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Purpose and Perspective of the Module 3

The purpose of this module is to learn about processors from Intel and AMD, and
generational differences for the lineups of both brands. The procedure for
installation of processors is covered in depth, using different motherboards and
brands for examples. Finally, different types of memory are discussed, and memory
installation procedures are outlined.

Module 3 Objectives
The following objectives are addressed in this module:
1. Compare characteristics and features of processors used for personal
computers
2. Select, install, and upgrade a processor
3. Compare the different kinds of physical memory and how they work
4. Upgrade memory

TYPES AND CHARACTERISTICS OF PROCESSORS

1. Elaborate on the features typical of a computer processor, such as:
a. Processor speed
b. Lithography
c. Socket and chipset
d. Multiprocessing abilities
e. Memory cache
f. The memory features on the motherboard that the processor can
support
g. Support for virtualization
h. Overclocking

2. When discussing multiprocessing, explain the various ways this can be

accomplished, either by multicore processing, multithreading, or use of
multiple processors.

3. Students should be aware of the different levels of cache, L1, L2, and L3.
They must also know where these different cache levels reside.

4. Discuss the two categories today’s processor architectures fall into:

a. Hybrid processors can process 32 bits or 64 bits
b. 64-bit processors

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Intel Processors

1. List some of the Intel Processors and discuss their features. Explain how the
different generations improve upon processor design.

2. Describe the Intel processor that are designed for server use and therefore
are more stable and error-free than other processors.

Pro Tip

To find details about any Intel processor, search the Intel ARK
database at ark.intel.com.

AMD Processors

1. Compare the line of processors created by Advanced Micro Devices, Inc., or

AMD (amd.com) to those by Intel, and point out what processors from both
brands are comparable.

ARM Processors

1. Elaborate on the method of processor architecture that ARM (Advanced RISC

Machine) employs as they design and license their designs to other
companies.

2. List the attributes that make ARM processors suitable for mobile devices.

SELECTING AND INSTALLING A PROCESSOR

Remind students that it’s important for them to know how to match a processor for
the system in which it is installed, as well as how to install the processor on the
motherboard for each of the current Intel and AMD sockets.

Selecting a Processor to Match System Needs

1. Discuss how to select the right processor based on the desired purpose of a
computer, and explain how different factors such as price, desired
performance, and availability affect processor choice.

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2. Explain that a thermal compound is placed between the bottom of the cooler
hear sink and the top of the processor. This compound is used to eliminate air
pockets and help draw heat off the processor.

Pro Tip

When building a custom PC or selecting parts for a server, students

should keep in mind that processors are not very easily replaced.
While many low-priced decent performing processors are available,
students should try to get the best processor they can afford when
on a budget.

Installing a Processor and Cooler Assembly

Install an Intel Processor

1. Stress to students that they should always read and follow the specific
directions for their motherboard and cooler assembly. Review the general
procedure to install the motherboard and then the processor, or vice versa
according to the directions.

2. Demonstrate how to replace or install a processor on a motherboard.

Install the Cooler Assembly

1. Show how the CPU cooler is installed onto the processor. Students should be
aware that if a thermal compound is not pre-applied on the cooler, it must be
applied to the processor prior to installing the cooler. Show how to apply
thermal compound to the processor.

2. Point out the 4-pin CPU fan header that should be used on the motherboard
for a cooler’s fan, and explain that properly connecting this cable is crucial to
maintaining proper temperatures.

3. Review how to check BIOS/UEFI setup to verify the system recognizes the
processor and that the CPU is not overheating.

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Install an AMD Processor and Cooler Assembly

1. Discuss how the different sockets affect processor installation and

demonstrate multiple processor sockets. Educate students on what steps
may differ between Intel and AMD processor installs, especially when
mounting the cooler.

MEMORY TECHNOLOGIES
1. Discuss the different categories of dynamic RAM (DRAM) and describe how
they differ from each other:
a. Dual inline memory module (DIMM)
b. Small outline DIMM (SO-DIMM)

DIMM and SO-DIMM Technologies

1. Discuss the important acronyms involving memory:

a. The “D” in DIMM stands for “dual”
b. A SIMM (single inline memory module) is an older technology that has
pins on only one side of the module edge connector
c. A DDR (Double Data Rate) DIMM gets its name from the fact that it ran
twice as fast as earlier DIMMs
d. DDR2, DDR3, DDR4

2. Explain that many DIMM technologies exist because they have evolved to
improve capacity, speed, and performance without greatly increasing the
cost.

3. Explain that the DDR2 and DDR3 modules use 240 pins but are not
compatible with each other. Students should understand that DDR3 is faster
and uses less power than DDR2. Also point out that DDR4 is an improvement
on DDR3 and uses 288 pins.

Single, Dual, Triple, and Quad Channels

1. Define what single channel means and explain that the number of channels
available defines how many DIMMs can be accessed at the same time. Note
that the number of channels available must be supported by the
motherboard and the DIMM itself.

2. Students must be aware that in order to use dual or more channels, the
DIMMs used must match in size, speed, and features. The DIMMs should also
preferably come from the same manufacturer.
3. Point out how the different memory channels are color coded (blue and black,
for example) on a motherboard. Review the dual channel configuration in
Figure 3-27.

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4. Describe how triple channel and quad channel memory requires three or four
DIMMs instead of just two.

DIMM Speeds

1. DIMM speeds should be explained, and students should understand the two
different methods of measurement for DIMM speeds: MHz and PC rating.

Error Checking

1. Define error-correcting code (ECC) RAM as RAM that is capable of detecting

errors in data. Students should know that this RAM cannot be mixed with non-
ECC RAM.

2. Note that you cannot install a mix of ECC and non-ECC memory on the
motherboard—the resulting system will not work.

Buffered and Registered DIMMs

1. Buffered and registered DIMMs should be described as using buffers or

registers to hold data, amplify a signal and increase memory performance.

CAS Latency

1. Describe the use of CAS Latency (column access strobe) in measuring access
timing for RAM.

Types of Memory Used in Laptops

1. Review different types of memory modules used in laptops and show

students the SO-DIMMs used by laptop computers. Note that you can only
use the type of memory the laptop is designed to support.

Virtual RAM

1. Explain that Virtual RAM, or virtual memory, is the way Windows uses space
on the hard drive to enhance the amount of RAM in a system.

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HOW TO UPGRADE MEMORY

1. Discuss how memory can affect a system’s performance and review the
features of RAM that can benefit a system’s overall performance.

How Much Memory Do I Need and How Much is Currently

Installed?

1. Explain the memory limitations of a 32-bit operating system compared to a

64-bit operating system. Note that a Windows 32-bit OS can only use 4 GB of
RAM, while Windows 10 Pro 64-bit can use up to 2 TB.

2. Demonstrate how to check the amount of RAM currently installed in a system

via the msinfo32 utility in Windows, or by checking the BIOS screen.

What Type of Memory Is Already Installed?

1. Discuss how to identify memory modules installed on a motherboard, and

what information should be collected about installed memory.

2. Explain the importance of checking the motherboard documentation for

proper configuration and placement of memory modules.

How Many and What Kind of Modules Can Fit on My

Motherboard?

1. Students should understand the potential performance benefits from

installing multiple DIMMs compared to installing a single DIMM.

2. Elaborate on how to install DIMMs on various typical motherboard

configurations.

Motherboard Using DDR4 Dual-Channel DIMMs

1. Explain that students must select two matching DIMMs to get the full benefit
of dual channeling when upgrading memory.

2. Note how to interpret the color-coded DIMM slots on a motherboard, as well

as which DIMM slots should be filled first.

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Motherboard Using DDR3 Triple-Channel DIMMs

1. Discuss how DIMM slots can be populated with different configurations, and
how these configurations change depending on how many modules are
available.

2. Define the Special Presence Detect (SPD) technology as a way for an installed
DIMM to report its size, speed, voltage, and data path width to system
BIOS/UEFI at startup.

Pro Tip

The color-coded DIMM slots aren’t always blue, white, or black.

Some motherboards use red, orange, yellow, or other colors.
Always consult the motherboard documentation for proper
installation of DIMMs.

How do I Select and Purchase the Right Memory Modules?

1. Educate students on the combinations of memory modules that will not work,
such as mixing unbuffered memory with buffered / registered memory.

2. Emphasize the importance of using matching memory and memory speeds

when possible, but explain that mixing memory manufacturers and speeds
will sometimes work.

Use a Website to Research Your Purchase

Demonstrate how to use memory manufacturer websites and motherboard

manufacturer websites to research what about type, size, and speed of RAM to buy
that are compatible.

Pro Tip

Motherboard manufacturers often have a Qualified Vendor List

(QVL), containing a list of memory modules that have been tested
for a particular motherboard model. However, memory
manufacturers often test their memory with popular motherboards
and verify compatibility, so be sure to check multiple websites for
information.

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How Do I Install the New Modules?

1. Discuss precautions to take when installing memory modules on a

motherboard, such as using an ESD strap and verifying that power has been
properly.

Install DIMMs

1. Demonstrate how to push a DIMM module into a DIMM slot on the

motherboard, making sure that clips on both sides of the module are firmly
seated.

How to Upgrade Memory on a Laptop

1. Demonstrate how to access the memory slots on a laptop, and how to

remove SO-DIMMs from their slots.

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Key Terms
CAS Latency: Column Access Strobe (CAS) - A method of measuring access timing
to memory, which is the number of clock cycles required to write or read a column
of data off a memory module.
DDR (Double Data Rate): The first type of memory that was able to process both
the rise and fall of the motherboard clock beat, thus doubling the processing speed.
It was first released in about the year 2000.
DDR3: Memory that is one generation older than the current highest performing
memory. Like the previous generation, they have 240 pins, but the notch is in a
different place. First released in about 2007.
DDR3L: This is a lower voltage version of DDR3 made specifically for laptops. Runs
at 1.35 volts compared to 1.5 volts or 1.65 volts.
DDR4: The fastest and lowest power memory technology in common use today.
Released in 2014.
DDR5: a DIMM module that is faster and uses less power than DDR4; it uses 288
pins & offers up to 64 Gb DRAM to double the effective data rate.
dual channels: A motherboard feature that improves memory performance by
allowing the memory controller to communicate with two DIMMs at the same time,
thus doubling the speed of memory access.
dual processors (or multiprocessor platform or multisocket): Two processor
sockets on a server motherboard. Also called a multiprocessor platform.
dynamic RAM (DRAM): The most common technology used in memory chips in
main system memory. It needs to be refreshed by an electrical current every few
milliseconds in order to retain its data.
ECC (error-correcting code): A type of memory that contains an extra chip used
to detect and fix errors in data. It is commonly used in servers to increase reliability.
Hyper-Threading: The Intel technology that allows the processor to work more
efficiently by processing two threads, or lines of data, at the same time. It causes
each core to appear as if it is two cores.
HyperTransport: The AMD technology that allows the processor to work more
efficiently by processing two threads, or lines of data, at the same time. It causes
each core to appear as if it is two cores.
Level 1 cache (L1 cache): Memory built into the processor die. It is a very small
amount of very fast S-RAM that stores frequently used or critical data for quicker
access.

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Level 2 cache (L2 cache): Memory in the processor package close to the CPU
cores but not on the processor die. It is a small amount of very fast S-RAM that
stores frequently used or critical data for quicker access.
Level 3 cache (L3 cache): Memory found in some CPUs that is further from the
processor core but still located inside the processor package. It is larger than the
other levels of CPU cache memory.
msinfo32.exe: The Windows utility that launches the System Information window.
multicore processing: A type of CPU in which the processor housing contains two
or more processor cores that work in parallel but independently of each other.
multiprocessing: Using two processing units installed within a single processor,
this technology allows the core to execute two threads of instruction at the same
time. It was first used by the Pentium processor.
multiprocessor platform: See dual processors
multisocket: See dual processors
processor frequency: The speed at which the processor operates internally,
usually expressed in GHz.
quad channel: Technology used by a motherboard and DDR3 or DDR4 DIMMs that
allows the memory controller to access four DIMMS at the same time.
single channel: The memory controller on a motherboard that can access only one
DIMM at a time.
single-core processing: An older processor technology whereby the processor
housing contains one processor core and can process only one thread at a time.
static RAM (SRAM): Memory technology type that retains information without the
need for refreshing, as long as the computer's power is on. It is more expensive
than traditional DRAM and is found in small amounts in CPU cache.
thermal compound: A cream-like substance that is placed between the bottom of
the cooler heat sink and the top of the processor to eliminate air pockets and help
draw heat off the processor.
thread: Each process that the processor is aware of. It is a single task that is part
of a larger task or request from a program.
triple channels: When the memory controller accesses three DIMMs at the same
time.
virtual memory: See virtual RAM
virtual RAM (or virtual memory): The way Windows uses space on the hard
drive to enhance the amount of RAM in a system.
x86-64 bit processor: A hybrid processor that can process 32 bits or 64 bits.

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Additional Resources

Internet Resources
 How to Choose a Processor/CPU: https://www.youtube.com/watch?
v=n8FfjrXbRbc

 Kingston Desktop/Notebook Memory:

https://www.kingston.com/us/memory/desktop-notebook

 What’s the Diff: RAM vs Storage:

https://www.backblaze.com/blog/whats-diff-ram-vs-storage/

 Installing DIMMs and SO-DIMMs:

https://www.compuram.de/blog/en/installing-new-memory-modules-a-short-
guide/

 How to Buy the Right CPU:

https://www.tomshardware.com/reviews/cpu-buying-guide,5643.html

 Emerging Memory Technologies:

https://thememoryguy.com/category/memory-manufacturers/

 How Computer Memory Works:

https://computer.howstuffworks.com/computer-memory1.htm

 Next-gen RAM: DDR5:

https://www.tomshardware.com/news/what-we-know-ddr5-ram,39079.html

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