Advanced manufacturing processes (ME F315)

Department of Mechanical Engineering

BITS Pilani K. K. Birla Goa campus
Instructor in charge: Dr. Biswajit Das
Office No.- E107
Tel: +91-832-2580381 (O)

BITS Pilani K. K. Birla GoaDr.campus

Manoj Kumar Pandey
 Carbon Dioxide Laser
Laser Medium : Mixture of CO2, N2 & He
Laser Wavelength : 10.6 micron (Infrared)
Mode of Operation : Continuous Wave (CW)& Pulsed
Excitation Method : Electrical Discharge: DC, RF, Pulsed
Efficiency : 10-15%
Laser Power : CW- A Few Watts to Tens of kW
Pulsed-
Rep. Rate : Single pulse – 100 kHz
Av. Power : kW
Pulse duration : s
Pulse Energy : 1-100 Joules
Types of CO2 Laser : Conventional Diffusion Cooled Laser
Hi-power Fast Axial Flow Laser
 Conventional Diffusion Cooled CO2 Laser

CO2 Laser Excitation

e - Accelerated in Electric Discharge,
Electrons gain energy.
e (Hi K.E.) + N2  N2* + e (Low
K E)
N2* + CO2  N2 + CO2*
CO2*  CO2 + Laser Photon
Laser Power = 50W/ m in Diffusion cooled laser,
 Nd:YAG Solid State Laser
Laser Medium : Neodymium ion Nd3+ doped
Yttrium Aluminum Garnet (Nd:YAG)

Laser Wavelength : : 1.06 micron (Infrared)

Mode of Operation : Continuous Wave (CW)& Pulsed

Excitation Method : Optical Pumping

Xenon Flash Lamp for Pulsed Mode
Krypton Arc Lamp for CW Mode
Diode Laser

Efficiency : Lamp pumped lasers- 2-5%

Diode pumped lasers- 15-20%
Construction of a Nd:YAG Laser
Output Elliptical Mirror
Mirror Reflecting Cavity

Laser Rod

Laser Flash Lamp

Beam

Q-switch /
Mode-Lock
Power Supply Switch

Abs. Spe. of
Laser Rod

 Spectrum E
Spectrum of Diode Lasing
of Lamp Laser

*Lamp pumping: Low *Diode pumping: High Efficiency

 Diode Pumped Solid State Laser
Axial Pumping
Lens Laser Rod
Laser Beam

Diode Laser
Mirror Mirror

Side Pumping

Diode Arrays
 Fiber Laser
Diode
Laser

• Active Medium: Optical (Silica Glass) Fiber with cladding, doped

with either Ytterbium / Neodymium / Erbium or their combinations for different laser
wavelength in 1-1.6 m range.

• Excitation / Pump source : Diode Lasers

• Most popular Fiber Laser for material processing applications: Ytterbium doped fiber
operating at ~ 1m wavelength, pumped by diode lasers

• Size: Most common Single mode Fiber ~ 10m dia. & 10’s m length

• Mode of operation: CW, modulated, pulsed

• Laser Beam quality: Excellent

• Laser Power : up to several kWs,

• Laser Efficiency: up to 30%

Semiconductor Diode Lasers
Active medium: Semiconductor similar to a light-emitting diode.
Most common type of laser diode: p-n junction
Excitation: Injected electrical current by forward biasing: Holes and electrons
recombine at the p-n interface and they emit light.

Typical Materials used : GaAs, AlGaAs, GaInAsP

• Laser Wavelength: 600nm- 1.650micron range

• Power: Few mW to a few Ws in a single chip
and up to several kWs in 2-3D arrays
• Efficiency: 30-50%
• Mode of operation: CW & Modulated up
to 50kHz
• Beam quality: Poor than other lasers due to
very small area of emission
• Beam Delivery: Through Optical Fiber
 Applications of Laser in Manufacturing

 Laser Cutting of Metal Sheets, Glass, Wood,

Plastics, Textiles, Rubber, Ceramic, Marble etc.

 Laser Welding of Similar & Dissimilar metals & Alloys.

 Laser Surface Hardening

 Laser Surface Alloying

 Laser Surface Cladding

 Laser Rapid Manufacturing

 Laser Marking, Engraving

 Laser Metal Forming

Laser Material Processing
Laser Power = 1- 5kW
Focal spot diameter = 10-5000micron
Laser Power Density = 103- 1012 W/cm2

Heating  Surface Transformation Hardening

Metal Forming
Melting  Welding,
Metal Cutting  Assist Gas
Surface Re-solidification, Glazing
Surface Alloying   External
Surface Cladding  Materials
Vaporization  Drilling Holes
Cutting of non-metals e.g. Ceramics,
Wood, Concrete, Glass etc.
Surface cleaning, Paint stripping
Ablation with Ultra short Laser Pulses  Hi-precision
drilling & Cutting
Plasma Formation  Laser Peening
Reflection and Absorption of Laser Radiation in a material :

Govern by refractive index which is usually complex

Complex Refractive Index : n* = n + ik

Reflectivity at normal incidence

R = [(n-1)2 +k2] / [(n+1)2 +k2]

Absorptivity, A = 1- R -T

Tansmitivity, T = 0 in Opaque materials

Absorption or Attenuation coefficient

I = I0 e -z
 = 4k/ ;
Light intensity attenuated by 1/e in a length
given by the attenuation length / Optical Skin
Depth
la = 1/  =  / 4k

In most metals, k,> n R is large ( >90%), A is small ( <5-10%),

la is very small (a few nm range) and laser beam is absorbed within this thin layer
(skin depth) at the surface.
Laser beam incident on a metal surface
Reflection Scattering Absorption Transmission

Above phenomena will depend on

Type of material (metal, semiconductor, insulator), and
its thermo-physical characterizes, surface condition,
Laser parameters (wavelength, pulse duration, polarization, power density)

Laser Radiation Absorbed in metals, impurities in Semiconductor materials

by Free electrons & then transferred to ions & lattice ( Pyrolitic / Heating)
Conduction band
In Semiconductor materials
* Interband absorption by electrons in valance band, h  Eg Photon Eg
•Lattice Vibration or Optical phonon excitation near
Infrared (Si-O bonds): Glass, Quartz, etc at 10 m Valance band

• In organic polymers , UV Laser: h  > EB

Direct bond breaking: Photolytic reaction Laser
beam
* Inhomogenity of wavelength scale: Ceramics,
 Summary

 Laser Beam is reflected, scattered, absorbed, transmitted in a material

 Laser radiation is first absorbed by free-electrons in a metal and their
energy and temperature increases.
 Heated electrons share their energy with ions and lattice vibrations, and
thus the material gets heated up.
 In metals laser radiation is absorbed within 10’s nm depth of metal surface

 Further heating by thermal diffusion

 In metals laser radiation of any wavelength is absorbed by free-electrons
present in them.
 Interaction of Laser Beam depends upon laser wavelength, Polarization,
Intensity and interaction time
 In semiconductors, laser radiation of photon energy (h) more than the
band gap energy ( between Valance & Conduction bands) is absorbed.
 Si-O bonds in glass, quartz absorb around 10 m radiation
 Laser radiation could get absorbed during multiple reflections at grain-
boundaries in ceramics
At very high intensities laser beam can be absorbed by nonlinear processes
in any material including transparent materials.
Physical phenomena at increasing Laser Intensity

~103W/cm2 ~105W/cm2 ~106W/cm2 ~107W/cm2

Formation of
Heating of Melting Formation of
Plasma
Surface layer Keyhole
Surface Ionization of
Cutting, Drilling, Vapor & gas,
Hardening, Conduction Deep penetration Shock
Metal Forming welding welding hardening,
Laser Peening
Principle characteristics of laser material processing

Keyhole

welding
Surface Alloying,
Cladding

Metal
Forming
Summary of Laser Power Density for Various Laser Material Processing:

Laser Processing Typical Laser Typical Laser

Power Density Interaction Time
Laser Heat Transformation: 103 – 5.104 W/cm2 1-10-2s
Laser Cutting: 5.104 - 107W/cm210-1-10-3s Laser
Welding: 5.104 - 6.106W/cm2 10-1-10-3s
Laser Drilling: 5.106-108 W/cm2 10-3-10-5s
Laser Surafce Re-melting: 5.105- 107 W/cm2 10-4-10-7s
Laser Alloying & Cladding: 5.104- 5.105 W/cm2 10-2-10-3s
Laser Shock Hardening: 108- 5.109 W/cm2 10-6-10-8s
 Laser Cutting
Laser cutting dominants the industrial laser applications & has more than 75% of
share of all LM applications.
Basic Principle : Melting with a focused laser beam and molten material ejection
by a high pressure gas jet.
* CO2 Laser (10.6m),
* Nd:YAG (1.06m) &
* Fiber Lasers (1.06)
Laser Power = 100W-5kW
Circularly or randomly polarized laser
Focal spot size ~ 0.1 – 0.3 mm
Power density of 1kW power at focal spot
of 0.3mm ~ 1.4 X106W/cm2
Effect on material
* Melting
* Vaporization
Pressurized co-axial gas jet ejects the molten / vaporized material
 Methods of Laser cutting:
• Melt and blow :
(Inert gas cutting, e.g: Ti, SS, Al etc.)
Absorption : Fresnel (A=1-R) and in
Plasma
Power density on front : ~106W/cm2
Melting
Drag of melt by gas jet
• Melt, burn and blow :
• (oxygen assist gas cutting, e.g: MS, SS etc.)
40-70 % energy from oxidation

• Vaporization :
High peak-power pulsed laser cutting or Cu t Ke rf

Materials which do not melt e.g:

wood, plastics
 Laser Fusion Cutting,
v  = (1-R) Laser Power
Coupling coefficient
w P = Laser power
t = thickness
t w = kerf width
v = cutting speed
Lf = latent heat of fusion
Energy balance equation: No conduction loss Lv = latent heat of
P = w.t.v. (Cp.Tm + Lf + m’Lv) vaporization
m’=Fraction of metal
m’ = 0 in fusion cutting evaporated
 Cutting speed, v = P / {w.t. (Cp.Tm + Lf )}  = density
T = Temperature raise
P/v.t = w. (Cp.Tm + Lf ) /  = Constant , S Cp = Specific Heat
for a
constant w & a given material

‘S’ is called as “Severance Energy”

(J/mm2)
 Energy Balance: M.R.R.

P  wtV {c p T  L f  m Lv }
t
V
w Lower Higher
Material
value (J/ value (J/
mm2) mm2)
t
V M.S + O2 4 13
w
M.S + N2 7 22
S.S + Ar 8 20
Cardboard 0.2 1.7

Parametric dependence:
* Laser cutting speed V increases with Laser power for a given job thickness t
* With increased laser power thicker material can be cut at same speed.
 Problem

You are handling a 1kW continuous wave of 10.6 µm. Laser beam diameter
given as 15 mm and beam quality M2=5 is known. It is focused on a metal
surface with a lens of 250 mm focal length. Complex refractive index given
as=4+5i.

(a) Laser power reflected from surface?

(b) Material depth upto which laser beam reduces by 50%?
(c) Amount of laser power absorbed in 25 nm thickness.
(d) Divergence of the laser beam?
(e) Brightness of laser beam?
(f) Focal spot diameter in surface?
(g) Laser power density at the surface?
Thank you
for
your patience

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