Lecture9 & 10
Lecture9 & 10
ELL732
Lecture 9 & 10
Dhiman Mallick
Department of Electrical Engineering, IIT Delhi
1
Semester I – 2024 - 2025
Carrier Transport Mechanisms
The net flow of the electrons and holes in a semiconductor will generate currents.
If we have a positive volume charge density ρ moving at an average drift velocity vd, the drift current density is
given by
where Jp|drf is the drift current density due to holes and vdp is the average drift velocity of the holes.
The equation of motion of a positively charged hole in the presence of an electric field is
where e is the magnitude of the electronic charge, a is the acceleration, E is the electric field, and m*cp is the
conductivity effective mass of the hole.
Drift Current Density
• As the hole accelerates in a crystal due to the electric field, the velocity increases.
• When the charged particle collides with an atom in the crystal, the particle loses most, or all, of its energy.
• The particle will again begin to accelerate and gain energy until it is again involved in a scattering process.
This continues over and over again.
• Throughout this process, the particle will gain an average drift velocity which, for low electric fields, is
directly proportional to the electric field.
Mobility: Defines how well a particle will move due to an electric field within a semiconductor. The unit of
mobility is expressed in terms of cm2/V-s.
Drift Current Density
Drift current density due to holes is given as
The drift current due to holes is in the same direction as the applied electric field.
The average drift velocity of an electron is also proportional to the electric field for small fields. However, since
the electron is negatively charged, the net motion of the electron is opposite to the electric field direction.
The total drift current density is the sum of the individual electron and hole drift current densities:
Typical random behaviour of a hole in a semiconductor (a) without an electric field and (b) with an electric field.
The hole mobility is given by: m*cp/cn are the mean time between
collisions for a hole or an electron
The electron mobility is given by: τcp/cn are the mean time between
collisions for a hole or an electron
Mobility Effects
There are two collision or scattering mechanisms that dominate in a semiconductor and affect the carrier
mobility:
Lattice scattering is related to the thermal motion of atoms, the rate at which the scattering occurs is a
function of temperature.
If we denote µL as the mobility that would be observed if only lattice scattering existed, the scattering
theory states that to first order
(a) Electron and (b) hole mobilities in silicon versus temperature for various doping concentrations.
Mobility Effects
Ionized impurity scattering: Impurities are ionized at room temperature so that a coulomb interaction
exists between the electrons or holes and the ionized impurities.
This coulomb interaction produces scattering or collisions and also alters the velocity characteristics of the
charge carrier.
If we denote µI as the mobility that would be observed if only ionized impurity scattering existed, then to
first order we have
If temperature increases, the random thermal velocity of a carrier increases, reducing the time the carrier
spends in the vicinity of the ionized impurity center. The less time spent in the vicinity of a coulomb force,
the smaller the scattering effect and the larger the expected value of µI
If the number of ionized impurity centers increases, then the probability of a carrier encountering an
ionized impurity center increases, implying a smaller value of µI
Mobility Effects
Then,
The electron mobility and diffusion coefficient are not independent parameters.
Graded Impurity Distribution
In many semiconductor devices, there may be regions that are nonuniformly doped.
The relation between the mobility and diffusion coefficient is known as the Einstein relation.
High Field Effects
It is assumed that the drift current is proportional to the electric
field and that the proportionality constant σ is not a function of
field E. This assumption is valid over a wide range of E.
However, large electric fields (> 103 V/cm) can cause the drift
velocity and therefore the current to exhibit a sublinear
dependence on the electric field.
In many cases an upper limit is reached for the carrier drift velocity
in a high field. This behaviour is typical of Si, Ge, and some
other semiconductors.
This limit occurs near the mean thermal velocity (≃107 cm/s) and
represents the point at which added energy imparted by the field is A decrease in electron velocity at high fields
transferred to the lattice rather than increasing the carrier velocity. for GaAs and certain other materials results
in negative conductivity and current
The result of this scattering limited velocity is a fairly constant instabilities in the sample.
current at high field.
(a) A Si bar 1 µm long and 100 µm2 in cross-sectional area is doped with 1017 cm-3 phosphorus. Find the current at 300
K with 10 V applied.
(b) How long does it take an average electron to drift 1 µm in pure Si at an electric field of 100 V/cm? Repeat for 105
V/cm.
In an n-type semiconductor bar, there is an increase in electron concentration from left to right and an electric field
pointing to the left. With a suitable sketch, indicate the directions of the electron drift and diffusion current flow and
explain why. If we double the electron concentration everywhere, what happens to the diffusion current and the drift
current? If we add a constant concentration of electrons everywhere, what happens to the drift and diffusion currents?
References