Quectel HCM111Z Bluetooth Module Specification V1.0
Quectel HCM111Z Bluetooth Module Specification V1.0
15.0 mm
BLE 5.3 Module
Compact LCC Package
12.0 mm 2.25 mm
HCM111Z is a high-performance MCU Bluetooth module launched by Quectel. It boasts a Cortex-M3 processor with
a frequency of up to 48 MHz and supports BLE 5.3 with a maximum data rate up to 2 Mbps. The module features
built-in 48 KB SRAM and 512 KB flash, ensuring efficient performance.
HCM111Z is in a LCC form factor with an ultra-compact size of 15.0 mm × 12.0 mm × 2.25 mm, which optimizes the
size and cost for end-products and is compatible with diverse designs.
HCM111Z supports up to 13 GPIOs for UART, SWD, SPI, I2C, ADC, PWM and I2S* functions in QuecOpen® solution,
and Bluetooth low power mode, which provides flexibility and versatility for a range of applications, especially in
smart homes and industrial IoT scenarios.
HCM111Z has a built-in Codec, which can realize microphone pickup and audio playback, and is suitable for smart
devices such as smart voice remote controls, smart toy cars, sports health and home appliances. The
multi-connection capability of the module supports dozens of devices to form a communication network, which can
be applied in scenarios where multiple devices such as large charging stations and micro inverters are connected. In
addition, HCM111Z is also widely used in fields such as meters and sensors.
Key Features
BLE 5.3
Built-in Codec
Multi-link network
13 GPIOs for UART, SWD, SPI, I2C, ADC, PWM and I2S* functions in
QuecOpen® solution
Version:1.0 Status:Released
SRAM 48 KB
Flash 512 KB
Temperature Range
Certifications
Europe: CE
America: FCC
Canada: IC
Regulatory
China: SRRC
Korea: KC
Australia/New Zealand: RCM
Interfaces
Antenna Interface × 1 (RF coaxial connector, external antenna pin, PCB antenna) (Optional)
Other Interfaces UART/ SWD/ SPI/ I2C/ ADC/ PWM/ I2S*, etc.
Electrical Features
RF Performance
Ordering Code Flash Operating Temperature Range Antenna Development Board (Only for Debugging)
NOTE:
1.: See hardware design manual for details of the module interfaces.
2. *: Under development.
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