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Quectel HCM111Z Bluetooth Module Specification V1.0

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0% found this document useful (0 votes)
64 views2 pages

Quectel HCM111Z Bluetooth Module Specification V1.0

Uploaded by

Nayana PS
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Quectel HCM111Z

15.0 mm
BLE 5.3 Module
Compact LCC Package
12.0 mm 2.25 mm

HCM111Z is a high-performance MCU Bluetooth module launched by Quectel. It boasts a Cortex-M3 processor with
a frequency of up to 48 MHz and supports BLE 5.3 with a maximum data rate up to 2 Mbps. The module features
built-in 48 KB SRAM and 512 KB flash, ensuring efficient performance.

HCM111Z is in a LCC form factor with an ultra-compact size of 15.0 mm × 12.0 mm × 2.25 mm, which optimizes the
size and cost for end-products and is compatible with diverse designs.

HCM111Z supports up to 13 GPIOs for UART, SWD, SPI, I2C, ADC, PWM and I2S* functions in QuecOpen® solution,
and Bluetooth low power mode, which provides flexibility and versatility for a range of applications, especially in
smart homes and industrial IoT scenarios.

HCM111Z has a built-in Codec, which can realize microphone pickup and audio playback, and is suitable for smart
devices such as smart voice remote controls, smart toy cars, sports health and home appliances. The
multi-connection capability of the module supports dozens of devices to form a communication network, which can
be applied in scenarios where multiple devices such as large charging stations and micro inverters are connected. In
addition, HCM111Z is also widely used in fields such as meters and sensors.

Key Features

BLE 5.3

48 KB SRAM and 512 KB flash Compact Size


BLE 5.3 LCC Form Factor

Built-in Codec

Multi-link network

Operating temperature range: -40 °C to +85 °C Multiple Operating Temperature


Interfaces Range: -40 °C to +85 °C
RF coaxial connector, external antenna pin, PCB antenna (Optional)

13 GPIOs for UART, SWD, SPI, I2C, ADC, PWM and I2S* functions in
QuecOpen® solution

Version:1.0 Status:Released

EMAIL US: info@quectel.com VISIT US: www.quectel.com


Quectel HCM111Z
BLE 5.3 HCM111Z

Bluetooth Protocol BLE 5.3

Encryption Mode TRNG, AES128 ECB

Operating Mode BLE (Bluetooth Low Energy)

Kernel ARM Cortex-M3 (up to 48 MHz)

SRAM 48 KB

Flash 512 KB

Dimensions 15.0 mm × 12.0 mm × 2.25 mm

Weight Approx. 0.62 g

Temperature Range

Operating Temperature Range -40 °C to +85 °C

Storage Temperature Range -45 °C to +95 °C

Certifications

Europe: CE
America: FCC
Canada: IC
Regulatory
China: SRRC
Korea: KC
Australia/New Zealand: RCM

Other Certification Bluetooth

Interfaces

Antenna Interface × 1 (RF coaxial connector, external antenna pin, PCB antenna) (Optional)

Other Interfaces UART/ SWD/ SPI/ I2C/ ADC/ PWM/ I2S*, etc.

Electrical Features

Power Supply Voltage 1.8–4.3 V, Typ. 3.3 V

RF Performance

Receiver Sensitivity Transmit Power

1 Mbps -95 dBm ±2 dB ≤ 10 dBm


BLE
2 Mbps -90 dBm ±2 dB ≤ 10 dBm

Ordering Code Flash Operating Temperature Range Antenna Development Board (Only for Debugging)

HCM111ZAAMD-0L 512 KB -40 °C to +85 °C External pin antenna -

HCM111ZAAMD-0P 512 KB -40 °C to +85 °C PCB antenna HCM111ZAATB-0P

HCM111ZAAMD-4X 512 KB -40 °C to +85 °C RF coaxial connector HCM111ZAATB-4X

NOTE:
1.: See hardware design manual for details of the module interfaces.
2. *: Under development.

Copyright © 2023 Quectel Wireless Solutions Co., Ltd. All Rights Reserved http://www.quectel.com
HQ address: Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai 200233, China
Tel: +86 21 51086236 Email: info@quectel.com

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