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PCB Design and Manufacturing Process

The document discusses the key components and manufacturing process of printed circuit boards (PCBs). PCBs connect electronic components using conducting traces etched from copper sheets and layered inside the board. The manufacturing process involves 10 main steps: 1) generating film for circuit patterns, 2) shearing raw copper-clad material, 3) drilling holes, 4) electroplating holes, 5) applying circuit images, 6) stripping and etching unwanted copper, 7) applying solder mask, 8) solder coating pads, 9) silkscreening markings, and 10) cutting boards from panels. PCBs are inexpensive, reliable connectors that are mass produced using this standard process.

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Jay Jataniya
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2K views

PCB Design and Manufacturing Process

The document discusses the key components and manufacturing process of printed circuit boards (PCBs). PCBs connect electronic components using conducting traces etched from copper sheets and layered inside the board. The manufacturing process involves 10 main steps: 1) generating film for circuit patterns, 2) shearing raw copper-clad material, 3) drilling holes, 4) electroplating holes, 5) applying circuit images, 6) stripping and etching unwanted copper, 7) applying solder mask, 8) solder coating pads, 9) silkscreening markings, and 10) cutting boards from panels. PCBs are inexpensive, reliable connectors that are mass produced using this standard process.

Uploaded by

Jay Jataniya
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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PCB Design and

Manufacturing Process

Printed Circuit Board


Electronic Board that connects circuit
components
PCB populated with electronic
components is a printed circuit assembly
(PCA)
PCBs are rugged, inexpensive, and can be
highly reliable
Mass manufacturing
Professional

Conducting layers are typically made of


thin copper foil.
The board is typically coated with a
solder mask that is green in color. Other
colors that are normally available are
blue and red.

Unwanted copper is removed from the


substrate after etching leaving only
the desired copper traces or pathways

Components
Pads
Traces
Vias
Top Metal Layer
Bottom Metal Layer

Components are the actual devices


used in the circuit.
This includes input/output connections.
I/O ports, including power supply
connections, are also important in the
PCB design.

Location that components connect to.


You will solder components to the pads
on the PCB.
Pads will connect to traces.
Pads have an inner diameter and outer
diameter.

Traces connect pads together.


Traces are essentially the wiring of the
PCB.
Equivalent to wire for conducting
signals
Traces sometimes connect to vias.
High current traces should be wide.
Signal traces usually narrower than
power or ground traces

Pad with a plated hole connecting


traces from one layer of board to other
layers.
Attempt to minimize via use in your
PCBs.
Some component leads can be used
as vias.

Most of the components


reside on the top layer
Fewer traces on the top
layer
Components are soldered
to the pads on the top
layer of PCB
Higher circuit densities

Few components on this layer.


Many traces on this layer.
Most soldering done on this layer.

Often, many signal wires need to exist


in too small of a space and must
overlap.
Running traces on different PCB layers
is an option.
Multilayer PCBs are often expensive.
Solution: use jumpers

Protect copper traces on outer layers from


corrosion
Areas that shouldn't be soldered may be
covered with polymer resist solder mask
coating
Designed to keep solder only in certain
areas
Prevents solder form binding between
conductors and thereby creating short
circuits

Printing on the solder mask to


designate component locations
Readable information about component
part numbers and placement.
Helpful in assembling, testing and
servicing the circuit board.

More then a top and bottom layer.


Typically there will be a power plane,
ground plane, top layer, and bottom
layer.
Sometimes signal layers are added as
needed.
Sometimes RF planes made of more
expensive materials are added.

1.

Film Generation

2. Shear Raw Material

3. Drill Holes

Industry standard
0.059" thick, copper
clad, two sides

4. Electrolus copper

Apply copper in hole barrels

5. Apply Image

Apply Photosensitive Material to


develop selected areas from
panel

6. Strip and Etch

Remove dryfilm, then


etch exposed copper
Tin protects the copper
circuitry from being
etched

7. Solder Mask

Apply solder mask area to


entire board with the exception
of solder pads

8. Solder Coat

Apply solder to pads

9. Silkscreen

Apply white letter marking


using screen printing
process

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