AMD EMBEDDED

SOLUTIONS
Welcome to the Revolution
1 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 2017: Year of Revolution for AMD

DESKTOP MOBILE

2 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 AMD EMBEDDED CPU PRODUCTS* TDP Range 4-15 Process Node 14nm

HSA Compliant HSA

Max # of Cores/ 4/8

Threads

2016 2017 2018 2019 2020

“Snowy Owl” x86 CPU “Next Gen” x86 CPU

14nm 16/32 35-100 7nm 16/32 35-100

AMD’s next generation x86 “Zen” core

V1000 x86 CPU V2000 x86 CPU

AMD’s next generation x86 “Zen” core
14nm 4/8 12-65 7nm 8/16

“Merlin Falcon” x86 CPU R1000 x86 CPU R2000 x86 CPU

28nm HSA 4 12-35 14nm 2/4 4.5-15 7nm 4/8

AMD’s next generation x86 “Zen” core

G1000 x86 CPU G2000 x86 C

14nm 2/4 4.5-15 7nm 2/4

Products still in concept and

subject to change

*AMD roadmaps are subject to change without notice or obligations to notify of changes.
Placement of boxes is not intended to represent first year of product shipment.
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 AMD EMBEDDED APU PRODUCTS* TDP Range 4-15 Process Node 14nm

iTemp SKUs
Max # of Cores/ 4/8
Threads

TODAY 2017 2018 2019 2020

V1000 x86 APU V2000 x86 APU

14nm 4/8 12-65 7nm 8/16

“Merlin Falcon” x86 APU R1000 x86 APU R2000 x86 APU

28nm 4 12-35 14nm 2/4 4.5-15 7nm 4/8

“Brown Falcon” x86 APU G1000 x86 APU G2000 x86 APU

28nm 2 12-15 14nm 2/4 4.5-15 7nm 2/4 4-12

“Prairie Falcon” x86 APU

28nm 2 6-12 “LX2” x86 APU

28nm 2 6-10
“LX” x86 APU
Products still in concept and
28nm 2 5-15 subject to change

*AMD roadmaps are subject to change without notice or obligations to notify of changes.
4 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED Placement of boxes is not intended to represent first year of product shipment.
 AMD Embedded V-Series
V1000 APU
Next gen SOC featuring industry leading graphics
performance and high-performance “Zen” CPU Core

4 11 4 4K60 10
Up to
Dual
Zen Cores
14nm
5th Gen GCN
Compute Units
4K Displays
VP91 decode support 1GE Years Planned
Longevity
1. AMD does not provide a license/sublicense to any intellectual property rights relating to any standards, including but not
5 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED limited to any audio and/or video codec technologies such as AVC/H.264/MPEG-4, AVC, VC-1, MPEG-2, and DivX/xVid.
AMD V1000 PRELIMINARY SAMPLE SPEC (FP5)
SUBJECT TO CHANGE*

Core/Thread

Temp Range
TDP Range

Max DDR4
L2 Cache

L3 Cache

Ethernet
(Tdie Max)
GPU CU
[SIMD]
Count

Rate
SMT

ECC
APU
35-54W1 4/8 Y 2M 4M 11 3200 0C – 105C Yes 2

35-54W1 4/8 Y 2M 4M 8 3200 0C – 105C Yes 2

12-25W2 4/8 Y 2M 4M 8 2400 0C – 105C Yes 2

12-25W2 2/4 Y 1M 4M 3 2400 0C – 105C Yes 2

Extended Temp
15W 4/4 N 2M 4M 6 2400 -40C – 105C Yes 2

* Product plans and offerings are subject to change. AMD is under no obligation to notify customers of changes.
1. Default TDP = 45W
2. Default TDP = 15W

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AMD V1000 PRELIMINARY SAMPLE SPEC (AM4)
SUBJECT TO CHANGE*

Core/Thread

Temp Range
TDP Range

Max DDR4
L2 Cache

L3 Cache

Ethernet
(Tdie Max)
GPU CU
[SIMD]
Count

Rate
SMT

ECC
APU
45-65W 4/8 Y 2M 4M 11 3200 0C – 105C Yes 2

45-65W 4/8 Y 2M 4M 8 3200 0C – 105C Yes 2

NPU
45-65W 4/8 Y 2M 4M - 3200 0C – 105C Yes 2

* Product plans and offerings are subject to change. AMD is under no obligation to notify customers of changes.

7 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 RYZEN™ ROLL-OUT
RYZEN RYZEN RYZEN
Consumer
Premium
Desktop
Commercial

HEDT

Consumer
Premium MOBILE

Mobile
MOBILE
Commercial

Q1 Q2 Q3 Q4 1H18
8 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 3.7/3.5
AMD Ryzen™ 7 PRO 1700X 8/16 4+16MB 14nm 95W 2 years YD17XBBAM88AES
GHz

AMD Ryzen™ 7 3.7/3.0

8/16 4+16MB 14nm 65W 7 years YD170BBBM88AES
PRO 1700 GHz

AMD Ryzen™ 5 3.6/3.2

6/12 3+16MB 14nm 65W 7 years YD160BBBM6IAES
PRO 1600 GHz

3.7/3.5
AMD Ryzen™ 5 PRO 1500 4/8 2+16MB 14nm 65W 2 years YD150BBBM4GAES
GHz

3.7/3.5
AMD Ryzen™ 3 PRO 1300 4/4 2+8MB 14nm 65W 2 years YD130BBBM4KAES
GHz

3.4/3.1
AMD Ryzen™ 3 PRO 1200 4/4 2+8MB 14nm 65W 7 years YD120BBBM4KAES
GHz

9 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 AMD ENTERPRISE SERVER ROADMAP
14nm 8/16 120-180
Process Node Max Cores/ TDP Range
Threads

2016 2017 2018 2019 2020

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

In Definition
EPYC 7001 SoC “Rome” x86 CPU “Milan” x86 CPU
“Zen1” Cores “Zen2” Cores “Zen3” Cores
Socket SP3 Socket SP3
DDR4 DDR4
PCIe3 PCIe3/4
14nm 32/64 120-180 SOC 7nm >32/64 120-200 SOC 7nm+

Snowy Owl SoC

“Zen1” Cores
SP4
DDR4
PCIe3
14nm 16/32 25-100 SOC

Continuous Innovation Performance Leadership

Left Edge = Tapeout

10 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED Right Edge = Production
 UNLOCK THE POWER OF EPYC™
MODEL CORE/THREAD BASE / BOOST FREQ. MEMORY I/O TDP

EPYC™ 7601 32/64 2.2 / 3.2 GHz 180W

EPYC™ 7551 32/64 2.0 / 3.0 GHz 180W

EPYC™ 7501 32/64 2.0 / 3.0 GHz 155/170W

EPYC™ 7451 24/48 2.3 / 3.2 GHz 180W

EPYC™ 7401 24/48 2.0 / 3.0 GHz 8 Channels 128 155/170W

DDR4 DRAM Lanes PCIe®

EPYC™ 7351 16/32 2.4 / 2.9 GHz 155/170W

EPYC™ 7301 16/32 2.2 / 2.7 GHz 155/170W

EPYC™ 7281 16/32 2.1 / 2.7 GHz 155/170W

EPYC™ 7251 8/16 2.1 / 2.9 GHz 120W

Available as 1P-only SKU
11 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 COMPLETE FORM FACTOR SOLUTIONS
PCI-Express® Board MXM – Mobile PCI Express Module MCM – Multi Chip Module
‒ Complete graphic card device ‒ Complete graphic card device ‒ GPU chip with multiple memory
including display outputs except for display outputs chips integrated on the same
‒ Different heights and lengths Type B substrate
Maximum power: 100W
‒ Packaging the GPU and memory
Full Height Maximum size of 82 mm x 105 mm
together allows for smaller and
easier integration for custom
solutions

Type A
Low Profile (Half Height) Lower power: <50W
Maximum size of 82 mm x 70 mm

12 | Q3
AMD2017
ENTERPRISE
PRODUCTSOLUTIONS
ROADMAP || TAIPEI
VERSIONEMBEDDED
1.0 | AMD
TECHNICAL
CONFIDENTIAL
SEMINAR
– NDA
| AMD
REQUIRED
CONFIDENTIAL – NDA REQUIRED
 Process Node
PROPOSED AMD EMBEDDED GPU ROADMAP 40nm 28nm 14nm 7nm

2016 2017 2018 2019 2020

Ultra-High E9550 [MXM]

Navi12 [MXM/PCIe]
95W TDP, 36 CU
Performance 8GB, 2019 LTS Vega12 [PCIe]
35W TDP, 20 CU
4GB (HBM2)

Navi10 [MXM/PCIe]

E9260 [MXM/PCIe]
50W TDP, 14 CU
High 4GB, 2021 LTS
Performance

E9170 [MCM/MXM/PCIe] Navi11 [MCM/MXM/PCIe]

40W TDP, 8 CU
4GB, 2024 LTS
E6465 [MCM/MXM/PCIe]
Power 35W TDP, 64b, 2 CU
Efficient 2GB, 2020 LTS

Products still in concept and

subject to change
*AMD roadmaps are subject to change without notice or obligations to notify of changes.
13 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED Placement of boxes is not intended to represent first year of product shipment.
 Process Node
AMD RADEON PRO ROADMAP 40nm 28nm 14nm 7nm

2016 2017 2018 2019 2020

Ultra-High WX7100 [MXM]

135W TDP, 36 CU
Performance 8GB, 2019 LTS

WX5100 PCIe
75W TDP, 28 CU
8GB, 2019 LTS

WX4100 PCIe
High 50W TDP, 16 CU
Performance 4GB, 2019 LTS

WX3100 PCIe
35W TDP, 8 CU
4GB, 2020 LTS
Power
Efficient WX2100 PCIe
35W TDP, 8 CU
2GB, 2020 LTS Products still in concept and
subject to change
*AMD roadmaps are subject to change without notice or obligations to notify of changes.
14 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED Placement of boxes is not intended to represent first year of product shipment.
15 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 EMBEDDED VERTICAL MARKET VALUE PROPOSITION
VALUE PROPOSITION
• High definition, multi display support
THIN CLIENT • Performance per Watt per $
• Scalability & longevity

• Migration to x86 for SDN & NFV

NETWORKING • Performance per Watt per $
• Scalability, longevity, ECC, Ethernet

• High definition, multi display support

CASINO GAMING • High performance dGPU
• Custom dGPU form factors

• High definition, multi display support

• Performance per Watt per $
PACHINKO • Optimized UVD/GPU performance &
interop
• X86, Windows & display support for IPC &
HMI market
INDUSTRIAL • dGPU in T&M and aerospace
• Second source in SBC market

• GPU Compute for FPGA replacement

IMAGING • High definition display support on dGPU
• Wide range of CPU for control

• High definition, multi display support

MEDIA & COLLABORATION • High performance multi media
16 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
• Scalability & longevity
 EMBEDDED MARKETING ORGANIZATION

Stephen Turnbull
Embedded Marketing

Amey Deosthali
Katie Eckermann Ralph Gonzalez David Rosado
Imaging, Media, &
Special Projects Thin Client Industrial
Collaboration

Mitch Furman Piotr Weglicki Simon Vivera

Casino Gaming Networking Pachiko/Pachislot

Austin

Markham

17 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 EMBEDDED STRATEGY
VERTICAL MARKET SEGMENT FOCUS

1. DEFEND THE BASE

• Maintain franchises in Thin Client & Casino
Gaming

2. DRIVE STRATEGIC GROWTH

• Establish Networking market position with
Snowy Owl

3. FOCUS ON HIGH ROI

• Leverage corporate investment
• Pachinko, Industrial, Imaging & Collaboration
2015 2020
TC CG PC/PS IM IC&A Comms

18 | AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
ZEN BASED DESIGN WINS
SEVERAL MILLIONS OF $

 Several large design wins across the full

range of our markets for Zen based
products
 Several customers evaluating
V1000, EPYC, and Snowy Owl
 Huge demand for V1000
 Beta customer demand exceeds
planned allocation
 EPYC and Snowy Owl provides unique
value proposition in the embedded
Networking Casino Gaming Pachinko Thin Client Imaging Industrial markets

Snowy Owl V1000 EPYC

19
| AMD ENTERPRISE SOLUTIONS | TAIPEI EMBEDDED TECHNICAL SEMINAR | AMD CONFIDENTIAL – NDA REQUIRED
 EMBEDDED IMAGE PROCESSING IMPACTS MANY SEGMENTS
MEDICAL PRINTING ENTERPRISE

INDUSTRIAL GAMING AUTOMOTIVE

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 Unified Memory

We are the Leader in

Embedded Image
Processing
GPU CPU

PARALLEL SERIAL
WORKLOADS WORKLOADS

High performance CPU and GPU Radeon Open Compute (ROCm) Supporting non-proprietary
standards and SW APIs
Support for x86, ARM, and POWER
Founding member: HSA, CCIX, Gen-Z, and OpenCAPI
Support for porting of
Supporting OpenCL, HIP, HCC, OpenGL, D3D11
CUDA applications

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 DISCLAIMER

The information contained herein is for informational purposes only, and is subject to change without notice. While every precaution has been taken in the preparation of this
document, it may contain technical inaccuracies, omissions and typographical errors, and AMD is under no obligation to update or otherwise correct this information. Advanced Micro
Devices, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this document, and assumes no liability of any kind, including the
implied warranties of noninfringement, merchantability or fitness for particular purposes, with respect to the operation or use of AMD hardware, software or other products described
herein. No license, including implied or arising by estoppel, to any intellectual property rights is granted by this document. Terms and limitations applicable to the purchase or use of
AMD’s products are as set forth in a signed agreement between the parties or in AMD's Standard Terms and Conditions of Sale.
AMD's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or
environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.
AMD does not provide a license/sublicense to any intellectual property rights relating to any to any standards, including but not limited to any audio and/or video codec technologies
such as AVC/H.264/MPEG-4, AVC, VC-1, MPEG-2, and DivX/xVid.

AMD, the AMD Arrow logo, AMD Catalyst, AMD CrossFire, AMD CrossFireX, AMD Radeon, ATI Radeon, and combinations thereof are trademarks of Advanced Micro Devices, Inc.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
Windows and DirectX are registered trademarks of Microsoft Corporation. ARM is a registered trademark of ARM Limited. 3DMark is a trademark of Futuremark Corporation. DivX is a
registered trademark of DivX, Inc. HDMI is a trademark of HDMI Licensing, LLC. Linux is a registered trademark of Linus Torvalds. OpenCL is a trademark of Apple Inc. used by
permission of Khronos. PCIe and PCI Express are registered trademarks of PCI-SIG Corporation.

© 2017 Advanced Micro Devices, Inc. All rights reserved.

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