Low Power CMOS VLSI Design: Aditya Japa Assistant Professor (ECE) KL Hyderabad 12/07/2021
Low Power CMOS VLSI Design: Aditya Japa Assistant Professor (ECE) KL Hyderabad 12/07/2021
Aditya Japa
Assistant professor (ECE)
KL Hyderabad
12/07/2021
Course Objective
Exploration of low power techniques with transistor, circuit, and architectural
level for CMOS VLSI sub-systems. Design and analysis of low voltage, low
power adders, multipliers and low power memories (SRAM and DRAM).
Course Contents
• Sources of power dissipation
Research work: Tunnel FET based Energy Efficient Circuit Design with Enhanced
Hardware security.
Teaching interests: Circuits and Systems for VLSI, Cryptography and hardware security.
N-channel MOSFET
Symbols of MOSFET:
PMOS NMOS
• Transfer characteristics are drawn between VGS and ID, it shows that NMOS produces the drain
current when VGS greater than threshold voltage(Vt).
• The output characteristics are drawn between VDS and ID. At small vale of VDS MOSFET
operates in the triode region, and when VDS increases it enters into saturation region.
Regions of operation
• Cut-off region: VGS 0, VDS 0
With this biasing transistor will be in cut-off region and zero current flows
2 L
Complementary metal-oxide-semiconductor (CMOS)
technology
• CMOS technology is a predominant technology for manufacturing integrated
circuits. This technology uses both NMOS and PMOS to realize various logic
functions.
• Hence direct current flows from Vout to the ground which shows that Vout = 0 V.
• On the other hand, when Vin is low then NMOS transistor is OFF and PMOS transistor is ON.
• Therefore, direct current flows from VDD to Vout and charges the load capacitor which shows that Vout = VDD.
Voltage transfer characteristics (VTC)
• VTC is drawn between input and output of the
inverter.
• PMOS and NMOS devices operate in different
regions at different parts of VTC.
• The VTC of the inverter hence exhibits a very
narrow transition zone.
Benefits of CMOS technology over MOS
• Very low static power consumption