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Specification: Product Model Number

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84 views10 pages

Specification: Product Model Number

datasheet
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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SPECIFICATION

Product: BLUETOOTH MODULE

Model Number:MD-BLT-QD3040I

DC-SP-V04170331
1 Introduction

BRITO Technologies introduces the pioneer of the Bluetooth


5.2 modules MD-BLT-QD3040I which is a high performance, cost effective,
low power and compact solution The Bluetooth
. module provides a complete
2.4GHz Bluetooth system based on the QCC3040 BGA chipset which is a single
chip radio and baseband IC for Bluetooth 2.4GHz systems. This module is fully
qualified single-chip dual mode Bluetooth@v5.2 system.

2 Key Features

MD-BLT-QD3040I (QCC3040) Features


 Qualified to Bluetooth v5.2 specification
 120 MHz Qualcomm® Kalimba™ audio DSP
 32 MHz Developer Processor for applications
 Firmware Processor for system
 Flexible QSPI flash programmable platform
 High-performance 24-bit audio interface
 Digital and analog microphone interfaces
 Flexible PIO controller and LED pins with PWM support
 Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0
 Advanced audio algorithms
 Active Noise Cancellation: Hybrid, Feedforward, and Feedback modes, using
Digital or Analog Mics, enabled using license keys available from Qualcomm®
 Qualcomm® aptX™ and aptX HD Audio
 1 or 2 mic Qualcomm® cVc™ headset speech processing
 Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery
charger
Application subsystem
 Dual-core application subsystem 32 MHz operation
 32-bit Firmware Processor (reserved for system use) executes:
 Bluetooth upper stack
 Profiles
 House-keeping code
 32-bit Developer Processor executes: Developer applications
 32 Mb flash memory
 On-chip caches per core enable optimized performance and power consumption
Bluetooth subsystem
 Qualified to Bluetooth v5.2 specification including 2 Mbps Bluetooth Low Energy
 Single ended antenna connection with on-chip balun and Tx/Rx switch
 Bluetooth, Bluetooth Low Energy, and mixed topologies supported
 Class 1 support
3 Applications

 Wired/wireless mono headsets/headphones


 Qualcomm TrueWireless™ stereo earbuds

4 Block Diagram

5 General specifications

Model Name MD-BLT-QD3040I


Product Description Bluetooth 5.2 Class2 Module
Bluetooth Standard Bluetooth 5.2
Chipset QCC3040 BGA
Dimension 13mm x 18mm x 2.5mm
Operating Conditions
Voltage 2.8~4.2V
Temperature -10~+70℃
Storage Temperature -40~+85℃
Electrical Specifications
Frequency Range 2402~2480MHz
Maximum RF Transmit Power 9dBm
π/4 DQPSK Receive Sensitivity -91dBm
8DPSK Receive Sensitivity -81dBm
6 Module Package Information

6.1 Pinout Diagram and package dimensions

Unit:MM

Recommended PCB layout footprint


6.2 Module Pin descriptions

Pin# Pin Name Pin type Description


Digital: Bidirectional with
1 PIO[20] programmable strength internal Programmable I/O line 20.
pull- up/pull-down
Digital: Bidirectional with
2 PIO[19] Programmable I/O line 19.
programmable strength internal
pull- up/pull-down
Digital: Bidirectional with
3 PIO[18] programmable strength internal Programmable I/O line 18.
pull- up/pull-down
Digital: Bidirectional with
4 PIO[17] programmable strength internal Programmable I/O line 17.
pull- up/pull-down
Digital: Bidirectional with
5 PIO[16] programmable strength internal Programmable I/O line 16.
pull- up/pull-down
Digital: Bidirectional with
6 PIO[15] programmable strength internal Programmable I/O line 15.
pull- up/pull-down
7 VBAT_SENSE Analog Battery voltage sense input.
USB Full Speed device D- I/O. IEC-61000-4-2
8 USB_DN Digital
(device level) ESD Protection
USB Full Speed device D+ I/O. IEC-61000-4-2
9 USB_DP Digital
(device level) ESD Protection
10 VCHG Supply Charger input to Bypass regulator.
Charger input sense pin after external mode
sense-resistor. High impedance.
11 VCHG_SENSE Analog
NOTE If using internal charger or no charger,
connect VCHG_SENSE direct to VCHG.
12 NC NC NC
Typically connected to an ON/OFF push button.
Boots device in response to a button press when
power is still present from battery and/or charger but
software has placed the device in the OFF or
13 SYS_CTRL Digital input
DORMANT state. Additionally useable as a digital
input in normal operation. No pull.
Additional function:
PIO[0] input only
14 VBAT Supply Battery voltage input.
15 GND Ground Ground
Analog or digital input/ open drain General-purpose analog/digital input or open drain
16 AIO[0]/LED[0]
output. LED output.
Analog or digital input/ open drain General-purpose analog/digital input or open drain
17 AIO[1]/LED[1]
output. LED output.
Analog or digital input/ open drain General-purpose analog/digital input or open drain
18 AIO[2]/LED[2]
output. LED output.
Analog or digital input/ open drain General-purpose analog/digital input or open drain
19 AIO[4]/LED[4]
output. LED output.
Analog or digital input/ open drain General-purpose analog/digital input or open drain
20 AIO[5]/LED[5]
output. LED output.
21 GND Ground Ground
22 1V8 Supply 1.8V voltage output.
23 VDD_PADS_2 Supply 1.8 V/3.3 V PIO supply.
24 VDD_PADS1_3 Supply 1.8 V/3.3 V PIO supply.
Digital: Bidirectional with Programmable I/O line 4.
25 PIO[4] programmable strength internal Alternative function:
pull- up/pull-down TBR_MOSI[1]
Digital: Bidirectional with Programmable I/O line 3.
26 PIO[3] programmable strength internal Alternative function:
pull- up/pull-down TBR_MISO[2]
Digital: Bidirectional with Programmable I/O line 6.
27 PIO[6] programmable strength internal Alternative function:
pull- up/pull-down TBR_MOSI[0]
Digital: Bidirectional with Programmable I/O line 5.
28 PIO[5] programmable strength internal Alternative function:
pull- up/pull-down TBR_MISO[1]
Digital: Bidirectional with Programmable I/O line 8.
29 PIO[8] programmable strength internal Alternative function:
pull- up/pull-down TBR_CLK
Digital: Bidirectional with Programmable I/O line 7.
30 PIO[7] programmable strength internal Alternative function:
pull- up/pull-down TBR_MISO[0]
Digital: Bidirectional with Programmable I/O line 2.
31 PIO[2] programmable strength internal Alternative function:
pull- up/pull-down TBR_MISO[3]
Automatically defaults to RESET# mode when the
Digital: Bidirectional with device is unpowered, or in off modes.
32 PIO[1] programmable strength internal Reconfigurable as a PIO after boot.
pull- up/pull-down Alternative function:
Programmable I/O line 1
Digital: Bidirectional with
33 PIO[60] programmable strength internal Programmable I/O line 60.
pull- up/pull-down
34 NC NC NC
35 NC NC NC
Headphone/speaker differential left output,
negative.
36 AUDIO_HPL_N/ SPKL_N Analog
Alternative function:
Differential left line output, negative
Headphone/speaker differential left output, positive.
37 AUDIO_HPL_P/ SPKL_P Analog Alternative function:
Differential left line output, positive
38 GND Ground Ground
39 AUDIO_MIC_BIAS Analog Mic bias output.
40 AUDIO_MIC2_N/ LINEIN_R_N Analog Microphone differential 2 input, negative.
Alternative function:
Differential audio line input right, negative
Microphone differential 2 input, positive.
41 AUDIO_MIC2_P/ LINEIN_R_P Analog Alternative function:
Differential audio line input right, positive
Microphone differential 1 input, negative.
42 AUDIO_MIC1_N/ LINEIN_L_N Analog Alternative function:
Differential audio line input left, negative
Microphone differential 1 input, positive.
43 AUDIO_MIC1_P/ LINEIN_L_P Analog Alternative function:
Differential audio line input left, positive
44 GND Ground Ground
45 GND Ground Ground
46 BT_RF RF Bluetooth transmit/receive.
47 GND Ground Ground
Digital: Bidirectional with
48 PIO[14] programmable strength internal Programmable I/O line 14.
pull- up/pull-down
Digital: Bidirectional with
49 PIO[13] programmable strength internal Programmable I/O line 13.
pull- up/pull-down
Digital: Bidirectional with
50 PIO[12] programmable strength internal Programmable I/O line 12.
pull- up/pull-down
Digital: Bidirectional with
51 PIO[11] programmable strength internal Programmable I/O line 11.
pull- up/pull-down
Digital: Bidirectional with
52 PIO[10] programmable strength internal Programmable I/O line 10.
pull- up/pull-down
Digital: Bidirectional with
53 PIO[9] programmable strength internal Programmable I/O line 9.
pull- up/pull-down
Digital: Bidirectional with
54 PIO[21] programmable strength internal Programmable I/O line 21.
pull- up/pull-down
7 Electrical Characteristics
7.1 Absolute Maximum Ratings

Rating Minimum Maximum


Storage temperature -40℃ +85℃

7.2 Recommended Operating Conditions

Operating Condition Minimum Maximum


Operating temperature range -10℃ +70℃
Supply voltage: VBAT +2.8V +4.2V
8 Recommended reflow temperature profile

The module Must go through 125℃ baking for at least 9 hours before SMT
AND IR reflow process!

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