?
Yes

No

Are the signals

entered into transformer
(T2 and T3) normal?

No

Replace the transformer

(T2, T3)

Yes

End

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CHAPTER 3. ! .

3.4.3.6 Operation of LAN Port is Abnormal

When a failure occurs to the LAN port of the TEPRI2 board, the troubleshooting sequence
is as follows:.

Start

Is the LAN port of the

front side used?

No

Connect the LAN cable

Yes

Is the result of
PING test normal?

No

- Check the clocks of U5(CPLD) K14

and R25
- Replace U2 PHY CHIP

Yes

Is the result of PING test

normal?

No

Replace U12 CPU

Yes

End

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3.4.3.7 Operation of SIO Port is Abnormal

When a failure occurs to the SIO port of the TEPRI2 board, the troubleshooting sequence is
as follows:
Start

Is a signal generated
at Pin SIO_TXD of TEPRI2
U12 H14?

No

- Check MMC
- Check Software version
- Check if other functions are normal
- Replace CPU(U12)

Yes

Is U1 (MAX3232) PIN14
TXO displayed properly?

No

Replace U1

Yes

Check the connection up to RJ-45

End

SAMSUNG Electronics Co., Ltd.

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CHAPTER 3. ! .

3.4.4 8SLI/16SLI/8HYB/8HYB2 Board

When a failure occurs on the 8SLI/16SLI/8HYB/8HYB2 board, the troubleshooting
sequence is as follows:

3.4.4.1 8SLI/16SLI/8HYB/8HYB2 Board is not Detected

When the 8SLI/16SLI/8HYB/8HYB2 board is not detected, the troubleshooting sequence
is as follows:
Check if a group does not
operate in MP40 Slot and LP40

Yes
Does a group fail to operate?

Repair the MP40/LP40 board

No

Check if all boards does not operate

Are all boards abnormal?

Yes

- Check with normal board again

- Repair the MP40/LP40 board

Yes

Check DATA BUS and CARD

ENABLE signals of the card

No

Does a failure occur

only when the SLI board
is mounted?
No

Repair the SLI board

End

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OfficeServ 7400 Service Manual

3.4.4.2 Power is not Supplied

When the power is not supplied to the 8SLI/16SLI/8HYB/8HYB2 ports, the
troubleshooting sequence is as follows:
Check the power at both ends
of TIP-RING(-30 V or more)

Check if the power of PIN7

of RELAY is 34 V or more

Is the power -34 V or more?

No

Check and repair 48 V at 30PIN

connector

Yes

Is PIN of LD0-15 HIGH?

No

Check and repair power control

port of SBS9401

Yes

Replace PZTA42

End

SAMSUNG Electronics Co., Ltd.

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CHAPTER 3. ! .

3.4.4.3 A Tone is not Heard

When a tone is not heard from the 8SLI/16SLI/8HYB/8HYB2 port, the troubleshooting
sequence is as follows:
Check the power between
TIP-RING

No
Is the power 30 V or more?

- Repair power supply unit

- Refer to 4.5.2 Power is not

Yes
Check if the HOS signal
is ACTIVE at SMC

No
Is HOS detected?

Replace TR surrounding circuits

Yes
Check if a tone signal is
generated at PIN3 of CODEC

No

Check if a time slot signal is

generated from PIN5/12 of CODEC

No

- Check or repair ADDRESS BUS

and DATA BUS
- Replace SBS9401

No

Repair the hardware of the

MP40 board and mother board

Is a tone heard?

Yes
Check and repair the
output of SBS9401

Is a time slot signal

generated?
Yes

Is a signal
generated at HWR?
Yes

Replace CODEC

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OfficeServ 7400 Service Manual

3.4.4.4 A Call is not Connected

When a call is not connected to the 8SLI/16SLI/8HYB/8HYB2 port, the troubleshooting
sequence is as follows:
Check time slot signal is
generated from PIN5/12 of
CODEC

Is a time slot signal

generated?

No

- Check or repair ADDRESS

BUS and DATA BUS
- Replace SBS9401

Yes

Is a signal
generated from HWR?

No

Repair the hardware of the

MP40 baord and mother board

No

Replace GAIN HYBRID

(HYB1, 3, 5, 6)

Yes

Is Rx signal
generated from between
TIP-RINGs?
Yes

Is a signal generated
from HWX?
Yes

Repair the MP40/LP40 board

No

Is a signal
generated from PIN14
of CODEC?

No

Replace CODEC

Yes
Replace GAIN HYBRID
(HYB1, 3, 5, 6)

End

SAMSUNG Electronics Co., Ltd.

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CHAPTER 3. ! .

3.4.4.5 Ring does not sound

When the ring of the 8SLI/16SLI port does not sound, the troubleshooting sequence is as
follows:
Start

Does RELAY sound?

No

Yes

Yes

Replace the port RELAY

No

Replace SBS9401

Yes
- Replace RELEY
- Replace TR

Check if 20 Hz ring signal

is generated from negative
terminal of D38

Is a ring signal
generated?

Is the ring control

port signal of SBS9401
generated?

No

About 75 V
DC is generated from the
both ends of C246
and 247?

End

No

- Replace PWM IC(U19)

- Replace Q57

Yes

Replace Q58, 59, 60 and 69

End

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OfficeServ 7400 Service Manual

3.4.5 16SLI2/16MWSLI Board

This subsection describes the troubleshooting procedures when failures occur on the
16SLI2/16MWSLI board.

3.4.5.1 16SLI2/16MWSLI board is not detected

When the 16SLI2/16MWSLI board is not detected, the troubleshooting sequence is as
follows:

Check if a specific group

does not operate in slots

Yes
Does a group fail to operate?

Repair the MP40/LP40 board

No

Check if all boards does not operate

Are all boards are abnormal?

Yes

- Check with a normal board again

- Repair the MP40/LP40 board

Yes

Check the DATA BUS and CARD

ENABLE signals of the card

No

Does a failure occur

only when the SLI board
is mounted?
No

Repair the SLI board

End

SAMSUNG Electronics Co., Ltd.

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CHAPTER 3. ! .

3.4.5.2 Power is not Supplied

When the power is not supplied to the 16SLI2/16MWSLI port, the troubleshooting
sequence is as follows:

Check both ends of TIP-RING

(-40 V or more)

Check if -40 V or more is applied

between PIN3-PIN6 of RELAY

Is the power -40 V or more?

No

Check and repair LF4007

Yes

Is PIN3 of LE79555
-40 V or more?

No

Check PIN2 of LE79555

(PWM Pulse)

Yes

Replace BAV23C

End

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OfficeServ 7400 Service Manual

3.4.5.3 A Tone is not heard

When a tone is heard from the 16SLI2/16MWSLI port, the troubleshooting sequence is as
follows:
Check the power
between TIP-RING

No
Is the power -30 V or more?

- Check PIN2 and PSU of LE79555

- Refer to 4.5.2 Power is not
provided

Yes
Check if the HOS(CD1)
signal of U10 is ACTIVE

No
Is HOS detected?

Check LE79555 and Ring Generator

Yes
Check if a tone signal is
generated from PIN22 of 58Q021

No
Is a tone generated?

Replace SLAC(58Q021)

Yes

Check U13(CPLD)

Is the Codec Control

signal generated?

No

Check the related signal

(Clock and Address/Data Bus)

No

Repair the hardware of MP40 board

and mother board

Yes

Is a signal generated at HWR?

Yes

Replace CODEC

SAMSUNG Electronics Co., Ltd.

End

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CHAPTER 3. ! .

3.4.5.4 A call is not connected

When a call is not connected to the 16SLI2/16MWSLI port, the troubleshooting sequence
is as follows:
Check if a PCM_FS signal is
generated from PIN5 of U1

Is a PCM_FS signal
generated?

No

Check or replace U1

Yes

Is a signal generated at HWR?

No

Repair the hardware of the MP40

board and mother board

Yes

Is a RX signal
generated from between
TIP-RING

No

Replace SLAC

Yes

Repair the MP40/LP40 board

End

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OfficeServ 7400 Service Manual

3.4.6 MGI Board

This subsection describes the troubleshooting procedures when failures occur on the MGI
board.

3.4.6.1 PWR LED is Turned off

When the PWR LED on the front side of the MGI board is turned off while all boards
mounted to OfficeServ 7400 and all connected terminals are properly operated, the
troubleshooting sequence is as follows:

Start

Is CARD ID of the
related slot is detected
at MMC 806?

No

Check +5 V and +3.3 V

of the 30 PIN connector

Yes

Is LED properly connected?

No

Replace LED

Yes

Replace LED or the board

End

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CHAPTER 3. ! .

3.4.6.2 RUN LED is turned off

If RUN LED on the front side of the MGI board is turned off while all boards mounted on
the OfficeServ 7400 system and all terminals connected operate properly, the
troubleshooting sequence is as follows:

Press the reset switch

Is RUN LED turned off?

No

End

Yes

Is the operation normal

after replacement of Flash
ROM(U20)?

No

Replace the board

Yes

End

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OfficeServ 7400 Service Manual

3.4.6.3 SVC LED is not turned on

If SVC LED on the front side of the MGI board is turned off while all boards mounted on
the OfficeServ 7400 system and all terminals connected operate properly, the
troubleshooting sequence is as follows:
Press the reset switch

No
Is SVC LED turned off?

End

Yes

Press the MGI reset button.

Check SVC LED

When executing the

dsptest command on console
after connecting the cable to SIO,
is the DSP turned to the
runningstatus?

No

Replace LED

Yes

Are P9, 10, 11, 12

PIN11(CLKX) and PIN12
FSX(8 KHz) normal?

No

Check P2 E4(CLKX) and

P3 D1(FSX) of 30P connector

Yes

OSC(Y2) 20M clock is

generated normally?

No

Replace the OSC(Y2) 20M clock

Yes

Replace the board

End

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CHAPTER 3. ! .

3.4.6.4 A call is not connected Between IP Phone and Digital Phone

If a call is not connected between an IP phone and digital phone while while all boards
mounted on the OfficeServ 7400 system and all terminals connected operate properly
(A call between local IP phone/local digital phone, local IP phone/digital phone or remote
IP phone/digital phone is not connected), the troubleshooting sequence is as follows:

Press MGI reset button and

check board,status

Do DSP, RTPT and RTPR

LEDs blink?

No

Check setup status of MMC 724, 615

on each system(refer to programming
description)

Yes

Is RTPT LED turned on?

No

- Check if IP/MAC of local IP phone is

redundant
- Check if remote MGI IP/MAC is
redundant

Yes

Does any identical

IP exist on MMC 831 and 840
of each system?
Yes

No

After ping test for corresponding IP

phone and IP of MGI MCP, check if
identical IP exits in each system.(Note
that perform the step after deleting
ARP table)

Reattempt the steps after changing

IP and check if the status is identical.
If so, replace the board

End

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OfficeServ 7400 Service Manual

3.4.7 MGI64 Board

This subsection describes the troubleshooting procedures when failures occur on the
MGI64 board.

3.4.7.1 PWR LED is turned off

When PWR LED on the front of the MGI64 board while all boards mounted to
OfficeServ 7400 and all connected terminals are properly operated, the troubleshooting
sequence is as follows:

Start

Is CARD ID
of the related slot is detected
at MMC 806?

No

Check +5 V of the 30PIN connector

Yes

Is LED properly connected?

No

Replace RED

Yes

Replace LED or the board

End

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CHAPTER 3. ! .

3.4.7.2 RUN LED is turned off

If RUN LED on the front side of the MGI64 board is turned off while all boards mounted
on the OfficeServ 7400 system and all terminals connected operate properly, the
troubleshooting sequence is as follows:
Press the reset switch.

Is RUN LED turned off?

No

End

Yes

Is the operation normal

after replacement of Flash
ROM(U23 and U28)?

No

Replace the board

Yes

End

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OfficeServ 7400 Service Manual

3.4.7.3 SVC LED is not turned on

If SVC LED on the front side of the MGI64 board is turned off while all boards mounted
on the OfficeServ 7400 system and all terminals connected operate properly, the
troubleshooting sequence is as follows:
Press the reset switch.

No
Is SVC LED turned off?

End

Yes

When executing the

chinfo command in console
after connecting the cable to SIO,
is create_ch Exist is turned
to the VoIP status?

No

Replace the LED

Yes

Are P9, 10, 11, 12 PIN11

(CLKX) and PIN12 FSX
(8 KHz) normal?

No

Check P2 E4(CLKX) and

P3 D1(FSX) of 30P connector

Yes

Replace the board

End

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CHAPTER 3. ! .

3.4.7.4 A call is not connected Between IP Phone and Digital Phone

If a call is not connected between an IP phone and digital phone while while all boards
mounted on the OfficeServ 7400 system and all terminals connected operate properly
(A call between local IP phone/local digital phone, local IP phone/digital phone or remote
IP phone/digital phone is not connected), the troubleshooting sequence is as follows:

Press the MGI64 reset button

and check board status

Do DSP, RTPT and

RTPR LEDs blink?

No

Check setup status of MMC 724, 615

on each system(refer to programming
description)

Yes

Is RTPT LED turned on?

No

- Check if IP/MAC of local IP phone is

redundant
- Check if remote MGI IP/MAC is
redundant

Yes

Does any identical

IP exist on MMC 831 and 840
of each system?

No

After ping test for corresponding IP

phone and IP of MGI MCP, check if
identical IP exits in each system.
(Note that perform the step after
deleting ARP table)

Yes

Reattempt the steps after changing

IP and check if the status is identical.
If so, replace the board

End

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OfficeServ 7400 Service Manual

3.4.8 4DSL Board

This subsection describes the troubleshooting procedures when failures occur on the 4DSL
board.

3.4.8.1 Operation of LAN Port is Abnormal

When a failure occurs to the LAN port of the 4DSL board, the troubleshooting sequence is
as follows:
Start

Does the lower LED blink?

No

- Check the LAN cable

- Check the environment of 10Mbps
LAN

Yes

Does the left LED blink?

No

Check the LAN cable

Yes

Is the result of PING

test normal?

No

- Check if the connector is connected

properly
- Check the replace the X1 crystal

Yes

Does it operate only for

a specific port?

No

Programe or replace U17 CPLD

Yes

Replace U60 PHY

End

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CHAPTER 3. ! .

3.4.8.2 DSL operates abnormally

When a failure occurs to Digital Subscriber Line(DSL) of the 4DSL board, the
troubleshooting sequence is as follows:

Start

Does the port operate properly?

No

- Check the port cable

- Check 24AWG

Yes

Does the port LED blink?

No

Check the length of the cable

Yes

Is the result of PING

test normal?

No

- Check U19~U22 EEPROM

- Check the version of PGM in MMC

Yes

Does it operate for only

a specific port?

No

Check if the fuse is short

Yes

Replace the board

End

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OfficeServ 7400 Service Manual

3.4.9 LIM Board

This subsection describes the troubleshooting procedures when failures occur on the LIM
board.

3.4.9.1 LAN Port operates abnormally

When the LAN port of the LIM board operates abnormally, the troubleshooting sequence is
as follows:

Start

Is the right LED tured on?

No

- Check the LAN cable

- Check the environemtn of 10M LAN

Yes

Is the left LED tured on?

No

Check the LAN cable

Yes

Is the result of PING

test normal?

No

- Check if the connector is properly

connected
- Compare and check the
UNMANAGED and MANAGED slots

Yes

Does it operate only

for a specific port?

No

- Replace U14 if only the 8 ports on

the left operate
- Replace U4 if only the 8 ports on the
right operate

Yes

Replace the U11 switch

Start

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CHAPTER 3. ! .

3.4.10 PLIM Board

This subsection describes the troubleshooting procedures when failures occur on the PLIM
board.

3.4.10.1 LAN port operates abnormally

When a failure occurs to the LAN port of the PLIM board, the troubleshooting sequence is
as follows:
Start

Is the right LED tured on?

No

- Check the LAN cable

- Check the environment of 10M LAN

Yes

Is the left LED tured on?

No
Check the LAN cable

Yes

No
Is the result of PING
test normal?

- Check if the connector is properly

connected
- Compare and check the
UNMANAGED and MANAGED slots

Yes

Does it operate only

for a specific port?

No

- Replace U14 if only the 8 ports on

the left operate
- Replace U4 if only the 8 ports on the
right operate

Yes

Replace the U11 switch

End

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OfficeServ 7400 Service Manual

3.4.10.2

PoE operates abnormally

When the PoE of the PLIM board operates abnormally, the troubleshooting sequence is as
follows:
Start

Is the power properly

supplied for the port
connected?

No

- Check the LAN cable

- Check the Strap option
- Check the connected terminal

Yes

Does it operate only for

a specific port?
No

Yes

- Replace U1 of PLIMD if 1, 2, 5 and 6

ports are abnormal
- Replace U2 of PLIMD if 3, 4, 7 and 8
ports are abnormal
- Replace U4 of PLIMD if 9, 10, 13
and 14 ports are abnormal
- Replace U6 of PLIMD if 11, 12, 15
and 16 ports are abnormal

End

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CHAPTER 3. ! .

3.4.11

GPLIM Board

This subsection describes the troubleshooting procedures when failures occur on the
GPLIM board.

3.4.11.1 Troubleshooting Procedures by Failure Types

For failures by types, the checking and troubleshooting procedures are described as
follows:
1) RESET Input Signal
The RESET input signal is collected to U13(LC4128V) CPLD. Check the status for each
input and troubleshoots the status if abnormal.
y

Is SYS_RST_L(U13-PIN126) High?
This signal is in High status if it is normal. Otherwise, the voltage of the system or
U33(DS1706) is abnormal, or the peripheral resistances has not been installed properly.

Is 852T_PORST_L(U13-PIN60) High?
It is the reset signal that runs the CPU. If this signal is in Low status, check the status
of the CPU and peripheral parts.

Is 852T_SOFTRST_L(U13-PIN102) High?
It is a software reset signal. If this signal is in Low status, check the status of the CPU
and EPLD source.

Is BP_RESET_L(U13-PIN45) High?
It is a signal for resetting IC. If this signal is in Low status, check if U13(LC4128V) is
normal. If this signal is in High status, check if U25-PIN2(74LCX14) is also High.
If U25-PIN2(74LCX14) is in Low status, check U31.

2) RESET Output Signal

The RESET output signal is generated at U13(LC4128V) CPLD and transferred to each
part of the board. If the RESET output is abnormal, the board does not operate.
y

Is ALT_RST_L(U13-PIN35) High?
This signal is a Backplane Reset signal. If this signal is in Low status, it means that the
Reset signal is held on the backplane or U3(MC74LCX245) is defective.

3) CLOCK
If a clock entered into U13(LC4128V) is abnormal, check 100MHz Clock of U13-PIN50
and RTC CLOCK(32.768KHz) of U13-PIN114.

3-62

Is CLK_EPLD_50M normal?
This signal is a 50MHz CLOCK. If the 50MHz CLOCK is not measured, check the
Y1(50 MHz OSC), U1(CY2305) and peripheral parts.

Is RTCCLK_32K normal?
This signal is a clock signal of 32.768KHz. If this signal is abnormal, it means that
U19(RTC8564NB) is abnormal or installed wrong.
SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

4) RESET Device
If the LED does not blink at the beginning even though the checking and troubleshooting
procedures are checked for RESET input signal, it means that U13 CPLD may be abnormal
or the program is not downloaded. Perform an inspection using CPLD program equipment.
If it is normal, check the soldering status. Otherwise, download the program again.
5) ROM Access
If RESET is released, ROM(39VF040, U12) is accessed. For the access, check the U12PIN22(ROM_CE_L) and U12-PIN24(ROM_OE_L) signals. If the status of two signals
repeats High and Low, it means ROM Access. Otherwise, check the status as follows:
y

PLD(U13)
The two types above displayed on U13-PIN91 and U13-PIN90. Check this signal to
check if the PLD operates properly.

CPU(U9)
If U13 is normal, it means CPU(U9) is abnormal or the assembly is wrong.

6) UART Device
Inspect PIN13 and PIN14 of UART(U30). If it is not measured to move to Low or High,
troubleshoots as described in ROM Access above.
Scope and inspect pins of U30(MAX3232) and RJ45(J10-PORT12).
7) Memory Access
If the console message stops being displayed, it is not likely to move to Boot ROM
Prompt(moved to this status if entering d on 5 1 count.). For this case, it is required to
inspect overall assembly status and defects of parts for the board.
8) GIGA PORT Device
12 Gigabit Ports are connected to external devices through the SFP module mounted on the
SFP cage via GE PHY Transceiver(HDMP1646A, U28, U31) at VT6526(U17).
Check the status and installation of the parts on those devices and connection path.
9) LAN PORT Device
12 FE LAN ports connect from VT6526(U17) to the external device through 12Port RJ45
Module via PHY Device(VT6108, U23, U24). Check the status and installation of the parts
on those devices and connection path.

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CHAPTER 3. ! .

10) Power Check

SWITH Chip(VT6526) applies 2.5V(2.5 V_MAC) generated using 3.3V and 5V entered
from Backplane for its main power. GIGA Transceiver(HDMP1646A) and SFP Module use
the power of 3.3 V entered from Backplane. FAST Ethernet PHY Device(VT6108) uses the
power of 2.5V(2.5 V_PHY0, 2.5 V_PHY1) generated using 3.3V and 5V entered from
Backplane.
Check if each power is normal.
11) Connector and Daughter Board (GLIMD)
If the power for PoE is supported for each port, check if Connector(J8) connecting the
mother board and daughter board is normal, and PD64004(U1, U2, U3), which is a PoE
manager supplying the power at Daughter board, and peripheral circuits are normal.
12) OSC and PoE MCU
If the power is properly provided to each port for the PoE function and the connector is
normal, check if OSC(Y1) supplying clock to PD63000(U4) is normal and a signal is
properly transferred between PD63000 and CPU(U9) of the mother board.

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OfficeServ 7400 Service Manual

3.4.11.2 Port LED on the Front Side does not Blink at the Beginning
If the Port LED on the front side does not blink when the PLIM board starts, it means that the
RESET signal of the board is still applied or the devices controlling the RESET signal has a
failure.
For this case, the troubleshooting sequence is as follows:
Turn on the power switch
of the cabinet

Is RESET input
all released?

No

Check the signal of RESET input for

troubleshooting

Yes

Is CLCOK normal?

No

Check the CLOCK for troubleshooting

Yes

Are the RESET devices

normal?

No

Check the RESET devices

Yes

Voltage Measurement
-54 V: P1-A1, P1-B1
+5 V: P3-A1, P3-B1
+3.3 V: P2-A1, P2-B1, P2-C1

End

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CHAPTER 3. ! .

3.4.11.3 Message is not displayed on Console

If the Port LED blinks at the beginning, it means that all RESET sources are normal and the board
is ready to operate. Nevertheless, if the board is not operated, perform the following
troubleshooting procedure:
Turn on the power switch
of the cabinet

Is RESET output all displayed?

No

Check the signal of RESET Output for

troubleshooting

Yes

Is ROM Access performed?

No

Check for ROM Access

Yes

Is UART Chip normal?

No

Check the UART device

Yes
Check the assempbly status of the
board and CPU (U7)
Check the voltage
- 1.8 V: C46-1, C46-2
- 2.5 V: C103-1, C103-2, C112-1,
C112-2, C108-1, C108-2
- 2.75 V: C74-1, C74-2, C75-1, C75-2

End

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OfficeServ 7400 Service Manual

3.4.11.4 A message is stopped being displayed on Console

If the message output stops after a part of serial message is displayed, it is likely to be caused by a
failure from the memory.
Turn on the power switch
of the cabinet

Is the status of Memory

Access normal?

No

Check the Memory Access

Yes

- Check the assembly status of

PU(U9) and board
- Check the voltage 1.8 V: C46-1,
C46-2

End

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CHAPTER 3. ! .

3.4.11.5 LINK LED of Port is not Turned on

If LINK LED is turned on when the relevant cable connects, check the status as follows:

Turn on the power switch

of the cabinet

Does the cable connect

properly?

No

Check if the cable connects properly

and meets the specification

No

Is the power of opposite port turned

on and the opposite port properly
operated?

Yes

Is the opposite port normal?

Yes

- Check each device

- Check the power

End

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OfficeServ 7400 Service Manual

3.4.11.6

PoE does not operate

For 12 10/100 ports of the GPLIM board, PoE is supported. If PoE is not supported, check
the status in the order of the following procedure. The actual PoE circuits are implemented
on GLIMD, which is the daughter board.
Turn on the power switch
of the cabinet

Is the power generated at

each port?

No

Check the status of the connector and

daughter board

Yes

Is a connected terminal
normal?

No

Check if the terminal is normal

Yes

Is the status of POE MCU

normal?

No

Check the status of OSC and POE

MCU

Yes
Check overall assembly status of
CPU and the board of the main board

End

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CHAPTER 3. ! .

3.4.12

GSIM Board

This subsection describes the troubleshooting procedures when failures occur on the GSIM
board.

3.4.12.1 Troubleshooting Procedures by Failure Types

For failures of the GSIM board by types, the checking and troubleshooting procedures are
described as follows:
1) RESET Input Signal
The RESET input signal is collected to U19(LC4128V) CPLD. Check the status for each
input and troubleshoots the status if abnormal.
y

Is SYS_RST_L(U19-PIN99) High?
This signal is in High status, if it is normal. Otherwise, the voltage of the system or
U25(DS1706) is abnormal, or the peripheral resistances has not been installed properly.

Is 5696_COREVRM_PGOOD(U19-91) High?
If the regulator that determines the status of the CORE voltage of BCM5696 is
properly operated, this signal is in High status. If this signal is in Low status, check the
Switching Regulator or the status of the peripheral circuits.

Is SOFT_RESET_L(U19-PIN98) High?
It is a software reset signal. This signal is displayed as High at MPC8247(U22) if it is
in normal status. If the signal is in Low status, check the status of the U22 assembly
and defects of the parts.

Is BP_RESET_L(U19-PIN68) High?
It is a Backplane Reset signal. If this signal is in Low status, it is likely because the
backplane holds on the reset signal or U14(MC74LCX245) is defective.

2) RESET Output Signal

The RESET output signal is generated at U19(LC4128V) CPLD and transferred to each
part of the board. If the RESET output is abnormal, the board does not operate.

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Is EPLD_SYSRST_L(U19-PIN4) High?
It is a signal to reset other devices on the board. If this signal is in Low status, check if
U19(LC4128 V) is normal. If this signal is in High status, check U28-PIN4, PIN8 and
PIN10(74LCX14) are in High status continuously. If it is in Low status, check U28.

Is EPLD_PORST_L(U19-13) High?
It is a signal to reset CPU. If this signal is Low, check if U19 is normal and U28-PIN2
is in High status.

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OfficeServ 7400 Service Manual

3) CLOCK
If a clock entered into U19(LC4128V) is abnormal, U19 does not operate properly. check
100MHz Clock of U19-PIN114 and RTC CLOCK(32.768KHz) of U19-PIN50.
y

Is EPLD_CLK_100M normal?
This signal is a 100MHz CLOCK. If the 100MHz CLOCK is not measured, check the
Y3(100MHz OSC), U15(ICS8305) and peripheral parts.

Is RTCCLK_32K normal?
This signal is a clock signal of 32.768KHz. If this signal is abnormal, it means that
U6(RTC8564NB) is abnormal or installed wrong.

4) RESET Device
If the LED does not blink at the beginning even though the checking and troubleshooting
procedures are checked for RESET input signal, it means that CPLD may be abnormal or
the program is not downloaded. Perform an inspection using CPLD program equipment.
If it is normal, check the soldering status. Otherwise, download the program again.
5) ROM Access
If RESET is released, ROM(39VF040, U30) is accessed. For the access, check the U30PIN22(ROM_CE_L) and U30-PIN24(ROM_OE_L) signals. If the status of two signals
repeats High and Low, it means ROM Access. Otherwise, check the status as follows:
y

PLD(U19)
The two outputs above are displayed on U19-PIN18 and U19-PIN19. If this signal is
not displayed, check the 8247_RCS0_L(U19-PIN117) and 8247_OE_L(U19-PIN110)
signals of U19. If it is turned to the Low or High status, check the status of U19.

CPU(U22)
If the ROM Access is not performed even though U19 is normal, it is likely because
the MPC8247(U22) or its installation is abnormal.

6) UART Device
Check U33(MAX3232) device. The UART_TXD signal of U33-PIN11 should be moved to
Low or High as well as TXD1_OUT of U33-PIN14.
If the failure is not found, check the assembly status of J1 and MPC8247.
7) Power
For the power of Fiber Module or LED, -54 V is used after regulation. Therefore, check
U17(P12 V), U24(P5 V_B) and U31(P3V3_B) in order, and if any abnormal voltage occurs,
check the regulator of the peripheral circuits.

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CHAPTER 3. ! .

3.4.12.2 LINK/ACT LED Remains in Turn-on Status

If the Link/Active LED remains in turn-on status even after the reset of Backplane is
released, it means that the booting is not properly processed because the GSIM board has
not its own RUN LED. For this case, check each part of the board in the following order:
Turn on the power switch
of the cabinet

Are all RESET

Inputs released?

No

Check the signal of RESET input for

troubleshooting

Yes

Is CLCOK normal?

No

Check the CLOCK for troubleshooting

Yes

Are RESET devices normal?

No

Check the RESET devices

Yes
Mesure the Voltage
-54 V: P1-A1, P1-B1
+5 V: P1-A6, P1-A6
-5 V: P2-E1
+3.3 V: P2-A1, P2-B1, P2-C1

End

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OfficeServ 7400 Service Manual

3.4.12.3 A Message does not Display on Console

If the message does not display on the console connected to the GSIM board, check the
board as follows:
Turn on the power switch
of the cabinet

Are all RESET

Inputs released?

No

Check the signal of RESET

Output for troubleshooting

Yes

Is ROM Access available?

No

Check for ROM Access

Yes

Is UART Chip normal?

No

Check the UART device

Yes

Check overall assembly status of

CPU (U22) and the board
Check the voltage
- VCORE(1.5 V): U32-4
- P3V3_A(3.3 V): P2-A1, P2-B1,
P2-C1
- P1V5(1.5 V): C52-1, C52-2

End

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CHAPTER 3. ! .

3.4.12.4 LINK/ACT LED does not Blink

There are 10 Gigabit ports on the GSIM board and a LINK/ACT LED exists on each port.
The LINK/ACT LED is composed in the form that LINK/ACT U19(LC4128V) displays a
signal related to LINK/ACT after receiving from BCM5696 and latching. If LINK/ACT
LED does not blink even though packets are exchanged as the relevant cable is connected,
it is required to check the assembly status of U19(LC4128V) or U18(BCM5696).
Turn on the power switch
of the cabinet

Is the cable connected

properly?

No

Check if cable is properly connected

and meets the specification

No

Is the power of the oppostie device

turned on and properly operated?

Yes

Is the opposite device normal?

Yes

- Check each device

- Check the power

End

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3.4.13 GWIM Board

This subsection describes the troubleshooting procedures when failures occur on the
GPLIM board.

3.4.13.1 Troubleshooting Procedures by Failure Types

For failures of the GWIM board by types, the checking and troubleshooting procedures are
described as follows:
1) RESET Input Signal
The RESET input signal is collected to U27(LC4128V) CPLD. Check the status for each
input and troubleshoots the status if abnormal.
y

Is SYS_POW_RST_L(U27-PIN34) High?
This signal is in High status, if it is normal. Otherwise, the voltage of the system or
U32(DS1706) is abnormal, or the peripheral resistances has not been installed properly.

Is SUBBD_PWRGOOD(U27-PIN38) High?
If the regulator is properly operated when Security Option Board(GWIMS) is mounted,
this signal is displayed as High. If this signal is in Low status, it is required to check if
the voltage and regulator of GWIMS is normal.

Is COREVRM_PWRGD(U27-PIN44) High?
If the CPU Power(1.5V) Regulator of GWIM is normal, this signal is displayed as High. If the
signal is in Low status, check the regulator and peripheral parts on page 8 of the circuit diagram.

Is P1V25_PWRGOOD(U27-PIN45) High?
This signal is displayed on the regulator that generates the voltage of 1.25V(DDR
Termination) presented on page 7 of the circuit diagram., and is in High status if normal.
If this signal is displayed as Low, check if U9 and peripheral parts are normal.

Is SOFT_RESET_L(U27-PIN63) High?
It is a Software Reset signal. If it is normal, it is displayed on MV64460(U13) as High.
If the signal is displayed as Low, check if the assembly status and parts of U13 are
normal.

Is BP_RESET_L(U27-PIN119) High?
It is a Backplane Reset signal. If this signal is displayed as Low, it means that
Backplane holds on the Reset signal or U4(MC74LCX245) is defective.

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2) RESET Output Signal

The RESET output signal is generated at U27(LC4128V) CPLD and transferred to each
part of the board. If the RESET output is abnormal, the board does not operate.
y

Is ALT_RSTOUT_L(U27-PIN42) High?
It is a signal to reset MV64460(U13). If this signal is displayed as Low, check if
U27(LC4128V) is normal. If it is displayed as High, check if U31-PIN6(74LCX14) is
displayed as High. If it is displayed as Low, check U31.

Is ALT_RSTOUT2(U27-PIN37) Low?
It is a signal to reset PCI Device. If this signal is displayed as High, check if U27 is
normal and each output signal of U31 is displayed as High.

Is ALT_RSTOUT3(U27-PIN36) Low?
It is a signal to reset CPU(U7) and UART(U35). If this signal is displayed as High, check
if U27 is normal and Pin 4 of U31 is displayed as High.

3) CLOCK
If a clock entered into U27(LC4128V) is abnormal, U27 does not operate. Inspect 100MHz
Clock of U27-PIN114 and RTC CLOCK(32.768KHz) of U27-PIN112.
y

Is CLK_100M_EPLD normal?
This signal is 100MHz CLOCK. If 100MHz CLOCK is not measured, check
Y3(100MHz OSC), U14(CY2305) and the peripheral parts specified on page 10 of the
circuit diagram.

Is RTCCLK_32K normal?
This signal is 32.768KHz Clock. If this signal is defective, it means U15(RTC8564NB)
is defective or the installation is wrong.

4) RESET Device
If the board does not operate properly even after troubleshooting RESET input signal, it is
likely that CPLD is abnormal or the program is not downloaded. Perform an inspection
using CPLD program equipment. If it is normal, check the soldering status. Otherwise,
download the program again.
5) ROM Access
If RESET is released, ROM(39VF040, U34) is accessed. For the access, check the U34PIN22(CS_BOOTROM_L) and U34-PIN24(OE_BOOTROM_L) signals. If the status of
two signals repeats High and Low, it means ROM Access. Otherwise, check the status as
follows
y

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PLD(U27)
The two types above displayed on U27-PIN8 and U27-PIN9. If this signal is not
displayed, check the MV_DEV_ALE_R(U27-62) signal. If it is detected that this
signal is changed to Low or High, check if U27 is normal.

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OfficeServ 7400 Service Manual

MV64460(U13)
If ROM Access is not available even though U27 is normal, it is likely that
MV64460(U13) is abnormal or is not properly installed.

CPU(U7)
If U27 and U13 are normal, it is likely that CPU(U7) is abnormal or is not installed properly.

6) UART Device
Inspect PIN11 and PIN15 of UART(U35). If it is not measured to move to Low or High,
check if the ROM Access is available.
Inspect the U35-PIN10(UART, TX) signal. If it is not measured to move to Low or High,
the device may be abnormal.
Inspect the U37(MAX3232) device. The UART_TXD signal of U37-PIN11 should be
moved to Low and High as well as STXD_O of U37-PIN14. In addition, check the
assembly status of J11.
7) DIMM
It is available to mount DDR SDRAM on DIMM Socket of GWIM. If a failure occurs, the
troubleshooting procedure is as follows:
y

Is DDR SDRAM mounted?

Check if a memory is mounted on the DIMM Slot(J5) board.

Is DDR SDRAM normal?

Check if the board is normal after replacing the memory.

8) Memory Size
Check if the memory size of 512Mbytes is displayed through a message displayed.
Otherwise, DIMM is abnormal or the SPD information of DIMM is not accessed properly.
The SPD information of DIMM is accessed through I2C Bus displayed at MV64460(U13).
If this bus is abnormal, DIMM is not accessed properly.
Check the pin signals of No. 22(MV_SCK) and 23(MV_SDA) of U30(PCA9548). If not
measured as moving to Low or High, it means that one of the following devices is
abnormal or installed improperly.
y

U30(PCA9548)

U15(RTC8564NB)

U41(AT24C02)

DIMM(J5)

U13(MV64460)

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9) Memory Access
If a console message stops being displayed, it is not likely to move to Boot ROM
Prompt(moved to this status if entering d on 5 1 count.). For this case, it is required to
inspect overall assembly status and defects of parts for the board.
If a prompt is displayed, enter the mt(memory test) command and wait for an amount of
time. Check if an error message is displayed.
10) V.35 Device
V.35 connects from MV64460(U13) to U1(SP504MCF) of the GWIMD board through J7
of GWIM and to external devices through J5 Connector of the GWIMD board.
Check if the GWIMD board is properly mounted to J7. If so, check if the resistances
mounted on U1(SP504MCF), U13(MV64460) of GWIM and the connection path are
normal and properly installed.
11) HSSI Device
HSSI connects to external devices through U38(SY100324) and U39(SY100325)
Transceiver from MV64460(U13).
Check if the parts on those devices and connection path are normal and installed properly.
12) LAN PORT Device
Three LAN ports connect to external device through the SFP module via Gigabit
Transceiver(HDMP1646A, U24, U25, U26) from MV64460(U13).
In those ports, P1 and P2 connects to the GWIMD board through J7 Connector, and the
SFP Cage of P3 is mounted on the GWIM board.
Check if the parts on those devices and connection path is normal and installed properly.
13) Power
V.35 uses P5V_A(+5 V) entered Backplane as its power. HSSI uses P5V_A and N5V(-5 V)
as an input power and each Gigabit Transceiver(HDMP1646A) uses P3V3_A(+3.3 V)
entered from Backplane. SFP Module uses P3V3_B(+3.3 V) generated on page 6 of the
circuit diagram.
Check if each power is normal.

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3.4.13.2

RUN LED does not Blink

RUN LED does not blink if the RESET signal of the GWIM board is not released and
applied, or the devices controlling the RESET signal are abnormal. For this case, check
each part of the board in the following order:
Turn on the power switch
of the cabinet

Is RESET input all

released?

No

Check the RESET input signal for

troubleshooting

Yes

Is CLCOK normal?

No

Check the CLOCK for troubleshooting

Yes

Are the RESET devices

normal?

No

Check the RESET devices

Yes

Measure the voltage

-54 V: P1-A1, P1-B1
+5 V: P1-A6, P1-A6
-5 V: P2-E1
+3.3 V: P2-A1, P2-B1, P2-C1

End

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3.4.13.3 A Message is not displayed on Console

When a message is not displayed on the console connecting to the GWIM board, the
troubleshooting procedure is as follows:
Turn on the power switch
of the cabinet

Is RESET output all

released?

No

Check the signal of RESET

Output for troubleshooting

Yes

Is ROM Access avaiable?

No

Check for ROM Access

Yes

No
Is UART Chip normal?

Check the UART device

Yes

Check overall assembly status of

CPU (U7), MV64460 (U13) and
board
Check the voltage
VCORE(1.5 V): C8-1, C8-2
P2V5(2.5 V): C27-1, C27-2
P1V5(1.5 V): C52-1, C52-2

End

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3.4.13.4 A message is stopped being displayed on Console

If the message output stops after a part of serial message is displayed, it is likely to be
caused by a failure from the memory.
Turn on the power switch
of the cabinet

Is DIMM properly
installed?

No

Check if DIMM is noraml

Yes

Is Memory Size normal?

No

Check the Memory Size

Yes

No
Is Memory Access normal?

Check the Memory Access

Yes

Check overall assembly status,

MV64460 (U13) and the board
Check the voltage
P2V5(2.5 V): C27-1, C27-2
P1V5(1.5 V): C52-1, C52-2

End

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CHAPTER 3. ! .

3.4.13.5 LINK LED is not Turned on

There are Five LINK LEDs on the GWIM board; V.35 LINK LED, HSSI LINK LED, LAN
Port 1 LINK LED, LAN Port 2 LINK LED and LAN Port 3 LINK LED.
If LINK LED is not turned on even though the cable is connected, check it as follows:

Turn on the power switch

of the cabinet

Does the cable connect

properly?

No

Check if the cable connects properly

and meets the specification

No

Is the power of opposite port turned

on and the opposite port properly
operated?

Yes

Is the opposite port normal?

Yes

Check each device

Check the power

End

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3.5 Option Board (Daughter Board)

This section describes the problems that occur on various universal boards and
troubleshooting procedures.

3.5.1 MODEM Board

This subsection describes troubleshooting procedures when failures occur on the MODEM
board.

3.5.1.1 SMC2 Port does not operate

When the SMC port of the basic cabinet does not operate, the troubleshooting sequence is
as follows:

Check the connection to IOM

Does the port of SMC2

fail to operate?

Yes

Replace the MP40 card and

MODEM board

No

Check if a group does not

operate in SMC1~2

Does a group fail to

operate?

Yes

- Replace the MP40 card if SMC1

does not operate
- Replace the MODEM board for
SMC2

No

Replace the MP40 card if the port that

does not operate is SMC1 or SMC2

End

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CHAPTER 3. ! .

3.5.2 MIS Board

This subsection describes troubleshooting procedures when failures occur on the MIS
board.

3.5.2.1 MIS Board is not Detected

When the MIS board is not detected, the troubleshooting sequence is as follows:
Check if the MIS board is properly
mounted on the MCP board

Check the CPLD version

Is CARD ID readible?

No

Replace CPLD(U4)

Yes

End

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3.5.2.2 RELAY is not Controlled

When RELAY is not controlled, the troubleshooting sequence is as follows:
Check if the control signal
is properly displayed on CPLD

Is the control signal normal?

No

Check ADDRESS and DATA BUS

Yes

Check the status by running

TRANSISTOR

Does TRANSISTOR
properly operate?

No

Replace TRANSISTOR and input

resistance

No

- Check if +5 V is supplied to RELAY

- Replace RELAY

Yes

Does RELAY sound?

Yes

End

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3.5.2.3 External Sound Source is not heard

When external sound source is not heard, the troubleshooting sequence is as follows:
SCOPING the INPUT
(PIN14 of U1, U2) of CODEC

Is music signal supplied

to the related CODEC?

No
Trace the signal flow from P1 to repair

Yes

Check if CLKX, FS1 and

FS2 are provided

Are CLKX, FS1 and

FS2 provided?

No

Replace CPLD

Yes

Check if a signal is loaded to

HWX(PIN11 of U1 and U2)

Is the signal displayed?

No

Replace the CODEC

Yes

The abnormal status is

generated from another module

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3.5.2.4 External Paging/Auxiliary Call Device does not Operate

When an external paging device or auxiliary call device(loud bell) does not operate, the
troubleshooting sequence is as follows:
SCOPING the INPUT
(PIN14 of U1, U2) of CODEC

Is a signal supplied to
the related CODEC?

No

Check if CLKX, FS1 and FS2 are

provided

Yes

Trace the signal flow from PIN3

of CODEC to P1 to repair

Are CLKX, FS1 and

FS2 provided?

No

Replace CPLD

Yes

Check if a signal is entered into

HWR(PIN6 of U1 and U2)

Is the signal displayed?

No

Replace the CODEC

Yes

The abnormal status is

generated from another module

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CHAPTER 3. ! .

3.5.3 MFM/SCM Board

This subsection describes troubleshooting procedures when failures occur on the
MFM/SCM board.

3.5.3.1 MFM/SCM Board is not Detected

When the MFM/SCM board is not detected, the troubleshooting sequence is as follows:
Check if the MFM board is mounted
on the LP40 board properly

Check the version of CPLD

Is CARD ID readible?

No

Replace CPLD(U6)

Yes

End

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3.5.3.2 All DSPs of the MFM/SCM board does not operate properly
When all DSPs of the MFM/SCM board does not operate properly, the troubleshooting
sequence is as follows:

Check the 16.384 MHz clock

Is it abnormal?

Yes

Replace Oscillator(Y1)

No

Check if all resets in the board

are in HIGH status

Check if 4 MHz, FOI signal is

normal

Check if a signal is entered to the

highway. If there is no signal,

Is it abnormal?

Yes

Repair the related item

No

Check the buffer signal of

ADDRESS/DATA

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3.5.3.3 A part of DSP on the MFM/SCM board does not operate properly
When a part of DSP on the MFM/SCM board does not operate properly, the
troubleshooting sequence is as follows:
Operation(U1~U3) Test by IC using
MMC 850 system resource program

Does DTMF SENDER operate?

No

Check the highway for SENDER

Yes
Check CHIP SELECTION(U1
PIN45/46)l

Replace U1

Does DTMF
RECEIVER operate?

No

Determine fault IC through MMC 850

system resource program

Yes
Check the Highway for RECEIVER

Check CHIP SELECTION

(U1~U3 PIN45/46)

Replace the IC

End

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3.5.4 RCM Board

This subsection describes troubleshooting procedures when failures occur on the RCM
board.

3.5.4.1 RCM Board is not Detected

When the RCM board is not detected, the troubleshooting sequence is as follows:
Check if the RCM board is
mounted on the LP40 board

Check the version of CPLD

Is CARD ID readible?

No

Replace CPLD(U8)

Yes

End

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CHAPTER 3. ! .

3.5.4.2 All DSPs of RCM Board does not operate properly

When all DSPs of the RCM board does not operate properly, the troubleshooting sequence
is as follows:
Check the 16.384 MHz clcok

Is it abnormal?

Yes
Replace Oscillator(Y1)

No

Check if all resets in the board

are in HIGH status

Check if 4 MHz, FOI signal is normal

Check if a signal is entered to the

highway. If there is no signal, trace
upto the time siwtch(9603) of the
MCP board

Is it abnormal?

Yes

Repair the related item

No
Check the buffer signal of
ADDRESS/DATA

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3.5.4.3 A part of DSP on the RCM Board does not Operate (1)
When a part of DSP on the RCM board, the troubleshooting sequence is as follows:

Operation(U1~U3) Test by IC using

MMC 850 system resource program

Does DTMF
SENDER operate?

No

Check the highway for SENDER

Yes
Check CHIP SELECTION
(U1 PIN45/46)

Replace U1

Does DTMF RECEIVER

operate?

No

Determine fault IC through MMC 850

system resource program

Yes
Check the highway for RECEIVER

Check CHIP SELECTION

(U1~U3 PIN45/46)

Replace the related IC

End

A Part of DSP on the RCM board does not operate properly

If the DSP of the RCM board is still abnormal even though the above procedure is
performed, refer to the 3.5.4.4. A Part of DSP on the RCM board does not
operate properly(2) on the next page.

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CHAPTER 3. ! .

3.5.4.4 A part of DSP on the RCM Board does not Operate (2)
If the DSP of the RCM board is still abnormal in spite of the troubleshooting procedure at
3.5.4.3 A Part of DSP on the RCM Board does not operate(1), the troubleshooting
sequence is as follows:
Operation(U1~U3) Test by IC using
MMC 850 system resource program

Does R2 SENDER operate?

No

Check the highway for SENDER

Yes
Check CHIP SELECTION
(U5 PIN45/46)

Replace U1

Does RS/CID
RECEIVER operate?

No

Determine fault IC through

MMC 850 system resource program

Yes
Check the highway for RECEIVER

Check CHIP SELECTION

(U1, U2 PIN16, U5 PIN45/46)

Replace the related IC

Check ADDRESS and DATA BUS

End

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3.5.5 CRM Board

This subsection describes troubleshooting procedures when failures occur on the CRM
board.

3.5.5.1 CRM Board is not Detected

When the CRM board is not detected, the troubleshooting sequence is as follows:
Check if the CRM board is mounted
on the LP40 board properly

Check the version of CPLD

Is CARD ID readible?

No

Refusing/Replace of CPLD(U2)

Yes

End

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CHAPTER 3. ! .

3.5.5.2 ENGINE of the CRM Board does not Operate Properly

When all ENGINEs of the CRM board does not operate properly, the troubleshooting
sequence is as follows:
Check 16.384 MHz clcok

Is it abnormal?

Yes
Replace Oscillator(Y1)

No

Check if all resets on the board

are in HIGH status

Check if 4MHz, FOI signal is normal

Check if a signal is entered to the

highway. If there is no signal, trace
upto ENGINE of the LP40 board

Is it abnormal?

Yes

Repair the related item

No

End

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3.5.5.3 A part of DSP on the CRM Board does not Operate Properly
When a part of DSP on the CRM board, the troubleshooting sequence is as follows:
(Checking Flow in DTMF Receiver)
Operation(U4~U5) Test by IC using
MMC 850 system resource program

Does the output

clock of U4/U5 Pin 94 operate
properly?

No

Inspect U4, U5 with naked eye(sort)

Check the status of U4, U5 Reset

Yes
Check the status of U4, U5 Reset

Replace the IC related to U4, U5

Does DTMF RECEIVER

opeate?

No

Check 2M, FOI, HWR

and HWX of DSP

Yes
Check HWR and HWX of Engine

Check Engine highway

TRACE of LP40

Replace the board

End

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CHAPTER 3. ! .

3.5.6 RCM2 Board

This subsection describes troubleshooting procedures when failures occur on the RCM2
board.

3.5.6.1 CRM Board is not Detected

When the CRM board is not detected, the troubleshooting sequence is as follows:
Check if the CRM board is mounted
on the LP40 board properly

Check the version of CPLD

Is CARD ID readible?

No

Refusing/Replace of CPLD(U5)

Yes

End

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3.5.6.2 DSP of the RCM2 Board does not Operate Properly

When DSP of the RCM2 board does not operate properly, the troubleshooting sequence is
as follows: (Checking Flow in CID SENDER)
Set up CID mode after mounting
RCM2 on the LP40 board

Does the output

clock of U1/U7 Pin 94 operate
properly?

No

Inspect U1, U7 with naked eye(sort)

Check the status of U4, U5 Reset

Yes
Check the status of U1, U7 Reset

Replace the IC related to U1, U7

Does CID SENDER

operate properly?

No

Check 4M, FOI

Yes
Check 2M, DSP_FS, HWR and HWX
DSP

Check Engine highway

TRACE of LP40

Replace the board

End

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This page is intentionally left blank.

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OfficeServ 7400 Service Manual

CHAPTER 4. Maintenance
Programming

This chapter describes how to execute Smart Media, Complex Programmable Logic
Devices(CPLD), off-line program.

4.1 Smart Media Programming

Smart Media, a NAND type flash memory, should be programmed via a program and
database before installing into the system.
The installation procedure and the execution method of each function are as follows:

4.1.1 Installing
This paragraph describe the way to install the Smart Media program.

4.1.1.1 Preparing
The following items are required to install the Smart Media program:
y

Smart Media writing board(SEC CODE: KP500DBSMW/EUS)

Desktop PC(486 or higher)

Smart Media Memory Card(SMC)

Software(SM_NEW.EXE: Execution of DOS mode, Offered by Samsung Electronics)

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CHAPTER 4. ! .

4.1.1.2 Installation Procedure

Lets see how to install the Smart Media program.
1)

Turn off a PC, and install Smart Media Writer(SMW) to an ISA slot of the PC.
With PC screws, fix the SMW.

2)

Turn on the PC and run SM_NEW.EXE in DOS mode or Windows mode. After then,
insert a Smart Media Card(SMC) to the SMW. At this time, the program to be stored
in SMC should exist in the directory where SM_NEW.EXE is located(i.e.,
C:\idcs500\smart).

3)

Enter 1 and press the [ENTER] key on the following screen:

C:\idcs500\smart>SM_NEW
Choose ECC Methods (1. Software ECC
(default is Software ECC)?

4)

2. Hardware ECC)

If the installation is successful, the following initial screen is displayed:

Figure 4.1 Initial Screen of Smart Media Program

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4.1.2 Performing Functions

In the initial screen, the following five functions can be performed:
y

Format

File Copy(PC to SMC, SMC to PC)

Directory View(same function as the DIR function of DOS mode)

File Delete(partial delete)

SMC Analysis

The above five functions are used for the creation of SMC to operate the OfficeServ 7400
system. These functions are used as follows:

4.1.2.1 Formatting
To use in the OfficeServ 7400 system, new SMC should be formatted.
1)

Enter 4 and press the [ENTER] key in the initial screen to open the
<Format Menu> screen. Enter 1 and press the [ENTER] key.

Figure 4.2 <Format Menu> Screen

2)

If the following contents are displayed in the screen, enter Y and press the
[ENTER] key.
Manufacturers code is
ec
Device code is
73
UID code is
a5
Fourth code is
bb
SAMSUNG 16 MB Smart Media (3.3V)
Bad Block= 1(zone=0)
Do you want to re-test all block for recovering Smart Media(y/n)? y

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CHAPTER 4. ! .

3)

Formatting is started. The progress of the format is displayed in the bottom of the
screen. If the format is normally completed, the <Format Menu> screen is displayed
again. Press the [P] key to return to the initial screen.

Figure 4.3 Formatting SMC

4.1.2.2 Copying
The Copy function is used to copy files in a PC to SMC or SMC to a PC.
1)

Enter 1 and press the [ENTER] key in the initial screen to open the <Copy Menu>
screen.

Figure 4.4 <Copy Menu> Screen

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OfficeServ 7400 Service Manual

Copying files in a PC to SMC

Files in a PC are copied to SMC.
1)

Enter 1 and press the [ENTER] key in the <Copy Menu> screen, the following screen
will be open. Enter a source file name to be copied after [:] and press the [ENTER] key.
Enter the source file name ((ex)mcp_l.pgm) : startup.sys
Enter the Smart Media Path ((ex) temp\dsc) : (just press "ENTER" key)
Enter the Smart Media file name ((ex)young.txt) : startup.sys

For SMC Programming

The SMC programming of the OfficeServ 7400 system needs MCP_MV106.PGM
and MCP_LV106.PGM, XXX.PGM as well as startup.sys.

2)

If the file is normally copied, the <Copy Menu> screen is opened. The above
operation screen is repeated to copy files to all SMCs used in the OfficeServ 7400
system.

Copying Files in SMC to a PC

Files in SMC are copied to a PC.
1)

Enter 2 and press the [ENTER] key on the <Copy Menu> screen:

2)

The following screen is displayed. Enter a source file name to be copied after [:] and
press the [ENTER] key. If the file name is incorrect, DOS mode will be closed. For
the correct file names, refer to 4.1.2.3 Displaying Directories.
Enter the source file name ((ex)mcp_l.pgm): just press "ENTER" key)
Enter the Smart Media Path ((ex) temp\dsc): startup.sys
Enter the Smart Media file name ((ex)young.txt):startup.sys

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CHAPTER 4. ! .

4.1.2.3 Displaying Directories

This function is used for the display of SMC file information. With this function, you can
check the file names included in SMC and if files are correctly copied. In addition, this
function is used to confirm file names when you overwrite the files from SMC to your PC
and you can create a subdirectory in SMC.
1)

Enter 2 and press the [ENTER] key in the initial screen to open the
<Directory Menu> screen. Enter 1 and press the [ENTER] key.

Figure 4.5 <Directory Menu> Screen

2)

4-6

If a file list included in SMC is displayed, drag the cursor to the corresponding item
and press the [ENTER] key to return to the screen concerned with the item.
Enter P and press the [ENTER] key to return to the initial screen.

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4.1.2.4 Deleting Files

This function is used for the deletion of the specified file in SMC.
1)

Enter 1 and press the [ENTER] key in the initial screen to open the <Copy Menu>
screen. Enter 3 and press the [ENTER] key.

Figure 4.6 <Copy Menu> Screen

2)

Enter the file name(i.e., STARTUP.SYS) to be deleted and press the [ENTER] key in
the following screen:
Enter the Smart Media Path ((ex) temp\dsc): SKIP
Enter the Smart Media file name ((ex)young.txt): STARTUP.SYS

4.1.2.5 Analyzing SMC

After storing the program for SMC, press the [E] key to exit the SM_NEW program.
If the system uses the SMC that startup.sys is not installed, SM LED is blinks repetitively.
The SMC to use should include startup.sys and main program(MCP PGM).
If you want to upgrade PBA program to MMC 818, save the file to be upgraded to a SMC and
insert it to MCP. After then, upgrade the program to the target PBA with MMC 818.
Enter as shown the figure below and check the file with the directory menu.
Enter the Smart Media Path ((ex) temp\dsc): SKIP
Enter the Smart Media file name ((ex)young.txt): STARTUP.SYS

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CHAPTER 4. ! .

4.2 CPLD Programming

Complex Programmable Logic Devices(CPLD) is programmed before OfficeServ 7400
leaves the factory. But the contents of the CPLD can be modified after the shipment.
Note that OfficeServ 7400 uses products of Lattice company(CPLD) or Altera
company(EPLD) and the programming methods for each product are rather different.
y

Lattice: Complex Programmable Logic Devices(CPLD)

Altera: Erasable Programmable Logic Devices(EPLD)

4.2.1 Lattice CPLD Programming

The programming method for CPLD of Lattice company.

4.2.1.1 Preparing
The following items are required to install the CPLD program of Lattice company:
y

Data to be programmed(*.JED file format)

PC supporting parallel ports

Target board to be programmed(connected by 10-pin connector)

Cable kit for programming

RJ-45 Connector cable for programming specially made

4.2.1.2 Connecting the Target CPLD to a PC

CPLD is connected in two ways according to the type of boards: A way to connect the SIO
port in the front plate of the board to a parallel port(LPT1) of a PC with RJ-45 Connector
and a programming cable kit specially made and the other way to directly connect to 10-pin
connector on the PBA of the target board.
The figure below shows the direct connection with a 10-pin connector.

CPLD
PC

KIT

Cable

PBA

Parallel Port

10Pin JTAG
connector

Figure 4.7 PC and Board Connection 1

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The figure below shows the way to connect to the SIO port.
For this connection, a programming cable specially made with RJ-45 Connector is used.

PC

KIT

Office Serv
7400
(SIO Port)

Cable

10Pin JTAG
connector

Parallel Port

RJ-45
Connector

Figure 4.8 PC and Board Connection 2

Boards using a SIO port

Boards to use the SIO port are MP40, LP40, TEPRI2, MGI64, GWIM, and GSIM.

Caution for the connection of a PC and a target board

A target board should be connected to a PC after turning off the PC power.
Otherwise, a parallel port of the PC or the target board may be damaged.

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CHAPTER 4. ! .

4.2.1.3 Running CPLD Programming Tools

A way to run a CPLD programming tool is as follows:
1)

Run the ispVM program on the windows screen of a PC.

[Start] [Program] [Lattice Semiconductor] [ispVM system]

Figure 4.9 Initial Screen of ispVM Program

2)

Click [Options] [Cable and I/O Port Setup].

Figure 4.10 <Cable and Port Setup Selection> Screen

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3)

Select 0x0378 for Port Setting item and LATTIC for Cable Type, respectively.
Click the [OK] button to apply the above selection.

Figure 4.11 <Cable and I/O Port Setup> Screen

4)

Click the [Scan] icon in the toolbar to import PLD of the target board.
At this time, check if the PLD name is displayed in Device List on the activated
screen and equal to that of the used PLD. If the scan window is not displayed, reset the
Option menu and click the scan icon again.
Double-click the FileName/IR-Length field next to the corresponding PLD to
import a desire JED file on the Scan window.

Figure 4.12 <Target Board Scanning> Screen

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CHAPTER 4. ! .

5)

Click the [Browse] button to import the JED file for fusing. Select Erase, Program,
Verify for the Operation item and click the [OK] button.

Figure 4.13 <Fusing File Selection> Screen

6)

Check again if the value of the Checksum/CRC field is the corresponding JED file.
Click the [GO] icon in the toolbar to open the <On Fusing> window as shown below:

Figure 4.14 <On Fusing> Screen

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4.2.1.5 Installing the ispVM Program

ispVM is a CPLD program tool provided by Lattice company and installed to program
CPLD.
1)

Make access to http://www.gtmkorea.co.kr/htmls/vander_lattice.html with

Internet Explorer.
2) Click as follows:
[Tool] [Programming Software] [ispVM System] [Download Software]
[ispVM System]
3) Download the program in a desired directory of your PC.

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CHAPTER 4. ! .

4.2.2 Altera EPLD Programming

Boards to program Altera EPLD are MGI and 4WLI boards. The configuration of Altera
EPLD is the same as that of CPLD except the cable kit for connection.
1)

The figure below show the initial screen(MAX + plus II Programmer Only PGM).
Click the [MAX + PLUS II] menu.

Figure 4.15 Initial Screen of Altera MAX + plus II Program

2)

Click the [File] menu and select [Select Programming File].

Figure 4.16 Selection of Program File

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3)

Select a *.POF file to program and click the [OK] button. The POF files are data files
for programming.

Figure 4.17 Selection of Data File for Programming

4)

Click the [Program] button, EPLD will enter to programming mode and download the
relevant POF files to EPLD.

Figure 4.18 Download of Data File

5)

Click the [Examine] button to store the device information.

6)

Click the [Verify] button to check the checksum of the device.

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CHAPTER 4. ! .

4.3 Offline Programming

The Offline program is a program that insects the normal operation of the system.
The Offline program for system inspection is included in the main program within Smart
Media. This program is used for the inspection of the system on the spot.

4.3.1 Preparing
For the use of the offline program, prepare the following items:
y

A PC supporting serial communication

Communication Program: QMODEM or something

Smart Media card that the main program is stored(mpexxxxx.pgm)

4.3.2 Environment Configuration

1)

Connect a PC and the OfficeServ 7400 system with a communication cable. The cable
is connected to the SIO port of a MP 40 board.
2) Run a communication program in the PC.
3) Set the communication speed to 38,400 bps.
4) Insert the SMC storing the main program to the front side of the MP 40 board.

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4.3.3 Starting to the Offline Test Mode

After preparing the above items, start the offline test by following the flow chart below:
Turn on the system power

In the Input of REST via SIO

Run the boot program

Run the offiline test program

Download the main
program to memory

AFT program is downloaded

Is REMOTE is
entered via SIO and the
[Enter] key pressed?

Yes

No
Stop the download of the
main program

Run Online program

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CHAPTER 4. ! .

4.3.3.1 Offline Program Commands

Offline program commands:
VERS
y

Test Category: Display the version and the issued date of the offline program.

Display of the Result

V100: 2005921: This result indicates that the version is v100 and the issued date is
09-21-2005.

REST
y

Test Category: Test the start function of the system.

Display of the Result

OK: The input command was normally progressed.

INIT
y

Test Category: Initialize the command environment of the offline program.

When the system has no response and the input of new command only creates BUSY
message while running a AFT command, this command is used for the initialization of
the command environment.

Display of the Result

OK: The input command was normally progressed.

BTSW
y

Test Category: Test the time switch channel in a MP40 board.

Display of the Result

PSS: The entire time switch channel of the MP40 board is normal.
FAIL: A time switch device of the MP40 board is abnormal.

BMEM

4-18

Test Category: Inspect the basic memory(DRAM 128 Mbytes, SRAM 2 Mbytes) in a
MP40 board.

Display of the Result

PASS: The status of the inspected memory is normal.
DRAM: The DRAM area of the inspected memory is abnormal.
SRAM: The SRAM area of the inspected memory is abnormal.

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IMOH
y

Test Category: Test the internal sound source of the system.

The internal sound source is provided in a MP40 board. Test the sound source after
installing a MISC board to a LP40 board(cabinet1) and connecting a speaker to the PAGE
port of the MISC board.

Display of the Result

OK: If the internal sound source in a MP40 board is normally connected to the
PAGE port of a MISC board, the internal sound source comes from the speaker.
Internal Sound Source Error: The internal sound source is not heard through the
speaker.

MLED
y

Test Category: Test the LED operation of a MP40 board.

Display of the Result

OK: 3-LED(RUN, SM and MDM) blinks three time in orange at the interval of
500 ms. The Orange means that Red and Green LED are displayed as On together.
LED Blink Error: LED is not blinked.

MIPC
y

Test Category: Test the IPC status among cabinet 1, 2 and 3.

Display of the Result

PASS: The IPC status is normal.
FAIL/n/../..: The IPC status of cabinet n is abnormal(n = 1 to 3)

BLAN
y

Test Category: Test the operation of the Ethernet port in a MP40 board.

Display of the Result

PASS: The Ethernet port of the corresponding MP40 board is normally working.
FAIL: The Ethernet port of the corresponding MP40 board is not normally
working.

LCPMx
y

Test Category: Inspect the memory of a LP40 board. This test is used for the
inspection of DRAM and FLASH of a LP40 board.
1) x: Cabinet number(1~3)

Display of the Result

PASS: The status of the inspected LP40 board memory is normal.
DRAM: The DRAM area of the inspected memory is abnormal.
FLASH: The FLASH memory area of the inspected memory is abnormal.

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CHAPTER 4. ! .

BMFRx
y

Test Category: Test eight MFR channels basically provided to a LP40 board.
x: Cabinet number(1~3)

Display of the Result

PASS: All of Eight DTMF Receivers are normal.
FAIL/n/../..: n channel is abnormal(n = 0 to 7)
For example, FAIL/1/3/ indicates that the DTMF Receiver of channel 1/3 is
abnormal.

BCNFx
y

Test Category: Test Conference 5-party 6-group basically provided to a LP40 board.
x: Cabinet number(1~3)

Display of the Result

PASS: All six groups of conference 5-party are normal.
FAIL/n/../..: n group is abnormal(n = 0 to 5)
For example, FAIL/1/3/ indicates that Conference group 1/3 is abnormal.

LSIOx
y

Test Category: Test the operation of the SIO port in a LP40 board.
For the test, this command should be entered after a DB9 connector that Tx(Pin2) and
Rx(Pin3) are connected each other is installed to the SIO port of a LP40 board to be
tested.
x: Cabinet number(1~3)

Display of the Result

PASS: The result of SIO Loop back test for the corresponding LP40 board is
normal.
FAIL: The result of SIO Loop back test for the corresponding LP40 board is
abnormal.

LFANx

4-20

Test Category: Inspect the operations of pan1, 2, 3 and 4. If a problem occurs, the
location of the pan with the problem is indicated as FAIL/1.
x: Cabinet number(1~3)

Display of the Result

PASS: The status of the inspected pans is normal.
FAIL/n/../..: The status of the inspected pan n is abnormal(n = 1~4).

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LLEDx
y

Test Category: Test the LED operation of a LP40 board.

x: Cabinet number(1~3)

Display of the Result

OK: 7-LED(excluding LAN) is blinked three times at the interval of 500 ms.
Among them, RUN, FAN, POE1 and POE2 are blinked in orange color and Rx, Tx
and DBD are blinked in green color, respectively. The Orange means that both red
and green are displayed as On.
LED Blink Error: Any LED is not blinked.

LLANx
y

Test Category: Test the operation of the Ethernet port in a LP40 board.
1) x: Cabinet number(1~3)

Display of the Result

PASS: The Ethernet port of the corresponding LP40 board is normally working.
FAIL: The Ethernet port of the corresponding LP40 board does not abnormally
work.

LMISx
y

Test Category: Test external sound source channels.

The test is performed by connecting a speaker to the PAGE port of a MISC board
after installing a MISC board whose EMOH port connects an external sound
source to the LP40 board of a cabinet that appoints the MISC board as x via the
command.
x: Cabinet number(1~3)

Display of the Result

OK: If an external sound source is normally connected to the PAGE port of the
MISC board, the external sound source is heard through the speaker.
External Sound Source Error: The external sound source is not heard through the
speaker.

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CHAPTER 4. ! .

DMFRxy
y

Test Category: Inspect the status of DTMF Receivers in SCM board, MFM board and
CRM board. SCM and MFM boards support 12 DTMF receiver channels per board
and a CRM board supports 16 DTMF receiver channels per board.
xy indicates the locations where the SCM, the MFM and the CRM boards are
mounted.
x: Cabinet number(1~3)
y: LOC number(1~2)

Display of the Result

PASS: All of 12 DTMF receivers in the MFM board are normal.
FAIL/n/../..: nn channel of the MFM board is abnormal(nn = 00~11),
and nn channel of the CRM board is abnormal(nn = 00~15).
For example, FAIL/01/03/10/ indicates that the DTMF Receiver of channel
01/03/10 in the MFM board is abnormal.

SCNFxy
y

Test Category: Test the status of conference group in SCM board, MFM board and CRM
board. SCM and MFM board support 5-party 12-group per board and CRM boards
support 5-party 6-group per board.
xy indicates the locations where the SCM, the MFM and the CRM boards are mounted.
x: Cabinet number(1~3)
y: LOC number(1~2)

Display of the Result

PASS: All conference groups are normal.
FAIL/n/../..: nn group of the MFM board is abnormal(nn = 00~11),
and nn group of the CRM board is abnormal(nn = 00~05).
For example, FAIL/01/03/10/ indicates that conference group 01/03/10 of the
MFM board is abnormal.

CCIDxy

4-22

Test Category: Test the CID function of a CRM board.

xy indicates the location that the CRM board is mounted.
x: Cabinet number(1~3)
y: LOC number(1~2)

Display of the Result

PASS: The CID function of the CRM board is normal.
FAIL: The CID function of the CRM board is abnormal.

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CCPLxy
y

Test Category: Display the CPLD version of a CRM board.

xy indicates the location that the CRM board is mounted.
x: Cabinet number(1~3)
y: LOC number(1~2)

Display of the Result

Vnn: The CPLD version of the CRM board(nn = 01~) is displayed.
FAIL: The CPLD version of the CRM board is not displayed.

R2RVxy
y

Test Category: Test the operation of R2 receiver in RCM boards and CRM boards.
RCM boards and CRM boards support 8 R2 receiver channels per board and 16 R2
receiver channels per board, separately.
xy indicates the location that RCM and CRM boards are mounted.
x: Cabinet number(1~3)
y: LOC number(1~2)

Display of the Result

PASS: All of eight R2 receives in the RCM board are normal.
FAIL/n/../..: nn channel of the RCM board in abnormal(nn = 00 to 07), and nn
channel of the CRM board is abnormal(nn = 00 to 15).
For example, FAIL/01/03/ indicates that the R2 Receiver in channel 01/03 of the
RCM board is abnormal.

BCPLx
y

Test Category: Display the CPLD version of the system mother board.
x: Cabinet number(1~3)

Display of the Result

Vnn: The CPLD version of the system mother board(nn = 01~) is displayed.
FAIL: The CPLD version of the system mother board is not displayed

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CHAPTER 4. ! .

PRIMxy
y

Test Category: Test the memory of TEPRI/TEPRI2 board. This test is used for the test
of DRAM and FLASH of a TEPRI board. This test should be progressed after
checking the normal operation of the TEPRI CARD.
xy indicates the location that the TEPRI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The status of the TEPRI board memory is normal.
DRAM: The DRAM area of the inspected memory is abnormal.
DPRAM: The DPRAM area of the inspected memory is abnormal.
FLASH: The FLASH area of the inspected memory is abnormal.

FALCxy
y

Test Category: Test the operation of Framing and Line Interface Component for E1 or
T1 element(FALC element) in TEPRI/TEPRI2 board.
If this memory is entered, the MCP memory reports the result of the board test to the
TEPRI board of the corresponding board. The corresponding board tests FALC
element in the TEPRI board by it self and reports the test result to the MCP board.
The MCP board displays the result.
xy indicates the location that the TEPRI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

4-24

Display of the Result

PASS: The FALC in the corresponding TEPRI board is normally working.
Fail: The FALC in the corresponding TEPRI board is not normally working.

Display of the Result

PASS: The FALC in the corresponding TEPRI board is normally working.
FAIL/n/../..: The nth FALC element in the corresponding TEPRI board is
abnormal(n = 1 and 2).

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TSIOxy
y

Test Category: Test the operation of the SIO port in a TEPRI2 board.
For the test, this command should be entered after a DB9 connector that Tx(Pin2) and
Rx(Pin3) are connected each other is installed to the SIO port of a TEPRI board to be
tested.
xy indicates the location that the TEPRI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

The result of SIO Loop back test for the corresponding TEPRI board is normal.
The result of SIO Loop back test for the corresponding TEPRI board is abnormal.

TLANxy
y

Test Category: Test the operation of the Ethernet port in a TEPRI2 board.
xy indicates the location that the TEPRI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The Ethernet port of the corresponding TEPRI board is normally working.
Fail: The Ethernet port of the corresponding TEPRI board does not is normally
working.

TLEDxy
y

Test Category: Test the operation of LED in a TEPRI2 board.

xy indicates the location that the TEPRI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

OK: 12-LED blinks three times at the interval of 500 ms. RUN LED blinks in
orange, and the remained 11-LED blinks in green. The Orange means that both red
and green are displayed as On.
LED Blink Error: Any LED does not blink.

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CHAPTER 4. ! .

TEPDxy
y

Test Category: Test if the ID of a TEPRI2 board is correctly read.

That is, check if the type of the MGI board in the specified slot is equal to the ID actually
read.
xy indicates the location that the TEPRI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The ID for the corresponding TEPRI board is equal to the type of the
specified board.
Fail: The ID for the corresponding TEPRI board is not equal to the type of the
specified board.

TCPLxy
y

Test Category: Display the CPLD version of a TEPRI2 board.

xy indicates the location that the TEPRI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

Vnn: The CPLD version of a TEPRI board(nn = 01~) is displayed.
FAIL: The CPLD version of a TEPRI board is not displayed

MMEMxy
y

Test Category: Inspect the memory of MGI/MGI64 board. This command is used for
the test of DRAM and FLASH of a MGI board. This test should be progressed after
checking the normal operation of the MGI CARD.
xy indicates the location that the MGI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

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Display of the Result

PASS: The status of the MGI board memory is normal.
DRAM: The DRAM area of the inspected memory is abnormal.
SRAM: The SRAM area of the inspected memories is abnormal.
FLASH: The FLASH area of the inspected memory is abnormal.

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MDSPxy
y

Test Category: Test the operation of DSP in MGI/MGI64 board.

xy indicates the location that the MGI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The DSPs in the corresponding MGI board work normally.
PASS: The DSPs in the corresponding MGI board do not work normally.

MSIOxy
y

Test Category: Test the operation of the SIO port in MGI/MGI64 board.
For the test, this command should be entered after a DB9 connector that Tx(Pin2) and
Rx(Pin3) are connected each other is installed to the SIO port of a MGI board to be
tested.
xy indicates the location that the MGI board is mounted.

Display of the Result

PASS: The result of the SIO Loop back test for the corresponding MGI board is
normal.
FAIL: The result of the SIO Loop back test for the corresponding MGI board is
abnormal.

MLANxy
y

Test Category: Test the operation of the Ethernet port in MGI/MGI64 board.
xy indicates the location that the MGI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The Ethernet port of the corresponding MGI board is normally working.
Fail: The Ethernet port of the corresponding MGI board is not normally working.

GLEDxy
y

Test Category: Test the operation of LED in a MGI64 board.

xy indicates the location that the MGI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

OK: All 5-LED(RUN, SVC, DSP, RTPT and RTPR) blinks three time in green at
the interval of 500 ms.
LED Blink Error: LED does not blink.

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CHAPTER 4. ! .

GCPLxy
y

Test Category: Display the CPLD version of a MGI64 board.

xy indicates the location that the MGI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

Vnn: The CPLD version of a MGI board(nn = 01~) is displayed.
FAIL: The CPLD version of a MGI board is not displayed

MGIDxy
y

Test Category: Test if the ID of MGI/MGI64 board is correctly read.

That is, check if the type of the MGI board in the specified slot is equal to the ID actually
read.
xy indicates the location that the MGI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The ID for the corresponding MGI board is equal to the type of the
specified board.
Fail: The ID for the corresponding MGI board is not equal to the type of the
specified board.

MPTOxy
y

Test Category: Test the conversion function for Codec in MGI/MGI64 board is
normally operated.
xy indicates the location that the MGI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

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Display of the Result

PASS: The Codec of the specified board is normally working.
FAIL: The Codec of the specified board is not normally working.

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WTSTxyz
y

Test Category: A command to enter/release the test mode for the test of 4WLI boards.
For the execution of 4WLI related commands, WMEMx, WDMCx, WTCMx and
WRSWxy, this command(WTSTxyz) is used for the start/release the test mode.
xyz indicates the position where the 4WLI board is mounted and the information on
test mode start control.
x: Cabinet number(1~3)
y: Slot number(0~B)
z: Information on the start and the release of the test mode
For the start of the test mode: 1
For the release of the test mode: 0

Display of the Result

PASS: With the command, the test for the corresponding 4WLI board is normally
performed.
FAIL: The execution of the command is not normally performed.

WMEMxy
y

Test Category: Inspect the memories(DPRAM, SRAM, Flash Memory) of the 4WLI
board.
xy indicates the location that the 4WLI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The status of the memories in the corresponding 4WLI is normal.
DRAM: The status of DRAM in the corresponding 4WLI is abnormal.
SRAM: The status of SRAM in the corresponding 4WLI is abnormal.
FLASH: The status of Flash memory in the corresponding 4WLI is abnormal.

WDMCxy
y

Test Category: Test 2-DMC(STL 7052 ASIC) in a 4WLI board.

xy indicates the location that the 4WLI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: DMC in the corresponding 4WLI board is normally working.
FAIL: DMC in the corresponding 4WLI board is not normally working.

SAMSUNG Electronics Co., Ltd.

4-29

CHAPTER 4. ! .

WTCMx
y

Test Category: Test 16-DASL built-in the specified 4WLI board.

xy indicates the location that the 4WLI board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: DASL in the corresponding 4WLI board is normally working.
FAIL: DASL in the corresponding 4WLI board is not normally working.

WRSWxyz
y

Test Category: Inspect the operation of the relay in a 4WLI board.

xyz indicates the position where the 4WLI board is mounted and the information on
Relay On/Off.
x: Cabinet number(1~3)
y: Slot number(0~B)
z: Relay On/Off information
Cut-off of the Relay: 0
Connection of the Relay: 1

Display of the Result

PASS: The connection/cut-off of the relay in the corresponding 4WLI board is
normally performed.
FAIL: The connection/cut-off of the relay in the corresponding 4WLI board is
abnormally performed.

MACRxy

4-30

Test Category: Read and Display the MAC address of a board supporting LAN.
xy indicates the positions where the boards that need the MAC address information
are mounted.

Target Boards: MP40, LP40, TEPRI2, MGI, MGI64, GWIM, GSIM, GPLIM
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

xx: 12-digit MAC address for the specified board is displayed.
FAIL: LAN support port does not exist or is not normally working in the
corresponding port.

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

WIMMxy
y

Test Category: Inspect the memory in a GWIM board. This command is used for the
test of DRAM and FLASH in a GWIM board. This test should be progressed after
checking the normal operation of the GWIM CARD.
xy indicates the location that the GWIM board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The status of the GWIM board memory is normal.
DPRAM: The DPRAM area of the inspected memory is abnormal.
FLASH: The FLASH area of the inspected memory is abnormal.

WIMOxy
y

Test Category: Test the operation of the SIO port in a GWIM board.
For the test, this command should be entered after a DB9 connector that Tx(Pin2) and
Rx(Pin3) are connected each other is installed to the SIO port of a GWIM board to be
tested.
xy indicates the location that the GWIM board is mounted.

Display of the Result

PASS: The result of the SIO Loop back test for the corresponding GWIM board is
normal.
FAIL: The result of the SIO Loop back test for the corresponding GWIM is
abnormal.

WIMIxy
y

Test Category: Test if the ID of a GWIM board is correctly read.

That is, check if the type of the GWIM board in the specified slot is equal to the ID actually
read.
xy indicates the location that the GWIM board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The ID for the corresponding GWIM board is equal to the type of the
specified board.
FAIL: The ID for the corresponding GWIM board is not equal to the type of the
specified board.

SAMSUNG Electronics Co., Ltd.

4-31

CHAPTER 4. ! .

WIMPxy
y

Test Category: Test the operation of Ethernet, V.35 and HSSI ports in a GWIM board.
For the test, this command should be entered after a loopback connector is connected
to each port of a GWIM board to be tested.
Ethernet port loopback connector: Connect an optical cable, which is cut in half.
V.35 port loopback connector:
Install the connector after connecting pins of DB26 1 connector each other,
referring to the table below:
DTE SIDE(GWIM 26POS MALE)
Pin Description

4-32

DTE SIDE(GWIM 26POS MALE)

Pin No

Pin No

Pin Description

TXD_A

RXD_A

TXD_B

14

16

RXD_B

RXD_A

TXD_A

RXD_B

16

14

TXD_B

RTS_A

CTS_A

CTS_A

RTS_A

DSR_A

8 + 20

DCD_A + DTR_A

DCD_A + DTR_A

8 + 20

DSR_A

SGND

SGND

RXC_B + TXCO_B

9 + 11

12

TXC_B

RXC_A + TXCO_A

17 + 24

15

TXC_A

TXC_B

12

9 + 11

RXC_B +TXCO_B

TXC_A

15

17 + 24

RXC_A +TXCO_A

LL

18

TM

25

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

HSSI port loopback connector :

Install the connector after connecting pins of 50P-CHAMP 1 connector each other,
referring to the table below:
DTE SIDE(GWIM)
Pin Description
Signal Ground(SG)
Dont Care
Receive Timing(RT)
DCE Available(CA)
Receive Data(RD)
Send Timing(ST)
Dont Care
Signal Ground(SG)
Dont Care
DTE Available(TA)
Terminal Timing(TT)
Send Data(SD)

DTE SIDE(GWIM)

Pin No

Pin No

26

26

27

34

28

33

11

29

36

31

31

32

32

33

28

34

27

11

36

29

Signal Ground(SG)

13

13

Dont Care

38

38

Signal Ground(SG)

19

19

Dont Care

44

44

Signal Ground(SG)

25

25

Dont Care

50

50

Pin Description
Signal Ground(SG)
Terminal Timing(TT)
DTE Available(TA)
Send Data(SD)
Send Timing(ST)
Signal Ground(SG)
DCE Available(CA)
Receive Timing(RT)
Receive Data(RD)
Signal Ground(SG)
Signal Ground(SG)
Signal Ground(SG)

xy indicates the location that the GWIM board is mounted.

x: Cabinet number(1~3)
y: Slot number(0~B)
y

Display of the Result

PASS: Ethernet, V.35 and HSSI ports in the corresponding TEPRI board are
normally working.
FAIL/n/../..: The Ethernet port, Pn(n = 1~3), in the corresponding GWIM port is
not normally working.
FAIL/V.35: V.35 port in the corresponding GWIM board is not normally working.
FAIL/HSSI: HSSI port in the corresponding GWIM board is not normally working.

SAMSUNG Electronics Co., Ltd.

4-33

CHAPTER 4. ! .

WIMExy
y

Test Category: Test the operation of the VPN accelerator port in a GWIM board.
For the test, this command should be entered after a VPN board(WIMS board) is
mounted on the GWIM board.
xy indicates the location that the GWIM board is mounted.

Display of the Result

PASS: The result of the VPN accelerator test for the corresponding GWIM board
is normal.
FAIL: The result of the VPN accelerator test for the corresponding GWIM board is
abnormal.

LIMMxy
y

Test Category: Inspect the memory in a GPLIM board. This command is used for the test
of DRAM and FLASH in a GPLIM board. This test should be progressed after checking
the normal operation of the GPLIM CARD.
xy indicates the location that the GPLIM board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The status of the GPLIM board memory is normal.
DPRAM: The DPRAM area of the inspected memory is abnormal.
FLASH: The FLASH area of the inspected memory is abnormal.

LIMOxy

4-34

Test Category: Test the operation of the SIO port in a GPLIM board.
For the test, this command should be entered after a DB9 connector that Pin5 and Pin6
are connected each other is installed to the P14 port of a GPLIM board to be tested.
xy indicates the location that the GPLIM board is mounted.

Display of the Result

PASS: The result of the SIO Loop back test for the corresponding GPLIM board is
normal.
FAIL: The result of the SIO Loop back test for the corresponding GPLIM board is
abnormal.

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

LIMIxy
y

Test Category: Test if the ID of a GPLIM board is correctly read.

That is, check if the type of the GPLIM board in a specified slot is equal to the ID
actually read.
xy indicates the location that the GPLIM board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The ID for the corresponding GPLIM board is equal to the type of a
specified board.
Fail: The ID for the corresponding GPLIM board is not equal to the type of the
specified board.

LIMLxy
y

Test Category: Test the operation of register in the L2 Switching chip of a GPLIM
board.
xy indicates the location that the GPLIM board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The register in the L2 Switching chip of the corresponding GPLIM board is
normally working.
FAIL: The register in the L2 Switching chip of the corresponding GPLIM board is
not normally working.

LIMXxyz
y

Test Category: Test if the Auto MDI/MDIX function of Viatech VT6108 chipset,
which is used as 10/100 Mbps Octal PHY of a GPLIM board, is normally operated.
xyz indicates the location that the GPLIM board is mounted and the information to
enable/disable the Auto MDI/MDIX function.
x: Cabinet number(1~3)
y: Slot number(0~B)
z: Information to enable/disable the Auto MDI/MDIX function
Disable: 0
Enable: 1

Display of the Result

PASS: The Auto MDI/MDIX function of the Viatech VT6108 chipset in the
corresponding GPLIM board is normally working.
FAIL: The Auto MDI/MDIX function of the Viatech VT6108 chipset in the
corresponding GPLIM board is normally working.

SAMSUNG Electronics Co., Ltd.

4-35

CHAPTER 4. ! .

SIMMxy
y

Test Category: Inspect the memory in a GSIM board. This command is used for the test of
DRAM and FLASH in a GSIM board. This test should be progressed after checking the
normal operation of the GSIM CARD.
xy indicates the location that the GSIM board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The status of the GSIM board memory is normal.
DPRAM: The DPRAM area of the inspected memory is abnormal.
FLASH: The FLASH area of the inspected memory is abnormal.

SIMOxy
y

Test Category: Test the operation of the SIO port in a GSIM board.
For the test, this command should be entered after a DB9 connector that Tx(Pin2) and
Rx(Pin3) are connected each other is installed to the SIO port of a GSIM board to be
tested.
xy indicates the location that the GSIM board is mounted.

Display of the Result

PASS: The result of the SIO Loop back test for the corresponding GSIM board is
normal.
FAIL: The result of the SIO Loop back test for the corresponding GSIM board is
abnormal.

SIMIxy
y

Test Category: Test if the ID of a GSIM board is correctly read.

That is, check if the type of the GSIM board in a specified slot is equal to the ID actually read.
xy indicates the location that the GSIM board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

4-36

Display of the Result

PASS: The ID for the corresponding GSIM board is equal to the type of a specified
board.
FAIL: The ID for the corresponding GPLIM board is not equal to the type of the
specified board.

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

SIMLxy
y

Test Category: Test the operation of register in the L3 Switching chip of a GSIM board.
xy indicates the location that the GSIM board is mounted.
x: Cabinet number(1~3)
y: Slot number(0~B)

Display of the Result

PASS: The register in the L3 Switching chip of the corresponding GSIM board is
normally working.
FAIL: The register in the L3 Switching chip of the corresponding GSIM board is not
normally working.

SAMSUNG Electronics Co., Ltd.

4-37

CHAPTER 4. ! .

This page is intentionally left blank.

4-38

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

CHAPTER 5. Parts Layout

This chapter provides part layouts for each board in the OfficeServ 7400 system.

SAMSUNG Electronics Co., Ltd.

5-1

CHAPTER 5. ! .

5.1 MP40 Board

Parts Side

5-2

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

Soldering Side

Figure 5.1 MP40 Board Layout

SAMSUNG Electronics Co., Ltd.

5-3

CHAPTER 5. ! .

5.2 LP40 Board

Parts Side

Figure 5.2 LP40 Board Layout

5-4

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.3 8TRK Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-5

CHAPTER 5. ! .

Soldering Side

Figure 5.3 8TRK Board Layout

5-6

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.4 TEPRI Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-7

CHAPTER 5. ! .

Soldering Side

Figure 5.4 TEPRI Board Layout

5-8

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.5 TEPRI2 Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-9

CHAPTER 5. ! .

Soldering Side

Figure 5.5 TEPRI2 Board Layout

5-10

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.6 16SLI Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-11

CHAPTER 5. ! .

Soldering Side

Figure 5.6 16SLI Board Layout

5-12

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.7 16SLI2/16MWSLI Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-13

CHAPTER 5. ! .

Soldering Side

Figure 5.7 16SLI2/16MWSLI Board Layout

5-14

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.8 8HYB Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-15

CHAPTER 5. ! .

Soldering Side

Figure 5.8 8HYB Board Layout

5-16

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.9 8HYB2 Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-17

CHAPTER 5. ! .

Soldering Side

Figure 5.9 8HYB2 Board Layout

5-18

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.10 16DLI Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-19

CHAPTER 5. ! .

Soldering Side

Figure 5.10 16DLI Board Layout

5-20

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.11 16DLI2 Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-21

CHAPTER 5. ! .

Soldering Side

Figure 5.11 16DLI2 Board Layout

5-22

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.12 MGI Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-23

CHAPTER 5. ! .

Soldering Side

Figure 5.12 MGI Board Layout

5-24

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.13 MGI64 Board

Parts Side

Figure 5.13 MGI64 Board Layout

SAMSUNG Electronics Co., Ltd.

5-25

CHAPTER 5. ! .

5.14 4DSL Board

Soldering Side

5-26

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

Parts Side

Figure 5.14 4DSL Board Layout

SAMSUNG Electronics Co., Ltd.

5-27

CHAPTER 5. ! .

5.15 4WLI Board

Parts Side

Figure 5.15 4WLI Board Layout

5-28

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.16 LIM Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-29

CHAPTER 5. ! .

Soldering Side

Figure 5.16 LIM Board Layout

5-30

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.17 PLIM Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-31

CHAPTER 5. ! .

Soldering Side

Figure 5.17 PLIM Board Layout

5-32

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.18 GPLIM Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-33

CHAPTER 5. ! .

Soldering Side

Figure 5.18 GLMP Board Layout

5-34

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.19 GSIM Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-35

CHAPTER 5. ! .

Soldering Side

Figure 5.19 GSIM Board Layout

5-36

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.20 GWIM Board

Parts Side

SAMSUNG Electronics Co., Ltd.

5-37

CHAPTER 5. ! .

Soldering Side

Figure 5.20 GWIM Board Layout

5-38

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.21 MODEM Board

Parts Side

Soldering Side

Figure 5.21 MODEM Board Layout

SAMSUNG Electronics Co., Ltd.

5-39

CHAPTER 5. ! .

5.22 MIS Board

Parts Side

Figure 5.22 MIS Board Layout

5.23 MFM/SCM Board

Parts Side

Soldering Side

Figure 5.23 MFM Board Layout

5-40

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.24 RCM Board

Parts Side

Soldering Side

Figure 5.24 RCM Board Layout

5.25 CRM Board

Parts Side

Figure 5.25 CRM Board Layout

SAMSUNG Electronics Co., Ltd.

5-41

CHAPTER 5. ! .

5.26 RCM2 Board

Parts Side

Figure 5.26 RCM2 Board Layout

5.27 MGI2D Board

Parts Side

Figure 5.27 MGI2D Board Layout

5-42

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.28 LIMD Board

Parts Side

Soldering Side

Figure 5.28 LIMD Board Layout

SAMSUNG Electronics Co., Ltd.

5-43

CHAPTER 5. ! .

5.29 PLIMD Board

Parts Side

Soldering Side

Figure 5.29 PLIMD Board Layout

5-44

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.30 GLIMD Board

Parts Side

Soldering Side

Figure 5.30 GLIMD Board Layout

SAMSUNG Electronics Co., Ltd.

5-45

CHAPTER 5. ! .

5.31 GSIMD Board

Parts Side

Figure 5.31 GSIMD Board Layout

5.32

GWIMD Board
Parts Side

Figure 5.32 GWIMD Board Layout

5-46

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

5.33 GWIMS Board

Parts Side

Figure 5.33 GWIMS Board Layout

SAMSUNG Electronics Co., Ltd.

5-47

CHAPTER 5. ! .

This page is intentionally left blank.

5-48

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

CHAPTER 6. Parts Lists

This chapter proveds the parts lists for the OfficeServ 7400 system.

SAMSUNG Electronics Co., Ltd.

6-1

CHAPTER 6. ! .

6.1 MP40 Board

No

Part Code

Assembly Position

Qtty.

Part Name

Description

0401-001099

D4, D5, D6, D7

DIODE-SWITCHING

DIODE-SWITCHING;1N4148WS, 75 V, 1

0402-001056

D1, D2, D3, D8

DIODE-RECTIFIER

DIODE-RECTIFIER;MBRS140, 40 V, 1 A

0403-001164

ZD1

DIODE-ZENER

DIODE-ZENER;MMSZ5232B, 5.32-5.8

0403-001416

ZD2

DIODE-ZENER

DIODE-ZENER;MMSZ5227B, 3.42-3.7

0501-000476

Q1

TR-SMALL SIGNAL

TR-SMALL SIGNAL;KST5401TA, PNP,

0601-001064

LED1~LED4

LED

LED;SMD, RED/Y-GRN, 1.7 x 2.5 mm, 66

0801-002127

U1, U4, U13, U14

IC-CMOS, LOGIC

IC-CMOS, LOGIC;74FCT16245, TRANS

0801-002128

U27

IC-CMOS, LOGIC

74FCT16244, BUFFE

0801-002367

U26

IDT49FCT3805AQ

IC-CMOS, LOGIC;49FCT3805, BUFFER

10

0802-001029

U2, U3, U30

74LVT16245DGGR

IC-BICMOS, LOGIC;74LVTH16245, TR

11

1006-000281

U33, U34, U35

IC-LINE DRIVER;

MC3487DR2, SOP, 16P

12

1006-000288

U29

IC-LINE RECEIVER

MC3486DR2, SOP, 16P

13

1006-001140

U32

IC-LINE TRANSCEIVER

MAX3232ECAE, SSOP

14

1026130(new)

U22

CPU

MPC8271VRMIBA, Pbga516

15

1053661(new)

U5

RTC

RTC8564NB, son20_w500

16

1103-001289

U25

IC-EEPROM

AT93C46-10SI-.7;93C46, 128 x 8/64 x 16, SO

17

1105-001548

U20, U21, U23, U24

IC-DRAM

K4S561632D-TC60;4X4MX16BIT, T

18

1106-001428

U18, U19

IC-SRAM

K6F8016U6A-EF7, 512KX16BIT, T

19

1107-001473

U16

IC-FLASH MEMORY

K9F2808U0C-PCB0, 16Mx

20

1107-001534

U11, U36

IC-FLASH MEMORY

SST39VF040-70-4C-NH;39VF040, 512K

21

1201-000197

U9

IC-OP AMP

;MC34072, SOP, TP, 8P, 15

22

1203-001643

U17

IC-RESET

DS1706RESA, SOIC, 8P, 150MIL

23

1203-001691

U12, U28

IC-POSI.ADJUST REG

MIC29152BU/T&R.;29152, TO-2

SAMSUNG Electronics Co., Ltd.

6-2

OfficeServ 7400 Service Manual

(continued)
No
24

Part Code
1204-002075

Assembly Position
U7

Qtty.
1

Part Name

Description

IC-MELODY;

M994T-05L, TO-92, 3P, 4

25

1205-000394

U6

IC-CODEC FILTER

TP3057WM, SOP, 1

26

1205-001864

U31

IC-TRANSCEIVER

LXT972LC;DJLXT972ALC, LQF

27

1205-002626

U8

IC-DIGITAL SWITCH

ZL50018QCC, L

28

1301-001647

U15

29

2007-000052

R448, R452, R535, R558,

IC-CPLD

LC4256V-75F256BC, FPBGA

90

R-CHIP:

R-CHIP;10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP:

R-CHIP;10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

100 Kohm, 1%, 1/10 W, TP, R1608_RES

R587, R588, R590, R591,

R594, R595, R629, R630,
R634, R636~R638, R669,
R659~R661, R663, R667,
R3, R23, R24, R72, R96,
R671, R672, R674, R681,
R143, R145, R260~R263,
R715, R719, R727, R684,
R729, R760, R761, R153,
R764, R765, R163, R175,
R281, R285, R326, R275,
R124, R126~R128, R278,
29

2007-000052

R185, R196, R207, R211,

R374, R375, R438, R446,
R226, R232, R233, R214,
R235, R243, R257, R215,
R486, R494, R496, R330,
R334, R338, R342,
R346~R348, R350, R356,
R481, R483, R502, R514,

30

2007-000060

SAMSUNG Electronics Co., Ltd.

R600, R457, R487, R488

6-3

CHAPTER 6. ! .

(continued)
No

Part Code

31

2007-000070

Assembly Position

Qtty.

Part Name

Description

R180, R186, R192, R763,

38

R-CHIP

R-CHIP;0 ohm, 5%, 1/10 W, TP, 1608

24

R-CHIP

MCR03EZPFX, 1.1 kohm, 5%, 1/10 W, TP, 1608

R197, R282, R288~, R291,

R313, R314, R316~, R319,
R420~R422, R424, R426,
R430, R439, R455, R456,
R471, R472, R525, R526,
R739, R743, R755, R762,
R756, R645, R648~R650
32

2007-000208

R585, R592, R604,

R606, R608, R610~R614,
R68, R80, R108, R110,
R616, R617, R619, R620,
R622~R624, R627, R628,
R750

33

2007-001164

R511, R512

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

34

2007-002899

R79, R256, R306, R527

R-CHIP

;10 ohm, 1%, 1/10 W, TP, 1608

35

2007-002906

R95

R-CHIP

200 Kohm, 1%, 1/10 W, TP, 160

36

2007-002987

72

R-CHIP

;4.75 Kohm, 1%, 1/10 W, TP, 16

R87, R274, R286, R287,

R294, R315, R357,
R358, R359, R360~R372,
R615, R639, R641, R668,
R643, R646, R651, R757,
R589, R599, R601~R603

37

2007-002991

R85

R-CHIP

61.9 Kohm, 1%, 1/10 W, TP, 16

38

2007-007049

R90, R473, R632

R-CHIP

22.1 Kohm, 1%, 1/10 W, TP, 16

SAMSUNG Electronics Co., Ltd.

6-4

OfficeServ 7400 Service Manual

(continued)
No

Part Code

39

2007-007226

Assembly Position
R1, R5, R7, R8, R10, R17, R22R25, R27, R34,

Qtty.
309

Part Name
R-CHIP

Description
49.9 ohm, 1%, 1/10 W, TP, 160 3

R42, R57, R66, R69~R71, R73, R76~R78, R81,

R82, R144, R86, R88, R91~R94, R141,
R97~R105, R107, R109, R129~R139, R157,
R158, R147~R151, R154, R161, R162,
R165~R167, R169, R170, R172~R174, R176,
R178, R179, R182, R183, R188, R189, R191,
R194, R195, R199~R201, R209, R213,
R218~R223, R225, R203~R206, R210, R212,
R280, R283, R284, R292, R293, R295~R305,
R307~R312, R327, R328, R320~R325, R339,
R340, R229, R244, R245~R255, R259,
R264~R273, R276, R331, R332, R335~R337,
R352~R355, R343, R344, R376~R379, R386,
R396, R432~R437, R440, R441, R442, R444,
R445, R447, R449, R453, R458~R470, R454,
R503~R505, R474, R475, R477, R478, R493,
R495, R497~R501, R510, R513, R515~R524,
R528~R531, R556, R566, R578, R582~R584,
R586, R593, R596~R598, R607, R609, R621,
R625, R626, R631, R633, R635, R640, R642,
R644, R647, R652~R658, R664~R666, R673,
R676, R677, R679, R680, R682, R683, R685,
R686, R688, R689, R691~R714, R717, R556,
R566, R578, R724~R726, R728, R730, R734,
R735, R741, R749
R758, R759, R662

SAMSUNG Electronics Co., Ltd.

6-5

CHAPTER 6. ! .

(continued)
No

Part Code

40

2007-007237

Assembly Position
R83

Qtty.
1

Part Name
R-CHIP

Description
;24.3 Kohm, 1%, 1/10 W, TP, 16

41

2007-007445

R418

R-CHIP

;9.09 Kohm, 1%, 1/10 W, TP, 16

42

2007-007454

R489, R490,R492, R506~R509

R-CHIP

;332 ohm, 1%, 1/10 W, TP, 1608

43

2007-007507

159

R-CHIP

;2.74 Kohm, 1%, 1/10 W, TP, 16 2

12

R-CHIP

;301 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

R-CHIP;1.91 kohm, 1%, 1/10 W, TP, 16

R532~R534, R536~R555,
R559~R577, R557, R579~R581,
R752, R754, R670, R675, R678,
R687, R690, R707, R712, R716,
R718, R731~R733, R738, R740,
R742, R744, R751, R2, R4, R6,
R9, R11~R15, R28~R33,
R35~R41,R45~R56, R62, R65,
R67, R74, R75, R106, R753,
R111~R123, R140, R142, R146,
R152, R155, R156, R159, R160,
R164, R168, R187, R190, R193,
R198, R202, R208, R216, R217,
R171, R177, R181, R184, R224,
R227, R228, R230, R234,
R236~R242, R258, R329, R333,
R341, R345, R349, R351, R373,
R423, R425, R427, R431, R443

44

2007-007610

R428, R429, R450, R451,

R720~R723, R745~R748

45

2007-008081

SAMSUNG Electronics Co., Ltd.

R419

6-6

OfficeServ 7400 Service Manual

(continued)
No

Part Code

Assembly Position

46

2007-008223

R84

47

2007-008225

R89

48

2011-000585

RA1~RA16

49

2203-000257

C30, C80, C337

50

2203-000626

C39, C40, C61, C62, C196

51

2203-000998

C92~C95,

Qtty.
1

C104,

C112,

C113,

Part Name
R-CHIP

Description
R-CHIP;39.2 Kohm, 1%, 1/10 W, TP, 16

R-CHIP

R-CHIP;226 Kohm, 1%, 1/10 W, TP, 160

16

R-NET

R-NET;47 ohm, 5%, 1/16 W, L, CHIP, 8P

C-CER

C-CER, CHIP;10 nF, 10%, 50 V, X7R, 16

C-CER

C-CER, CHIP;0.022 nF, 5%, 50 V, C0G,

70

C-CER

C-CER, CHIP;0.047 nF, 5%, 50 V, C0G,

C115~C134, C145, C148, C154, C157,

C158, C162, C172, C173, C175, C176,
C178, C203, C305, C314, C330, C333,
C335, C338, C340, C1~C12, C58~C60,
C87
52

2203-000998

C64~C70, C68, C69, C88

C-CER

C-CER, CHIP;0.047 nF, 5%, 50 V, C0G,

53

2203-001408

C78, C79

C-CER

C-CER, CHIP;0.27 nF, 5%, 50 V, NP0, 1

54

2203-002099

C359

C-CER

C-CER, CHIP;0.0068 nF, 5%, 50 V, NP0, 1

55

2203-003027

C28, C31

C-CER

C-CER, CHIP;0.82 nF, 5%, 50 V, NP0, T

56

2203-005249

211

C-CER

C-CER, CHIP;100 nF, 10%, 50 V, X7R, 1 2

C17,

C25,

C33,

C36,

C37,

C38,

C41~C44, C49, C53, C56, C72, C73,

C81,

C84,

C85,

C86,

C90,

C91,

C96~C111, C114, C135~C144, C146,

C147,

C149~C153,

C155,

C156,

C159~C161, C163~C171, C174, C77,

C179~C195, C197~C202, C204~C213,
C215, C216, C217, C218, C220~C297,
C357, C299~C304, C306, C326, C332,
C334, C336, C308~C312, C316~C323
57

2203-005457

C89, C358

C-CER

C-CER, CHIP;1 NF, 10%, 2 KV, X7R, TP,

58

2203-005565

C45, C63, C214, C298, C313

C-CER

C-CER, CHIP;1 nF, 5%, 50 V, NP0, TP, 1

SAMSUNG Electronics Co., Ltd.

6-7

CHAPTER 6. ! .

(continued)
No

Part Code

59

2404-001037

Assembly Position

Qtty.

Part Name

Description

C13, C14, C16, C24, C26,

12

C-TA, CHIP

C-TA, CHIP;10, UF, 10%, 16 V, TP, 35

C-TA, CHIP

C-TA, CHIP;22, UF, 10%, 10 V, GP, TP, 3

C27, C29, C32, C34, C35

60

2404-001051

C54

61

2404-001288

C18~C23

C-TA, CHIP

C-TA, CHIP;2.2UF, 10%, 16 V, WT, TP,

62

2404-001307

C46, C47, C48, C50~C52

C-TA, CHIP

C-TA, CHIP;47UF, 10%, 10 V, LR, TP, 3

63

2409-001034

C15

C-EDL

;1300000UF, 5.5 V, BK, 21

64

2601-001056

T1

TRANS-SMD,

PULSE;350UH, 1:1, 1:

65

2702-001112

L5, L8, L14, L22

INDUCTOR-RADIAL

SBT-0260T;60, UH, 35%, 7.5x8

66

2804-001239

Y2

SCO-100DS(1.8432 MHZ)

OSCILLATOR-CLOCK;1.8432 MHZ, 50P

67

2804-001247

Y4

SCO-10350D-25M

OSCILLATOR-CLOCK;25 MHz, 50, Ppm, 1

68

2804-001302

Y5

SCO-10325DSR-66M

OSCILLATOR-CLOCK;66 MHz, 25, Ppm, 1

69

2804-001496

Y1

SCO-10350SR-16.384

OSCILLATOR-CLOCK;16.384 MHz, 50p

70

2805-001052

Y3

TCXO-STB(20 MHZ)

OSCILLATOR-TCXO;20 MHZ, 4, PPM, 10T

71

2901-000188

M1

72

3301-000317

L10~L13,

FILTER-EMI

CFI06B1H470MF ON BOARD;50 V, 1 A, 4

28

BEAD-SMD

BLM21AF121SN1D;120 ohm, 2012, TP

73

3301-001120

L3, L4, L7, L9, L27, L36,

BEAD-SMD

BLM21P300SPT;30 OHM, 2012, 3000, TP

74

3301-001308

L50~L56, L58~L61

21

BEAD-SMD

BLM11B100SB;10 OHM, 1608, 500, TP

75

3301-001463

L1, L2, L16~L21

BEAD-SMD

BLM11B121SB;120 OHM, 1608, 200, TP

76
77

3403-001144

S3

SWITCH-PUSH

SP-12FH-S;28 V, 100MA, SPDT, ON-

3407-001052

S2

SWITCH-DIP

TD08HOSK1;50 V, 100MA, SLIDE, STA

78

3408-000308

S1

SWITCH-SLIDE

JSS2207;30 V, 200 mA, DPDT

79

3703-001252

P1, P2, P3, P4, P5

CONNECTOR-BACK

89047-102PANEL;30P, 5R, FE

L23~L26,

L28~L35, L38~L49
L37, L63
L65~L71, L6, L15, L64

SAMSUNG Electronics Co., Ltd.

6-8

OfficeServ 7400 Service Manual

(continued)
No

Part Code

80

3709-001139

Assembly Position
SM1

Qtty.
1

Part Name

Description

CONNECTOR-CARD EDGE

CN015R-3123-0;26P, 1.1MM,

81

3710-001432

J1, J2

CONNECTOR-SOCKET

HBB-17AS-2.54D;17P, 1R, 2.54MM

82

3722-002045

J4

JACK-MODULAR

DEK657PCB8-ST4;8P/8C, INVERTED, Y,

83

GA13-10064A

U10

IC ASIC;DCS

STL7065C, QFP, 160P,

84

GA41-00182A

PCB

MAIN-MP40;OFFICESERV 7400,

SAMSUNG Electronics Co., Ltd.

6-9

CHAPTER 6. ! .

6.2 LP40 Board

Level
1

Part Code
GA92-02927A

Assembly Position
-

Qtty.
-

Part Name
PBA MAIN-LP40

Description
OFFICESERV 7400, MULTIPLE, MULTIPLE, MAIN, CONTROL
B'D, ENGINE, EUS, 130 X 275 MM

0202-000108

0.001

SOLDER-CREAM

RMA-20-21L, 20~38 m, 62.8SN/36.8PB/0.4AG, 10%

0202-001091

0.001

SOLDER-BAR

HI-FLO, 20 X 356 X 11, 63SN/37PB

0402-001056

D1, D4

DIODE-RECTIFIER

MBRS140, 40 V, 1A, CASE403A, TP

0403-001164

ZD1

DIODE-ZENER

MMSZ5232B, 5.32-5.88 V, 500MW, SOD-123, TP

0403-001416

ZD2

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500MW, SOD-123, TP

0406-001070

D2, D3

DIODE-TVS

LC03-6, 6.8/-/-V, 750 W, SO-8

0601-001064

LED1, LED2, LED3

LED

SMD, RED/Y-GRN, 1.7 x 2.5 mm, 660/560 nm, 3 x 2.5 x 1.5 mm

IC-CMOS, LOGIC

LED4, LED5, LED6

LED7, LED8
2

0801-002127

U33,

U34,

U35,

U36, U37, U38

2

0801-002446

U30

74FCT16245, TRANSCEIVER, TSSOP, 48, 240MIL, DUAL, ST,

4.5/5.5 V

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173MIL, HEX, TP,

2.0/3.6 V

0802-001029

U32

IC-BICMOS, LOGIC

74LVTH16245, TRANSCEIVER, TSSOP, 48, 240MIL, DUAL, TP,

2.7/3.6 V

0802-001099

U31

IC-BICMOS, LOGIC

74LVTH125, BUFFER, TSSOP, 14, 173MIL, QUAD, TP, 2.7/3.6 V

0902-001747

U29

IC-MICROPROCESSOR

MPC852T, 50MHZ, 32BIT, BGA, 256P, TR, PLSATIC, 1.8 V, 140MW,

1006-000281

U27

IC-LINE DRIVER

DS3487, SOP, 16P, 157MIL, QUAD, ST, PLASTIC, 5.25V, 0to+70C,

0TO+95C, 4/4/8KB, 32BIT, ATM/100

1051 mW, 4, 0

SAMSUNG Electronics Co., Ltd.

6-10

OfficeServ 7400 Service Manual

(continued)
Level
2

Part Code
1006-000288

Assembly Position
U9, U28

Qtty.

Part Name

IC-LINE, RECEIVER

Description
3486, SOP, 16P, 155MIL, QUAD, ST, PLASTIC, 5.25 V, 0to+70C,
1002 mW, 4

1006-001140

U26

IC-LINE

3232, SSOP, 16P, 212MIL, DUAL, TP, PLASTIC, 5.5 V, 0to+70C,

TRANSCEIVER

571 mW, 2, 2
93C46, 128 x 8/64 x 16, SOP, 8P, 5 x 4 mm, 2.7/5.5 V, -40to+85C

1103-001289

U23

IC-EEPROM

1105-001390

U21, U22

IC-DRAM

K4S641632, 1M x 16 x 4BIT, TSOP(II), 54P, 400MIL, 7.5NS, 3.3 V, 10%,

0TO+70C, 30 MA, CMOS, TR

1107-001459

U25

IC-FLASH MEMORY

29LV320D, 32MBIT, 4M x 8/2M x 16BIT, TSOP, 48P, 18.4 x 12 MM, 90NS,

1107-001534

U24

IC-FLASH MEMORY

39VF040, 512K 8BIT, PLCC, 32P, 13.97 x 11.43 MM, 70NS, 2.7/3.6 V,

1203-001643

U18

IC-RESET

1203-002046

U17

IC-POSI.FIXED, REG. 5209, SOP, 8P, 150MIL, PLASTIC, 1.782/1.818, 0to+125C, 500mA, TP

1205-001864

U19

IC-TRANSCEIVER

DJLXT972ALC, LQFP, 64P, 393MIL, PLASTIC, 4 V, 0TO+70C, TR

1205-002004

U20

IC-DIGITAL SWITCH

MT90863, MQFP, 128P, PLASTIC, 3.3 V, 2 W, -40TO+85C, TR

1301-001647

U14

IC-CPLD

2.7/3.6 V, -40TO+85C, 0.2UA

15UA, 0TO+70C, 15UA, TP
DS1706, SOIC, 8P, 150MIL, PLASTIC, -40TO+85C, TP

LC4256V-75F256BC, FPBGA, 256P, 17 x 17 MM, 7.5NS, 3.3 V,

10%, 12.5 MA, 0TO+90C, 160, 160, 16

2007-000043

R116, R117, R121

14

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R124, R118, R119,

R120, R122, R123,
R125, R126, R127,
R128, R541

SAMSUNG Electronics Co., Ltd.

6-11

CHAPTER 6. ! .

(continued)
Level
2

Part Code
2007-000052

Assembly Position
R343, R344, R345, R346, R347,

Qtty.

Part Name

Description

67

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R352, R353, R354, R355, R356,

R359, R360, R362, R364, R365,
R366, R371, R372, R374, R376,
R377, R378, R379, R380,R381,
R382, R383, R384, R385, R386,
R387, R399, R405, R406, R407,
R408, R409, R410, R411, R412,
R413, R414, R415, R611, R612,
R613, R342, R351, R357, R358,
R361, R363, R367, R368, R369,
R370, R373, R375, R388, R389,
R390
2

2007-000052

R398, R402, R543, R610, R614, R615

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

2007-000060

R433

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

2007-000070

R82, R666

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

2007-001164

R444, R445

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

2007-002899

R609

R-CHIP

10 ohm, 1%, 1/10 W, TP, 1608

2007-002987

38

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

22.1 Kohm, 1%, 1/10 W, TP, 1608

R93, R95, R96, R97, R98, R104,

R113, R400, R401, R403, R404,
R593, R594, R595, R596, R616,
R617, R619, R627, R628, R631,
R92, R94, R99, R100, R101, R102,
R103, R105, R115, R618, R629,
R630, R632, R633, R634, R664,
R665

2007-007049

SAMSUNG Electronics Co., Ltd.

R446

6-12

OfficeServ 7400 Service Manual

(continued)
Level
2

Part Code
2007-007226

Assembly Position

Qtty.

Part Name

Description

R1, R83, R84, R88, R138, R139, R193, R195, R196,

145

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

16

R-CHIP

332 ohm, 1%, 1/10 W, TP, 1608

20

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 1608

12

R-CHIP

301 ohm, 1%, 1/10 W, TP, 1608

R205, R207, R216, R217, R218, R320, R322, R327,

R328, R329, R330, R331, R332, R440, R443, R450,
R452, R547, R550, R572, R573, R574, R575, R576,
R577, R578, R579, R580, R589, R590, R591, R592,
R608, R638, R644, R645, R646, R654, R656, R657,
R660, R661, R85, R86, R89, R90, R129, R140, R155,
R156, R157, R166, R167, R168, R172, R173, R174,
R178, R179, R180, R181, R187, R188, R189, R190,
R191, R192, R194, R206, R239, R256, R264, R285,
R319, R321, R324, R325, R326, R341, R434, R435,
R436, R437, R438, R439, R449, R451, R544, R545,
R546, R548, R549, R551, R552, R553, R554, R555,
R581, R582, R583, R584, R585, R586, R587, R588,
R597, R598, R599, R600, R601, R602, R603, R604,
R605, R606, R607, R635, R636, R637, R639, R640,
R641, R642, R643, R647, R648, R649, R650, R651,
R652, R653, R658, R659, R662, R663
2

2007-007454

R424, R425, R426, R427, R428, R429, R430, R114,

R416, R417, R418, R419, R420, R421, R422, R423

2007-007507

R348, R349, R350, R556, R557, R558, R559, R560,

R561, R562, R563, R564, R565, R566, R567, R568,
R569, R570, R571, R655

2007-007610

R519, R520, R525, R526, R531, R532, R537, R538,

R535, R536, R539, R540

SAMSUNG Electronics Co., Ltd.

6-13

CHAPTER 6. ! .

(continued)
Level
2

Part Code
2011-000585

Assembly Position

Qtty.

RA1, RA2, RA3, RA4, RA5, RA6,

53

Part Name
R-NET

Description
47 ohm, 5%, 1/16 W, L, CHIP, 8P, TP,
3.2 x 1.6 x 0.5 mm

RA7, RA8, RA9, RA11, RA12,

RA13, RA15, RA16, RA17, RA18,
RA19, RA20, RA21, RA22, RA23,
RA24, RA25, RA26, RA27, RA28,
RA29, RA30, RA31, RA32, RA36,
RA44, RA45, RA46, RA47, RA49,
RA50, RA51, RA52, RA53, RA54,
RA55, RA56, RA57, RA58, RA59,
RA60, RA80, RA81, RA82, RA83,
RA84, RA85
2

2011-000664

RA61, RA62, RA63, RA64, RA65,

18

R-NET

RA66, RA67, RA68, RA69, RA74,

2.7 Kohm, 5%, 1/16 W, L, CHIP, 8P, TP,

3.2 x 1.6 x 0.5 mm

RA75, RA76, RA78, RA79, RA86,

RA87, RA88, RA89
2

2203-000257

C118, C120, C122, C185, C186

C-CER, CHIP

10 nF, 10%, 50 V, X7R, 1608

2203-000426

C137, C138, C139

C-CER, CHIP

0.018 nF, 5%, 50 V, C0G, 1608

2203-000998

C125, C129, C130, C131, C132,

19

C-CER, CHIP

0.047 nF, 5%, 50 V, C0G, 1608

C133, C134, C146, C147, C204,

C205, C124, C126, C127, C128,
C145, C200, C201, C202
2

2203-001408

C140, C141

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, 1608

2203-002099

C136

C-CER, CHIP

0.0068 nF, 0.25pF, 50 V, C0G, 1608

SAMSUNG Electronics Co., Ltd.

6-14

OfficeServ 7400 Service Manual

(continued)
Level
2

Part Code
2203-005249

Assembly Position
C5, C6, C7, C8, C9, C10, C11, C12, C13,

Qtty.

Part Name

Description

129

C-CER, CHIP

100 nF, 10%, 50 V, X7R, 1608

C-CER, CHIP

1 NF, 10%, 2KV, X7R, TP, 4520

17

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1608

C-TA, CHIP

10, UF, 10%, 16 V, TP, 3528

C14, C15, C16, C17, C18, C19, C20, C21,

C22, C23, C24, C25, C26, C27, C31, C34,
C35, C37, C43, C44, C45, C46, C47, C48,
C49, C50, C52, C53, C54, C55, C56, C57,
C58, C59, C60, C61, C62, C63, C64, C65,
C66, C67, C68, C69, C70, C71, C72, C73,
C74, C75, C76, C77, C78, C79, C80, C81,
C82, C83, C84, C85, C86, C87, C88, C89,
C90, C91, C92, C93, C94, C95, C96, C97,
C98, C99, C100, C101, C102, C103, C104,
C105, C106, C108, C109, C113, C119,
C167, C168, C169, C177, C187, C188,
C189, C190, C191, C192, C193, C28, C29,
C30, C32, C33, C51, C116, C117, C170,
C171, C172, C173, C174, C175, C176,
C194, C195, C196, C207-C212
2

2203-005457

2203-005565

C142, C143, C144, C206

C182, C183, C184, C153, C154, C155,
C156, C157, C158, C159, C160, C161,
C162, C163, C164, C165, C166

2404-001037

C1, C2, C3, C4, C178, C179

2404-001288

C36

C-TA, CHIP

2.2, UF, 10%, 16 V, WT, TP, 3216

2601-001056

T1

TRANS-SMD,

350, UH, 1:1, 1:1, 12.7 X 6.73 X 5.97 MM, TP

C180, C181

PULSE

SAMSUNG Electronics Co., Ltd.

6-15

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2703-000388

L20

INDUCTOR-SMD

470, UH, 5%, 3225

2804-001239

Y3

OSCILLATOR-CLOCK

1.8432 MHZ, 50, PPM, 15PF, TP, 3.3 V, 16 MA

2804-001325

Y1

OSCILLATOR-CLOCK

50 MHz, 50, Ppm, 10TTL, 15pF, TP, 3.3 V, 40 mA

2804-001496

Y2

OSCILLATOR-CLOCK

16.384 MHz, 50, Ppm, 10TTL, 15pF, TP, 3.3 V, 40 mA

3301-001120

10

BEAD-SMD

30O HM, 2012, 3000, TP, 0.015

20

BEAD-SMD

10O HM, 1608, 500, TP, 0.15

L1, L2, L3, L4, L5, L6,

L7, L8, L9, L10

3301-001308

L12, L13, L14, L15,

L16, L18, L19
L11, L17, L21, L22,
L23, L24
L25-L31

3403-001144

S1

SWITCH-PUSH

28 V, 100MA, SPDT, ON-OFF

3703-001252

P1, P2, P3, P4

CONNECTOR-BACK,

30P, 5R, FEMALE, ANGLE-F, AU30U

PANEL
2

3704-000249

3710-001659

U24

P5, P6, P7, P8, P9,

P10
2

3711-003272

P11

SOCKET-IC

32P, PLCC, SN, 1.27 mm

SOCKET-BOARD TO

40P, 2R, 0.8 MM, SMD-S, AUF, NTR

BOARD
1

HEADER-BOARD TO

BOX, 10P, 2R, 2.54 mm, STRAIGHT, AUF, BLK

CABLE
2

3722-002045

P13

JACK-MODULAR

8P/8C, INVERTED, Y, ANGLE, N, BLK, AU15U

6002-000154

SCREW-TAPPING

PH, +, 2, M3, L8, ZPC(YEL), SWRCH18A, P1.35

GA13-10064A

U15, U16

DCS, STL7065C, QFP, 160P

GA41-00183A

PCB MAIN-LP40

OFFICESERV 7400, FR4, 6L, 01, 1.6T, 130 X 275 MM

GA68-00289A

LABEL(P)-BAR, CODE

KEY, PHONE, POLYESTER, T0.05, W6.5, L37.5, WHT, WHT

GA72-00242A

PMO-LEN, LENS-2

SME, PMMA, TRP, T2.0, HI-855M, UL94-HB

SAMSUNG Electronics Co., Ltd.

6-16

OfficeServ 7400 Service Manual

(continued)
Level
2

Part Code
GA97-01931A

Assembly Position
-

Qtty.
1

Part Name

Description

MEA-LP40 STIFF

OFFICESERV 7400, STA, USA, LP40 STIFFENER, LP40 SHIELD,

ASSY

EJECTOR

6003-000264

SCREW-TAPTITE

PWH, +, B, M3, L6, ZPC(YEL), SWRCH18

GA70-00075A

IPR-SHIELD, PLATE,

OFFICESERV7400, STS304, T0.25, W39.4, PASS, L126.4

GA72-00240A

PMO-EJECTOR

SME, PC/ABS, BLANK K2571, T2.5, NH-1000T, UL94-V0

GA72-00362A

PMO-STIFFENER,

OFFICESERV7400, PC/ABS, SIL, 132 X 45 X 33.5, NH-1000T,

LP40

UL94-V0

LP40

SAMSUNG Electronics Co., Ltd.

6-17

CHAPTER 6. ! .

6.3 8TRK Board

Level
2

Part Code
GA92-02769A

Assembly Position
-

Qtty.
1

Part Name

Description

PBA MAIN-8PORTA

OFFICESERV 7400, DOM/EXP, KOREA,

NALOGTRUNK

8PORTANALOGTRUNK, FR-4, 4, L, 130*275*1.6T, 8 TRK

0401-001099

D7-D38

31

DIODE-SWITCHING

1N4148WS, 75 V, 150MA, SOD-323, TP

0402-001207

D5, D6

DIODE-SCHOTTKY

UPS5819, 40 V, 1000 MA, DO-216AA, TP

0403-000549

ZD17-ZD32

16

DIODE-ZENER

RLZJ24B, 23.61-24.92 V, 500 MW, LL-34, TP

0403-001416

ZD1-ZD16

16

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500 MW, SOD-123, TP

0501-000477

Q1-Q16

16

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

0601-001064

LED1-LED8

LED

SMD, RED/Y-GRN, 1.7X2.5 MM, 660/560 NM,

3X2.5X1.5 MM

0604-001002

PC1-PC8

PHOTO-COUPLER

TR, 100-600 %, 200 mW, SOP-4, TP

0802-000111

U18, U39

IC-BICMOS, LOGIC

74FCT245, BUS TRANSCEIVER, SOP, 20, 300 MIL,

0802-001084

U34, U35

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP,

1205-000394

U7-U14

IC-CODEC FILTER

TP3057 WM, SOP, 16P, PLASTIC, 5.2

OCTAL, ST, 4.75/5.25 V

4.5/5.5 V
3

2003-000293

R101-R108

R-METAL OXIDE

4.7 Kohm, 5%, 2 W, AA, TP, 6x16 mm

2007-000043

R85-R100

16

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

2007-000052

R109-R116

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

2007-000060

R82

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

2007-000063

R117-R124

R-CHIP

150 Kohm, 1%, 1/10 W, TP, 1608

2007-000070

R8-R15

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

2007-000287

R133, R134, R32,

31

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R-CHIP

1 Mohm, 1%, 1/10 W, TP, 1608

R34-R53, R74-R81
3

2007-000475

SAMSUNG Electronics Co., Ltd.

R84

6-18

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-007277

R125-R132

R-CHIP

392 ohm, 1%, 1/10 W, TP, 1608

2007-007547

R135-R145

11

R-CHIP

2.43 Kohm, 1%, 1/10 W, TP, 1608

2203-000236

C38

C-CER, CHIP

0.1 NF, 5%, 50 V, C0G, TP, 1608

2203-000257

C40-C42, C45, C46

C-CER, CHIP

10 nF, 10%, 50 V, X7R, TP, 1608

2203-005249

C21-C37, C68, C88,

20

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-FILM, LEAD-PEF

2200 nF, 10%, 250 V, TP, 18x8.5x14.5

C89
3

2305-001053

C64-C67, C69-C71,

U38
3

2402-000120

2402-000170

C18, C20, C48-C55

10

C-AL, SMD

10, UF, 2 %, 50 V, GP, TP, 6.6X6.6X5.4 MM

C1-C4, C6-C17,

24

C-AL, SMD

1, UF, 20%, 50 V, GP, TP, 4.3x4.3x5.4

RELAY-MINIATURE

5 VDC, 140 MW, 2000 MA, 2FORMC, 4 MS, 4 MS

CONNECTOR-BACK,

30, P, 5, R, FEMALE, ANGLE-F, AU30U

C56-C63
3

3501-001035

K1-K16

16

3703-001252

P1, P2

3722-002045

J1

4715-000127

DSS1-DSS24

EC27-30514A

L1

EC39-00002A

C72-C87

GA13-00004A

U5, U6

PANEL
24
1
16

JACK-MODULAR

8P/8C, INVERTED, Y, ANGLE, N, BLK, AU15U

SURGE ABSORBER

300 V, 15%, 500 A

COIL, RF

INFOREX, 35, UH, 40 T

CBF HARNESS-BH39

COREX-L, AWG22(0.6PI), 52 MM, AWG22(0.6, PI)

-40305U
2

IC ASIC-TMC

STL7053E, IDCS500, PREMIUM, 60, PIN, 5 V, QFP, TR

GA13-10002A

HYB9-HYB16

IC ASIC

DCS/COMPACT EURO, KP-PRS, SIP, 8

GA13-10068A

HYB1-HYB8

IC HYBRID

STA-1224, DANA/KP-0039SA-T, DIP

GA13-10577A

HYB17-HYB20

IC HYBRID

COMPACT2, KP0054SA, DIP, 17, 45 mm

GA26-50068A

T1-T8

TRANS MATCHING-

MATCHING TRANS, 2000 VAC, 600/600

DCS
3

GA41-00137A

SAMSUNG Electronics Co., Ltd.

PCB-8TRK

OFFICESERV 7400, FR-4, 4, L, 00, 1.6T, 130X275 MM

6-19

CHAPTER 6. ! .

6.4 TEPRI Board

Level
2

Part Code
GA92-02767A

Assembly Position
-

Qtty.
1

Part Name

Description

PBA MAIN-T1, E1,

OFFICESERV 7400, DOM/EXP, WORLD, T1, E1, PRI INTERFACE,

PRI INTERFACE

FR-4, 6L, 130*275*1.6T, TEPRI

0402-001081

D11-D18

DIODE-RECTIFIER

RGF1D, 200V, 1A, DO-214BA, TP

0403-001164

ZD1, ZD2

DIODE-ZENER

MMSZ5232B, 5.32-5.88 V, 500 MW, SOD-123, TP

0406-000127

TVS1, TVS3

DIODE-TVS

P6KE18CA, 17.1/18/18.9 V, 600 W, DO

0406-001073

U37, U38

DIODE-TVS

LC01-6, 8/-/-V, 1500 W, SO-16

0601-001064

LED1-LED8

LED

SMD, RED/Y-GRN, 1.7X2.5 MM, 660/560 NM, 3X2.5X1.5 MM

0801-000547

U33

IC-CMOS, LOGIC

74ACT273, D FLIP-FLOP, SOP, 20, 300 MIL, OCTAL, ST, 4.5/5.5 V

0801-002325

U6

IC-CMOS, LOGIC

74LCX04, INVERTER, TSSOP, 14, 173 MIL, HEX, TP, 2.0/3.6 V

0801-002326

U4, U25

IC-CMOS, LOGIC

74LCX32, OR GATE, TSSOP, 14, 173 MIL, QUAD, TP, 2.0/3.6 V

0801-002381

U34

IC-CMOS, LOGIC

74LCX138, DECODER/DEMULTIPLEXE, SOP, 16, 150 MIL,

SINGLE, TP, 2.0/3.6 V

0801-002446

U19, U20

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173 MIL, HEX, TP,

2.0/3.6 V

0801-002518

U13-U15

IC-CMOS, LOGIC

74LCX157, 2-INPUT MULTIPLEXER, TSSOP, 16P, 173 MIL, QUAD,

TP, PLASTIC, 0.55 V40to+85

0801-002711

0802-000111

U11
U21-U23, U26-U32,

1
11

IC-CMOS, LOGIC

74LCX86, XOR GATE, TSSOP, 14, 173MIL, QUAD, TP, 2.0/3.6 V

IC-BICMOS, LOGIC

74FCT245, BUS TRANSCEIVER, SOP, 20, 300 MIL, OCTAL, ST,

U8

4.75/5.25 V

0802-001084

U39

IC-BICMOS, LOGIC

0902-000231

U2

IC-MICROPROCESSOR

74ABT125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 4.5/5.5 V

68302, 16.67 MHZ, 16BIT, QFP, 132P, A6, TR, PLASTIC, 5 V,
525 MW, 0TO+70C, 1152 x 8 BIT, 24 BIT,

1006-001140

U1

IC-LINE TRANSCEIVER

3232, SSOP, 16P, 212 MIL, DUAL, TP, PLASTIC, 5.5 V, 0to+70C,
571 mW, 2, 2

SAMSUNG Electronics Co., Ltd.

6-20

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
1105-001114

Assembly Position
U16

Qtty.
1

Part Name
IC-DRAM

Description
4F151611, 1 M x 16 BIT, TSOP, 44P, 400 MIL, 60NS, 5 V, 10%,
PLASTIC, 0TO+70C, 1MA, CMOS, ST

1106-001136

U24

IC-SRAM

7C136, 2 K x 8 BIT, QFP, 52P, 10 x 10 MM, 55NS, 5 V, 10%,

PLASTIC, 0TO+70C, 15MA, CMOS, TR

1107-001079

U17

IC-FLASH MEMORY

29F800, 1 M x 8/512 K x 16, TSOP, 48P, 18.4 x 12 mm, 4.5/5.5 V,

0to+70C

1203-001643

U35

IC-RESET

DS1706, SOIC, 8P, 150 MIL, PLASTIC40TO+85C, TP

1205-001191

U36

IC-FRAMER

PEB2254H, QFP, 80P, 300 MIL, PLASTI

1301-001499

U9

IC-CPLD

4A5, TQFP, 44P, 10 x 10 mm, 10 nS, 5, 5 %

1404-001115

THER1-THER4

2007-000052

R10-R19, R1000,

2007-000052

R194-R199,

THERMISTOR-PTC

0.1 ohm, 30%, 30 Vac, 40A, 2.2A, BK

14

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

18

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

12

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

10

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

22

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

R186, R189, R192

R20-R30, R201, R3
3

2007-000052

R301-R308, R31,
R32, R352, R4

2007-000052

R73-R75, R77, R79,

R81-R84, R87

2007-000052

R88, R89, R903-R920,

R91, R92

2007-000052

R922-R924, R926,
R967, R969, R971

2007-000052

2007-000070

R972, R984,
R994-R999

SAMSUNG Electronics Co., Ltd.

R123, R76, R964-R966

6-21

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-000287

Assembly Position
R1, R101, R151, R193,

Qtty.

Part Name

Description

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

15

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R2, R200, R242

3

2007-000287

R5, R78, R850,

R928-R938, R95

2007-000287

R985-R987

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

2007-000536

R973

R-CHIP

200 ohm, 1%, 1/10 W, TP, 1608

2007-000969

R974, R975

R-CHIP

5.1 ohm, 1%, 1/10 W, TP, 1608

2007-002901

R979

R-CHIP

12.1 Kohm, 1%, 1/10 W, TP, 1608

2007-007302

R137, R970

R-CHIP

24.9 ohm, 1%, 1/10 W, TP, 1608

2007-007454

R251-R258

R-CHIP

332 ohm, 1%, 1/10 W, TP, 1608

2007-007645

85

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

27

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R202-R241, R243-R248,
R33-R71

2007-007645

R86, R90, R93, R94,

2007-007645

R988-R993

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

2007-008105

R976, R977

R-CHIP

18.2 ohm, 1%, 1/10 W, TP, 1608

2007-008111

R978

R-CHIP

191 ohm, 1%, 1/10 W, TP, 1608

2007-008122

R102-R113, R85

13

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

2203-000041

C165, C166

2203-000236

C10-C12, C158, C17-C22,

2203-000236

C6-C9, C88-C96

2203-000257

2203-001408

R939-R960, R962

C-CER, CHIP

0.01 NF, 0.25PF, 50 V, C0G, TP, 1608

12

C-CER, CHIP

0.1 NF, 5%, 50 V, C0G, TP, 1608

13

C-CER, CHIP

0.1 NF, 5%, 50 V, C0G, TP, 1608

C190

C-CER, CHIP

10 nF, 10%, 50 V, X7R, TP, 1608

C188, C189, C191-C193

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, TP, 1608

C52, C53

SAMSUNG Electronics Co., Ltd.

6-22

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2203-003027

Assembly Position
C164

2203-005009

C167, C168

2203-005249

C1, C13-C16, C156,

2203-005249

C169-C187, C194,

2203-005249

C26-C29, C3-C5,

Qtty.
1

Part Name

Description

C-CER, CHIP

0.82 nF, 5%, 50 V, NP0, TP, 1608

C-CER, CHIP

0.0056 nF, 0.25, PF, 50 V, NP0, TP, 1608

11

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

23

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

13

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C159-C163
C195, C2, C23
C31-C34, C61, C81
3

2203-005249

C82-C86

2203-005457

C197, C198

C-CER, CHIP

1 NF, 10%, 2 KV, X7R, TP, 4520

2402-000204

C157, C56

C-AL, SMD

10, UF, 20%, 16 V, WT, TP, 4.3 x 4.3 x 5.4

2602-000054

T1, T2

TRANS-PULSE

4 MH, 1:1.41, 14 x 12.5 x 13 MM, TR

2801-004043

Y7

CRYSTAL-SMD

12.352 MHZ, 15, PPM, 28-ABX, 18PF, 50 OHM, TP

2801-004044

Y5, Y6

CRYSTAL-SMD

16.384 MHZ, 20, PPM, 28-ABX, 18PF, 50 OHM, TP

2804-001453

Y4

OSCILLATOR-CLOCK

32.768 MHZ, 50, PPM, TTL, TP, 3.3 V, 40MA

2804-001496

Y1

OSCILLATOR-CLOCK

16.384 MHZ, 50, PPM, 10 TTL, 15PF, TP, 3.3V, 16MA

2901-000188

B14-B18

FILTER-EMI ON

50 V, 1 A, 47pF, 7.5 x 2.5 x 6.2 mm, TP

BOARD
3

3301-001308

B13, B3-B9, L1

BEAD-SMD

10 ohm, 1608, 500 mA, TP, 0.15 ohm

3403-001104

S2

SWITCH-PUSH

28 V, 0.4A, 1P, MOMENTARY, D2.8(Plunger)

3404-001008

SW2

SWITCH-TACT

15 V, 50MA, 160GF, 6 x 6 x 5 MM, SPST

3407-000131

S1

SWITCH-DIP

24 V, 300mA, SLIDE, STANDARD

3703-001252

P26, P27

CONNECTOR-BACK,

30P, 5R, FEMALE, ANGLE-F, AU30U

3710-000001

J1, J2, JP3-JP9

PANEL

SAMSUNG Electronics Co., Ltd.

CONNECTOR-SHUNT 2P, 1R, STRAIGHT, AUF

6-23

CHAPTER 6. ! .

(continued)
Level
3

Part Code
3710-001659

Assembly Position
P18, P19

Qtty.
2

Part Name
CONNECTOR-

Description
40P, 2R, 0.8 MM, SMD-S, AUF, NTR

SOCKET
3

3711-001465

J1, J2, JP3-JP9

CONNECTOR-HEADER NOWALL, 3P, 1R, 2.54 mm, STRAIGHT, A

3711-003272

P12

CONNECTOR-HEADER BOX, 10P, 2R, 2.54 mm, STRAIGHT, AU

3722-001050

P11

JACK-MODULAR

8P/8C 2, STANDARD, Y, ANGLE, STANDARD, N, BLK, AU50U

4711-000162

U10

DELAY, LINE

200ns, 8.1 x 19.8 x 6.4 mm, ST

4715-000127

SUR1-SUR6

SURGE ABSORBER

300 V, 15%, 500A

GA41-00135A

PCB-TEPRI

OFFICESERV 7400, FR -4, 4L, 00, 1.6T, 130 x 275 MM

SAMSUNG Electronics Co., Ltd.

6-24

OfficeServ 7400 Service Manual

6.5 TEPRI2 Board

Level
1

Assembly

Part Code
GA92-02935A

Position
-

Qtty.
1

Part Name
PBA MAIN-TEPRI2

Description
OFFICESERV 7400, DOM/EXP, WORLD, T1, E1, PRI INTERFACE,
FR-4, 130 x 275 MM

0401-001099

D2

DIODE-SWITCHING

1N4148WS, 75 V, 150MA, SOD-323, TP

0402-001056

D1

DIODE-RECTIFIER

MBRS140, 40 V, 1 A, CASE403A, TP

0403-001164

ZD4

DIODE-ZENER

MMSZ5232B, 5.32-5.88 V, 500MW, SOD-123, TP

0403-001416

ZD3

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500MW, SOD-123, TP

0406-001070

D3, D4

DIODE-TVS

LC03-6, 6.8/-/-V, 750 W, SO-8

0406-001073

D5-D8

DIODE-TVS

LC01-6, 8/-/-V, 1500 W, SO-16

0406-001074

D9, D10

DIODE-TVS

SRDA3.3-4, 3.5/-/-V, 500W, SO-8

0406-001230

ZD1, ZD2

0601-001064

LED1-LED12

0801-002127

U15, U16, U17

2
12
3

DIODE-TVS

P6SMB18CAT3G, 17.1/18/18.9 V, 600W, SMB

LED

SMD, RED/Y-GRN, 1.7 x 2.5 MM, 660/560 NM, 3 x 2.5 x 1.5 MM

IC-CMOS, LOGIC

74FCT16245, TRANSCEIVER, TSSOP, 48, 240MIL, DUAL, ST,

4.5/5.5 V

0802-001029

U11, U13

IC-BICMOS, LOGIC

74LVTH16245, TRANSCEIVER, TSSOP, 48, 240MIL, DUAL, TP,

2.7/3.6 V

0802-001037

U4

IC-BICMOS, LOGIC

74LVT245, BUS TRANSCEIVER, TSSOP, 20, 173MIL, OCTAL, TP,

2.7/3.6 V

1006-001140

U1

IC-LINE

3232, SSOP, 16P, 212MIL, DUAL, TP, PLASTIC, 5.5 V, 0to+70C571 mW, 2, 2

TRANSCEIVER
2

1103-001289

U8

IC-EEPROM

93C46, 128 x 8/64 x 16, SOP, 8P, 5 x 4 mm, 2.7/5.5 V, -40to+85C

1105-001390

U18, U21

IC-DRAM

K4S641632, 1M x 16 x 4 BIT, TSOP(II), 54P, 400 MIL, 7.5NS, 3.3 V, 10%,

0TO + 70C, 30MA, CMOS, TR

1106-001058

SAMSUNG Electronics Co., Ltd.

U14

IC-SRAM

71321, 2KX8BIT, TQFP, 64P, 10 x 10 MM, 35NS, 5 V, 10%

6-25

CHAPTER 6. ! .

(continued)
Level

Part Code

1107-001459

Assembly Position
U20

Qtty.

Part Name

Description

IC-FLASH MEMORY

29LV320D, 4M x 8/2M x 16, TSOP, 48P, 18.4 x 12 mm, 2.7/3.6 V, -40

to + 85C

1107-001534

U19

IC-FLASH MEMORY

39VF040, 512Kx8BIT, PLCC, 32P, 13.97 X 11.43MM, 70NS, 2.7/

3.6 V, 15UA

1203-001643

U3

IC-RESET

DS1706, SOIC, 8P, 150MIL, PLASTIC, -40TO+85C, TP

1203-002046

U10

IC-POSI.FIXED REG.

5209, SOP, 8P, 150MIL, PLASTIC, 1.782/1.818, 0to+125C, 500

1205-001864

U2

IC-TRANSCEIVER

DJLXT972ALC, LQFP, 64P, 393MIL, PLASTIC, 4 V, 0TO+70C, TR

1205-002786

U6, U7

IC-FRAMER

PEF2256H, QFP, 80P, 14 x 14 mm, PLASTIC

1301-001647

U5

IC-CPLD

LC4256V-75F256BC, FPBGA, 256P, 17 x 17 MM, 7.5NS, 3.3 V,

10%, 12.5MA, 0TO+90C, 160, 160, 16

1404-001115

2007-000052

THY1-THY5

THERMISTOR-PTC

0.1 ohm, 30%, 30Vac, 40 A, 2.2A, BK

R12-R14, R21, R28,

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10W, TP, 1608

R-CHIP

4.75 Kohm, 1%, 1/10W, TP, 1608

R-CHIP

4.75 Kohm, 1%, 1/10W, TP, 1608

R-CHIP

4.75 Kohm, 1%, 1/10W, TP, 1608

R-CHIP

4.75 Kohm, 1%, 1/10W, TP, 1608

R48, R49
2

2007-000052

R52, R53, R63, R73,

R74, R76

2007-000052

R79, R81, R82, R84,

R85, R87

2007-002987

R45, R46, R50, R51,

R54, R55

2007-002987

R60, R61, R90, R91,

R93, R94

2007-002987

R95-R97, R101,
R102

2007-002987

SAMSUNG Electronics Co., Ltd.

R103-R106, R114

6-26

OfficeServ 7400 Service Manual

(continued)
Level
2

Part Code
2007-002987

Assembly Position

Qtty.

Part Name

Description

R120, R131, R224,

R-CHIP

4.75 Kohm, 1%, 1/10W, TP, 1608

R226, R228
2

2007-002987

R286, R299-R301

R-CHIP

4.75 Kohm, 1%, 1/10W, TP, 1608

2007-007049

R11

R-CHIP

22.1 Kohm, 1%, 1/10W, TP, 1608

2007-007226

R3-R10, R15, R16,

12

R-CHIP

49.9 ohm, 1%, 1/10W, TP, 1608

13

R-CHIP

49.9 ohm, 1%, 1/10W, TP, 1608

R-CHIP

49.9 ohm, 1%, 1/10W, TP, 1608

10

R-CHIP

49.9 ohm, 1%, 1/10W, TP, 1608

13

R-CHIP

49.9 ohm, 1%, 1/10W, TP, 1608

12

R-CHIP

49.9 ohm, 1%, 1/10W, TP, 1608

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

31

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

R18, R20
2

2007-007226

R22-R27,
R29-R34, R56

2007-007226

R64-R67, R69,
R70, R75

2007-007226

R77, R78, R80,

R107-R113

2007-007226

R115-R119, R121,
R124-R130

2007-007226

R133-R141, R143,
R144, R148

2007-007226

R152-R154,
R161-R165

2007-007226

R167-R181,
R184-R199

2007-007226

R215, R216, R219,

R222, R227

2007-007226

R229-R231,
R233-R236

SAMSUNG Electronics Co., Ltd.

6-27

CHAPTER 6. ! .

(continued)
Level
2

Part Code
2007-007226

Assembly Position

Qtty.

Part Name

Description

R238-R249, R254,

15

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

R202-R214

13

R-CHIP

332 ohm, 1%, 1/10 W, TP, 1608

R89, R92, R99,

35

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

604 ohm, 1%, 1/10 W, TP, 1608

R-NET

47 OHM, 5%, 1/16 W, L, CHIP, 8P, TP

R257, R262
2

2007-007226

R275, R277, R281,

R287, R290

2007-007226

R291, R297, R309,

R314, R315

2007-007226

R318, R322-R324,
R327, R328

2007-007454

2007-007507

R100, R122
2

2007-007507

R142, R145, R146,

R149-R151

2007-007507

R155-R160, R265,
R266

2007-007507

R269-R274, R278,
R280

2007-007507

R283, R288, R293,

R295

2007-007507

R298, R302, R305,

R307

2007-007776

R296

2011-000585

RA1-RA24

24

2203-000236

C30, C32

SAMSUNG Electronics Co., Ltd.

C-CER, CHIP

0.1n F, 5%, 50 V, C0G, 1608

6-28

OfficeServ 7400 Service Manual

(continued)
Level
2

Part Code
2203-000257

Assembly Position
C7, C27, C37, C107,

Qtty.

Part Name

Description

C-CER, CHIP

10 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

0.047 NF, 5%, 50 V, C0G, TP, 1608

C-CER, CHIP

0.047 NF, 5%, 50 V, C0G, TP, 1608

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, TP, 1608

C160, C161
2

2203-000998

C17, C18, C26, C44,

C78-C81

2203-000998

C83-C86,
C167-C170, C179

2203-001408

C3, C4, C12, C13,

C20.C21

2203-001656

C96

C-CER, CHIP

0.47 nF, 5%, 50 V, NP0, TP, 1608

2203-002099

C38

C-CER, CHIP

0.0068 NF, 0.25, PF, 50 V, C0G, TP, 1608

2203-005218

C24, C25

C-CER, CHIP

470 nF, 10%, 50 V, X7R, TP, 3216

2203-005249

C2, C8-C11, C19, C35,

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C36
2

2203-005249

C43, C45-C71, C73

29

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2203-005249

C75-C77, C82, C87-C95

13

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2203-005249

C97-C106, C108-C136

39

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2203-005249

C138-C158, C163-C166

25

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2203-005249

C172-C178

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2203-005457

C1, C5, C6, C171

C-CER, CHIP

1 NF, 10%, 2KV, X7R, TP, 4520

2203-005565

C42, C72, C74, C137

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1608

2404-001037

C14, C22, C23, C28, C29

C-TA, CHIP

10, UF, 10%, 16 V, TP, 3528

2404-001037

C31, C33, C34, C159

C-TA, CHIP

10, UF, 10%, 16 V, TP, 3528

SAMSUNG Electronics Co., Ltd.

6-29

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2601-001056

T1

TRANS-SMD, PULSE

350, UH, 1:1, 1:1, 12.7 X 6.73 X 5.97 MM, TP

2601-001139

T2, T3

TRANS-SMD, PULSE

1 MH, 0.85 OHM, 12.83 X 9.53 X 6.22 MM, TAPE & REEL

2703-000388

L9

INDUCTOR-SMD

470, UH, 5%, 3225

2804-001239

Y3

OSCILLATOR-CLOCK

1.8432 MHZ, 50, PPM, 3.3 V

2804-001325

Y2

OSCILLATOR-CLOCK

50 MHZ, 50, PPM, 10 TTL &, CMOS, TP, 3.3 V, 40 MA

2804-001602

Y1, Y4

OSCILLATOR-CLOCK

16.384 MHZ, 25, PPM, 10 TTL 15, PF, TP, 3.3 V, 16 MA

2901-000188

M1, M2

FILTER-EMI ON

50 V, 1 A, 47, PF, 7.5 x 2.5 x 6.2 mm, TP

BOARD
2

3301-001120

L2-L4, L6-L8, L10-L12,

10

BEAD-SMD

30 ohm, 2 x 1.25 x 0.85 mm, 3000 mA, TP, 0.015 ohm

L17
2

3301-001308

L1, L5, L13-L16

BEAD-SMD

10 ohm, 1608, 500 mA, TP, 0.15 ohm

3403-001144

S1

SWITCH-PUSH

28 V, 100 MA, SPDT, ON-OFF,

3407-001067

S2, S3

SWITCH-DIP

5 V, 100 MA, SLIDE, STANDARD

3703-001252

P1-P3

CONNECTOR-BACK,

30P, 5R, FEMALE, ANGLE-F, AU30U

PANEL
2

3704-000249

U19

SOCKET-IC

32P, PLCC, SN, 1.27 mm

3710-000001

J1-J4

CONNECTOR-SHUNT

2P, 1R, STRAIGHT, AUF

3711-001465

J1-J4

CONNECTOR-HEADER

NOWALL, 3P, 1R, 2.54mm, STRAIGHT, A

3722-001049

P5

JACK-MODULAR

8P/8C 4, STANDARD, Y, ANGLE, INVERTED, N, BLK, AU50U

4715-001082

SUR1-SUR12

SURGE ABSORBER

300 V, 15%, 1500 A, SMD

6002-000154

SCREW-TAPPING

PH, +, 2, M3, L8, ZPC(YEL), SWRCH18A, P1.35

GA13-10064A

U9

IC ASIC

DCS, STL7065C, QFP, 160P,

SAMSUNG Electronics Co., Ltd.

12

6-30

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

GA41-00179A

01

PCB-TEPRI2

OFFICESERV 7400, ROH, 6, 01, 1.6T, 130 X 275 MM

GA68-00289A

XX

LABEL(P)-BAR, CODE

KEY, PHONE, POLYESTER, T0.05, W6.5, L37.5, WHT, WHT

GA72-00241A

PMO-LEN, LENS-2

SME, PMMA, TRP, T1.0, IF-830, UL94-HB

GA97-01930A

6003-000264

GA70-00076A

Part Name

Description

MEA-TEPRI2 STIFF

OFFICESERV 7400, STA, USA, TEPRI2 STIFFENER, TEPRI2

ASSY

SHIELD, EJECTOR

SCREW-TAPTITE

PWH, +, B, M3, L6, ZPC(YEL), SWRCH18

IPR-SHIELD, PLATE

OFFICESERV SME, STS304, T0.3, W126.4, PASS, L39.4

TEPRI2
3

GA72-00240A

GA72-00361A

SAMSUNG Electronics Co., Ltd.

PMO-EJECTOR

SME, PC-ABS, BLACK, T2.5, NH-1000T, ULU94-V0

PMO-STIFFENER

OFFICESERV SME, PC-ABS, SILVER, 132X45X33.6,

TEPRI

NH-1000T, UL94-V0

6-31

CHAPTER 6. ! .

6.6 8SLI Board

Level

Part Code

Assembly Position

Qtty.

KP-OSDB8S

GA92-02768A

Part Name

Description

PBA MAIN-8PORTAN

OFFICESERV 7200, DOM/EXP, KOR,

ALOGSUBSCRIBE

8PORTANALOGSUBSCRIBE, FR-4, 4L, 130*275*1.6 T, 8 SLI

17

DIODE-SWITCHING

1N4148 WS, 75 V, 150 MA, SOD-323, TP

DIODE-RECTIFIER

MURS160, 600 V, 1 A, DO-20, TP

0401-001099

D1-D16, D44

0402-001049

D38

0402-001216

D17, D26-D29, D39

DIODE-RECTIFIER

MURS120, 200 V, 1 A, TO-220 F, TP

0403-000283

ZD33-ZD36

DIODE-ZENER

MMBZ5234B, 5.78-6.44 V, 225 MW, SOT-23, TP

0403-001396

ZD37, ZD38

DIODE-ZENER

MMSZ5263B, 5%, 500 MW, SOD-123, TP

0403-001416

ZD1-ZD16

16

0501-000476

Q33, Q35, Q37, Q39,

0501-000477

Q12, Q14, Q15, Q17-

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500 MW, SOD-123, TP

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

14

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

15

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

Q41, Q43, Q45, Q47

Q24, Q2, Q34, Q36
3

0501-000477

Q38, Q4, Q40, Q42,

Q44, Q46, Q48-Q56

0501-000477

Q6, Q8, Q9

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

0502-001066

Q1, Q3, Q5, Q7, Q10,

TR-POWER

PZTA42, NPN, 1000 mW, SOT-223, TP, 25-

Q11, Q13, Q16

3

0502-001067

Q25-Q32

TR-POWER

FZT957, PNP, 3 W, SOT-223, TP, 100-3

0505-001477

Q58, Q69

FET-SILICON

SFR9220, P, 200 V, 3.1A, 1.5 ohm, 30 W, D-PAK

0505-001478

Q57, Q59, Q60

FET-SILICON

FQU5N40, N, 400 V, 3.4 A, 1.6 ohm, 45 W, I-PAK

0601-001064

LED1-LED8

LED

SMD, RED/Y-GRN, 1.7 x 2.5 MM, 660/560 NM,

0604-001002

U22-U24

PHOTO-COUPLER

TR, 100-600%, 200 mW, SOP-4, TP

3 x 2.5 x 1.5 MM

SAMSUNG Electronics Co., Ltd.

6-32

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
0801-002215

Assembly Position
U6

Qtty.
1

Part Name
IC-CMOS, LOGIC

Description
74FCT138, 1-OF-8 DECODER, SOP, 16, 300 MIL, SINGLE, TP,
4.5/5.5 V

0801-002403

U16

IC-CMOS, LOGIC

74LC x 08, AND GATE, TSSOP, 14, 173 MIL, QUAD, TP, 2.0/3.6 V

0801-002446

U15, U17, U95, U97

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173 MIL, HEX, TP,

2.0/3.6 V

0802-001026

U1, U2, U5

IC-BICMOS, LOGIC

74ABT16245, BUS TRANSCEIVER, TSSOP, 48, 380 MIL, QUAD,

0802-001084

U12

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 4.5/5.5 V

1203-000302

U19

IC-PWM,

3842B, SOP, 14P, 150 MIL, PLASTIC, 3

TP, 4.5/5.5 V

CONTROLLER
3

1203-001213

U96

IC-POSI.ADJUST REG. 431A, SOP, 8P, 150 MIL, PLASTIC, 37 V

1205-000394

U10, U13, U14, U3,

IC-CODEC FILTER

TP3057 WM, SOP, 16, P, PLASTIC, 5.2

U4, U7-U9
3

1405-000125

V17

VARISTOR

220 V, 4500 A, 17 x 4.2 mm, TP

1405-000130

V1-V8

VARISTOR

270 V, 1200 A, 9 x 4.6 mm, TP

2003-000144

R396-R398

R-METAL OXIDE

100 ohm, 2%, 2 W, AA, TP, 6 x 16 mm

2003-001032

R1, R12, R13, R16,

R-METAL OXIDE(S)

220 ohm, 5%, 1 W, AF, TP, 2.5 x 6.5 mm

2003-001032

R25, R28, R29, R32,

R-METAL OXIDE(S)

220 ohm, 5%, 1 W, AF, TP, 2.5 x 6.5 mm

2003-002037

R530, R531, R55-R62

10

R-METAL OXIDE(S)

270 ohm, 5%, 2 W, AF, TP, 3.9 x 10 mm

2007-000040

R10, R11, R14, R15,

R-CHIP

150 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

150 ohm, 1%, 1/10 W, TP, 1608

R17, R20, R21, R24

R4, R5, R8, R9

R18, R19, R2, R22

3

2007-000040

R23, R26, R27, R3,

R30, R31, R6, R7

SAMSUNG Electronics Co., Ltd.

6-33

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-000041

R515-R522

R-CHIP

475 ohm, 1%, 1/10 W, TP, 1608

2007-000043

R171, R175, R179, R183, R187, R191,

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R195
3

2007-000043

R199, R230, R231, R254, R278, R283, 48

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

2007-000043

R63, R66, R69, R72, R75, R78, R81, R84

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

2007-000045

R286

R-CHIP

3.32 Kohm, 1%, 1/10 W, TP, 1608

2007-000052

R101, R102, R105, R108, R111, R114,

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

21

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R117
3

2007-000052

R120, R123, R131, R168, R210-R225,

2007-000052

R242, R244, R249-R251, R299, R46,

2007-000052

R524-R527, R87, R89, R90

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

2007-000060

R228, R256, R266, R267, R279, R280,

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R237
R523

R282
3

2007-000060

R285, R303, R361, R103, R106, R109,

R112

2007-000066

R115, R118, R121, R124, R134, R135,

R137

2007-000066

R138, R140, R141, R143, R144, R146,

2007-000066

R149, R150, R152, R153, R155, R156,

2007-000066

R281, R284, R304

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

2007-000070

R529

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

R147
R269

SAMSUNG Electronics Co., Ltd.

6-34

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-000287

Assembly Position

Qtty.

Part Name

Description

R100, R126-R130, R132, R157, R158,

10

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

25

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

17

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R167
3

2007-000287

R202-R209, R226, R232, R33-R45,

R49, R50

2007-000287

R503-R506, R51-R54, R88, R91-R98

2007-000475

R227

R-CHIP

1 Mohm, 1%, 1/10 W, TP, 1608

2007-000669

R170, R174, R178, R182, R186,

R-CHIP

2 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

2 Kohm, 1%, 1/10 W, TP, 1608

R190, R194
3

2007-000669

R198

2007-001139

R243

R-CHIP

7.5 Kohm, 1%, 1/10 W, TP, 1608

2007-002901

R253

R-CHIP

12.1 Kohm, 1%, 1/10 W, TP, 1608

2007-002910

R172, R173, R176, R177, R180,

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

11

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

R181, R184
3

2007-002910

R185, R188, R189, R192, R193,

R196, R197

2007-002910

R200, R201, R233-R236, R238-R241,

R366

2007-002910

R367

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

2007-002912

R268

R-CHIP

33.2 Kohm, 1%, 1/10 W, TP, 1608

2007-002987

R133, R136, R139, R142, R145,

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

14

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R148, R151
3

2007-002987

R154, R159-R166, R64, R67, R70,

R73, R76

2007-002987

R79, R82, R85

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

2007-007226

R252

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

2007-007443

R255

R-CHIP

3.01 Kohm, 1%, 1/10 W, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-35

CHAPTER 6. ! .

(continued)
Level

Assembly Position

Qtty.

2007-007613

R471-R480, R487-R490, R493, R494

16

R-CHIP

121 ohm, 1%, 1/10 W, TP, 1608

2007-007796

R507-R514

R-CHIP

2.21 Kohm, 1%, 1/10 W, TP, 1608

2007-008133

R104, R107, R110, R113, R116, R119,

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

2007-008133

R125, R65, R68, R71 R74, R77, R80,

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

2007-008133

R86

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

2007-008150

R257-R260, R270-R273

R-CHIP

12.1 ohm, 1%, 1/10 W, TP, 1608

2011-001099

HYB2, HYB4

R-NET

300 ohm, 5%, 2 W, X, ARRAY, 10P, BK

2203-000426

C283

C-CER, CHIP

0.018 NF, 5%, 50 V, C0G, TP, 1608

2203-000888

C137, C139

C-CER, CHIP

4.7 nF, 10%, 50 V, X7R, TP, 1608

2203-001408

C279, C281, C282

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, TP, 1608

2203-001656

C138

C-CER, CHIP

0.47 nF, 5%, 50 V, NP0, TP, 1608

2203-005144

C102, C103, C106, C121, C124,

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

10

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

14

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

Part Code

Part Name

Description

R122
R83

C125, C128
3

2203-005144

C26, C29, C30, C33, C51, C54, C55,

C58, C99

2203-005249

C1, C10, C100, C101, C104, C105,

2203-005249

C110-C113, C116-C118, C12, C122,

2203-005249

C126, C127, C13-C20, C131, C132,

C109, C11
C123
C153, C2

SAMSUNG Electronics Co., Ltd.

6-36

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2203-005249

Assembly Position

Qtty.

Part Name

Description

C23-C25, C27, C28, C3, C31,

11

C-CER, CHIP

100 nF, 10 %, 50 V, X7R, TP, 1608

13

C-CER, CHIP

100 nF, 10 %, 50 V, X7R, TP, 1608

C32, C36-C38
3

2203-005249

C4-C9, C41, C42, C52, C53,

C56, C57, C78

2203-005249

C98

C-CER, CHIP

100 nF, 10 %, 50 V, X7R, TP, 1608

2203-005457

C275, C276

C-CER, CHIP

1 NF, 10 %, 2 KV, X7R, TP, 4520

2203-005565

C97

C-CER, CHIP

1 nF, 5 %, 50 V, NP0, TP, 1608

2305-000385

C175

C-FILM, LEAD-PEF

470 nF, 10 %, 250 V, BK, 18 x 6 x 12, 15

2401-001216

C246-C249

C-AL

4.7, UF, 20 %, 100 V, GP, TP, 5 x 11, 5

2402-000120

C274, C61, C63, C65

C-AL, SMD

10, UF, 20 %, 50 V, GP, TP, 6.6 x 6.6 x 5.4 MM

C67, C69, C71, C73

3

2402-000120

C75

C-AL, SMD

10, UF, 20 %, 50 V, GP, TP, 6.6 x 6.6 x 5.4 MM

2402-000130

C62, C64, C66, C68, C70,

C-AL, SMD

2.2, UF, 20 %, 50 V, GP, TP, 4.3 x 4.3 x 5.

C72, C74, C76

3

2402-000170

C43-C50

C-AL, SMD

1, UF, 20 %, 50 V, GP, TP, 4.3 x 4.3 x 5.4,

2402-001083

C135, C154, C202, C213

C-AL, SMD

100, UF, 20 %, 50 V, GP, TP, 10 x 10.3 x 10

2402-001224

C258-C260, C264-C267,

24

C-AL, SMD

10, UF, 20 %, 100 V, GP, TP, 8.0 x 10.0 MM

FILTER-EMI ON

50 V, 1A, 47pF, 7.5 x 2.5 x 6.2 mm, TP

C269, C81-C96
3

2901-000188

M2, M3

BOARD
3

3301-001308

L2, L3, L6, L7

BEAD-SMD

10 ohm, 1608, 500 mA, TP, 0.15 ohm

3501-001139

K1-K9

RELAY-MINIATURE

4.5 VDC, 140 MW, 1000 MA, 2FORMC, 4 MS, 4 MS

3703-001252

J1, J2

CONNECTOR-BACK,

30, P, 5R, FEMALE, ANGLE-F, AU30U

PANEL
3

3722-002045

SAMSUNG Electronics Co., Ltd.

J3

JACK-MODULAR

8P/8C, INVERTED, Y, ANGLE, N, BLK, AU15U

6-37

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

EC26-20501A

T1-T8

TRANS AF

INFOREX, 800 mH

EC27-30514A

L1

COIL RF

INFOREX, 35UH, 40T

GA13-10066A

U11

IC ASIC

DCS, SBS-9401, QFP, 80P

GA13-10576A

HYB1, HYB3

IC HYBRID-BALANCE DCS-KOR, KP0078SA, SIP, 20, 2000

GA26-30073A

T17

TRANS, POWER

DCS48 V//13 V/85 V, 877, UH//100, UH

GA41-00136A

PCB-8SLI

OFFICESERV 7200, FR-4, 4, L, 00, 1.6T, 130 x 275 MM

SAMSUNG Electronics Co., Ltd.

6-38

OfficeServ 7400 Service Manual

6.7 16SLI Board

Level
2
3

Part Code
GA92-02784A
0401-001099

Assembly Position
D1-D16, D18-D25,

Qtty.
1
33

Part Name

Description

PBA MAIN-16PORTA

OFFICESERV 7200, DOM/EXP, KOREA, 16PORTANALOGSUBSCIBE,

NALOGSUBSCIBE

FR-4, 6, L, 130*275*1.6 T, 16 SLI

DIODE-SWITCHING

1N4148WS, 75 V, 150 MA, SOD-323, TP

D30-D37, D44
3

0402-001049

D38

DIODE-RECTIFIER

MURS160, 600 V, 1 A, DO-20, TP

0402-001216

D17, D26-D29, D39

DIODE-RECTIFIER

MURS120, 200 V, 1 A, TO-220F, TP

0403-000283

ZD33-ZD36

DIODE-ZENER

MMBZ5234B, 5.78-6.44 V, 225 MW, SOT-23, TP

DIODE-ZENER

MMSZ5263B, 5%, 500 MW, SOD-123, TP

32

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500 MW, SOD-123, TP

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

12

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

14

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

14

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

13

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

11

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

13

TR-POWER

PZTA42, NPN, 1000 mW, SOT-223, TP, 25-

0403-001396

ZD37, ZD38

0403-001416

ZD1-ZD32

0501-000476

Q33, Q35, Q37, Q39,

Q41, Q43, Q45

0501-000476

Q47, Q70, Q72, Q74,

Q76, Q78, Q80

0501-000476

Q82, Q84

0501-000477

Q100, Q101,
Q110-117, Q12, Q14

0501-000477

Q15, Q17-Q24, Q2,

Q34, Q36, Q38, Q4

0501-000477

Q40, Q42, Q44, Q46,

Q48-Q56, Q6

0501-000477

Q61-Q68, Q71, Q73,

Q75, Q77, Q79

0501-000477

Q8, Q9, Q81, Q83,

0502-001066

Q1, Q10, Q11, Q13,

Q85, Q94-Q99
Q16, Q102-Q109

SAMSUNG Electronics Co., Ltd.

6-39

CHAPTER 6. ! .

(continued)
Level
3

Part Code
0502-001066

Assembly Position
Q3, Q5, Q7

Qtty.
3
16

Part Name

Description

TR-POWER

PZTA42, NPN, 1000 mW, SOT-223, TP, 25-

0502-001067

Q25-Q32, Q86-Q93

TR-POWER

FZT957, PNP, 3 W, SOT-223, TP, 100-3

0505-001477

Q58, Q69

FET-SILICON

SFR9220, P, 200 V, 3.1 A, 1.5 ohm, 30 W, D-PAK

0505-001478

Q57, Q59, Q60

FET-SILICON

FQU5N40, N, 400 V, 3.4 A, 1.6 ohm, 45 W, I-PAK

0601-001064

LED1-LED8

LED

SMD, RED/Y-GRN, 1.7X2.5 MM, 660/560 NM, 3X2.5X1.5 MM

0604-001002

U22-U24

PHOTO-COUPLER

TR, 100-600%, 200 mW, SOP-4, TP

0801-002215

U6

IC-CMOS, LOGIC

74FCT138, 1-OF-8 DECODER, SOP, 16, 300 MIL, SINGLE, TP,

4.5/5.5 V

0801-002403

U16

IC-CMOS, LOGIC

74LCX08, AND GATE, TSSOP, 14, 173 MIL, QUAD, TP, 2.0/3.6 V

0801-002446

U15, U17, U95, U97,

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173 MIL, HEX, TP,

0802-001026

IC-BICMOS, LOGIC

74ABT16245, BUS TRANSCEIVER, TSSOP, 48, 380 MIL, QUAD,

U98
U1, U2, U5

2.0/3.6 V
TP, 4.5/5.5 V

0802-001084

U12

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 4.5/5.5 V

1203-000302

U19

IC-PWM, CONTROLLER

3842B, SOP, 14P, 150 MIL, PLASTIC, 3

1203-001213

U96

IC-POSI.ADJUST REG.

431A, SOP, 8P, 150 MIL, PLASTIC, 37 V

1205-000394

IC-CODEC FILTER

TP3057WM, SOP, 16, P, PLASTIC, 5.2

U3, U4, U7-U10,

10

U13, U14, U20, U21

3

1205-000394

U25-U30

1405-000125

V1-V17

6
17

IC-CODEC FILTER

TP3057WM, SOP, 16, P, PLASTIC, 5.2

VARISTOR

220 V, 4500 A, 17 x 4.2 mm, TP

2003-000144

R396-U398

R-METAL OXIDE

100 ohm, 2%, 2 W, AA, TP, 6 x 16 mm

2003-001032

R1, R12, R13, R16,

R-METAL OXIDE(S)

220 ohm, 5%, 1 W, AF, TP, 2.5 x 6.5 mm

2003-001032

R-METAL OXIDE(S)

220 ohm, 5%, 1 W, AF, TP, 2.5 x 6.5 mm

R17, R20, R21, R24

R25, R28, R29, R32,
R4, R439, R442

SAMSUNG Electronics Co., Ltd.

6-40

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2003-001032

Assembly Position
R443, R446, R447, R450,

Qtty.

Part Name

Description

R-METAL OXIDE(S)

220 ohm, 5%, 1 W, AF, TP, 2.5 x 6.5 mm

R-METAL OXIDE(S)

220 ohm, 5%, 1 W, AF, TP, 2.5 x 6.5 mm

R451, R454, R455

3

2003-001032

R458, R459, R462, R463,

R466, R467, R470

2003-001032

R5, R8, R9

R-METAL OXIDE(S)

220 ohm, 5%, 1 W, AF, TP, 2.5 x 6.5 mm

2003-002037

R402, R406, R410, R414,

R-METAL OXIDE(S)

270 ohm, 5%, 2 W, AF, TP, 3.9 x 10 mm

2003-002037

R430, R530-R533,

13

R-METAL OXIDE(S)

270 ohm, 5%, 2 W, AF, TP, 3.9 x 10 mm

2007-000040

R-CHIP

150 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

150 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

150 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

150 ohm, 1%, 1/10 W, TP, 1608

R418, R422, R426

R55-R62
R10, R11, R14, R15, R18,
R19, R2, R22, R23
3

2007-000040

R26, R27, R3, R30, R31,

R440, R441, R444

2007-000040

R445, R448, R449, R452,

R453, R456, R457

2007-000040

R460, R461, R464, R465,

R468, R469, R6, R7

2007-000041

R515-R522

R-CHIP

475 ohm, 1%, 1/10 W, TP, 1608

2007-000043

R171, R175, R179, R183,

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R187, R191, R195

3

2007-000043

R199, R230, R231, R254,

R278, R283, R306

2007-000043

R310, R314, R318, R322,

R326, R330, R334

2007-000043

R399, R403, R407, R411,

R415, R419, R423

SAMSUNG Electronics Co., Ltd.

6-41

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-000043

Assembly Position
R427, R48, R63, R66

Qtty.

Part Name

Description

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R69, R72, R75, R78

3

2007-000043

R81, R84

2007-000045

R286

R-CHIP

3.32 Kohm, 1%, 1/10 W, TP, 1608

2007-000052

R101, R102, R105, R108,

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

21

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

20

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

10

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R89, R90

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R228, R256, R266, R267,

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

R285, R303, R361

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

R103, R106, R109, R112,

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R111, R114, R117

3

2007-000052

R120, R123, R131, R168,

R210-R225, R229

2007-000052

R237, R242, R244,

R249-R251, R261, R287

2007-000052

R288-R302, R338, R341,

R344, R347, R350

2007-000052

R353, R356, R359, R46,

R523-R527, R87

2007-000052

2007-000060

R279, R280, R282

3

2007-000060

2007-000066

R115, R118, R121

3

2007-000066

2007-000066

2007-000066

R124, R134, R135, R137,

R138, R140, R141
R143, R144, R146, R147,
R149, R150, R152
R153, R155, R156, R269,
R281, R284, R304

SAMSUNG Electronics Co., Ltd.

6-42

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-000066

Assembly Position

Qtty.

Part Name

Description

R337, R340, R343, R346,

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

R349, R352, R355

3

2007-000066

R358, R368, R369, R371,

R372, R374, R375

2007-000066

R377, R378, R380, R381,

R383, R384, R386

2007-000066

R387, R389, R390

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

2007-000070

R529

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

2007-000287

10

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

12

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

22

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

10

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R126-R130, R132, R157,

R158, R167, R202

2007-000287

R203-R209, R226, R232,

R247, R248, R33

2007-000287

R34-R45, R49-R54,
R503-R506

2007-000287

R88, R91-R99

2007-000475

R227

R-CHIP

1 Mohm, 1%, 1/10 W, TP, 1608

2007-000669

R170, R174, R178, R182,

R-CHIP

2 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

2 Kohm, 1%, 1/10 W, TP, 1608

R186, R190, R194

3

2007-000669

R198, R305, R309, R313,

R317, R321, R325

2007-000669

R329, R333

R-CHIP

2 Kohm, 1%, 1/10 W, TP, 1608

2007-001139

R243

R-CHIP

7.5 Kohm, 1%, 1/10 W, TP, 1608

2007-002901

R253

R-CHIP

12.1 Kohm, 1%, 1/10 W, TP, 1608

2007-002910

R172, R173, R176, R177,

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

R180, R181, R184

SAMSUNG Electronics Co., Ltd.

6-43

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-002910

Assembly Position

Qtty.

Part Name

Description

R185, R188, R189, R192,

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

11

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

10

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

R193, R196, R197

3

2007-002910

R200, R201, R233-R236,

R238-R241, R262

2007-002910

R263-R265, R274-R277,
R307, R308, R311

2007-002910

R312, R315, R316, R319,

R320, R323, R324

2007-002910

R327, R328, R331, R332,

R335, R336, R366

2007-002910

R367

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

2007-002912

R268

R-CHIP

33.2 Kohm, 1%, 1/10 W, TP, 1608

2007-002987

R133, R136, R139, R142,

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

13

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R145, R148, R151

3

2007-002987

2007-002987

2007-002987

R154, R159-R166, R339,

R342, R345, R348
R351, R354, R357, R360,
R400, R404, R408
R412, R416, R420, R424,
R428, R64, R67, R70

2007-002987

R73, R76, R79, R82, R85

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

2007-007226

R252

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

2007-007443

R255

R-CHIP

3.01 Kohm, 1%, 1/10 W, TP, 1608

2007-007613

R471-R502

32

R-CHIP

121 ohm, 1%, 1/10 W, TP, 1608

2007-007796

R507-R514

R-CHIP

2.21 Kohm, 1%, 1/10 W, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-44

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-008133

Assembly Position
R104, R107, R110,

Qtty.

Part Name

Description

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

R113, R116, R119,

R122
3

2007-008133

R125, R370, R373,

R376, R379, R382,
R385

2007-008133

R388, R391, R401,

R405, R409, R413,
R417

2007-008133

R421, R425, R429,

R65, R68, R71, R74,
R77

2007-008133

R80, R83, R86

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

2007-008150

R257-R260, R270,

R-CHIP

12.1 ohm, 1%, 1/10 W, TP, 1608

2011-001099

R-NET

300 ohm, 5%, 2 W, X, ARRAY, 10, P, BK

C-CER, CHIP

0.018 NF, 5%, 50 V, C0G, TP, 1608

R271-R273
HYB2, HYB4, HYB7,
HYB8
3

2203-000426

C283

2203-000888

C137, C139

C-CER, CHIP

4.7 nF, 10%, 50 V, X7R, TP, 1608

2203-001408

C279, C282

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, TP, 1608

2203-001656

C138

C-CER, CHIP

0.47 nF, 5%, 50 V, NP0, TP, 1608

2203-005144

C102, C103, C106,

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C121, C124, C125,

C128
3

2203-005144

C145, C148, C149,

C152, C176, C179,
C180

SAMSUNG Electronics Co., Ltd.

6-45

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2203-005144

Assembly Position
C183, C214, C217, C218,

Qtty.

Part Name

Description

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C221, C250, C253

3

2203-005144

C254, C257, C26, C29, C30,

C33, C51, C54

2203-005144

C55, C58, C99

2203-005249

C1, C10, C100, C101C104,

2203-005249

C116-C119, C12, C13, C122,

2203-005249

C13, C131, C132, C136, C14,

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

12

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

27

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

10

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

12

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C105, C109-C113
C123, C126, C127
C140-C142, C146
3

2203-005249

C147, C15-C17, C150, C151,

C153, C177, C178

2203-005249

C18-C20, C181, C182, C2,

C215, C216, C219

2203-005249

C220, C224-C243, C23-C25,

C251, C252, C255

2203-005249

C256, C27, C28, C3, C31,

C32, C36-C38, C4

2203-005249

C41, C42, C5, C52, C53, C56,

2203-005249

C98

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2203-005457

C275, C276

C-CER, CHIP

1 NF, 10%, 2 KV, X7R, TP, 4520

C57, C6-C9, C78

SAMSUNG Electronics Co., Ltd.

6-46

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2203-005565

C97

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1608

2305-000385

C175

C-FILM, LEAD-PEF

470 nF, 10%, 250 V, BK, 18x6x12, 15

2401-001216

C246-C249

C-AL

4.7, UF, 20%, 100 V, GP, TP, 5x11, 5

2402-000120

C184, C186, C188, C190,

C-AL, SMD

10, UF, 20%, 50 V, GP, TP, 6.6 x 6.6 x 5.4 MM

10

C-AL, SMD

10, UF, 20%, 50 V, GP, TP, 6.6 x 6.6 x 5.4 mm

C-AL, SMD

2.2, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.

C-AL, SMD

2.2, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.

16

C-AL, SMD

1, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.4,

C-AL, SMD

100, UF, 20%, 50 V, GP, TP, 10 x 10.3 x 10

48

C-AL, SMD

10, UF, 20%, 100 V, GP, TP, 8.0 x 10.0 mm

C192, C194, C196

3

2402-000120

C198, C274, C61, C63, C65,

C67, C69, C71, C73, C75

2402-000130

C185, C187, C189, C191,

C193, C195, C197, C199

2402-000130

C62, C64, C66, C68, C70,

2402-000170

C203-C210, C43-C50

2402-001083

C135, C154, C202, C213

2402-001224

C72, C74, C76

C157-C172, C258-C273, C81C96

2901-000188

M2, M3

FILTER-EMI ON BOARD

50 V, 1A, 47pF, 7.5 x 2.5 x 6.2 mm, TP

3301-001308

L2-L7

BEAD-SMD

10 ohm, 1608, 500 mA, TP, 0.15 ohm

RELAY-MINIATURE

4.5 VDC, 440 MW, 1000 MA, 2FORMC, 4 MS, 4 MS

CONNECTOR-BACK,

30, P, 5R, FEMALE, ANGLE-F, AU30U

3501-001139

K1-K17

3703-001252

J1, J2

17
2

3722-002045

J3

EC26-20501A

T1-T16

EC27-30514A

L1

PANEL

SAMSUNG Electronics Co., Ltd.

16
1

JACK-MODULAR

8P/8C, INVERTED, Y, ANGLE, N, BLK, AU15U

TRANS AF

INFOREX, 800 mH

COIL RF

INFOREX, 35, UH, 40T

6-47

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

GA13-10066A

U11, U18

IC ASIC

DCS, SBS-9401, QFP, 80P

GA13-10576A

HYB1, HYB3, HYB5,

IC HYBRID-BALANCE

DCS-KOR, KP0078SA, SIP, 20, 2000

GA26-30073A

T17

TRANS, POWER

DCS48 V/13 V/85 V, 877, UH/100, UH

GA41-00136A

PCB-8SLI

OFFICESERV 7200, FR-4, 4, L, 00, 1.6 T, 130 x 275 MM

HYB6

SAMSUNG Electronics Co., Ltd.

6-48

OfficeServ 7400 Service Manual

6.8 16MWSLI Board

No

Part Code

Assembly Position

0401-001099

D109

0401-001134

D101, D102, D151,

Qtty.

Part Name

Description

DIODE-SWITCHING

1N4148WS, 75 V, 150 mA, SOD-323, TP

32

DIODE-SWITCHING

BAV23C, 250 V, 400 MA, SOT-23, TP

DIODE-RECTIFIER

D1FL40-4063, 400 V, 0.6 A, 1F, TP

17

DIODE-RECTIFIER

D1FL40-4063, 400 V, 0.6 A, 1F, TP

D152, D201, D202,

D251, D252, D301,
D302, D351, D352,
D401, D402, D451,
D452, D501, D502,
D551, D552, D601,
D602, D651, D652,
D701, D702, D751,
D752, D801, D802,
D851, D852
3

0402-000197

D4, D103, D153,

D203, D253, D303,
D353, D403

0402-000197

D4, D103, D153,

D203, D253, D303,
D353, D403, D453,
D503, D553, D603,
D653, D703, D753,
D803, D853

0402-000309

D1, D2

DIODE-RECTIFIER

1SR154-400, 400 V, 1 A, SOD-106, TP

0402-001216

D3, D5-D9

DIODE-RECTIFIER

MURS120, 200 V, 1 A, TO-220F, TP

0403-000141

ZD5-ZD7

DIODE-ZENER

1N4735A, 5%, 1000 MW, DO-41, TP

0403-000283

ZD1-ZD4, ZD8-ZD12

DIODE-ZENER

MMBZ5234B, 5.78-6.44 V, 225 MW, SOT-23, TP

SAMSUNG Electronics Co., Ltd.

6-49

CHAPTER 6. ! .

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

0403-001396

Z13, Z14

DIODE-ZENER

MMSZ5263B, 5%, 500 MW, SOD-123, TP

10

0505-001477

Q3, Q4

FET-SILICON

SFR9220, P, 200 V, 3.1A, 1.5 ohm, 30W, D-PAK

11

0505-001478

Q1, Q2, Q5

FET-SILICON

FQU5N40, N, 400 V, 3.4A, 1.6 ohm, 45W, I-PAK

12

0604-001002

PC1-PC3

PHOTO-COUPLER

TR, 100-600%, 200 mW, SOP-4, TP

13

0801-002127

U1, U7, U10

IC-CMOS, LOGIC

74FCT16245, TRANSCEIVER, TSSOP, 48, 240MIL, DUAL, ST,

14

0801-002171

U852

IC-CMOS, LOGIC

74LCX125, BUS BUFFER, SOP, 14, 150MIL, QUAD, TP, 2.0/3.6 V

15

0801-002403

U6

IC-CMOS, LOGIC

74LCX08, AND GATE, TSSOP, 14, 173MIL, QUAD, TP, 2.0/3.6 V

16

0801-002446

U9, U11

IC-CMOS, LOGIC

4.5/5.5 V

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173MIL, HEX, TP,

2.0/3.6 V

17

1203-000302

U8

IC-PWM,

3842B, SOP, 14P, 150MIL, PLASTIC, 3

CONTROLLER
18

1203-001213

19

1205-002314

U12

IC-VOL. REFERANCE

U100, U150, U200,

16

IC-SLIC

431A, SOP, 8P, 150MIL, PLASTIC, 37 V

LE7955-2FQC, QFN, 32P, 8 x 8 mm, PLASTIC, 5 V, 860 MW,
0TO+70C, TR

U250, U300, U350,

U400, U450, U500,
U550, U600, U650,
U700, U750, U800,
U850
20

1205-002345

U2-U5

IC-SLIC

LE58QL021BVC, TQFP, 44P, 10x10 mm, PLASTIC, 3.3 V,

170 MW40TO+85C, TR, QLSLAC

21

1301-001680

U13

IC-CPLD

LC4064V-75T100C, TQFP, 100P, 16x16 mm, 7.5 NS, 3.3 V, 10%,

12 MA, 0TO+90C, 64, 64, 4, -0.5/5

22

1405-000125

SAMSUNG Electronics Co., Ltd.

V1

VARISTOR

220 V, 4500 A, 17 x 4.2 mm, TP

6-50

OfficeServ 7400 Service Manual

(continued)
No
23

Part Code
1405-000130

Assembly Position
V101, V151, V201, V251, V301,

Qtty.

Part Name

Description

16

VARISTOR

270 V, 1200 A, 9 x 4.6 mm, TP

16

VARISTOR

82 V, 1200 A, 9 x 6 mm, TP

V351, V401, V451, V501, V551,

V601, V651, V701, V751, V801, V851
24

1405-000171

V100, V150, V200, V250, V300,

V350, V400, V450, V500, V550,
V600, V650, V700, V750, V800, V850

25

2003-000458

R1, R3, R7, R8, R14

R-METAL OXIDE(S)

100 ohm, 5%, 2 W, AF, TP, 4 x 12 mm

26

2007-000043

R26-R28, R35, R43, R46

R-CHIP

1K ohm, 1%, 1/10 W, TP, 1608

27

2007-000052

R1095~R1097, R1134, R220, R221,

49

R-CHIP

10 kohm, 1%, 1/10 W, TP, 1608

11

R-CHIP

100 kohm, 1%, 1/10 W, TP, 1608

R-CHIP

20 kohm, 1%, 1/10 W, TP, 1608

16

R-CHIP

1.3 kohm, 1%, 1/10 W, TP, 1608

R270, R271, R320, R321, R370,

R371, R24, R36~R38, R40, R44,
R45, R47~R50, R53, R420, R421,
R470, R471, R520, R521, R570,
R571, R54, R57, R67, R120, R121,
R131, R170, R171, R620, R621,
R670, R671, R720, R721, R770,
R771, R820, R821, R870, R871,
R1080~R1084, R1086
28

2007-000060

R5, R6, R9, R11, R15-R18, R20, R23,

R34

29

2007-000066

30

2007-000231

R10, R19, R21, R22

R108, R158, R208, R258, R308,
R358, R408, R458, R508, R558,
R608, R658, R708, R758, R808,
R858

SAMSUNG Electronics Co., Ltd.

6-51

CHAPTER 6. ! .

(continued)
No
31

Part Code
2007-000497

Assembly Position
R104, R113, R154, R163, R204, R213,

Qtty.

Part Name

Description

32

R-CHIP

2.2 Mohm, 1%, 1/10 W, TP, 1608

18

R-CHIP

49.9 ohm, 1%, 1 W, TP, 6432

14

R-CHIP

49.9 ohm, 1%, 1 W, TP, 6432

R-CHIP

7.5 kohm, 1%, 1/10 W, TP, 1608

32

R-CHIP

2 Mohm, 5%, 1/10 W, TP, 1608

R-CHIP

12.1 kohm, 1%, 1/10 W, TP, 1608

18

R-CHIP

30.1 kohm, 1%, 1/10 W, TP, 1608

R-CHIP

4.75 kohm, 1%, 1/10 W, TP, 1608

16

R-CHIP

90.9 kohm, 1%, 1/10 W, TP, 1608

R254, R263, R304, R313, R354, R363,

R404, R413, R454, R463, R504, R513,
R554, R563, R604, R613, R654, R663,
R704, R713, R754, R763, R804, R813,
R854, R863
32

2007-000954

R107, R112, R157, R162, R207, R212,

R257, R262, R307, R312, R357, R362,
R407, R412, R457, R462, R507, R512,

33

2007-000954

R557, R562, R607, R612, R657, R662,

R707, R712, R757, R762, R807, R812,
R857, R862

34

2007-001139

35

2007-001342

R25
R103, R109, R153, R159, R203, R209,
R253, R259, R303, R309, R353, R359,
R403, R409, R453, R459, R503, R509,
R553, R559, R603, R609, R653, R659,
R703, R709, R753, R759, R803, R809,
R853, R859

36

2007-002901

37

2007-002910

R39
R12, R31, R32, R105, R155, R205, R255,
R305, R355, R405, R455, R505, R555,
R605, R655, R705, R755, R805, R855

38

2007-002987

39

2007-007331

R1087-R1094
R117, R167, R217, R267, R317, R367,
R417, R467, R517, R567, R617, R667,
R717, R767, R817, R867

SAMSUNG Electronics Co., Ltd.

6-52

OfficeServ 7400 Service Manual

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

40

2007-007443

R13

R-CHIP

3.01 kohm, 1%, 1/10 W, TP, 1608

41

2007-007443

R33

R-CHIP

3.01 kohm, 1%, 1/10 W, TP, 1608

42

2007-007519

32

R-CHIP

80.6 kohm, 1%, 1/10 W, TP, 1608

16

R-CHIP

15 KOHM, 5%, 1 W, TP, 6432

51

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

32

R-CHIP

13 kohm, 1%, 1/10 W, TP, 1608

R110, R114, R160, R164, R210, R214, R260,

R264, R310, R314, R360, R364, R410, R414,
R460, R464, R510, R514, R560, R564, R610,
R614, R660, R664, R710, R714, R760, R764,
R810, R814, R860, R864

43

2007-007637

R102, R152, R202, R252, R302, R352, R402,

R452, R502, R552, R602, R652, R702, R752,
R802, R852

44

2007-007645

R1136, R1137, R41, R42, R93~R97,

R126~R130, R1106~R1133

45

2007-007768

R115, R116, R165, R166, R215, R216, R265,

R266, R315, R316, R365, R366, R415, R416,
R465, R466, R515, R516, R565, R566, R615,
R616, R665, R666, R715, R716, R765, R766,
R815, R816, R865, R866

46

2007-008122

R51, R52, R55, R56, R1135

R-CHIP

22.1 ohm, 1%, 1/10 W, TP, 1608

47

2007-008150

R1098-R1105

R-CHIP

12.1 ohm, 1%, 1/10 W, TP, 1608

48

2007-008681

48

R-CHIP

1.2 KOHM, 5%, 1 W, TP, 6432

R101, R106, R111, R151, R156, R161, R201,

R206, R211, R251, R256, R261, R301, R306,
R311, R351, R356, R361, R401, R406, R411,
R451, R456, R461, R501, R506, R511, R551,
R556, R561, R601, R606, R611, R651, R656,
R661, R701, R706, R711, R751, R756, R761,
R801, R806, R811, R851, R856, R861

SAMSUNG Electronics Co., Ltd.

6-53

CHAPTER 6. ! .

(continued)
No

Part Code

49

2203-000426

50

2203-000576

Assembly Position
C277, C278, C283
C110, C160, C210, C260, C310, C360, C410,

Qtty.

Part Name

Description

C-CER, CHIP

0.018 nF, 5%, 50 V, C0G, 1608

16

C-CER, CHIP

220 nF, 10%, 50 V, X7R, 3216

C-CER, CHIP

4.7 nF, 10%, 50 V, X7R, TP, 1608

96

C-CER, CHIP

100 nF, 10%, 100 V, X7R, TP, 3216, 3.2

C-CER, CHIP

0.47 nF, 5%, 50 V, NP0, TP, 1608

16

C-CER, CHIP

0.082 nF, 5%, 50 V, NP0, 1608

C460, C510, C560, C610, C660, C710, C760,

C810, C860
51

2203-000888

C15, C19

52

2203-001386

C102, C104, C105, C111, C114, C115, C152,

C154, C155, C161, C164, C165, C202, C204,
C205, C211, C214, C215, C252, C254, C255,
C261, C264, C265, C302, C304, C305, C311,
C314, C315, C352, C354, C355, C361, C364,
C365, C402, C404, C405, C411, C414, C415,
C452, C454, C455, C461, C464, C465, C502,
C504, C505, C511, C514, C515, C552, C554,
C555, C561, C564, C565, C602, C604, C605,
C611, C614, C615, C652, C654, C655, C661,
C664, C665, C702, C704, C705, C711, C714,
C715, C752, C754, C755, C761, C764, C765,
C802, C804, C805, C811, C814, C815, C852,
C854, C855, C861, C864, C865

53

2203-001656

54

2203-001697

C16
C113, C163, C213, C263, C313, C363, C413,
C463, C513, C563, C613, C663, C713, C763,
C813, C863

SAMSUNG Electronics Co., Ltd.

6-54

OfficeServ 7400 Service Manual

(continued)
No
55

Part Code
2203-002080

Assembly Position
C112, C162, C212, C262, C312, C362, C412,

Qtty.

Part Name

Description

16

C-CER, CHIP

0.56 nF, 5%, 50 V, C0G, TP, 1608

32

C-CER, CHIP

15 nF, 10%, 50 V, X7R, TP, 1608

70

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

1 nF, 10%, 2 KV, X7R, TP, 4520

32

C-CER, CHIP

2.2 nF, 10%, 500 V, X7R, TP, 3216

32

C-CER, CHIP

470 nF, 20%, 250 V, X7R, TP, 4532

C462, C512, C562, C612, C662, C712, C762,

C812, C862
56

2203-005221

C101, C109, C151, C159, C201, C209, C251,

C259, C301, C309, C351, C359, C401, C409,
C451, C459, C501, C509, C551, C559, C601,
C609, C651, C659, C701, C709, C751, C759,
C801, C809, C851, C859

57

2203-005249

C203, C208, C216, C253, C258, C266, C303,

C308, C3, C6~C14, C18, C23, C26~C29, C33, C37,
C38, C316, C353, C358, C366, C403, C408, C416,
C453, C41, C42, C108, C116, C153, C158, C166,
C458, C466, C503, C508, C516, C553, C558,
C566, C603, C608, C616, C653, C658, C666,
C703, C708, C716, C753, C758, C766, C803,
C808, C816, C853, C858, C866, C868~C880

58

2203-005457

59

2203-005687

C275, C276, C881

C106, C107, C156, C157, C206, C207, C256,
C257, C306, C307, C356, C357, C406, C407,
C456, C457, C506, C507, C556, C557, C606,
C607, C656, C657, C706, C707, C756, C757,
C806, C807, C856, C857

60

2203-006115

C100, C117, C150, C167, C200, C217, C250,

C267, C300, C317, C350, C367, C400, C417,
C450, C467, C500, C517, 550, C567, C600,
C617, C650, C667, C700, C717, C750, C767,
C800, C817, C850, C867

SAMSUNG Electronics Co., Ltd.

6-55

CHAPTER 6. ! .

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

61

2305-000385

C2

C-FILM, LEAD-PEF

470 nF, 10%, 250 V, BK, 18 x 6 x 1 2, 15

62

2401-000625

C4, C5

C-AL

2.2, UF, 20%, 160 V, GP, TP, 6.3 x 11, 5

63

2401-003291

C1

C-AL

22, UF, 20%, 200 V, WT, TP, 10 x 16, 5

64

2401-003298

C21, C24

C-AL

100, UF, 20%, 63 V, GP, TP, 8 x 11.5, 5

65

2402-000120

C274

C-AL, SMD

10, UF, 20%, 50 V, GP, TP, 6.6 x 6.6 x 5.4 mm

66

2402-001083

C17, C882

C-AL, SMD

100, UF, 20%, 50 V, GP, TP, 10 x 10.3 x 10

67

2702-001112

L5

INDUCTOR-RADIAL

60, UH, 35%, 7.5 x 8.0 mm

68

2703-002639

L100, L150, L200, L250, L300, L350,

INDUCTOR-SMD

1000, UH, 20%, 5.2 x 5.2 x 1.8 mm

16

L400, L450, L500, L550, L600, L650,

L700, L750, L800, L850
69

2901-000188

B1, B2

FILTER-EMI

50 V, 1 A, 47, PF, 7.5 x 2.5 x 6.2 mm, TP

70

3301-001308

L2-L4, L6, L7

BEAD-SMD

10O HM, 1608, 500, TP, 0.15

71

3501-001258

32

RELAY-MINIATURE

5 V, 100 MW, 1000 MA, 2FORMC, 3 MS, 3 MS

RELAY-MINIATURE

5 V, 100 MW, 1000 MA, 2FORMC, 3 MS, 3 MS

K100, K250, K105, K150, K400,

K200, K300, K550, K350, K450,
K700, K500, K600, K850, K650,
K750, K451, K501, K551, K601,
K651, K701, K751, K801, K800,
K101, K151, K201, K251, K301,
K351, K401

72

3501-001258

K851

73

3703-001252

P1-P3

CONNECTOR-BACK, 30P, 5R, FEMALE, ANGLE-F, AU30U

PANEL

74

3710-000001

JP1

CONNECTOR-

2P, 1R, 2.54 mm, AUF

SHUNT

SAMSUNG Electronics Co., Ltd.

6-56

OfficeServ 7400 Service Manual

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

75

3711-001465

JP1

CONNECTOR-HEADER

NOWALL, 3P, 1R, 2.54 mm, STRAIGHT, AUF, BLK

76

3711-003272

P4

CONNECTOR-HEADER

BOX, 10P, 2R, 2.54 mm, STRAIGHT, AUF, BLK

77

3722-001302

P5

JACK-MODULAR

8P, ANGLE, BLK, AU50U

78

EC27-30514A

L1

COIL RF

INFOREX, 35uH, 40T

79

GA26-30073A

T1

TRANS, POWER

DCS, -48 V//13 V/85 V, 877, UH//100, UH

80

GA41-00177A

PCS.01

PCB MAIN-OS7200 16SLI2

OFFICESERV 7200, FR4, 4L, 00, 1.6T, 130 x

275 mm

SAMSUNG Electronics Co., Ltd.

6-57

CHAPTER 6. ! .

6.9 8HYB Board

Level
2

Part Code
GA92-02787A

Assembly Position
-

Qtty.
1

Part Name

Description

PBA MAIN-8PORT A/D

OFFICESERV 7400, DOM/EXP, WORLD, 8PORT A/D SUBSCIBER,

SUBSCIBER

FR-4, 4, L, 130*275, 8 HYB

17

DIODE-SWITCHING

1N4148WS, 75 V, 150 MA, SOD-323, TP

0401-001099

D7-D22, D44

0402-001049

D26

DIODE-RECTIFIER

MURS160, 600 V, 1 A, DO-20, TP

0402-001211

D45

DIODE-RECTIFIER

MURS320, 200 V, 3 A, MSR, TP

0402-001216

D24, D25, D27, D3,

DIODE-RECTIFIER

MURS120, 200 V, 1 A, TO-220F, TP

D4, D5
3

0403-000283

D1, D2, D23, D6

DIODE-ZENER

MMBZ5234B, 5.78-6.44 V, 225 MW, SOT-23, TP

0403-001396

ZD1, ZD2

DIODE-ZENER

MMSZ5263B, 5%, 500 MW, SOD-123, TP

0403-001416

ZD3-ZD34

29

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500 MW, SOD-123, TP

0501-000476

Q45-Q52, Q62

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

0501-000477

Q4-Q19, Q36-Q43,

33

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

TR-POWER

PZTA42, NPN, 1000 mW, SOT-223, TP, 25-

Q53-Q60, Q63
3

0502-001066

Q20-Q35

16

0505-001477

Q3, Q44

FET-SILICON

SFR9220, P, 200 V, 3.1 A, 1.5 ohm, 30 W, D-PAK

0505-001478

Q1, Q2, Q61

FET-SILICON

FQU5N40, N, 400 V, 3.4 A, 1.6 ohm, 45 W, I-PAK

0505-001769

Q64

FET-SILICON

FQU12N20, N, 200 V, 9.0 A, 0.28 OHM, 55 W, TO-251

0601-001064

LED1-LED8

LED

SMD, RED/Y-GRN, 1.7 x 2.5 MM, 660/560 NM, 3 x 2.5 x 1.5 MM

0604-001002

U1-U3

PHOTO-COUPLER

TR, 100-600%, 200 mW, SOP-4, TP

0801-001073

U25

IC-CMOS, LOGIC

74ACT74, D FLIP-FLOP, SOP, 14, 150 MIL, DUAL, TP, 4.5/5.5 V

0801-002055

U15, U16

IC-CMOS, LOGIC

74FCT374, D REGISTER, SOP, 20, 300 MIL, OCTAL, TP, 4.5/5.5 V

0801-002215

U24

IC-CMOS, LOGIC

74FCT138, 1-OF-8 DECODER, SOP, 16, 300 MIL, SINGLE, TP,

4.5/5.5 V

SAMSUNG Electronics Co., Ltd.

6-58

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

0801-002403

U4

IC-CMOS, LOGIC

74LCX08, AND GATE, TSSOP, 14, 173 MIL, QUAD, TP, 2.0/3.6 V

0801-002446

U6

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173MIL, HEX, TP,

0802-001026

U18-U20

IC-BICMOS, LOGIC

74ABT16245, BUS TRANSCEIVER, TSSOP, 48, 380 MIL, QUAD,

0802-001084

U27

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 4.5/5.5 V

1203-000302

U5

IC-PWM,

3842B, SOP, 14P, 150 MIL, PLASTIC, 3

1203-001213

U28

1205-000394

U7-U14

IC-CODEC FILTER

TP3057WM, SOP, 16P, PLASTIC, 5.2

1404-000126

PS1-PS8

THERMISTOR-PTC

4.85 ohm, 60 V, 5 mm

1405-000125

V1

VARISTOR

220 V, 4500 A, 17 x 4.2 mm, TP

1405-000130

V2-V9

VARISTOR

270 V, 1200 A, 9 x 4.6 mm, TP

1405-000171

V10-V34

25

VARISTOR

82 V, 1200 A, 9 x 6 mm, TP

2003-000144

R143, R33, R72

R-METAL OXIDE

100 ohm, 2%, 2 W, AA, TP, 6 x 16 mm

2003-001032

R1-R16

16

R-METAL OXIDE(S)

220 ohm, 5%, 1 W, AF, TP, 2.5 x 6.5 mm

2003-002037

R35-R42, R362, R363

10

R-METAL OXIDE(S)

270 ohm, 5%, 2 W, AF, TP, 3.9 x 10 mm

2005-001199

R388

R-WIRE WOUND(S),

0.8 OHM, 1%, 3 W, AA, TP, 6 x 16 MM

2007-000040

R17-R32

2007-000041

R341-R348

2.0/3.6 V
TP, 4.5/5.5 V

CONTROLLER
IC-POSI.ADJUST

431A, SOP, 8P, 150 MIL, PLASTIC, 37 V

REG.

NON

SAMSUNG Electronics Co., Ltd.

16

R-CHIP

150 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

475 ohm, 1%, 1/10 W, TP, 1608

6-59

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-000043

Assembly Position
R104, R109, R114,

Qtty.

Part Name

Description

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R119, R124, R134,

R182
3

2007-000043

2007-000043

R196, R198, R204,

R237, R308, R49, R52
R55, R58, R61, R64,
R67, R70, R99

2007-000045

R142

R-CHIP

3.32 Kohm, 1%, 1/10 W, TP, 1608

2007-000052

R100, R105, R110,

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R115, R120, R125,

R130
3

2007-000052

R135, R145, R146,

R149, R150, R153,
R154

2007-000052

R157, R158, R161,

R162, R165, R166,
R169

2007-000052

R170, R173, R174,

R195, R199, R203,
R208

2007-000052

R209, R259, R260,

R262, R265, R276,
R277

2007-000052

R278, R279, R281,

R300, R301-R304,
R357

SAMSUNG Electronics Co., Ltd.

6-60

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-000052

Assembly Position
R358-R360,

Qtty.

Part Name

Description

14

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

R377-R387
3

2007-000060

R138-R141, R176,
R207, R233, R241,
R245

2007-000060

R298, R34, R45, R46

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

2007-000066

R101, R106, R111,

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

22

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

26

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

33

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R116, R121, R126,

R131
3

2007-000066

R136, R297, R43,

R44, R47, R73-R88,
R97

2007-000070

R268-R275, R307,
R309-R324, R365

2007-000287

R210-R230, R235,
R238, R247,
R250-R258

2007-000287

R264, R267, R280,

R305, R306,
R366-R369

2007-000475

R234

R-CHIP

1 Mohm, 1%, 1/10 W, TP, 1608

2007-000669

R147, R151, R155,

R-CHIP

2 Kohm, 1%, 1/10 W, TP, 1608

R159, R163, R167,

R171
3

2007-000669

R175

R-CHIP

2 Kohm, 1%, 1/10 W, TP, 1608

2007-001139

R197

R-CHIP

7.5 Kohm, 1%, 1/10 W, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-61

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-002901

R205

R-CHIP

12.1 Kohm, 1%, 1/10 W, TP, 1608

2007-002910

R103, R108, R113,

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

12

R-CHIP

30.1 Kohm, 1%, 1/10 W, TP, 1608

R118, R123, R128,

R133
3

2007-002910

R144, R148, R152,

R156, R160, R164,
R168

2007-002910

R172, R187-R194,
R201, R202, R98

2007-002912

R177

R-CHIP

33.2 Kohm, 1%, 1/10 W, TP, 1608

2007-002987

R102, R107, R112,

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

13

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R117, R122, R127,

R132
3

2007-002987

R137, R239, R240,

R244, R263, R89R96

2007-007226

R200

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

2007-007443

R206, R266

R-CHIP

3.01 Kohm, 1%, 1/10 W, TP, 1608

2007-007613

R325-R340

16

R-CHIP

121 ohm, 1%, 1/10 W, TP, 1608

2007-007645

R370-R373

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

2007-007796

R242, R243,

10

R-CHIP

2.21 Kohm, 1%, 1/10 W, TP, 1608

R299

R-CHIP

4.32 Kohm, 1%, 1/10 W, TP, 1608

R48, R50, R51, R53,

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

R349-R356
3

2007-008091

2007-008133

R54, R56, R57, R59,

R60

SAMSUNG Electronics Co., Ltd.

6-62

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-008133

Assembly Position

Qtty.

Part Name

Description

R62, R63, R65, R66,

R-CHIP

56.2 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

12.1 ohm, 1%, 1/10 W, TP, 1608

R68, R69, R71

3

2007-008150

R178-R181,
R183-R186

2011-001099

HYB1, HYB2

R-NET

300 ohm, 5%, 2 W, X, ARRAY, 10, P, BK

2203-000236

C208-C210

C-CER, CHIP

0.1 NF, 5%, 50 V, C0G, TP, 1608

2203-000426

C205

C-CER, CHIP

0.018 NF, 5%, 50 V, C0G, TP, 1608

2203-000888

C89, C90

C-CER, CHIP

4.7 nF, 10%, 50 V, X7R, TP, 1608

2203-000998

C137, C138, C188

C-CER, CHIP

0.047 NF, 5%, 50 V, C0G, TP, 1608

2203-001408

C200

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, TP, 1608

2203-001656

C88

C-CER, CHIP

0.47 nF, 5%, 50 V, NP0, TP, 1608

2203-005144

C101, C102, C105,

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

18

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C106, C109, C110,

C113
3

2203-005144

C114, C117, C118,

C121, C122, C125,
C126

2203-005144

C129, C156-C171,
C98

2203-005218

C176-C183

C-CER, CHIP

470 nF, 10%, 50 V, X7R, TP, 3216

2203-005249

C10, C100, C103,

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C104, C107, C108,

C11

SAMSUNG Electronics Co., Ltd.

6-63

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2203-005249

Assembly Position
C111, C112, C115, C116,

Qtty.

Part Name

Description

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

12

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

21

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

12

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

14

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C119, C12, C120

3

2203-005249

C123, C124, C127, C128,

C13, C130-C136

2203-005249

C139, C14-C17, C140,

C142-C155, C173

2203-005249

C174, C185, C187, C189,

C2-C7, C53, C77

2203-005249

C78, C8, C81, C84-C87, C9,

C93-C97, C99

2203-005565

C201-C204

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1608

2305-000385

C1

C-FILM, LEAD-PEF

470 nF, 10%, 250 V, BK, 18 x 6 x 12, 15

2401-001216

C49, C50, C73, C74

C-AL

4.7, UF, 20%, 100 V, GP, TP, 5 x 11, 5

2402-000120

15

C-AL, SMD

10, UF, 20%, 50 V, GP, TP, 6.6 x 6.6 x 5.4 MM

C172, C175, C186, C25C33, C35, C37, C39

2402-000130

C41, C43, C45, C47

C-AL, SMD

2.2, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.

2402-000170

C191, C34, C36, C38, C40,

C-AL, SMD

1, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.4,

2402-001083

C190, C20, C72, C82, C83

C-AL, SMD

100, UF, 20%, 50 V, GP, TP, 10 x 10.3 x 10

2402-001224

C192-C199, C54-C69

24

C-AL, SMD

10, UF, 20%, 100 V, GP, TP, 8.0 x 10.0 MM

2901-000188

M2, M3

FILTER-EMI ON BOARD

50 V, 1 A, 47, PF, 7.5 x 2.5 x 6.2 mm, TP

3301-001308

L3-L5

BEAD-SMD

10 ohm, 1608, 500 mA, TP, 0.15 ohm

3501-001139

K1-K8

RELAY-MINIATURE

4.5 VDC, 140 MW, 1000 MA, 2FORMC, 4 MS, 4 MS

C42, C44, C46, C48

SAMSUNG Electronics Co., Ltd.

6-64

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
3703-001252

Assembly Position
J1, J2

Qtty.
2

Part Name
CONNECTOR-BACK,

Description
30, P, 5 R, FEMALE, ANGLE-F, AU30U

PANEL
3

3722-002045

J3

JACK-MODULAR

8P/8C, INVERTED, Y, ANGLE, N, BLK, AU15U

EC26-20501A

T2-T9

TRANS AF

INFOREX, 800 mH

EC27-30514A

L1

COIL RF

INFOREX, 35, UH, 40T

EN13-10502A

U21, U22

IC ASIC

DECT, TP3404, PLCC, 28P

EN13-10503A

U23

IC ASIC

DECT, STI-9511, QFP, 60P

GA13-10066A

U17

IC ASIC

DCS, SBS-9401, QFP, 80P

GA13-10576A

HYB3, HYB4

IC HYBRID-BALANCE

DCS-KOR, KP0078SA, SIP, 20, 2000

GA26-10053A

T10-T17

TRANS, PULSE

DGP 360, 144//72.5/72T, 5 mH

GA26-30073A

T1

TRANS, POWER

DCS48V//13V/85 V, 877, UH//100, UH

GA27-30057A

L2

COIL RF

PRO-56EX/120 MX, 72, UH

GA41-00149A

PCB-8HYB

OFFICESERV 7400, FR-4, 4, L, 00, 1.6 T, 130 x 275 MM

SAMSUNG Electronics Co., Ltd.

6-65

CHAPTER 6. ! .

6.10 8HYB2 Board

No
1

Part Code
0401-001099

Assembly Position
D10~D22, D44,

Qtty.

Part Name

Description

17

DIODE-SWITCHING

1N4148WS, 75 V, 150 mA, SOD-323, TP

D7~D9
2

0402-001049

D26

DIODE-RECTIFIER

MURS160, 600 V, 1 A, DO-214 AA

0402-001211

D45

DIODE-RECTIFIER

MURS320, 200 V, 3 A, MSR, TP

0402-001216

D24, D25, D27, D3,

DIODE-RECTIFIER

MURS120, 200 V, 1 A, TO-220F, TP

0403-000283

D1, D2, D23, D6

DIODE-ZENER

MMBZ5234B, 5.78-6.44 V, 225 MW, SOT-23, TP

0403-001396

ZD1, ZD2

DIODE-ZENER

MMSZ5263B, 5%, 500 MW, SOD-123, TP

0403-001416

ZD10~D29, ZD3,

32

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500 MW, SOD-123, TP

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

33

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

D4, D5

ZD30~ZD34,
ZD4~ZD9
8

0501-000476

Q45~Q52, Q62

0501-000477

Q10~Q19, Q36~Q39,
Q4, Q40~Q43, Q5,
Q53~Q59, Q6, Q60,
Q63, Q7~Q9

10

0502-001066

Q20~Q27

TR-POWER

PZTA42, NPN, 1000 mW, SOT-223, TP, 25-

11

0502-001067

Q28~Q35

TR-POWER

FZT957, PNP, 3 W, SOT-223, TP, 100-3

12

0505-001477

Q3, Q44

FET-SILICON

SFR9220, P, 200 V, 3.1 A, 1.5 ohm, 30 W, D-PAK

13

0505-001478

Q1, Q2, Q61

FET-SILICON

FQU5N40, N, 400 V, 3.4 A, 1.6 ohm, 45 W, I-PAK

14

0505-001769

Q64

FET-SILICON

FQU12N20, N, 200 V, 9.0A, 0.28OHM, 55W, TO-251

15

0604-001002

U1~U3

PHOTO-COUPLER

TR, 100-600%, 200 mW, SOP-4, TP

16

0801-001073

U25

IC-CMOS, LOGIC

74ACT74, D FLIP-FLOP, SOP, 14, 150MIL, DUAL, TP, 4.5/5.5 V

SAMSUNG Electronics Co., Ltd.

6-66

OfficeServ 7400 Service Manual

(continued)
No
17

Part Code
0801-002215

Assembly Position
U24

Qtty.
1

Part Name
IC-CMOS, LOGIC

Description
74FCT138, 1-OF-8 DECODER, SOP, 16, 300MIL, SINGLE, TP,
4.5/5.5 V

18

0801-002403

U4

IC-CMOS, LOGIC

74LCX08, AND GATE, TSSOP, 14, 173MIL, QUAD, TP, 2.0/3.6 V

19

0801-002446

U6

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173MIL, HEX, TP,

20

0802-001026

U18~U20

IC-BICMOS, LOGIC

74ABT16245, BUS TRANSCEIVER, TSSOP, 48, 380MIL, QUAD, TP,

2.0/3.6 V
4.5/5.5 V
21

0802-001084

U27

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173MIL, QUAD, TP, 4.5/5.5 V

22

1203-000302

U5

IC-PWM,

3842B, SOP, 14P, 150MIL, PLASTIC, 3

23

1203-001213

U28

IC-VOL. REFERANCE

24

1205-000120

U9~U14

IC-CODEC

CONTROLLER
431 A, SOP, 8P, 150MIL, PLASTIC, 37V
TP3054WMX, SOP, 16P, 300MIL, PLASTIC, 5.25 V, 60 MW,
-25TO+125C, TP
25

1404-000126

PS1~PS8

THERMISTOR-PTC

4.85 ohm, 60 V, 5 mm

26

1405-000125

V1

VARISTOR

220 V, 4500A, 17 x 4.2 mm, TP

27

1405-000130

V2~V9

VARISTOR

270 V, 1200A, 9 x 4.6 mm, TP

28

1405-000171

V10~V34

25

VARISTOR

82 V, 1200A, 9 x 6 mm, TP

29

2003-000458

R143, R33, R72

R-METAL OXIDE(S)

100 ohm, 5%, 2W, AF, TP, 4 x 12 mm

30

2003-001032

R1~R16

16

R-METAL OXIDE(S)

220 ohm, 5%, 1W, AF, TP, 2.5 x 6.5 mm

31

2003-002037

R35, R36, R362,

10

R-METAL OXIDE(S)

270 ohm, 5%, 2 W, AF, TP, 3.9 x 10 mm

16

R-CHIP

150 ohm, 1%, 1/10W, TP, 1608

R363, R37~R42
32

2007-000040

SAMSUNG Electronics Co., Ltd.

R17~R32

6-67

CHAPTER 6. ! .

(continued)
No
33

Part Code
2007-000043

Assembly Position
R104, R109, R114,

Qtty.

Part Name

Description

19

R-CHIP

1 kohm, 1%, 1/10W, TP, 1608

R-CHIP

3.32 kohm, 1%, 1/10W, TP, 1608

22

R-CHIP

10 kohm, 1%, 1/10W, TP, 1608

29

R-CHIP

10 kohm, 1%, 1/10W, TP, 1608

R-CHIP

10 kohm, 1%, 1/10W, TP, 1608

R119, R124, R129,

R134, R182, R196,
R198, R204, R308,
R49, R52, R55, R58,
R61, R64, R67, R70,
R99
34

2007-000045

35

2007-000052

R142
R100, R105, R110,
R115, R120, R125,
R130, R135, R145,
R146, R149, R150,
R153, R154, R157,
R158, R161, R162,
R165, R166, R169,
R170,

36

2007-000052

R173, R174, R195,

R199, R203, R208,
R209, R259, R260,
R262, R265~R279,
R281, R300~R304,
R357, R358~R360,

36

2007-000052

SAMSUNG Electronics Co., Ltd.

R377~R387

6-68

OfficeServ 7400 Service Manual

(continued)
No
37

Part Code
2007-000060

Assembly Position
R138~R141, R176,

Qtty.

Part Name

Description

13

R-CHIP

100 kohm, 1%, 1/10 W, TP, 1608

29

R-CHIP

20 kohm, 1%, 1/10 W, TP, 1608

18

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

44

R-CHIP

100 ohm, 1%, 1/10 W, TP, 1608

R234

R-CHIP

1 Mohm, 1%, 1/10 W, TP, 1608

R147, R151, R155,

R-CHIP

2 kohm, 1%, 1/10 W, TP, 1608

R207, R233, R241,

R245, R298, R34,
R45, R46
38

2007-000066

R101, R106, R111,

R116, R121, R126,
R131, R136, R297,
R43, R44, R47,
R73~R88, R97

39

2007-000070

R187~R194, R268,
R269, R270~R275,
R307, R365

40

2007-000287

R210~R230, R235,
R236, R238, R247,
R250~R258, R264,
R267, R280, R305,
R306, R366~R369

41

2007-000475

42

2007-000669

R159, R163, R167,

R171, R175
43

2007-001139

R197

R-CHIP

7.5 kohm, 1%, 1/10 W, TP, 1608

44

2007-002901

R205

R-CHIP

12.1 kohm, 1%, 1/10 W, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-69

CHAPTER 6. ! .

(continued)
No
45

Part Code
2007-002910

Assembly Position
R103, R108, R113,

Qtty.

Part Name

Description

18

R-CHIP

30.1 kohm, 1%, 1/10 W, TP, 1608

R-CHIP

33.2 kohm, 1%, 1/10 W, TP, 1608

20

R-CHIP

4.75 kohm, 1%, 1/10 W, TP, 1608

R118, R123, R128,

R133, R144, R148,
R152, R156, R160,
R164, R168, R172,
R201, R202, R98
46

2007-002912

47

2007-002987

R177
R102, R107, R112,
R117, R122, R127,
R132, R137, R239,
R240, R244, R263,
R89~R96

48

2007-007226

R200

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

49

2007-007443

R206, R266

R-CHIP

3.01 kohm, 1%, 1/10 W, TP, 1608

50

2007-007613

R325~R340

16

R-CHIP

121 ohm, 1%, 1/10 W, TP, 1608

51

2007-007645

R370~R373

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

52

2007-007796

R242, R243

R-CHIP

2.21 kohm, 1%, 1/10 W, TP, 1608

53

2007-008091

R299

R-CHIP

4.32 kohm, 1%, 1/10 W, TP, 1608

54

2007-008133

R48, R50, R51, R53,

12

R-CHIP

56.2 kohm, 1%, 1/10 W, TP, 1608

R-CHIP

12.1 ohm, 1%, 1/10 W, TP, 1608

R54, R56, R57, R59,

R60, R62, R63, R65,
R66, R68, R69, R71
55

2007-008150

SAMSUNG Electronics Co., Ltd.

R178~R186

6-70

OfficeServ 7400 Service Manual

(continued)
No
56

Part Code
2011-001099

Assembly Position
HYB1, HYB2

Qtty.
2

Part Name
R-NET

Description
300 ohm, 5%, 2W, X, ARRAY, 10P,
BK

57

2203-000236

C200, C208~C210

C-CER, CHIP

0.1 nF, 5%, 50 V, C0G, 1608

58

2203-000426

C205

C-CER, CHIP

0.018 nF, 5%, 50 V, C0G, 1608

59

2203-000888

C89, C90

C-CER, CHIP

4.7 nF, 10%, 50 V, X7R, TP, 1608

60

2203-000998

C137, C138, C188

C-CER, CHIP

0.047 nF, 5%, 50 V, C0G, TP, 1608

61

2203-001656

C88

C-CER, CHIP

0.47 nF, 5%, 50 V, NP0, TP, 1608

62

2203-005144

C101, C102, C105, C106, C109, C110,

22

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C113, C114, C117, C118, C121, C122, C125,

C126, C129, C156, C157, C158, C159,
C160~C171, C98
63

2203-005218

C176~C183

C-CER, CHIP

470 nF, 10%, 50 V, X7R, TP, 3216

64

2203-005249

C10, C100, C103, C104, C107, C108, C11,

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C111, C112, C115, C116, C119, C12, C120,

C123, C124, C127, C128, C13, C130, C131,
C132~C136, C139, C14, C140, C142~C149,
C15, C150~C155, C16, C17, C173, C174,
C185, C187, C189, C2~C4, C5, C53, C6,
C7, C77, C78, C8, C81, C84~C87, C9, C93,
C94, C95, C99

SAMSUNG Electronics Co., Ltd.

6-71

CHAPTER 6. ! .

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

65

2203-005565

C203, C204

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1608

66

2305-000385

C1

C-FILM, LEAD-PEF

470 nF, 10%, 250 V, BK, 18 x 6 x 12, 15

67

2401-001216

C49, C50, C73, C74

C-AL

4.7, UF, 20%, 100 V, GP, TP, 5 x1 1, 5

68

2402-000120

C172, C175, C186,

10

C-AL, SMD

10, UF, 20%, 50 V, GP, TP, 6.6 x 6.6 x 5.4 mm

C-AL, SMD

2.2, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.

C-AL, SMD

1, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.4

C-AL, SMD

100, UF, 20%, 50 V, GP, TP, 10 x 10.3 x 10

C-AL, SMD

10, UF, 20%, 100 V, GP, TP, 8.0 x 10.0mm

FILTER-EMI ON

50 V, 1 A, 47pF, 7.5 x 2.5 x 6.2 mm, TP

C25~C32
69

2402-000130

C33, C35, C37, C39,

C41, C43, C45, C47

70

2402-000170

C191, C34, C36, C38,

C40, C42, C44, C46,
C48

71

2402-001083

C190, C20, C72, C82,

C83

72

2402-001224

C192~C199, C54~C69

73

2901-000188

M2, M3

BOARD
74

3301-001308

L3~L5

BEAD-SMD

10 OHM, 1608, 500, TP, 0.15

75

3501-001139

K1~K8

RELAY-MINIATURE

4.5 VDC, 140 MW, 1000 MA, 2FORMC, 4 MS, 4 MS

76

3703-001252

J1, J2

CONNECTOR-BACK,

30P, 5R, FEMALE, ANGLE-F, AU30U

PANEL
77

3722-001302

J3

JACK-MODULAR

8P, ANGLE, BLK, AU50U

78

EC26-20501A

T2~T9

TRANS AF

INFOREX, 800 mH

79

EC27-30514A

L1

COIL RF

INFOREX, 35uH, 40T

80

EN13-10502A

U21, U22

IC ASIC

DECT, TP3404, PLCC, 28P

SAMSUNG Electronics Co., Ltd.

6-72

OfficeServ 7400 Service Manual

(continued)
No

Part Code

81

EN13-10503A

U23

IC ASIC

DECT, STI-9511, QFP, 60P

82

GA13-10066A

U17

IC ASIC

DCS, SBS-9401, QFP, 80P

83

GA13-10576A

HYB3, HYB4

IC HYBRID-BALANCE

DCS-KOR, KP0078SA, SIP, 20, 2000

84

GA26-10053A

T10~T13

TRANS, PULSE

DGP 360, 144//72.5/72T, 5 mH

85

GA26-10053A

T14

TRANS, PULSE

DGP 360, 144//72.5/72T, 5 mH

86

GA26-10053A

T15, T16

TRANS, PULSE

DGP 360, 144//72.5/72T, 5 mH

87

GA26-10053A

T17

TRANS, PULSE

DGP 360, 144//72.5/72T, 5 mH

88

GA26-30073A

T1

TRANS, POWER

DCS, -48 V//13 V/85 V, 877, UH//100, UH

89

GA27-30057A

L2

COIL RF

PRO-56EX/120MX, 72uH

90

GA41-00191A

PCS.01

PCB-8HYB2

OFFICESERV 7200, FR4, 4L, 1.6, 130 x 275 mm, 8HYB2

SAMSUNG Electronics Co., Ltd.

Assembly Position

Qtty.

Part Name

Description

6-73

CHAPTER 6. ! .

6.11 8DLI Board

Level
2

Part Code
GA92-02771A

Assembly Position
-

Qtty.
1

Part Name

Description

PBA MAIN-8PORTDI

OFFICESERV 7400, DOM/EXP, WORLD,

GITALSUBSCRIB

8PORTDIGITALSUBSCRIB, 2PCB, 130*275*1.6T, 8 DLI

0401-001099

D33, D35

DIODE-SWITCHING

1N4148WS, 75 V, 150 MA, SOD-323, TP

0402-001211

D34

DIODE-RECTIFIER

MURS320, 200 V, 3 A, MSR, TP

0403-001416

ZD1-ZD16

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500 MW, SOD-123, TP

0501-000476

Q2

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

0501-000477

Q1

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

0505-001769

Q3

FET-SILICON

FQU12N20, N, 200 V, 9.0 A, 0.28 OHM, 55 W, TO-251

0601-001064

LED1-LED8

LED

SMD, RED/Y-GRN, 1.7 x 2.5 MM, 660/560 NM, 3 x 2.5 x 1.5 MM

0801-000379

U7

IC-CMOS, LOGIC

74HC00, NAND GATE, SOP, 14, 150 MIL, QUAD, TP, 2.0/6.0 V

0801-000841

U6

IC-CMOS, LOGIC

74ACT14, INVERTER, SOP, 14, 150 MIL, HEX, ST, 4.5/5.5 V

0801-001071

U12

IC-CMOS, LOGIC

74ACT08, AND GATE, SOP, 14, 150 MIL, QUAD, TP, 4.5/5.5 V

0801-001073

U13

IC-CMOS, LOGIC

74ACT74, D FLIP-FLOP, SOP, 14, 150 MIL, DUAL, TP, 4.5/5.5 V

0801-002055

U14

IC-CMOS, LOGIC

74FCT374, D REGISTER, SOP, 20, 300 MIL, OCTAL, TP, 4.5/5.5 V

0801-002215

U8

IC-CMOS, LOGIC

74FCT138, 1-OF-8 DECODER, SOP, 16, 300 MIL, SINGLE, TP,

0802-000111

U9-U11

IC-BICMOS, LOGIC

74FCT245, BUS TRANSCEIVER, SOP, 20, 300 MIL, OCTAL, ST,

0802-001084

U3, U4

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 4.5/5.5 V

1404-000126

P28-P35

THERMISTOR-PTC

4.85 ohm, 60 V, 5 mm

1405-000171

VARISTOR

82 V, 1200 A, 9 x 6 mm, TP

16

4.5/5.5 V
4.75/5.25 V

V9-V24, V41,

25

V50-V57

SAMSUNG Electronics Co., Ltd.

6-74

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2005-001199

Assembly Position
R1121

Qtty.
1

Part Name
R-WIRE WOUND(S),

Description
0.8 OHM, 1%, 3 W, AA, TP, 6 x 16 MM

NON
3

2007-000041

R1002, R1004, R1006,

R-CHIP

475 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

475 ohm, 1%, 1/10 W, TP, 1608

10

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R1008, R1010
3

2007-000041

2007-000052

R1012, R1014, R1016,

R1119, R1120,
R960-R966, R969

2007-000052

R970, R971,
R975-R977

2007-000060

R1030-R1032

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

2007-000066

R1067

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

2007-000070

18

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

14

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R1036, R1037,
R1087-R1102

2007-000287

R978-R979, R982-

2007-000475

R1062

R-CHIP

1 Mohm, 1%, 1/10 W, TP, 1608

2007-002987

R1019-R1025

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

2007-007443

R1063

R-CHIP

3.01 Kohm, 1%, 1/10 W, TP, 1608

2007-007645

R1038-R1056,

24

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

21

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R990, R999-R1001

R1058-R1061, R1068
3

2007-007645

R1069-R1071, R939R948, R952-R959

2007-007796

R1033-R1035

R-CHIP

2.21 Kohm, 1%, 1/10 W, TP, 1608

2007-008091

R1066

R-CHIP

4.32 Kohm, 1%, 1/10 W, TP, 1608

2007-008122

R1064

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-75

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2203-000236

C93, C106

C-CER, CHIP

0.1 NF, 5%, 50 V, C0G, TP, 1608

2203-000257

C102

C-CER, CHIP

10 nF, 10%, 50 V, X7R, TP, 1608

2203-000998

C100, C101, C42-C44,

C-CER, CHIP

0.047 NF, 5%, 50 V, C0G, TP, 1608

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

470 nF, 10%, 50 V, X7R, TP, 3216

20

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50V, X7R, TP, 1608

C98
3

2203-005144

C45, C46, C48, C49,

C51, C52, C54, C55

2203-005144

C57, C58, C60, C61,

C63, C64, C66, C67

2203-005218

2203-005249

C8-C15
C28-C41, C47, C50,
C53, C56, C59, C62

2203-005249

C65, C68, C94, C96,

C97

2203-005457

C107, C108

C-CER, CHIP

1 NF, 10%, 2 KV, X7R, TP, 4520

2203-005565

C103, C104, C111

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1608

2402-000120

C3-C5

C-AL, SMD

10, UF, 20 %, 50 V, GP, TP, 6.6 x 6.6 x 5.4 MM

2402-000170

C7

C-AL, SMD

1, UF, 20 %, 50 V, GP, TP, 4.3 x 4.3 x 5.4,

2402-001083

C6

C-AL, SMD

100, UF, 20 %, 50 V, GP, TP, 10 x 10.3 x 10

3301-001463

L2-L5

BEAD-SMD

120 ohm, 1.6 x 0.8 x 0.8 mm, 200 mA, TP, 0.5 ohm

3703-001252

P26, P27

CONNECTOR-BACK,

30, P, 5 R, FEMALE, ANGLE-F, AU30U

PANEL
3

3722-002045

SAMSUNG Electronics Co., Ltd.

J1

JACK-MODULAR

8P/8C, INVERTED, Y, ANGLE, N, BLK, AU15U

6-76

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

EN13-10502A

U16, U17

IC ASIC

DECT, TP3404, PLCC, 28, P

EN13-10503A

U2

IC ASIC

DECT, STI-9511, QFP, 60, P

GA26-10053A

T1-T8

GA27-30057A

L1

COIL RF

PRO-56EX/120 MX, 72, UH

GA41-00138A

PCB-16DLI

OFFICESERV 7400, FR-4, 4, L, 00, 1.6 T, 130 x 275 MM

SAMSUNG Electronics Co., Ltd.

TRANS, PULSE

DGP 360, 144//72.5/72 T, 5 mH

6-77

CHAPTER 6. ! .

6.12 16DLI Board

Level
2

Part Code
GA92-02770A

Assembly Position
-

Qtty.
1

Part Name

Description

PBA MAIN-16PORTDI

OFFICESERV 7400, DOM/EXP, WORLD,

GITALSUBSCRI

16PORTDIGITALSUBSCRI, FR-4, 4, L, 130 x 275 x 1.6T, 16 DLI

0401-001099

D33, D35

DIODE-SWITCHING

1N4148WS, 75 V, 150 MA, SOD-323, TP

0402-001211

D34

DIODE-RECTIFIER

MURS320, 200 V, 3A, MSR, TP

0403-001416

ZD1-ZD32

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500 MW, SOD-123, TP

0501-000476

Q2

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

0501-000477

Q1

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

0505-001769

Q3

FET-SILICON

FQU12N20, N, 200 V, 9.0A, 0.28 OHM, 55 W, TO-251

0601-001064

LED1-LED8

LED

SMD, RED/Y-GRN, 1.7 x 2.5 MM, 660/560 NM, 3 x 2.5 x 1.5 MM

32

0801-000379

U7

IC-CMOS, LOGIC

74HC00, NAND GATE, SOP, 14, 150 MIL, QUAD, TP, 2.0/6.0 V

0801-000841

U6

IC-CMOS, LOGIC

74ACT14, INVERTER, SOP, 14, 150 MIL, HEX, ST, 4.5/5.5 V

0801-001071

U12

IC-CMOS, LOGIC

74ACT08, AND GATE, SOP, 14, 150 MIL, QUAD, TP, 4.5/5.5 V

0801-001073

U13

IC-CMOS, LOGIC

74ACT74, D FLIP-FLOP, SOP, 14, 150 MIL, DUAL, TP, 4.5/5.5 V

0801-002055

U14, U15

IC-CMOS, LOGIC

74FCT374, D REGISTER, SOP, 20, 300 MIL, OCTAL, TP, 4.5/5.5 V

0801-002215

U8

IC-CMOS, LOGIC

74FCT138, 1-OF-8 DECODER, SOP, 16, 300 MIL, SINGLE, TP,

4.5/5.5 V

0802-000111

U9-U11

IC-BICMOS, LOGIC

74FCT245, BUS TRANSCEIVER, SOP, 20, 300 MIL, OCTAL, ST,

0802-001084

U3, U4

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 4.5/5.5 V

1404-000126

P28-P43

16

THERMISTOR-PTC

4.85 ohm, 60 V, 5 mm

1405-000171

V9-V57

59

VARISTOR

82 V, 1200 A, 9 x 6 mm, TP

2005-001199

R1200

R-WIRE WOUND(S),

0.8 OHM, 1%, 3W, AA, TP, 6 x 16 MM

4.75/5.25 V

NON

SAMSUNG Electronics Co., Ltd.

6-78

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-000041

Assembly Position
R1002, R1004,

Qtty.

Part Name

Description

R-CHIP

475 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

475 ohm, 1%, 1/10 W, TP, 1608

18

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

R1006, R1008
3

2007-000041

R1010, R1012,
R1014, R1016

2007-000052

R960-R971,
R973-R977, R1119

2007-000060

R1027, R1028,
R1030-R1032

2007-000066

R1067

2007-000070

R1036, R1037,

R-CHIP

20 Kohm, 1%, 1/10 W, TP, 1608

34

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

24

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R1087-R1118
3

2007-000287

R978-R1001

2007-000475

R1062

R-CHIP

1 Mohm, 1%, 1/10 W, TP, 1608

2007-002987

R1018-R1025

4.75 Kohm, 1%, 1/10 W, TP, 1608

2007-007443

R1063

2007-007645

R1038-R1057,

2007-007645

R1069, R1070, R939-

2007-007796

R1003, R1005, R1007

R-CHIP

3.01 Kohm, 1%, 1/10 W, TP, 1608

24

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

20

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

2.21 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

2.21 Kohm, 1%, 1/10 W, TP, 1608

R1059-R1061, R1068
R948, R952-R959
R1009, R1011
3

2007-007796

R1013, R1015, R1017

R1033-R1035

2007-008091

R1066

R-CHIP

4.32 Kohm, 1%, 1/10 W, TP, 1608

2007-008122

R1064, R1065

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

2203-000236

C93, C106

C-CER, CHIP

0.1 NF, 5%, 50 V, C0G, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-79

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2203-000257

C102

C-CER, CHIP

10 nF, 10%, 50 V, X7R, TP, 1608

2203-000998

C100, C101,

C-CER, CHIP

0.047 NF, 5%, 50 V, C0G, TP, 1608

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C8-C23

16

C-CER, CHIP

470 nF, 10%, 50 V, X7R, TP, 3216

C24-C41, C47, C50,

24

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C42-C44, C98, C99

3

2203-005144

C45, C46, C48, C49,

C51, C52, C54, C55

2203-005144

2203-005144

2203-005144

C57, C58, C60, C61,

C63, C64, C66, C67
C69, C70, C72, C73,
C75, C76, C78, C79
C81, C82, C84, C85,
C87, C88, C90, C91

2203-005218

2203-005249

C53, C56, C59, C62

3

2203-005249

C65, C68, C71, C74,

C77, C80, C83, C86

2203-005249

C89, C92, C94, C96,

2203-005457

C107, C108

C-CER, CHIP

1 NF, 10%, 2 KV, X7R, TP, 4520

2203-005565

C103, C104, C111

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1608

2402-000120

C1-C5

C-AL, SMD

10, UF, 20%, 50 V, GP, TP, 6.6 x 6.6 x 5.4 MM

2402-000170

C7

C-AL, SMD

1, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.4,

2402-001083

C6

C-AL, SMD

100, UF, 20%, 50 V, GP, TP, 10 x 10.3 x 10

3301-001463

L2-L5

BEAD-SMD

120 ohm, 1.6 x 0.8 x 0.8 mm, 200 mA, TP, 0.5 ohm

3703-001252

P26, P27

CONNECTOR-BACK,

30, P, 5 R, FEMALE, ANGLE-F, AU30U

C97

PANEL

SAMSUNG Electronics Co., Ltd.

6-80

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
3722-002045

Assembly Position
J1

Qtty.
1

Part Name
JACK-MODULAR

Description
8P/8C, INVERTED, Y, ANGLE, N, BLK, AU15U

EN13-10502A

U16-U19

IC ASIC

DECT, TP3404, PLCC, 28P

EN13-10503A

U1, U2

IC ASIC

DECT, STI-9511, QFP, 60P

16

GA26-10053A

T1-T16

TRANS, PULSE

DGP 360, 144//72.5/72T, 5 mH

GA27-30057A

L1

COIL RF

PRO-56EX/120 MX, 72, UH

GA41-00138A

PCB-16DLI

OFFICESERV 7400, FR-4, 4, L, 00, 1.6T, 130 x 275 MM

SAMSUNG Electronics Co., Ltd.

6-81

CHAPTER 6. ! .

6.13 16DLI2 Board

No

Part Code

Assembly Position

Qtty.

Part Name

Description

0401-001099

D33, D35

DIODE-SWITCHING

1N4148WS, 75V, 150 mA, SOD-323, TP

0402-001211

D34

DIODE-RECTIFIER

MURS320, 200 V, 3 A, MSR, TP

0403-001416

ZD1, ZD10~ZD19,

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500 MW, SOD-123, TP

32

ZD2, ZD20~ZD29,
ZD3, ZD30~ZD32,
ZD4~ZD9
4

0501-000476

Q2

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

0501-000477

Q1

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

0505-001769

Q3

FET-SILICON

FQU12N20, N, 200V, 9.0A, 0.28 ohm, 55W, TO-251

0801-000379

U7

IC-CMOS, LOGIC

74HC00, NAND GATE, SOP, 14, 150MIL, QUAD, TP, 2.0/6.0 V

0801-000841

U6

IC-CMOS, LOGIC

74ACT14, INVERTER, SOP, 14, 150MIL, HEX, ST, 4.5/5.5 V

0801-001071

U12

IC-CMOS, LOGIC

74ACT08, AND GATE, SOP, 14, 150MIL, QUAD, TP, 4.5/5.5 V

10

0801-001073

U13

IC-CMOS, LOGIC

74ACT74, D FLIP-FLOP, SOP, 14, 150MIL, DUAL, TP, 4.5/5.5 V

11

0801-002215

U8

IC-CMOS, LOGIC

74FCT138, 1-OF-8 DECODER, SOP, 16, 300MIL, SINGLE, TP, 4.5/5.5 V

12

0802-000111

U9~U11

IC-CMOS, LOGIC

74FCT245, BUS TRANSCEIVER, SOP, 20P, 12.8 x 7.5 mm, OCTAL, ST,

13

0802-001084

U3, U22

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173MIL, QUAD, TP, 4.5/5.5 V

14

1404-000126

P28~P43

16

THERMISTOR-PTC

4.85 ohm, 60V, 5 mm

15

1405-000171

V10~V57, V9

58

VARISTOR

82 V, 1200A, 9 x 6 mm, TP

0to+70C

SAMSUNG Electronics Co., Ltd.

6-82

OfficeServ 7400 Service Manual

(continued)
No
16

Part Code
2005-001199

Assembly Position
R1125

Qtty.
1

Part Name
R-WIRE WOUND(S),

Description
0.8 ohm, 1%, 3W, AA, TP, 6 x 16 mm

NON
17

2007-000052

R1119, R960~R977

19

R-CHIP

10 kohm, 1%, 1/10W, TP, 1608

18

2007-000060

R1027, R1028,

R-CHIP

100 kohm, 1%, 1/10W, TP, 1608

19

2007-000066

R1067

R-CHIP

20 kohm, 1%, 1/10W, TP, 1608

20

2007-000070

R1036, R1037,

34

R-CHIP

0 ohm, 5%, 1/10W, TP, 1608

21

2007-000287

R1000, R1001, R1060,

26

R-CHIP

100 ohm, 1%, 1/10W, TP, 1608

22

2007-000475

R1062

R-CHIP

1 Mohm, 1%, 1/10W, TP, 1608

23

2007-002987

R1018~R1025

R-CHIP

4.75 kohm, 1%, 1/10W, TP, 1608

24

2007-007443

R1063

R-CHIP

3.01 kohm, 1%, 1/10W, TP, 1608

25

2007-007645

R1038~R1070,

R-CHIP

51.1 ohm, 1%, 1/10W, TP, 1608

R1030~R1032

R1087~R1118
R1061, R978~R999

R1121~R1124,
R939~R948,
R952~R959
26

2007-007796

R1033~R1035

R-CHIP

2.21 kohm, 1%, 1/10W, TP, 1608

27

2007-008091

R1066

R-CHIP

4.32 kohm, 1%, 1/10W, TP, 1608

28

2203-000236

C93, C106

C-CER, CHIP

0.1nF, 5%, 50 V, C0G, 1608

29

2203-000257

C102

C-CER, CHIP

10nF, 10%, 50 V, X7R, 1608

30

2203-000626

C100, C101

C-CER, CHIP

0.022nF, 5%, 50 V, C0G, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-83

CHAPTER 6. ! .

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

31

2203-000815

C112~C119

C-CER, CHIP

0.033 nF, 5%, 50 V, C0G, TP, 1608

32

2203-000998

C42~C44, C98, C99

C-CER, CHIP

0.047 nF, 5%, 50 V, C0G, TP, 1608

33

2203-005144

C45, C46, C48, C49,

32

C-CER, CHIP

1000 nF, 10%, 10 V, X7R, TP, 2012

C51, C52, C54, C55,

C57, C58, C60, C61,
C63, C64, C66, C67,
C69, C70, C72, C73,
C75, C76, C78, C79,
C81, C82, C84, C85,
C87, C88, C90, C91
34

2203-005218

C9~C23

15

C-CER, CHIP

470 nF, 10%, 50 V, X7R, TP, 3216

35

2203-005249

C24~C30, C33~C41,

33

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C47, C50, C53, C56,

C59, C62, C65, C68,
C71, C74, C77, C80,
C83, C86, C89, C92,
C94, C96, C97
36

2203-005457

C107, C108

C-CER, CHIP

1 nF, 10%, 2 KV, X7R, TP, 4520

37

2203-005565

C111

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1608

38

2402-000120

C1~C5

C-AL, SMD

10, UF, 20%, 50 V, GP, TP, 6.6 x 6.6 x 5.4 mm

39

2402-000170

C7

C-AL, SMD

1, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.4,

40

2402-001083

C6

C-AL, SMD

100, UF, 20%, 50 V, GP, TP, 10 x 10.3 x 10

41

3301-001463

L2~L5

BEAD-SMD

120 ohm, 1608, 200, TP, 0.5

SAMSUNG Electronics Co., Ltd.

6-84

OfficeServ 7400 Service Manual

(continued)
No

Part Code

42

3703-001252

Assembly Position
P26, P27, P44

Qtty.
3

Part Name
CONNECTOR-BACK,

Description
30P, 5R, FEMALE, ANGLE-F, AU30U

PANEL
43

3722-001302

J1

JACK-MODULAR

8P/16PORT, AU50U, BLK, NO

44

EN13-10502A

U16~U19, U1, U2

IC ASIC

DECT, TP3404, PLCC, 28P

45

GA26-10053A

T1, T10~T16, T2~T9

TRANS, PULSE

DGP 360, 144//72.5/72T, 5mH

46

GA27-30057A

L1

COIL RF

PRO-56EX/120MX, 72uH

47

GA41-00186A

PCS.01

PCB

OFFICESERV 7200, FR4, 4L, 1.6 T, 130 x 275 mm

SAMSUNG Electronics Co., Ltd.

16

6-85

CHAPTER 6. ! .

6.14 MGI Board

Level
2

Part Code
GA92-02766A

Assembly Position
-

Qtty.
1

Part Name

Description

PBA MAIN-MEDIAGAT

OFFICESERV 7400, DOM/EXP, WORLD,

EWAYINTERFAC

MEDIAGATEWAYINTERFAC, FR-4, 4, L, 130*275*1.6T, MGI

0402-001207

D3-D5

DIODE-SCHOTTKY

UPS5819, 40 V, 1000 MA, DO-216 AA, TP

0406-001070

D1, D2

DIODE-TVS

LC03-6, 6.8/-/-V, 750 W, SO-8

0601-001064

LED1-LED8

LED

SMD, RED/Y-GRN, 1.7 x 2.5 MM, 660/560 NM, 3 x 2.5 x 1.5 MM

0801-000906

U35

IC-CMOS, LOGIC

74HCT74, D FLIP-FLOP, SOP, 14, 150 MIL, DUAL, TP, 4.5/5.5 V

0801-002295

U29

IC-CMOS, LOGIC

74HCT259, 8BIT, LATCH, SOP, 16P, 39

0801-002381

U7

IC-CMOS, LOGIC

74LCX138, DECODER/DEMULTIPLEXE, SOP, 16, 150 MIL,

0801-002403

U10

IC-CMOS, LOGIC

74LCX08, AND GATE, TSSOP, 14, 173 MIL, QUAD, TP, 2.0/3.6 V

0801-002446

U27

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173 MIL, HEX, TP,

0801-002625

U31, U32

IC-CMOS, LOGIC

0802-001029

U11-U13, U2-U4

IC-BICMOS, LOGIC

SINGLE, TP, 2.0/3.6 V

2.0/3.6 V
74ALVC1G125, BUS BUFFER, SOP, 5, 49 MIL, SINGLE, TP,
2.7/3.6 V
74LVTH16245, TRANSCEIVER, TSSOP, 48, 240 MIL, DUAL, TP,
2.7/3.6 V
3

0802-001099

U26, U28, U36, U38

IC-BICMOS, LOGIC

74LVTH125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 2.7/3.6 V

0903-001151

U6

IC-MICROCONTROLLER

32C50100, QFP, 208P, 40 MHZ, TR, CMOS, 3.3 V, 0TO+70C,

1006-001140

U8

IC-LINE TRANSCEIVER

32 BIT
3232, SSOP, 16P, 212 MIL, DUAL, TP, PLASTIC, 5.5 V, 0to+70C,
571 mW, 2, 2
3

1105-001103

U1, U9

IC-DRAM

4S641632, 1M x 16 x 4 BIT, TSOP, 54, P, 400 MIL, 10NS, 3.3 V,

10%, PLASTIC, 0TO+70C, 30 MA, CMOS, TR

SAMSUNG Electronics Co., Ltd.

6-86

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
1106-001354

Assembly Position
U16, U25

Qtty.
2

Part Name
IC-SRAM

Description
6X4008, 512KX8 BIT, TSOP2, 32, P, 400 MIL, 70NS, 3.3 V, 10%,
PLASTIC, 0TO+70C, 15UA, CMOS, ST

1107-001118

U19

IC-FLASH MEMORY

29LV040, 512K x 8, PLCC, 32, P, 11.4 x 13.9 mm, 2.7/3.6 V,

0to+70C

1107-001367

U21-U23

IC-FLASH MEMORY

29LV160, 2Mx8/1Mx16, TSOP, 48P, 18.4x12 mm, 2.7/3.6 V,

-40to+85, C

1109-000126

U17, U18

IC-FIFO

7201, 512 x 9 BIT, PLCC, 32, P, 13.9 x 11.4 MM, 50 NS, 5 V, 0.1,
PLASTIC, 0TO+70, C, 5 MA, CMOS, TR

1203-001227

U34

IC-RESET

DS1233D, SOT-223, 4, P, 6.3X3.3 MM, PLASTIC40TO+85C, 8 MA,

1203-001643

U15

IC-RESET

DS1706, SOIC, 8P, 150 MIL, PLASTIC40TO+85C, TP

1203-002267

U30

IC-POSI.FIXED REG.

TP

TO-263-5, 5P, 400 MIL, PLASTIC, 1.782/1.818 V, 3W,

-40TO+125C, 1.5 A, TP

1205-001864

U5

IC-TRANSCEIVER

1301-001473

U24

IC-CPLD

DJLXT972ALC, LQFP, 64P, 393 MIL, PLASTIC, 4 V, 0TO+70C, TR

3064, TQFP, 100P, 16 x 16 MM, 10NS, 3.3 V, 0.1, 0TO+85C,
PLASTIC, 66, 66, 2, 222.2 MHZ0.5/5.7

2007-000029

L1, L4, L5, L9

R-CHIP

0 ohm, 5%, 1/8 W, TP, 2012

2007-000043

R183-R185, R200,

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

48

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

11

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

17

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R337, R342
3

2007-000043

R356-R359, R364

2007-000052

R10, R11, R100-R108,

R119-R155

2007-000052

R160, R162-R168,
R17, R171, R188

2007-000052

R189-R199, R208R211, R21, R216

SAMSUNG Electronics Co., Ltd.

6-87

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-000052

Assembly Position
R217-R219, R231,

Qtty.

Part Name

Description

16

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

11

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

22

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R237-R248, R24
3

2007-000052

R25, R251, R253R255, R262, R263

2007-000052

R280, R281, R302R307, R313-R315

2007-000052

R321-R323, R328,
R330, R333, R335

2007-000052

R336, R340, R350,

R352, R353, R360

2007-000052

R361-R363, R372,

2007-000052

R47-R54, R5, R6,

2007-000052

R76, R77, R8, R9,

2007-000052

R94-R99

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

2007-000070

R179-R182, R258,

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

2007-000070

R339, R341, R345,

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

2007-000070

R385, R386, R78

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

2007-000287

R178, R261,

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

R387, R42-R45
R60-R69, R71, R74
R80, R81, R88

R329, R331, R332

R354, R370, R384

R347-R349,
R367-R369, R86
3

2007-001164

SAMSUNG Electronics Co., Ltd.

R205, R228

6-88

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-002987

Assembly Position

Qtty.

Part Name

Description

R159, R215, R221-R224, R232,

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R247, R264
3

2007-002987

R317-R320, R324-R327

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

2007-007049

R212

R-CHIP

22.1 Kohm, 1%, 1/10 W, TP, 1608

2007-007226

R1-R3, R14, R16, R33-R35,

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

R351

R-CHIP

681 ohm, 1%, 1/10 W, TP, 1608

R161, R176, R177, R186, R187,

R-CHIP

332 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

332 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

332 ohm, 1%, 1/10 W, TP, 1608

17

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

10

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

13

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

21

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

25

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

R355
3

2007-007228

2007-007454

R20, R201
3

2007-007454

R202-R204, R22, R23, R220,

R229, R230

2007-007454

2007-007645

R46
R114-R118, R12, R13, R28-R32,
R308-R312

2007-007645

R365, R374, R388-R391,

R83-R85, R87

2007-008122

2007-008122

2007-008122

R109-R113, R156-R158,
R172-R175, R18
R207, R213, R214, R226, R227,
R233-R236
R249, R250, R252, R256, R26,
R265-R279, R27

2007-008122

R282-R301, R334, R338, R343,

R344, R37

SAMSUNG Electronics Co., Ltd.

6-89

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-008122

Assembly Position
R38-R41, R4,

Qtty.

Part Name

Description

15

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

R55-R59, R7, R70,

R72, R73, R75
3

2007-008122

R82, R89-R93

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

2007-008166

R225

R-CHIP

182 OHM, 1%, 1/10 W, DA, TP, 1608

2203-000236

C95

C-CER, CHIP

0.1 NF, 5%, 50 V, C0G, TP, 1608

2203-000257

C11, C45

C-CER, CHIP

10 nF, 10%, 50 V, X7R, TP, 1608

2203-000405

C128-C130

C-CER, CHIP

0.18 NF, 5%, 50 V, C0G, TP, 1608

2203-000998

C115, C118-C120,

C-CER, CHIP

0.047 NF, 5%, 50 V, C0G, TP, 1608

C150, C162-C165
3

2203-001408

C1, C12, C124, C125

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, TP, 1608

2203-003027

C4

C-CER, CHIP

0.82 nF, 5%, 50 V, NP0, TP, 1608

2203-005249

C10, C100-C114,

20

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

16

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

38

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

41

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

1 NF, 10%, 2 KV, X7R, TP, 4520

C116, C117,
C121-C123
3

2203-005249

C132-C140, C14,
C146-C148, C151,
C16, C160

2203-005249

C17-C27, C2,
C29-C37, C42, C43,
C46-C59, C5

2203-005249

C6-C9, C60-C67,
C70-C94, C96-C99

2203-005457

SAMSUNG Electronics Co., Ltd.

C131, C28

6-90

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2404-001037

Assembly Position

Qtty.

Part Name

Description

C126, C127, C13, C15,

C-TA, CHIP

10, UF, 10%, 16 V, TP, 3528

C3, C44
3

2404-001096

C40, C41

C-TA, CHIP

33, UF, 10%, 16 V, GP, TP, 6032

2409-001034

C39

C-EDL

1000000, UF, 5.5 V, BK, 21.6 x 9 MM, 5

2601-001056

T1

TRANS-SMD, PULSE

350, UH, 1:1, 1:1, 12.7 x 6.73 x 5.97 MM, TP

2804-001245

Y3

OSCILLATOR-CLOCK

10 MHz, 50, PPM, 10TTL &, CMOS, TP, 3

2804-001246

Y2

OSCILLATOR-CLOCK

20 MHZ, 50, PPM, 10TTL&CMOS, TP, 3.3 V

2804-001247

Y1

OSCILLATOR-CLOCK

25 MHZ, 50, PPM, 10TTL &, CMOS, TP, 3.3 V

3301-001120

L10, L12

BEAD-SMD

30 ohm, 2x1.25x0.85 mm, 3000 mA, TP, 0.015 ohm

3301-001308

L11, L13, L14, L2, L3,

BEAD-SMD

10 ohm, 1608, 500 mA, TP, 0.15 ohm

L6-L8
3

3403-001104

S1

SWITCH-PUSH

28 V, 0.4 A, 1P, MOMENTARY, D2.8(Plunger)

3408-000230

S2

SWITCH-SLIDE

30 V DC, 200 mA, DPDT, ANGLE SHAPE

3703-001252

P2, P3

CONNECTOR-BACK,

30, P, 5 R, FEMALE, ANGLE-F, AU30U

3704-000249

U19

SOCKET-IC

32, P, PLCC, SN, 1.27 mm

3710-000001

J1, J2

CONNECTOR-SHUNT

2, P, 1 R, STRAIGHT, AUF

3710-001659

P10-P12, P4-P7, P9

CONNECTOR-SOCKET

40, P, 2 R, 0.8 mm, SMD-S, AUF, NTR

3711-001465

J1

CONNECTOR-HEADER

NOWALL, 3, P, 1 R, 2.54 mm, STRAIGHT, A

3711-002630

P13, P8

CONNECTOR-HEADER

NOWALL, 10, P, 2 R, 2.54 mm, STRAIGHT,

3711-002633

J2

CONNECTOR-HEADER

NOWALL, 2, P, 1 R, 2.54 mm, STRAIGHT, A

3722-001050

P1

JACK-MODULAR

8P/8C 2, STANDARD, Y, ANGLE, STANDARD, N, BLK, AU50U

GA41-00134A

PCB-MGI

OFFICESERV 7400, FR-4, 4, L, 00, 1.6 T, 130 x 275 mm

PANEL

SAMSUNG Electronics Co., Ltd.

6-91

CHAPTER 6. ! .

6.15 MGI64 Board

Level
1

Part Code
0202-001091

Assembly Position
-

Qtty.
0.001

Part Name
Subsidiary Materials(raw/subsidiary

Description
SOLDER-BAR;HI-FLO, 20 x 356 x 11,

materials)
1

3703-001252

P1-P3

Connectors(electric field)

CONNECTOR-BACK, PANEL;30P, 5R, FE

3722-001050

P4

Connectors(electric field)

JACK-MODULAR;8P/8C, STANDARD, Y,

6002-000154

Locking, Unit, Part

SCREW-TAPPING;PH, +, 2, M3, L8, ZPC

(material available)
1

GA68-00289A

Print, Part(print, Packing)

LABEL(P)-BAR, CODE;KEY, PHONE

GA72-00242A

Plastics(injection)

PMO-LEN, LENS-2;SME, PMMA, TRP, T2

GA94-01936A

EF-89R(security device)

PHANTOM AU GA92-02924A

GA94-01937A

EF-89R(security device)

PHANTOM SM GA92-02924A

0202-000108

0.001

Packing, Part(print, Packing)

SOLDER-CREAM;RMA-20-21L, 20~3

0402-001056

D1

DIODES(electron)

DIODE-RECTIFIER;MBRS140, 40 V, 1 A

0404-001116

D4, D5

DIODES(electron)

DIODE-SCHOTTKY;B540C, 40 V, 5000 M

0601-001064

LED1-LED8

Optical Elements(electron)

LED;SMD, RED/Y-GRN, 1.7 x 2.5 mm, 66

0801-002127

U10, U11, U2, U22, U3

LOGIC IC(electron)

IC-CMOS, LOGIC;74FCT16245, TRANS

0802-001029

U18, U20

LOGIC IC(electron)

IC-BICMOS, LOGIC;74LVTH16245, TR

0802-001037

U6

LOGIC IC(electron)

IC-BICMOS, LOGIC;74LVT245, BUS T

0902-001802

U5

MPU/MCU(electron)

IC-MICROPROCESSOR;M82530, 250MH

1001-001111

U21

INTERFACE IC(electron)

IC-BUS SWITCH; TSSOP, 56P, 240M

1006-001140

U9

INTERFACE IC(electron)

IC-LINE TRANSCEIVER;3232, SSOP,

1103-001289

U25

MEMORY IC(electron)

IC-EEPROM;93C46, 128 x 8/64 x 16, SO

1105-001548

U14, U15

MEMORY IC(electron)

IC-DRAM;K4S561632, 4 x 4 M x 16 BIT, T

SAMSUNG Electronics Co., Ltd.

6-92

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

1106-001058

U17

MEMORY IC(electron)

IC-SRAM;71321, 2K x 8BIT, TQFP, 64P

1107-001228

U19

MEMORY IC(electron)

IC-FLASH MEMORY;28F640, 8M x 8/4M

1107-001534

U23, U28

MEMORY IC(electron)

IC-FLASH MEMORY;39VF040, 512K

1203-001447

U27

LINEAR IC(electron)

IC-SWITCH VOL.REG;2596, TO-263,

1203-001643

U7

LINEAR IC(electron)

IC-RESET;DS1706, SOIC, 8P, 150MIL

1205-002129

U1

LINEAR IC(electron)

IC-TRANSCEIVER;BCM5221A4KPT, TQ

1301-001647

U4

ASICs(electron)

IC-CPLD;LC4256V-75F256BC, FPBGA

2007-000052

43

Fixed Registers(electron)

R-CHIP;10 Kohm, 1%, 1/10W, TP, 1608

R4, R10, R48, R52, R99, R100, R126,

R130, R138, R139, R145, R148-R150,
R156, R159-R162, R185-R187, R189,
R197, R200, R202, R205-R207, R218,
R223, R228, R232-R236, R249-R252,
R260, R261

2007-000057

R273

Fixed Registers(electron)

R-CHIP;40.2 Kohm, 1%, 1/10W, TP, 16

2007-000070

R2, R241, R35, R75, R77, R94, R95

Fixed Registers(electron)

R-CHIP;0 ohm, 5%, 1/10W, TP, 1608

2007-000287

43

Fixed Registers(electron)

R-CHIP;100 ohm, 1%, 1/10W, TP, 1608

69

Fixed Registers(electron)

R-CHIP;49.9 ohm, 1%, 1/10W, TP, 160

R13-R31, R34, R54-R73, R151, R164,

R179

2007-007226

R36, R37, R39, R41-R45, R47, R49,

R74, R76, R78-R81, R83-R86,
R88-R93, R108, R112-R119, R121,
R122, R125, R127-R129, R131-R136,
R140, R141, R144, R153, R157,
R188, R190-R196, R213, R215,
R247, R253-R256, R266, R267

SAMSUNG Electronics Co., Ltd.

6-93

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-007342

R272

Fixed Registers(electron)

R-CHIP;1.82 Kohm, 1%, 1/10 W, TP, 16

2007-007454

R224, R225, R230, R231,

Fixed Registers(electron)

R-CHIP;332 ohm, 1%, 1/10 W, TP, 1608

2007-007507

20

Fixed Registers(electron)

R-CHIP;2.74 Kohm, 1%, 1/10 W, TP, 16

Fixed Registers(electron)

R-CHIP;1.27 Kohm, 1%, 1/10 W, TP, 16

R237-R240
R109, R110, R142, R143, R158,
R199, R201, R203, R204, R210,
R212, R214, R216, R217, R219,
R220, R226, R227, R229, R3
3

2007-007669

R111, R123, R163, R33

2007-008122

R120, R165-R177

14

Fixed Registers(electron)

R-CHIP;22.1 OHM, 1%, 1/10 W, TP, 160

2011-000002

RA5-RA11, RA14-RA20

14

Fixed Registers(electron)

R-NET;22 OHM, 5%, 1/16 W, L, CHIP, 8P

2011-000585

RA1-RA4, RA12, RA13, RA21-RA30

16

Fixed Registers(electron)

R-NET;47 ohm, 5%, 1/16 W, L, CHIP, 8P

2203-000236

C148, C149

Ceramic, Capacitor

C-CER, CHIP;0.1 nF, 5%, 50 V, C0G, 16

(electron)
3

C7-C9, C19-C21, C27-C35, C39-C45,

2203-000257

39

Ceramic, Capacitor(electron)

C-CER, CHIP;10 nF, 10%, 50 V, X7R, 16

11

Ceramic, Capacitor(electron)

C-CER, CHIP;0.047 nF, 5%, 50 V, C0G,

C54-C58, C61-C63, C79, C80, C82,

C92, C114-C118

2203-000998

C67, C73, C76, C84, C87, C130,

C188-C190, C194

2203-001408

C69, C70

Ceramic, Capacitor(electron)

C-CER, CHIP;0.27 nF, 5%, 50 V, NP0, 1

2203-005171

C212

Ceramic, Capacitor(electron)

C-CER, CHIP;1000 nF, 10%, 16 V, X7R,

SAMSUNG Electronics Co., Ltd.

6-94

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2203-005249

Assembly Position
C1-C3, C10, C11, C14, C15,

Qtty.

Part Name

Description

114

Ceramic, Capacitor(electron)

C-CER, CHIP;100 nF, 10%, 50 V, X7R, 1

C22-C26, C36-C38, C46, C47,

C49-C53, C64-C66, C68, C72,
C75, C77, C81, C83, C85, C86,
C88-C91, C93, C95-C100, C102C105, C107-C113, C119-C123,
C131-C134, C137-C143, C145C187, C215-C217
3

2203-005457

C124, C16, C6, C71

Ceramic, Capacitor(electron)

C-CER, CHIP;1 NF, 10%, 2KV, X7R, TP,

2203-005565

C191-C193

Ceramic, Capacitor(electron)

C-CER, CHIP;1 nF, 5%, 50 V, NP0, TP, 1

2203-005929

C101, C106, C125, C126, C13,

15

Ceramic, Capacitor(electron)

C-CER, CHIP;10000 nF, 10%, 16 V, X

C18, C196, C211, C219, C48,

C59, C60, C74, C78, C94
3

2404-001037

C12, C17, C195

Eletrolytic, Capacitor(electron) C-TA, CHIP;10, UF, 10%, 16V, TP, 35

2404-001097

C197, C205, C218

Eletrolytic, Capacitor(electron) C-TA, CHIP;220, UF, 10%, 10 V, GP, TP,

2404-001288

C4, C5

Eletrolytic, Capacitor(electron) C-TA, CHIP;2.2, UF, 10%, 16 V, WT, TP,

2601-001056

T1

TRANSFORMER(electricity)

TRANS-SMD, PULSE;350UH, 1:1, 1:

2703-001795

L10

INDUCTOR/COIL(electricity)

INDUCTOR-SMD;15UH, 20%, 18.54X15

2804-001245

Y3

Oscillator(electron)

OSCILLATOR-CLOCK;10 MHz, 50, Ppm, 1

2804-001325

Y2

Oscillator(electron)

OSCILLATOR-CLOCK;50 MHz, 50, Ppm, 1

2804-001496

Y1

Oscillator(electron)

OSCILLATOR-CLOCK;16.384 MHz, 50p

3301-000373

L3, L4, L6

Magnetic, Parts(electricity)

BEAD-SMD;220 OHM, 1608, 200, TP,

SAMSUNG Electronics Co., Ltd.

6-95

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

3301-001308

L1, L2, L5, L7, L8

Magnetic, Parts(electricity)

BEAD-SMD;10 OHM, 1608, 500, TP

3403-001144

S1

Switches(electric field)

SWITCH-PUSH;28 V, 100 MA, SPDT, ON

3704-000249

U23, U28

Connectors(electric field)

SOCKET-IC;32P, PLCC, SN, 1.27 mm

4401-001294

PWR1

POWER SUPPLY(electricity)

CONVERTER-DC/DC;3.3 V, 1.2 V, 16

GA13-10064A

U16

ASICs(electron)

IC ASIC;DCS, STL7065C, QFP, 160P,

GA41-00181A

PCS01

PCB(electricity)

PCB MAIN-MGI64;OFFICESERV 7400

GA97-01933A

Appliance ASS'Y

MEA-MGI64 STIFF ASSY;OFFICESER

6003-000264

Locking, Unit, Part(material

SCREW-TAPTITE;, PWH, +, B, M3, L6, ZP

available)
2

GA70-00066A

Ferous Metal, Processing,

IPR-SHIELD MGI;OFFICESERV SME,

Part(PRESS)
2

GA72-00238E

Plastics(injection)

PMO-STIFFENER MGI64;OFFICESERV

GA72-00240A

Plastics(injection)

PMO-EJECTOR;SME, PC/ABS, BLANK K

SAMSUNG Electronics Co., Ltd.

6-96

OfficeServ 7400 Service Manual

6.16 4DSL Board

No

Part Code

Assembly Position

Qtty.

Part Name

Description

0401-001099

D1~D4, D9~D13

DIODE-SWITCHING

1N4148WS, 75 V, 150 mA, SOD-323, TP

0402-001216

D5~D8

DIODE-RECTIFIER

MURS120, 200 V, 1 A, TO-220F, TP

0403-001416

ZD1~ZD16

DIODE-ZENER

MMSZ5227B, 3.42-3.78 V, 500MW, SOD-123, TP

0406-001053

L19, L21, L23, L25,

DIODE-TVS

SMBJ30CA, 33.3/35.8/38.3 V, 600W, DO-214AA

16

L27, L29, L31, L33

5

0501-000476

Q5~Q8

TR-SMALL SIGNAL

KST5401TA, PNP, 350 MW, SOT-23, TP, 60-240

0505-001031

Q1~Q4

FET-SILICON

IRF540, N, 100 V, 28 A, 0.077 ohm, 125

0601-001064

LED1~LED4

LED

SMD, RED/Y-GRN, 1.7 x 2.5 mm, 660/560 NM, 3 x 2.5 x 1.5 mm

0801-001090

U12, U25

IC-CMOS, LOGIC

74HC14, SCHMITT INVERTER, SOP, 14, 150 MIL, HEX, TP, 2.0/6.0 V

0801-002325

U21

IC-CMOS, LOGIC

74LCX04, INVERTER, TSSOP, 14, 173 MIL, HEX, TP, 2.0/3.6 V

10

0801-002403

U26

IC-CMOS, LOGIC

74LCX08, AND GATE, TSSOP, 14, 173 MIL, QUAD, TP, 2.0/3.6 V

11

0801-002446

U31

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173MIL, HEX, TP, 2.0/3.6 V

12

0802-001084

U11, U27, U30, U5, U6

IC-BICMOS, LOGIC

74ABT125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 4.5/5.5 V

13

0802-001099

U22

IC-BICMOS, LOGIC

74LVTH125, BUFFER, TSSOP, 14, 173 MIL, QUAD, TP, 2.7/3.6 V

14

0902-000231

U14

IC-

MC68302, 16.67 MHz, 16 bit, QFP, 132P, TR, PLASTIC, 5 V, 525 MW,

MICROPROCESSOR

TO + 70C, 1.152 KB, 24 bit

IC-LINE

3232, SSOP, 16P, 212MIL, DUAL, TP, PLASTIC, 5.5 V,

TRANSCEIVER

0to + 70C, 571 mW, 2, 2

15
16

1006-001140
1106-000353

U15
U18, U19

1
2

IC-SRAM

6X4008, 512 K x 8 bit, TSOP(II), 32P, 400 MIL, 70 NS, 5 V,

10%, PLASTIC, 0TO+70C, 20UA, CMOS, ST

17

1106-001136

U17

IC-SRAM

7C136, 2K x 8 bit, QFP, 52P, 10 x 10 mm, 55 NS, 5 V, 10%,

PLASTIC, 0TO + 70C, 15 MA, CMOS, TR

SAMSUNG Electronics Co., Ltd.

6-97

CHAPTER 6. ! .

(continued)
No
18

Part Code
1107-001079

Assembly Position
U23

Qtty.

Part Name

IC-FLASH MEMORY

Description
29F800, 1M x 8/512K x 16, TSOP, 48P, 18.4 x 12 mm,
4.5/5.5 V, 0to+70C

19

1203-001643

U24

IC-RESET

DS1706, SOIC, 8P, 150MIL, PLASTIC, -40TO+85C, TP

20

1203-002267

U28

IC-POSI.FIXED REG.

TO-263-5, 5P, 400 MIL, PLASTIC, 1.782/1.818 V, 3W,

21

1204-002210

U29

IC-ECHO

-40TO + 125C, 1.5A, TP

ZL50235QCC, LQFP, 100P, 14 x 14 x mm, PLASTIC, 3.6 V,
-40TO + 85C, TR, 16CH VOICE ECHO-IC
22

1205-000443

U1, U2, U3, U4, U7~U10

IC-ADAPTER

TP3464V, PLCC, 28P, PLASTIC, 7 V, 0, 0to+70C, ST

23

1301-001473

U16

IC-CPLD

3064, TQFP, 100P, 16 x 16 mm, 10 nS, 3.3, 10%

24

1404-000126

PS1~PS8

THERMISTOR-PTC

4.85 ohm, 60V, 5 mm

25

2007-000041

R1~R3, R220

R-CHIP

475 ohm, 1%, 1/10W, TP, 1608

26

2007-000043

24

R-CHIP

1K ohm, 1%, 1/10W, TP, 1608

27

R-CHIP

10 kohm, 1%, 1/10W, TP, 1608

R102~R108, R111, R114,

R138, R143, R147, R150,
R153, R154, R157, R159,
R160, R163, R168, R169,
R170, R171, R221

27

2007-000052

R13, R140, R15, R151,

R17, R19, R190, R203,
R208, R215, R216, R233,
R234, R30, R34, R35,
R42, R43, R44, R48, R50,
R53~R58

SAMSUNG Electronics Co., Ltd.

6-98

OfficeServ 7400 Service Manual

(continued)
No
28

Part Code
2007-000070

Assembly Position
R113, R115, R116, R119, R120,

Qtty.

Part Name

Description

26

R-CHIP

0 ohm, 5%, 1/10W, TP, 1608

27

R-CHIP

0 ohm, 5%, 1/10W, TP, 1608

R-CHIP

100 ohm, 1%, 1/10W, TP, 1608

R141, R145, R146, R152, R156,

R158, R162, R164, R165, R166,
R201, R21, R214, R22, R223~R229,
29

2007-000070

R23, R230, R238, R239, R24,

R240~R248, R25~R27, R29, R40,
R41, R47, R49, R52, R59, R80, R82,
R90

30

2007-000287

R10, R11, R117, R118, R121,

R122~R129, R137, R142, R144,
R148, R149, R177, R181~R185,
R191~R200, R202, R205~R207,
R209~R213, R217~R219, R235,
R236, R37~R39, R4~R6, R60~R69,
R7, R70, R8, R9, R91~R97

31

2007-001153

R31

R-CHIP

750 ohm, 1%, 1/10W, TP, 1608

32

2007-002918

R12, R14, R16, R18

R-CHIP

51.1 kohm, 1%, 1/10W, TP, 1608

33

2007-002987

R100, R101, R109, R110,

R-CHIP

4.75 kohm, 1%, 1/10W, TP, 1608

R45

R-CHIP

1.21 kohm, 1%, 1/10W, TP, 1608

R112, R161, R178, R20, R204, R246,

R-CHIP

51.1 ohm, 1%, 1/10W, TP, 1608

R130~R136, R139, R167, R172,

R173, R175, R176, R179, R180,
R186~R189, R231, R232, R36, R46,
R71~R79, R81, R83~R89, R98, R99
34

2007-007296

35

2007-007645

R28, R32

SAMSUNG Electronics Co., Ltd.

6-99

CHAPTER 6. ! .

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

36

2007-008122

R237, R33

R-CHIP

22.1 ohm, 1%, 1/10W, TP, 1608

37

2203-000257

C52, C86

C-CER, CHIP

10 nF, 10%, 50 V, X7R, 1608

38

2203-000426

C110

C-CER, CHIP

0.018 nF, 5%, 50 V, C0G, 1608

39

2203-001408

C57, C58

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, TP, 1608

40

2203-002793

C1, C10, C12, C17~C19, C2, C20,

C-CER, CHIP

1000 nF, +80-20%, 25 V, Y5 V, 2012

C-CER, CHIP

470 nF, 10%, 50 V, X7R, TP, 3216

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C22, C24, C26, C28, C3, C4, C6,

C8
41

2203-005218

C11, C21, C23, C25, C27, C5, C7,

42

2203-005249

C100~C107, C13~C16, C29~C32,

43

2402-000170

C33~C36

C-AL, SMD

1, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.4,

44

2402-001083

C93

C-AL, SMD

100, UF, 20%, 50 V, GP, TP, 10 x 10.3 x 10

45

2404-001037

C88, C94, C95

C-TA, CHIP

10, UF, 10%, 16 V, TP, 3528

46

2804-001496

Y1

OSCILLATOR-CLOCK

16.384 MHz, 50, Ppm, 10TTL, 15pF, TP, 3.3 V, 40 mA

47

2804-001499

Y2

OSCILLATOR-CLOCK

20 MHz, 50, Ppm, 10TTL, 15pF, TP, 3.3 V, 40 mA

48

3301-001120

L1, L34~L36

BEAD-SMD

30 ohm, 2012, 3000, TP, 0.015

49

3301-001308

L37, L38

BEAD-SMD

10 ohm, 1608, 500, TP, 0.15

50

3301-001309

L10~L17, L2~L9

BEAD-SMD

47 ohm, 1608, 500, TP, 0.3

51

3404-001008

SW2

SWITCH-TACT

15V, 50 MA, 160GF, 6 x 6 x 5 mm, SPST

52

3703-001252

P2, P3

CONNECTOR-BACK,

30P, 5R, FEMALE, ANGLE-F, AU30U

C9
C37~C56, C59~C99

PANEL

SAMSUNG Electronics Co., Ltd.

6-100

OfficeServ 7400 Service Manual

(continued)
No
53

Part Code
3711-003272

Assembly Position
P1

Qtty.
1

Part Name
CONNECTOR-

Description
BOX, 10P, 2R, 2.54 mm, STRAIGHT, AUF, BLK

HEADER
54

3722-002045

J1

JACK-MODULAR

8P/8C, INVERTED, Y, ANGLE, N, BLK, AU15U

55

GA13-10051A

U13

IC ASIC

DCS, STL7052E, QFP, 80P

56

GA26-10053A

T1~T8

TRANS, PULSE

DGP 360, 144//72.5/72T, 5mH

57

GA41-00139A

PCS.03

PCB-WLI

OFFICESERV SME, FR-4, 4L, 00, 1.6T, 130 x 275 mm

SAMSUNG Electronics Co., Ltd.

6-101

CHAPTER 6. ! .

6.17 LIM Board

Level
2

Part Code
GA92-02777A

Assembly Position
-

Qtty.
1

Part Name

Description

PBA MAIN-16PORT,

OFFICESERV 7400, DOM/EXT, WORLD, 16PORT, LAN SWITCH,

LAN SWITCH

FR-4, 6, L, 130 x 275 x 1.6 T, LIM

0401-001099

D1

DIODE-SWITCHING

1N4148WS, 75 V, 150 MA, SOD-323, TP

0601-000005

LED1-LED3

LED

SMD, GRN, 3 x 2 MM, 570 NM, 3 x 2 MM

0801-000862

U9

IC-CMOS, LOGIC

74LVT125, BUFFER, SOP, 14, P, 244 MIL

0801-002095

U17

IC-CMOS, LOGIC

74LCX245, TRANSCEIVER, TSSOP, 20, 173 MIL, OCTAL, TP,

2.0/3.6 V

0801-002446

U13

IC-CMOS, LOGIC

74LCX14, SCHMITT INVERTER, TSSOP, 14, 173 MIL, HEX, TP,

2.0/3.6 V

0801-002643

U3

IC-CMOS, LOGIC

74LCX139, DECODER/DEMUX, SOP, 16, 150 MIL, QUAD, TP,

0802-001037

U1, U2, U7, U8, U12,

IC-BICMOS, LOGIC

74LVT245, BUS RANSCEIVER, TSSOP, 20, 173 MIL, OCTAL, TP,

1203-002681

IC-POSI.FIXED REG.

LP3962, SOT-223, 5, P, PLASTIC, 2.475/2.525 V, -40TO+125, C,

2.0/3.6 V
U18
U5, U6, U16

2.7/3.6 V
1.5 A, TP

1205-001864

U15

IC-TRANSCEIVER

DJLXT972ALC, LQFP, 64, P, 393 MIL, PLASTIC, 4 V, 0TO+70C, TR

1205-002452

U11

IC-ETHERNET SWITCH

VT6526, LQFP, 208, P, 28 x 28 MM, PLASTIC, 5.5 V, 2.8 W, 0TO+70,

1205-002455

U4, U14

IC-TRANSCEIVER

C, TR, IC-ETHERNET SWITCH

VT6108, PQFP, 208, P, 28 x 28 MM, PLASTIC, 3.45 V, 1.8 W,
0TO+70C, TR, 8, PORT TRANSCEIVER
3

2007-000043

R147, R162, R163,

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

R173, R192
3

2007-000043

R24, R34, R37, R44,

R57, R63, R75

SAMSUNG Electronics Co., Ltd.

6-102

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-000045

R179, R180

R-CHIP

3.32 Kohm, 1%, 1/10 W, TP, 1608

2007-000052

R186-R191, R66, R76,

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

2007-000070

R47, R56, R86

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

2007-001164

R10-R12, R101-R103,

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

12

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

R58

R-CHIP

475 Kohm, 1%, 1/10 W, TP, 1608

R114, R115, R137,

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

R92

R109-R111
3

2007-001164

R119-R121, R127-

2007-001164

R152-R154, R165-

2007-001164

R129, R139-R141
R167, R174-R176
R18-R20, R28-R30,
R3-R5, R41-R43
3

2007-001164

R50-R52, R67-R69,
R83-R85

2007-002916

2007-002987

R138, R151, R164

3

2007-002987

R182, R183, R193,

R194, R21, R27

2007-002987

R62, R73, R90, R91

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

2007-007049

R157

R-CHIP

22.1 Kohm, 1%, 1/10 W, TP, 1608

2007-007443

R158, R61

R-CHIP

3.01 Kohm, 1%, 1/10 W, TP, 1608

2007-007645

R1, R104, R105,

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R107, R108, R112

SAMSUNG Electronics Co., Ltd.

6-103

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-007645

Assembly Position
R113, R117, R118, R122,

Qtty.

Part Name

Description

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

R123, R125
3

2007-007645

R126, R13, R130, R131,

R135, R136

2007-007645

R14, R142-R146, R155,

R156, R159

2007-007645

R16, R160, R161, R168,

R169, R17

2007-007645

R171, R172, R177, R178,

R2, R22, R23

2007-007645

R25, R26, R31, R32, R39,

2007-007645

2007-007645

2007-007645

R9, R93, R94

R-CHIP

51.1 ohm, 1%, 1/10 W, TP, 1608

2007-007796

R36, R38

R-CHIP

2.21 Kohm, 1%, 1/10 W, TP, 1608

2007-008122

R116, R124, R148, R149,

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

R-CHIP

22.1 ohm, 1%, 1/10 W, DA, TP, 1608

R-CHIP

182 OHM, 1%, 1/10 W, DA, TP, 1608

11

R-NET

R40, R45
R46, R48, R49, R54, R55,
R6, R64, R65
R7, R71, R72, R8, R81,
R82, R87, R88

R15, R150, R184

3

2007-008122

R185, R35, R60, R70, R74,

R80, R89

2007-008166

2011-000002

R132-R134
RA1, RA4-RA8, RA11,

22 OHM, 5%, 1/16 W, L, CHIP, 8, P, TP, 3216

RA12, RA15, RA18, RA19

SAMSUNG Electronics Co., Ltd.

6-104

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2011-001238

Assembly Position
RA2, RA3, RA9, RA10,

Qtty.

Part Name

Description

R-NET

330 OHM, 5%, 1/8 W, L, CHIP, 8, P, TP

RA13, RA14, RA16, RA17

3

2203-000041

C130, C131

C-CER, CHIP

0.01 NF, 0.25PF, 50 V, C0G, TP, 1608

2203-000236

C216-C218

C-CER, CHIP

0.1 NF, 5%, 50 V, C0G, TP, 1608

2203-000257

C147

C-CER, CHIP

10 nF, 10%, 50 V, X7R, TP, 1608

2203-000426

C167, C168

C-CER, CHIP

0.018 NF, 5%, 50 V, C0G, TP, 1608

2203-000815

C81, C100

C-CER, CHIP

0.033 NF, 5%, 50 V, C0G, TP, 1608

2203-001408

C141, C152

C-CER, CHIP

0.27 nF, 5%, 50 V, NP0, TP, 1608

2203-005249

C1, C10, C101-C113, C115-

22

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

10

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

13

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

24

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C120, C122
3

2203-005249

C123, C125, C126, C128,

C13, C132, C133

2203-005249

C135-C138, C14, C140,

2203-005249

C15, C149-C151, C153-

2203-005249

C161, C163, C164, C166,

C142-C144, C148
C155, C157, C16
C169, C17, C170
3

2203-005249

C172, C174, C175, C18,

C182, C2, C20

2203-005249

C219, C22, C220, C25-C27,

C29-C34, C3

2203-005249

C37-C40, C4, C42-C46,

C48, C49-C60, C5

SAMSUNG Electronics Co., Ltd.

6-105

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2203-005249

Assembly Position
C62-C65, C68, C69, C7,

Qtty.

Part Name

Description

10

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

16

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

C71, C72, C74

3

2203-005249

C75, C76, C78-C80, C8,

C82-C90, C9

2203-005249

C92-C97

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2203-005457

C11, C114, C121, C139,

C-CER, CHIP

1 NF, 10 %, 2 KV, X7R, TP, 4520

2203-005457

C158, C171, C19, C28, C41,

C-CER, CHIP

1 NF, 10 %, 2 KV, X7R, TP, 4520

2203-005457

C77, C91, C98

C-CER, CHIP

1 NF, 10 %, 2 KV, X7R, TP, 4520

C145, C146, C156

C47, C6, C61
3

2203-005565

C183-C214

2402-000120

C127, C129, C160, C162,

2402-000170

2402-001082

32

C-CER, CHIP

1 nF, 5 %, 50 V, NP0, TP, 1608

C-AL, SMD

10, UF, 20 %, 50 V, GP, TP, 6.6 x 6.6 x 5.4 MM

C66

C-AL, SMD

1, UF, 20 %, 50 V, GP, TP, 4.3 x 4.3 x 5.4,

C124, C134, C176-178, C23,

C-AL, SMD

33, UF, 20 %, 50 V, GP, TP, 8.3 x 8.3 x 6.3

C165, C70, C73

C24
3

2402-001082

C35, C36

C-AL, SMD

33, UF, 20 %, 50V, GP, TP, 8.3 x 8.3 x 6.3

2601-001056

T5

TRANS-SMD,

350, UH, 1:1, 1:1, 12.7 x 6.73 x 5.97 MM, TP

2601-001111

T1-T4

TRANS-SMD,

PULSE
350, UH, 0.9 OHM, 1CT:1CT, 28.58 x 16.00 x 5.84 MM, TP

PULSE
3

2801-004058

Y1, Y2

3301-001120

L1-L14, L16, L17

3404-001008

S1

SAMSUNG Electronics Co., Ltd.

2
16
1

CRYSTAL-SMD

25 MHZ, 30, PPM, 28-ABX, 20PF, 50 OHM, TP

BEAD-SMD

30 ohm, 2x1.25x0.85 mm, 3000 mA, TP, 0.015 ohm

SWITCH-TACT

15 V, 50 MA, 160GF, 6 x 6 x 5 mm, SPST

6-106

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
3703-001252

Assembly Position
P1, P2, P3, P7

Qtty.

Part Name

CONNECTOR-BACK,

Description
30, P, 5R, FEMALE, ANGLE-F, AU30U

PANEL
3

3711-005026

P8, P9

CONNECTOR-

BOX, 100P, 2R, 0.8 MM, SMD-S, AU30U, NTR

HEADER
3

GA41-00141A

PCB-LIM

OFFICESERV 7400, FR-4, 6L, 00, 1.6T, 130 x 275 mm

GA92-02788A

PBA MAIN-8PORT A/D

OFFICESERV 7400, DOM/EXP, WORLD, 8PORT A/D

SUBSCIBER

SUBSCIBER, FR-4, 4, L, 130 x 275, LIMD

3710-001756

P4, P5

CONNECTOR-SOCKET

100P, 2R, 0.8 MM, SMD-S, AUF, NTR

3722-002054

J1

JACK-MODULAR

8P/8C, STANDARD/INVERTED, Y, ANGLE-F, GRN, BLK, AU50U

GA41-00147A

PCB-LIMD

OFFICESERV 7400, FR-4, 4, L, 00, 1.6T, 130 x 45 MM

SAMSUNG Electronics Co., Ltd.

6-107

CHAPTER 6. ! .

6.18 PLIM Board

No

Part Code

Assembly Position

Qtty.

Part Name

Description

0402-001211

D2

case_403

MURS320T3

0501-000476

Q1

sot23

KST5401TA

0501-000477

Q3

sot23

MMBT5550

0505-000323

Q2

fet_590x1070

IRFR220-TF

0601-000005

LED1, LED2, LED3

sml-010

SML010MT

0801-000862

U9

sop14_w600

74LVT125D

0801-002095

U17

ps_tssop20_w640_1.5

MC74LCX245DTR2

0801-002446

U13

ps_tssop14_w640_1.5

74LCX14MTCX

0801-002643

U3

sop16_w600

74LCX139M

10

0802-001037

U1, U2, U7, U8, U12, U18

ps_ssop20_w640_1.5

SN74LVT245APW

11

1203-000469

U19

sot223

LM1117MPX-ADJ

12

1203-001643

U20

sop8_w600

DS1706RESA

13

1203-002681

U5, U6, U16

sot223-5_nsc

LP3962EPM-2.5

14

1205-001864

U15

ps_tqfp64_w1200_1.5

LXT972LC

15

1405-000171

V1

vari_p200_1

ERZ-VA7V820

16

2007-000045

R179, R180

W1608_RES

3.32K, 1%

17

2007-000052

R37, R44, R66, R75, R76, R92,

23

W1608_RES

10K, 1%

R196, R197, R206, R213, R214,

R24, R34, R57, R63, R173, R186,
R187, R188, R189, R190, R191,
R195

SAMSUNG Electronics Co., Ltd.

6-108

OfficeServ 7400 Service Manual

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

18

2007-000060

R202

W1608_RES

100 K, 1%

19

2007-000066

R198

W1608_RES

20 K, 1%

20

2007-000070

R200, R207, R208, R209, R210, R56, R86

R1608_RES

RC1608J000CS

21

2007-000287

R204

R1608_RES

RC1608F1000CS

22

2007-001164

R3, R10, R18, R28, R41R50, R67, R83, R101,

16

W1608_RES

75, 1%

23

2007-002987

20

R1608_RES

RC1608F4751CS

R109, R119, R127, R139, R152, R165, R174

R21, R151, R211, R27, R62, R73, R90, R114, R115,
R137, R138, R147, R162, R163, R164, R182, R183,
R192, R193, R194
24

2007-007049

R157

W1608_RES

22.1 K, 1%

25

2007-007443

R61, R158

W1608_RES

3.01 K, 1%

26

2007-007613

R205

W1608_RES

RC1608F1210CS

27

2007-007645

R1, R2, R6, R7, R8, R9, R13, R14, R16, R17, R22,

66

R1608_RES

RC1608F51R1CS

R23, R25, R26, R31, R32, R39, R40, R45, R46,

R48, R49, R54, R55, R64, R65, R71, R72, R81,
R82, R87, R88, R93, R94, R104, R105, R107, R108,
R112, R113, R117, R118, R122, R123, R125, R126,
R130, R131, R135, R136, R142, R143, R144, R145,
R146, R155, R156, R159, R160, R161, R168, R169,
R171, R172, R177, R178
28

2007-007796

R36, R38

R1608_RES

2.21 K, 1%

29

2007-008091

R199

W1608_RES

RC1608F4321CS

30

2007-008122

R15, R60, R74, R89, R116, R35, R70, R80, R124,

14

W1608_RES

MCR03EZHF22R1

R148, R149, R150, R184, R185

SAMSUNG Electronics Co., Ltd.

6-109

CHAPTER 6. ! .

(continued)
No

Part Code

Assembly Position

31

2007-008166

R132, R133, R134

32

2011-000002

RA1, RA4, RA5, RA6, RA7, RA8, RA11, RA12,

33

2011-001238

34

Qtty.

Part Name

Description

W1608_RES

182, 1%

11

mnr14_3216

MNR14-EOA-J-220

RA2, RA3, RA9, RA10, RA13, RA14, RA16, RA17

sm_r_bcn4d

BCN4DB331JT

2203-000041

C130, C131

W1608_CAP

CL10C100CBNC

35

2203-000236

C216, C217, C218

R1608_CAP

CS1608C0G101J500NR

36

2203-000257

C147, C228, C229

R1608_CAP

10 NF, 50 V

37

2203-000426

C167, C168

W1608_CAP

18, PF, 50 V

38

2203-000815

C81, C100

W1608_CAP

33, PF, 50 V

39

2203-001408

C141, C152

R1608_CAP

270, PF, 50 V

40

2203-005249

C3, C4, C5, C7, C8, C9, C10, C13, C14, C15,

123

W1608_CAP

CL10B104KBNC

RA15, RA18, RA19

C16, C17, C18, C20, C22, C25, C26, C27, C29,

C30, C31, C32, C33, C34, C37, C38, C39, C40,
C42, C43, C44, C45, C46, C48, C49, C50, C51,
C52, C53, C54, C55, C56, C57, C58, C59, C60,
C62, C63, C64, C65, C68, C69, C71, C72, C74,
C75, C76, C78, C79, C80, C82, C83, C84, C85,
C86, C87, C88, C89, C90, C92, C93, C94, C95,
C96, C97, C101, C102, C103, C104, C105, C106,
C107, C108, C109, C110, C111, C112, C113,
C115, C116, C119, C120, C122, C123, C125,
C126, C128, C132, C133, C135, C136, C137,
C138, C140, C142, C143, C144, C148, C149,
C150, C151, C154, C155, C157, C161, C163,
C164, C166, C169, C170, C172, C182, C225

SAMSUNG Electronics Co., Ltd.

6-110

OfficeServ 7400 Service Manual

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

41

2203-005249

C1, C2, C117, C118, C153, C174, C175

R1608_CAP

CL10B104KBNC

42

2203-005457

C6, C11, C19, C28, C41, C47, C61, C77,

18

R4520_CAP

1 nF, 2 KV

32

W1608_CAP

1 nF, 5%

sm_ecap_f55

10, UF, 50 V

C222

sm_ecap_d55

2.2, UF, 50 V

C23, C24, C35, C36, C124, C134, C176,

sm_ecap2

33, UF, 50 V

C91,C98, C114, C121, C139, C145,

C146, C156, C158, C171
43

2203-005565

C183, C184, C185, C186, C187, C188,

C189, C190, C207, C208, C209, C210,
C211, C212, C213, C214, C191, C192,
C193, C194, C195, C196, C197, C198,
C199, C200, C201, C202, C203, C204,
C205, C206

44

2402-000120

C70, C73, C127, C129, C160, C162,

C165

45

2402-000130

46

2402-001082

C177, C178
47

2402-001229

C221

sm_ecap_12.5 x 13.5

MVG100VC100M

48

2404-001074

C223, C224

R3216_TAN

TCSCS1A106KAAR

49

2601-001056

T5

sm_trans16_w940

H1102

50

2601-001111

T1 T2 T3 T4

sm_trans40_w1600

H1164

51

2801-004058

Y1 Y2

sm_xtal2

HC-49/SM5H

52

3301-001120

L1, L3, L4, L5, L6, L7, L8, L9, L10, L11,

R2012_CORE

BLM21P300SPT

20

L12, L13, L14, L16, L17, L18, L19, L20,

L21, L22
53

3703-001252

P1, P2, P3, P7

zpack_pin30_5_fe

89047-102

54

3711-001465

J1 J2 J3

scon_sps01_pin3

103239-3

SAMSUNG Electronics Co., Ltd.

6-111

CHAPTER 6. ! .

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

55

3711-005026

P8, P9

smd_dcon100_177986-4

1-177986-4

56

1205-002452

U11

ps_pqfp208_w3000_ep

VT6526R110

57

1205-002455

U4, U14

ps_pqfp208_w3120

VT6108

58

GA75-00017B

MEC-STIFFNER,

PLIM STIFFNER

ASSY
59

6001-000568

PH, +, M3, L8, NI, PLT

SCREW

60

6203-001062

U11, U4, U14

HS2727B, T2.6, L27

Heat-Sink

61

EC70-00091A

SMG-3200

Spacer

62

3710-000001

J1 J2 J3

SHT-5A

CONNECTOR-SHUNT

SAMSUNG Electronics Co., Ltd.

6-112

OfficeServ 7400 Service Manual

6.19 PLIMD Board

No

Part Code

Assembly Position

0401-000115

D1 D3 D4 D5

0402-001080

ZD3 ZD4 ZD7 ZD8 ZD11 ZD12

Qtty.
4

Part Name

Description

sot23

MMBD7000LT1

16

do-214ba

GF1G

16

sod_123

MMSZ5240BT1

ZD15 ZD16 ZD19 ZD20 ZD23

ZD24 ZD27 ZD28 ZD31 ZD32
3

0403-001280

ZD1 ZD2 ZD5 ZD6 ZD9 ZD10

ZD13 ZD14 ZD17 ZD18 ZD21
ZD22 ZD25 ZD26 ZD29 ZD30

0502-000333

Q1

to_220

MJE340

0604-001002

PC1

sm_led4_tlp121

TLP181-GB

1037423

U1, U2, U4, U6

qfp48_w700

PD64004

2007-000043

R127, R128

R1608_RES

1 K, 1%

2007-000052

R56, R64, R108, R162, R165

R1608_RES

10 K, 1%

2007-000070

R43, R78, R81, R85, R105,

R1608_RES

RC1608J000CS

R106, R109, R148

10

2007-000287

R25

R1608_RES

RC1608F1000CS

11

2007-000536

R24, R74, R134, R161

R1608_RES

RC1608F2000CS

12

2007-000669

R7, R14, R20, R29, R32, R49,

16

R1608_RES

RC1608F2001CS

R59, R71, R80, R95, R111,

R120, R133, R137, R144, R152
13

2007-001139

R8, R51, R112, R150

R1608_RES

RC1608F7501CS

14

2007-007049

R62, R155

R1608_RES

22.1 K, 1%

15

2007-007287

R157

R1608_RES

MCR03EZHF2802

16

2007-007299

R11, R55, R115, R154

R1608_RES

RC1608F6811CS

SAMSUNG Electronics Co., Ltd.

6-113

CHAPTER 6. ! .

(continued)
No

Part Code

Assembly Position

Qtty.

Part Name

Description

17

2007-007455

R16, R65, R122, R156

R1608_RES

24.9 K, 1%

18

2007-007549

R12

R1608_RES

4.99 K, 1%

19

2007-007723

R17

R1608_RES

RC1608F753CS

20

2007-007937

R123

R1608_RES

RC1608F1742CS

21

2007-008067

R116

R1608_RES

21 K, 1%

22

2007-008108

20

R1608_RES

RC0603FR-45.3 K

R1608_RES

RC0603FR-0722K6

16

R1608_RES

RC0603FR072R

R3216_CAP

47 NF, 100 V

41

R3216_CAP

100 NF, 100 V

16

R3216_CAP

1 NF, 100 V

R6, R13, R21, R22, R28, R33,

R48, R58, R69, R70, R79, R96,
R110, R119, R126, R132, R138,
R143, R151, R159

23

2007-008414

R23, R72, R131, R160

24

2007-008656

R1, R2, R3, R4, R36,

R37, R40, R41, R98,
R99, R100, R101, R141,
R142, R145, R146

25

2203-000971

C20, C64, C95, C125

26

2203-001386

C2, C4, C6, C8, C9, C15, C21,

C23, C24, C25, C26, C36, C38,
C40, C41, C42, C50, C53, C55,
C57, C58, C66, C68, C69, C70,
C75, C80, C83, C84, C85, C89,
C96, C98, C99, C100, C103,
C107, C109, C110, C111, C122

27

2203-005199

C3, C16, C19, C29, C34, C45,

C48, C63, C65, C77, C79, C91,
C94

SAMSUNG Electronics Co., Ltd.

6-114

OfficeServ 7400 Service Manual

(continued)
No

Part Code

Assembly Position

27

2203-005199

C102, C106, C116

28

2203-005249

C13, C14, C17, C32, C47, C49,

Qtty.

Part Name

Description

R3216_CAP

1 NF, 100 V

13

R1608_CAP

CL10B104KBNC

12

R1608_CAP

1 nF, 5%

C51, C86, C88, C90, C117,

C118, C123
29

2203-005565

C7, C18, C28, C46, C52, C60,

C81, C92, C93, C113, C119,
C124

30

2402-001231

C1, C11, C12, C35, C76, C104

sm_ecap_10 x 10

GC2A476M10010

31

2404-001288

C30, C31

R3216_TAN

2.2, UF, 16 V

32

3710-001756

P1, P2

smd_dcon100_177985-4

177985-4

33

3722-002054

J1

modular_jack8p_16port

1116317-4

34

SCREW

SC1 SC2

screw_npth3.2

SCREW_3.2

SAMSUNG Electronics Co., Ltd.

6-115

CHAPTER 6. ! .

6.20 GPLIM Board

Level

Part Code

Assembly Position

Qtty.

Part Name

Description

0404-001004

D1 D4

DIODES(electron)

DIODE-SCHOTTKY;MBRS130L, 30 V, 1000MA, DO-21

0404-001020

D3

DIODES(electron)

DIODE-SCHOTTKY;BAT54C, 30 V, 200mA, SOT

0601-001064

LED1, LED2, LED3, LED4,

Optical Elements(electron)

LED;CHIP, RED/Y-GRN, 1.7 x 2.5 mm, 660/560 nm

24

Optical Elements(electron)

LED;SMD, Y-GRN, 1.6 x 0.8 x 0.8 MM, 570 NM, 1

LED29, LED30
3

0601-001094

LED5, LED6, LED7, LED8,

LED9, LED10, LED11,
LED12, LED13, LED14,
LED15, LED16, LED17,
LED18, LED19, LED20,
LED21, LED22, LED23,
LED24, LED25, LED26,
LED27, LED28

0801-002446

U25, U32

LOGIC IC(electron)

IC-CMOS, LOGIC;74LCX14, SCHMITT INVERTER, T

0802-001029

U7, U10

LOGIC IC(electron)

IC-BICMOS, LOGIC;74LVTH16245, AND GATE, TSS

0802-001037

U2, U3, U4, U34

LOGIC IC(electron)

IC-BICMOS, LOGIC;74LVT245, BUS TRANSCEIVER

1089062

U9

1006-001140

U30

INTERFACE IC(electron)

IC-LINE TRANSCEIVER;3232, SSOP, 16P, 200MIL

2601-001140

T2 T3 T4 T5 T6 T7

TRANSFORMER(electricity) TRANS-SMD, PULSE; 1:1, 13.64 x 14.99

1053661

U19

MICRO-PROCESSOR IC

RTC-8564, I2C Interface, Built-in Oscillator, 3.3 V

1053661

U19

MICRO-

RTC-8564, I2C Interface, built-in Oscillator, 3.3 V

1060666

J9

Connectors(electric field)

40P, 2RX2, PRESS-FIT

1062526

J10

Connectors(electric field)

8P/8C, STANDARD/INVERTED, Y, ANGLE-SNAP,

LIGHTPIPE, BLK, AU50U

SAMSUNG Electronics Co., Ltd.

6-116

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

1103-001010

U20

MEMORY IC(electron)

IC-EEPROM;24C02, 256 x 8, SOP, 8P, 5 x 4 mm

1105-001548

U8, U11

MEMORY IC(electron)

IC-DRAM;K4S561632, 4 x 4 M x 1 6 BIT, TSOP

1107-001229

U16

MEMORY IC(electron)

IC-FLASH MEMORY;28F128, 16 M x 8/8 M x 16 BIT, TS

1107-001534

U12

MEMORY IC(electron)

39VF040, 512K x 8 BIT, PLCC, 32P

1106-001058

U6

MEMORY IC(electron)

IC-SRAM; 71321, 2 K x 8 BIT, TQFP, 64P, 10 x 1

1203-000469

U21

LINEAR IC(electron)

IC-POSI.ADJUST REG.; 1117, SOT-223, 4P, 138 M

1203-001643

U33

LINEAR IC(electron)

IC-RESET; 706R, SOP, 8P, 150MIL, PLASTIC, 0.3/

1203-002681

U22, U26, U27

LINEAR IC(electron)

IC-POSI.FIXED REG.;, LP3962, SOT-223, 5P, P

1205-001530

U28, U31

LINEAR IC(electron)

IC-TRANSCEIVER; HDMP-1646A, QFP, 64P, 1

1205-001606

U1, U18

LINEAR IC(electron)

IC-BUFFER;, CY2305SC-1H, SOIC, 8P, 150MIL, PLA

1205-001864

U14

LINEAR IC(electron)

IC-TRANSCEIVER; DJLXT972ALC, LQFP, 64P, 393 M

1205-002452

U17

LINEAR IC(electron)

IC-ETHERNET SWITCH; VT6526, LQFP, 208P, 28 x 2

1205-002480

U29

LINEAR IC(electron)

IC-BUS SWITCH;, PCA9548PW, TSSOP, 24P, 7

1301-001663

U13

ASICs(electron)

IC-CPLD;, LC4128 V-75T128C, TQFP, 128P, 14 x 14 M

SAMSUNG Electronics Co., Ltd.

6-117

CHAPTER 6. ! .

(continued)
Level

Part Code

2007-000043

Assembly Position
R28, R29, R38, R40, R42, R46, R50, R66,

Qtty.

Part Name

Description

121

Fixed Registers(electron)

R-CHIP; 1 KOHM, 1%, 1/16W, DA, TP, 1608

Fixed Registers(electron)

R-CHIP; 6.19 Kohm, 1%, 1/10W, TP, 1608

11

Fixed Registers(electron)

R-CHIP; 10 KOHM, 1%, 1/16 W, DA, TP, 1608

Fixed Registers(electron)

R-CHIP; 0 OHM, 5%, 1/16 W, DA, TP, 1608

12

Fixed Registers(electron)

R-CHIP; 100 OHM, 1%, 1/10 W, DA, TP, 1608

14

Fixed Registers(electron)

R-CHIP; 75 ohm, 1%, 1/16 W, DA, TP, 1608

R70, R71, R79, R80, R98, R113, R114, R115,

R116, R117, R128, R155, R156, R164, R165,
R166, R167, R181, R183, R185, R186, R187,
R189, R190, R191, R192, R193, R215, R216,
R217, R218, R220, R221, R222, R223, R226,
R227, R228, R230, R234, R236, R237, R241,
R247, R274, R278, R291, R292, R293, R294,
R297, R298, R299, R300, R301, R302, R303,
R304, R315, R317, R319, R321, R323, R326,
R335, R343, R345, R346, R347, R348, R351,
R375, R396, R403, R404, R405, R406, R408,
R409, R417, R424, R425, R427, R428, R431,
R438, R439, R440, R441, R458, R459, R460,
R462, R465, R466, R467, R468, R469, R470,
R471, R472, R473, R474, R475, R476, R478,
R487, R495, R508, R600, R602, R603, R609
3

2007-000048

R213, R504

2007-000052

R162, R198, R203, R212, R214, R219

R225, R229, R233, R238, R414

2007-000070

2007-000287

R592, R593
R99, R196, R224, R231, R309, R316, R318,
R320, R322, R324, R325, R353

2007-001164

R430, R443, R565, R567, R569, R571, R573,

R575, R577, R579, R581, R583, R585, R587

SAMSUNG Electronics Co., Ltd.

6-118

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

2007-002899

R161

2007-002913

R32, R33, R34, R41, R43, R44, R45,

Qtty.
1

Part Name

Description

Fixed Registers(electron) R-CHIP; 10 OHM, 1%, 1/16 W, DA, TP, 1608

54

Fixed Registers(electron) R-CHIP; 33.2 OHM, 1%, 1/16 W, DA, TP, 1608

83

Fixed Registers(electron) R-CHIP; 4.75 KOHM, 1%, 1/16 W, DA, TP, 1608

Fixed Registers(electron) R-CHIP; 22.1 KOHM, 1%, 1/16 W, DA, TP, 1608

R47, R48, R49, R74, R75, R76, R77,

R78, R96, R97, R120, R121, R122,
R123, R124, R125, R126, R127, R150,
R153, R154, R168, R169, R180, R235,
R248, R251, R252, R253, R254, R260,
R261, R262, R263, R264, R265, R266,
R267, R273, R281, R282, R283, R284,
R349, R402, R407, R515
3

2007-002987

R16, R22, R23, R24, R25, R26, R27,

R30, R31, R54, R55, R56 57, R58, R60,
R61, R62, R63, R64, R65, R67, R68,
R69, R81, R83, R86, R87, R88, R89,
R111, R112, R148, R149, R157, R159,
R174, R182, R184, R200, R201, R239,
R249, R250, R255, R256, R275, R276,
R279, R285, R286, R296, R342, R344,
R373, R384, R385, R400, R410, R411,
R412, R413, R415, R416, R420, R421,
R422, R432, R442, R477, R479, R480,
R481, R483, R490, R497, R501, R509,
R510, R511, R512, R595, R596, R597

2007-007049

SAMSUNG Electronics Co., Ltd.

R429

6-119

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-007226

Assembly Position

Qtty.

Part Name

Description

R1, R2, R3, R4, R5, R6, R7, R8, R9,

65

Fixed Registers(electron)

R-CHIP; 49.9 ohm, 1%, 1/16 W, DA, TP, 1608

Fixed Registers(electron)

R-CHIP; 8.25 Kohm, 1%, 1/16 W, DA, TP, 1608

29

Fixed Registers(electron)

R-CHIP; 332 OHM, 1%, 1/16 W, DA, TP, 1608

Fixed Registers(electron)

R-CHIP; 121 OHM, 1%, 1/16 W, DA, TP, 1608

R10, R11, R12, R13, R14, R15, R444,

R445, R516, R517, R518, R519,
R520, R521, R522, R523, R524,
R525, R526, R527, R528, R529,
R530, R531, R532, R533, R534,
R535, R536, R537, R538, R539,
R540, R541, R542, R543, R544,
R545, R546 R547, R548, R549,
R550, R551, R552, R553, R554,
R555, R556, R557, R558, R559,
R560, R561, R562, R563
3

2007-007238

R240, R242, R243, R244, R245,

R246

2007-007454

R199, R202, R204, R205, R206,

R207, R208, R209, R210, R211,
R374, R482, R484, R485, R486,
R489 R491 R492, R493, R496, R498,
R499, R500, R502, R503, R588,
R589, R590, R591

2007-007613

SAMSUNG Electronics Co., Ltd.

R197

6-120

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-007620

Assembly Position
R17, R18, R19, R20, R21, R35, R36

Qtty.

Part Name

Description

148

Fixed Registers(electron)

R-CHIP; 47.5 OHM, 1%, 1/16 W, DA, TP, 1608

R37 R51 R52 R53 R72 R73 R82 R84

R85, R90, R91, R92, R93, R94, R95,
R100, R101, R102, R103, R104, R105,
R106, R107, R108, R109, R110, R129,
R130, R131, R132, R133, R134, R135,
R136, R137, R138, R139, R140, R141,
R142, R143, R144, R145, R146, R147,
R151, R152, R170, R171, R172, R173,
R175, R176, R177, R178, R179, R268,
R269, R270, R271, R272, R305, R306,
R307, R308, R310, R311, R312, R313,
R314, R327, R329, R330, R331, R332,
R333, R334, R336, R337, R338, R339,
R340, R341, R350, R352, R354, R355,
R356, R357, R358, R359, R360, R361,
R362, R363, R364, R365, R366, R367,
R368, R369, R370, R371, R372, R376,
R377, R378, R379, R380, R381, R382,
R383, R386, R387, R388, R389, R390,
R391, R392, R393, R394, R395, R401,
R418, R419, R433, R434, R435, R436,
R437, R446, R447, R448, R449, R450,
R451, R452
3

2007-007620

R453, R454, R455, R456

Fixed Registers(electron)

R-CHIP; 47.5 OHM, 1%, 1/16 W, DA, TP, 1608

2007-007645

R39

Fixed Registers(electron)

R-CHIP; 51.1 OHM, 1%, 1/16 W, DA, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-121

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-008122

Assembly Position
R188, R194, R195, R232, R457,

Qtty.

Part Name

Description

10

Fixed Registers(electron)

R-CHIP; 22.1 OHM, 1%, 1/10 W, DA, TP, 1608

Fixed Registers(electron)

R-CHIP; 182 OHM, 1%, 1/10 W, DA, TP, 1608

R505, R506, R507, R513, R514

3

2007-008166

R163

2203-000041

C15, C16, C67, C68, C76, C79, C87,

26

C91, C130, C142, C197, C199,

Ceramic Capacitor(electron) C-CERAMIC, CHIP;0.01 NF, 0.25PF, 50 V, C0G,

TP

C200, C201, C209, C296, C297,

C298, C301, C363
3

2203-000257

C58, C60, C143, C144, C145, C146,

29

C147, C148, C149, C150, C151,

Ceramic Capacitor(electron) C-CERAMIC, CHIP;10 NF, 10%, 50 V, X7R, TP,

1608

C152, C153, C154, C155, C156

3

2203-000257

C157, C158, C159, C160, C161,

Ceramic Capacitor(electron) C-CERAMIC, CHIP;10 NF, 10%, 50 V, X7R, TP,

C162, C163, C164, C165, C166,

1608

C290, C299, C300

3

2203-000426

C131

Ceramic Capacitor(electron) C-CERAMIC, CHIP;0.018 nF, 5%, 50 V, NP0, TP,

160

2203-000783

C133, C367, C368

Ceramic Capacitor(electron) C-CERAMIC, CHIP;0.33 nF, 5%, 50 V, NP0, TP,

1608

2203-001408

C70, C71, C132

Ceramic Capacitor(electron) C-CERAMIC, CHIP;0.27 nF, 5%, 50 V, NP0, TP,

1608

SAMSUNG Electronics Co., Ltd.

6-122

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

2203-005249

Assembly Position
C7, C14, C22, C23, C26, C27, C54, C59, C61, C66, C77,
C78, C84, C85, C86, C116, C134, C135, C136, C139, C140,

Qtty.

Part Name

233

Ceramic Capacitor(electron)

Description
C-CERAMIC, CHIP;100 NF,
10%, 50 V, X7R, TP, 1608

C169, C170, C171, C174, C175, C177, C191, C192, C193,

C194, C195, C196, C198, C202, C203, C204, C205, C206,
C207, C208, C210, C211, C212, C213, C214, C215, C216,
C217, C218, C219, C220, C221, C222, C223, C224, C225,
C226, C227, C228, C229, C230, C231, C232, C233, C234,
C235, C236, C237, C238, C239, C240, C241, C242, C243,
C244, C246, C247, C248, C250, C251, C252, C253, C254,
C255, C256, C257, C258, C259, C260, C261, C262, C263,
C264, C265, C266, C267, C268, C269, C270, C271, C272,
C273, C274, C275, C276, C277, C278, C279, C280, C281,
C282, C283, C284, C285, C286, C287, C288, C289, C291,
C292, C293, C294, C295, C302, C303, C304, C305, C306,
C307, C308, C309, C310, C311, C312, C313, C314, C315,
C316, C317, C318, C319, C320, C321, C322, C323, C324,
C325, C326, C327, C328, C329, C330, C331, C332, C333,
C334, C335, C336, C337, C338, C339, C340, C341, C342,
C343, C344, C345, C346, C347, C348, C349, C350, C351,
C352, C353, C354, C355, C356, C357, C358, C359, C360,
C361, C362, C364, C365, C366, C369, C370, C371, C372,
C373, C376, C377, C378, C379, C380, C381, C382, C383,
C384, C385, C386, C387, C388, C389, C390, C391, C392,
C393, C394, C395, C396, C397, C398, C399, C400, C401,
C402, C403, C404, C405, C406, C407, C408, C409, C410,
C411, C412, C413, C414, C415

SAMSUNG Electronics Co., Ltd.

6-123

CHAPTER 6. ! .

(continued)
Level

Part Code

2203-005457

Assembly Position
C62, C69, C179, C180, C181, C182,

Qtty.

Part Name

14

Ceramic Capacitor(electron)

C183, C184, C185, C186, C187, C188,

Description
C-CERAMIC, CHIP;1 NF, 10%, 2 KV, X7R, TP,
4525

C189, C190
3

2203-006005

C11, C12, C13

Ceramic Capacitor(electron)

2203-006104

C6, C65, C72, C73

Ceramic Capacitor(electron)

C-CER, CHIP;10 NF, 10%, 100 V, X7R, TP, 160

C-CER, CHIP;100 0NF, 10%, 50 V, X7R, TP,
3225

2402-001224

C5

Aluminum Capacitor(electron)

C-AL, SMD;10, UF, 20%, 100 V, GP, TP, 8.0 x

10.0 M

2402-001229

C10

2404-001037

C3, C4, C8, C9, C19, C20, C21, C25,

Aluminum Capacitor(electron)

C-AL, SMD;100, UF, 20%, 100 V, GP, TP, 13 x

77

Eletrolytic Capacitor(electron)

C-TA, CHIP;10, UF, 10%, 16 V, TP, 3528

13
C28, C29, C30, C32, C33, C34, C35, C36,
C38, C41, C42, C43, C44, C45, C46, C47,
C49, C50, C51, C52, C53, C57, C63, C64,
C80, C81, C83, C88, C89, C92, C93, C94,
C95, C96, C97, C98, C99, C100, C101,
C102, C103, C104, C105, C106, C107,
C108, C109, C110, C111, C112, C114,
C115, C120, C122, C123, C124, C125,
C127, C128, C129, C137, C138, C141,
C167, C168, C172, C173, C176, C178
3

2409-001112

C24, C31

Capacitors(electron)

C-ORGANIC, SMD;100, UF, 20%, 16 V, LR, TP,

1

2409-001114

C1, C2, C17, C18, C37, C40, C74, C75,

14

Capacitors(electron)

C-POLYMER, CHIP;220, UF, 20%, 10 V, LR, TP

C82, C90, C113, C119, C121, C126

3

2601-001056

T1

TRANSFORMER(electricity)

TRANS-SMD, PULSE;350, UH, 1:1, 1:1, 12.7 X

6.7

SAMSUNG Electronics Co., Ltd.

6-124

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2804-001588

Y1

Oscillator(electron)

OSCILLATOR-CLOCK;50 MHZ, 50PPM, 10TTL

2804-001247

Y2

Oscillator(electron)

OSCILLATOR-CLOCK;25 MHz, 50ppm, 10TTL &,

3301-000373

L19, L21, L22, L23

Magnetic, Parts(electricity)

BEAD-SMD;220 OHM, 1608, 200 MA, 307

3301-001120

L1, L2, L5, L6, L7, L8, L9, L10, L11,

15

Magnetic, Parts(electricity)

CMO
OHM/346 M
L14, L15, L16, L18, L20, L24

CORE-FERRITE BEAD;AB, 30 ohm, 2 x1.25 x

0.85 mm

3301-001208

L3, L4, L12, L13

Magnetic, Parts(electricity)

BEAD-SMD;60 ohm, 1608, 500 mA, TP, 80.2o

3301-001273

L17

Magnetic, Parts(electricity)

CORE-FERRITE BEAD;AB, 600 OHM, 1608, 200

3403-001144

S1

Switches(electric field)

SWITCH-PUSH 28 V, 0.4 A, 1P

3703-001252

P1, P2, P3

Connectors(electric field)

CONNECTOR-BACK, PANEL;30P, 5R, FEMALE,

3710-001184

J8

Connectors(electric field)

3711-001465

J1 J2 J3 J4

Connectors(electric field)

MA, T

ANGLE
CONNECTOR-SOCKET;60P, 2R, 0.8MM, SMD-S
CONNECTOR-HEADER;NOWALL, 3P, 1R,
2.54 mm, STR
1

3711-002630

J6

Connectors(electric field)

CONNECTOR-HEADER;NOWALL, 10P, 2R, 2.54

MM, ST

4309-001015

BAT1

Connectors(electric field)

1205-002455

U23, U24

LINEAR IC(electron)

CELL, PIN, 10 MM, 23.1 x 5.8 x 13.1 MM, BK

IC-TRANSCEIVER;VT6108, PQFP, 208P, 28 x
28 MM

1203-002267

U15

LINEAR IC(electron)

IC-POSI.FIXED REG.; TO-263-5, 5P, 400 MIL

2007-000040

R610, R611, R612, R613

Fixed Registers(electron)

R-CHIP;150 OHM, 1%, 1/16 W, DA, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-125

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

1203-002267

U15

LINEAR IC(electron)

IC-POSI.FIXED REG.; TO-263-5, 5P, 400 MIL

2007-000040

R610, R611, R612,

Fixed Registers(electron)

R-CHIP;150 OHM, 1%, 1/16 W, DA, TP, 1608

3704-000249

U12

Connectors(electric field)

SOCKET-IC;32P, PLCC, SN, 1.27 mm

4301-000108

BAT1

POWER SUPPLY(electricity)

BATTERY-LI;3 V, 220 mAH, BUTTON, 20 x 3.2 m

6203-001062

U17, U23, U24

HEAT SINK

HEAT SINK;HS2727B, T2.6, W27, L27, H4.8, ANOD

3710-000001

J1 J2 J3 J4

Connectors(electric field)

CONNECTOR-SHUNT;2P, 1R, STRAIGHT, AUF

GA41-00196A

PCS01

PCB(electricity)

OFFICESERV 7400, FR4, 8L, 1.6T, 130 x 275 MM

6002-000154

Locking, Unit, Part(metal available)

SCREW-TAPPING;PH, +, 2, M3(P 1.35), L8, ZPC

GA72-00241A

Plastics(injection)

PMO-LED, LENS;SME, PMMA, TRP, T1.0, IF-830,

R613

UL
1

GA97-01927A

SAMSUNG Electronics Co., Ltd.

Plastics(injection)

MEA-GPLIM STIFFENER ASSY;OFFICESERV

6-126

OfficeServ 7400 Service Manual

6.21 GLMD Board

Level

Part Code

Assembly Position

0401-000115

D1 D2 D3

0402-001080

0403-001280

0404-001004

ZD1 ZD2 ZD5 ZD6 ZD9

ZD10 ZD13 ZD14 ZD17
ZD18 ZD21 ZD22
ZD3 ZD4 ZD7 ZD8 ZD11
ZD12 ZD15 ZD16 ZD19
ZD20 ZD23 ZD24
D4

0502-000333

Qtty.

Part Name

Description

DIODES(electron)

MMBD7000LT1, 100 V, 20

12

DIODES(electron)

GF1G, 400 V, 1A, DO-214BA, TP

12

DIODES(electron)

MMSZ5240B, 9.5-10.5 V, 500

DIODES(electron)

MBRS130L, 30 V, 1000 MA, DO-214AA, TP

Q1

Transistors(electron)

MJE340, NPN, 20 W, TO-225 AA, BK

0604-001002

PC1, PC2, PC3

Transistors(electron)

TR, 100-600%, 200 mW, SOP-4, TP

1028219

U4

MICRO-PROCESSOR IC

40MHZ, 8BIT, 64P, LQFP, 3.3 V, -40 TO +85C, 4KBYTE

1037423

U1, U2, U3

LINEAR IC(electron)

QFN, 48P, 7 x 7 x 1 MM, PLASTIC

2007-000042

R84, R92

Fixed Registers(electron)

499 OHM, 1%, 1/10 W, TP, 1608

2007-000043

11

Fixed Registers(electron)

1 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-000052

Fixed Registers(electron)

10 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-000060

R6, R10, R15, R16, R29,

R35, R83, R85, R86, R90,
R95
R28, R34, R66, R67, R96,
R99
R36

Fixed Registers(electron)

100 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-000070

R20, R33, R97, R98

Fixed Registers(electron)

0 OHM, 5%, 1/16 W, DA, TP, 1608

2007-000287

R1, R37

Fixed Registers(electron)

100 OHM, 1%, 1/10 W, DA, TP, 1608

2007-000475

R103

Fixed Registers(electron)

1MOHM, 1%, 1/16 W, DA, TP, 1608

2007-000536

R42, R58, R73

Fixed Registers(electron)

200 ohm, 1%, 1/16 W, DA, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-127

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

12

Fixed Registers(electron)

2 KOHM, 1%, 1/16 W, DA, TP, 1608

Fixed Registers(electron)

7.5 KOHM, 1%, 1/10 W, TP, 1608

R104

Fixed Registers(electron)

10 OHM, 1%, 1/16 W, DA, TP, 1608

2007-007049

R19

Fixed Registers(electron)

22.1 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007226

R25, R26, R27, R38, R39,

R80, R81, R82, R93, R94,
R101, R102

12

Fixed Registers(electron)

49.9 ohm, 1%, 1/16 W, DA, TP, 1608

2007-007296

R53

Fixed Registers(electron)

1.21 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007299

R8, R18, R31

Fixed Registers(electron)

6.81 KOHM, 1%, 1/10 W, TP, 1608

2007-007455

R7, R17, R30

Fixed Registers(electron)

24.9 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007549

R9

Fixed Registers(electron)

4.99 Kohm, 1%, 1/16 W, DA, TP, 1608

2007-007723

R52

Fixed Registers(electron)

75 Kohm, 1%, 1/10 W, TP, 1608

2007-007937

R88

Fixed Registers(electron)

17.4 Kohm, 1%, 1/10 W, TP, 1608

2007-008067

R32

Fixed Registers(electron)

21 KOHM, 1%, 1/10 W, TP, 1608

2007-008108

R40, R41, R46, R49, R50,

15

Fixed Registers(electron)

45.3 Kohm, 1%, 1/10 W, TP, 1608

Fixed Registers(electron)

22.6 Kohm, 1%, 1/10 W, TP, 1608

13

Fixed Registers(electron)

2 ohm, 1%, 1/10 W, TP, 1608

2007-000669

2007-001139

R2, R3, R4, R5, R11, R12,

R13, R14, R21, R22, R23,
R24
R51, R65, R87, R89

2007-002899

R54, R55, R56, R61, R62,

R68, R69, R71, R75, R76
3

2007-008414

R45, R57, R72

2007-008656

R43, R44, R47, R48, R59,

R60, R63, R64, R74, R77,
R78, R79, R100

SAMSUNG Electronics Co., Ltd.

6-128

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2011-001011

RA1

Fixed Registers(electron)

10 Kohm, 5%, 63 mW, L, CHIP, 8P, TP

2203-000426

C39, C79, C80

Ceramic, Capacitor(electron)

0.018 nF, 5%, 50 V, NP0, TP, 1608

2203-000971

C1, C19, C30

Ceramic, Capacitor(electron)

47 nF, 10%, 100 V, X7R, TP, 321

2203-001386

C6, C7, C10, C11, C20, C21, C23,

30

Ceramic, Capacitor(electron)

100 nF, 10%, 100 V, X7R, TP, 3216, 3.2

Ceramic, Capacitor(electron)

2.2 NF, 5%, 50 V, NP0, TP, 1608

12

Ceramic, Capacitor(electron)

1 nF, 5%, 100 V, NP0, TP, 3216

14

Ceramic, Capacitor(electron)

100 NF, 10%, 50 V, X7R, TP, 1608

Ceramic, Capacitor(electron)

1 nF, 5%, 50 V, NP0, TP, 1608

C24, C28, C29, C35, C36, C43, C45,

C46, C48, C49, C53, C54, C56, C57,
C58, C59, C60, C64, C65, C66, C68,
C69, C70
3

2203-001397

2203-005199

C77, C81
C2, C3, C4, C5, C14, C15, C17, C18,
C27, C31, C33, C34

2203-005249

C12, C13, C25, C26, C37, C38, C44,

C47, C55, C67, C74, C75, C76, C78

2203-005565

C50, C51, C52, C61, C62, C63, C71,

C72, C73

2402-000130

C8, C9, C40, C41, C42

Aluminum, Capacitor(electron)

2.2, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.

2402-001231

C16, C22, C32

Aluminum, Capacitor(electron)

47, UF, 20%, 10 0 V, GP, TP, 10.3X1

1089115

Y1

Oscillator(electron)

9.8304 MHZ, 20PPM, SMD, 18, PF, 70 OHM, TP

3301-001120

L1, L2

Magnetic, Parts(electricity)

AB, 30 ohm, 2 x 1.25 x 0.85 mm, 3000 mA, TP,

3711-003581

J1

Connectors(electric field)

BOX, 60P, 2R, 0.8 MM, S

6001-000560

XX

Locking, Unit, Part(metal available)

PH, +, M3, L6, PASS, STS30

6046-000184

XX

Locking, Unit, Part(metal available)

M3, L12, NI, PLT, SM20C

GA41-00197A

PCS01

PCB(electricity)

OFFICESERV 7400, FR4, 6L, 1.6T, 88.9 x 56 MM

FERRITE

SAMSUNG Electronics Co., Ltd.

6-129

CHAPTER 6. ! .

6.22 GSIM Board

Level

Part Code

Assembly Position

Qtty.

Part Name

Description

0402-001211

D4 D5

DIODES(electron)

DIODE-RECTIFIER;MURS320, 200 V, 3 A, MSR, TP

0404-001004

D1 D2 D6 D7 D8 D10 D11

DIODES(electron)

DIODE-SCHOTTKY;MBRS130L, 30 V, 1000 MA, DO-21

0404-001020

D3

DIODES(electron)

DIODE-SCHOTTKY;BAT54C, 30 V, 200 mA, SOT

0404-001116

D9

DIODES(electron)

DIODE-SCHOTTKY;B540C, 40 V, 5000 MA, DO-

0501-000467

Q3

TRANSISTORs(electron)

TR-SMALL SIGNAL;MMBT3906, PNP, 300 MW, SOT-2

0505-001778

Q1 Q2

TRANSISTORs(electron)

FET-SILICON;IRF7822, N, 30 V, 18 A, 6.5 MO

0601-001064

LED10

Optical Elements(electron)

LED;CHIP, RED/Y-GRN, 1.7 x 2.5 mm, 660/560 nm

0601-001094

11

Optical Elements(electron)

LED;SMD, Y-GRN, 1.6 x 0.8 x 0.8 MM, 570 NM, 1

LED1, LED2, LED3, LED4,

LED5, LED6, LED7, LED8,
LED9, LED11, LED12

0801-002446

U28

LOGIC IC(electron)

IC-CMOS, LOGIC;74LCX14, SCHMITT INVERTER, T

0802-001029

U1, U2, U3

LOGIC IC(electron)

IC-BICMOS, LOGIC;74LVTH16245, AND GATE, TSS

0802-001037

U8, U13, U14

LOGIC IC(electron)

IC-BICMOS, LOGIC;74LVT245, BUS TRANSCEIVER

1205-002580

U18

LINEAR IC(electron)

IC-ETHERNET SWITCH;BCM5696B0KPBG, PB

1006-001140

U33

INTERFACE IC(electron)

IC-LINE TRANSCEIVER;3232, SSOP, 16P, 200MIL

1032143

U7

LINEAR IC(electron)

ICS8535AG-01, TSSOP, 20P, 6.6 x 6.4 MM, PLASTIC, 3.3 V

1053661

U6

MICRO-PROCESSOR IC

RTC-8564, I2C Interface, Built-in Oscillator, 3.3 V

1063422

U17

LINEAR IC(electron)

LT1170, 5-LEAD DD, 5P, 9.906 x 8.382, PLASTIC, 3/75 V,

0TO + 125C, 10 A, 1.224/1.264 V, ST

SAMSUNG Electronics Co., Ltd.

6-130

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

1067118

U22

MICRO-PROCESSOR IC

400MHZ, 64BIT, PBGA, 516P, 1.5 V, 0 TO 105C, 32 BIT

1090354

L12

INDUCTOR/COIL(electricity)

IDI-OR17.5-130, 13 0UH, 10%, 0.1 MAX 21.5 x 10. M

1103-001010

U5

MEMORY IC(electron)

IC-EEPROM; 24C02, 256 x 8, SOP, 8P, 5 x 4 mm

1105-001548

U9, U10, U11, U12

MEMORY IC(electron)

IC-DRAM;K4S561632, 4 x 4 M x 1 6 BIT, TSOP

1107-001229

U20, U21

MEMORY IC(electron)

IC-FLASH MEMORY;28F128, 16M x 8/8 M x 16 BIT, TS

1107-001534

U30

MEMORY IC(electron)

39VF040, 512 K 8 BIT, PLCC, 32P

1106-001058

U27

MEMORY IC(electron)

IC-SRAM;71321, 2 K x 8 BIT, TQFP, 64P, 10 x 1

1203-000469

U23

LINEAR IC(electron)

IC-POSI.ADJUST REG.;1117, SOT-223, 4P, 138 M

1203-001643

U25

LINEAR IC(electron)

IC-RESET;706R, SOP, 8P, 150MIL, PLASTIC, 0.3/

1203-001691

U31, U32

LINEAR IC(electron)

IC-POSI.ADJUST REG.;29152, TO-263, 5P, PL

1203-001694

U24

LINEAR IC(electron)

IC-SWITCH VOL. REG.;2678, TO-263, 7P

1203-003114

U4

LINEAR IC(electron)

IC-DC/DC, CONVERTER;MAX1813EEI, QSOP

1205-001606

U16

LINEAR IC(electron)

IC-BUFFER;, CY2305SC-1H, SOIC, 8P, 150MIL, PLA

1205-001864

U29

LINEAR IC(electron)

IC-TRANSCEIVER;DJLXT972ALC, LQFP, 64P, 393 M

1205-002480

U26

LINEAR IC(electron)

IC-BUS SWITCH;PCA9548PW, TSSOP, 24P, 7

1205-002676

U15

LINEAR IC(electron)

IC-BUFFER;ICS8305AGT, TSSOP, 16P, 5 x 4.

1301-001663

U19

ASICs(electron)

IC-CPLD;LC4128V-75T128C, TQFP, 128P, 14 x 14 M

SAMSUNG Electronics Co., Ltd.

6-131

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-000043

Assembly Position
R5, R6, R7, R8, R12, R14, R15, R22,

Qtty.

Part Name

Description

56

Fixed Registers(electron)

R-CHIP;1 KOHM, 1%, 1/16 W, DA, TP, 1608

R25, R26, R27, R30, R40, R64, R78,

R79, R80, R81, R82, R105, R109,
R121, R154, R156, R159, R180,
R185, R197, R199, R201, R202,
R203, R204, R216, R218, R219,
R222, R223, R227, R228, R232,
R233, R234, R235, R241, R245,
R251, R259, R260, R264, R265,
R267, R268, R270, R271, R272
3

2007-000052

R28, R172, R256

Fixed Registers(electron)

R-CHIP;10 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-000060

R18, R35

Fixed Registers(electron)

R-CHIP;100 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-000063

R9

Fixed Registers(electron)

R-CHIP;150 Kohm, 1%, 1/16 W, DA, TP, 1608

2007-000070

R2, R42, R274

Fixed Registers(electron)

R-CHIP;0 OHM, 5%, 1/16 W, DA, TP, 1608

2007-000287

18

Fixed Registers(electron)

R-CHIP;100 OHM, 1%, 1/10 W, DA, TP, 1608

Fixed Registers(electron)

R-CHIP;100 OHM, 1%, 1/10 W, DA, TP, 1608

R31, R36, R73, R93, R95, R101,

R107, R111, R116, R120, R133

2007-000287

R153, R155, R173, R205, R206,

2007-000879

R32

Fixed Registers(electron)

R-CHIP;4.7 ohm, 1%, 1/16 W, DA, TP, 1608

2007-001164

R207, R208

Fixed Registers(electron)

R-CHIP;75 ohm, 1%, 1/16 W, DA, TP, 1608

2007-002899

14

Fixed Registers(electron)

R-CHIP;10 OHM, 1%, 1/16 W, DA, TP, 1608

18

Fixed Registers(electron)

R-CHIP; 33.2 OHM, 1%, 1/16 W, DA, TP, 1608

R236, R273

R122, R124, R127, R129, R130,

R137, R138, R141, R144, R147,
R148, R229, R263, R269

2007-002913

R17, R63, R75, R77, R97, R98, R102,

R106, R117, R118, R132, R164,
R165, R174, R224, R230, R237, R258

SAMSUNG Electronics Co., Ltd.

6-132

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-002987

R209, R210, R252, R257

Fixed Registers(electron)

R-CHIP; 4.75 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007049

R255

Fixed Registers(electron)

R-CHIP; 22.1 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007226

32

Fixed Registers(electron)

R-CHIP; 49.9 ohm, 1%, 1/16 W, DA, TP, 1608

Fixed Registers(electron)

R-CHIP; 49.9 ohm, 1%, 1/16 W, DA, TP, 1608

66

Fixed Registers(electron)

R-CHIP; 8.25 Kohm, 1%, 1/16 W, DA, TP, 1608

Fixed Registers(electron)

HIP; 3.01 KOHM, 1%, 1/16 W, DA, TP, 1608

12

Fixed Registers(electron)

R-CHIP; 332 OHM, 1%, 1/16 W, DA, TP, 1608

R43, R44, R45, R46, R47, R48,

R49, R50, R51, R52, R53, R54

2007-007226

R55, R56, R59, R60, R61, R62,

R65, R66, R67, R68, R85, R86,
R91, R94, R99, R100, R103,
R194, R195, R261

2007-007238

R1, R3, R10, R16, R21, R24,

R33, R69, R70, R71, R72, R74,
R76, R87, R92, R104, R113,
R115, R123, R125, R126, R128,
R131, R139, R140, R142, R145,
R146, R149, R150, R151, R152,
R157, R158, R160, R161, R166,
R167, R168, R176, R178, R179,
R183, R184, R188, R189, R190,
R191, R192, R193, R198, R200,
R212, R213, R214, R215, R217,
R225, R226, R238, R239, R240,
R243, R250, R275, R276

2007-007443

R83, R84, R162, R163, R170,

R171, R186, R187

2007-007454

R29, R39, R57, R58, R169,

R175, R177, R181, R182, R211,
R248, R254

SAMSUNG Electronics Co., Ltd.

6-133

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-007520

R11

Fixed Registers(electron)

R-CHIP; 20 OHM, 1%, 1/16 W, DA, TP, 1608

2007-007620

R4, R88, R89, R96, R220,

Fixed Registers(electron)

R-CHIP; 47.5 OHM, 1%, 1/16 W, DA, TP, 1608

2007-007645

R90, R247, R253

Fixed Registers(electron)

R-CHIP; 51.1 OHM, 1%, 1/16 W, DA, TP, 1608

2007-007676

R262

Fixed Registers(electron)

R-CHIP; 237 ohm, 1%, 1/10 W, TP, 1608

2007-007796

R112

Fixed Registers(electron)

R-CHIP; 2.21 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-008106

R37

Fixed Registers(electron)

R-CHIP; 3.92 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-008122

R108, R110, R114, R119,

Fixed Registers(electron)

R-CHIP; 22.1 OHM, 1%, 1/10 W, DA, TP, 1608

2007-008122

R136, R143

Fixed Registers(electron)

R-CHIP; 22.1 OHM, 1%, 1/10 W, DA, TP, 1608

2007-008148

R20

Fixed Registers(electron)

R-CHIP; 121 Kohm, 1%, 1/16 W, DA, TP, 1608

2007-008368

R266

Fixed Registers(electron)

R-CHIP; 10MOHM, 1%, 1/10 W, DA, TP, 1608

2011-000151

RA89, RA91

Fixed Registers(electron)

R-NETWORK;100 ohm, 5%, 63 mW, L, CHIP, 8P, TP

2011-000515

RA84, RA85, RA86

Fixed Registers(electron)

R-NETWORK;4.7 Kohm, 5%, 1/16 W, L, CHIP, 8P, TP

2011-000585

42

Fixed Registers(electron)

R-NETWORK; 47 ohm, 5%, 63 mW, L, CHIP, 8P, TP

R221

R134, R135

RA1, RA3, RA5, RA8, RA10,

RA12, RA15, RA17, RA19,
RA22, RA24, RA26, RA28,
RA29, RA30, RA35, RA36,
RA37, RA44, RA45, RA46,
RA47, RA49, RA50, RA51,
RA52, RA53, RA54, RA58,
RA59, RA60, RA63, RA66,
RA67, RA69, RA72, RA73,
RA74, RA78, RA79, RA80,
RA81

SAMSUNG Electronics Co., Ltd.

6-134

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2011-000660

Assembly Position
RA21, RA43, RA65, RA70, RA71, RA87, RA88, RA90,

Qtty.
9

RA92
3

2011-000689

RA7, RA14, RA42, RA48, RA55, RA56, RA57, RA61,

16

RA62, RA64, RA68, RA75, RA76, RA77, RA82, RA83

3

2011-000881

RA2, RA4, RA6, RA9, RA11, RA13, RA16, RA18,

20

RA20, RA23, RA25, RA27, RA31, RA32, RA33, RA34,

Part Name

Description

Fixed

R-NETWORK; 1 Kohm, 5%, 63 mW,

Registers(electron)

L, CHIP, 8P, TP

Fixed

R-NET; 8.2 KOHM, 5%, 1/16 W, L,

Registers(electron)

CHIP, 8P, TP

Fixed

R-NETWORK; 33 ohm, 5%, 1/16 W,

Registers(electron)

L, CHIP, 8P, TP

RA38, RA39, RA40, RA41

3

2203-000041

C22, C69, C70, C90, C136, C137, C138, C149, C151,

17

C154, C167, C170, C198, C199, C200, C324, C325

3
3

2203-000257
2203-000425

C285, C313, C314, C368, C376

C86, C87, C88, C89, C99, C100, C101, C255, C256,

5
13

C257, C258, C259, C260

3
3

2203-000576
2203-000681

C4
C373, C374

1
2

Ceramic

C-CERAMIC, CHIP;0.01 NF, 0.25, PF,

Capacitor(electron)

50 V, C0G, TP

Ceramic

C-CERAMIC, CHIP;10 NF, 10%, 50 V,

Capacitor(electron)

X7R, TP, 1608

Ceramic

C-CER, CHIP;0.018 NF, 5%, 50 V,

Capacitor(electron)

C0G, 1005

Ceramic

C-CER, CHIP;220 nF, 10%, 50 V,

Capacitor(electron)

X7R, TP, 3216

Ceramic

C-CERAMIC, CHIP;0.027 nF, 5%,

Capacitor(electron)

50 V, NP0, TP, 160

2203-000783

C365, C371

Ceramic

C-CERAMIC, CHIP;0.33 nF, 5%,

Capacitor(electron)

50 V, NP0, TP, 1608

2203-000998

C13

Ceramic

C-CERAMIC, CHIP;0.047 NF, 5%,

Capacitor(electron)

50 V, NP0, TP, 160

2203-001386

C169, C183

Ceramic

C-CER, CHIP;100 nF, 10%, 100 V,

Capacitor(electron)

X7R, TP, 3216, 3

2203-001408

C286, C287

Ceramic

C-CERAMIC, CHIP;0.27 nF, 5%,

Capacitor(electron)

50 V, NP0, TP, 1608

Ceramic

C-CER, CHIP;33 NF, 10%, 50 V, X7R,

Capacitor(electron)

TP, 1608

2203-001634

SAMSUNG Electronics Co., Ltd.

C301

6-135

CHAPTER 6. ! .

(continued)
Level
3
3

Part Code
2203-005171
2203-005249

Assembly Position

Qtty.

C19, C21, C43, C52, C127, C132, C150, C176, C191, C355

10

C1, C5, C6, C7, C8, C9, C11, C15, C16, C17, C18, C20,
C23, C25, C26, C27, C28, C29, C31, C33, C34, C37, C44,

238

Part Name

Description

Ceramic

C-CER, CHIP 1000 NF, 10%,

Capacitor(electron)

16 V, X7R, 2012

Ceramic

C-CERAMIC, CHIP;100 NF, 10%,

Capacitor(electron)

50 V, X7R, TP, 1608

C46, C47, C48, C49, C50, C54, C56, C57, C59, C60, C61,
C62, C63, C64, C71, C73, C74, C75, C76, C77, C78, C79,
C80, C84, C93, C95, C97, C98, C104, C105, C106, C110,
C111, C114, C115, C116, C117, C118, C119, C120, C121,
C124, C125, C126, C128, C130, C131, C134, C135, C139,
C140, C141, C142, C143, C144, C145, C146, C147, C148,
C152, C153, C155, C156, C157, C158, C159, C160, C161,
C162, C163, C164, C165, C168, C171, C172, C173, C174,
C175, C177 178, C179, C180, C184, C185, C186, C190,
C192, C193, C194, C196, C201, C202, C203, C204, C205,
C206, C207, C208, C209, C210, C211, C212, C213, C214,
C215, C216, C217, C218, C220, C221, C222, C223, C224,
C225, C226, C227, C228, C229, C230, C231, C232, C233,
C234, C235, C236, C237, C239, C240, C241, C242, C243,
C244, C245, C247, C248, C249, C252, C253, C254, C261,
C264, C265, C266, C267, C268, C269, C270, C272, C273,
C276, C277, C278, C279, C280, C281, C282, C283, C284,
C288, C289, C293, C294, C295, C297, C298, C299, C300,
C304, C305, C306, C307, C308, C309, C310, C312, C315,
C316, C317, C321, C326, C328, C330, C331, C333, C334,
C335, C336, C337, C338, C339, C340, C341, C342, C343,
C345, C346, C347, C348, C349, C354, C357, C358, C359,
C360, C366, C367, C369, C372, C375, C377, C380, C381,
C382, C383, C386

SAMSUNG Electronics Co., Ltd.

6-136

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2203-005457

C322, C323

Ceramic, Capacitor(electron)

C-CERAMIC, CHIP;1 NF, 10%, 2KV, X7R, TP, 4525

2203-006005

C45, C53, C55, C67,C108, C181

Ceramic, Capacitor(electron)

C-CER, CHIP;10 NF, 10%, 100V, X7R, TP, 160

2203-006104

C24, C187

Ceramic, Capacitor(electron)

C-CER, CHIP;1000 NF, 10%, 50V, X7R, TP, 3225

2203-006170

C250

Ceramic, Capacitor(electron)

C-CER, CHIP;220 nF, 10%, 16V, X7R, 1608

2402-000204

C14, C274, C302, C370, C379

Ceramic, Capacitor(electron)

C-AL, SMD;10, UF, 20%, 16V, WT, TP, 4.3 x 4.3 x 5.4

2402-001224

C42

C-AL, SMD;10, UF, 20%, 100 V, GP, TP, 8.0 x 10.0 M

2402-001229

C41, C94

C-AL, SMD;100, UF, 20%, 100 V, GP, TP, 13 x 13

2404-001037

C2, C3, C30, C38, C39, C40,

50

Eletrolytic, Capacitor(electron) C-TA, CHIP; 10, UF, 10%, 16 V, TP, 3528

C51, C58, C65, C66, C68, C72,

C85, C91, C92, C102, C103,
C107, C109, C112, C113, C129,
C133, C166, C182, C188, C189,
C195, C197, C219, C238, C262,
C263, C275, C290, C292, C311,
C318, C319, C320, C327, C329,
C332, C350, C351, C352, C356,
C378, C384, C385
3

2409-001112

2409-001114

C12, C246, C251

C10, C35, C36, C81, C82, C83,

C-ORGANIC, SMD;100, UF, 20%, 16 V, LR, TP, 1

19

C-POLYMER, CHIP;220, UF, 20%, 10 V, LR, TP

C96, C122, C123, C271, C291,

C296, C303, C344, C353, C361,
C362, C363, C364
3

2601-001056

SAMSUNG Electronics Co., Ltd.

T1

TRANSFORMER(electricity) TRANS-SMD, PULSE;350, UH, 1:1, 1:1, 12.7 x 6.7

6-137

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2703-001795

L24

INDUCTOR/COIL(electricity)

INDUCTOR-SMD; 15, UH, 20%, 18.54 x 15.24 x 7

2703-002220

L2

INDUCTOR/COIL(electricity)

INDUCTOR-SMD; 1, UH, 20%, 4540

2703-002330

L5

INDUCTOR/COIL(electricity)

INDUCTOR-SMD; 3.3, UH, 20%, 13.21 x 9.91 MM

2801-004058

Y4

CRYSTAL-SMD; 25 MHZ, 30, PPM, 28-ABX, 20, PF, 50

OH

2804-001247

Y1

Oscillator(electron)

OSCILLATOR-CLOCK;25 MHz, 50, Ppm, 10TTL &, CMO

2804-001587

Y3

Oscillator(electron)

OSCILLATOR-CLOCK;100 MHz, 50, Ppm, 10 TTL

2804-001622

Y2

Oscillator(electron)

OSCILLATOR-CLOCK;127 MHZ, 50PPM, E/D &, C

3301-000373

L3, L4, L7, L8, L10, L11, L13,

12

Magnetic Parts(electricity)

BEAD-SMD;220 OHM, 1608, 200MA, 307 OHM/346 M

L18, L19, L21, L22, L23

3

3301-001120

L1, L14, L15

Magnetic Parts(electricity)

CORE-FERRITE BEAD;AB, 30 ohm, 2 x 1.25 x 0.85 mm

3301-001208

L6, L9, L17, L20, L25, L27,

Magnetic Parts(electricity)

BEAD-SMD;60 ohm, 1608, 500 mA, TP, 80.2o

L28, L29, L30

3

3301-001273

L16, L26

Magnetic Parts(electricity)

CORE-FERRITE BEAD;AB, 600 OHM, 1608, 200 MA, T

3404-001062

S1

Switches(electric field)

SWITCH-TACT;12 V, 50 MA, 160GF, 6 x 6 x 3.6 MM, SPS

3703-001252

P1, P2, P3

Connectors(electric field)

CONNECTOR-BACK, PANEL;30P, 5R, FEMALE, ANGLE

3710-001184

J12

Connectors(electric field)

CONNECTOR-SOCKET;60P, 2R, 0.8 MM, SMD-S

3711-001465

J13 J14

Connectors(electric field)

CONNECTOR-HEADER;NOWALL, 3P, 1R, 2.54 mm, STR

3711-002630

J17

Connectors(electric field)

CONNECTOR-HEADER;NOWALL, 10P, 2R, 2.54 MM, ST

3711-002633

J15 J18

Connectors(electric field)

CONNECTOR-HEADER;NOWALL, 2P, 1R, 2.54 mm, STR

3719-001308

J7 J8 J9 J10 J11

Connectors(electric field)

CONNECTOR-ACCESSORY;20P, SFP, C-ALLOY

3722-001399

J1

Connectors(electric field)

JACK-MODULAR;8P/8C, STANDARD, Y, ANGLE, STAN

SAMSUNG Electronics Co., Ltd.

6-138

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

4309-001015

BAT1

Connectors(electric field)

CELL, PIN, 10 MM, 23.1 x 5.8 x 13.1 MM, BK

2007-008116

R249

Fixed Registers(electron)

R-CHIP;30.1 OHM, 1%, 1/10W, TP, 1608

3710-002077

J2 J3 J4 J5 J6

Connectors(electric field)

CONNECTOR-SOCKET;20P, 2R, 0.8MM, SMD-A

3704-000249

U30

Connectors(electric field)

32P, PLCC, SN, 1.27 mm

4301-000108

BAT1

POWER SUPPLY(electricity)

BATTERY-LI;3V, 220 mAH, BUTTON, 20 x 3.2 m

3710-000001

J13 J14

Connectors(electric field)

CONNECTOR-SHUNT;2P, 1R, STRAIGHT, AUF

6002-000154

XX

Locking, Unit, Part(metal available)

SCREW-TAPPING;PH, +, 2, M3(P 1.35), L8, ZPC

GA41-00194A

PCS01

PCB(electricity)

OFFICESERV 7400, FR4, 8L, 1.6T, 130 x 275 MM

GA72-00365A

XX

Plastics(injection)

PMO-LED, LENS-3;OFFICESERV7400, PMMA,

GA97-01929A

XX

Plastics(injection)

MEA-GSIM STIFFENER ASSY;OFFICESERV

SAMSUNG Electronics Co., Ltd.

6-139

CHAPTER 6. ! .

6.23 GSIMD Board

Level

Part Code

Assembly Position

0404-001004

D1

0601-001094

LED1, LED2, LED3, LED4,

Qtty.
1
10

Part Name

Description

DIODES(electron)

MBRS130L, 30 V, 1000 MA, DO-214AA, TP

Optical Elements(electron)

SMD, Y-GRN, 1.6 x 0.8 x 0.8 MM, 570 NM, 1

LED5, LED6, LED7, LED8,

LED9, LED10
3

1203-001691

U1

LINEAR IC(electron)

29152, TO-263, 5P, PLASTIC, 1.24/26 V, -40

1205-002480

U2

LINEAR IC(electron)

PCA9548PW, TSSOP, 24P, 7

2007-000043

R1, R2, R3, R10, R17, R18,

Fixed Registers(electron)

1 KOHM, 1%, 1/16 W, DA, TP, 1608

10

Fixed Registers(electron)

332 OHM, 1%, 1/16 W, DA, TP, 1608

R19, R20, R21

3

2007-007454

R6, R7, R8, R9, R11, R12,

R13, R14, R15, R16

2007-007645

R4

Fixed Registers(electron)

51.1 OHM, 1%, 1/16 W, DA, TP, 1608

2007-008116

R5

Fixed Registers(electron)

30.1 OHM, 1%, 1/10 W, TP, 1608

2011-000515

RA5, RA6, RA7

Fixed Registers(electron)

4.7 Kohm, 5%, 1/16 W, L, CHIP, 8P, TP

2011-000689

RA1, RA2, RA3, RA4, RA8

Fixed Registers(electron)

8.2 KOHM, 5%, 1/16 W, L, CHIP, 8P, TP

2203-005249

19

Ceramic Capacitor(electron)

100 NF, 10%, 50 V, X7R, TP, 1608

Ceramic Capacitor(electron)

100 NF, 10%, 50 V, X7R, TP, 1608

Eletrolytic Capacitor(electron)

10, UF, 10%, 16 V, TP, 3528

220, UF, 20%, 10 V, LR, TP

Magnetic Parts(electricity)

220 OHM, 1608, 200MA, 307 OHM/346 MHZ, 30000O

C1, C2, C4, C6, C7, C8,

C10, C12, C15, C16, C18,
C20, C21, C22

2203-005249

C23, C25, C27, C28, C32

2404-001037

C3, C5, C9, C11, C13, C14,

12

C17, C19, C24, C26, C31,

C33
3

2409-001114

C29, C30

3301-000373

L1, L2, L3, L5, L6, L8, L9,

2
12

L11, L12, L14, L15, L16

SAMSUNG Electronics Co., Ltd.

6-140

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

3301-001208

L4, L7, L10, L13, L17

Magnetic Parts(electricity)

60 ohm, 1608, 500 mA, TP, 80.2o

3710-002077

J1 J3 J5 J8 J10

Connectors(electric field)

20P, 2R, 0.8 MM, SMD-A

3711-003581

J7

Connectors(electric field)

BOX, 60P, 2R, 0.8 MM, S

3719-001308

J2 J4 J6 J9 J11

Connectors(electric field)

20P, SFP, C-ALLOY

GA41-00195A

PCS01

PCB(electricity)

OFFICESERV 7400, FR4, 4L, 1.6T, 102.2 x 68.5 MM

GA72-00365A

Plastics(injection)

OFFICESERV7400, PMMA

SAMSUNG Electronics Co., Ltd.

6-141

CHAPTER 6. ! .

6.24 GWIM Board

Level

Part Code

Assembly Position

Qtty.

Part Name

Description

0402-001211

D1 D9

DIODES(electron)

DIODE-RECTIFIER;MURS320, 200 V, 3A, MSR, TP

0404-001004

D2 D4 D6 D7 D10

DIODES(electron)

DIODE-SCHOTTKY;MBRS130L, 30 V, 1000MA, DO-21

0404-001020

D5

DIODES(electron)

DIODE-SCHOTTKY;BAT54C, 30 V, 200 mA, SOT

0404-001116

D3 D11

DIODES(electron)

DIODE-SCHOTTKY;B540C, 40 V, 5000 MA, DO-

0501-000467

Q6

Transistors(electron)

TR-SMALL SIGNAL;MMBT3906, PNP, 300 MW, SOT-2

0505-001778

Q1 Q2 Q3 Q4 Q5

Transistors(electron)

FET-SILICON;IRF7822, N, 30 V, 18 A, 6.5MO

0601-001064

LED1, LED2, LED3, LED4,

Optical Elements(electron)

LED;CHIP, RED/Y-GRN, 1.7 x 2.5 mm, 660/560 nm

LED5, LED6
3

0801-002095

U2, U3, U4, U21, U22, U23

LOGIC IC(electron)

IC-CMOS, LOGIC;74LC x 245, BUFFERS, TSSOP, 20P

0801-002446

U31, U33

LOGIC IC(electron)

IC-CMOS, LOGIC;74LCX14, SCHMITT INVERTER, T

0801-002626

U18, U19, U20

LOGIC IC(electron)

IC-CMOS, LOGIC;74LVX573, LATCH, TSSOP, 20P, 1

0805-001038

U38

LOGIC IC(electron)

IC-ECL;100S324Q, TRANSLATOR, PLCC, 28P

0805-001039

U39

LOGIC IC(electron)

IC-ECL;100S325, TRANSLATOR, PLCC, 28P

0902-001866

U7

CPU IC(electron)

IC-MICROPROCESSOR;IBM25PPC750GX, 1 GH

0904-001363

U35

UART IC(electron)

IC-UART;16C1551, 8 BIT, PLCC, 28P, 24 MHZ, TR

0904-001991

U13

IC-MEMORY,

IC-MEMORY, CONT.;MV64460, 64 BIT, BGA, 8

CONT(electron)
3

1003-001613

U17

IC-CLOCK

IC-CLOCK DRIVER;95V857, TSSOP, 48P, 24

DRIVER(electron)
3

1006-001140

U37

INTERFACE IC(electron)

IC-LINE TRANSCEIVER;3232, SSOP, 16P, 200MIL

1053661

U15

MICRO-PROCESSOR IC

RTC-8564, I2C Interface, built-in Oscillator, 3.3 V

SAMSUNG Electronics Co., Ltd.

6-142

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
1063422

Assembly Position
U1

Qtty.
1

Part Name
LINEAR IC(electron)

Description
LT1170, 5-LEAD DD, 5P, 9.906 x 8.382, PLASTIC, 3/75 V,
0TO+125C, 10 A, 1.224/1.264 V, ST

1063459

U9

LINEAR IC(electron)

LTC3413, TSSOP, 16P, 4.9 x 6.4 MM, PLASTIC, 0.7/3 V,

-40TO+85C, 3A, 2.5/6 V, TP

1090354

L1

INDUCTOR/COIL(electricity) IDI-OR17.5-130, 130UH, 10%, 0.1 MAX, 21.5 x 10.5 MM

1103-001010

U41

MEMORY IC(electron)

IC-EEPROM;24C02, 256 x 8, SOP, 8P, 5 x 4 mm

1107-001229

U28, U29

MEMORY IC(electron)

IC-FLASH MEMORY;28F128, 16M x 8/8 M x 16 BIT, TS

1107-001534

U34

Memory IC(electron)

39VF040, 512K 8 BIT, PLCC, 32P

1106-001058

U40

Memory IC(electron)

IC-SRAM;71321, 2KX8 BIT, TQFP, 64P, 10 x 1

1203-001643

U32

Linear IC(electron)

IC-RESET;706R, SOP, 8P, 150MIL, PLASTIC, 0.3

1203-001691

U10, U36

Linear IC(electron)

IC-POSI.ADJUST REG.;29152, TO-263, 5P, PL

1203-001694

U6

Linear IC(electron)

IC-SWITCH VOL. REG.;2678, TO-263, 7P

1203-001998

U5

Linear IC(electron)

IC-SWITCH VOL. REG.;2596, TO-263, 5P

1203-003114

U8

Linear IC(electron)

IC-DC/DC, CONVERTER;MAX1813EEI, QSOP

1205-001530

U24, U25, U26

Linear IC(electron)

IC-TRANSCEIVER;HDMP-1646A, QFP, 64P, 1

1205-001606

U14, U16

Linear IC(electron)

IC-BUFFER;CY2305SC-1H, SOIC, 8P, 150MIL, PLA

1205-002480

U30

Linear IC(electron)

IC-BUS SWITCH;PCA9548PW, TSSOP, 24P, 7

1205-002675

U12

Linear IC(electron)

IC-BUFFER;ICS670M-03IT, SOP, 16P, 10 x 4

1205-002676

U11

Linear IC(electron)

IC-BUFFER;ICS8305AGT, TSSOP, 16P, 5 x 4.

1301-001663

U27

ASICs(electron)

IC-CPLD;LC4128V-75T128C, TQFP, 128P, 14 x 14 M

2007-000042

R204

R-CHIP;499OHM, 1%, 1/10 W, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-143

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-000043

Assembly Position
R122, R150, R203, R210,

Qtty.

Part Name

Description

22

Fixed Registers(electron)

R-CHIP;1 KOHM, 1%, 1/16 W, DA, TP, 1608

12

Fixed Registers(electron)

R-CHIP;10 KOHM, 1%, 1/16 W, DA, TP, 1608

Fixed Registers(electron)

R-CHIP;150 Kohm, 1%, 1/16 W, DA, TP, 1608

68

Fixed Registers(electron)

R-CHIP;4.7 KOHM, 5%, 1/16 W, TP, 1005

R214, R217, R309, R311,

R312, R313, R321, R331,
R336, R338, R342, R346,
R354, R359, R361, R371,
R372, R395
3

2007-000052

R124, R176, R182, R194,

R199, R202, R205, R322,
R324, R326, R341, R350

2007-000063

2007-000143

R26
R1, R5, R6, R7, R9, R12,
R14, R15, R16, R17, R18,
R19, R20, R28, R29, R30,
R31, R32, R108, R109,
R125, R135, R137, R138,
R144, R145, R146, R147,
R148, R151, R177, R178,
R184, R185, R186, R187,
R188, R190, R191, R192,
R196, R197, R198, R207,
R208, R212, R213, R215,
R216, R230, R255, R256,
R257, R258, R259, R260,
R261, R262, R263, R264,
R265, R289, R292, R293,
R316, R330, R335, R349

SAMSUNG Electronics Co., Ltd.

6-144

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-000147

Assembly Position

Qtty.

Part Name

Description

R65, R66, R67, R70, R72, R83,

27

Fixed Registers(electron)

R-CHIP;8.2 Kohm, 5%, 1/16 W, TP, 1005

Fixed Registers(electron)

R-CHIP;8.2 Kohm, 5%, 1/16 W, TP, 1005

16

Fixed Registers(electron)

R-CHIP;0 OHM, 5%, 1/16 W, TP, 1005

24

Fixed Registers(electron)

R-CHIP;22 ohm, 5%, 1/16 W, TP, 1005

Fixed Registers(electron)

R-CHIP;47 ohm, 5%, 1/16 W, TP, 1005

Fixed Registers(electron)

R-CHIP;1.5 KOHM, 1%, 1/16 W, DA, TP, 1608

R86, R87, R88, R169, R219,

R220, R222, R224, R226,
R233, R269, R271, R279,
R280, R283, R284, R295, R300
3

2007-000147

R303, R305, R368

2007-000171

R43, R45, R53, R54, R91, R92,

R93, R98, R120, R236, R238,
R296, R297, R319, R320, R391

2007-000173

R11, R42, R44, R46, R55, R58,

R64, R90, R96, R99, R100,
R101, R102, R103, R104,
R153, R206, R306, R308,
R310, R314, R315, R317, R318

2007-000174

R50, R221, R223, R343, R344,

R345

2007-000239

R362, R364, R373, R374,

R375, R376, R377, R378

2007-000501

R149, R168, R171

Fixed Registers(electron)

R-CHIP;2.2 OHM, 1%, 1/10 W, TP, 1608

2007-000879

R164

Fixed Registers(electron)

R-CHIP;4.7 ohm, 1%, 1/16 W, DA, TP, 1608

2007-001292

R8, R10, R33, R34, R35, R39,

22

Fixed Registers(electron)

R-CHIP;33 OHM, 5%, 1/16 W, TP, 1005

R40, R41, R110, R136, R152,

R155, R156, R160, R161,
R165, R166, R173, R189,
R195, R337, R339

SAMSUNG Electronics Co., Ltd.

6-145

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-002451

R37

Fixed Registers(electron)

R-CHIP;4.3 MOHM, 5%, 1/10 W, TP, 1608

2007-002899

R47, R48, R62, R63, R97, R114,

Fixed Registers(electron)

R-CHIP;10 OHM, 1%, 1/16 W, DA, TP, 1608

2007-007107

R162, R167, R181

Fixed Registers(electron)

R-CHIP;100 Kohm, 1%, 1/16 W, TP, 1005

2007-007226

R218, R369

Fixed Registers(electron)

R-CHIP;49.9 ohm, 1%, 1/16 W, DA, TP, 1608

2007-007296

R154

Fixed Registers(electron)

R-CHIP;1.21 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007297

R201, R363, R381, R382, R383

Fixed Registers(electron)

R-CHIP;110 ohm, 1%, 1/16 W, DA, TP, 1608

2007-007306

R81, R82, R95, R105, R106,

17

Fixed Registers(electron)

R-CHIP;100 OHM, 1%, 1/16 W, TP, 1005

69

Fixed Registers(electron)

R-CHIP;1 KOHM, 1%, 1/16 W, TP, 1005

R158

R107, R127, R128, R143, R229,

R232, R235, R237, R239, R242,
R389, R390
3

2007-007318

R22, R24, R36, R49, R51, R52,

R56, R57, R59, R68, R69, R71,
R73, R74, R75, R76, R77, R78,
R79, R80, R84, R85, R89, R129,
R130, R131, R140, R170, R225,
R231, R240, R241, R243, R250,
R251, R252, R253, R254, R267,
R268, R270, R272, R273, R274,
R275, R276, R278, R281, R282,
R285, R286, R287, R288, R290,
R291, R294, R298, R299, R301,
R302, R304, R307, R323, R325,
R327, R328, R329, R332, R334

SAMSUNG Electronics Co., Ltd.

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OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-007443

R358

Fixed Registers(electron)

HIP;3.01 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007444

R27

Fixed Registers(electron)

R-CHIP;5.11 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007454

16

Fixed Registers(electron)

R-CHIP;332 OHM, 1%, 1/16 W, DA, TP, 1608

R115, R116, R117, R118,

R119, R365, R366, R367,
R370, R379, R380, R384,
R385, R386, R387, R388

2007-007482

R159

Fixed Registers(electron)

R-CHIP;1.24 Kohm, 1%, 1/10 W, TP, 1608

2007-007520

R172

Fixed Registers(electron)

R-CHIP;20 OHM, 1%, 1/16 W, DA, TP, 1608

2007-007645

R112, R126, R157, R200,

12

Fixed Registers(electron)

R-CHIP;51.1 OHM, 1%, 1/16 W, DA, TP, 1608

R347, R348, R355, R356,

R357, R392, R393, R394
3

2007-007796

R121

Fixed Registers(electron)

R-CHIP;2.21 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-007798

R228, R234

Fixed Registers(electron)

R-CHIP;10 OHM, 1%, 1/16 W, DA, TP, 1005

2007-008101

R38

Fixed Registers(electron)

R-CHIP;316 Kohm, 1%, 1/10 W, TP, 1608

2007-008116

R227, R244, R245, R246,

Fixed Registers(electron)

R-CHIP;30.1 OHM, 1%, 1/10 W, TP, 1608

Fixed Registers(electron)

R-CHIP;120 ohm, 5%, 1/16 W, TP, 1005

Fixed Registers(electron)

R-NETWORK;4.7 Kohm, 5%, 1/16 W, L, CHIP, 8P, TP

R247, R340
3

2007-001305

R396, R397, R398, R399,

R400, R401

2011-000515

RA4, RA112, RA124,

RA155, RA156

SAMSUNG Electronics Co., Ltd.

6-147

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2011-000585

Assembly Position

Qtty.

RA1, RA2, RA97, RA98, RA99, RA100,

24

Part Name
Fixed Registers(electron)

RA101, RA102, RA103, RA104, RA105,

Description
R-NETWORK;47 ohm, 5%, 63 mW, L, CHIP, 8P,
TP

RA106, RA107, RA108, RA109, RA110,

RA111, RA148, RA149, RA150, RA151,
RA152, RA160, RA161
3

2011-000660

RA3, RA5, RA6, RA7, RA8, RA9, RA11,

16

Fixed Registers(electron)

RA113, RA114, RA116, RA117, RA125,

R-NETWORK;1 Kohm, 5%, 63 mW, L, CHIP, 8P,

TP

RA153, RA154, RA158, RA159

3

2011-000689

RA38, RA39, RA46, RA47, RA52, RA53,

19

Fixed Registers(electron)

R-NET;8.2 KOHM, 5%, 1/16 W, L, CHIP, 8P, TP

47

Fixed Registers(electron)

R-NET;33 ohm, 5%, 1/16 W, L, CHIP, 8P, TP, 2

22

Fixed Registers(electron)

R-NETWORK;10 ohm, 5%, 1/16 W, L, CHIP, 8P,

RA59, RA60, RA65, RA66, RA71, RA72,

RA79, RA80, RA85, RA86, RA91, RA92,
RA157
3

2011-001261

RA10, RA12, RA13, RA14, RA15, RA16,

RA17, RA18, RA19, RA20, RA21, RA22,
RA23, RA24, RA25, RA26, RA27, RA28,
RA29, RA30, RA31, RA32, RA33, RA34,
RA35, RA40, RA41, RA48, RA49, RA54,
RA55, RA56, RA61, RA62, RA67, RA68,
RA73, RA74, RA81, RA82, RA87, RA88,
RA93, RA94, RA95, RA96, RA115

2011-001264

RA36, RA37, RA42, RA43, RA44, RA45,

RA50, RA51, RA57, RA58, RA63, RA64,
RA69, RA70, RA75, RA76, RA77, RA78,
RA83, RA84, RA89, RA90

SAMSUNG Electronics Co., Ltd.

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OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2011-001346

Assembly Position
RA118, RA119, RA120,

Qtty.
28

Part Name

Description

Fixed Registers(electron)

R-NET;68 ohm, 5%, 1/16 W, L, CHIP, 8P, TP, 2

Ceramic Capacitor(electron)

C-CERAMIC, CHIP;0.1 NF, 5%, 50 V, NP0, TP, 1608

40

Ceramic Capacitor(electron)

C-CER, CHIP;0.012 nF, 5%, 50 V, C0G, 1005

RA121, RA122, RA123,

RA126, RA127, RA128,
RA129, RA130, RA131,
RA132, RA133, RA134,
RA135, RA136, RA137,
RA138, RA139, RA140,
RA141, RA142, RA143,
RA144, RA145, RA146,
RA147
3

2203-000236

C259, C275, C287, C316,

2203-000330

C50, C51, C117, C119,

C376, C379, C419, C422

C120, C121, C124, C125,
C132, C133, C155, C198,
C277, C278, C288, C298,
C358, C434, C435, C437,
C455, C459, C461, C463,
C464, C465, C470, C471,
C473, C476, C481, C482,
C485, C486, C487, C489,
C490, C494, C498, C499

SAMSUNG Electronics Co., Ltd.

6-149

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2203-000671

C208

Ceramic Capacitor(electron)

C-CERAMIC, CHIP;27 nF, 10%, 50 V, X7R, TP, 2012

2203-000783

C262, C599, C600

Ceramic Capacitor(electron)

C-CERAMIC, CHIP;0.33 nF, 5%, 50 V, NP0, TP, 1608

2203-000998

C258

Ceramic Capacitor(electron)

C-CERAMIC, CHIP;0.047 NF, 5%, 50 V, NP0, TP, 160

2203-001386

C164, C165

Ceramic Capacitor(electron)

C-CER, CHIP;100 nF, 10%, 100 V, X7R, TP, 3216, 3.

2203-001397

C46, C47, C261, C488

Ceramic Capacitor(electron)

C-CER, CHIP;2.2 NF, 5%, 50 V, NP0, TP, 1608

2203-001607

C601

Ceramic Capacitor(electron)

C-CERAMIC, CHIP;0.22NF, 5%, 50 V, NP0, TP, 1608

2203-001634

C201

Ceramic Capacitor(electron)

C-CER, CHIP;33 NF, 10%, 50 V, X7R, TP, 1608

2203-002720

C363, C380, C453

Ceramic Capacitor(electron)

C-CER, CHIP;10 NF, 10%, 25 V, X7R, 1005

2203-005171

C34, C41, C186, C225,

12

Ceramic Capacitor(electron)

C-CER, CHIP 1000 NF, 10%, 16 V, X7R, 2012

24

Ceramic Capacitor(electron)

C-CERAMIC, CHIP;100 NF, 10%, 50 V, X7R, TP, 1608

Ceramic Capacitor(electron)

C-CER, CHIP;10 NF, 10%, 100 V, X7R, TP, 160

360

Ceramic Capacitor(electron)

C-CER, CHIP;100 NF, 10%, 16 V, X7R, TP, 100

C242, C252, C265, C273,

C484, C532, C571, C580
3

2203-005249

C167, C168, C169, C170,

C171, C172, C173, C174,
C183, C187, C223, C224,
C226, C241, C249, C263,
C264, C271, C274, C283,
C475, C483, C581, C582

2203-006005

2203-006158

C161, C162, C163, C175

C18, C19, C54, C55, C57,
C58, C59, C60, C61, C64,
C65, C66, C67, C68, C69,
C70, C71, C72, C73, C74,
C75, C76, C77, C78, C79,
C80, C81, C82

SAMSUNG Electronics Co., Ltd.

6-150

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2203-006158

Assembly Position

Qtty.

C83, C84, C85, C86, C87, C88, C89,

C90, C91, C92, C93, C94, C96, C97,

Part Name
Ceramic

Description
C-CER, CHIP;100 NF, 10%, 16 V, X7R, TP, 100

Capacitor(electron)

C98, C99, C100, C101, C102, C103,

C104, C105, C106, C107, C110,
C111, C112, C113, C114, C115,
C126, C146, C152, C153, C156,
C157, C159, C160, C166, C176,
C177, C192, C193, C194, C195,
C196, C197, C202, C203, C204,
C205, C206, C207, C209, C210,
C211, C212, C213, C214, C215,
C216, C217, C218, C219, C220,
C221, C222, C227, C228, C229,
C230, C231, C232, C233, C234,
C235, C236, C237, C238, C239,
C240, C243, C244, C245, C246,
C247, C248, C253, C254, C255,
C256, C270, C272, C279, C280,
C281, C282, C284, C286, C290,
C291, C292, C293, C294, C295,
C296, C301, C302, C303, C304,
C305, C306, C307, C308, C309,
C310, C311, C312, C313, C314,
C315, C317, C318, C319, C320,
C321, C322, C323, C324, C325

SAMSUNG Electronics Co., Ltd.

6-151

CHAPTER 6. ! .

(continued)
Level
3

Part Code
2203-006158

Assembly Position

Qtty.

Part Name

C227, C228, C229, C230, C231,

Ceramic, Capacitor(electron)

Description
C-CER, CHIP;100 NF, 10%, 16 V, X7R, TP, 100

C232, C233, C234, C235, C236,

C237, C238, C239, C240, C243,
C244, C245, C246, C247, C248,
C253, C254, C255, C256, C270,
C272, C279, C280, C281, C282,
C284, C286, C290, C291, C292,
C293, C294, C295, C296, C301,
C302, C303, C304, C305, C306,
C307, C308, C309, C310, C311,
C312, C313, C314, C315, C317,
C318, C319, C320, C321, C322,
C323, C324, C325, C394, C395,
C396, C397, C398, C399, C400,
C401, C402, C403, C404, C405,
C406, C407, C408, C409, C410,
C411, C413, C414, C415, C416,
C418, C420, C421, C424, C425,
C426, C427, C430, C431, C432,
C438, C439, C440, C441, C442,
C444, C448, C450, C451, C454,
C456, C462, C467, C468, C469,
C472, C474, C478, C479, C480,
C493, C495, C496, C497, C506,
C507, C508, C509, C510, C511

SAMSUNG Electronics Co., Ltd.

6-152

OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2203-006158

Assembly Position
C512, C513, C514, C515,

Qtty.

Part Name

Description

Ceramic, Capacitor(electron)

C-CER, CHIP;100 NF, 10%, 16 V, X7R, TP, 100

C516, C517, C518, C519,

C520, C521, C522, C523,
C524, C525, C526, C527,
C528, C529, C530, C531,
C533, C534, C535, C536,
C537, C538, C539, C540,
C541, C542, C543, C544,
C545, C546, C547, C548,
C549, C552, C553, C554,
C555, C556, C557, C558,
C559, C560, C561, C562,
C563, C564, C565, C566,
C567, C568, C569, C572,
C573, C575, C576, C577,
C578, C579, C583, C584,
C585, C586, C588, C589,
C590, C591, C592, C593,
C594, C595, C596, C597,
C598
3

2203-006170

C35, C184, C445, C466

Ceramic, Capacitor(electron)

C-CER, CHIP;220 nF, 10%, 16 V, X7R, 1608

2402-000204

C21, C23

Aluminum, Capacitor(electron)

C-AL, SMD;10, UF, 20%, 16 V, WT, TP, 4.3 x 4.3 x 5.4

2402-001224

C6

Aluminum, Capacitor(electron)

C-AL, SMD;10, UF, 20%, 100 V, GP, TP, 8.0 x 10.0 M

2402-001229

C1, C2

Aluminum, Capacitor(electron)

C-AL, SMD;100, UF, 20%, 100 V, GP, TP, 13 x 13

2404-000227

C130, C134, C477, C574

Eletrolytic, Capacitor(electron)

C-TA, CHIP;4.7, UF, 10%, 10 V, TP, 3216

SAMSUNG Electronics Co., Ltd.

6-153

CHAPTER 6. ! .

(continued)
Level

Part Code

2404-001037

Assembly Position
C3, C4, C5, C7, C8, C9, C22, C25,

Qtty.

Part Name

Description

75

Eletrolytic, Capacitor(electron)

C-TA, CHIP;10, UF, 10%, 16 V, TP, 3528

21

Eletrolytic, Capacitor(electron)

C-TA, CHIP;220, UF, 10%, 10 V, GP, TP, 7343

C28, C29, C30, C33, C40, C43,

C44, C48, C49, C56, C62, C63,
C95, C108, C109, C116, C122,
C135, C136, C137, C138, C139,
C140, C141, C142, C145, C147,
C148, C149, C150, C151, C154,
C158, C178, C179, C180, C181,
C182, C185, C188, C189, C190,
C191, C199, C200, C251, C260,
C266, C267, C268, C269, C289,
C297, C299, C300, C433, C436,
C443, C446, C447, C449, C452,
C460, C550, C551, C570, C587
3

2404-001097

C11, C12, C13, C14, C15, C16,

C17, C20, C26, C27, C31, C32,
C36, C37, C38, C39, C45, C52,
C53, C143, C144

2409-001112

C10, C24

Capacitors(electron)

C-ORGANIC, SMD;100, UF, 20%, 16 V, LR, TP, 1

2703-001795

L4

INDUCTOR/COIL(electricity)

INDUCTOR-SMD;15, UH, 20%, 18.54 x 15.24 x 7

2703-002626

L3

INDUCTOR/COIL(electricity)

IHLP5050CERZ100M01

2703-002664

L2

INDUCTOR/COIL(electricity)

INDUCTOR-SMD;0.58, UH, 20%, 12.5 x 12.5 MM

2703-002713

L5

INDUCTOR/COIL(electricity)

INDUCTOR-SMD;0.56, UH, 20%, 10 x 10 mm

2804-001244

Y4

Oscillator(electron)

OSCILLATOR-CLOCK;14.31818 MHz, 50, Ppm

2804-001302

Y2

Oscillator(electron)

OSCILLATOR-CLOCK;66 MHZ, 25, PPM, 10TTL &,

CMO

SAMSUNG Electronics Co., Ltd.

6-154

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2804-001510

Y1

Oscillator(electron)

OSCILLATOR-CLOCK;125 MHz, 50, Ppm, 10TTL

2804-001587

Y3

Oscillator(electron)

OSCILLATOR-CLOCK;100 MHz, 50, Ppm, 10TTL

3301-000373

L16, L17

Magnetic, Parts(electricity)

BEAD-SMD;220OHM, 1608, 200 MA, 307 OHM/346 M

3301-001120

L6, L7, L8, L11, L14

19

Magnetic, Parts(electricity)

CORE-FERRITE BEAD;AB, 30 ohm, 2 x 1.25 x 0.85 mm

L15, L18, L21, L22

L23, L24, L25, L26
L27, L28, L29, L30
L31, L32
3

3301-001208

L9, L10, L12, L13

Magnetic, Parts(electricity)

BEAD-SMD;60 ohm, 1608, 500 mA, TP, 80.2o

3301-001273

L19, L20, L33

Magnetic, Parts(electricity)

CORE-FERRITE BEAD;AB, 600 OHM, 1608, 200 MA, T

3403-001144

S1

Switches(electric field)

SWITCH-PUSH 28 V, 0.4 A, 1P,

3702-001170

J12

Connectors(electric field)

CONNECTOR-RIBBON;50P, FEMALE, ANGLE, A

3703-001252

P1, P2, P3

Connectors(electric field)

CONNECTOR-BACK, PANEL;30P, 5R, FEMALE, ANGLE

3709-001308

J5

Connectors(electric field)

1565712-1

3710-001184

J4 J6 J7

Connectors(electric field)

CONNECTOR-SOCKET;60P, 2R, 0.8MM, SMD-S

3710-002077

J9

Connectors(electric field)

CONNECTOR-SOCKET;20P, 2R, 0.8MM, SMD-A

3711-000820

J3

Connectors(electric field)

CONNECTOR-HEADER;BOX, 2P, 1R, 2.5MM, STRAIGH

3711-001465

J1 J2

Connectors(electric field)

CONNECTOR-HEADER;NOWALL, 3P, 1R, 2.54 mm, STR

3711-002630

J10

Connectors(electric field)

CONNECTOR-HEADER;NOWALL, 10P, 2R, 2.54 MM, ST

3719-001308

J8

Connectors(electric field)

CONNECTOR-ACCESSORY;20P, SFP, C-ALLOY

3722-001399

J11

Connectors(electric field)

JACK-MODULAR;8P/8C, STANDARD, Y, ANGLE, STAN

4309-001015

BAT1

Connectors(electric field)

CELL, PIN, 10 MM, 23.1 x 5.8 x 13.1 MM, BK

SAMSUNG Electronics Co., Ltd.

6-155

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

3704-000249

U34

Connectors(electric field)

SOCKET-IC;32P, PLCC, SN, 1.27 mm

4301-000108

BAT1

POWER

BATTERY-LI;3 V, 220 mAH, BUTTON, 20 x 3.2 m

3710-000001

J1 J2

Connectors(electric field)

CONNECTOR-SHUNT;2P, 1R, STRAIGHT, AUF

1105-001602

J5

Connectors(electric field)

IC-DRAM MODULE;M470L6524BT0, 64M x 64B

GA41-00198A

PCS01

PCB(electricity)

OFFICESERV 7400, FR4, 10L, 1.6T, 130 x 275 MM

6002-000154

Locking, Unit, Part(metal

SCREW-TAPPING;PH, +, 2, M3(P 1.35), L8, ZPC

SUPPLY(electricity)

available)
1

GA62-00001A

U7

HEAT SINK

HEAT SINK-OFFICESERV FAN ASSY;OFFIC

GA72-00241A

Plastics(injection)

PMO-LED, LENS;SME, PMMA, TRP, T1.0, IF-830, UL

GA97-01928A

XX

Plastics(injection)

MEA-GWIM STIFFENER ASSY;OFFICESERV

SAMSUNG Electronics Co., Ltd.

6-156

OfficeServ 7400 Service Manual

6.25

GWIMD Board
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

0404-001004

D1

DIODES(electron)

DIODE-SCHOTTKY;MBRS130L, 30 V, 1000MA, DO-21

1006-001030

U1

INTERFACE IC(electron)

IC-DRIVER/RECEIVER;504, QFP, 80P, TR, CE

2007-000043

R1, R2, R3, R4, R5, R6, R7

Fixed Registers(electron)

R-CHIP;1 KOHM, 1%, 1/16 W, DA, TP, 1608

2011-000689

RA1, RA2

Fixed Registers(electron)

R-NET;8.2 KOHM, 5%, 1/16 W, L, CHIP, 8P, TP

2203-005249

Ceramic,

C-CERAMIC, CHIP;100NF, 10%, 50 V, X7R, TP, 1608

C2, C3, C4, C8, C9, C10,

17

C11, C12, C14, C15

Capacitor(electron)

C16, C17, C18, C19

C20, C21, C22
3

2404-001037

C1, C5, C6, C7, C13,

11

C23, C24, C25, C26,

Eletrolytic,

C-TA, CHIP;10, UF, 10%, 16 V, TP, 3528

Capacitor(electron)

C27, C28
3

3301-000373

L1, L2, L3, L4

Magnetic, Parts(electricity)

BEAD-SMD;220 OHM, 1608, 200 MA, 307 OHM/346 M

3701-001291

J5

Connectors(electric field)

CONNECTOR-DSUB;26P, 3R, FEMALE, ANGLE, AU30U

3710-002077

J2 J4

Connectors(electric field)

CONNECTOR-SOCKET;20P, 2R, 0.8 MM, SMD-A

3711-003581

J6

Connectors(electric field)

CONNECTOR-HEADER;BOX, 60P, 2R, 0.8MM, S

3719-001308

J1, J3

Connectors(electric field)

CONNECTOR-ACCESSORY;20P, SFP, C-ALLOY

GA41-00193A

PCS01

PCB(electricity)

OFFICESERV 7400, FR4, 6L, 1.6T, 82 x 61 MM

SAMSUNG Electronics Co., Ltd.

6-157

CHAPTER 6. ! .

6.26 GWIMS Board

Level

Part Code

Assembly Position

Qtty.

Part Name

Description

0402-001019

D1

DIODES(electron)

DIODE-SCHOTTKY;MBRS340, 40 V, 3000 MA, D

0404-001004

D2

DIODES(electron)

DIODE-SCHOTTKY;MBRS130L, 30 V, 1000 MA, DO-21

0501-000465

Q3, Q4, Q5

Transistors(electron)

TR-SMALL SIGNAL;MMBT3904, NPN, 350 mW, SOT-2

0505-001647

Q1

Transistors(electron)

FET-SILICON;IRF7811W, N, 30 V, 14 A, 9MOH

0505-001778

Q2

Transistors(electron)

FET-SILICON;IRF7822, N, 30 V, 18 A, 6.5MO

1065117

U2

MICRO-PROCESSOR IC

350MHZ, PCI 64BIT, PBGA, 256P, PLASTIC, 1 V, 6 W,

1203-002681

U3

Linear IC(electron)

IC-POSI.FIXED, REG.;LP3962, SOT-223, 5P, P

1203-003114

U1

Linear IC(electron)

IC-DC/DC, CONVERTER;MAX1813EEI, QSOP,

2007-000043

12

Fixed Registers(electron)

R-CHIP;1 KOHM, 1%, 1/16 W, DA, TP, 1608

0TO + 70C

R2, R7, R8, R9, R12, R14,

R19, R32, R34, R37, R38,
R39

2007-000060

R3, R4, R21, R23

Fixed Registers(electron)

R-CHIP;100 KOHM, 1%, 1/16 W, DA, TP, 1608

2007-000063

R20

Fixed Registers(electron)

R-CHIP;150 Kohm, 1%, 1/16 W, DA, TP, 1608

2007-000070

R1, R26, R41

Fixed Registers(electron)

R-CHIP;0 OHM, 5%, 1/16 W, DA, TP, 1608

2007-000287

R16, R25, R36

Fixed Registers(electron)

R-CHIP;100 OHM, 1%, 1/10 W, DA, TP, 1608

2007-000879

R42

Fixed Registers(electron)

R-CHIP;4.7 ohm, 1%, 1/16 W, DA, TP, 1608

2007-002913

R35

Fixed Registers(electron)

R-CHIP;33.2 OHM, 1%, 1/16 W, DA, TP, 1608

2007-002987

R6, R11, R13, R18, R22,

Fixed Registers(electron)

R-CHIP;4.75 KOHM, 1%, 1/16 W, DA, TP, 1608

R40
3

2007-007520

R17

Fixed Registers(electron)

R-CHIP;20 OHM, 1%, 1/16 W, DA, TP, 1608

2007-007620

R27, R28, R29, R30, R31

Fixed Registers(electron)

R-CHIP;47.5 OHM, 1%, 1/16 W, DA, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-158

OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-007645

R15

Fixed Registers(electron)

R-CHIP;51.1OHM, 1%, 1/16 W, DA, TP, 1608

2007-008148

R24

Fixed Registers(electron)

R-CHIP;121 Kohm, 1%, 1/16 W, DA, TP, 1608

2011-000585

20

Fixed Registers(electron)

R-NETWORK;47 ohm, 5%, 63 mW, L, CHIP, 8P, TP

RA1, RA2 RA3, RA4, RA5,

RA6, RA7, RA8, RA9, RA10,
RA11, RA12, RA13, RA14,
RA15, RA16, RA17,
RA18RA19, RA20

2203-000041

C35, C57

Ceramic, Capacitor(electron) C-CERAMIC, CHIP;0.01NF, 0.25PF, 50 V, C0G, TP,

2203-000576

C3

Ceramic, Capacitor(electron) C-CER, CHIP;220nF, 10%, 50 V, X7R, TP, 3216

2203-000998

C17

Ceramic, Capacitor(electron) C-CERAMIC, CHIP;0.047 NF, 5%, 50 V, NP0, TP, 160

2203-001607

C67

Ceramic, Capacitor(electron) C-CERAMIC, CHIP;0.22 NF, 5%, 50 V, NP0, TP, 1608

2203-005171

C16, C56, C66

Ceramic, Capacitor(electron) C-CER, CHIP 1000 NF, 10%, 16 V, X7R, 2012

2203-005249

C8, C9, C11, C13, C14, C18,

46

Ceramic, Capacitor(electron) C-CERAMIC, CHIP;100 NF, 10%, 50 V, X7R, TP, 1608

C19, C21, C22, C24, C25,

C26, C27, C28, C29, C30,
C31, C32, C33, C34, C36,
C37, C38, C39, C41, C42,
C43, C44, C45, C46, C47,
C48, C49, C50, C51, C52,
C53, C54, C55, C58, C59,
C60, C61, C62, C63, C65

SAMSUNG Electronics Co., Ltd.

6-159

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2402-000204

C7

Aluminum, Capacitor(electron)

C-AL, SMD;10, UF, 20%, 16 V, WT, TP, 4.3 x 4.3 x 5.4

2404-001037

C2, C6, C10, C12, C15,

Eletrolytic, Capacitor(electron)

C-TA, CHIP;10, UF, 10%, 16 V, TP, 3528

2404-001097

C1, C5, C64

Eletrolytic, Capacitor(electron)

C-TA, CHIP;220UF, 10%, 10 V, GP, TP, 7343

2703-002330

L1

INDUCTOR/COIL(electricity)

INDUCTOR-SMD;3.3UH, 20%, 13.21 x 9.91 MM

2804-001588

Y1

Oscillator(electron)

OSCILLATOR-CLOCK;50 MHZ, 50, PPM, 10TTL

3301-001208

L3

Magnetic, Parts(electricity)

BEAD-SMD;60 ohm, 1608, 500 mA, TP, 80.2o

3711-003581

J1 J2

Connectors(electric field)

CONNECTOR-HEADER;BOX, 60P, 2R, 0.8 MM, S

GA41-00204A

PCS01

PCB(electricity)

OFFICESERV 7400, FR4, 6L, 1.6T, 39.62 x 99.82 MM

6203-001051

U2

HEAT SINK

HEAT SINK;SJ90810-01, T10, W28, L28, H10, BLK

C20, C23, C40

SAMSUNG Electronics Co., Ltd.

6-160

OfficeServ 7400 Service Manual

6.27 MODEM Board

No

Part Code

Assembly Position

Qtty.

Part Name

Description

IC

74HCT04, SMD

U1

IC

74HCT125, SMD

U5

IC

74HCT541, SMD

IC, EEPROM

AT24C02N-10SC,

U10

IC, SRAM

KM681002CJ-15

U9

IC, FLASH MEMORY

AM29F002NBB-90JC, F

U8

IC, MCU

L2800-38

U7

IC, MDP

R6764-63

U3

IC, DUAL OPAMP

MC1458CD

10

U2

IC, A-LAW, PCM, CODEC

TP3057WM

11

U11

IC, SINGLE 2-INPUT, POSITVE AND GATE

74AHCT1G08

12

U9

IC-SOCKET, 32PIN, PLCC

13

Y1

CRYSTAL

28.2240 MHz, +/- 30, Ppm,

14

C16, C17

CAP

CE, 30, PF, 20%, 50 V, SMD

15

C2

CAP

CE, 330, PF, 20%, 50 V, SMD

16

BC1~BC16, C3, C5, C7, C9,

25

CAP

CE, 0.1, UF, 20%, 50 V, SMD

17

C1

CAP

CE, 1, UF, 20%, 50 V, SMD

18

C4, C6, C8, C10, C12, C14,

CAP

TT, 10, UF, 20%, 10 V, SMD

C11, C13, C15, C20, C21

C18, C19, C22

SAMSUNG Electronics Co., Ltd.

6-161

CHAPTER 6. ! .

(continued)
No

Part Code

19

Assembly Position
R7, R11, R13~20, R25, R25,

Qtty.

Part Name

Description

15

R-CHIP

0 ohm, 1/10 W 1%, SMD

R27, R33
20

R23

R-CHIP

10 ohm, 1/10 W 1%, SMD

21

R22, R26

R-CHIP

100 ohm, 1/10 W 1%, SMD

22

R1

R-CHIP

3.3 Kohm, 1/10 W 1%, SMD

23

11

R-CHIP

10 Kohm, 1/10 W 1%, SMD

R4, R6, R9, R28, R29, R31,

R37~39, R41, R45, R50

24

R10

R-CHIP

20 Kohm, 1/10 W 1%, SMD

25

R2, R3, R5, R8

R-CHIP

44.2 Kohm, 1/10 W 1%, SMD

26

L1., L2

INDUCTOR

10, UH, 10%

27

L4

EMI FILTER

BLM31A700S

28

SWITCH

TACT SWITCH, 2PIN

29

P1, P2

CONNECTOR

STRAIGHT HEADER MALE 17AS-2.54D;17P, 1R, 2.54 MM

30

PCB

MODEM

SAMSUNG Electronics Co., Ltd.

6-162

OfficeServ 7400 Service Manual

6.28 MIS Board

Level
2

Part Code
GA92-02785A

Assembly Position
-

Qtty.
1

Part Name

Description

PBA MAIN-MISCELLA

OFFICESERV 7200, DOM/EXP, WORLD, MISCELLANEOUS,

NEOUS

FR-4, 4, L, 111.8*50.9*1.6T, MIS

0401-001099

D5-D7

DIODE-SWITCHING

1N4148WS, 75 V, 150 MA, SOD-323, TP

0402-001216

D1-D4

DIODE-RECTIFIER

MURS120, 200 V, 1A, TO-220F, TP

0501-000477

Q1-Q3

TR-SMALL SIGNAL

MMBT5550, NPN, 300 MW, SOT-23, TP, 20-250

1201-000236

U13

IC-OP AMP

TL084, SOP, TP, 14, P, 150 MIL, QUAD, 200V/MV, PLASTIC, 18 V,

680 MW, 0TO+70C, 86DB, 13 V/US, 5PA, 2

1205-000120

U14, U15

IC-CODEC

TP3054WMX, SOP, 16, P, 300 MIL, PLASTIC, 5.25 V, 60 MW,

-25TO+125C, TP

1205-000394

U1, U2

IC-CODEC FILTER

TP3057WM, SOP, 16, P, PLASTIC, 5.2

1301-001499

U4

IC-CPLD

4A5, TQFP, 44, P, 10 x 10 mm, 10 nS, 5, 5 %

2007-000043

R58

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

2007-000052

R17-R42, R64

27

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

2007-000060

R3, R4

R-CHIP

100 Kohm, 1%, 1/10 W, TP, 1608

2007-000287

R51-R54

R-CHIP

100 OHM, 1%, 1/10 W, DA, TP, 1608

2007-000669

R43-R45

R-CHIP

2 Kohm, 1%, 1/10 W, TP, 1608

2007-002906

R5, R6

R-CHIP

200 Kohm, 1%, 1/10 W, TP, 1608

2007-002918

R1, R2

R-CHIP

51.1 Kohm, 1%, 1/10 W, TP, 1608

2007-002991

R46-R49

R-CHIP

61.9 Kohm, 1%, 1/10 W, TP, 1608

SAMSUNG Electronics Co., Ltd.

6-163

CHAPTER 6. ! .

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2007-007237

R50, R61

R-CHIP

24.3 Kohm, 1%, 1/10 W, TP, 1608

2007-007274

R59, R60

R-CHIP

27.4 Kohm, 1%, 1/10 W, TP, 1608

2007-008102

R62, R63

R-CHIP

357 ohm, 1%, 1/10 W, TP, 1608

2007-008223

R11-R16

R-CHIP

39.2 Kohm, 1%, 1/10 W, TP, 1608

2007-008225

R7, R8

R-CHIP

226 Kohm, 1%, 1/10 W, TP, 1608

2203-003027

C25, C26

C-CER, CHIP

0.82 nF, 5%, 50 V, NP0, TP, 1608

2203-005249

C10-C24

15

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2402-000130

C1-C6

C-AL, SMD

2.2, UF, 20%, 50 V, GP, TP, 4.3 x 4.3 x 5.

2404-001037

C7-C9

C-TA, CHIP

10, UF, 10%, 16 V, TP, 3528

3301-001308

B1-B18

18

BEAD-SMD

10 ohm, 1608, 500 mA, TP, 0.15 ohm

3501-001139

K1-K3

RELAY-MINIATURE

4.5 VDC, 140 MW, 1000 MA, 2FORMC, 4 MS, 4 MS

3711-004744

P1, P2

CONNECTOR-

BOX, 40, P, 2R, 0.8 MM, SMD-S, AU30U, NTR

HEADER
3

EC26-20501A

T1-T4

TRANS AF

INFOREX, 800 mH

GA41-00143A

PCB-MISC

OFFICESERV 7200, FR-4, 4, L, 00, 1.6T, 120 x 45 MM

SAMSUNG Electronics Co., Ltd.

6-164

OfficeServ 7400 Service Manual

6.29 CRM Board

Level

Part Code

GA92-02929A

Assembly Position
-

Qtty.
1

Part Name
PBA SUB-CRM

Description
OFFICESERV 7400, octavo volume, COMMON RESOURCE MODU, 1
69 x 194

0202-000108

0.001

SOLDER-CREAM

RMA-20-21L, 20~38 m, 62.8SN/36.8PB/0.4 AG, 10%

0202-001091

0.001

SOLDER-BAR

HI-FLO, 20 X 356 X 11, 63SN/37PB

0904-001310

IC-DSP

TMS320LC549, 16BIT, TQFP, 144P, 20 x 20 MM, 80 MHZ, TR, CMOS,

1203-001631

U3

IC-POSI.FIXED REG. 2940, TO-263, 3P, PLASTIC, 3.3 V,

1301-001663

U2

IC-CPLD

U4, U5

PLASTIC, 3.3V, -40TO+100C, 32 KX

LC4128V-75T128C, TQFP, 128P, 14 x 14 MM, 7.5NS, 3.3 V, 10%, 0TO+90C,

92, 92, 4, 333 MHZ, 3.47

2007-000043

2007-000052

R58 R122
R1 R34 R35 R36 R37

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

57

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R38 R39 R40 R42 R43

R45 R49 R50 R51 R52
R53 R56 R65 R67 R68
R71 R73 R75 R76 R78
R80 R83 R85 R89 R90
R91 R92 R93 R94 R96
R99 R100 R102 R104
R105 R108 R109 R111
R112 R116 R117 R118
R123 R124 R125 R126
R128 R129 R132 R134
R135 R138

SAMSUNG Electronics Co., Ltd.

6-165

CHAPTER 6. ! .

(continued)
Level
2

Part Code
2007-007226

Assembly Position
R18 R19 R20 R21

Qtty.

Part Name

Description

46

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 1608

32

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 1608

C-CER, CHIP

0.047 nF, 5%, 50 V, C0G, 1608

R22 R23 R24 R25

R26 R27 R28 R29
R30 R31 R32 R33
R46 R48 R54 R55
R57 R59 R61 R62
R64 R66 R69 R72
R77 R79 R81
R84 R95 R97 R101
R103 R107 R110
R114 R115 R119
R120 R121 R133
R136 R137
2

2007-007507

R2 R3 R4 R5 R6 R7
R8 R9 R10 R11 R12
R13 R14 R15 R16
R17 R41 R44 R47
R60 R63 R70 R82
R86 R87 R88 R98
R106 R113 R127
R130 R131

2203-000998

SAMSUNG Electronics Co., Ltd.

C24, C30, C39

6-166

OfficeServ 7400 Service Manual

(continued)
Level
2

Part Code
2203-005249

Assembly Position
C1, C2, C3, C4, C5,

Qtty.
33

Part Name

Description

C-CER, CHIP

100 nF, 10%, 50 V, X7R, 1608

C6, C7, C8, C9, C10,

C11, C12, C13, C14,
C15, C16, C17, C18,
C19, C20, C21, C22,
C23, C25, C26, C27,
C28, C29, C32, C34,
C35, C36, C37
2

2404-001037

C31, C33, C38

C-TA, CHIP

10, UF, 10%, 16 V, TP, 3528

2804-001496

Y1

OSCILLATOR-CLOCK

16.384 MHz, 50, Ppm, 10TTL, 15, PF, TP, 3.3 V, 40 mA

3301-001120

L1, L6, L8

BEAD-SMD

30 OHM, 2012, 3000, TP, 0.015

3301-001308

L2, L3, L4, L5, L7

BEAD-SMD

10 OHM, 1608, 500, TP, 0.15

3407-001067

S1

SWITCH-SMD

6 V, 100 MA, SLIDE

3711-004744

P1, P2

HEADER-BOARD TO

BOX, 40P, 2R, 0.8 MM, SMD-S, AU30U, NTR

GA13-10064A

U1

IC ASIC

DCS, STL7065C, QFP, 160P

GA41-00184A

PCB-CRM

OFFICESERV 7400, FR4, 4L, 1.6T, 169 x 19 MM

GA68-00289A

LABEL(P)-BAR, CODE

KEY, PHONE, POLYESTER, T0.05, W6.5, L37.5, WHT, WHT

BOARD

SAMSUNG Electronics Co., Ltd.

6-167

CHAPTER 6. ! .

6.30 RCM2 Board

Level

Part Code

Assembly Position

Qtty.

Part Name

Description

GA92-02819A

PBA MAIN-RCM2

IDCS 500, KOR, RCM2, K/P KSU

0202-000108

SOLDER-CREAM

RMA-20-21L, 20~38 , 62.8SN/36.8PB/0.4AG, 10%

0202-001091

SOLDER-BAR

HI-FLO, 20 x 356 x 11, 63SN/37PB

0801-002379

U2, U6

IC-CMOS, LOGIC

74LCX16245, TRANSCEIVER, TSSOP, 48, 240MIL, DUAL, TP,

2.0/3.6 V

0802-001084

U4

IC-BICMOS, LOGIC

0904-001310

U1, U7

IC-DSP

74ABT125, BUFFER, TSSOP, 14, 173MIL, QUAD, TP, 4.5/5.5 V

TMS320LC549, 16BIT, TQFP, 144P, 20 x 20 MM, 80 MHZ, TR,
CMOS, PLASTIC, 3.3 V, 40TO+100C, 32KX

1203-001631

U8

IC-POSI.FIXED

2940, TO-263, 3P, PLASTIC, 3.3 V,

REG.
2

1301-001499

U5

IC-CPLD

4A5, TQFP, 44P, 10 x 10 mm, 10nS, 5, 5%

2007-000043

R29-R31, R49, R53, R65

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

2007-000043

R66, R74, R78

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

2007-000052

R1-R14, R23-R28, R38-

31

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R48
2

2007-000052

R50, R51, R52, R54-R63

13

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

2007-000052

R70-R73, R76, R79-R81

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

2007-000287

R64, R67, R68, R69, R75

R-CHIP

100 OHM, 1%, 1/10 W, TP, 1608

2007-008122

R77

R-CHIP

22.1 OHM, 1%, 1/10 W, TP, 1608

2203-005249

C1-C24, C27, C28

C-CER, CHIP

100 nF, 10%, 50 V, X7R, 1608

2404-001037

C25, C26, C29

C-TA, CHIP

10, UF, 10%, 16 V, TP, 3528

SAMSUNG Electronics Co., Ltd.

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3

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OfficeServ 7400 Service Manual

(continued)
Level

Part Code

Assembly Position

Qtty.

Part Name

Description

2804-001496

Y1

OSCILLATOR-CLOCK

16.384 MHz, 50, Ppm, 10TTL, 15, PF, TP, 3.3 V, 40 mA

3301-001120

L3, L4, L6

BEAD-SMD

30 OHM, 2012, 3000, TP, 0.015

3301-001308

L1, L2, L5

BEAD-SMD

10 OHM, 1608, 500, TP, 0.15

3408-000230

S1

SWITCH-SLIDE

30 V DC, 200 mA, DPDT, ANGLE SHAPE

3711-004744

J1, J3

HEADER-BOARD TO

BOX, 40P, 2R, 0.8 MM, SMD-S, AU30U, NTR

BOARD
2

GA41-00150A

REV.01

PCB-RCM2

IDCS500, FR4, 4L, 1.6T, 169 X 194.1 MM

GA68-00289A

LABEL(P)-BAR, CODE

KEY, PHONE, POLYESTER, T0.05, W6.5, L37.5, WHT, WHT

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CHAPTER 6. ! .

6.31 MGI2DB Board

Level

Part Code

Assembly Position

Qtty.

Part Name

Description

KP-OSDBMG2

GA92-02782A

PBA MAIN-VOIP,

OFFICESERV 7400, DOM/EXP, WORLD, VOIP, D B'D,

D BD, CLIENT

CLIENT, FR-4, 4, L, 48204 4CH, 75 x 54.5 x 1.6 T, MG

1106-001469

U2

IC-SRAM

GA71116ATP-8, 64K x 16 BIT, TSOP, 44, P, 400 MIL, 8NS,

3.3 V, 10%, 0TO+70C, 20 MA, TP

1204-002202

U1

2007-000043

R22, R32

2007-000070

R7-R10, R21,

IC-VOICE,

AC48204E6-C, TQFP, 144P, 20 x 20 MM, PLASTIC, 3.6 V,

PROCESSOR

200 MW, 0TO+70C, TR, VOP, PROCESSOR

R-CHIP

1 Kohm, 1%, 1/10 W, TP, 1608

13

R-CHIP

0 ohm, 5%, 1/10 W, TP, 1608

R-CHIP

75 ohm, 1%, 1/10 W, TP, 1608

R35-R42
3

2007-001164

R33, R34

2007-002987

R1-R5, R24-R29

11

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 1608

2203-005249

C3-C17

15

C-CER, CHIP

100 nF, 10%, 50 V, X7R, TP, 1608

2402-001140

C1, C2

C-AL, SMD

4.7UF, 50V, GP, TP, 4.3 x 4.3 x 5.3 MM

3711-004744

J1, J2

CONNECTOR-HEADER BOX, 40, P, 2 R, 0.8 MM, SMD-S, AU30U, NTR

GA41-00145A

PCB-MGI2D

SAMSUNG Electronics Co., Ltd.

OFFICESERV 7400, FR-4, 4, L, 00, 1.6 T, 120 x 240 MM

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OfficeServ 7400 Service Manual

6.32 MBD40 Board

Level

Part Code

Assembly Position

Qtty.

Part Name

Description

1405-000171

V1

VARISTOR

82 V, 1200A, 9 x 6 mm, TP

3703-000236

P502

CONNECTOR-BACK, PANEL

10P, 2R, FE

3703-001454

P500-P501

CONNECTOR-BACK, PANEL

110P, 5R, M

3703-001526

P1-P39

39

CONNECTOR-BACK, PANEL

30P, 5R, MA

3711-001528

P504-P505

HEADER-BOARD TO, CABLE

NOWALL, 4P

3711-003272

P40

HEADER-BOARD TO, CABLE

BOX, 10P

3711-004515

P503

CONNECTOR-HEADER

BOX, 4P, 1R, 7.4

0402-001476

D1-D3

DIODE-RECTIFIER

ES3B, 100V, 3A, D

0501-000477

Q2

TR-SMALL SIGNAL

MMBT5550, NPN, 3

0505-001477

Q1

FET-SILICON

SFR9220, P, 200 V, 3.1

0604-001002

PC1

PHOTO-COUPLER

TR, 100-600%, 200 m

0801-002127

U2, U4-U12

IC-CMOS, LOGIC

74FCT16245, TRANS

1203-001643

U3

IC-RESET

DS1706, SOIC, 8P, 150MIL

1301-001647

U1

IC-CPLD

LC4256 V-75F256BC, FPBGA

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CHAPTER 6. ! .

(continued)
Level
3

Part Code
2007-000052

Assembly Position
R2-R3, R6, R10, R14, R16, R20, R22, R28-

Qtty.

Part Name

Description

137

R-CHIP

10 Kohm, 1%, 1/10 W, TP, 1608

R-CHIP

4.75 Kohm, 1%, 1/10 W, TP, 16

202

R-CHIP

49.9 ohm, 1%, 1/10 W, TP, 160

R29, R31, R35, R37-R38, R41, R43-R44, R46R47, R49, R52, R55, R59-R60, R62-R63, R65,
R68, R70-R71, R70-R71, R74, R76-R77, R79,
R81, R84, R86-R91, R93, R95, R97-R98,
R100, R103, R105-R106, R108, R111-R121,
R124, R129, R131-R136, R145-R156, R177,
R200-R201, R207-R208, R211-R213, R215R218, R200-R202, R229, R237, R245, R255,
R264, R277, R279, R281, R284-R285, R287,
R345-R349, R350-R373
3

2007-002987

2007-007226

R304-R306
R1, R4-R5, R7-R9, R10-R13, R15, R17-R18,
R21, R23-R24, R26, R32-R34, R36, R39, R40,
R42, R45, R48, R50-R51, R53-R54, R56-R58,
R61, R64, R66, R69, R72-R72, R75, R78, R80
R83-R83, R85, R92, R94, R96, R99, R101R102, R104, R107, R109-R110, R123, R125R126, R128, R130, R137-R144, R163-R172,
R178-R179, R190-R199, R209-R210, R214,
R219, R223-R228, R230-R236, R238-R244,
R246-R254, R256-R263, R265-R271, R273R276, R278, R280, R282-R283, R286, R288R303, R307-R344

SAMSUNG Electronics Co., Ltd.

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OfficeServ 7400 Service Manual

(continued)
Level
3

Part Code
2007-007507

Assembly Position

Qtty.

R25, R27, R30, R122, R127,

27

Part Name

Description

R-CHIP

2.74 Kohm, 1%, 1/10 W, TP, 16

R157-R162, R180-R189,
R202-R206, R272
3

2203-000236

C32-C35, C42, C53

C-CER, CHIP

0.1 nF, 5%, 50 V, C0G, 16

2203-000626

C70

C-CER, CHIP

0.022 nF, 5%, 50 V, C0G,

2203-005249

62

C-CER, CHIP

100 nF, 10%, 50 V, X7R, 1

C1-C9, C11-C31, C36-C41,

C43-C52, C54-69

2203-005565

C10

C-CER, CHIP

1 nF, 5%, 50 V, NP0, TP, 1

2804-001496

Y1

OSCILLATOR-CLOCK

16.384 MHz, 50p

3301-001308

L1-L5

BEAD-SMD

10 OHM, 1608, 500, TP

GA41-00180A

PCS01

PCB-MBD40

OFFICESERV 7400, FR4,

SAMSUNG Electronics Co., Ltd.

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CHAPTER 6. ! .

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OfficeServ 7400 Service Manual

CHAPTER 7. System Parts Diagram

This chapter provides the parts diagram of the OfficeServ 7400 system.

9
7

Figure 7.1 Exploded Parts Diagram of OfficeServ 7400

SAMSUNG Electronics Co., Ltd.

7-1

CHAPTER 7. ! .

Table 7.1 Parts List

No.
1

Part Name
LP40 STIFFNER

Part Code

Qtty.

No.

Part Name

Part Code

Qtty.

GA97-01931A

RINGER BRKT

GA70-00082A

ASSY
2

OS7400 RACK ASSY

GA97-01925A

PoE, CABLE

GA39-00042A

OS7400 MBD40

GA92-02925C

AC/DC, UNIT

FAN ASSY

GA96-00822A

RINGER ASSY

REAR, PANEL

GA70-00081A

10

M3 SCREW

6003-000267

(Front Side)

16

(Rear side)

Figure 7.2 Front/Rear side of Power Supply Module

7-2

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

ABBREVIATION

A
AAA

Authentication, Authorization and Accounting

AC

Alternating Current

ALG

Application Level Gateway

AMI

Alternate Mark Inversion

AOM

Add On Module

AP

Access Point

ASIC

Application Specific Integrated Chip

BRI

Basic Rate Interface

B8ZS

Bipolar 8-Zero Substitution

B
C
CA

Call Agent

CAS

Channel Associated Signaling

CCS

Common Channel Signaling

CID

Caller Identification

COM

Communication

CRM

Common Resource Module

CSU

Communication Service Unit

CTI

Computer Telephony Integration

DASL

Digital Adaptor for Subscriber Loop

D
DC

Direct Current

DECT

Digital Enhanced Cordless Telecommunications

DGP

Digital Phone

DHCP

Dynamic Host Configuration Protocol

DPLL

Digital Phase Locked Loop

DLI

Digital Line Interface

DSU

Data Service Unit

DSSS

Direct Sequence Spread Spectrum

DTMF

Dual Tone Multi Frequency

SAMSUNG Electronics Co., Ltd.

! .

E
EMI

Electro-Magnetic Interference

F
FXO

Foreign Exchange Office

FXS

Foreign Exchange Station

GARP

Generic Attribute Registration Protocol

GK

Gatekeeper

GVRP

GARP VLAN Registration Protocol

HDB3

High Density Bipolar of order 3

HDLC

High level Data Link Control

H
HLR

Home Location Register

HOS

Hook Off Sensing

HTML

Hypertext Markup Language

HTTP

Hypertext Transfer Protocol

ID

Identification

I
IDS

Intrusion Detection System

IGMP

Internet Group Management Protocol

IMAP

Internet Messaging Access Protocol

IN-SCP

Intelligent Network Service Control Point

IP

Internet Protocol

IPC

Inter Processor Communication

IPDC

Internet Protocol Device Control

IP-SCP

Internet Protocol Service Control Point

ISDN

Integrated Services Digital Network

ISUP

ISDN User Part

ITP

IP Telephone

ITU

International Telecommunication Union

JDBC

Java Database Connectivity

KDB

Keyset Daughter Board

J
K

II

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

L
LAN

Local Area Network

LCD

Liquid Crystal Display

LCP

Local Control Processor

LED

Light Emitting Diode

LIM

LAN Interface Module

MCP

Main Control Processor

MEGACO

Media Gateway Control

M
MG

Media Gateway

MGC

Media Gateway Controller

MGI

Media Gateway Interface

MGCP

Media Gateway Control Protocol

MMC

Man Machine Communication

MMU

Memory Management Unit

MPD

Metering Pulse Detection

MOH

Music On Hold

MUA

Mail User Agent

MTA

Mail Transfer Agent

NAT

Network Address Translation

OSPF

Open Shortest Path First

PAT

Port Address Translation

PBA

Printed circuit Board Assembly

N
O
P
PCM

Pulse Code Modulation

PCMMC

PC based Man Machine Communication

PLD

Programmable Logic Device

PLIM

Physical Layer Interface Module

PLL

Phase Locking Loop

POP3

Post Office Protocol version 3

PPP

Point to Point Protocol

PPPoE

Point to Point Protocol over Ethernet

PRI

Primary Rate Interface

PSTN

Public Switched Telephone Network

PSU

Power Supply Unit

SAMSUNG Electronics Co., Ltd.

III

! .

Q
QFP

Quad Flat Pack

Q-SIG

Q-Signaling

QoS

Quality of Service

R
RCM

R2 CID Module

RIP

Routing Information Protocol

RTCP

Real-time Transmission Control Protocol

RTP

Real-time Transmission Protocol

S
SCP

Signal Control Processor

SDP

Session Description Protocol

SG

Signaling Gateway

SGCP

Simple Gateway Control Protocol

SIGTRAN

Signaling Transport

SIP

Session Initiation Protocol

SLI

Single Line Interface

SLT

Single Line Telephone

SMTP

Simple Mail Transfer Protocol

SoL

Server optimized Linux

STA

Spanning Tree Algorithm

STP

Signaling Transfer Point

T
TCAP

Transmission Control Application Part

TCP

Transmission Control Protocol

TEPRI

T1E1PRI

TRK

Trunk

IV

UA

User Agent

UAC

User Agent Client

UART

Universal Asynchronous Receiver and Transmitter

UAS

User Agent Server

UCD

Uniform Call Distribution

UDP

User Datagram Protocol

USB

Universal Serial Bus

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400 Service Manual

V
VAD

Voice Activation Detect

VDSL

Very high-Data rate digital Subscriber Line

VLAN

Virtual LAN

VoIP

Voice over Internet Protocol

VPN

Virtual Private Network

WAN

Wide Area Network

WIM

WAN Interface Module

WLI

Wireless LAN Interface

xDSL

x-Digital Subscriber Line

SAMSUNG Electronics Co., Ltd.

! .

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VI

SAMSUNG Electronics Co., Ltd.

OfficeServ 7400

Service Manual
2005 Samsung Electronics Co., Ltd.
All rights reserved.
Information in this manual is proprietary to SAMSUNG
Electronics Co., Ltd.
No information contained here may be copied, translated,
transcribed or duplicated by any form without the prior written
consent of SAMSUNG.
Information in this manual is subject to change without notice.