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PCB

The document describes the PCB design and manufacturing process. It discusses key components of PCBs like pads, traces, and vias. It also outlines the basic manufacturing steps, which include: applying a copper layer to a substrate, etching away unwanted copper, applying a solder mask, and populating the board with electronic components. The goal is to produce a printed circuit board that can reliably connect circuit components through multiple interconnected layers.

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252 views

PCB

The document describes the PCB design and manufacturing process. It discusses key components of PCBs like pads, traces, and vias. It also outlines the basic manufacturing steps, which include: applying a copper layer to a substrate, etching away unwanted copper, applying a solder mask, and populating the board with electronic components. The goal is to produce a printed circuit board that can reliably connect circuit components through multiple interconnected layers.

Uploaded by

jhpandi
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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PCB Design and Manufacturing Process

Printed Circuit Board Electronic Board that connects circuit components PCB populated with electronic components is a printed circuit assembly (PCA) PCBs are rugged, inexpensive, and can be highly reliable Mass manufacturing Professional

Conducting layers are typically made of thin copper foil. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue and red.

Unwanted

copper is removed from the substrate after etching leaving only the desired copper traces or pathways

Components Pads Traces Vias Top Metal Layer Bottom Metal Layer

Components are the actual devices used in the circuit. This includes input/output connections. I/O ports, including power supply connections, are also important in the PCB design.

Location that components connect to. You will solder components to the pads on the PCB. Pads will connect to traces. Pads have an inner diameter and outer diameter.

Traces connect pads together. Traces are essentially the wiring of the PCB. Equivalent to wire for conducting signals Traces sometimes connect to vias. High current traces should be wide. Signal traces usually narrower than power or ground traces

Pad with a plated hole connecting traces from one layer of board to other layers. Attempt to minimize via use in your PCBs. Some component leads can be used as vias.

Most of the components reside on the top layer Fewer traces on the top layer Components are soldered to the pads on the top layer of PCB Higher circuit densities

Few components on this layer. Many traces on this layer. Most soldering done on this layer.

Often, many signal wires need to exist in too small of a space and must overlap. Running traces on different PCB layers is an option. Multilayer PCBs are often expensive. Solution: use jumpers

Protect copper traces on outer layers from corrosion Areas that shouldn't be soldered may be covered with polymer resist solder mask coating Designed to keep solder only in certain areas Prevents solder form binding between conductors and thereby creating short circuits

Printing on the solder mask to designate component locations Readable information about component part numbers and placement. Helpful in assembling, testing and servicing the circuit board.

More then a top and bottom layer. Typically there will be a power plane, ground plane, top layer, and bottom layer. Sometimes signal layers are added as needed. Sometimes RF planes made of more expensive materials are added.

1.

Film Generation

2. Shear Raw Material

3. Drill Holes

Industry standard 0.059" thick, copper clad, two sides

4. Electrolus copper

5. Apply Image

Apply copper in hole barrels

Apply Photosensitive Material to develop selected areas from panel

6. Strip and Etch

7. Solder Mask

Remove dryfilm, then etch exposed copper Tin protects the copper circuitry from being etched

Apply solder mask area to entire board with the exception of solder pads

8. Solder Coat

9. Silkscreen

Apply solder to pads

Apply white letter marking using screen printing process

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