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Integrated Circuit

This document discusses integrated circuits (ICs) in four main sections: 1. It describes different types of ICs classified by application (analog, digital, mixed), number of components (SSI, MSI, LSI, VLSI, ULSI), and manufacturing technique (monolithic, thin/thick film, hybrid). 2. It discusses the semiconductor materials used in ICs and how their electrical properties can change with temperature, light, or magnetic fields. 3. It provides a brief overview of general IC functions like setting input/output voltages and governing the work of other blocks. 4. It gives an example application of a monostable multivibrator circuit and how it can

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135 views5 pages

Integrated Circuit

This document discusses integrated circuits (ICs) in four main sections: 1. It describes different types of ICs classified by application (analog, digital, mixed), number of components (SSI, MSI, LSI, VLSI, ULSI), and manufacturing technique (monolithic, thin/thick film, hybrid). 2. It discusses the semiconductor materials used in ICs and how their electrical properties can change with temperature, light, or magnetic fields. 3. It provides a brief overview of general IC functions like setting input/output voltages and governing the work of other blocks. 4. It gives an example application of a monostable multivibrator circuit and how it can

Uploaded by

urwah dz
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Name : Urwah /EK3C /21

Integrated Circuit
A. Describing Symbols and Types
1. IC grouping based on the application
a. Analog IC
 Operates on continuous wave signals
 Example: Power amplifier IC, Signal amplifier IC, Voltage Regulator IC,
Multiplier IC and Op-Amp IC.

b. Digital IC
 Operates on digital signals ('1' and '0')
 Example: Microprocessor IC, Flip-flip IC, Counter IC, Memory IC,
Multiplexer IC and Microcontroller IC.

c. Mixed IC
 Combines the functions of Analog ICs and Digital ICs into one IC
packaging.
 Generally used as an IC that converts Digital signals to Analog (D / A
Converter) or Analog signals to Digital signals (A / D Converter).
 Along with the development of IC technology, this type of IC mix allows
it to integrate Digital Signals with RF functions into one IC package.

2. IC grouping based on the Number of Components


Below is a grouping of IC types based on the number of components, especially
on the number of Transistor Components contained in an IC package.
a. Small-scale integration (SSI)
 IC on a small scale
 Only consists of a few transistors in it.

b. Medium-scale integration (MSI)


 Consisting of hundreds of transistors
 Developed in the 1960s
 More economical when compared to IC Small-scale integration (SSI).

c. Large-scale integration (LSI)


 Consists of thousands of transistors
 Developed first for calculators in the 1970s to have less than 4000
transistors.

d. Very large-scale integration (VLSI)


 Consisting of tens of thousands to hundreds of thousands of transistors
 Developed starting in the 1980s.

e. Ultra large-scale integration (ULSI)


 Consisting of more than 1 million transistors

3. IC grouping based on Manufacturing Technique


a. Monolithic IC
 Integrate Passive Components and Active Components on one single chip
 Silicon as a semiconductor material.
 Has high reliability with low production costs. - Many found in television
sets, amplifiers, voltage regulators and AM / FM receivers.

b. Thin and Thick Film IC


• Relatively larger than Monolithic IC.
• This is because only passive components (resistors and capacitors) can be
integrated in the IC wafer while active components such as transistors and
diodes cannot be integrated and must be connected separately that form a
separate circuit in the IC packaging.
• Using evaporation techniques (cathode-sputtering technique)
• While Thick Film IC uses screen printing techniques.

c. Hybrid IC or Multi-chip IC
• Made of a number of chips connected to one integrated circuit.
• Used in high power amplifier circuits from 5W to more than 50W.
• Better than Monolithic IC.

4. IC Classification based on Package (Package)


• SIP (Single In-line Packages)
• DIP (Dual In-line Packages)
• SOP (Small Outline Packages)
• QFP (Quad Flat Packages)
• BGA (Ball Grid Arrays)

5. IC grouping based on its general function


• Logic Gates IC, which is an IC that functions as a Logic Gate.
• IC Comparator, which is IC that functions as a Comparator (Comparator)
• IC Timer, the IC that functions as a timer (timer)
• IC Switching, namely IC that functions as a Switch (switch)
• Audio Amplifier IC, which is an IC that functions as an audio amplifier.

B. Describing IC Material
Semiconductor material is a material that is half conductor because the energy gap
formed by the structure of this material is smaller than the energy gap of an insulating
material but is greater than the energy gap of a conductor material, thus allowing
electrons to move from one constituent atom to another constituent atom with certain
treatment of the material these (giving voltage, changing temperature and so on).

Therefore semiconductors can be semi-conducting. Semiconductor material can


change its electrical properties if the temperature changes. In its pure state it has the
properties of insulation, while at room temperature (27 ° C) it can change its nature
into a conductor. Electrical properties of conductors and insulators are not easily
changed by the influence of temperature, light or magnetic fields, but in
semiconductors these characteristics are very sensitive.

C. Describing Function
The IC function itself varies according to the IC code or type. But, IC functions in
general, namely:
1. Set the input voltage and output.
2. As the heart of a series. Because IC is what governs the work of each block
series by dividing the task of each particular series of blocks.
3. And others.

D. Describing Applcation

Monostable Multivibrator circuit

Monostable has the meaning of one or mono and stable which is the initial standby
condition at low and high conditions for a certain time interval after being triggered.

This circuit can be used as a time delay, detection of lost wave pulses, bouncefree
switch / pressing switch once and latch, touch switch, pulse wide moulation (PWM),
frequency divider, and meter capacitance.

The way this circuit works is by utilizing the capacitor charging and discharging as a
delay timer.

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