PCB DESIGN

&
SPICE LAB
COURSE TITLE : PCB DESIGN AND SPICE LAB
COURSE CODE : 5047
COURSE CATEGORY :A
PERIODS/WEEK :5
PERIODS/SEMESTER : 65/5
CREDITS :3

Prepared by

REMYA GOPALAKRISHNAN

SANIL KUMAR.C

BIJUKUMAR.S
TIME SCHEDULE:

TOPICS SUB TOPICS PERIODS

PCB DESIGN RULES 3
PCB FABRICATION 3
SOLDERING AND DESOLDERING 3
PCB PREPARATION SOLDERING AND DESOLDERING OF 3
SMD
EXPERIMENTS
15
PCB LAYOUT DESIGN EXPERIMENTS 10
USING SOFTWARE
TUTORIAL 3
SPICE
EXPERIMENTS 25
TOTAL: 65

COURSE GENERAL OUTCOME:

TOPICS GO ON COMPLETION OF THE STUDY OF

THIS COURSE THE STUDENTS WILL BE
ABLE:

1 TO UNDERSTAND PCB DESIGN RULES

2 TO UNDERSTAND PCB LAYOUT
PCB PREPARATION
3 TO UNDERSTAND PCB FABRICATION
PCB LAYOUT DESIGN 4 TO UNDERSTAND PCB LAYOUT DESIGN
USING SOFTWARE USING SOFTWARE.
5 TO KNOW ABOUT GERBER FILE GIVEN TO
A PCB PLANT
6 TO UNDERSTAND ABOUT CIRCUIT
SIMULATION SOFTWARE.
SPICE
7 TO UNDERSTAND CIRCUIT SIMULATION
USING SIMULATION SOFTWARE.

GO - General Outcome
 PCB DESIGN

I. PCB DESIGN RULES

II. PCB FABRICATION
III. SOLDERING AND DESOLDERING
IV. SOLDERING AND DESOLDERING OF SMD
V. PCB FABRICATION OF BRIDGE RECTIFIER
VI. PCB FABRICATION OF ASTABLE MULTIVIBRATOR
VII. PCB FABRICATION OF RC COUPLED AMPLIFIER
VIII. PCB FABRICATION OF TIMER USING 555
IX. PCB FABRICATION OF HALF ADDER
X. PCB LAYOUT DESIGN USING SOFTWARE
Experiment No. 1

PCB DESIGN & LAY-OUT PREPARATION

AIM:

To study about PCB (Printed Circuit Board) Design and Lay-Out Preparation
steps.

OBJECTIVES:

To familiarize PCB Design of Electronics circuits.

TOOLS/MATERIALS:

Graph sheet, tracing sheet, components etc.

THEORY:

Printed circuit board wiring was developed as an interconnection method suitable

for mass production. This scheme reduces the size and weight of the equipment and also
helped to reduce the wiring errors. Another important advantage of this system is to have
close control over various parameters of the products. Printed circuit board is an electronic
board that connects electronic components and it is used for soldering components to form
compact and rugged electronic circuits. The PCB of simple circuits can easily be designed
without strictly following the design rules.

1. The physical dimensions of the components in the circuit should be measured before
drawing.
2. Input and Output terminal can be brought to one side for easy connection.
3. Components that produce heat should be placed in one corner of the PCB.
4. Similarly bulky Components (like filter capacitor, transformer etc.) should be placed
in one corner of the PCB.
5. Width of the ground line should be maximum.
ie,
Width of ground line is 3mm.
Width of power line is 2mm.
Width of signal line is 1mm.
6. PCB layout is obtained by reversing the component lay-out horizontally.
Conductor routing rules.
 Design of Reliable Solder Joints

PROCEDURE:

1. Identify and collect all the components that are going to be used in the particular
circuit.
2. Calculate the area required for the printed circuit pattern, considering tolerance.
3. Mark the components lay out in proper
p place on graph sheet.
4. Draw the tracks connecting the components as per the circuit diagram.
5. Trace this track on a tracing sheet.
6. Reverse side (mirror image) of this track is PCB lay-out.
lay

RESULT:

PCB Design and Lay-out

Lay preparation steps are studied.
Experiment No. 2

PCB FABRICATION
AIM:

To study about printed circuit board fabrication techniques.

OBJECTIVES:

1. To identify different types of Copper clad sheet.

2. To understand the process of Etching, Drilling, Masking.

TOOLS/MATERIALS:

Copper clad sheet, ferric chloride solution, Etching machine, drilling machine,
PCB art work tapes & pads, Screen Printing materials /paint, turpentine/thinner etc.

THEORY:

Copper Clad Sheet:

PCB is prepared from copper clad sheet consist of 30 m to 40 µm thick copper foil
fixed over a 1mm to 2mm thick insulated board. Materials used for preparing copper clad
sheet can be paper phenolic or glass epoxy.

Etching:

Ferric chloride solution is the popularly used etching solution. The ferric chloride
powder is made in to a solution using water and kept in a plastic tray / etching machine.
Immerse the printed copper clad sheet in this solution until un-marked area etches out.
Take out the etched sheet, dry and remove the paint using turpentine.

Drilling:

The holes are made by using PCB drilling Machine for components insertion.
Suitable drill bits are used for this purpose.

Solder Mask:

Solder mask is a thin polymer coating on PCB which surrounds the pads to prevent
solder from bridging between pins. This is essential for surface mount and fine pitch
devices. The solder mask typically covers everything except pads.
PROCEDURE:

1. Prepare the PCB lay-out of the given circuit in a tracing sheet using suitable size art
work tapes and pads.
2. Copper clad sheet (Paper phenolic /Glass epoxy) is cut to the suitable size and it is
cleaned.
3. Transfer the lay-out to the copper side using screen printing/paint.
4. Etching is done to remove the un-marked copper from the copper clad sheet.
5. Drill proper holes for component mounting.

RESULT:

PCB fabrication techniques are studied.

Experiment No. 3.
SOLDERING & DE- SOLDERING
AIM:

To practice soldering and de- soldering of electronic components.

OBJECTIVES:

1. To list different types of soldering and specifications of soldering tools.

2. To understand safety precautions in soldering.

TOOLS/MATERIALS:

Soldering iron/station, De-soldering pump/station, Nose-plier, Wire stripper,

Tweezer, Knife/blade.

PCB, solder, flux, wires, electronic components.

THEORY:

Soldering:

Soldering is the process of joining two or more metals using another metal having
low melting point.

Wave soldering:

Wave soldering is a large scale soldering process by which electronic components

are soldered to a PCB to form an electronic assembly. The name is derived from the use of
waves of molten solder to attach metal components to the PCB. This soldering is much
faster than manual soldering of components. Wave soldering is used for both through hole
printed circuit assembly and SMD.

De- Soldering:

De-soldering is the process of removal of solder and components from a PCB for
Trouble shooting and repair purpose.

Soldering Iron:

It is the tool used to melt the solder during the process of soldering. It consists of
an insulated handle heating element and a bit. Commonly available iron is from 10W to
100W. For electronic work 10W and 25W soldering irons are used.
Soldering station:

A soldering station is equipment which provides an iron and a control console

that controls the temperature. The tip temperature is maintained with temperature sensor.

De-soldering Pump /De-soldering station:

During trouble shooting and repairing, the components may be removed from the
PCB. This is done with help of the de- soldering pump/ De-soldering station .The solder
points are heated with a hot soldering iron and the molten solder is sucked by a pump.

Wire Stripper:

It is a simple Tool like a cutter which is used to remove the electrical insulation.

Tweezer:

For soldering & de- soldering small surface mount components with two terminals
such as sum links, resistors, capacitors and diodes etc. this tool can be used.

Solder:

Solder is an alloy. Several alloys of tin such as Tin –Lead, Tin –Antimony, Tin –
Silver, Tin –Zinc etc are available. Tin –Lead is commonly used solder. The ratio of Tin:
Lead is 63:37. It is called eutectic solder and its melting point is 183 ° C.

Flux:

Flux is a cleaning agent which removes the oxides and helps the solder to make a
good bond. If the oxides are not removed properly, the joint become dry solder and the
conductivity will be poor.

Solvent:

Solvent is used to clean the soldered surface. Solvent is used to remove the
dissolved flux residue from solder points.

Safety Precautions:

1. Use soldering irons with correct temperature and power ratings for different
applications.
2. Unplug the iron when not in use. Always return the soldering iron to its stand
when it is not in use.
3. Work in a well-ventilated area.
4. Solder contains lead, which is a poisonous metal. Wash your hands after using
solder.
5. Overheating pins of IC can damage IC’s. So it is advisable to use IC base.
 6. While using Electrostatic Devices, anti static precautions has to be taken.

PROCEDURE:

1. Clean the components leads using a blade or steel wool and bend them as needed
using tweezer.
2. Clean the PCB with steel wool before soldering for removal of any oil, wax etc.
3. Plug in the cord of soldering iron in to the main supply.
4. Mount the components on the PCB, apply a little flux on the joints.
5. Take a little solder on soldering iron. Apply the molten solder to the joints. Soldering
must be done in minimum time to avoid dry soldering and heating up of the
components.
6. For De-Soldering, solder points are heated using a hot soldering iron and the molten
solder is sucked by a pump.

RESULT:

Soldering and De-soldering of electronic components are studied.

Experiment No. 4.
SOLDERING & DE- SOLDERING OF SMD
AIM:

To practice soldering and de- soldering of SMD (Surface Mount Device).

OBJECTIVES:

To acquire practical skill of SMD soldering and de- soldering.

TOOLS/MATERIALS:

SMD Soldering iron, SMD de-soldering station /Blower, Tweezers, Needles, IC

extractor, SMD Components (chip type resistors, capacitors, diodes etc.)Solder wire,
desoldering wick , Flux, etc.

THEORY:

Surface Mount Technology (SMT):

It is a method for making electronic circuits in which the components are mounted
or placed directly on to the surface of PCBs. An electronic device so made is called
surface mount device.

Soldering Iron:

This should be higher quality temperature controlled soldering iron with a few
types of fine soldering bits (1 mm and such, smaller for SMD).

De-Soldering station/ Blower:

It is a tool used for desolder the SMD components from PCB using controlled hot
air.

Solder wire:

Solder wire should be resin cored and thin. Commonly 0.5mm solder wire is used.
It should be a silver alloy as an ordinary solder will dissolve pads on components such as
resistors or ceramic capacitors, but it is expensive and sometimes hard to find.
PROCEDURE:

1. To prepare the pads, tin them with a fine, thin film of solder.
2. To correctly tin the pads, flood them with solder and then pick up the excess with de-
soldering wick.
3. To solder a component like a resistor or a transistor, pick up the component with
tweezers and place it on the prepared pads, put a little solder on soldering iron’s tip
and while holding the component in place with tweezers, touch pad with soldering
iron.
4. To solder an IC, position the component on the pads so that all pins and pads line up.
Then holding the component in place, solder two opposite pins of the IC, to keep the
IC in place while you are soldering the other pins.
5. To desolder small components such as resistors, diodes, capacitors, heat the pads
alternately, quickly moving the soldering iron from one pad to the other repeatedly,
while pushing the component to the side with a small screw driver until it gives in and
push the component away from pads.
6. To remove three pin components and ICs apply hot air from the special equipment
(Hot air gun/Blower).
7. Excess solder is removed using de-soldering wick.

RESULT:

Soldering and De-soldering of SMD components studied.

Experiment No. 5.
PCB FABRICATION OF BRIDGE RECTIFIER
AIM:

To prepare PCB of Bridge Rectifier with Filter and set up this circuit.

OBJECTIVES:

1. To design PCB lay-out.

2. To fabricate PCB.

3. To assemble the components.

4. Soldering the components.

TOOLS/MATERIALS:

Etching Machine, Drilling machine, soldering iron, knife, wire stripper, Copper
clad sheet, ferric chloride, Screen printing ink, PCB Art work tapes, pads, solder,
Transformer 230/0-6/1A, Diode 1N4001, capacitor 470uf/12V, Resistor 1k.etc.

THEORY:

Rectifier converts input AC into DC output of required voltage. During the

positive half cycle of the input signal, the diode D1 and D3 is forward biased. Hence the
current flows through D1, R1 and D3. During the negative half cycle of the input signal,
the diode D1 and D3 are reverse biased and the diode D2 and D4 are forward biased.
Hence the current flows through D2, R1 and D4. Thus, the voltage obtained across R1 is
full wave rectified.

PROCEDURE:

1. Draw the circuit diagram of given circuit.

2. Draw the components lay-out on a graph sheet.

3. Prepare the PCB lay-out of given circuit in a tracing sheet.

4. Cut the Copper clad sheet as per the size of PCB.

5. Transfer the PCB layout to the copper side of copper clad sheet with help of
screen printing or paint.

6. Dip the PCB in the Ferric Chloride Solution or etching machine for etching.
 7. The etched
ched PCB is cleaned with turpentine/thinner.

8. Drill the terminal holes on PCB using drilling machine with suitable bit.

9. Properly insert all components on this PCB.

10. Solder the components on PCB with help of soldering iron/station.

CIRCUIT DIAGRAM:

COMPONENT LAYOUT:

PCB LAYOUT:
ARTWORK:

RESULT:

PCB of a bridge rectifier is fabricated, assembled and tested.

Experiment No: 6

ASTABLE MULTIVIBRATOR
AIM:

To prepare PCB of Astable Multivibrator and set up this circuit.

OBJECTIVES:

1. To design PCB lay-out.

2. To fabricate PCB.

3. To assemble the components.

4. Soldering the components.

TOOLS/MATERIALS:

Etching Machine, Drilling machine, soldering iron, knife, wire stripper, Copper
clad sheet, ferric chloride, Screen printing ink, PCB Art work tapes, pads, solder,
Transistor BC548, capacitor 10uf, Resistor 82k, 470E, LED etc.

THEORY:

A s t a b l e m u l t i v i b r a t o r i s a rectangular wave shaping circuit having

non-stable states. The time period of the output square wave is given by, T = 1.38RC.

PROCEDURE:

1. Draw the circuit diagram of given circuit.

2. Draw the components lay-out on a graph sheet.

3. Prepare the PCB lay-out of given circuit in a tracing sheet.

4. Cut the Copper clad sheet as per the size of PCB.

5. Transfer the PCB layout on the copper side of copper clad sheet with help of
screen printing or paint.

6. Dip the PCB in the Ferric Chloride Solution or etching machine for etching.
 7. The etched PCB is cleaned with turpentine/thinner.

8. Drill the terminal holes on PCB using drilling machine with suitable bit.

9. Properly insert all components on this PCB.

10. Solder the components on PCB with help of soldering iron/station

Circuit Diagram:

COMPONENT LAYOUT:
PCB LAYOUT:

RESULT:

PCB of Astable Multivibrator is fabricated, assembled and tested.

Experiment No: 7

R C Coupled Amplifier
AIM:

To prepare PCB of R C coupled Amplifier and set up this circuit.

OBJECTIVES:

1. To design PCB lay-out.

2. To fabricate PCB.

3. To assemble the components.

4. Soldering the components.

TOOLS/MATERIALS:

Etching Machine, Drilling machine, soldering iron, knife, wire stripper, Copper
clad sheet, ferric chloride, Screen printing ink, PCB Art work tapes, pads, solder ,
Transistor BC107, capacitor 10uf, 22 uf, Resistor 1k, 1.8k, 47k, 10k, 470E etc.

THEORY:

Amplifier is a circuit that is used for amplifying a signal. Common emitter

configuration is most commonly used in audio amplifier applications.

PROCEDURE:

1. Draw the circuit diagram of given circuit.

2. Draw the components lay-out on a graph sheet.

3. Prepare the PCB lay-out of given circuit in a tracing sheet.

4. Cut the Copper clad sheet as per the size of PCB.

5. Transfer the PCB layout on the copper side of copper clad sheet with help of
screen printing or paint.

6. Dip the PCB in the Ferric Chloride Solution or etching machine for etching.

7. The etched PCB is cleaned with turpentine/thinner.

 8. Drill the terminal holes on PCB using drilling machine with suitable bit.

9. Properly insert all components on this PCB.

10. Solder the components on PCB with help of soldering iron/station

CIRCUIT DIAGRAM:

COMPONENTS LAYOUT:
PCB LAYOUT:

RESULT:

PCB of RC coupled amplifier is fabricated, assembled and tested.

Experiment No: 8
TIMER USING IC555
AIM:

To Prepare PCB of Timer Circuit using IC 555 and set up this circuit.

OBJECTIVES:

1. To design PCB lay-out.

2. To fabricate PCB.

3. To assemble the components.

4. Soldering the components.

TOOLS/MATERIALS:

Etching Machine, Drilling machine, soldering iron, knife, wire stripper, Copper
clad sheet, ferric chloride, Screen printing ink, PCB Art work tapes, pads, solder, IC 555,
Resistors 6.8k, capacitor 0 .01uf, 0.1uf etc.

THEORY:

The astable multivibrator using IC 555 generates a rectangular wave. The time
during which the output is either high or low is determined by the two resistors (R1 and
R2) and a capacitor (C2) which is externally connected to the 555 timer.

PROCEDURE:

1. Draw the circuit diagram of given circuit.

2. Draw the components lay-out on a graph sheet.

3. Prepare the PCB lay-out of given circuit in a tracing sheet.

4. Cut the Copper clad sheet as per the size of PCB.

5. Transfer the PCB layout on the copper side of copper clad sheet with help of
screen printing or paint.

6. Dip the PCB in the Ferric Chloride Solution or etching machine for etching.

7. The etched PCB is cleaned with turpentine/thinner.

 8. Drill the terminal holes on PCB using drilling machine with suitable bit.

9. Properly insert all components on this PCB.

10. Solder the components on PCB with help of soldering iron/station

CIRCUIT DIAGRAM:

COMPONENTS LAYOUT:
 PCB LAYOUT:

RESULT:

PCB of a timer using IC555 is fabricated, assembled and tested.

Experiment No: 9
HALF ADDER
AIM:

To Prepare PCB of Half Adder Circuit and set up this circuit.

OBJECTIVES:

1. To design PCB lay-out.

2. To fabricate PCB.

3. To assemble the components.

4. Soldering the components.

TOOLS/MATERIALS:

Etching Machine, Drilling machine, soldering iron, knife, wire stripper, Copper
clad sheet, ferric chloride, Screen printing ink, PCB Art work tapes, pads, solder, IC 7486,
7408, Resistors 1k, LED, Switcches etc.

THEORY:

Half adder is a combinational arithmetic circuit that adds two numbers and
produces a sum bit (S) and carry bit (C) as the output. It uses digital IC 7408 and 7486.

PROCEDURE:

1. Draw the circuit diagram of given circuit.

2. Draw the components lay-out on a graph sheet.

3. Prepare the PCB lay-out of given circuit in a tracing sheet.

4. Cut the Copper clad sheet as per the size of PCB.

5. Transfer the PCB layout on the copper side of copper clad sheet with help of
screen printing or paint.

6. Dip the PCB in the Ferric Chloride Solution or etching machine for etching.

7. The etched PCB is cleaned with turpentine/thinner.

8. Drill the terminal holes on PCB using drilling machine with suitable bit.
 9. Properly insert all components on this PCB.

10. Solder the components on PCB with help of soldering iron/station

CIRCUIT DIAGRAM:

COMPONENTS LAYOUT:

PCB LAYOUT:
RESULT:

PCB of Half Adder circuit is fabricated, assembled and tested.

Experiment No: 10

PCB DESIGN AND LAYOUT PREPARATION USING SOFTWARE

AIM:

To deign PCB layout of bridge rectifier circuit using PCB design software.

OBJECTIVES:

1. Design circuit using schematic entry package.

2. Generate netlist for PCB package.

3. Import netlist into PCB package.

4. Place components, route board.

5. Generate machining (Gerber) files for PCB plant.

TOOL REQUIRED:

Circuit simulator, Layout simulator installed in a Personal Computer.

THEORY:

A s t a b l e m u l t i v i b r a t o r i s a rectangular wave shaping circuit having

non-stable states. The time period of the output square wave is given by, T = 1.38RC.

Several PCB design software for PCB layout preparation is available. Some of
them are ORCAD, Proteus, FREE EDA, KiCAD, Protel etc. Here ORCAD based
simulator is used. Free and student’s versions of ORCAD are available, like ORCAD 9.2,
ORCAD Lite etc. Information about ORCAD Lite is available from the ORCAD website:
http://www.orcad.com/pspicead.aspx

It is advisable to do this experiment after familiarizing with SPICE circuit

simulator.

PROCEDURE:
General Steps for PCB design using Orcad:

1. Design circuit using schematic entry package (Capture).

2. Generate netlist for PCB package.

3. Import netlist into PCB package (LayoutPlus).

4. Place components, route board.

5. Generate machining (Gerber) files for PCB plant.

6. View the PCB Layout.

Schematic Design:

1. Use Capture to enter the design (Refer SPICE Experiments). While creating
new project, Select Schematic, here the component library consist of more
components than in PSPICE Library.
2. Connectors can be used for inputs, and outputs. Select Connector B2S for
inputs and Outputs.
3. Select project in project window.
4. Check for any design rules violations. Tools  Design Rules Check. Any
violation in electrical Rules, Unconnected Nets, Invalid References and
Duplicate References will be checked. To view drc file, Outputs *.drc
5. Create Bill of materials. A file with details of components used, quantity and
specifications will be generated. Tools  Bill of materials. To view bom file,
Outputs *.bom
6. Create netlist. A file that is used in layout preparation is created. Tools 
Create Netlist. Choose Layout tab  OK. A netlist file (.mnl extension) will
be created.
7. Close Capture.

PCB Layout:

1. Run LayoutPlus. An ORCAD LAYOUT Window opens.

2. Choose FileNew. Another window, LAYOUT PLUS, opens.

3. Select a “technology file” appropriate for the design. These are in Program

C:\ Program Files\ Orcad\ Layout_Plus\ Data and select DEFAULT.TCH.

4. Choose the created netlist file (.mnl extension).

 5. If some of the components chosen from the Orcad Capture libraries did not have
PCB footprints associated with them “Cannot find footprint for...” messages will
be displayed. If this happens, choose “link existing footprint to component”.
Browse footprint libraries to find the required footprint. Eg: Capacitor TM-
DISC, TM-CYLND, JumperJ0, DiodeTM-DIODE, ResistorTM-AXIAL,
Connector  BCON100T etc.

Place Components:

1. Draw the border. ToolObstacleSelect tool. Draw the board outline.

2. Select thickness of different grids. Size is usually specified in mils(m), where 1
mil = 0.001 inch. OptionsSystem Setting, Select Visible Grid 100, Detail
Grid 25, Place Grid 25, Routing Grid 25, Via grid 10.
3. Select the origin. Tool Dimension Move Datum. Place the datum (A circle
with a cross symbol) to one corner of outline. Origin will have the coordinate
(X=0, Y=0).
4. Drag the components to inside the board outline. Tool ComponentSelect
tool click on required component and drag it.
5. Right click to see some options, including rotate.

Choose Layers:

1. Select width of the net. View Spreadsheet NetWidth Enter Min

(Minimum) 25, Con (Connection)50, Max (Maximum) 100. (All units in
mils).
2. Select Route Spacing. View Spreadsheet Strategy Route Spacing Set all
to 12. (All units in mils)

3. Select layer to route. View Spreadsheet  Layers Layer Type.

4. Enable only the layers for routing, set other layers to unused (double click on
the Layer Type select all to unused routing).

5. For a single sided board use only the “bottom” layer. Select layers needed then
right click, select properties, then set routing to enable layers.

Routing:

1. To automatically route, select Auto auto routeboard.

2. After an autoroute, board is completed.

3. Some times it is more appropriate to use manual routing. For manual routing
turn on Edit Segment Mode icon on top.
 4. All tracks may not be routed after autoroute. Via can be added for connecting
this track. Right click Add Via.

5. If any modification is required, unroute the board. Auto Unroute Board.

Generate Machining Files (Gerber files):

A Gerber file is a file that contains the information from Layout necessary for the
prototyping machine to mill, drill and cut the PCB.

1. The machining files required to manufacture the PCB are generated by the
“post processor”. From options menu choose “Post Process Settings”. In the
spreadsheet, select the layers needed to manufacture. Post processor Settings
Batch Enabled Properties First disable all, then enable BOT (BOTTOM),
SMB (Solder Mask Bottom) and SMT (Solder Mask Top), SST (Silk Screen
Top), AST (Assembly Top) and DRD (Drill Drawing).

2. Select Options  Gerber Settings  OK.

3. Choose Auto Run Post Processor to generate the files (.GTD flile). The files
generated by the post processor are the only ones needed for the PCB plant to
make the board.

Viewing PCB Layout:

1. Open ORCAD LAYOUT window.

2. Open created GTD file. ToolsGerb toolOpen Open created *.GTD file.
3. Select .BOTRedraw, to view PCB bottom.
.SMB Redraw, Solder mask bottom.
.SMT Redraw, Solder mask Top.
.SST Redraw, Silk Screen Top. \

Creating new footprint:

Footprint of all components may not be available in LAYOUT Library. New
Libraries for required footprint can be created.
1. Open LAYOUT PLUS window.
2. Select Library manager. ToolsLibrary Manager.
3. We can create new footprint, or modify existing footprint. Select a footprint
that looks similar to new requirement  Edit it Create New Library 
Change the name of footprintSave footprint in new Library.
4. Component footprint can be selected from newly created library at the time of
layout preparation.

Creating new part:

New parts can be created in ORCAD.
 1. Open ORCAD capture. Create new schematic project. FileNewProject,
Select Schematic.
2. Create a library of part symbols. FileNewLibrary. A new folder and a
library file are created.
3. Save the library file. Right click library file Save AsGive name.
4. Now add part to the library. Right click library file  New Part. Enter part
name.
5. A workspace for part creation opens. Using toolbar in the right side, create a
new part.
6. Save the part and close the window.

CIRCUIT DIAGRAM:

OBSERVATIONS:
SILK SCREEN TOP:

BOTTOM LAYER:
RESULT:
Familiarized with PCB Layout design using software. PCB layout of Bridge
Rectifier circuit is prepared using PCB design software.

INFERENCE:

2. PCB layout of any electronic circuit can be prepared using Simulation

Software’s.
3. This experiment can be repeated to prepare PCB layout of Astable
Multivibrator, RC Coupled Amplifier, Timer using IC555 and Adder Circuit
mentioned in previous experiments.

ASTABLE MULTIVIBRATOR:

OBSERVATIONS:
RC COUPLED AMPLIFIER:
CIRCUIT DIAGRAM:

OBSERVATIONS:
TIMER USING IC555:
CIRCUIT DIAGRAM:
OBSERVATIONS:

HALF ADDER:
CIRCUIT DIAGRAM:
OBSERVATIONS:
 SPICE

I. SPICE TUTORIAL
II. VOLTAGE DIVIDER CIRCUIT
III. CHARACTERISTICS OF DIODE
IV. CHARACTERISTICS OF BJT
V. CENTRE TAPPED FULL WAVE RECTIFIER CIRCUIT
VI. SINGLE STAGE AMPLIFIER
VII. RC PHASE SHIFT OSCILLATOR
VIII. ASTABLE MULTIVIBRATOR USING TRANSISTOR
IX. ASTABLE MULTIVIBRATOR USING 555
X. REGULATED POWER SUPPLY
XI. SCHMITT TRIGGER USING 741
XII. HALF ADDER
XIII. SYNCHRONOUS COUNTER
EXPERIMENT NO:1

SPICE TUTORIAL

Simulation Program for Integrated Circuits Emphasis.

SPICE is a powerful general purpose analog and mixed-mode circuit simulator that
is used to verify circuit designs and to predict the circuit behavior. SPICE was originally
developed at the Electronics Research Laboratory of the University of California,
Berkeley (1975).

SPICE inspired and served as a basis for many other circuit simulation programs,
in academia, in industry, and in commercial products. The first commercial version of
SPICE was ISPICE. The most prominent commercial versions of SPICE include HSPICE
and PSPICE. The academic spinoffs of SPICE include XSPICE, and Cider. Student
versions of SPICE are also available. Some freely available simulators are PSICE 9.1
student version, AIM-SPICE, 5SPICE, TINA student version and LTSPICE. The OrCAD
student edition is called PSpice AD Lite. Information about Pspice AD is available from
the OrCAD website: http://www.orcad.com/pspicead.aspx. The SPICE student version
will have the following limitations: circuits have limited number of nodes, transistors and
other components. Here ORCAD based simulator is used. It is advisable to run the
simulator in Windows XP operating system.

All analyses can be done at different temperatures. The default temperature is

300K.

The circuit can contain the following components:

• Independent and dependent voltage and current sources
• Resistors
• Capacitors
• Inductors
• Diodes
• Bipolar transistors
• MOS transistors
• JFET
• Digital gates
• and other components
1. SOURCE FILE:

A SPICE input file, called source file, consists of three parts.

1. Data statements: description of the components and the interconnections.

2. Control statements: tells SPICE what type of analysis to perform on the circuit.
3. Output statements: specifies what outputs are to be printed or plotted.

Two other statements are required: the title statement and the end statement. The title
statement is the first line and can contain any information, while the end statement is
always .END. In addition, you can insert comment statements, which must begin with an
asterisk (*) and are ignored by SPICE.

TITLE STATEMENT
ELEMENT STATEMENTS
.
.
COMMAND (CONTROL) STATEMENTS
OUTPUT STATEMENTS
.END

2. DATA STATEMENTS

Data Statements specify the circuit components and the interconnections.

2.1. Independent DC Sources

Voltage source: Vname N1 N2 Type Value

Current source: Iname N1 N2 Type Value

N1 is the positive terminal node

N2 is the negative terminal node
Type can be DC, AC or TRAN, depending on the type of analysis.
Value gives the value of the source

Examples: Vin 2 0 DC 10

Is 3 4 DC 1.5

2.2. Dependent Sources

Voltage controlled voltage source:

Ename N1 N2 NC1 NC2 Value
Voltage controlled current source:
Gname N1 N2 NC1 NC2 Value

Current controlled voltage source:

Hname N1 N2 Vcontrol Value

Current controlled current source:

Fname N1 N2 Vcontrol Value

N1 and N2 are the positive and negative terminals of the dependent source,
respectively.
NC1 and NC2 are the positive and negative terminals of the controlling voltage
source, respectively.

Examples: F1 0 3 Vmeas 0.5

Vmeas 4 0 DC 0

2.3. Sinusoidal sources

Vname N1 N2 SIN(VO VA FREQ TD THETA PHASE)

VO - offset voltage in volt.

VA - amplitude in volt.
f = FREQ - the frequency in herz.
TD - delay in seconds
THETA - damping factor per second
Phase - phase in degrees

Example: VG 1 2 SIN(5 10 50 0.2 0.1)

2.4. Resistors

Rname N1 N2 Value

N1 and N2 are the terminals; Value gives the value of the resistor.

Example: R1 0 3 10k

2.5. Capacitors (C) and Inductors (L)

Cname N1 N2 Value <IC>

Lname N1 N2 Value <IC>

 N1 is the positive node.
N2 is the negative node.
IC is the initial condition (DC voltage or current).
The symbol < > means that the field is optional. If not specified, it is assumed to be
zero.

Example: C5 5 3 4 35E-12 5

L12 7 3 6.25E-3 1m

2.6. Mutual Inductors

A mutual inductance in SPICE is defined by specifying the coupling coefficient K

between the two inductors. The syntax is as follows:

Kname Inductor1 Inductor2 value_of_K

The value of K must be larger than 0 but smaller than 1. The above statement must
always be together with the statements for the two inductors.

Example:
L1 3 5 10M
L2 4 7 3M
K L1 L2 0.81

2.7. Transformer

SPICE has no model for an ideal transformer. An ideal tranformer is simulated

using mutual inductances such that the coupling factor K close to one (ex. K=0.99999)

2.8. Semiconductor Devices

Most of the elements that have been described above require only a few parameters
to specify its electrical characteristics. However, the models for semiconductor devices
require many parameter values. A set of device model parameters is defined in a separate
.MODEL statement and assigned a unique name. Thus a semiconductor device is specified
by two command lines: an element and model statement.

The syntax for the model statement is:

.MODEL MODName Type (parameter values)

MODName is the name of the model for the device. The Type refers to the type of
device and can be any of the following:

D: Diode
 NPN: npn bipolar transistor
PNP: pnp bipolar transistor
NMOS: nmos transistor
PMOS: pmos transistor
NJF: N-channel JFET model
PJF: P-channel JFET model

The parameter values specify the device characteristics.

2.8.1. Diode

Element line: Dname N+ N- MODName Model statement:

.MODEL MODName D (IS= N= Rs= CJO= Tt= BV= IBV=)

The element name starts with D to indicate that the element is a diode, N+ and N-
are the two node numbers and MODName is the name of the model of the diode which is
specified in the model line. The values include: the saturation current, IS ,the emission
coefficient, N (=1), the series resistance, RS (=0 ohm), junction capacitance, CJO (=0F),
transit time, TT (=0sec), reverse bias breakdown voltage, BV (=infinite) and the reverse
bias breakdown current, IBV (=1xE-10A).

Example: .model D1N4148 D (IS=0.1PA, RS=16 CJO=2PF TT=12N BV=100

IBV=0.1PA)

2.8.2. Bipolar transistors

Element: Qname C B E BJT_modelName

Model statement:

.MODEL BJT_modName NPN (BF=val IS=val VAF=val)

In which BF is the common emitter current gain ß, IS is the saturation current and
VAF is the Early voltage. Other parameters can be specified including the junction
capacitances CJE and CJC, the transit times TT and TR, the base RB, emitter RE and
collector resistances RC.

Example:
.model Q2N2222A NPN (IS=14.34F XTI=3 EG=1.11 VAF= 74.03 BF=255.9
NE=1.307 ISE=14.34F IKF=.2847 XTB=1.5 BR=6.092 NC=2 ISC=0 IKR=0
RC=1 CJC=7.306P MJC=.3416 VJC=.75 FC=.5 CJE=22.01P MJE=.377 VJE=.75
TR=46.91N TF=411.1P ITF=.6 VTF=1.7 XTF=3 RB=10)

2.8.3. MOSFETS
 Element: Mname ND NG NS &ltNB> ModName L= W=

The MOS transistor name (Mname) has to start with a M; ND, NG, NS and NB are
the node numbers of the Drain, Gate, Source and Bulk terminals, respectively. ModName
is the name of the transistor model .L and W is the length and width of the gate .

Model statement:

.MODEL ModName NMOS (KP= VT0= lambda= gamma=)

KP=uCox and VTO is the threshold voltage.

3. UNITS & VALUES

The units of elements are specified using standard units:

Resistor : ohm
Capacitor: F
Inductro: H
Voltage: V
Current: A

The values of elements can be specified using scaling factors (upper or lower case):

T or Tera (= 1E12);
G or Giga (= E9);
MEG or Mega (= E6);
K or Kilo (= E3);
M or Milli (= E-3);
U or Micro (= E-6);
N or Nano (= E-9);
P or Pico (= E-12)
F of Femto (= E-15)

4. TYPES OF ANALYSIS, OPERATING POINT TRANSIENT, AC & DC

SPICE can do DC bias, DC Sweep, Transient with Fourier analysis, AC analysis,

Montecarlo/worst case sweep, Parameter sweep and Temperature sweep.

• Non-linear DC analysis: Calculates the DC transfer curve.

• Non-linear transient and Fourier analysis: Calculates the voltage and current as a
function of time when a large signal is applied; Fourier analysis gives the
frequency spectrum.
• Linear AC Analysis: calculates the output as a function of frequency. A bode plot is
generated.
• Noise analysis
 • Parametric analysis
• Monte Carlo Analysis

5.COMMANDS OR CONTROL STATEMENTS TO SPECIFY THE TYPE OF

ANALYSIS

5.1. .OP Statement

This statement instructs SPICE to compute the DC operating points:

 voltage at the nodes

 current in each voltage source
 operating point for each element

In SPICE it is usually not necessary to specify .OP as it automatically gives the DC

node voltages.

5.2. .DC Statement

This statement allows to increment(sweep) an independent source over a certain

range with a specified step. The format is as follows:

.DC SRCname START STOP STEP

SRC name is the name of the source you want to vary; START and STOP are the
starting and ending value, respectively; and STEP is the size of the increment.

Example: .DC V1 0 20 2

5.3. .TF Statement

The .TF statement instructs SPICE to calculate the following small signal
characteristics:

1. the ratio of output variable to input variable (gain or transfer gain)

2. the resistance with respect to the input source
3. the resistance with respect to the output terminals

.TF OUTVAR INSRC

OUTVAR is the name of the output variable and INSRC is the input source.

Example: .TF V(3,0) VIN

5.4. .TRAN Statement

 This statement specifies the time interval over which the transient analysis takes
place, and the time increments. The format is as follows:

.TRAN TSTEP TSTOP <TSTART <TMAX>> <UIC>

TSTEP is the printing increment.
TSTOP is the final time
TSTART is the starting time (if omitted, TSTART is assumed to be zero)
TMAX is the maximum step size.
UIC stands for Use Initial Condition and instructs SPICE not to do the quiescent
operating point before beginning the transient analysis.

5.5. .IC Statement

This statement provides an alternative way to specify initial conditions of nodes.

.IC Vnode1 = value Vnode2 = value etc.

5.6. .AC Statement

This statement is used to specify the frequency (AC) analysis. The format is as
follows:

.AC LIN NP FSTART FSTOP

.AC DEC ND FSTART FSTOP
.AC OCT NO FSTART FSTOP

LIN stands for a linear frequency variation, DEC and OCT for a decade and octave
variation respectively. NP stands for the number of points and ND and NO for the number
of frequency points per decade and octave. FSTART and FSTOP are the start and stopping
frequencies in Hertz.

Example: .AC DEC 10 1000 1E6

6. OUTPUT STATEMENTS

These statements will instruct SPICE what output to generate. If an output

statement is not specified, SPICE will always calculate the DC operating points. The two
types of outputs are the prints and plots. A print is a table of data points and a plot is a
graphical representation. The format is as follows:

.PRINT TYPE OV1 OV2 OV3 ...

.PLOT TYPE OV1 OV2 OV3 ...

TYPE specifies the type of analysis to be printed or plotted and can be:
  DC
 TRAN
 AC

The output variables are OV1, OV2 and can be voltage or currents in voltage sources.

.PLOT DC V(1,2) V(3)

.PLOT AC VM(3,0)

.PRINT TRAN V(3,1)

7. SIMULATION OF CIRCUITS

7.1. BIAS or DC analysis

1. With the schematic open, go to the SPICE menu and choose NEW SIMULATION
PROFILE.
2. In the Name text box, type a descriptive name, e.g. Bias
3. From the Inherit From List: select none and click Create.
4. When the Simulation Setting window opens, for the Analyis Type, choose Bias
Point and click OK.
5. Now it is ready to run the simulation: PSPICE/RUN
6. If the simulation was successful an output window will open. If there are errors,
check the Simulation Output file.
7. To see the result of the DC bias point simulation, open the Simulation Output file or
go back to the schematic and click on the V icon (Enable Bias Voltage Display)
and I icon (current display) to show the voltage and currents.

7.2. DC Sweep simulation

1. Create a New Simulation Profile (from the SPICE Menu).
2. For analysis select DC Sweep; enter the name of the voltage source to be swept. The
start and end values and the step need to be specified.
3. Run the simulation. SPICE will generate an output file that contains the values of all
voltages and currents in the circuit.

7.3. Transient Analysis

1. Set up the Transient Analysis: go to the PSPICE/NEW SIMULATION PROFILE.
2. Give it a name. When the Simulation Settings window opens, select "Time Domain
(Transient)" Analysis. Enter also the Run Time. For the Max Step size, leave it
blank.
3. Run PSPICE.
4. A Probe window in SPICE will open. Traces can be added to display the results.

7.4. AC Sweep Analysis

 The AC analysis will apply a sinusoidal voltage whose frequency is swept over a
specified range. The simulation calculates the corresponding voltage and current amplitude
and phases for each frequency.
1. Create a new New Simulation Profile.
2. For analysis select AC Sweep. The start frequency, end frequency and the
points/decade need to be specified.
3. Run the simulation.
EXPERIMENT NO: 2

VOLTAGE DIVIDER CIRCUIT

AIM:

To familiarize with SPICE simulator using a voltage divider circuit.

OBJECTIVES:

 To create circuit schematic.

 To simulate a circuit.
 To view and understand Netlist.
 To view Output File and understand Analysis Directive.
 To view simulated output.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

The voltage divider circuit consists of resistors connected in series and parallel.
According to voltage division rule, voltage will be dropped across different resistors.

PROCEDURE:

1. Open the available SPICE simulation software. C:\Program Files\ORCAD\CAPTURE

 CAPTURE CIS
2. Create a new project. File NewProject.
3. Name the Project. SelectAnalog or Mixed Signal Circuit Wizard.
4. Give location to save Project. BrowseSelect path
5. Select the Part Symbol Libraries to be Included. Select Libraries AddFinish.
6. Schematic Window opens. Place Parts from Libraries. LibrariesANALOG,
PartR. LibrariesSOURCE, Part VDC.
7. Edit the values of Parts. Double click on value Give new value.
8. Place Ground. Library CAPSYM, Symbol GND, Name0.
9. Connect the parts using Place Wire.
10. Name the nodes using Place Net Alias.
11. Connect Voltage/Level Marker, from where outputs are required.
12. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeDC Sweep,
NameV1, Sweep typeLinear, Start value 0V, End value10V, Increment 1V.
13. Run the simulation. Probe window opens, showing the voltages measured by
Voltage/Level Marker. New traces can be added in this plot. TraceAdd trace. Axis
range can be edited. Plot X AxisData range  User defined Enter Start to End
valueOK. New plot can be added in the window. Plot Add plot to window. Select
the new plot and add traces.
14. Data statements will be specified in netlist. PSpiceView Netlist.
15. SPICE will generate an output file that contains the values of all voltages and currents
in the circuit, analysis directives and libraries included.

CIRCUIT DIAGRAM:

R1 R2
N1 N2 N3
1k 1k
V V V

V1
5Vdc R3 R4
2k 1k

* Data statements
V_V1 N1 0 5Vdc
R_R1 N1 N2 1k
R_R2 N2 N3 1k
R_R3 N2 0 2k
R_R4 N3 0 1k

*Analysis directives:
.DC LIN V_V1 0 10 1
.PROBE

OBSERVATIONS:
RESULT:

Familiarized with SPICE simulation software using a voltage divider circuit.

Created the circuit schematic and simulated the circuit. Netlist and Analysis directives are
studied.
 EXPERIMENT NO: 3

CHARACTERISTICS OF DIODE
AIM:

To obtain V-I characteristic of diode using SPICE.

OBJECTIVES:

 To create circuit schematic.

 To modify model file of diode.
 To simulate the circuit.
 To find cut-in voltage of diode during forward bias.
 To find breakdown voltage of diode during reverse bias.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

The diode is a device formed from a junction of n-type and p-type semiconductor
material. During forward bias diode will not conduct until input voltage exceeds cut-in
voltage (0.7V). The diode breaks down (8V) during reverse bias.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. LibrariesDIODE, Part D1N4001.
4. Edit the values of Parts. The default breakdown voltage (Bv) of D1N4001 is 75V. We
can edit this value to 8V. Select D1 Edit PSpice Model. Modify the parameter
Bv=8V.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeDC Sweep,
NameV1, Sweep typeLinear, Start value-10V, End value1.2V,
Increment0.01V.
7. Run the simulation.

CIRCUIT DIAGRAM:
 D1
N1 N2
D1N4001
V1
1Vdc R1
I
1k

* Data statements
R_R1 N2 0 1k

D_D1 N1 N2 D1N4001

V_V1 N1 0 1Vdc

*Analysis directives:

.DC LIN V_V1 -10 1.2 0.01

.PROBE

OBSERVATIONS:

RESULT:

V-I characteristic of diode has been obtained using SPICE.

 EXPERIMENT NO: 4

CHARACTERISTICS OF BJT

AIM:
To obtain input and output V-I characteristic of transistor using SPICE.

OBJECTIVES:

 To create circuit schematic.

 To simulate the input characteristic.
 To simulate the output characteristic.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

The BJT is connected in the common emitter configuration. The input

characteristic plot is of the input current (IB) against the input voltage (VBE) for various
values of output voltage (VCE). For a constant VCE the input current starts increasing at
the cut-in voltage.
The output plot is of the output current (IC) against the output voltage (VCE) for
various values of input current. For a constant IB the current increases as the voltage
increases till it reaches saturation. The characteristics are made up of three regions: cutoff,
active and saturation regions. At saturation, the VCE is almost zero and very high current
flows. At cutoff, the output current will be zero. At the active region, the IC increases
linearly with the VCE.
PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. LibrariesEBIPOLAR, Part BC107A.
4. Edit the values of Parts.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. Input characteristic and output characteristics has to be simulated.
6.1. Input Characteristic. PSpiceNew Simulation Profile. Analysis TypeDC
Sweep, Options Primary Sweep, NameV1, Sweep typeLinear, Start
value0V, End value 2V, Increment0.1V.
Options Secondary Sweep, NameV2, Sweep typeLinear, Start value0V,
End value 30V, Increment 30V.
 6.2. Output Characteristic. PSpiceEdit Simulation Profile. Analysis TypeDC
Sweep, Options Primary Sweep, NameV2, Sweep typeLinear, Start
value0V, End value 30V, Increment0.1V.
Options Secondary Sweep, NameV1, Sweep typeLinear, Start value0V,
End value 2V, Increment 0.5V.
7. Run the simulation.

CIRCUIT DIAGRAM:
R1 R2
N1 N2 N3 N4
47k 1k

Q1
V1 V2
1Vdc 30Vdc
BC107A
I

* Data statements
Q_Q1 N3 N2 0 BC107A
R_R1 N1 N2 47k
R_R2 N3 N4 1k
V_V1 N1 0 1Vdc
V_V2 N4 0 30Vdc

*Input Characteristics Analysis directives:

.DC LIN V_V1 0 2 0.1

+ LIN V_V2 0 30 30
.PROBE

* Output Characteristics Analysis directives:

.DC LIN V_V2 0 30 0.1
+ LIN V_V1 0 2 .5
.PROBE
OBSERVATIONS:

INPUT CHARACTERISTICS:

OUTPUT CHARACTERISTICS:

RESULT:
Input V-I characteristic and Output V-I characteristic of diode has been obtained
using SPICE.
EXPERIMENT NO: 5

CENTER TAPPED FULL WAVE RECTIFIER CIRCUIT

AIM:
To setup a center tapped full wave rectifier circuit in SPICE and to simulate the
rectified output.

OBJECTIVES:

 To create circuit schematic.

 To couple inductors.
 To simulate the circuit.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

During the positive half cycle of the input signal, the diode D1 is forward biased
and the diode D2 is reverse biased. Hence the current flows through D1 and R2. During
the negative half cycle of the input signal, the diode D1 is reverse biased and the diode D2
is forward biased. Hence the current flows through D2 and R2. Thus, the voltage obtained
across R2 is full wave rectified.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. LibrariesANALOG, Part L, K Linear.
LibrariesSOURCE, Part VSIN.
4. Edit the values of Parts. VSIN Voff=0, VAMPL=100V, FREQ= 60Hz. Inductors
L1, L2, and L3 needs to be coupled. Select K1EditProperties Set L1 in L1, L2
in L2, and L3 in L3.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeTime
Domain(Transient), Run to time: 50ms, Start saving data after: 0s, Maximum step
size: 0.01ms
7. Run the simulation.

CIRCUIT DIAGRAM:
 D1
N3 N4
D1N4001

L2 C1
R1
N1 N2 K K1 10H
100u
K_Linear
1k
COUPLING = 1 R2

L1
1k
V1 V
VOFF = 0 1000H L3
VAMPL = 100
FREQ = 60 10H

D2
N5
D1N4001

* Data statements
C_C1 N4 0 100u

L_L1 N2 0 1000H

L_L2 N3 0 10H

L_L3 N5 0 10H

R_R1 N1 N2 1k

R_R2 N4 0 1k

D_D1 N3 N4 D1N4001

D_D2 N5 N4 D1N4001

V_V1 N1 0

+SIN 0 100 60 0 0 0

Kn_K1 L_L1 L_L2

+ L_L3 1

*Analysis directives:

.TRAN 0 50ms 0 0.01ms

.PROBE
OBSERVATIONS:

RESULT:
Center tapped full wave rectifier circuit is setup and output is simulated using
SPICE.

.
EXPERIMENT NO: 6

SINGLE STAGE AMPLIFIER

AIM:
To setup a single stage amplifier and to simulate frequency response of amplifier
using SPICE.

OBJECTIVES:

 To create circuit schematic.

 To do AC simulation.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

Amplifier is a circuit that is used for amplifying a signal. Common emitter

configuration is most commonly used in audio amplifier applications. Capacitor C1 is the
input DC decoupling capacitor, C2 is the output DC decoupling capacitor, R1 and R2 are the
biasing resistors, R4 is the collector resistor and R3 is the emitter resistor. The range of
frequency that an amplifier can amplify properly is called the bandwidth. The frequency
response of a single stage RC coupled transistor is plotted by varying input signal
frequency.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. LibrariesSOURCE, Part VAC.
4. Edit the values of Parts.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeAC
Sweep/Noise, AC Sweep typeLogarithmicDecade, Start frequency100Hz, End
frequency1GHz, Points/decade 100.
7. Run the simulation.

CIRCUIT DIAGRAM:
 V1
12Vdc

N3

R1 R3
100k 2.2k C2
N4 N6
15u
Q1 V
C1
N1 N2 R5
10u 1k
BC107A

V3 N5
100mVac R2
0Vdc R4 C3
47k
680ohm 22u

* Data statements
Q_Q1 N4 N2 N5 BC107A
R_R1 N2 N3 100k
R_R2 N2 0 47k
R_R3 N3 N4 2.2k
R_R4 N5 0 680ohm
R_R5 N6 0 1k
C_C1 N1 N2 10u
C_C2 N4 N6 15u
V_V3 N1 0 DC 0Vdc AC 100mVac
C_C3 N5 0 22u
V_V1 N3 0 12Vdc

*Analysis directives:

.AC DEC 100 100 1g

.PROBE

OBSERVATIONS:
RESULT:
Single stage amplifier is setup and the frequency response is simulated using
SPICE.
 EXPERIMENT NO: 7

RC PHASE SHIFT OSCILLATOR

AIM:
To setup a RC phase shift oscillator and to simulate output using SPICE.

OBJECTIVES:

 To create circuit schematic.

 To simulate the circuit.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

A common emitter amplifier is used in forward path followed

b y t h r e e sections of RC phase network in the reverse path with the output of the last
section being returned to the input of the amplifier. In the RC phase shift
oscillator, phase shift of 180˚ in required in the feedback loop. The value o f
R and C are chosen such that the phase shift of each RC section is
60˚. Therefore at a specific frequency the total phase shift
f r o m b a s e t o transistor’s around circuit and back to base is exactly 360˚ or
0˚. Thus the Barkhausen criterion for oscillation is satisfied.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries.
4. Edit the values of Parts.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. PSpiceNew Simulation Profile . Analysis TypeTime
Domain(Transient), Run to time: 1000ms, Start saving data after: 0.1s, Maximum step
size: 0.1ms, Select Skip the initial transient bias point calculation.
7. Run the simulation.
CIRCUIT DIAGRAM:

V1
12Vdc
N1

R1 R3
33k 2.2k C1 C2 C3
N3 N5 N6 N7
1u 1u 1u
R5 R6 R7V
Q1
N2 6.8k 6.8k 6.8k

BC107A

N4
R2
R4 C4
8.2k
1k 47u

* Data statements
Q_Q1 N3 N2 N4 BC107A

R_R1 N2 N1 33k

R_R2 N2 0 8.2k

R_R3 N1 N3 2.2k

R_R4 N4 0 1k

R_R5 N5 0 6.8k

R_R6 N6 0 6.8k

R_R7 N2 N7 6.8k

C_C1 N3 N5 1u

C_C2 N5 N6 1u

C_C3 N6 N7 1u

C_C4 N4 0 47u

V_V1 N1 0 12Vdc
*Analysis directives:

.TRAN 0 1000ms .1s .1m SKIPBP

.PROBE

OBSERVATIONS:

RESULT:
RC phase shift oscillator is setup and output is simulated using SPICE.
 EXPERIMENT NO: 8

ASTABLE MULTIVIBRATOR USING TRANSISTOR

AIM:

To setup an astable multivibrator circuit using transistor and to simulate output

using SPICE.

OBJECTIVES:

 To create circuit schematic.

 To create a mismatch in circuit.
 To simulate the circuit.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

A s t a b l e m u l t i v i b r a t o r i s a rectangular wave shaping circuit having

non-stable states. It consists of two similar NPN transistors. They are capacitor
coupled. It has 2 quasi-stable states. It switches between the two states without any
applications of input trigger pulses. The time period of the output square wave is given by,
T = 1.38RC.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries.
4. Edit the values of Parts. For oscillation to start the there must be a mismatch in
parameters of components. To create a mismatch change initial current (IC) of one of
capacitor to 0. Select C1 Edit  Properties  Set IC = 0.
5. Place Ground. Connect the parts using Place Wire.
8. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeTime Domain
(Transient), Run to time: 10ms, Start saving data after: 0s, Maximum step size:
0.01ms.
6. Run the simulation.

CIRCUIT DIAGRAM:
 V1

12Vdc
N1

R1 R2 R4 R3
4.7k 82k 82k 4.7k
C1 C2
N2 N3 N4 N5
0.022u 0.022u
Q1 Q2

V
BC107A BC107A
V

* Data statements

Q_Q1 N2 N4 0 BC107A

Q_Q2 N5 N3 0 BC107A

R_R1 N1 N2 4.7k

R_R2 N1 N3 82k

R_R3 N1 N5 4.7k

R_R4 N1 N4 82k

C_C1 N2 N3 0.022u IC=0

C_C2 N4 N5 0.022u

V_V1 N1 0 12Vdc

*Analysis directives:

.TRAN 0 10ms 0 0.01m

.PROBE

OBSERVATIONS:
RESULT:
Astable multivibrator circuit is setup in SPICE and output is simulated.
 EXPERIMENT NO: 9

ASTABLE MULTIVIBRATOR USING 555

AIM:
To setup an astable multivibrator using IC555 in SPICE and to simulate the output.

OBJECTIVES:

 To create circuit schematic using analog IC.

 To simulate the circuit.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

Astable multivibrator is circuit which is not stable in either output state without
any applications of input trigger pulses. The astable multivibrator using IC 555 generates a
rectangular wave. The time during which the output is either high or low is determined by
the two resistors (R1 and R2) and a capacitor (C2) which is externally connected to the
555 timer. Initially when the output is high capacitor C2 starts charging towards Vcc
through R1 and R2. As soon as the voltage across the capacitor equals 2/3Vcc, the output
switches to low state. Now capacitor C2 discharges through R2. When voltage across C2
equals 1/3Vcc, the output goes high. Then the cycle repeats.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. LibrariesANL-MISC, Part 555C.
4. Edit the values of Parts.
5. Place Ground. Connect the parts using Place Wire.
9. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeTime Domain
(Transient), Run to time: 1ms, Start saving data after: 0.m1s, Maximum step size: 0s,
Select Skip the initial transient bias point calculation.
6. Run the simulation.

CIRCUIT DIAGRAM:
 N1

V1
8 5Vdc
U1
R1
VCC
2
4k 4 TRIGGER 3 N5
5 RESET OUTPUT
N3 6 CONTROL
THRESHOLD V
N2 7
DISCHARGE
GND
N6 555C
R2 1

1k

C2 C1
29n 1p

* Data statements

X_U1 0 N3 N5 N1 N6 N3 N2 N1 555C
C_C1 N6 0 1p
C_C2 N3 0 29n
R_R1 N2 N1 4k
R_R2 N3 N2 1k
V_V1 N1 0 5Vdc

*Analysis directives:

.TRAN 0 1m 0.1m 0 SKIPBP

.PROBE

OBSERVATIONS:
RESULT:
Astable multivibrator circuit is setup in SPICE and output is simulated.
EXPERIMENT NO: 10

REGULATED POWER SUPPLY

AIM:
To setup a regulated power supply using zener diode and to simulate the output in
SPICE.

OBJECTIVES:

 To create circuit schematic.

 To simulate line regulation of circuit.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

The function of a regulator is to provide a constant output voltage to a load

connected in parallel with it, in spite of the ripples in the supply voltage or the variation in
the load current. A zener diode of break down voltage VZ is reverse connected to an input
voltage source V1 across a load resistance R2 and a series resistor R1. The voltage across
the zener will remain steady at its break down voltage VZ. Hence a regulated DC output
voltage is obtained across R2, whenever the input voltage remains within a minimum and
maximum voltage.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. LibrariesDIODE, Part D1N750.
4. Edit the values of Parts.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. Zener diode D1N750 has breakdown voltage, VB=4.7V.
PSpiceNew Simulation Profile. Analysis TypeDC Sweep, NameV1, Sweep
typeLinear, Start value4V, End value6V, Increment1V.
7. Run the simulation.

CIRCUIT DIAGRAM:
 R1 R2
N1 N2
100
V
1.2k
V1 D1
1Vdc
D1N750

* Data statements
D_D1 0 N2 D1N750

R_R1 N1 N2 100

R_R2 N2 0 1.2k

V_V1 N1 0 1Vdc

*Analysis directives:

.DC LIN V_V1 4 6 1

.PROBE

OBSERVATIONS:
RESULT:
Regulated power supply using zener diode is setup and simulated using SPICE.
EXPERIMENT NO: 11

SCHMITT TRIGGER USING 741

AIM:
To setup a Schmitt trigger circuit using IC741 and to simulate output in SPICE.

OBJECTIVES:

 To create circuit schematic.

 To simulate the circuit.
 To find UTP and LTP from the stimulated output.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

Schmitt trigger is basically an inverting comparator circuit with a positive

feedback. The purpose of the Schmitt trigger is to convert any regular or irregular shaped
input waveform into a square wave output voltage or pulse. A voltage divider with
resistors R1 and R2 is set in the positive feedback of the 741 IC op-amp. The voltage
across R1 is fed back to the non-inverting input. The input voltage V1 triggers or changes
the state of output Vout every time it exceeds its voltage levels above a certain threshold
value. When Vout changes to +Vsat, the input voltage at Upper Threshold
Voltage/Point(UTP). When Vout changes to -Vsat, the input voltage is at Lower
Threshold Voltage/Point(LTP).

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. LibrariesOPAMP, Part uA741.
4. Edit the values of Parts.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeTime Domain
(Transient), Run to time: 3ms, Start saving data after: 0s, Maximum step size: 0s.
7. Run the simulation.

CIRCUIT DIAGRAM:
 R1 R2

1k 4k

5Vdc V2

7
U1
3 5

V+
+ OS2
6
OUT
2 1 V

V-
- OS1
LM741
V

4
R3
V1 V3
VOFF = 0 -5Vdc 1k
VAMPL = 5v
FREQ = 1k

* Data statements
X_U1 N00040 N00075 N00059 N00072 N00049 LM741

R_R1 0 N00040 1k

R_R2 N00040 N00049 4k

R_R3 0 N00049 1k

V_V1 N00075 0

+SIN 0 5v 1k 0 0 0

V_V2 N00059 0 5Vdc

V_V3 N00072 0 -5Vdc

*Analysis directives:

.TRAN 0 3ms 0 0

.PROBE

OBSERVATIONS:
RESULT:
Schmitt trigger circuit using IC741 is setup and output is simulated in SPICE.
 EXPERIMENT NO: 12

HALF ADDER

AIM:
To setup a half adder circuit and to verify simulated output in SPICE.

OBJECTIVES:

 To create a combinational digital circuit schematic.

 To simulate the circuit at gate level.
 To verify output of adder circuit given the inputs.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

Half adder is a combinational arithmetic circuit that adds two numbers and
produces a sum bit (S) and carry bit (C) as the output. If A and B are the input bits, then
sum bit (S) is the X-OR of A and B and the carry bit (C) will be the AND of A and B.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. LibrariesSOURCSTM, PartDigStim1. Libraries
7400, Part7408, 7486.
4. Edit the values of Parts. Select DSTM1 Edit PSpice Stimulus. NameA, Select
Clock or Signal Clock, Frequency 5 KHz, ApplyOk, FileSaveUpdate
Schematic, Close the Stimulus Editor Window. Similarly do for DSTM2, Name B,
frequency  10 KHz.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeTime Domain
(Transient), Run to time: 800us (Time as given in stimulus window), Start saving data
after: 0s, Maximum step size: 0s. OptionsSelect Gate level stimulation  Select
Worst-Case (Min/Max)  Select Suppress simulation error message in waveform data
file, Initialize all flipflops0.
7. Run the simulation.

CIRCUIT DIAGRAM:
 DSTM1
A
S1 U1A
DSTM2 Implementation = A V 1
B 3 Sum
S1
2
Implementation = B V
V
7486

U2A
1
3 Carry
2
V
7408

* Data statements

X_U1A A B SUM $G_DPWR $G_DGND 7486 PARAMS:

+ IO_LEVEL=0 MNTYMXDLY=0

X_U2A A B CARRY $G_DPWR $G_DGND 7408 PARAMS:

+ IO_LEVEL=0 MNTYMXDLY=0

U_DSTM1 STIM(1,0) $G_DPWR $G_DGND A IO_STM STIMULUS=A

U_DSTM2 STIM(1,0) $G_DPWR $G_DGND B IO_STM STIMULUS=B

*Analysis directives:

.TRAN 0 800us 0

.OPTIONS NOPRBMSG

.OPTIONS DIGINITSTATE= 0

.OPTIONS DIGMNTYMX= 4

.PROBE

OBSERVATIONS:
RESULT:
Half adder circuit is setup and SUM and CARRY outputs are verified using
SPICE.
EXPERIMENT NO: 13

SYNCHRONOUS COUNTER

AIM:

To setup a synchronous counter and to simulate the output using SPICE.

OBJECTIVES:

 To create a sequential digital circuit schematic.

 To simulate the circuit at gate level.

TOOL REQUIRED:

SPICE circuit simulator installed in a Personal Computer.

THEORY:

Synchronous counter is a sequential circuit which generates some patterned binary

value depending on a clock. In synchronous counters, the clock inputs of all the flip-flops
are connected together and are triggered by the input pulses. Thus, all the flip-flops
change state simultaneously (in parallel). Q0 changes state at every negative edge of CLK
signal. Q0 is connected to the J and K inputs of second Flip-Flop. Q1 changes state at
negative edge of CLK signal when Q0 is HIGH.

PROCEDURE:

1. Open the available SPICE simulation software. OrCAD CAPTURE CIS.

2. Create a new project. Name the Project. Give location to save Project.
3. Place Parts from Libraries. Libraries 7400, Part7476.
4. Edit the values of Parts. DSTM1, Name clock, frequency  1 KHz.
5. Place Ground. Connect the parts using Place Wire.
6. Simulate the circuit. PSpiceNew Simulation Profile. Analysis TypeTime Domain
(Transient), Run to time: 4ms (Time as given in stimulus window), Start saving data
after: 0s, Maximum step size: 0s. OptionsSelect Gate level stimulation  Select
Worst-Case (Min/Max)  Select Suppress simulation error message in waveform data
file, Initialize all flipflops0.
7. Run the simulation.

CIRCUIT DIAGRAM:
 V1
5Vdc

N2
U3A U5A V2

2
5Vdc

PRE

PRE
N1 4 15 Q0 4 15 Q1
DSTM1 J Q J Q
S1
CLK 1 1
CLK V CLK V
Implementation = Clock
V
16 14 16 14
K Q K Q

CLR

CLR
7476 7476

3
* Data statements

U_DSTM1 STIM(1,0) $G_DPWR $G_DGND CLK IO_STM

STIMULUS=Clock

V_V1 N1 0 5Vdc

X_U5A CLK N2 N2 Q0 Q0 Q1 M_UN0001 $G_DPWR $G_DGND 7476

PARAMS:

+ IO_LEVEL=0 MNTYMXDLY=0

V_V2 N2 0 5Vdc

X_U3A CLK N2 N2 N1 N1 Q0 M_UN0002 $G_DPWR $G_DGND 7476

PARAMS:

+ IO_LEVEL=0 MNTYMXDLY=0

*Analysis directives:

.TRAN 0 4ms 0

.OPTIONS NOPRBMSG

.OPTIONS DIGINITSTATE= 0

.OPTIONS DIGMNTYMX= 4

.PROBE
OBSERVATIONS:

RESULT:
Synchronous counter is setup and output is simulated using SPICE.