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Vinod Physical Design 3+years Exp-1

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124 views4 pages

Vinod Physical Design 3+years Exp-1

Uploaded by

vinod
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© © All Rights Reserved
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You are on page 1/ 4

Gaddam Vinod Babu

vinodece7447@gmail.com
+91 8431297978

SUMMARY 3+ years of experience in Physical Design.


 Have experience on floorplan,placement, CTS ,route and signoff .
 Experience in working on 5nm, 7nm and 16nm technologies from leading
foundries Samsung, TSMC.
 Involved in 4 different projects and responsible for block level design
implementation.
 Have Experience using Synopsys tools like DC, ICC2, PT and Calibre.
 Have Knowledge in using Cadence tools like Innovus, Genus.
 Experience on multi voltage design.
 Created voltage islands for Feedthroughs.
 Have Experience in Static Timing Analysis and Low power design techniques.
 Have experience crosstalk fixing, OCV, AOCV and POCV.
 Good Knowledge in writing scripts using Tcl and Perl.
 Have knowledge on Synthesis, DFT and RTL coding using Verilog.
 Have experience in fixing base and metal DRC’s.
 Experience in timing closure at MMMC’s.
 Have experience in fixing timing violations and aslo good understanding of
Synopsis Design Constraints.
 Energized by new challenges; capable of working on own initiative as well as in
team.

ADDITIONAL
QUALIFICATIONS
/AFFILIATIONS

 Secured AIR 7042 in GATE.

EMPLOYMENT
HISTORY

Aug 2020 – till date


DIGICOMM ( QUALCOMM (CLIENT) )

July 2018-August 2020


ALTRAN

EDUCATION

M.Tech – VLSI Design and Embedded System Design (2016- 2019)


Gayatri Vidya Parishad College of Engineering, Obtained: 9.1 CGPA
B.Tech – Electronics and Communication Engineering (2011- 2015)
Lakki Reddy Bali Reddy College of Engineering, Mylavaram, Obtained: 85%

1|P age
PROJECT
EXPERIENCE

Project1- Qualcomm

Description
 Technology Node : 5nm, 12layers
 No. of Blocks handled : 2
 Inst Count : 1 million
 Frequency : 1Ghz
 Macros : 42
 Tools : Icc2 (1st block), cadence Innovus (2nd block)

Responsibilities
 Responsible for hm level implementation from floorplan to signoff.
 Created volatge islands for feedthroughs.
 Performed Macro placement and provided proper channel spacing to avoid
channel congestion.
 Analysed and fixed congestion applying various techniques like using partial
blockages, cell padding, congestion driven placement and congestion driven
restructuring.
 Fixed Max cap, data max tran and clock max tran violations.
 Fixed special max tran violations.
 Implemented timing ecos for setup and hold.
 Fixed secondary grid resistance violations by redrawing the secondary grid.
 Fixed dynamic PDN violations by spreading the clustered cells, appying M2 ,M4
shunting techniques and Decap insertion.
 Fixed antenna violations by applying antenna diodes and metal jumping
techniques.
 Fixed base and metal drcs .
 Fixed PG and signal shorts.
 Ran through FV, PDN, CLP,PV sign off flows.
 Implemented TCL script to fix mismatch fillers, responsible for base violations.
Responsibilities

Project2 - Intel

Description  Technology Node : 7nm, 16 layers


 No. of Blocks handled : 2
 Inst Count : 500k
 Frequency : 450 MHz
 Macros : 55
 Tools : Synopsys Dc,Icc2, PT compiler, Menter graphics calibre.

Responsibilities  Responsible for block level implementation from floorplan to Signoff.


 Fixed TCIC errors in design by following TSMC guidelines.
 Congestion and Timing were the challenges faced.

2|P age
 Written Tcl script to solve boundary cell continuity issue after macro placement.
 Analysed and fixed congestion in various stages by applying different techniques.
 Fixing timing issues in placement stage using path grouping and bound creation.
 Fixed icg setup timing violations, pulse width violations and hold timing issues
in CTS
 Implemented timing ECO’s for DRC, setup, hold, noise, power recovery.
 Fixed timing Drvs like Slow slope and Max cap violations.
 Fixed side branch on output , Logic on Clock Path and Dangling in nets.
 Fixed shorts.
 Fixed Base DRC by applying placement blockages around the pads by following
TSMC guidelines, this is done using tcl scripting.
 Fixed metal DRC like metal spacing , via enclouser, via spacing, cut metal
spacing issues.

Project 3

Description  Technology Node : 16nm/10 layers


 Inst Count : 150k
 Frequency : 1 GHz
 Macros :4
 Tools : Synopsys Icc2, PT compiler and Mentor graphics caliber.
Responsibilities
 Worked on block level design with multiple power domains.
 Created volatge areas for different power domains.
 Worked on floor plan and PnR of the design using Synopsys ICC2 tool.
 Congestion and timing issues are resolved by using various techniques.
 Did signal integrity checks (DRV) and repairs for the design.
 Implemented timing eco at post route stage.

Project 4

Description  Technology No : 16nm/10 layers


 Inst Count : 120k
 Frequency : 500 MHz
 Macros : None
 Tools : Synopsys Icc2, PT compiler and Mentor graphics calibre

Responsibilities  Performed floorplan to route.


 Fixed congestion issue by applying various techniques.
 Solved timing problems using different techniques like increasing placement
effort, creating bounds, creating path groups applying weightage and critical
range to path groups and trail cts for fixing icg violations.
 Fixes timing issues with the help of swaps, upsize and net improvement.
 Implemented ECOs for timing.
 Written TCL scripts to reduce cell density (congestion) as well as routing density

3|P age
for a design.
 Fixed shorts.
 Ran calibre for fixing base and metal drcs.

4|P age

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