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PCB PPT

A Printed Circuit Board (PCB) is used to support and connect electronic components through conductive pathways. There are various types of PCBs, including single-layer, double-layer, and multi-layer, and they are made from flame-retardant materials with specific properties for safety and durability. The manufacturing process involves multiple steps, from design to testing, and there are numerous companies involved in PCB production across different cities.

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0% found this document useful (0 votes)
38 views

PCB PPT

A Printed Circuit Board (PCB) is used to support and connect electronic components through conductive pathways. There are various types of PCBs, including single-layer, double-layer, and multi-layer, and they are made from flame-retardant materials with specific properties for safety and durability. The manufacturing process involves multiple steps, from design to testing, and there are numerous companies involved in PCB production across different cities.

Uploaded by

prema.cbe19
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PPTX, PDF, TXT or read online on Scribd
You are on page 1/ 6

PRINTED CIRCUIT BOARD

(PCB)
 PRINTED CIRCUIT BOARD (PCB ):
A Printed Circuit Board (PCB) is a board used to mechanically support and electrically connect
electronic components using conductive pathways, tracks, or signal traces etched from copper sheets laminated
onto a non-conductive substrate.

 TYPES OF PCB Layers:


1.Single-Layer PCB – One layer of conductive material, used in simple devices.
2.Double-Layer PCB – Conductive layers on both sides, allowing more complex circuits.
3.Multi-Layer PCB – More than two layers for high-density, advanced applications.
TYPES OF PCB MATERIALS
FR SERIES PCB MATERIALS & THEIR APPLICATIONS
 FR Full Form is Flame-Retardant

 Key Features of Flame-Retardant Materials:


1. Fire Resistance – Prevents or delays burning
2. Self-Extinguishing – Stops burning once the flame source is removed
3. Heat Resistance – Withstands high temperatures without melting
4. Safety: Prevents electrical fires in devices
5. Durability: Ensures longer lifespan in high-heat environments

 Type of Flame Retardant-FR:


1. FR-1 (Flame Retardant-1)
2. FR-2 (Flame Retardant-2)
3. FR-3 (Flame Retardant-3)
4. FR-4 (Flame Retardant-4)
5. FR-5 (Flame Retardant-5)
6. FR-6 (Flame Retardant-6)
FR BOARD COMPARISON TABLE

Material Base Material Layers Properties Applications

FR-1 Paper +
Low-Cost Materials Phenolic Single Basic electronics
1.Low cost
FR-2 Paper + 2.Low mechanical strength Budget-friendly PCB
Low-Cost Materials Epoxy/Phenolic Single 3. Higher heat resistance designs

FR-3 Improved 1.Slightly better insulation than FR-2


Single-Layer Paper + Epoxy Single 2. Moderate heat resistance Small consumer electr
General purpose-Com
1.High mechanical strength smartphones,
FR-4 2.Good electrical insulation industrial electronics
Most Common PCB Fiberglass + 3.Widely used in all industries Automotive and aeros
Material Epoxy Multi-layer 4.Higher heat resistance circuits
1.Very Higher heat resistance than
FR-4 1.Military and aerospa
FR-5 Advanced 2.Improved mechanical strength electronics
OTHER TYPES OF PCB MATERIALS

• & (Composite Epoxy Material):


Material Base Material Layers Properties Applications
CEM-1-Composite
Epoxy Material Low cost,
low-cost and better
CEM-3-Composite Paper, fiberglass, and than CEM-1, close to LED lighting,
Epoxy Material epoxy combinations FR-4 household appliances
High thermal LED lighting, power
MCPCB-Metal Core Aluminum and copper conductivity, converters, automotive
PCB core Better heat dissipation applications
Rogers Material- RF & microwave
High-Frequency Ceramic-filled PTFE Stable at high applications, 5G
Laminates PCB (Teflon) frequencies communication
PCB MANUFACTURING PROCESS
1.Design & Layout – Using software like KiCad, Altium, Eagle , Proteus, EasyPC to create the PCB
design.
2.Printing the PCB Design – The layout is printed onto a film for further processing.
3.Substrate Preparation – The base material (e.g., FR4) is cut and cleaned.
4.Copper Lamination – Thin copper layers are laminated onto the substrate.
5.Photoresist Application & UV Exposure – A light-sensitive film is applied, then exposed to UV
light through a mask.
6.Etching – Unwanted copper is removed, leaving behind the desired circuit traces.
7.Drilling – Holes are drilled for through-hole components and vias.
8.Plating & Deposition – Copper is electroplated into drilled holes to create electrical connections.
9.Solder Mask Application – A protective layer is applied to insulate copper traces.
10.Silkscreen Printing – Labels, component markings, and logos are added.
11.Surface Finish – Coating is applied to prevent oxidation (e.g., HASL, ENIG, OSP).
12.Testing – Electrical and functional tests are performed.
13.Cutting & Final Inspection – PCBs are cut into shape and inspected for quality.
SL.NO Company Name City
1 Genus Electrotech Ltd Kutch
2 Ascent Circuits Pvt. Ltd Hosur
3 Shogini Technoarts Pvt. Ltd Pune
4 Epitome Components Ltd Ahmednag
5 CIPSA-TEC India Pvt Ltd Tumkur
6 Meena Circuits Pvt Ltd Vadodara
7 Fine Line Circuits Ltd. Mumbai
8 Akasaka Electronics Limited Mumbai
9 Circuit Systems India Ltd / PCB Power Gandhinag
10 SB Electronics Gandhinag
11 Micro Pack Bangalore
12 India Circuits Ltd / Garg Electronics Panchkula
13 Sulakshana Circuits Ltd Hyderabad
14 Sonic Technology (India), Inc Ahmedaba
15 Hi-Q Electronics Pvt. Ltd Bangalore
16 PC Process Pvt Ltd Bangalore
17 NSP Electronics Bangalore
18 BCC FUBA INDIA LIMITED Solar
19 BLG Electronics Gandhinag
20 Lion Circuits Bangalore

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