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Electronic Circuits and PCB

Design (21ECC101J)

Dr. Aarti Sharma

ASSISTANT PROFESSOR
DEPARTMENT OF ECE
SRM IST, DELHI NCR CAMPUS
Unit- IV
 Learning outcomes 2

At the end of this module students will apply

the concept and rules for PCB design.
 Contents 3
 Concept of PCB Design
 Classifications and manufacturing of PCB
 Layout planning and Design block diagram
 Mechanical Design of PCB
 Stress analysis
 Electrical Design Consideration of PCB
 Rules for Component Placement in PCB
 Rules for Power supply and Ground,
 Connections layout and component assembly in PCB
Concept of PCB Design 4
 The use of miniaturization and sub-miniaturization in
electronic equipment design gave birth to a new
technique in inter-component wiring and assembly
that is popularly known as the printed circuit board.
Advantages of Printed Circuit Boards 5
 The size of component assembly is reduced with a
corresponding decrease in weight.
 Quantity production can be achieved at lower unit
cost.
 Component wiring and assembly can be
mechanized.
 Circuit characteristics can be maintained without
introducing variation in inter-circuit capacitance.
 They ensure a high level of repeatability and offer
uniformity of electrical characteristics from
assembly to assembly.
Classification of Printed Circuit Boards 6
 Single-sided Printed Circuit Boards
Double-sided Printed Circuit Boards 7
Rigid and Flexible Printed Circuit Board 8
 Rigid boards are made up from the variety of
materials while flexible boards are made up
from flexible substrate material like polyester.
 Rigid Flex board are made up from rigid and
flexible boards that are merged together.
Layout Planning and Diagram 9
The printed circuit layout is basically a sketch that
represents the printed wiring on the substrate, the
physical size and location of all electronic and
mechanical components and the routing of conductors
which interconnect the electronic parts.
 Mechanical Design of PCB 1
The PCB provides mechanical support and connectivity to the
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components mounted on it. It is therefore necessary for the PCB
designer to know the overall physical size of the board (outline
dimensions), position of mounting holes, height restrictions and related
details. The following are the main mechanical design considerations
for the PCB:
 Optimal board size compatible with the PCB manufacturing process;
 Position of board mounting holes, brackets, clamps, clips, shielding
boxes and heat sinks.
 Proper fixation arrangement for heavy components.
 Proper hole diameter for component mounting.
 Assembled board to withstand the mechanical stress and vibrations
occurring in transportation.
Stress analysis 1
 PCB stress testing is the evaluation of a circuit board’s ability to1
withstand or endure forces or parameter strains. The objective
of this testing is to determine the ranges within which the board
will maintain its structural integrity and functionality.
Electrical Design Consideration of PCB 1
A multi-layer board is a high performance, high speed system. At higher
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frequencies, the signal rise times decrease and consequently, signal reflections
and line lengths become critical.
 Dielectric Constant: The dielectric constant of the laminate material plays a
major role in the determination of impedance, propagation delay and
capacitance. The dielectric constant of the epoxy glass used for the
laminate and the prepreg can be controlled by varying the percentage of
the resin content.
 The epoxy resin has a dielectric constant of 3.45 and glass of 6.2.
Depending upon the percentage of these materials, the dielectric constant
of epoxy glass can be achieved from 4.2 to 5.3. The thickness of the
laminate is a good indicator for determining and controlling the dielectric
constant.
 Prepreg materials with low relative dielectric constants are suitable for use
in radio frequency and microwave engineering. The low dielectric constant
gives rise to a low signal delay at radio and microwave frequencies.
Rules for Component Placement in PCB 1

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In a highly sensitive circuit, the critical components are
placed first and in such a manner as to require minimum
length for the critical conductors.
 In a less critical circuit, the components are arranged
exactly in the order of signal flow. This will result in a
minimum overall conductor length.
 In a circuit where a few components have considerably
more connecting points than the others, these key
components have to be placed first and the remaining
ones are grouped around them.
 The general rule is to place first components, whose
position is fixed for the final fitting and interconnections,
Rules for Component Placement in PCB 1
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 Components should be placed on the grid of 2.5 mm.
 Among the components, larger components are placed
first and the space in between is filled with smaller ones.
 All the components should be placed in such a manner
that disordering of other components is not necessary if
they have to be replaced.
 Components should be placed in a row or a column, so
that it gives a good overview.
Rules for Power Supply and 1
Ground 5 that
 When several supply voltages are used in a circuit, it must be ensured
the ground conductor has the capacity to carry the combined load under the
worst case condition. A rule of thumb for deciding the width of conductors
for various purposes is:
Wground > Wsupply > Wsignal
Where
Wground = conductor width of ground line
Wsupply = conductor width of supply line
Wsignal = conductor width of signal line.
 The fundamental rule for TTL circuits is
Wground ≥ 2 Wsupply
Wsupply ≥ 2 Wsignal
 Connection Layout and Component 1
Assembly in PCB 6
Certain limits should be taken into account in order to maximize
manufacturability and thereby minimize cost. Also, the human
factors should be considered before designing is undertaken.
These factors are delineated below.
 Conductor spacing less than 0.1mm will not work with the
etching process, because the etchant fluid does not circulate
efficiently in narrower spaces resulting in incomplete metal
removal.
 Features with a conductor width smaller than 0.1 mm will lead
to breakage and damage during etching.
 The land size should be at least 0.6 mm greater than the hole
Connection Layout and Component 1
Assembly in PCB 7
The following parameters are taken into considerations for
design from the point of view of assembly of printed circuit
boards:
 Properly locate smaller components so that they are not
shadowed by large components.
 Solder mask thickness should not be greater than 0.05
mm.
 Screen print legend must not interface with any solder
pad.
 The top half of the board should be a mirror of the bottom
Connection Layout and Component 1
Assembly in PCB 8

 Soldering techniques and equipment for

assembly also impose many restrictions on the
board design and layout. For example, in wave
soldering, the maximum sizes of the slots,
edge clearances and handling clearances are
important parameters. Also, the designers
must be aware of what the final product will be
and try to protect its most sensitive parts, as
far as possible.
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Thanks