Motorola Mvme162
Motorola Mvme162
- ~ ARTISAN®
~I TECHNOLOGY GROUP
with experienced engineers and technicians on staff.
Motorola® and the Motorola symbol are registered trademarks of Motorola, Inc.
Delta SeriesTM, MC68040TM, VMEmoduleTM, VMEsystemTM, VMEexecTM, and 162BugTM
are trademarks of Motorola, Inc.
IndustryPackTM and IPTM are trademarks of GreenSpring Computers, Inc.
TimekeeperTM and ZeropowerTM are trademarks of Thompson Components.
All other products mentioned in this document are trademarks or registered
trademarks of their respective holders.
© Copyright Motorola 1993, 1994
All Rights Reserved
Printed in the United States of America
July 1994
Safety Summary
Safety Depends On You
The following general safety precautions must be observed during all phases of operation, service, and
repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in
this manual violates safety standards of design, manufacture, and intended use of the equipment. Motorola,
Inc. assumes no liability for the customer’s failure to comply with these requirements.
The safety precautions listed below represent warnings of certain dangers of which Motorola is aware. You,
as the user of the product, should follow these warnings and all other safety precautions necessary for the
safe operation of the equipment in your operating environment.
Ground the Instrument.
To minimize shock hazard, the equipment chassis and enclosure must be connected to an electrical ground.
The equipment is supplied with a three-conductor AC power cable. The power cable must either be plugged
into an approved three-contact electrical outlet or used with a three-contact to two-contact adapter, with the
grounding wire (green) firmly connected to an electrical ground (safety ground) at the power outlet. The
power jack and mating plug of the power cable meet International Electrotechnical Commission (IEC) safety
standards.
Do Not Operate in an Explosive Atmosphere.
Do not operate the equipment in the presence of flammable gases or fumes. Operation of any electrical
equipment in such an environment constitutes a definite safety hazard.
Keep Away From Live Circuits.
Operating personnel must not remove equipment covers. Only Factory Authorized Service Personnel or
other qualified maintenance personnel may remove equipment covers for internal subassembly or
component replacement or any internal adjustment. Do not replace components with power cable
connected. Under certain conditions, dangerous voltages may exist even with the power cable removed. To
avoid injuries, always disconnect power and discharge circuits before touching them.
Do Not Service or Adjust Alone.
Do not attempt internal service or adjustment unless another person, capable of rendering first aid and
resuscitation, is present.
Use Caution When Exposing or Handling the CRT.
Breakage of the Cathode-Ray Tube (CRT) causes a high-velocity scattering of glass fragments (implosion).
To prevent CRT implosion, avoid rough handling or jarring of the equipment. Handling of the CRT should
be done only by qualified maintenance personnel using approved safety mask and gloves.
Do Not Substitute Parts or Modify Equipment.
Because of the danger of introducing additional hazards, do not install substitute parts or perform any
unauthorized modification of the equipment. Contact your local Motorola representative for service and
repair to ensure that safety features are maintained.
Dangerous Procedure Warnings.
Warnings, such as the example below, precede potentially dangerous procedures throughout this manual.
Instructions contained in the warnings must be followed. You should also employ all other safety
precautions which you deem necessary for the operation of the equipment in your operating environment.
vii
CHAPTER 2 HARDWARE PREPARATION AND INSTALLATION
Introduction .................................................................................................................2-1
Unpacking Instructions..............................................................................................2-1
Hardware Preparation ...............................................................................................2-1
SIM Selection ........................................................................................................2-2
Removal of Existing SIM .............................................................................2-4
Installation of New SIM ..............................................................................2-5
System Controller Select Header (J1)................................................................2-5
Synchronous Clock Select Header (J11) for Serial Port 1/Console ..............2-6
Clock Select Header (J12) for Serial Port 2 .......................................................2-6
SRAM Battery Backup Source Select Header (J20) .........................................2-7
EPROM Size Select Header (J21) .......................................................................2-7
General-Purpose Readable Jumpers Header (J22)..........................................2-8
Installation Instructions .............................................................................................2-9
IP Installation on the MVME162 .......................................................................2-9
MVME162 Module Installation .......................................................................2-10
System Considerations .....................................................................................2-12
viii
CHAPTER 4 FUNCTIONAL DESCRIPTION
Introduction ................................................................................................................ 4-1
MVME162 Functional Description .......................................................................... 4-1
Data Bus Structure .............................................................................................. 4-1
MC68040/MC68LC040 MPU ............................................................................ 4-2
EPROM and Flash Memory............................................................................... 4-2
SRAM.................................................................................................................... 4-2
About the Battery......................................................................................... 4-3
Onboard DRAM .................................................................................................. 4-4
Battery Backed Up RAM and Clock................................................................. 4-5
VMEbus Interface and VMEchip2 .................................................................... 4-5
I/O Interfaces ...................................................................................................... 4-5
Serial Communications Interface .............................................................. 4-5
IndustryPack (IP) Interfaces....................................................................... 4-8
Ethernet Interface......................................................................................... 4-8
SCSI Interface ............................................................................................... 4-9
SCSI Termination......................................................................................... 4-9
Local Resources ................................................................................................... 4-9
Programmable Tick Timers ...................................................................... 4-10
Watchdog Timer ........................................................................................ 4-10
Software-Programmable Hardware Interrupts..................................... 4-10
Local Bus Timeout ..................................................................................... 4-10
Timing Performance ......................................................................................... 4-10
Local Bus to DRAM Cycle Times ............................................................ 4-11
EPROM/Flash Cycle Times ..................................................................... 4-11
SCSI Transfers ............................................................................................ 4-11
LAN DMA Transfers................................................................................. 4-12
Remote Status and Control.............................................................................. 4-12
ix
x
List of Figures
xi
xii
List of Tables
xiii
xiv
GENERAL INFORMATION
1
Introduction
This manual provides general information, hardware preparation and
installation instructions, operating instructions, and a functional description
of the MVME162 Embedded Controller (referred to as the MVME162
throughout this manual).
Models
The MVME162 is available in several models, which are listed in Table 1-1.
MVME162/D21-1
General Information
1
Features
Features of the MVME162 include:
❏ 25MHz 32-bit Microprocessor: either an MC68LC040 Enhanced 32-bit
Microprocessor with 8KB of cache and MMU, or an optional 25MHz
MC68040 32-bit Microprocessor with 8KB of cache, MMU, and FPU
❏ 1MB, 4MB, or 8MB of shared Dynamic Random Access Memory (DRAM)
with programmable parity
❏ 512KB of Static Random Access Memory (SRAM) with battery backup
❏ One JEDEC standard 32-pin PLCC EPROM socket (EPROMs may be
shipped separately from the MVME162)
❏ 1MB Flash memory: either one Intel 28F008SA (for older boards) or four
Intel 28F020s (for newer boards)
❏ Four 32-bit programmable timers and programmable Watchdog Timer
(MCchip)
❏ Two 32-bit programmable timers and programmable Watchdog Timer
(optional VMEchip2)
❏ 8K by 8 Non-Volatile Random Access Memory (NVRAM) and Time of
Day (TOD) clock with battery backup (Thompson MK48T08)
❏ Input/Output
– Two serial ports (one EIA-232-D DCE; one EIA-232-D or EIA-530
DCE/DTE)
– Serial port controller (Zilog Z85230)
– Optional Small Computer Systems Interface (SCSI) bus interface with
32-bit local bus burst Direct Memory Access (DMA) (NCR 53C710
controller)
– Optional LAN Ethernet transceiver interface with 32-bit local bus
DMA (Intel 82596CA controller)
– Four MVIP IndustryPack interfaces
❏ VMEbus interface (VMEchip2)—non-VMEbus version optional
– VMEbus system controller functions
– VMEbus interface to local bus (A24/A32, D8/D16/D32
(D8/D16/D32/D64BLT) (BLT = Block Transfer)
– Local bus to VMEbus interface (A16/A24/A32, D8/D16/D32)
– VMEbus interrupter
Specifications
Table 1-2, MVME162 Specifications, lists the specifications for an MVME162
without IndustryPacks. The subsequent sections detail cooling requirements
and FCC compliance.
MVME162/D2 1-3
General Information
1
Cooling Requirements
The Motorola MVME162 Embedded Controller is specified, designed, and
tested to operate reliably with an incoming air temperature range from 0° to
55° C (32° to 131° F) with forced air cooling at a velocity typically achievable
by using a 100 CFM axial fan. Temperature qualification is performed in a
standard Motorola VMEsystem 3000 chassis. Twenty-five watt load boards
are inserted in two card slots, one on each side, adjacent to the board under
test, to simulate a high power density system configuration. An assembly of
three axial fans, rated at 100 CFM per fan, is placed directly under the VME
card cage. The incoming air temperature is measured between the fan
assembly and the card cage, where the incoming airstream first encounters the
controller under test. Test software is executed as the controller is subjected to
ambient temperature variations. Case temperatures of critical, high power
density integrated circuits are monitored to ensure component vendors
specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the controller. Less airflow is required to cool the
controller in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the controller
reliably at higher than 55° C with increased airflow. It is important to note that
there are several factors, in addition to the rated CFM of the air mover, which
determine the actual volume and speed of air flowing over the controller.
The following are some steps that the user can take to help make elevated-
temperature operation possible:
1. Position the MVME162 board in the chassis for maximum airflow over the
component side of the board.
2. Avoid placing boards with high power dissipation adjacent to the
MVME162.
3. Use low-power IP modules only. The preferred locations for IP modules
are position a (J2 and J3) and position d (J18 and J19).
FCC Compliance
The MVME162 was tested without IndustryPacks in an FCC-compliant chassis
and meets the requirements for Class A equipment. FCC compliance was
achieved under the following conditions:
1. Shielded cables on all external I/O ports.
2. Cable shields connected to earth ground via metal shell connectors
bonded to a conductive module front panel.
3. Conductive chassis rails connected to earth ground. This provides the
path for connecting shields to earth ground.
4. Front panel screws properly tightened.
For minimum RF emissions, it is essential that the conditions above be
implemented. Failure to do so could compromise the FCC compliance of the
equipment containing the module.
MVME162/D2 1-5
General Information
1
General Description
The MVME162 is a double-high VMEmodule equipped with an MC68LC040
or optional MC68040 microprocessor. (The MC68040 microprocessor has a
floating-point coprocessor; the MC68LC040 does not.)
The MVME162 has 1MB, 4MB, or 8MB of parity-protected DRAM; 512KB
SRAM (with battery backup); a TOD clock (with battery backup); an optional
LAN Ethernet transceiver interface with DMA, two serial ports (EIA-232-D
and EIA-232-D/EIA-530); six tick timers with watchdog timer(s); optional
SCSI bus interface with DMA; VMEbus interface (local bus to
VMEbus/VMEbus to local bus, with A16/A24/A32, D8/D16/D32 bus widths
and a VMEbus system controller).
Input/Output
Input/Output (I/O) signals are routed through backplane connector P2. A P2
adapter board or LCP2 adapter board routes the signals and grounds from
connector P2 to an MVME712 series transition module (MVME712-12,
MVME712-13, MVME712A, MVME712AM, or MVME712M). The transition
module routes the signals to the appropriate configuration headers and
industry-standard connectors. Refer to the MVME712-12, MVME712-13,
MVME712A, MVME712AM, and MVME712B Transition Modules and LCP2
Adapter Board User’s Manual or the MVME712M Transition Module and P2
Adapter Board User’s Manual for more information.
N otes When used with the MVME162, only serial ports 2 and 4 on
the MVME712 are available for use. Serial ports 1 and 3 and
the printer port are not connected to any MVME162 circuits
and should not be used.
VMEbus Interface
The optional VMEchip2 ASIC is the VMEbus interface for the MVME162.
(This option is a factory build and cannot be added in the field.) VMEchip2
features include:
❏ Two programmable 32-bit tick timers
❏ A programmable watchdog timer
❏ Programmable map decoders for the master and slave interfaces
❏ A VMEbus to/from local bus DMA controller
❏ A VMEbus to/from local bus non-DMA programmed access interface
❏ A VMEbus interrupter
❏ A VMEbus system controller
❏ A VMEbus interrupt handler
❏ A VMEbus requester
Processor-to-VMEbus transfers can be D8, D16, or D32. VMEchip2 DMA
transfers to the VMEbus, however, can be D16, D32, D16/BLT, D32/BLT, or
D64/MBLT.
No-VMEbus-Interface Option
If desired, the MVME162 can function as an embedded controller without a
VMEbus interface (i.e., without the optional VMEchip2). Contact your local
Motorola sales office for ordering information.
MCchip
The Memory Controller (MCchip) ASIC provides four 32-bit programmable
tick timers and an interface to the LAN chip, SCSI chip, serial port chip,
BBRAM, PROM/Flash, SRAM, DRAM, reset control, watchdog timers, access
timers, and interrupter logic.
MVME162/D2 1-7
General Information
1
256 Kbit x 8; 512 Kbit x 8; 1 Mbit x 8) organized as a 512Kbit x 8 device. A
jumper allows reset code to be fetched either from Flash memory or from the
EPROM.
IndustryPack Modules
Up to four IndustryPack (IP) modules may be installed on the MVME162. The
interface between the IPs and MVME162 is the IndustryPack Interface
Controller (IPIC) ASIC. Access to the IPs is provided by four 3M connectors
located behind the MVME162 front panel.
Required Equipment
The following equipment is required to complete an MVME162 system:
❏ System console terminal
❏ Disk drives and controllers
❏ Operating system
❏ MVME712 series transition module (MVME712-12, MVME712-13,
MVME712A, MVME712AM, MVME712B, or MVME712M); P2 Adapter
Board or LCP2 Adapter Board; and cable
MVME162Bug Firmware
The 162Bug package, MVME162BUG, is a powerful evaluation and debugging
tool for systems built around the MVME162 CISC-based microcomputers.
Facilities are available for loading and executing user programs under
complete operator control for system evaluation. 162Bug includes commands
for display and modification of memory, breakpoint and tracing capabilities,
a powerful assembler/disassembler useful for patching programs, and a self-
Available Software
Available software for the MVME162 includes the on-board
debugger/monitor firmware, VMEexec driver packages for various
IndustryPack modules, and numerous third-party applications for MC680x0-
based systems. Contact your local Motorola sales office for more information.
MVME162/D2 1-9
General Information
1
Related Documentation
The following publications are applicable to the MVME162 and may provide
additional helpful information. If not shipped with this product, they may be
purchased by contacting your local Motorola sales office. Non-Motorola
documents may be purchased from the sources listed.
Motorola
Document Title Publication
Number
Support Information
You can obtain connector interconnect signal information, parts lists, and
schematics for the MVME162 free of charge by contacting your local Motorola
sales office.
MVME162/D2 1-11
General Information
1
Manual Terminology
Throughout this manual, a convention is used which precedes data and
address parameters by a character identifying the numeric format as follows:
$ dollar specifies a hexadecimal character
% percent specifies a binary number
& ampersand specifies a decimal number
Unless otherwise specified, all address references are in hexadecimal.
An asterisk (*) following the signal name for signals which are level-significant
denotes that the signal is true or valid when the signal is low.
An asterisk (*) following the signal name for signals which are edge-significant
denotes that the actions initiated by that signal occur on high-to-low
transition.
In this manual, assertion and negation are used to specify forcing a signal to a
particular state. In particular, assertion and assert refer to a signal that is active
or true; negation and negate indicate a signal that is inactive or false. These
terms are used independently of the voltage level (high or low) that they
represent.
In this manual, MVME712 series transition module refers generically to the
MVME712-12, MVME712-13, MVME712A, MVME712AM, or MVME712M.
MVME712x transition module refers to the closely related MVME712-12,
MVME712-13, MVME712A, or MVME712AM (not to the MVME712M).
References to a specific module use the complete designation of that module.
Data and address sizes are defined as follows:
❏ A byte is eight bits, numbered 0 through 7, with bit 0 being the least
significant.
❏ A word is 16 bits, numbered 0 through 15, with bit 0 being the least
significant.
❏ A longword is 32 bits, numbered 0 through 31, with bit 0 being the least
significant.
Unpacking Instructions
Unpack the equipment from the shipping carton. Refer to the packing list and
verify that all items are present. Save the packing material for storing and
reshipping of equipment.
Hardware Preparation
To produce the desired configuration and ensure proper operation of the
MVME162, you may need to carry out certain modifications before installing
the module.
The MVME162 provides software control over most options: by setting bits in
control registers after installing the MVME162 in a system, you can modify its
configuration. (The MVME162 registers are described in Chapter 4, and/or in
the MVME162 Embedded Controller Programmer’s Reference Guide as listed in
Related Documentation in Chapter 1.)
Some options, however, are not software-programmable. Such options are
controlled by manual installation or removal of header jumpers or interface
modules.
MVME162/D22-1
Hardware Preparation and Installation
SIM Selection
Port B of the MVME162’s Z85230 serial communications controller is
configurable via a serial interface module (SIM) which is installed at connector
J10 on the MVME162 board. Four serial interface modules are available:
❏ EIA-232-D (DCE and DTE)
❏ EIA-530 (DCE and DTE)
You can change Port B from an EIA-232-D to an EIA-530 interface (or vice-
versa) by mounting the appropriate serial interface module. Port B is routed
(via the SIM at J10) to the 25-pin DB25 front panel connector marked SERIAL
PORT 2.
For the location of SIM connector J10 on the MVME162, refer to Figure 2-1.
Figure 2-2 illustrates the secondary side (bottom) of a serial interface module,
showing the J1 connector which plugs into SIM connector J10 on the
MVME162. Figure 2-3 (sheets 3-6), Figure 2-4 (sheets 3-4), and Figure 2-5
illustrate the configurations available for Port B.
For the part numbers of the serial interface modules, refer to Table 2-1. The
part numbers are ordinarily printed on the primary side (top) of the SIMs, but
may be found on the secondary side in some versions.
If you need to replace an existing serial interface module with a SIM of another
type, go to Removal of Existing SIM below. If there is no SIM on the main board,
skip to Installation of New SIM.
2-3
Hardware Preparation
P1 P2
Figure 2-1. MVME162 Switch, Header, Connector, Fuse, and LED Locations
A1 A32 2 40 A1 A32
B1 B32 1
P4 39 B1 B32
C1 C32 C1 C32
1 2
1
F2
J20 J21
3
5 6
49 27 49 27 49 27 49 27
50 26 50 26 50 26 50 26
24 J3 2 24 J8 2 24 J14 2 24 J19 2
25 1 25 1 25 1 25 1
2 40
1
P3 39
49 27 49 27 49 27 49 27
50 26 50 26 50 26 50 26
24 J2 2 24 J7 2 24 J13 2 24 J18 2
25 1 25 1 25 1 25 1
2
1
49 1 49 1
50
J6 2
2
J12 4 50
J17 2
J1 1
J22
40 2
2
49 1 39
J10 1 2 49 1
50
J5 2 J11 4 50
J16 2
1
15
16
19 F1
1 13 1 13 1
20 J4 2 J9 J15
S1 S2
DS1
DS2
DS3
DS4
25 14 25 14
PRIMARY SIDE
MVME162/D2
RUN SCON
FUSE
STAT
SCSI VME
162-XX
MVME
ABORT
RESET
FAIL
LAN
SERIAL PORT 2 SERIAL PORT 1/ CONSOLE
cb232 9212
Hardware Preparation and Installation
2
Table 2-1. Serial Interface Module Part Numbers
EIA Model
Configuration Part Number
Standard Number
39 1
J1
40 2
SECONDARY SIDE
10922.00 9403 (2-2)
C aution Avoid lifting the SIM by one side only, as the connector can
be damaged on the SIM or the main board.
3. Place the two 4-40 x 3/16” Phillips-head screws that you previously
removed (or that were supplied with the new SIM) into the two opposite-
corner mounting holes. Screw them into the standoffs but do not
overtighten them.
The signal relationships and signal connections in the various serial
configurations available for ports A and B are illustrated in Figures 2-3, 2-4,
and 2-5.
J1 J1
1 1
2 2
MVME162/D2 2-5
Hardware Preparation and Installation
J11 J11
2 4 2 4
1 3 1 3
Internal Clock (factory configuration) External Clock
J12 J12
2 4 2 4
1 3 1 3
Internal Clock (factory configuration) External Clock
1 2 1 2 1 2
5 6 5 6 5 6
J21
4Mbit EPROM
(Factory configuration)
MVME162/D2 2-7
Hardware Preparation and Installation
N ote Pins 9-10 (GPIO3) are reserved to select either the Flash
memory map (jumper installed) or the EPROM memory
map (jumper removed). They are not user-definable.
The MVME162 is shipped from the factory with J22 set to all zeros (jumpers on
all pins).
Installation Instructions 2
The following sections discuss the installation of IndustryPacks (IPs) on the
MVME162, the installation of the MVME162 into a VME chassis, and the
system considerations relevant to the installation. Before installing
IndustryPacks, ensure that the serial ports and all header jumpers are
configured as desired.
MVME162/D2 2-9
Hardware Preparation and Installation
2. Remove the chassis cover as instructed in the user’s manual for the
equipment.
3. Remove the filler panel from the card slot where you are going to install
the MVME162.
– If you intend to use the MVME162 as system controller, it must occupy
the leftmost card slot (slot 1). The system controller must be in slot 1
to correctly initiate the bus-grant daisy-chain and to ensure proper
operation of the IACK daisy-chain driver.
– If you do not intend to use the MVME162 as system controller, it can
occupy any unused double-height card slot.
4. Slide the MVME162 into the selected card slot. Be sure the module is
seated properly in the P1 and P2 connectors on the backplane. Do not
damage or bend connector pins.
5. Secure the MVME162 in the chassis with the screws provided, making
good contact with the transverse mounting rails to minimize RF
emissions.
6. Install the MVME712 series transition module in the front or the rear of the
VME chassis. (To install an MVME712M, which has a double-wide front
panel, you may need to shift other modules in the chassis.)
7. On the chassis backplane, remove the INTERRUPT ACKNOWLEDGE
(IACK) and BUS GRANT (BG) jumpers from the header for the card slot
occupied by the MVME162.
9. Connect the appropriate cable(s) to the panel connectors for the EIA-232-
D serial ports, SCSI port, and LAN Ethernet port.
– Note that some cables are not provided with the MVME712 series
module and must be made or purchased by the user. (Motorola
recommends shielded cable for all peripheral connections to minimize
radiation.)
10. Connect the peripheral(s) to the cable(s). Appendix A supplies detailed
information on the EIA-232-D signals supported. Appendix B describes
the Ethernet LAN (Local Area Network) port connections. Appendix C
describes the SCSI (Small Computer System Interface) I/O bus connections.
11. Install any other required VMEmodules in the system.
12. Replace the chassis cover.
13. Connect the power cable to the AC power source and turn the equipment
power ON.
MVME162/D2 2-11
Hardware Preparation and Installation
System Considerations
2
The MVME162 draws power from VMEbus backplane connectors P1 and P2.
P2 is also used for the upper 16 bits of data in 32-bit transfers, and for the upper
8 address lines in extended addressing mode. The MVME162 may not function
properly without its main board connected to VMEbus backplane connectors
P1 and P2.
Whether the MVME162 operates as a VMEbus master or as a VMEbus slave, it
is configured for 32 bits of address and 32 bits of data (A32/D32). However, it
handles A16 or A24 devices in the address ranges indicated in Chapter 3. D8
and/or D16 devices in the system must be handled by the MC68040/
MC68LC040 software. Refer to the memory maps in Chapter 3.
The MVME162 contains shared onboard DRAM whose base address is
software-selectable. Both the onboard processor and offboard VMEbus
devices see this local DRAM at base physical address $00000000, as
programmed by the MVME162Bug firmware. This may be changed via
software to any other base address. Refer to the MVME162 Embedded Controller
Programmer’s Reference Guide for more information.
If the MVME162 tries to access offboard resources in a nonexistent location and
is not system controller, and if the system does not have a global bus timeout,
the MVME162 waits forever for the VMEbus cycle to complete. This will cause
the system to lock up. There is only one situation in which the system might
lack this global bus timeout: when the MVME162 is not the system controller
and there is no global bus timeout elsewhere in the system.
Multiple MVME162s may be installed in a single VME chassis. In general,
hardware multiprocessor features are supported.
Other MPUs on the VMEbus can interrupt, disable, communicate with, and
determine the operational status of the processor(s). One register of the GCSR
(global control/status register) set includes four bits that function as location
monitors to allow one MVME162 processor to broadcast a signal to any other
MVME162 processors. All eight registers are accessible from any local
processor as well as from the VMEbus.
MVME162/D2 2-13
Hardware Preparation and Installation
712M TRANSITION
MODULE
PORT 2
TO MODEM DB25
J17
RXD P2-C27 TXD2 TXD
PIN 2
TXD P2-C28 RXD2 RXD
PIN 3
CTS P2-C29 RTS2 RTS
PIN 4
RTS P2-C30 CTS2 CTS
PIN 5
DCD P2-C31 DTR2 DTR
PIN 20
DTR P2-C32 DCD2 DCD
PIN 8
DSR
PIN 6
P2 CABLE TXC
PIN 15
TO TERMINAL RXC
PIN 17
J16 TXCO
PIN 24
+12V PIN 7
1.5K
FRONT PANEL
Z85230 DB25
A PORT
TXD PORT 1
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME162 EIA-232-D DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
RXC D PIN 15
RXC
3 4 D PIN 17
1 2 TXCO
R PIN 24
J11
PIN 7
712M TRANSITION
MODULE
PORT 2
TO MODEM DB25
J17
RXD P2-C27 TXD2 TXD
PIN 2
TXD P2-C28 RXD2 RXD
PIN 3
CTS P2-C29 RTS2 RTS
PIN 4
RTS P2-C30 CTS2 CTS
PIN 5
DCD P2-C31 DTR2 DTR
PIN 20
DTR P2-C32 DCD2 DCD
PIN 8
DSR
PIN 6
P2 CABLE TXC
PIN 15
TO TERMINAL
RXC
J16 PIN 17
TXCO
PIN 24
+12V PIN 7
1.5K
FRONT PANEL
Z85230 DB25
A PORT
TXD PORT 1
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME162 EIA-232-D DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
RXC D PIN 15
RXC
3 4 D PIN 17
1 2 TXCO
R PIN 24
J11
PIN 7
MVME162/D2 2-15
Hardware Preparation and Installation
712M TRANSITION
MODULE
PORT 4
TO MODEM DB25
J19
TXD P2-A25 TXD4 TXD
PIN 2
RXD P2-A26 RXD4 RXD
PIN 3
RTS P2-A27 RTS4 RTS
PIN 4
CTS P2-A29 CTS4 CTS
PIN 5
DTR P2-A30 DTR4 DTR
PIN 20
DCD P2-A31 DCD4 DCD
PIN 8
DSR
PIN 6
RTXC P2-A32 RTXC4 TXC
PIN 15
TRXC P2-A28 TRXC4 TO TERMINAL RXC
PIN 17
J18 TXCO
PIN 24
P2 CABLE PIN 7
+12V
1.5K
J15
PIN 7
712M TRANSITION
MODULE
PORT 4
TO MODEM DB25
J19
TXD P2-A25 TXD4 TXD
PIN 2
RXD P2-A26 RXD4 RXD
PIN 3
RTS P2-A27 RTS4 RTS
PIN 4
CTS P2-A29 CTS4 CTS
PIN 5
DTR P2-A30 DTR4 DTR
PIN 20
DCD P2-A31 DCD4 DCD
PIN 8
DSR
PIN 6
RTXC P2-A32 RTXC4 TXC
PIN 15
TRXC P2-A28 TRXC4 TO TERMINAL RXC
PIN 17
J18 TXCO
PIN 24
P2 CABLE
+12V PIN 7
1.5K
J15
PIN 7
MVME162/D2 2-17
Hardware Preparation and Installation
712M TRANSITION
MODULE
PORT 4
TO MODEM DB25
J19
TXD P2-A25 TXD4 TXD
PIN 2
RXD P2-A26 RXD4 RXD
PIN 3
RTS P2-A27 RTS4 RTS
PIN 4
CTS P2-A29 CTS4 CTS
PIN 5
DTR P2-A30 DTR4 DTR
PIN 20
DCD P2-A31 DCD4 DCD
PIN 8
DSR
PIN 6
RTXC P2-A32 RTXC4 TXC
PIN 15
TO TERMINAL
TRXC P2-A28 TRXC4 RXC
J18 PIN 17
TXCO
PIN 24
P2 CABLE PIN 7
+12V
1.5K
J15
NOTES:
1. WITH DTE MODULE AND MVME 712 JUMPERED AS TO TERMINAL,
THE CLOCKS (TXC AND RXC) ARE THE WRONG DIRECTION.
THE CLOCKS ARE BOTH INPUTS. THEY SHOULD BOTH BE OUTPUTS.
2. WITH DTE MODULE, THE RECEIVE CLOCK OF 85230 ON B INTERFACE
MUST BE PROGRAMMED AS INPUT TO PREVENT BUFFER CONTENTION.
PIN 7
712M TRANSITION
MODULE
PORT 4
TO MODEM DB25
J19
TXD P2-A25 TXD4 TXD
PIN 2
RXD P2-A26 RXD4 RXD
PIN 3
RTS P2-A27 RTS4 RTS
PIN 4
CTS P2-A29 CTS4 CTS
PIN 5
DTR P2-A30 DTR4 DTR
PIN 20
DCD P2-A31 DCD4 DCD
PIN 8
DSR
PIN 6
RTXC P2-A32 RTXC4 TXC
PIN 15
TO TERMINAL
TRXC P2-A28 TRXC4 RXC
J18 PIN 17
TXCO
PIN 24
P2 CABLE
+12V PIN 7
1.5K
J15
NOTE:
WITH DCE MODULE AND MVME 712 JUMPERED AS TO TERMINAL,
THE CLOCKS (TXC AND RXC) ARE THE WRONG DIRECTION.
THE CLOCKS ARE BOTH OUTPUTS. THEY SHOULD BOTH BE INPUTS.
PIN 7
MVME162/D2 2-19
Hardware Preparation and Installation
2
712A/AM/12/13
TRANSITION MODULE
PORT 2
DCE DTE
1.5K J9 1.5K
+12V
SERIAL PORT 2
J16 DB9
RXD P2-C27 TXD2 TXD
PIN 3
TXD P2-C28 RXD2 RXD
PIN 2
CTS P2-C29 RTS2 RTS
PIN 7
RTS P2-C30 CTS2 CTS
PIN 8
DCD P2-C31 DTR2 DTR
PIN 4
DTR P2-C32 DCD2 DCD
PIN 1
DSR
P2 CABLE PIN 6
MODEM PORT 2
J17
MTXD
RJ11
MRXD
TIP
MCTS MODEM PIN 2
(712AM/712-13 RING
MDTR PIN 3
ONLY)
MDCD
NOTES:
1. SERIAL PORT 2 IS HARD-WIRED DTE. USE NULL MODEM CABLE FOR DCE.
2. TO CONNECT TERMINAL, SET DSR LINE PULLUP SELECT J9 TO "DCE".
FRONT PANEL
Z85230 DB25
A PORT
TXD PORT 1
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME162 RS232 DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
RXC D PIN 15
RXC
3 4 D PIN 17
1 2 TXCO
R PIN 24
J11
PIN 7
2
712AM/13
TRANSITION MODULE
PORT 2
DCE DTE
1.5K J9 1.5K
+12V
SERIAL PORT 2
J16 DB9
RXD P2-C27 TXD2 TXD
PIN 3
TXD P2-C28 RXD2 RXD
PIN 2
CTS P2-C29 RTS2 RTS
PIN 7
RTS P2-C30 CTS2 CTS
PIN 8
DCD P2-C31 DTR2 DTR
PIN 4
DTR P2-C32 DCD2 DCD
PIN 1
DSR
P2 CABLE PIN 6
MODEM PORT 2
J17
MTXD
RJ11
MRXD
TIP
MCTS MODEM PIN 2
(712AM/712-13 RING
MDTR PIN 3
ONLY)
MDCD
NOTE:
USING SERIAL PORT 2 AS A MODEM PORT REQUIRES CONNECTION TO
+5/+12/-12Vdc BACKPLANE POWER, A DATA CABLE AT THE DB9 CONNECTOR,
AND A TELCO CABLE AT THE RJ11 CONNECTOR. REFER TO THE USER’S
MANUAL FOR THIS MODULE (MVME712A) FOR SETUP INSTRUCTIONS.
FRONT PANEL
Z85230 DB25
A PORT
TXD PORT 1
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME162 RS232 DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
RXC D PIN 15
RXC
3 4 D PIN 17
1 2 TXCO
R PIN 24
J11
PIN 7
MVME162/D2 2-21
Hardware Preparation and Installation
2
712A/AM/-12/-13
TRANSITION MODULE
PORT 4
DCE DTE
1.5K J14 1.5K
+12V
DB9
TXD P2-A25 TXD4 TXD
PIN 3
RXD P2-A26 RXD4 RXD
PIN 2
RTS P2-A27 RTS4 RTS
PIN 7
CTS P2-A29 CTS4 CTS
PIN 8
DTR P2-A30 DTR4 DTR
PIN 4
DCD P2-A31 DCD4 DCD
PIN 1
DSR
PIN 6
TXC P2-A32 RTXC4
NC
RXC P2-A28 TRXC4
NC
P2 CABLE
MVME 712A/AM/-12/-13 PORT 4 (DTE)
NOTES:
1. SERIAL PORT 4 IS HARD-WIRED DTE. USE NULL MODEM CABLE FOR DCE.
2. TO CONNECT TERMINAL, SET DSR LINE PULLUP SELECT J14 TO "DCE".
PIN 7
2
712A/AM/-12/-13
TRANSITION MODULE
PORT 4
DCE DTE
1.5K J14 1.5K
+12V
DB9
TXD P2-A25 TXD4 TXD
PIN 3
RXD P2-A26 RXD4 RXD
PIN 2
RTS P2-A27 RTS4 RTS
PIN 7
CTS P2-A29 CTS4 CTS
PIN 8
DTR P2-A30 DTR4 DTR
PIN 4
DCD P2-A31 DCD4 DCD
PIN 1
DSR
PIN 6
TXC P2-A32 RTXC4
NC
RXC P2-A28 TRXC4
NC
P2 CABLE
MVME 712A/AM/-12/-13 PORT 4 (DTE)
NOTES:
1. SERIAL PORT 4 IS HARD-WIRED DTE. USE NULL MODEM CABLE FOR DCE.
2. TO CONNECT TERMINAL, SET DSR LINE PULLUP SELECT J14 TO "DCE".
PIN 7
MVME162/D2 2-23
Hardware Preparation and Installation
2 P2 CONNECTOR
TXD_B
P2-C18
TXD_A
P2-A25
RXD_B
P2-A19
RXD_A
P2-A26
RTS_B
P2-C19
RTS_A
P2-A27
CTS_B
P2-C26
CTS_A
P2-A29
DTR_B
P2-A23
DTR_A
P2-A30
DCD_B
P2-C22
DCD_A
P2-A31
DSR_B
P2-A22
DSR_A
P2-A20
MVME 162 EIA-530 DTE CONFIGURATION TXC_B
P2-C24
(TO MODEM) TXC_A
P2-A32
RXC_B
P2-C21
RXC_A
P2-A28
TXCO_B
P2-C23
TXCO_A
P2-A24
TM_A
P2-C25
LL_A
P2-C20
RL_A
P2-A21
Z85230 NC PIN 1
B PORT PORT
TXD_B
PIN 14 2
TXD D TXD_A
PIN 2
RXD_B
PIN 16
RXD R RXD_A
PIN 3
RTS_B
PIN 18
RTS D RTS_A
PIN 4
CTS_B
PIN 13
CTS R CTS_A
PIN 5
DTR_B
PIN 23
DTR D DTR_A
PIN 20
DCD_B
PIN 10
DCD R DCD_A
PIN 8
DSR_B
PIN 22
TXC NC R DSR_A
PIN 6
3 4 TXC_B
RXC PIN 12
R TXC_A
+5V PIN 15
RXC_B
1 2 PIN 9
R RXC_A
PIN 17
J12
TXCO_B
PIN 11
D TXCO_A
PIN 24
TM_A
NC PIN 25
+5V LL_A
D PIN 19
+5V RL_A
D PIN 21
PIN 7
P2 CONNECTOR 2
TXD_B
P2-C18
TXD_A
P2-A25
RXD_B
P2-A19
RXD_A
P2-A26
RTS_B
P2-C19
RTS_A
P2-A27
CTS_B
P2-C26
CTS_A
P2-A29
DTR_B
P2-A23
DTR_A
P2-A30
DCD_B
P2-C22
DCD_A
P2-A31
DSR_B
P2-A22
MVME 162 EIA-530 DCE CONFIGURATION DSR_A
P2-A20
(TO TERMINAL) TXC_B
P2-C24
TXC_A
P2-A32
RXC_B
P2-C21
RXC_A
P2-A28
TXCO_B
P2-C23
TXCO_A
P2-A24
TM_A
P2-C25
LL_A
P2-C20
RL_A
P2-A21
Z85230 NC PIN 1
B PORT PORT
TXD_B
PIN 14 2
TXD D TXD_A
PIN 2
RXD_B
PIN 16
RXD R RXD_A
PIN 3
RTS_B
PIN 18
RTS D RTS_A
PIN 4
CTS_B
PIN 13
CTS R CTS_A
PIN 5
DTR_B
PIN 23
DTR D DTR_A
PIN 20
DCD_B
PIN 10
DCD R DCD_A
PIN 8
DSR_B
PIN 22
TXC D DSR_A
PIN 6
3 4 TXC_B
RXC PIN 12
D TXC_A
+5V PIN 15
RXC_B
1 2 PIN 9
D RXC_A
PIN 17
J12
TXCO_B
PIN 11
R TXCO_A
PIN 24
+5V TM_A
D PIN 25
LL_A
NC PIN 19
RL_A
NC PIN 21
PIN 7
PIN 7
MVME162/D2 2-25
Hardware Preparation and Installation
MVME162/D23-1
Operating Instructions
3
N ote For an MVME162 without the VMEbus option (i.e., with no
VMEchip2), the LCSR control bit is not available to reset the
module. In this case, the watchdog timer is allowed to time
out to reset the MVME162.
Memory Maps
There are two points of view for memory maps:
❏ The mapping of all resources as viewed by local bus masters (local bus
memory map)
3
❏ The mapping of onboard resources as viewed by VMEbus masters
(VMEbus memory map)
MVME162/D2 3-3
Operating Instructions
N otes 1. Reset enables the decoder for this space of the memory map so
that it will decode address spaces $FF800000 - $FF9FFFFF and
$00000000 - $003FFFFF. The decode at 0 must be disabled in
the MCchip before DRAM is enabled. DRAM is enabled with
the DRAM Control Register at address $FFF42048, bit 24.
PROM/Flash is disabled at the low address space with PROM
Control Register at address $FFF42040, bit 20.
2. This area is user-programmable. The DRAM and SRAM
decoder is programmed in the MCchip, the local-to-VMEbus
decoders are programmed in the VMEchip2, and the IP
memory space is programmed in the IPIC.
3. Size is approximate.
4. Cache inhibit depends on devices in area mapped.
5. The EPROM and Flash are sized by the MCchip ASIC from an
8-bit private bus to the 32-bit MPU local bus. Because the
device size is less than the allocated memory map for some
entries, the device contents repeat for those entries.
If jumper GPIO3 is installed, the Flash device is accessed. If 3
GPIO3 is not installed, the EPROM is accessed.
6. The Flash and EPROM are sized by the MCchip ASIC from an
8-bit private bus to the 32-bit MPU local bus. Because the
device size is less than the allocated memory map for some
entries, the device contents repeat for those entries.
If jumper GPIO3 is installed, the PROM device is accessed. If
GPIO3 is not installed, the Flash is accessed.
7. These areas are not decoded unless one of the programmable
decoders are initialized to decode this space. If they are not
decoded, an access to this address range will generate a local
bus timeout. The local bus timer must be enabled.
Table 3-2 focuses on the ‘‘Local I/O Devices’’ portion of the local bus main
memory map.
MVME162/D2 3-5
Operating Instructions
N otes 1. For a complete description of the register bits, refer to the data
sheet for the specific chip. For a more detailed memory map,
refer to the following detailed peripheral device memory
maps.
2. The SCC is an 8-bit device located on an MCchip private data
bus. Byte access is required.
MVME162/D2 3-7
Operating Instructions
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
34
38 DMA CONTROLLER
3C DMA CONTROLLER
40 DMA CONTROLLER
44 DMA CONTROLLER
TICK TICK CLR IRQ VMEBUS
48 2/1 IRQ 1 IRQ STAT INTERRUPT VMEBUS INTERRUPT VECTOR
EN LEVEL
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
DMA DMA LB DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA
TBL SNP MODE INC INC WRT D16 D64 BLK AM AM AM AM AM AM
INT VME LB BLK 5 4 3 2 1 0
BYTE COUNTER
1360 9403
MVME162/D2 3-9
Operating Instructions
3
VMEchip2 LCSR Base Address = $FFF40000
OFFSET:
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
ARB VME
DMA DMA
4C BGTO GLOBAL
EN TIME OFF TIME ON TIMER
50 TICK TIMER 1
54 TICK TIMER 1
58 TICK TIMER 2
5C TICK TIMER 2
64 PRE
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
AC AB SYS MWP PE IRQ1E TIC2 TIC1 VME DMA SIG3 SIG2 SIG1 SIG0 LM1 LM0
68 FAIL IRQ FAIL BERR IRQ IRQ IRQ IRQ IACK IRQ IRQ IRQ IRQ IRQ IRQ IRQ
IRQ IRQ IRQ IRQ
EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN
6C IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
70
CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR
74 IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
8C
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
VME LOCAL WD
ACCESS BUS TIME OUT
PRESCALER
TIMER TIMER SELECT CLOCK ADJUST
COMPARE REGISTER
COUNTER
COMPARE REGISTER
COUNTER
SCALER
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
SW7 SW6 SW5 SW4 SW3 SW2 SW1 SW0 SPARE VME VME VME VME VME VME VME
IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ7 IRQ6 IRQ5 IRQ4 IRQ3 IRQ2 IRQ1
EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN
IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
SET SET SET SET SET SET SET SET
IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
15 14 13 12 11 10 9 8
CLR CLR CLR CLR CLR CLR CLR CLR
IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
15 14 13 12 11 10 9 8
SIG 1 SIG 0 LM 1 LM 0
IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL
1361 9403
MVME162/D2 3-11
Operating Instructions
3
This page intentionally left blank.
2 4 LM3 LM2 LM1 LM0 SIG3 SIG2 SIG1 SIG0 RST ISF BF SCON SYSFL X X X
4 8 GENERAL PURPOSE CONTROL AND STATUS REGISTER 0
MVME162/D2 3-13
Operating Instructions
N otes 1. Refer to the MPU Port and MPU Channel Attention registers
in the MVME162 Embedded Controller Programmer’s Reference
Guide.
2. After resetting, you must write the System Configuration
Pointer to the command registers before writing to the MPU
Channel Attention register. Writes to the System Configura-
tion Pointer must be upper word first, lower word second.
MVME162/D2 3-15
Operating Instructions
MVME162/D2 3-17
Operating Instructions
Table 3-9 contains a summary of the IPIC CSR registers. The CSR registers can
be accessed as bytes, words, or longwords; they should not be accessed as
lines. They are shown in the table as bytes.
$00 CHIP ID 0 0 1 0 0 0 1 1
$01 CHIP REVISION 0 0 0 0 0 0 0 0
$02 RESERVED 0 0 0 0 0 0 0 0
$03 RESERVED 0 0 0 0 0 0 0 0
$04 IP_a MEM BASE UPPER a_BASE31 a_BASE30 a_BASE29 a_BASE28 a_BASE27 a_BASE26 a_BASE25 a_BASE24
$05 IP_a MEM BASE LOWER a_BASE23 a_BASE22 a_BASE21 a_BASE20 a_BASE19 a_BASE18 a_BASE17 a_BASE16
$06 IP_b MEM BASE UPPER b_BASE31 b_BASE30 b_BASE29 b_BASE28 b_BASE27 b_BASE26 b_BASE25 b_BASE24
$07 IP_b MEM BASE LOWER b_BASE23 b_BASE22 b_BASE21 b_BASE20 b_BASE19 b_BASE18 b_BASE17 b_BASE16
$08 IP_c MEM BASE UPPER c_BASE31 c_BASE30 c_BASE29 c_BASE28 c_BASE27 c_BASE26 c_BASE25 c_BASE24
$09 IP_c MEM BASE LOWER c_BASE23 c_BASE22 c_BASE21 c_BASE20 c_BASE19 c_BASE18 c_BASE17 c_BASE16
$0A IP_d MEM BASE UPPER d_BASE31 d_BASE30 d_BASE29 d_BASE28 d_BASE27 d_BASE26 d_BASE25 d_BASE24
$0B IP_d MEM BASE LOWER d_BASE23 d_BASE22 d_BASE21 d_BASE20 d_BASE19 d_BASE18 d_BASE17 d_BASE16
$0C IP_a MEM SIZE a_SIZE23 a_SIZE22 a_SIZE21 a_SIZE20 a_SIZE19 a_SIZE18 a_SIZE17 a_SIZE16
$0D IP_b MEM SIZE b_SIZE23 b_SIZE22 b_SIZE21 b_SIZE20 b_SIZE19 b_SIZE18 b_SIZE17 b_SIZE16
$0E IP_c MEM SIZE c_SIZE23 c_SIZE22 c_SIZE21 c_SIZE20 c_SIZE19 c_SIZE18 c_SIZE17 c_SIZE16
$0F IP_d MEM SIZE d_SIZE23 d_SIZE22 d_SIZE21 d_SIZE20 d_SIZE19 d_SIZE18 d_SIZE17 d_SIZE16
$10 IP_a INT0 CONTROL a0_PLTY a0_E/L* a0_INT a0_IEN a0_ICLR a0_IL2 a0_IL1 a0_IL0
$11 IP_a INT1 CONTROL a1_PLTY a1_E/L* a1_INT a1_IEN a1_ICLR a1_IL2 a1_IL1 a1_IL0
$12 IP_b INT0 CONTROL b0_PLTY b0_E/L* b0_INT b0_IEN b0_ICLR b0_IL2 b0_IL1 b0_IL0
$13 IP_b INT1 CONTROL b1_PLTY b1_E/L* b1_INT b1_IEN b1_ICLR b1_IL2 b1_IL1 b1_IL0
$14 IP_c INT0 CONTROL c0_PLTY c0_E/L* c0_INT c0_IEN c0_ICLR c0_IL2 c0_IL1 c0_IL0
$15 IP_c INT1 CONTROL c1_PLTY c1_E/L* c1_INT c1_IEN c1_ICLR c1_IL2 c1_IL1 c1_IL0
$16 IP_d INT0 CONTROL d0_PLTY d0_E/L* d0_INT d0_IEN d0_ICLR d0_IL2 d0_IL1 d0_IL0
$17 IP_d INT1 CONTROL d1_PLTY d1_E/L* d1_INT d1_IEN d1_ICLR d1_IL2 d1_IL1 d1_IL0
$1C RESERVED 0 0 0 0 0 0 0 0
$1D RESERVED 0 0 0 0 0 0 0 0
$1E RESERVED 0 0 0 0 0 0 0 0
$1F IP RESET 0 0 0 0 0 0 0 RES
MVME162/D2 3-19
Operating Instructions
Address D7 D6 D5 D4 D3 D2 D1 D0 Function
$FFFC1FF8 W R S -- -- -- -- -- CONTROL
$FFFC1FF9 ST -- -- -- -- -- -- -- SECONDS 00
$FFFC1FFA x -- -- -- -- -- -- -- MINUTES 00
$FFFC1FFB x x -- -- -- -- -- -- HOUR 00
$FFFC1FFC x FT x x x -- -- -- DAY 01
$FFFC1FFD x x -- -- -- -- -- -- DATE 01
$FFFC1FFE x x x -- -- -- -- -- MONTH 01
$FFFC1FFF -- -- -- -- -- -- -- -- YEAR 00
MVME162/D2 3-21
Operating Instructions
11. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the serial port 2 personality board in ASCII format.
12. Eight bytes are reserved for the serial number assigned to the serial port 2
personality board in ASCII format. 3
13. Eight bytes are reserved for the board identifier, in ASCII format, assigned
to the optional first IndustryPack a.
14. Eight bytes are reserved for the serial number, in ASCII format, assigned
to the optional first IndustryPack a.
15. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the optional first IndustryPack a.
16. Eight bytes are reserved for the board identifier, in ASCII format, assigned
to the optional second IndustryPack b.
17. Eight bytes are reserved for the serial number, in ASCII format, assigned
to the optional second IndustryPack b.
18. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the optional second IndustryPack b.
19. Eight bytes are reserved for the board identifier, in ASCII format, assigned
to the optional third IndustryPack c.
20. Eight bytes are reserved for the serial number, in ASCII format, assigned
to the optional third IndustryPack c.
21. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the optional third IndustryPack c.
22. Eight bytes are reserved for the board identifier, in ASCII format, assigned
to the optional fourth IndustryPack d.
23. Eight bytes are reserved for the serial number, in ASCII format, assigned
to the optional fourth IndustryPack d.
24. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the optional fourth IndustryPack d.
25. Growth space (65 bytes) is reserved. This pads the structure to an even 256
bytes.
26. The final one byte of the area is reserved for a checksum (as defined in the
MVME162Bug Debugging Package User’s Manual) for security and data
integrity of the configuration area of the NVRAM. This data is stored in
hexadecimal format.
MVME162/D2 3-23
Operating Instructions
Software Initialization
Most functions that have been done with switches or jumpers on other
modules are done by setting control registers on the MVME162. At powerup
or reset, the EPROMs that contain the 162Bug debugging package set up the
default values of many of these registers.
Specific programming details may be determined by study of the M68040
Microprocessor User’s Manual. Then check the details of all the MVME162
onboard registers as given in the MVME162 Embedded Controller Programmer’s
Reference Guide.
N ote The GCSR allows a VMEbus master to reset the local bus.
This feature is very dangerous and should be used with
caution. The local reset feature is a partial system reset, not
a complete system reset such as powerup reset or
SYSRESET*. When the local bus reset signal is asserted, a
local bus cycle may be aborted. The VMEchip2 is connected
to both the local bus and the VMEbus and if the aborted
cycle is bound for the VMEbus, erratic operation may result.
Communications between the local processor and a
VMEbus master should use interrupts or mailbox locations;
reset should not be used in normal communications. Reset
should be used only when the local processor is halted or
the local bus is hung and reset is the last resort.
Any VMEbus access to the MVME162 while it is in the reset state is ignored. If
a global bus timer is enabled, a bus error is generated.
MVME162/D2 3-25
Operating Instructions
MVME162/D24-1
Functional Description
MC68040/MC68LC040 MPU
The MVME162 is equipped with an MC68040 or MC68LC040 microprocessor.
The MC68040/MC68LC040 have on-chip instruction and data caches; the
MC68040 also provides a floating-point coprocessor. Refer to the M68040
Microprocessor User’s Manual for more information.
SRAM
The MVME162 provides 512KB of 32-bit-wide onboard static RAM in a single
non-interleaved architecture with onboard battery backup. The worst case
elapsed time for battery protection is 200 days. Specifics on SRAM
performance can be found in the section on the SRAM Memory Controller in
the MCchip Programming Model in the MVME162 Embedded Controller
Programmer’s Reference Guide. The SRAM arrays are not parity protected.
The battery backup function for the MVME162 SRAM is provided by a Dallas
DS1210S device that supports primary and secondary power sources. In the
event of a main board power failure, the DS1210S checks power sources and
switches to the source with the higher voltage.
If the voltage of the backup source is lower than two volts, the DS1210S blocks
the second memory cycle; this allows software to provide an early warning to
avoid data loss. Because the second access may be blocked during a power
failure, software should do at least two accesses before relying on the data.
The MVME162 provides jumpers (on J20) that allow either power source of the
DS1210S to be connected to the VMEbus +5V STDBY pin or to one cell of the
onboard battery. For example, the primary system backup source may be a
battery connected to the VMEbus +5V STDBY pin and the secondary source
may be the onboard battery. If the system source should fail or the board is
removed from the chassis, the onboard battery takes over.
MVME162/D2 4-3
Functional Description
When dealing with lithium batteries, carefully follow the precautions listed
4 below in order to prevent accidents.
❏ Do not short-circuit.
❏ Do not disassemble, deform, or apply excessive pressure.
❏ Do not heat or incinerate.
❏ Do not apply solder directly.
❏ Do not use different models, or mix new and old batteries together.
❏ Do not charge.
❏ Always check proper polarity.
To remove the battery from the module, carefully pull the battery from the
socket.
Before installing a new battery, ensure that the battery pins are clean. Note the
battery polarity and press the battery into the socket. When the battery is in
the socket, no soldering is required.
Onboard DRAM
The MVME162 offers a 1MB, a 4MB, and an 8MB DRAM option. The DRAM
architecture is non-interleaved for 1MB and interleaved for 4MB and 8MB.
Parity protection can be enabled with interrupts or bus exception when a
parity error is detected. DRAM performance is specified in the section on the
DRAM Memory Controller in the MCchip Programming Model in the
MVME162 Embedded Controller Programmer’s Reference Guide.
The DRAM map decoder can be programmed to accommodate different base
address(es) and sizes of mezzanine boards. The onboard DRAM is disabled
by a local bus reset and must be programmed before the DRAM can be
accessed. Refer to the MCchip description in the MVME162 Embedded
Controller Programmer’s Reference Guide for detailed programming information.
Most DRAM devices require some number of access cycles before the DRAMs
are fully operational. Normally this requirement is met by the onboard refresh
circuitry and normal DRAM initialization. However, software should insure
that a minimum of 10 initialization cycles are performed to each bank of RAM.
I/O Interfaces
The MVME162 provides onboard I/O for many system applications. The I/O
functions include serial ports, IndustryPack (IP) interfaces, and optional
interfaces for LAN Ethernet transceivers and SCSI mass storage devices.
Serial Communications Interface
The MVME162 uses a Zilog Z85230 serial port controller to implement the two
serial communications interfaces. Each interface supports CTS, DCD, RTS,
and DTR control signals as well as the TxD and RxD transmit/receive data
signals, and TxC/RxC synchronous clock signals. The Z85230 supports
synchronous (SDLC/HDLC) and asynchronous protocols. The MVME162
hardware supports asynchronous serial baud rates of 110B/s to 38.4KB/s.
MVME162/D2 4-5
Functional Description
Port B is routed (via the module at J10) to the 25-pin DB25 connector marked
SERIAL PORT 2 on the MVME162 front panel. Port B is also routed to a DB9 (on
the MVME712x) or DB25 (on the MVME712M) connector on the MVME712
series transition module. It is identified there as Port 4.
Although both ports are connected to the same Z85230 Port B, there are several
considerations to keep in mind:
❏ On the MVME162 front panel, Port 2 can be connected to the TxC and RxC 4
clock signals which may be present on the DB25 connector. These
connections are made via header J12 on the MVME162 board (see Figures
2-3, 2-4, and 2-5 in Chapter 2). The TxC and RxC clock lines are also
available at Port 4 on MVME712M transition modules.
❏ On MVME712x transition modules, Port 4 is hard-wired as an EIA-232-D
DB9 DTE serial port. A ‘‘null modem’’ cable is necessary to use it as a DCE
port.
❏ On MVME712M transition modules, Port 4 can be configured as either a
DTE or DCE EIA-232-D serial port via jumper headers J19 and J18 on the
MVME712M. Port 4 can also be connected to the TxC and RxC clock
signals which may be present on the DB25 connector. These connections
are made via header J15 on the MVME712M (see Figure 2-3, sheets 3-6 in
Chapter 2).
❏ When Port B is configured as an EIA-530 interface, EIA-530 data transfers
normally occur through serial port 2 on the MVME162 front panel. The
MVME712 series transition module should be disconnected from the
MVME162.
Although the signals are present at P2 (see Figure 2-5), the EIA-530
standard calls for a DB25 connector and balanced (not single-ended) lines;
these are not supported by the P2 adapter and MVME712 series transition
modules. System integrators who wish to use the EIA-530 signals at P2
must provide the appropriate connections.
Figure 2-3 (sheets 3-6), Figure 2-4 (sheets 3-4), and Figure 2-5 in Chapter 2
illustrate the factory configurations available for Port B. Note that the port
configurations shown in Figure 2-3, sheets 5 and 6 are not recommended for
synchronous applications because of the incorrect clock direction.
MVME162/D2 4-7
Functional Description
If the data in the BBRAM is lost, use the number on the label on backplane
connector P2 to restore it.
The Ethernet transceiver interface is located on the MVME162 main module.
An industry-standard DB15 connector is located on the MVME712 series
transition module.
The MCchip provides support functions for the 82596CA. Refer to the
82596CA user’s guide and to the MVME162 Embedded Controller Programmer’s 4
Reference Guide for detailed programming information. Refer to the
MVME712-12, MVME712-13, MVME712A, MVME712AM, and MVME712B
Transition Modules and LCP2 Adapter Board User’s Manual or the MVME712M
Transition Module and P2 Adapter Board User’s Manual for the pin assignments
of the transition module Ethernet connectors.
SCSI Interface
The MVME162 supports mass storage subsystems through the industry-
standard SCSI bus. These subsystems may include hard and floppy disk
drives, streaming tape drives, and other mass storage devices. The SCSI
interface is implemented using the NCR 53C710 SCSI I/O controller.
Support functions for the NCR 53C710 are provided by the MCchip. Refer to
the NCR 53C710 user’s guide and to the MVME162 Embedded Controller
Programmer’s Reference Guide for detailed programming information. Refer to
the MVME712-12, MVME712-13, MVME712A, MVME712AM, and
MVME712B Transition Modules and LCP2 Adapter Board User’s Manual or to the
MVME712M Transition Module and P2 Adapter Board User’s Manual for the pin
assignments of the transition module SCSI connectors.
SCSI Termination
The individual configuring the system must ensure that the SCSI bus is
properly terminated at both ends.
The MVME162 provides sockets for SCSI bus terminators on the P2 adapter
board or the LCP2 adapter board. If the SCSI bus ends at the adapter board,
then termination resistors must be installed on the adapter board. +5V power
to the SCSI bus TERMPWR signal and termination resistors is provided
through a fuse located on the adapter board.
Local Resources
The MVME162 includes many resources for the local processor. These include
tick timers, software programmable hardware interrupts, watchdog timer,
and local bus timeout.
MVME162/D2 4-9
Functional Description
Timing Performance
This section provides performance information for the MVME162. The
MVME162 is designed to operate at 25 MHz.
N ote TEA is the MC68040 bus error transaction signal. "With TEA"
indicates that a bus error cycle occurs if a DRAM parity error was
detected.
MVME162/D2 4-11
Functional Description
This reduces local bus usage by the SCSI device. Refer to the MCchip
Programming Model in the MVME162 Embedded Controller Programmer’s
Reference Guide.
The transfer rate of the DMA controller is 44MB/sec at 25 MHz with parity off
and interleaved DRAM and read cycles. Assuming a continuous transfer rate
of 5MB/sec on the SCSI bus, 12% of the local bus bandwidth is used by
4 transfers from the SCSI bus.
LAN DMA Transfers
The MVME162 includes a LAN interface with DMA controller. The LAN DMA
controller uses a FIFO buffer to interface the serial LAN bus to the 32-bit local
bus. The FIFO buffer allows the LAN DMA controller to efficiently transfer
data to the local bus.
The 82596CA does not execute MC68040 compatible burst cycles, therefore the
LAN DMA controller does not use burst transfers. Parity DRAM write cycles
require 3 clock cycles, and read cycles require 5 clock cycles with parity off and
6 clock cycles with parity on.
The transfer rate of the LAN DMA controller is 20MB/sec at 25 MHz with
parity off. Assuming a continuous transfer rate of 1MB/sec on the LAN bus,
5% of the local bus bandwidth is used by transfers from the LAN bus.
P2
REMOTE LEDS AND SWITCHES MC68040 MPU IPL COMBINER CLOCKS GENERATOR
RESET/ABORT/LEDS
MVME162/D2
IPCHIP
SCSI INTERFACE SCSI
J5, J6, J16, J17 J2, J7, J13, J18 J3, J8, J14, J19
IP MODULE
IP MODULES
PORTS
SERIAL
PORTS
DRAM
MEZZANINE
J9, J15 P1
SRAM
10883.00 9401
4-13
MVME162 Functional Description
4
Functional Description
WE LL
WE LM
CAS
RAS
OE
ADDRESS
PARITY
WE UM
WE UU
DATA 16 - 31
RAM 16 - 31
10685.00 9309
4-15
MVME162 Functional Description
4
Functional Description
EIA-232-D Connections
The EIA-232-D standard defines the electrical and mechanical aspects of this
serial interface. The interface employs unbalanced (single-ended) signaling
and is generally used with DB25 connectors, although other connector styles
(e.g., DB9 and RJ45) are sometimes used as well.
Table A-1 lists the standard EIA-232-D interconnections. Not all pins listed in
the table are necessary in every application.
To interpret the information correctly, remember that the EIA-232-D serial
interface was developed to connect a terminal to a modem. Serial data leaves
the sending device on a Transmit Data (TxD) line and arrives at the receiving
device on a Receive Data (RxD) line. When computing equipment is
interconnected without modems, one of the units must be configured as a
terminal (data terminal equipment: DTE) and the other as a modem (data
circuit-terminating equipment: DCE). Since computers are normally
configured to work with terminals, they are said to be configured as a modem
in most cases.
MVME162/D2A-1
Serial Interconnections
A
1 Not used.
2 TxD Transmit Data. Data to be transmitted; input to modem from terminal.
3 RxD Receive Data. Data which is demodulated from the receive line; output
from modem to terminal.
4 RTS Request To Send. Input to modem from terminal when required to
transmit a message. With RTS off, the modem carrier remains off. When
RTS is turned on, the modem immediately turns on the carrier.
5 CTS Clear To Send. Output from modem to terminal to indicate that message
transmission can begin. When a modem is used, CTS follows the off-to-on
transition of RTS after a time delay.
6 DSR Data Set Ready. Output from modem to terminal to indicate that the
modem is ready to send or receive data.
7 SG Signal Ground. Common return line for all signals at the modem
interface.
8 DCD Data Carrier Detect. Output from modem to terminal to indicate that a
valid carrier is being received.
9-14 Not used.
15 TxC Transmit Clock (DCE). Output from modem to terminal; clocks data from
the terminal to the modem.
16 Not used.
17 RxC Receive Clock. Output from terminal to modem; clocks input data from
the terminal to the modem.
18, 19 Not used.
20 DTR Data Terminal Ready. Input to modem from terminal; indicates that the
terminal is ready to send or receive data.
21 Not used.
22 RI Ring Indicator. Output from modem to terminal; indicates that an
incoming call is present. The terminal causes the modem to answer the
phone by carrying DTR true while RI is active..
23 Not used.
24 TxC Transmit Clock (DTE). Input to modem from terminal; same function as
TxC on pin 15.
25 BSY Busy. Input to modem from terminal; a positive EIA signal applied to this
pin causes the modem to go off-hook and make the associated phone busy.
Interface Characteristics
The EIA-232-D interface standard specifies all parameters for serial binary
data interchange between DTE and DCE devices using unbalanced lines. EIA-
232-D transmitter and receiver parameters applicable to the MVME162 are
listed in Tables A-2 and A-3.
MVME162/D2 A-3
Serial Interconnections
A
EIA-530 Connections
The EIA-530 interface complements the EIA-232-D interface in function. The
EIA-530 standard defines the mechanical aspects of this interface, which is
used for transmission of serial binary data, both synchronous and
asynchronous. It is adaptable to balanced (double-ended) as well as
unbalanced (single-ended) signaling and offers the possibility of higher data
rates than EIA-232-D with the same DB25 connector.
Table A-4 lists the EIA-530 interconnections that are available at serial port B
(SERIAL PORT 2 on the front panel) when the port is configured via serial
interface modules as an EIA-530 DCE or DTE port.
1 Not used.
2 TxD_A Transmit Data (A). Data to be transmitted; output from DTE to DCE.
3 RxD_A Receive Data (A). Data which is demodulated from the receive line; input
from DCE to DTE.
4 RTS_A Request to Send (A). Output from DTE to DCE when required to transmit
a message.
5 CTS_A Clear to Send (A). Input to DTE from DCE to indicate that message
transmission can begin.
6 DSR_A Data Set Ready (A). Input to DTE from DCE to indicate that the DCE is
ready to send or receive data. In DCE configuration, always true.
7 SIG GND Signal Ground. Common return line for all signals.
8 DCD_A Data Carrier Detect (A). Receive line signal detector output from DCE to
DTE to indicate that valid data is being transferred to the DTE on the RxD
line.
9 RxC_B Receive Signal Element Timing—DCE (B). Control signal that clocks
input data.
10 DCD_B Data Carrier Detect (B). Receive line signal detector output from DCE to
DTE to indicate that valid data is being transferred to the DTE on the RxD
line.
11 TxCO_B Transmit Signal Element Timing—DTE (B). Control signal that clocks
output data.
12 TxC_B Transmit Signal Element Timing—DCE (B). Control signal that clocks
input data.
13 CTS_B Clear to Send (B). Input to DTE from DCE to indicate that message
transmission can begin.
14 TxD_B Transmit Data (B). Data to be transmitted; output from DTE to DCE.
15 TxC_A Transmit Signal Element Timing—DCE (A). Control signal that clocks
input data.
16 RxD_B Receive Data (B). Data which is demodulated from the receive line; input
from DCE to DTE.
17 RxC_A Receive Signal Element Timing—DCE (A). Control signal that clocks
input data.
18 RTS_B Request to Send (B). Output from DTE to DCE when required to transmit
a message.
19 LL_A Local Loopback (A). Reroutes signal within local DCE. In DTE
configuration, always tied inactive and driven false. In DCE
configuration, ignored
20 DTR_A Data Terminal Ready (A). Output from DTE to DCE indicating that the
DTE is ready to send or receive data.
21 RL_A Remote Loopback (A). Reroutes signal within remote DCE. In DTE
configuration, always tied inactive and driven false. In DCE
configuration, ignored.
22 DSR_B Data Set Ready (B). Input to DTE from DCE to indicate that the DCE is
ready to send or receive data. In DCE configuration, always true.
MVME162/D2 A-5
Serial Interconnections
A
Table A-4. Serial Port B EIA-530 Interconnect Signals (Continued)
Pin Signal
Signal Name and Description
Number Mnemonic
23 DTR_B Data Terminal Ready (B). Output from DTE to DCE indicating that the
DTE is ready to send or receive data.
24 TxCO_A Transmit Signal Element Timing—DTE (A). Control signal that clocks
output data.
25 TM_A Test Mode (A). Indicates whether the local DCE is under test. In DTE
configuration, ignored. In DCE configuration, always tied inactive and
driven false.
Interface Characteristics
In specifying parameters for serial binary data interchange between DTE and
DCE devices, the EIA-530 standard assumes the use of balanced lines, except
for the Remote Loopback, Local Loopback, and Test Mode lines, which are
single-ended. Balanced-line data interchange is generally employed in
preference to unbalanced-line data interchange where any of the following
conditions prevail:
❏ The interconnection cable is too long for effective unbalanced operation.
❏ The interconnection cable is exposed to extraneous noise sources that may
cause an unwanted voltage in excess of ±1V measured differentially
between the signal conductor and circuit ground at the load end of the
cable, with a 50Ω resistor substituted for the transmitter.
❏ It is necessary to minimize interference with other signals.
❏ Inversion of signals may be required (e.g., plus polarity MARK to minus
polarity MARK may be achieved by inverting the cable pair).
EIA-530 interface transmitter and receiver parameters applicable to the
MVME162 are listed in Tables A-5 and A-6.
MVME162/D2 A-7
Serial Interconnections
A
Proper Grounding
An important subject to consider is the use of ground pins. There are two pins
labeled GND. Pin 7 is the signal ground and must be connected to the distant
device to complete the circuit. Pin 1 is the chassis ground, but it must be used
with care. The chassis is connected to the power ground through the green
wire in the power cord and must be connected to be in compliance with the
electrical code.
The problem is that when units are connected to different electrical outlets,
there may be several volts of difference in ground potential. If pin 1 of each
device is interconnected with the others via cable, several amperes of current
could result. This condition may not only be dangerous for the small wires in
a typical cable, but may also produce electrical noise that causes errors in data
transmission. That is why Tables A-1 and A-4 show no connection for pin 1.
Normally, pin 7 (signal ground) should only be connected to the chassis ground
at one point; if several terminals are used with one computer, the logical place
for that point is at the computer. The terminals should not have a connection
between the logic ground return and the chassis.
When using this index, keep in mind that a page number indicates only where
referenced material begins. It may extend to the page or pages following the page
referenced.
Numerics E
162Bug package 1-8 EIA-232-D
interconnections A-1
B SIM part numbers 2-4
backplane jumpers 2-10 EIA-530
battery interconnections A-4
backup 4-2 interface characteristics 4-7, A-6
precautions 4-4 signals A-4
BBRAM 4-4 SIM part numbers 2-4
configuration area memory map 3-19 EPROM
binary number 1-12 size selection 2-7
board socket 1-2, 1-7, 4-2
configuration 2-1 EPROM/Flash selection 2-8
layout 2-2 Ethernet
placement 2-10 address 4-8
serial number 3-21 interface 1-2, 1-8, 4-8
bus arbitration 4-1 Ethernet transceiver
bus priority levels 4-1 interface 2-13
power 2-13
C
configuration area 3-21 F
control/status register 2-12 FCC compliance 1-5
cooling requirements 1-4 features 1-2, 1-6
firmware 1-8
D Flash memory 1-2, 1-7, 2-8, 4-2
data circuit-terminating equipment floating-point coprocessor 1-6, 4-2
(DCE) A-1, 4-6 front panel controls 3-1
data terminal equipment (DTE) A-1, 4-6 fuses 2-13
debugging firmware 1-8
decimal number 1-12
DRAM
base address 2-12
options 4-4
MVME162LX/D1IN-1
Index
T
tick timers 4-9
Time of Day clock 1-2
timeout functions 4-10
timers 1-2
TOD clock memory map 3-20
transition modules 1-6, 1-9, 2-13, 4-6
installation 2-10 I
serial I/O connectors 4-6 N
transmitters, EIA-232-D A-3 D
transmitters, EIA-530 A-7 E
U X
user-definable jumpers 2-8
MVME162LX/D1 IN-3
Index
I
N
D
E
X
Artisan Scientific Corporation dba Artisan Technology Group is not an affiliate, representative, or authorized distributor for any manufacturer listed herein.
We're here to make your life easier. How can we help you today?
(217) 352-9330 I sales@artisantg.com I artisantg .com