PCB DESIGN AND PROTOTYPE DEVELOPMENT LAB RECORD

III B.TECH I SEMESTER

(R20)

DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING

CHADALAWADA RAMANAMMA ENGINEERING COLLEGE (AUTONOMOUS)

(Accredited by NAAC, Approved by AICTE, New Delhi & Affiliated to JNTU Anantapur)
Renigunta Road, Tirupati – 517506, A.P., India.
 DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING

CHADALAWADA RAMANAMMA ENGINEERING COLLEGE (AUTONOMOUS)

(Accredited by NAAC, Approved by AICTE, New Delhi & Affiliated to JNTU Anantapur)
Renigunta Road, Tirupati – 517506, A.P., India

PCB DESIGN AND PROTOTYPE DEVELOPMENT LAB RECORD

(20CA04511)

Name:

H.T. No.:

Year & Semester:

In-charge HOD
(SAC-I)
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Fundamental of basic electronics: Component identification, Component symbols & their footprints,
understand schematic, Creating new PCB, Browsing footprints libraries, Setting up the PCB layers, Design
rule checking, Track width selection, Component selection, Routing and completion of the design

What's a PCB?
Printed circuit board is the most common name but may also be called "printed wiring boards" or
"printed wiring cards". Before the advent of the PCB circuits were constructed through a
laborious process of point-to-point wiring. This led to frequent failures at wire junctions and
short circuits when wire insulation began to age and crack.

A significant advance was the development of wire wrapping, where a small gauge wire is
literally wrapped around a post at each connection point, creating a gas-tight connection which is
highly durable and easily changeable.

As electronics moved from vacuum tubes and relays to silicon and integrated circuits, the size
and cost of electronic components began to decrease. Electronics became more prevalent in
consumer goods, and the pressure to reduce the size and manufacturing costs of electronic
products drove manufacturers to look for better solutions. Thus was born the PCB.

PCB is an acronym for printed circuit board. It is a board that has lines and pads that connect
various points together. In the picture above, there are traces that electrically connect the various
connectors and components to each other. A PCB allows signals and power to be routed between
physical devices. Solder is the metal that makes the electrical connections between the surface of
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the PCB and the electronic components. Being metal, solder also serves as a strong mechanical
adhesive.

Composition
A PCB is sort of like a layer cake or lasagna- there are alternating layers of different materials
which are laminated together with heat and adhesive such that the result is a single object.

Let's start in the middle and work our way out.

The base material, or substrate, is usually fiberglass. Historically, the most common designator
for this fiberglass is "FR4". This solid core gives the PCB its rigidity and thickness. There are
also flexible PCBs built on flexible high-temperature plastic (Kapton or the equivalent).

You will find many different thickness PCBs; the most common thickness for SparkFun products
is 1.6mm (0.063"). Some of our products- LilyPad boards and Arudino Pro Micro boards- use a
0.8mm thick board.

Cheaper PCBs and perf boards (shown above) will be made with other materials such as epoxies
or phenolics which lack the durability of FR4 but are much less expensive. You will know you

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are working with this type of PCB when you solder to it - they have a very distictive bad smell.
These types of substrates are also typically found in low-end consumer electronics. Phenolics
have a low thermal decomposition temperature which causes them to delaminate, smoke and
char when the soldering iron is held too long on the board.

Copper

The next layer is a thin copper foil, which is laminated to the board with heat and adhesive. On
common, double sided PCBs, copper is applied to both sides of the substrate. In lower cost
electronic gadgets the PCB may have copper on only one side. When we refer to a double sided
or 2-layer board we are referring to the number of copper layers (2) in our lasagna. This can be
as few as 1 layer or as many as 16 layers or more.

PCB with copper exposed, no solder mask or silkscreen.

The copper thickness can vary and is specified by weight, in ounces per square foot. The vast
majority of PCBs have 1 ounce of copper per square foot but some PCBs that handle very high
power may use 2 or 3 ounce copper. Each ounce per square translates to about 35 micrometers or
1.4 thousandths of an inch of thickness of copper.

Soldermask

The layer on top of the copper foil is called the soldermask layer. This layer gives the PCB its
green (or, at SparkFun, red) color. It is overlaid onto the copper layer to insulate the copper
traces from accidental contact with other metal, solder, or conductive bits. This layer helps the
user to solder to the correct places and prevent solder jumpers.
In the example below, the green solder mask is applied to the majority of the PCB, covering up
the small traces but leaving the silver rings and SMD pads exposed so they can be soldered to.

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Soldermask is most commonly green in color but nearly any color is possible. We use red for
almost all the SparkFun boards, white for the IOIO board, and purple for the LilyPad boards.

Silkscreen

The white silkscreen layer is applied on top of the soldermask layer. The silkscreen adds letters,
numbers, and symbols to the PCB that allow for easier assembly and indicators for humans to
better understand the board. We often use silkscreen labels to indicate what the function of each
pin or LED.

Silkscreen is most commonly white but any ink color can be used. Black, gray, red, and even
yellow silkscreen colors are widely available; it is, however, uncommon to see more than one
color on a single board.

Terminology
Now that you've got an idea of what a PCB structure is, let's define some terms that you may
hear when dealing with PCBs:
Annular ring - the ring of copper around a plated through hole in a PCB.

Examples of annular rings.

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• DRC - design rule check. A software check of your design to make sure the design does
not contain errors such as traces that incorrectly touch, traces too skinny, or drill holes
that are too small.
• Drill hit - places on a design where a hole should be drilled, or where they actually were
drilled on the board. Inaccurate drill hits caused by dull bits are a common manufacturing
issue.

• Finger - exposed metal pads along the edge of a board, used to create a connection
between two circuit boards. Common examples are along the edges of computer
expansion or memory boards and older cartridge-based video games.
• Mouse bites - an alternative to v-score for separating boards from panels. A number of
drill hits are clustered close together, creating a weak spot where the board can be broken
easily after the fact. See the SparkFun Protosnap boards for a good example.

Pad - a portion of exposed metal on the surface of a board to which a component is soldered.

PTH (plated through-hole) pads on the left, SMD (surface mount device) pads on the right.

• Panel - a larger circuit board composed of many smaller boards which will be broken
apart before use. Automated circuit board handling equipment frequently has trouble with
smaller boards, and by aggregating several boards together at once, the process can be
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sped up significantly.
• Paste stencil - a thin, metal (or sometimes plastic) stencil which lies over the board,
allowing solder paste to be deposited in specific areas during assembly.

Abe does a quick demonstration of how to line up a paste stencil and apply solder paste.

• Pick-and-place - the machine or process by which components are placed on a circuit

board.
• Plane - a continuous block of copper on a circuit board, define by borders rather than by
a path. Also commonly called a "pour".

Various portions of the PCB that have no traces but has a ground pour instead.

• Plated through hole - a hole on a board which has an annular ring and which is plated all
the way through the board. May be a connection point for a through hole component, a
via to pass a signal through, or a mounting hole.

A PTH resistor inserted into the FabFM PCB, ready to be soldered. The legs of the resistor go
through the holes. The plated holes can have traces connected to them on the front of the PCB
and the rear of the PCB.

• Pogo pin - spring-loaded contact used to make a temporary connection for test or
programming purposes.

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The popular pogo pin with pointed tip. We use tons of these on our test beds.

• Reflow - melting the solder to create joints between pads and component leads.
• Silkscreen - the letters, number, symbols, and imagery on a circuit board. Usually only
one color is available, and resolution is usually fairly low.

Silkscreen identifying this LED as the power LED.

• Slot - any hole in a board which is not round. Slots may or may not be plated. Slots
sometimes add to add cost to the board because they require extra cut-out time.

• Solder paste - small balls of solder suspended in a gel medium which, with the aid of a
paste stencil, are applied to the surface mount pads on a PCB before the components are
placed. During reflow, the solder in the paste melts, creating electrical and mechanical
joints between the pads and the component.

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Solder paste on a PCB shortly before the components are placed. Be sure to read about
*pastestencil above as well.*

• Solder pot - a pot used to quickly hand solder boards with through hole components.
Usually contains a small amount of molten solder into which the board is quickly dipped,
leaving solder joints on all exposed pads.
• Soldermask - a layer of protective material laid over the metal to prevent short circuits,
corrosion, and other problems. Frequently green, although other colors (SparkFun red,
Arduino blue, or Apple black) are possible. Occasionally referred to as "resist".

Solder mask covers up the signal traces but leaves the pads to solder to.

• Solder jumper - a small, blob of solder connecting two adjacent pins on a component on
a circuit board. Depending on the design, a solder jumper can be used to connect two
pads or pins together. It can also cause unwanted shorts.
• Surface mount - construction method which allows components to be simply set on a
board, not requiring that leads pass through holes in the board. This is the dominant
method of assembly in use today, and allows boards to be populated quickly and easily.
• Thermal - a small trace used to connect a pad to a plane. If a pad is not thermally
relieved, it becomes difficult to get the pad to a high enough temperature to create a good
solder joint. An improperly thermally relieved pad will feel "sticky" when you attempt to
solder to it, and will take an abnormally long time to reflow.

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• Thieving - hatching, gridlines, or dots of copper left in areas of a board where no plane
or traces exist. Reduces difficulty of etching because less time in the bath is required to
remove unneeded copper.
• Trace - a continuous path of copper on a circuit board.

• V-score- a partial cut through a board, allowing the board to be easily snapped along a
line.
• Via - a hole in a board used to pass a signal from one layer to another. Tented vias are
covered by soldermask to protect them from being soldered to. Vias where connectors
and components are to be attached are often untented (uncovered) so that they can be
easily soldered.

Front and back of the same PCB showing a tented via. This via brings the signal from the front
side of the PCB, through the middle of the board, to the back side.

• Wave solder - a method of soldering used on boards with through-hole components

where the board is passed over a standing wave of molten solder, which adheres to
exposed pads and component leads.

Building PCB Footprints to Load Into Your Layout

To create a footprint using the pad that we just created, open up the Allegro PCB Editor and go
to File > New. In the New Drawing pop-up menu, select Package Symbol as the drawing type,
and since we are going to create a simple fourteen pin IC, give it a drawing name of SOIC-14.

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Once you’ve OK’ed the dialog box, it will open a new window for creating the footprint. Before
you start creating the part however, make sure that your parameters are set up the way you want
by going to the Setup > Design Parameters menu. In the design tab are the settings for sizes
and extents that you may want to adjust. You also have the choice of using the Design Workflow
window to access the setups, and in this case, we will click on Grids to adjust their size and
enable their display.

Now we will add some pins by going to the Layout > Pins pulldown menu. In the options
window, make sure that the pin type is set to Connect, and click on the 3 dot browser button to
select a padstack to use. Since our padpath was only set up for the directory that we saved our
75x25_smd pad in, that is the only padstack displayed in the pop-up browser. Double click on
the padstack that you want to use, and continue to set up the remainder of the options. In our
case, we want to place seven pins going down with a spacing of 0.050 inches between them.
Now you can move your cursor into the correct location for the first pin, and click the mouse
button to place all seven pins.

Placing pins in a surface mount footprint

In the picture above, you can see the first seven pins that have been placed, and the next row of
pins is ready to be placed in the lower right corner. With the pin order in the options changed
from down to up and the pin number starting at 8, all we have to do is to click the mouse button
to place the next column of pins.

As with any footprint you will want to add various graphics and attributes. These can include
silkscreen and assembly drawing shapes, pin 1 indicators, and component minimum and
maximum heights to name a few. You do need to add a boundary outline for the part, however,
and at least one of the layers needs to have a reference designator on it. Once all of this is
completed, you can save the part. Remember, like the padstack, you will want this package
symbol or footprint, to be saved into the directory that is specified by your “psmpath” so that the
Allegro PCB Editor can find it later.

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Loading PCB Footprints From Your CAD Libraries

With our footprint now created, we can load it into the PCB editor. In Allegro this is done by
going to the Place > Manually pulldown menu. If you are working on a layout that already has
other footprints in it, you will see them all in the Package symbols list of the Placement pop-up
menu. Click on the Advanced Settings tab and disable the display of the database symbols, and
then click back into the Placement List tab. Now you will only see the footprints saved to the
library directory that you have specified in your library path, just as we have done in the picture
below.

Using the Placement menu in Allegro PCB Editor to place the SOIC-14 footprint we just created

In the picture above we have selected our SOIC-14 from the placement menu to demonstrate
how a footprint is loaded into the PCB editor. You can see the new part just to the right of the
pop-up menu. If we had created additional parts, they would have been listed here in the
placement menu along with the SOIC-14. Together with the library path setups, this system of
footprint creation gives you precise control over your library as well as the footprints that you
load into the layout tools. But manually building padstacks and symbol packages isn’t the only
way to load new footprints into Allegro. There are some other options as well, which we’ll
explore in the next section.

PCB Outline, Mounting Requirements and Identification

The following precautions should be taken when designing a PCB.

PCB Outline

Make sure that this is well defined and drawn in the Keep Out layer

PCB Mounting Requirements

You need to give careful thought as to how your PCB will be mounted and factor this into your design.
This may be by way of mounting holes (use sizes of 3mm or 4mm typically). But other methods of
PCBmounting are also acceptable.

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Figure 6 Changing the parameters of a PAD

PCB Identification
To facilitate in identifying & distributing PCBs once they are made, make sure that your PCB is
identified in the following manner:

• Part IV project students: Course Number / Project No.

o examples: EE 401 / Prj 95, CS 401 / Prj 83, SE 401 / Prj 16
• Part III design students: Course No. / Group No.
o examples: EE 310 / Grp 12, CS 301 / Grp 5
• All others: write their UPI or PCB title (whichever is convenient)
The text used for identification can be placed either on the top or bottom layers. If placed on the
Bottom layer, it should be mirrored, but if on the Top layer, it should not.

Design Rule Checking

Once you have completed your PCB design, you need to verify that it complies with the design rules. Do
this as follows:

Choose Tools >> Design Rule Check & then click on Run Design Rule Check

Design Rule check highlights any design violations in your design. If you have complied with all the
design rules, there should be no rule violations. However, if in your design you have run tracks through
the adjacent pins of an IC, then the Minimum Clearance of 0.5mm (20mil) won’t be met and a violation
will be highlighted. In this situation you can add a new Clearance Design Rule just for the footprint of the
component in question (in this case and IC).

For more details on how to add a clearance rule, read the Getting Started With PCB Design. This is
a PDF document and can be found in Protel help.

Submitting Your Design for Manufacture

Before submitting your design for manufacture, you should complete the check list contained in
Appendix A. Once you have completed your PCB design, you need to send the PCB file
(.pcbdoc) to the project technician so that your PCB can be made.

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Introduction to PCB: Definition and Need/Relevance of PCB, Background and History of PCB, Types
of PCB, Classes of PCB Design, Terminology in PCB Design, Different Electronic design automation
(EDA)tools and comparison.

Printed Circuit Boards (PCBs) can be defined as rugged nonconductive boards built on substrate-
based structure as shown in Fig. 4.1. The PCBs are mainly used to provide electrical connection
and mechanical support to the electrical components of a circuit. They are prevalent in electronic
devices and can be easily identified as the green-colored board in most cases. Based on the
design specifications and requirements, many active (for example, operational amplifiers and
batteries) and passive components (such as inductors, resistors, and capacitors) are mounted on
the PCBs to match the form factor of the final design. Form factor can be defined as a feature of
any hardware design that specifies the size, shape, and other relevant physical properties of the
PCB in its entirety. While determining a form factor of a PCB design, aspects such as chassis,
mounting schemes, and board configurations are taken into consideration. The connection among
the components on a PCB are established with copper interconnects (routes), which act as the
pathway for the electrical signals.

Figure Modern PCBs are very complex with multiple layers and several components arranged in
a compact manner to minimize the overall size. A modern PCB in different forms, such as
layout, schematic, and its final output is shown in this figure.

Since its first development, PCB designs have significantly evolved over time.
Modern-day PCBs largely vary in complexity, starting from single layer PCBs to complex
designs with as many as 20 to 30 layers with hidden vias and embedded components [18]. PCB
vias can be defined as vertical interconnect accesses for establishing the electrical connection
through one or more adjacent layers of the circuit board.

PCBs play a vital role in area, power, performance, reliability, and security of a computing
system. The PCB design and test process should consider these parameters. This chapter
provides an overview of the PCBs with a highlight on current practices of design and test.
It discusses the electrical components used in a PCB and different types of boards available.
It also presents a brief history of PCB evolution highlighting the changes in PCB design with
technological progress. The complete life cycle of modern PCB design is also depicted in the
chapter with an illustrative description of the steps and parties involved in these steps.

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PCB Design Process: PCB Design Flow, Placement and routing, Steps involved in layout design, Artwork
generation Methods - manual and CAD, General design factors for digital and analogue circuits, Layout
and Artwork making for Single-side, double-side and Multilayer Boards, Design for manufacturability,
Design-specification standards

PCB Design Process and Fabrication Challenges

Virtually every electronic product is constructed with one or more printed-circuit boards (PCBs).
The PCBs hold the ICs and other components and implement the interconnections between them.
PCBs are
What is Design for Manufacturing or DFM?
Design for Manufacturing (DFM) is the process of designing parts, components or products for
ease of manufacturing with an end goal of making a better product at a lower cost. This is done
by simplifying, optimizing and refining the product design. The acronym DFMA (Design for
Manufacturing and Assembly) is sometimes used interchangeably with DFM.

Five principles are examined during a DFM. They are:

1. Process
2. Design
3. Material
4. Environment
5. Compliance/Testiing

Ideally, DFM needs to occur early in the design process, well before tooling has begun. In addition,
properly-executed DFM needs to include all the stakeholders — engineers, designers, contract
manufacturer, moldbuilder and material supplier. The intent of this “cross-functional” DFM is to
challenge the design — to look at the design at all levels: component, sub-system, system, and holistic
levels — to ensure the design is optimized and does not have unnecessary cost embedded in it.

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The following chart offers an excellent visual representation of the effect of an early
DFM. As the design progresses through the product life cycle, changes become more
expensive, as well as more difficult to implement. Early DFM allows design changes
to be executed quickly, at the least expensive location.

Pulling stakeholders together early in the design process is easier if you're developing
a new product, but even if you're dealing with an established product, challenging the
original design is a necessary element of a thorough DFM. Too often, mistakes in a
design are repeated by replicating a previous design. Question every aspect of your
design.

• Look at the original drawings.

• Tear down the product.
• Look at competitive and near-neighbor products, as well as lead users such as
medical and automotive.
• Talk to your contract manufacturer — who may have solved the problem with
a different customer?
• Has someone else solved this problem a different way?
• Is there a way to make it better?

A lot of thought, time and effort go into a DFM. Jeff Tadin, our senior product
development engineer, has almost 30 years of experience with product development,
design and manufacturing. Today, he’s going to walk us through a hypothetical DFM
process using a basic computer mouse (this mouse was not produced by East West
Manufacturing.)

PRINCIPLES OF DFM: A CLOSER LOOK

1 | PROCESS

The manufacturing process chosen must be the correct one for the part or product. You
wouldn't want to use highly-capitalized process like injection molding which involves
building of tools and dies to make a low-volume part that could have been
manufactured using a lower-capitalized method, such as thermoforming. That would be
equivalent to using a tank to squash an anthill — a classic case of overkill. Let's see
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what Jeff has to say about selecting the right manufacturing process:

2 | DESIGN

Design is essential. The actual drawing of the part or product has to conform to good
manufacturing principles for the manufacturing process you’ve chosen. Here's Jeff,
talking aboutdesign of the mouse:

In the case of plastic injection molding, for example, the following principles would apply:

• Constant wall thickness, which allows for consistent and quick part cooling
• Appropriate draft (1 - 2 degree is usually acceptable)
• Texture - need 1 degree for every 0.001” of texture depth on texture side walls
• Ribs = 60 percent of nominal wall, as a rule of thumb
• Simple transitions from thick to thin features
• Wall thickness not too small - this increases injection pressure
• No undercuts or features that require side action - all features “in line of pull/mold opening”
• Spec the loosest tolerances that allow a good product - and consult the trade
organization for your manufacturing process on what is reasonable for that process

Be sure to discuss the design with your contract manufacturer, who can ensure that
your designconforms to good manufacturing principles for the selected process.
3 | MATERIAL

It's important to select the correct material for your part/product. In this video, Jeff
talks aboutsome of the criteria that go into that decision:

Some material properties to consider during DFM include:

• Mechanical properties - How strong does the material need to be?

• Optical properties - Does the material to be reflective or transparent?
• Thermal properties - How heat resistant does it need to be?
• Color - What color does the part need to be?
• Electrical properties - Does the material need to act as a dielectric (act as an
insulator rather than a conductor)?
• Flammability - How flame/burn resistant does the material need to be?

Again, be sure to discuss the material with your contract manufacturer, who might
have access to existing materials in their portfolio which would allow you to secure
lower material pricing.

4 | ENVIRONMENT

Your part/product must be designed to withstand the environment it will be subjected

to. All the form in the world won’t matter if the part can’t function properly under its
normal operating conditions:

5 | COMPLIANCE/TESTING

All products must comply with safety and quality standards. Sometimes these are
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industry standards, others are third-party standards and some are internal, company-
specific standards.

FACTORS THAT AFFECT DFM

The goal of DFM is to reduce manufacturing costs without reducing performance. In

addition to the principles of DFM, here are five factors that can affect design for
manufacturing and design for assembly:

1 | Minimize Part Count

Reducing the number of parts in a product is the quickest way to reduce cost because
you are reducing the amount of material required, the amount of engineering,
production, labor, all theway down to shipping costs.

2 | Standaradize Parts and Materials

Personalization and customization are expensive and time-consuming. Using

quality standardized parts can shorten time to production as such parts are typically
available and youcan be more certain of their consistency.

Material is based on the planned use of the product and it's function. Consider:

• How should it feel? Hard? Soft?

• Does it need to withstand pressure?
• Will your part or product need to conduct heat, electricity?

3 | Create Modular Assemblies

Using non-customized modules/modular assemblies in your design allows you to

modify the product without losing its overall functionality. A simple example is a
basic automobile that allows you to add in extras by putting in a modular upgrade.

4 | Design for Efficient Joining

Can the parts interlock or clip together? Look for ways to join parts without the use
of screws,fasteners or adhesives. If you must use fasteners, here are a few tips:
• Keep the number, size and variation of fasteners to a minimum
• Use standard fasteners as much as possible.
• Use self-tapping and chamfered screws for better placement.
• Stay away from screws that are too long or too short, separate washers, tapped
holes, round heads and flatheads.

5 | Minimize Reorientation of Parts During Assembly & Machining

Parts should be designed so that a minimum of manual interaction is necessary during

productionand assembly.

6 | Streamline Number of Manufacturing Operations/Processes

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The more complex the process of making your product, is the more variables for
error are introduced. Remember what Jeff said: All processes have limitations
and capabilities. Only include those operations that are essential to the function
of the design.

7 | Define "Acceptable" Surface Finishes

Unless it must be trade show grade, go with function rather than flashy for your surface finish.

The Gerber file set is PCB jargon for the output files of the layout that are
used by PCB manufacturers to create the PCB. A complete set of Gerber files
includes outputfiles
generated from the board layout file:
• Silkscreen top and bottom
• Solder mask top and bottom
• All metal layers
• Paste mask top and bottom
• Component map (X-Y coordinates)
• Assembly drawing top and bottom
• Drill file
• Drill legend
• FAB outline (dimensions, special features)
• Netlist file
• Gentle Learning Curve
• Intuitive GUI
• Routine Tasks Performed By Easy To remember Hotkeys
• Comprehensive Constraint Manager handling High-Speed Signal Integrity and Easy to Grapple
• Manageable File Structure
• Easy to Create and Manage Library Manager
• Intuitive 3D Visualization Engine
• Decent Auto-Routing capability
• Connect Seamlessly to Its Schematic Tool For Easier ECOs
• Allow Manageable Exports of Manufacturing Outputs
• Handle Large Number of Copper Shapes
• Allow Designer to Easily Manage Large Number of Layers
• Embedded CAM Engine That Follows CAD Tool’s GUI
• Not Too Overpriced

Single-Sided Boards
A single-side PCB, also known as a single-layer PCB, is simple and affordable to
produce. The manufacturer begins with a base core material, such as fiberglass (FR4),
which the core has a layer of copper on it. This copper material makes the board
conductive and allows electricity to flow through. Then, they add a solder mask that
insulates the conductive copper sheet below.

Finally, they cover the rest of the layers with a silkscreen print that indicates the
location for each part. When creating a single-sided board, the manufacturer adds these
layers to one side only. Single-sided boards may not have the same complexity as their
counterparts, but they power a wide range of everyday electronics. Since they cost so
little to make, you can find them in bulk-manufactured devices like:

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• Cameras
• Audio equipment
• Power supplies
• Calculators
• Solid state drives
• Printers
Double-Sided PCBs
Making double-sided PCBs involves the same kinds of layers as a single-sided board.
The difference between double-sided and single-sided PCBs is that instead of using a
single-sided copper core, the manufacture will start a core with copper on both sides.
During production, they also drill holes called vias that they can plate or fill with a
conductive, or non conductive material. The electrical current travels from one side of
the board to the other through these vias. Double-sided PCBs have a higher cost than
single-sided boards, but they provide twice as much space for components. Electronics
that need an intermediate level of circuit complexity use double-sided PCBs to
operate. Double-sided boards power more complicated devices than single-sided
PCBs, but they can’t handle advanced applications like computers or smartphones.
They appear in electronics such as:

• LED lighting
• Vending machines
• Car dashboards
• Phone systems
• Industrial controls

Multilayer Printed Circuit Boards

Multilayer PCBs can support a high level of circuit complexity because they consist
of three or more copper layers laminated together. The manufacturer starts a core that
has the same materials as a typical single-sided or double-sided PCB. After etching
the inner core, they add layers of prepreg, a soft fiberglass. This material keeps the
layers together and becomes hard fiberglass after the board goes through a hot press.
As a result of the curing process, multilayer PCBs are tough and durable. If the
manufacture is building a 4 Layer pcb they typically will use one core, prepreg and
they copper foil for the top and bottom layers. We have complex technology like
computers and data servers thanks to the high capacity of multilayer PCBs. Other
examples of devices powered by multilayer PCBs include:
• Fiber optics
• Smartphones
• GPS systems
• Scientific and space equipment
• Heart monitors
• Atomic accelerators

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Voltage Regulator Circuit and PCB layout using IC7805

Aim: To design Voltage regulator circuit and PCB layout design using 7805.

Apparatus:

• IC 7805

• Capacitors -2 (0.33uF)

• DC Power Supply Voltage: from 8V to 15V

• PCB Board

• CAD Soft Eagle Software

A voltage regulator is used to produce a constant linear output voltage. It’s generally used with AC to DC power

supply. And also it can be used as well as a DC to DC voltage converter .

Circuit diagram of 7805 Voltage Regulator

7805 Voltage Regulator PCB Layout diagram using Cadsoft Tool

Result: Hence the voltage regulator circuit using IC7805 and PCB layout using Cadsoft software
designed successfully.

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Astable Multivibrator Circuit and PCB layout using IC555

Aim:

To design and create a PCB layout for an Astable Multivibrator using the 555 timer.

Apparatus/Components:
1. IC 555 Timer (1 unit)
2. Resistors (e.g., 1 kΩ and 10 kΩ, or as per the desired frequency)
3. Capacitors (e.g., 0.01 µF and 10 µF for timing and stability)
4. Power Supply (e.g., 5V to 15V DC)
5. PCB Board and Etching Supplies
6. PCB Design Software (e.g., KiCAD, Eagle, or EasyEDA)
7. Soldering Equipment and Connecting Wires

Circuit Diagram:

Circuit diagram of Astable Multivibrator using IC555 timer

PCB Layout:

Astable Multivibrator using IC555 timer PCB Layout diagram using Cadsoft Tool

Result: Hence an Astable Multivibrator circuit using IC555 and PCB layout using Cadsoft software
designed successfully.

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Full Adder using Half Adders Circuit and PCB layout

Aim:

To design and implement a Full Adder circuit using two Half Adder circuits and an OR gate, and to
create a PCB layout for the circuit.

Apparatus/Components:
1. ICs:
o XOR gate IC (e.g., 74LS86)
o AND gate IC (e.g., 74LS08)
o OR gate IC (e.g., 74LS32)
2. Power Supply (e.g., 5V DC)
3. PCB Board and Etching Supplies
4. PCB Design Software (e.g., KiCAD, Eagle, or EasyEDA)
5. Connecting Wires
6. Soldering Equipment

Circuit Diagram:

Circuit Diagram of Full Adder using Half Adders

PCB Layout:

Full adder Circuit using Half adders PCB layout Diagram

Result: Hence Full adder using half adders and PCB layout using Cadsoft software designed
successfully.

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