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Ece113 Lec05 Components at RF

The document discusses how circuit components behave at radio frequencies (RF). It explains that at high frequencies, wires have increased resistance due to skin effect and self-inductance. Resistors and capacitors also exhibit self-inductance and parasitic capacitance/resistance respectively. The quality and impedance of components is affected by their construction and varies significantly with frequency. Proper component selection is important for circuit design in the RF spectrum.

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0% found this document useful (0 votes)
28 views42 pages

Ece113 Lec05 Components at RF

The document discusses how circuit components behave at radio frequencies (RF). It explains that at high frequencies, wires have increased resistance due to skin effect and self-inductance. Resistors and capacitors also exhibit self-inductance and parasitic capacitance/resistance respectively. The quality and impedance of components is affected by their construction and varies significantly with frequency. Proper component selection is important for circuit design in the RF spectrum.

Uploaded by

許耕立
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© © All Rights Reserved
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You are on page 1/ 42

ECE 113 Lecture 05:

Components at RF
BEHAVIOR OF CIRCUIT COMPONENTS AT RF

ECE 113: COMMUNICATION ELECTRONICS 1


Series RLC Circuit

Resistor Inductor

Wires
Capacitor

2
In High Frequencies
• Wires
◦ Increased resistance due to skin effect.
◦ Significant self-inductance due to large electrical length.

• Resistors
◦ Wires create self inductance and capacitance.
◦ Wound resistors have large self-inductance.

• Capacitors
◦ Insulator has a finite conductance.
◦ Through-hole wires have self-inductance.

• Inductors
◦ Needs long wires, has a significant resistance and distributed
capacitance.

3
Wires
•Metal interconnects, device leads, etc.

•Insulated or un-insulated; solid, hollow, or braided

•Ideally act as short circuit (at DC and low AC freq)

•Behavior in the RF spectrum depends mostly on


diameter and length

4
Skin Effect
•At RF (or AC high frequencies), current density is
concentrated around the “skin” of the conductor.
◦ Due to “eddy currents” induced inside conductor

5
Skin Effect
•e.g. - AWG #22 Copper wire (25.3 mils / 0.64 mm diameter)
at f = 10 kHz

6
Skin Effect
•e.g. - AWG #22 Copper wire (25.3 mils / 0.64 mm diameter)
at f = 1 MHz

7
Skin Effect
•Occurs for all conductors including resistor leads,
capacitor leads, etc.
◦ At high frequencies, effects of component leads CANNOT be
neglected

•For a particular conductor, we can quantify skin effect


by computing for the skin depth.

𝜎 𝛿𝑠 @ 10 GHz
Aluminum 3.816 × 107 S 8.14 × 10−7 m
Gold 4.098 × 107 S 7.86 × 10−7 m
Copper 5.813 × 107 S 6.60 × 10−7 m
Silver 6.173 × 107 S 6.40 × 10−7 m

8
Skin Depth, δS
•Depth into the conductor at which the charge-carrier
density falls to 1/e or 37% of its value along the surface.
•A function of frequency (f), permeability (μ) and
conductivity (σ) of the medium.

2 1
S = =
 f

•Can be thought of as the effective depth in which a


uniform current density penetrates into the conductor
9
The “Effect” of Skin Effect
•For AC high freq, most of the current flow inside a good
conductor is concentrated in a very thin region near the
surface of the conductor.

•The effective cross-sectional area of a conductor is reduced


due to skin effect resulting in a considerable increase in AC
resistance for the conductor.
L
R =
 (AEFF  )
•May cause impedance matching problems when cascaded

10
Self-Inductance
•For AC, magnetic field varies in time, and will induce a
voltage (and current) across the conductor which opposes
the change in the current flow.

•This opposition to the change is called the self-inductance.

11
Self-Inductance
•As frequency increases, self-inductance becomes more
significant (will be discussed later - Inductors).

•All conductors exhibit this property of inductance at RF.

•Depends on both length and diameter of conductor.

12
Inductance of
Straight-Wire Conductors
4𝓁
𝐿 = 0.002𝓁 2.3 log − 0.75 𝜇𝐻
𝑑

•L = inductance (in μH)


•l = length of wire (in cm)
•d = diameter of wire (in cm)

•NOTE: This is an approximation (from Bowick) that assumes


conductor is non-magnetic and has l >> d

13
Resistors
•Resistance - property of a material that determines the
rate at which electrical energy is converted to heat
energy for a given electric current

•Resistors are used extensively in circuits


◦ Bias networks, signal combiners, attenuators, matching
networks, etc.

•RF characteristics vary significantly from resistor DC


equivalent - may even disrupt circuit operation

14
Resistor at RF
•Resistor Equivalent Circuit

R – Resistor value
L – Lead inductance
C – Combination of
parasitic capacitances

•Parasitic capacitances vary significantly between different


resistor structures

15
Common Resistor Types
•Carbon Composition Resistors

•Wire-Wound Resistors

•Metal-Film Resistors

•Thin-Film Chip Resistors

16
Comparison of Resistors
Type Image Peformance at RF
High capacitance due to carbon
Carbon
granules
Composition
Poor RF response

High inductance due to windings


Wire-Wound
Poor RF response

Inductance and capacitance are


Metal Film small
Useful up to 10 MHz

Inductance and capacitance are


Thin Film Chip greatly reduced
~0 parasitics up to 2 GHz

17
Capacitors
•Capacitance - property that permits storage of charge
when a potential difference exists between conductors
separated by an insulating material or dielectric

18
Applications of Capacitors

19
Common Dielectrics
Dielectric Constant
Dielectric K or εr
Air 1
Polystyrene 2.5
Paper 4
Mica 5
Mylar (Polyester Film) 3.2
Ceramic (low K) 10
Ceramic (high K) 100 – 10,000

•Dielectric’s characteristics determine voltage level


extremes and temperature dependence

20
Capacitors at RF
•Capacitor Equivalent Circuit
C – Capacitance
RS – Series Resistance
RP – Insulation
Resistance
L – Inductance of
leads

21
Capacitor Considerations (at
RF)
•Insulation Resistance (RP)
◦ Measure of amount of DC leakage current that flows
through dielectric of capacitor when voltage is applied
◦ RP ≈ 100 GΩ (Resistance at DC)

•Effective Series Resistance (ESR)


◦ RP and RS combined
◦ AC resistance of capacitor
◦ Decreases w/ frequency
•C in uF
PF
ESR = (110 6 )[],  = 2f
C
22
Capacitor Considerations (at
RF)
•Dissipation Factor (DF)
◦ Ratio of the AC Resistance to the Capacitor’s Reactance

ESR
DF = x100%
XC
•Component Quality Factor (Component Q)
◦ Measure of the ability of an element to store energy

XC 1 1
QC = = =
ESR C ( ESR) DF
23
Quality Factor for Capacitor
•The larger the Q, the better the capacitor.

•Measures how close to ideal the capacitor is.

•Ideally, Q = ∞.

24
Capacitor Impedance vs. Freq.

25
Internal Inductance of
Capacitors
•Larger-valued capacitors tend to exhibit higher internal
inductance than smaller-valued capacitors.

•Impedance ZC↓ as freq↑ NOT necessarily true.

•Only way to be sure is to use an LCR Meter or a


Network Analyzer to measure actual impedance,
especially when working with circuits at frequencies
100MHz and above.

26
Common Capacitor Types
•Ceramic Capacitors

•Mica Capacitors

•Metalized Film (Teflon, Polystyrene, Polyester, Paper)

27
Comparison of Capacitors
Type Image Characteristics/Uses

Performance largely dependent on


Ceramic dielectric constant
Higher 𝜖𝑟 , poorer RF performance

Multilayer
Useful above 500 MHz
Ceramic Chip
High Q factor
(MLCC)

Low 𝜖𝑟 , Bulky
Metalized
Stable temperature characteristics
Film
Used in resonant circuits

Bulkier than Metalized Film


Thin Film Chip Used for filtering, bypassing, and
coupling

EEE 107: INTRODUCTION TO COMMUNICATION SYSTEMS 28


Inductors
•Wire-wound or coiled as to increase flux linkage NΦ
between the N turns of the coil.
◦ Increasing NΦ increases the wire’s self inductance L

Nf
L=
i
29
Applications of Inductors
•Resonant circuits, filters, phase-shift and delay
networks, and as RF chokes

30
Inductors (at RF)
•Probably the component
most prone to very drastic
changes over frequency

•Distributed capacitance
and series resistance play
a major role in the
performance of an
inductor

31
Inductors (at RF)
•Inductor Equivalent Circuit

L – Inductance
RS – AC Resistance
Cd – Distributed
Capacitance

32
Inductor Impedance vs. Freq

•The RS keeps the impedance finite at resonance. It also


broadens the resonance peak

33
Inductor Considerations (at RF)
•Component Quality ▪ Q variation versus frequency
Factor
◦ Measures
how close to ideal the
inductor is

XL
QL =
RS

34
Inductor Design
•Ways to increase the Q of an inductor
◦ Use a larger diameter wire
◦ Decrease DC and AC resistance to some extent

◦ Spread windings apart


◦ Decrease distributed capacitance

◦ Increase the permeability of the flux-linkage


path
◦ Winding around a magnetic-core material

35
Single-Layer Air-Core Inductor
Design
2 2
0.394r N
L= H
9r + 10l
Where:
•r – coil radius (in cm) l – coil length (in cm)
•N – number or turns L – inductance (in uH)

Notes:
•When l > 0.67r, L is accurate to 1%
•Optimum Q is attained when l = 2r

36
Magnetic Core Materials
•Has greater permeability than air

•Allows an inductor to have greater inductance with


fewer turns

•Advantages
◦ Smaller size
◦ Increased Q
◦ Variability

37
Magnetic Core Materials
•Disadvantages
◦ Each core tends to introduce losses
◦ Permeability of all magnetic cores changes with frequency
◦ The higher the permeability, the more sensitive to temp.
variation
◦ The permeability changes w/ the applied signal level

38
Toroids
•Ring or doughnut-shaped
magnetic material widely used
to wind RF inductors and
transformers
•Usually made of iron or ferrite
•W/ very high permeability thus
allowing higher Q
•Almost completely contain the
magnetic flux w/ in itself

39
Self-shielding

Contains the magnetic flux within


Radiates RF signals flowing within the material itself

40
Summary

41
Summary

Original
Components

42

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