Bluetooth Module Datasheet

Model: HY-BTM525

Version: V1.2

2020-04-23

Shenzhen Huayang Xinke Electronics Co., Ltd

Mob: (086)13480952801

E-mail: info@hyxkiot.com

Web: www.hyxkiot.com

Baoan, Shenzhen

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List of Contents

1 Introduction.................................................................................................................................................... 3

2 Key Features.................................................................................................................................................. 3

3 Applications................................................................................................................................................... 4

4 Block Diagram...............................................................................................................................................4

5 General specifications............................................................................................................................. 4

6 Module Package Information................................................................................................................ 5

6.1 Pinout Diagram and package dimensions......................................................................... 5

6.2 Module Pin descriptions.............................................................................................................. 6

7 Electrical Characteristics................................................................................................................... 10

7.1 Absolute Maximum Ratings.................................................................................................... 10

7.2 Recommended Operating Conditions............................................................................... 10

8 Recommended reflow temperature profile................................................................................ 11

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1 Introduction
Shenzhen Huayang Xinke Electronics Co., Ltd introduces the pioneer
of the Bluetooth 5.0 modules HY-BTM525 which is a high performance, cost
effective, low power and compact solution. The Bluetooth module provides a
complete 2.4GHz Bluetooth system based on the QCC5125 BGA chipset which
is a single chip radio and baseband IC for Bluetooth 2.4GHz systems. This
module is fully qualified single-chip dual mode Bluetooth@v5.0 system.

2 Key Features
BTM525(QCC5125) Features
 Qualified to Bluetooth® v5.0 specification
 120 MHz Qualcomm® Kalimba™ audio DSPs
 32 MHz Developer Processor for applications
 Firmware Processor for system
 Flexible QSPI flash programmable platform
 Advanced audio algorithms
 High-performance 24-bit stereo audio interface
 Digital and analog microphone interfaces
 Active Noise Cancellation:Feedforward, Feedback,Hybrid
 Serial interfaces: UART, Bit Serializer (I²C/SPI),USB 2.0
 Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery
charger
 20 PIOs, 5 LED pads with PWM
Application subsystem
 Dual core application subsystem 32 MHz operation
 32-bit Firmware Processor:
Reserved for system use
Runs Bluetooth upper stack, profiles, house-keeping code
 32-bit Developer Processor:Runs developer applications
 Both cores execute code from external flash memory using QSPI clocked at 32
MHz
 On-chip caches per core allow for optimized performance and power
consumption
Bluetooth subsystem
 Qualified to Bluetooth v5.0 specification including 2 Mbps Bluetooth low energy
(Production parts)
 Single ended antenna connection with on-chip balun and Tx/Rx switch
 Bluetooth, Bluetooth low energy, and mixed topologies supported
 Class 1 support

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3 Applications

 Wired/wireless stereo headsets/headphones

 Qualcomm TrueWireless™ stereo earbuds
 USB to Bluetooth dongle

4 Block Diagram

5 General specifications

Model Name BLM-BTM525

Product Description Bluetooth 5.0 Class 2 Module
Bluetooth Standard Bluetooth 5.0
Chipset QCC5125 BGA
Dimension 13mm x 18mm x 2.5mm
Operating Conditions
Voltage 2.8~4.2V
Temperature -10～+70℃
Storage Temperature -40～+85℃
Electrical Specifications
Frequency Range 2402～2480MHz
Maximum RF Transmit Power 9dBm
π/4 DQPSK Receive Sensitivity -91dBm
8DPSK Receive Sensitivity -81dBm

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6 Module Package Information

6.1 Pinout Diagram and package dimensions

Unit：MM

Recommended PCB layout footprint

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 6.2 Module Pin descriptions

Pin# Pin Name Pin type Description

1 NC NC NC
Digital: Bidirectional with Programmable I/O line 19.
2 PIO[19] programmable strength internal Alternative function:
pull- up/pull-down PCM_DIN[0]
3 PIO[18] Digital: Bidirectional with Programmable I/O line 18.

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 programmable strength internal Alternative function:
pull- up/pull-down PCM_DOUT[0]
Digital: Bidirectional with Programmable I/O line 17.
4 PIO[17] programmable strength internal Alternative function:
pull- up/pull-down PCM_SYNC
Digital: Bidirectional with Programmable I/O line 16.
5 PIO[16] programmable strength internal Alternative function:
pull- up/pull-down PCM_CLK
Digital: Bidirectional with Programmable I/O line 15.
6 PIO[15] programmable strength internal Alternative function:
pull- up/pull-down MCLK_OUT
7 VBAT_SENSE Analog Battery voltage sense input.
USB Full Speed device D- I/O. IEC-61000-4-2
8 USB_DN Digital
(device level) ESD Protection
USB Full Speed device D+ I/O. IEC-61000-4-2
9 USB_DP Digital
(device level) ESD Protection
10 VCHG Supply Charger input to Bypass regulator.
Charger input sense pin after external mode
sense-resistor. High impedance.
11 VCHG_SENSE Analog
NOTE If using internal charger or no charger,
connect VCHG_SENSE direct to VCHG.
External charger transistor current control. Connect
12 CHG_EXT Analog to base of external charger transistor as per
application schematic.
Typically connected to an ON/OFF push button.
Boots device in response to a button press when
power is still present from battery and/or charger but
software has placed the device in the OFF or
13 SYS_CTRL Digital input
DORMANT state. Additionally useable as a digital
input in normal operation. No pull.
Additional function:
PIO[0] input only
14 VBAT Supply Battery voltage input.
15 GND Ground Ground
Analog or digital input/ open drain General-purpose analog/digital input or open drain
16 AIO[0]/LED[0]
output. LED output.
Analog or digital input/ open drain General-purpose analog/digital input or open drain
17 AIO[1]/LED[1]
output. LED output.
Analog or digital input/ open drain General-purpose analog/digital input or open drain
18 AIO[2]/LED[2]
output. LED output.
Analog or digital input/ open drain General-purpose analog/digital input or open drain
19 AIO[4]/LED[4]
output. LED output.
Analog or digital input/ open drain General-purpose analog/digital input or open drain
20 AIO[5]/LED[5]
output. LED output.

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21 GND Ground Ground
22 1V8 Supply 1.8V voltage output.
23 VDD_PADS1 Supply 1.8 V/3.3 V PIO supply.
24 VDD_PADS3_7 Supply 1.8 V/3.3 V PIO supply.
Digital: Bidirectional with Programmable I/O line 4.
25 PIO[4] programmable strength internal Alternative function:
pull- up/pull-down TBR_MOSI[1]
Digital: Bidirectional with Programmable I/O line 3.
26 PIO[3] programmable strength internal Alternative function:
pull- up/pull-down TBR_MISO[2]
Digital: Bidirectional with Programmable I/O line 6.
27 PIO[6] programmable strength internal Alternative function:
pull- up/pull-down TBR_MOSI[0]
Digital: Bidirectional with Programmable I/O line 5.
28 PIO[5] programmable strength internal Alternative function:
pull- up/pull-down TBR_MISO[1]
Digital: Bidirectional with Programmable I/O line 8.
29 PIO[8] programmable strength internal Alternative function:
pull- up/pull-down TBR_CLK
Digital: Bidirectional with Programmable I/O line 7.
30 PIO[7] programmable strength internal Alternative function:
pull- up/pull-down TBR_MISO[0]
Digital: Bidirectional with Programmable I/O line 2.
31 PIO[2] programmable strength internal Alternative function:
pull- up/pull-down TBR_MISO[3]
Automatically defaults to RESET# mode when the
Digital: Bidirectional with device is unpowered, or in off modes.
32 PIO[1] programmable strength internal Reconfigurable as a PIO after boot.
pull- up/pull-down Alternative function:
Programmable I/O line 1
33 NC NC NC
Headphone/speaker differential right output,
negative.
34 AUDIO_HPR_N/ SPKR_N Analog
Alternative function:
Differential right line output, negative
Headphone/speaker differential right output,
positive.
35 AUDIO_HPR_P/ SPKR_P Analog
Alternative function:
Differential right line output, positive
Headphone/speaker differential left output,
negative.
36 AUDIO_HPL_N/ SPKL_N Analog
Alternative function:
Differential left line output, negative
Headphone/speaker differential left output, positive.
37 AUDIO_HPL_P/ SPKL_P Analog
Alternative function:

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 Differential left line output, positive
38 GND Ground Ground
39 AUDIO_MIC_BIAS Analog Mic bias output.
Microphone differential 2 input, negative.
40 AUDIO_MIC2_N/ LINEIN_R_N Analog Alternative function:
Differential audio line input right, negative
Microphone differential 2 input, positive.
41 AUDIO_MIC2_P/ LINEIN_R_P Analog Alternative function:
Differential audio line input right, positive
Microphone differential 1 input, negative.
42 AUDIO_MIC1_N/ LINEIN_L_N Analog Alternative function:
Differential audio line input left, negative
Microphone differential 1 input, positive.
43 AUDIO_MIC1_P/ LINEIN_L_P Analog Alternative function:
Differential audio line input left, positive
44 GND Ground Ground
45 GND Ground Ground
46 BT_RF RF Bluetooth transmit/receive.
47 GND Ground Ground
Digital: Bidirectional with Programmable I/O line 54.
48 PIO[54] programmable strength internal Alternative function:
pull- up/pull-down SDIO_D[0]
Digital: Bidirectional with Programmable I/O line 53.
49 PIO[53] programmable strength internal Alternative function:
pull- up/pull-down SDIO_CMD
Digital: Bidirectional with Programmable I/O line 52.
50 PIO[52] programmable strength internal Alternative function:
pull- up/pull-down SDIO_CLK
Digital: Bidirectional with
51 PIO[60] programmable strength internal Programmable I/O line 60.
pull- up/pull-down
Digital: Bidirectional with
52 PIO[61] programmable strength internal Programmable I/O line 61.
pull- up/pull-down
Digital: Bidirectional with Programmable I/O line 21.
53 PIO[21] programmable strength internal Alternative function:
pull- up/pull-down PCM_DOUT[2]
Digital: Bidirectional with Programmable I/O line 20.
54 PIO[20] programmable strength internal Alternative function:
pull- up/pull-down PCM_DOUT[1]

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7 Electrical Characteristics
7.1 Absolute Maximum Ratings

Rating Minimum Maximum

Storage temperature -40℃ +85℃

7.2 Recommended Operating Conditions

Operating Condition Minimum Maximum

Operating temperature range -10℃ +70℃
Supply voltage: VBAT +2.8V +4.2V

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8 Recommended reflow temperature profile

The module Must go through 125℃ baking for at least 9 hours before SMT
AND IR reflow process!

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Record of Changes
Data Revision Description
2018-08-10 V1.0 Original publication of this document.
2018-10-12 V1.1 Fix PIN definition.
2020-04-23 V1.2 Fix PIN definition.

Mob/ WhatsAPP:

(086)13480952801

Web: www.hyxkiot.com

E-mail: info@hyxkiot.com

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