What Materials Make Up Printed Circuit Boards
What Materials Make Up Printed Circuit Boards
The printed circuit board (PCB) materials that are used to made up from a copper conduit layer that contains an overlay of laminate. The laminate covers the board is usually made up from an epoxy resin. Almost color are green due to the resin is used to cover the board, which is a green epoxy. However, there are many other colors are available through different types of laminating materials. The standard for make PCB, always using a thin layer of copper along with a green mask epoxy.
1. FR4 Material
FR4, the most widely used in printed circuit boards, is a standard fiber epoxy laminate. FR4 advantage has higher temperature coefficients and lower dielectric constants. FR4 has a starting Tg of 140 degrees Celsius; FR4-06 has a Tg of 170 degrees to suit your different requests.
More flexible than FR4, polyimide support hotter temperatures; this makes it always use in electrical insulation applications. The polyimide make up of a silicone adhesive design as well as a polyimide film built to withstand high temperatures. It protects edge connectors, gold edge fingers during wave soldering, and the reflow soldering processes during PCB assembly. Polyimide is easily distinguishable by its brown color.
3. Metal Core---Aluminum
Popular in LED Lighting printed circuits boards, Metal Core has great heat elimination. A single layer MCPBC contains a metal base, usually an aluminum and non-conduction layer, and a copper circuit layer. The metal core can provide high heat conductivity, to ensure the heat and lifetime of the LED's.
4. Rogers
Features a superior temperature stability of the dielectric constant, dielectric constant and thermal coefficient of copper foil is very consistent, insufficient to improve PTFE base material of this product is an ideal application to rapid changes in environmental temperature occasions (space), due to its low dielectric loss and metalized hole of high reliability, can be used in high frequency and a multilayer structure.
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