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Motorola Mvme162

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0% found this document useful (0 votes)
52 views108 pages

Motorola Mvme162

Uploaded by

Sanjy
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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MVME162
Embedded Controller
User’s Manual
(MVME162/D2)
Notice
While reasonable efforts have been made to assure the accuracy of this document,
Motorola, Inc. assumes no liability resulting from any omissions in this document, or
from the use of the information obtained therein. Motorola reserves the right to revise
this document and to make changes from time to time in the content hereof without
obligation of Motorola to notify any person of such revision or changes.
No part of this material may be reproduced or copied in any tangible medium, or
stored in a retrieval system, or transmitted in any form, or by any means, radio,
electronic, mechanical, photocopying, recording or facsimile, or otherwise, without the
prior written permission of Motorola, Inc.
It is possible that this publication may contain reference to, or information about
Motorola products (machines and programs), programming, or services that are not
announced in your country. Such references or information must not be construed to
mean that Motorola intends to announce such Motorola products, programming, or
services in your country.

Restricted Rights Legend


If the documentation contained herein is supplied, directly or indirectly, to the U.S.
Government, the following notice shall apply unless otherwise agreed to in writing by
Motorola, Inc.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth
in subparagraph (c)(1)(ii) of the Rights in Technical Data and Computer Software
clause at DFARS 252.227-7013.
Motorola, Inc.
Computer Group
2900 South Diablo Way
Tempe, Arizona 85282
Preface
The MVME162 User’s Manual provides general information, hardware preparation and
installation instructions, operating instructions, and a functional description for the
MVME162 Embedded Controller.
This manual is intended for anyone who wants to design OEM systems, supply
additional capability to an existing compatible system, or work in a lab environment
for experimental purposes.
A basic knowledge of computers and digital logic is assumed.
To use this manual, you should be familiar with the publications listed in the Related
Documentation section in Chapter 1 of this manual.
The computer programs stored in the Read Only Memory of this device contain
material copyrighted by Motorola Inc., first published 1990, and may be used only
under a license such as the License for Computer Programs (Article 14) contained in
Motorola’s Terms and Conditions of Sale, Rev. 1/79.

This equipment generates, uses, and can radiate radio


! frequency energy and if not installed and used in
WARNING accordance with the documentation for this product, may
cause interference to radio communications. It has been
tested and found to comply with the limits for a Class A
Computing Device pursuant to Subpart J of Part 15 of FCC
rules, which are designed to provide reasonable protection
against such interference when operated in a commercial
environment. Operation of this equipment in a residential
area is likely to cause interference in which case the user, at
the user’s own expense, will be required to take whatever
measures necessary to correct the interference.

Motorola® and the Motorola symbol are registered trademarks of Motorola, Inc.
Delta SeriesTM, MC68040TM, VMEmoduleTM, VMEsystemTM, VMEexecTM, and 162BugTM
are trademarks of Motorola, Inc.
IndustryPackTM and IPTM are trademarks of GreenSpring Computers, Inc.
TimekeeperTM and ZeropowerTM are trademarks of Thompson Components.
All other products mentioned in this document are trademarks or registered
trademarks of their respective holders.
© Copyright Motorola 1993, 1994
All Rights Reserved
Printed in the United States of America
July 1994
Safety Summary
Safety Depends On You
The following general safety precautions must be observed during all phases of operation, service, and
repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in
this manual violates safety standards of design, manufacture, and intended use of the equipment. Motorola,
Inc. assumes no liability for the customer’s failure to comply with these requirements.
The safety precautions listed below represent warnings of certain dangers of which Motorola is aware. You,
as the user of the product, should follow these warnings and all other safety precautions necessary for the
safe operation of the equipment in your operating environment.
Ground the Instrument.
To minimize shock hazard, the equipment chassis and enclosure must be connected to an electrical ground.
The equipment is supplied with a three-conductor AC power cable. The power cable must either be plugged
into an approved three-contact electrical outlet or used with a three-contact to two-contact adapter, with the
grounding wire (green) firmly connected to an electrical ground (safety ground) at the power outlet. The
power jack and mating plug of the power cable meet International Electrotechnical Commission (IEC) safety
standards.
Do Not Operate in an Explosive Atmosphere.
Do not operate the equipment in the presence of flammable gases or fumes. Operation of any electrical
equipment in such an environment constitutes a definite safety hazard.
Keep Away From Live Circuits.
Operating personnel must not remove equipment covers. Only Factory Authorized Service Personnel or
other qualified maintenance personnel may remove equipment covers for internal subassembly or
component replacement or any internal adjustment. Do not replace components with power cable
connected. Under certain conditions, dangerous voltages may exist even with the power cable removed. To
avoid injuries, always disconnect power and discharge circuits before touching them.
Do Not Service or Adjust Alone.
Do not attempt internal service or adjustment unless another person, capable of rendering first aid and
resuscitation, is present.
Use Caution When Exposing or Handling the CRT.
Breakage of the Cathode-Ray Tube (CRT) causes a high-velocity scattering of glass fragments (implosion).
To prevent CRT implosion, avoid rough handling or jarring of the equipment. Handling of the CRT should
be done only by qualified maintenance personnel using approved safety mask and gloves.
Do Not Substitute Parts or Modify Equipment.
Because of the danger of introducing additional hazards, do not install substitute parts or perform any
unauthorized modification of the equipment. Contact your local Motorola representative for service and
repair to ensure that safety features are maintained.
Dangerous Procedure Warnings.
Warnings, such as the example below, precede potentially dangerous procedures throughout this manual.
Instructions contained in the warnings must be followed. You should also employ all other safety
precautions which you deem necessary for the operation of the equipment in your operating environment.

Dangerous voltages, capable of causing death, are present in


! this equipment. Use extreme caution when handling,
WARNING testing, and adjusting.
Contents

CHAPTER 1 GENERAL INFORMATION


Introduction .............................................................................................................1-1
Models ......................................................................................................................1-1
Features.....................................................................................................................1-2
Specifications ...........................................................................................................1-3
Cooling Requirements.....................................................................................1-4
Special Considerations for Elevated Temperature Operation ...................1-4
FCC Compliance ..............................................................................................1-5
General Description ................................................................................................1-6
Input/Output ...................................................................................................1-6
VMEbus Interface ............................................................................................1-7
No-VMEbus-Interface Option........................................................................1-7
MCchip ..............................................................................................................1-7
Flash Memory and EPROM............................................................................1-7
IndustryPack Modules ....................................................................................1-8
Optional SCSI Interface...................................................................................1-8
Optional LAN Ethernet Transceiver Interface .............................................1-8
Required Equipment...............................................................................................1-8
MVME162Bug Firmware ................................................................................1-8
MVME712 Series Transition Modules...........................................................1-9
Available Software ...........................................................................................1-9
Related Documentation........................................................................................1-10
Support Information .............................................................................................1-11
Manual Terminology ............................................................................................1-12

vii
CHAPTER 2 HARDWARE PREPARATION AND INSTALLATION
Introduction .................................................................................................................2-1
Unpacking Instructions..............................................................................................2-1
Hardware Preparation ...............................................................................................2-1
SIM Selection ........................................................................................................2-2
Removal of Existing SIM .............................................................................2-4
Installation of New SIM ..............................................................................2-5
System Controller Select Header (J1)................................................................2-5
Synchronous Clock Select Header (J11) for Serial Port 1/Console ..............2-6
Clock Select Header (J12) for Serial Port 2 .......................................................2-6
SRAM Battery Backup Source Select Header (J20) .........................................2-7
EPROM Size Select Header (J21) .......................................................................2-7
General-Purpose Readable Jumpers Header (J22)..........................................2-8
Installation Instructions .............................................................................................2-9
IP Installation on the MVME162 .......................................................................2-9
MVME162 Module Installation .......................................................................2-10
System Considerations .....................................................................................2-12

CHAPTER 3 OPERATING INSTRUCTIONS


Introduction .................................................................................................................3-1
Switches and LEDs .....................................................................................................3-1
ABORT Switch (S1)..............................................................................................3-1
RESET Switch (S2) ...............................................................................................3-1
Front Panel Indicators (DS1 - DS4) ...................................................................3-2
Memory Maps .............................................................................................................3-3
Local Bus Memory Map .....................................................................................3-3
Normal Address Range ...............................................................................3-3
Detailed I/O Memory Maps ..............................................................................3-7
IPIC Overall Memory Map .......................................................................3-17
BBRAM, TOD Clock Memory Map .........................................................3-21
Interrupt Acknowledge Map....................................................................3-24
VMEbus Memory Map .....................................................................................3-24
VMEbus Accesses to the Local Bus..........................................................3-24
VMEbus Short I/O Memory Map............................................................3-24
Software Initialization ..............................................................................................3-24
Multi-MPU Programming Considerations ....................................................3-24
Local Reset Operation .......................................................................................3-25

viii
CHAPTER 4 FUNCTIONAL DESCRIPTION
Introduction ................................................................................................................ 4-1
MVME162 Functional Description .......................................................................... 4-1
Data Bus Structure .............................................................................................. 4-1
MC68040/MC68LC040 MPU ............................................................................ 4-2
EPROM and Flash Memory............................................................................... 4-2
SRAM.................................................................................................................... 4-2
About the Battery......................................................................................... 4-3
Onboard DRAM .................................................................................................. 4-4
Battery Backed Up RAM and Clock................................................................. 4-5
VMEbus Interface and VMEchip2 .................................................................... 4-5
I/O Interfaces ...................................................................................................... 4-5
Serial Communications Interface .............................................................. 4-5
IndustryPack (IP) Interfaces....................................................................... 4-8
Ethernet Interface......................................................................................... 4-8
SCSI Interface ............................................................................................... 4-9
SCSI Termination......................................................................................... 4-9
Local Resources ................................................................................................... 4-9
Programmable Tick Timers ...................................................................... 4-10
Watchdog Timer ........................................................................................ 4-10
Software-Programmable Hardware Interrupts..................................... 4-10
Local Bus Timeout ..................................................................................... 4-10
Timing Performance ......................................................................................... 4-10
Local Bus to DRAM Cycle Times ............................................................ 4-11
EPROM/Flash Cycle Times ..................................................................... 4-11
SCSI Transfers ............................................................................................ 4-11
LAN DMA Transfers................................................................................. 4-12
Remote Status and Control.............................................................................. 4-12

APPENDIX A SERIAL INTERCONNECTIONS


Introduction ............................................................................................................... A-1
EIA-232-D Connections ............................................................................................ A-1
Interface Characteristics.................................................................................... A-3
EIA-530 Connections ................................................................................................ A-4
Interface Characteristics.................................................................................... A-6
Proper Grounding ..................................................................................................... A-8

ix
x
List of Figures

Figure 2-1. MVME162 Switch, Header, Connector, Fuse,


and LED Locations .............................................................................2-3
Figure 2-2. Serial Interface Module, Connector Side .........................................2-4
Figure 2-3. MVME162/MVME712M EIA-232-D Connection Diagram ........2-14
Figure 2-4. MVME162/MVME712x EIA-232-D Connection Diagram ..........2-20
Figure 2-5. MVME162 EIA-530 Connection Diagram......................................2-24
Figure 4-1. MVME162 Main Module Block Diagram ....................................4-13
Figure 4-2. Parity DRAM Mezzanine Module Block Diagram.......................4-14

xi
xii
List of Tables

Table 1-1. MVME162 Models.................................................................................1-1


Table 1-2. MVME162 Specifications......................................................................1-3
Table 2-1. Serial Interface Module Part Numbers...............................................2-4
Table 3-1. Local Bus Memory Map .......................................................................3-4
Table 3-2. Local I/O Devices Memory Map ........................................................3-5
Table 3-3. VMEchip2 Memory Map......................................................................3-8
Table 3-4. MCchip Register Map .........................................................................3-14
Table 3-5. Z85230 SCC Register Addresses........................................................3-15
Table 3-6. 82596CA Ethernet LAN Memory Map.............................................3-15
Table 3-7. 53C710 SCSI Memory Map ................................................................3-16
Table 3-8. IPIC Overall Memory Map ................................................................3-17
Table 3-9. IPIC Memory Map—Control and Status Registers ........................3-18
Table 3-10. MK48T08 BBRAM/TOD Clock Memory Map..............................3-19
Table 3-11. BBRAM Configuration Area Memory Map...................................3-19
Table 3-12. TOD Clock Memory Map.................................................................3-20
Table 4-1. DRAM Performance............................................................................4-11
Table A-1. EIA-232-D Interconnections...............................................................A-2
Table A-2. EIA-232-D Interface Transmitter Characteristics ............................A-3
Table A-3. EIA-232-D Interface Receiver Characteristics .................................A-4
Table A-4. Serial Port B EIA-530 Interconnect Signals ......................................A-4
Table A-5. EIA-530 Interface Transmitter Characteristics ................................A-7
Table A-6. EIA-530 Interface Receiver Characteristics......................................A-7

xiii
xiv
GENERAL INFORMATION
1
Introduction
This manual provides general information, hardware preparation and
installation instructions, operating instructions, and a functional description
of the MVME162 Embedded Controller (referred to as the MVME162
throughout this manual).

Models
The MVME162 is available in several models, which are listed in Table 1-1.

Table 1-1. MVME162 Models


Model Description

-001 MC68LC040 microprocessor, 1MB DRAM, 512KB SRAM


-002 MC68040 microprocessor, 1MB DRAM, 512KB SRAM
-003 MC68LC040 microprocessor, 1MB DRAM, 512KB SRAM, no VMEbus
-010 MC68LC040 microprocessor, 4MB DRAM, 512KB SRAM
-011 MC68LC040 microprocessor, 4MB DRAM, SCSI, 512KB SRAM
-012 MC68LC040 microprocessor, 4MB DRAM, Ethernet, 512KB SRAM
-013 MC68LC040 microprocessor, 4MB DRAM, SCSI, Ethernet, 512KB SRAM
-014 MC68LC040 microprocessor, 4MB DRAM, Ethernet, no VMEbus
-020 MC68040 microprocessor, 4MB DRAM, 512KB SRAM
-021 MC68040 microprocessor, 4MB DRAM, SCSI, 512KB SRAM
-022 MC68040 microprocessor, 4MB DRAM, Ethernet, 512KB SRAM
-023 MC68040 microprocessor, 4MB DRAM, SCSI, Ethernet, 512KB SRAM
-026 MC68040 microprocessor, 4MB DRAM, Ethernet, no VMEbus
-030 MC68LC040 microprocessor, 8MB DRAM, 512KB SRAM
-031 MC68LC040 microprocessor, 8MB DRAM, SCSI, 512KB SRAM
-032 MC68LC040 microprocessor, 8MB DRAM, Ethernet, 512KB SRAM
-033 MC68LC040 microprocessor, 8MB DRAM, SCSI, Ethernet, 512KB SRAM
-040 MC68040 microprocessor, 8MB DRAM, 512KB SRAM
-041 MC68040 microprocessor, 8MB DRAM, SCSI, 512KB SRAM
-042 MC68040 microprocessor, 8MB DRAM, Ethernet, 512KB SRAM
-043 MC68040 microprocessor, 8MB DRAM, SCSI, Ethernet, 512KB SRAM

MVME162/D21-1
General Information
1

Features
Features of the MVME162 include:
❏ 25MHz 32-bit Microprocessor: either an MC68LC040 Enhanced 32-bit
Microprocessor with 8KB of cache and MMU, or an optional 25MHz
MC68040 32-bit Microprocessor with 8KB of cache, MMU, and FPU
❏ 1MB, 4MB, or 8MB of shared Dynamic Random Access Memory (DRAM)
with programmable parity
❏ 512KB of Static Random Access Memory (SRAM) with battery backup
❏ One JEDEC standard 32-pin PLCC EPROM socket (EPROMs may be
shipped separately from the MVME162)
❏ 1MB Flash memory: either one Intel 28F008SA (for older boards) or four
Intel 28F020s (for newer boards)
❏ Four 32-bit programmable timers and programmable Watchdog Timer
(MCchip)
❏ Two 32-bit programmable timers and programmable Watchdog Timer
(optional VMEchip2)
❏ 8K by 8 Non-Volatile Random Access Memory (NVRAM) and Time of
Day (TOD) clock with battery backup (Thompson MK48T08)
❏ Input/Output
– Two serial ports (one EIA-232-D DCE; one EIA-232-D or EIA-530
DCE/DTE)
– Serial port controller (Zilog Z85230)
– Optional Small Computer Systems Interface (SCSI) bus interface with
32-bit local bus burst Direct Memory Access (DMA) (NCR 53C710
controller)
– Optional LAN Ethernet transceiver interface with 32-bit local bus
DMA (Intel 82596CA controller)
– Four MVIP IndustryPack interfaces
❏ VMEbus interface (VMEchip2)—non-VMEbus version optional
– VMEbus system controller functions
– VMEbus interface to local bus (A24/A32, D8/D16/D32
(D8/D16/D32/D64BLT) (BLT = Block Transfer)
– Local bus to VMEbus interface (A16/A24/A32, D8/D16/D32)
– VMEbus interrupter

1-2 MVME162 Embedded Controller User’s Manual


Specifications
1
– VMEbus interrupt handler
– Global CSR for interprocessor communications
– DMA for fast local memory-VMEbus transfers (A16/A24/A32,
D16/D32[D16/D32/D64BLT])
❏ Switches and Light-Emitting Diodes (LEDs)
– Two pushbutton switches (ABORT and RESET)
– Eight LEDs (FAIL, STAT, RUN, SCON, LAN, FUSE, SCSI, and VME)

Specifications
Table 1-2, MVME162 Specifications, lists the specifications for an MVME162
without IndustryPacks. The subsequent sections detail cooling requirements
and FCC compliance.

Table 1-2. MVME162 Specifications


Characteristics Specifications

Power requirements +5V (± 5%), 3.5 A typical, 4.5 A maximum


(with PROM; without IPs) +12 Vdc (± 5%), 100 mA maximum
-12 Vdc (± 5%), 100 mA maximum
Operating temperature 0° to 70° C exit air with forced air cooling (see NOTE)
Storage temperature -40° to +85° C
Relative humidity 5% to 90% (noncondensing)
Physical dimensions Double-high VMEboard
PC board with mezzanine
module only
Height 9.2 inches (233 mm)
Depth 6.3 inches (160 mm)
Thickness 0.66 inch (17 mm)
PC board with connectors
and front panel
Height 10.3 inches (262 mm)
Depth 7.4 inches (188 mm)
Thickness 0.80 inch (20.32 mm)

N ote Refer to the following sections on Cooling Requirements and


Special Considerations for Elevated Temperature Operation.

MVME162/D2 1-3
General Information
1

Cooling Requirements
The Motorola MVME162 Embedded Controller is specified, designed, and
tested to operate reliably with an incoming air temperature range from 0° to
55° C (32° to 131° F) with forced air cooling at a velocity typically achievable
by using a 100 CFM axial fan. Temperature qualification is performed in a
standard Motorola VMEsystem 3000 chassis. Twenty-five watt load boards
are inserted in two card slots, one on each side, adjacent to the board under
test, to simulate a high power density system configuration. An assembly of
three axial fans, rated at 100 CFM per fan, is placed directly under the VME
card cage. The incoming air temperature is measured between the fan
assembly and the card cage, where the incoming airstream first encounters the
controller under test. Test software is executed as the controller is subjected to
ambient temperature variations. Case temperatures of critical, high power
density integrated circuits are monitored to ensure component vendors
specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the controller. Less airflow is required to cool the
controller in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the controller
reliably at higher than 55° C with increased airflow. It is important to note that
there are several factors, in addition to the rated CFM of the air mover, which
determine the actual volume and speed of air flowing over the controller.

Special Considerations for Elevated Temperature Operation


The following information is for users whose applications for the MVME162
may subject it to high temperatures.
The MVME162 uses commercial grade devices. Therefore, it can operate in an
environment with ambient air temperatures from 0° C to 70° C. Several factors
influence the ambient temperature seen by components on the MVME162.
Among them are inlet air temperature; air flow characteristics; number, types,
and locations of IndustryPack (IP) modules; power dissipation of adjacent
boards in the system, etc.
A temperature profile of the MVME162-023 was developed in an MVME945
12-slot VME chassis. This board was loaded with one GreenSpring IP-Dual
P/T module (position a) and three GreenSpring IP-488 modules (positions b,
c, and d). One twenty-five-watt load board was installed adjacent to each side
of the board under test. The exit air velocity was approximately 200 LFM

1-4 MVME162 Embedded Controller User’s Manual


Specifications
1
between the MVME162 and the IP-Dual P/T module. Under these conditions,
a 10° C rise between the inlet and exit air was observed. At 70° C exit air
temperature (60° C inlet air), the junction temperatures of devices on the
MVME162 were calculated (from the measured case temperatures) and did
not exceed 100° C.

C aution For elevated-temperature operation, the user must perform


similar measurements and calculations to determine what
operating margin exists in a specific environment.

The following are some steps that the user can take to help make elevated-
temperature operation possible:
1. Position the MVME162 board in the chassis for maximum airflow over the
component side of the board.
2. Avoid placing boards with high power dissipation adjacent to the
MVME162.
3. Use low-power IP modules only. The preferred locations for IP modules
are position a (J2 and J3) and position d (J18 and J19).

FCC Compliance
The MVME162 was tested without IndustryPacks in an FCC-compliant chassis
and meets the requirements for Class A equipment. FCC compliance was
achieved under the following conditions:
1. Shielded cables on all external I/O ports.
2. Cable shields connected to earth ground via metal shell connectors
bonded to a conductive module front panel.
3. Conductive chassis rails connected to earth ground. This provides the
path for connecting shields to earth ground.
4. Front panel screws properly tightened.
For minimum RF emissions, it is essential that the conditions above be
implemented. Failure to do so could compromise the FCC compliance of the
equipment containing the module.

MVME162/D2 1-5
General Information
1

General Description
The MVME162 is a double-high VMEmodule equipped with an MC68LC040
or optional MC68040 microprocessor. (The MC68040 microprocessor has a
floating-point coprocessor; the MC68LC040 does not.)
The MVME162 has 1MB, 4MB, or 8MB of parity-protected DRAM; 512KB
SRAM (with battery backup); a TOD clock (with battery backup); an optional
LAN Ethernet transceiver interface with DMA, two serial ports (EIA-232-D
and EIA-232-D/EIA-530); six tick timers with watchdog timer(s); optional
SCSI bus interface with DMA; VMEbus interface (local bus to
VMEbus/VMEbus to local bus, with A16/A24/A32, D8/D16/D32 bus widths
and a VMEbus system controller).

Input/Output
Input/Output (I/O) signals are routed through backplane connector P2. A P2
adapter board or LCP2 adapter board routes the signals and grounds from
connector P2 to an MVME712 series transition module (MVME712-12,
MVME712-13, MVME712A, MVME712AM, or MVME712M). The transition
module routes the signals to the appropriate configuration headers and
industry-standard connectors. Refer to the MVME712-12, MVME712-13,
MVME712A, MVME712AM, and MVME712B Transition Modules and LCP2
Adapter Board User’s Manual or the MVME712M Transition Module and P2
Adapter Board User’s Manual for more information.

N otes When used with the MVME162, only serial ports 2 and 4 on
the MVME712 are available for use. Serial ports 1 and 3 and
the printer port are not connected to any MVME162 circuits
and should not be used.

An I/O device may be connected to serial port 1 (or 2) on the


MVME162 or to serial port 2 (or 4) on the MVME712, but not
both. (That is, if an I/O device is connected to MVME162
port 1, no other I/O device should be connected to
MVME712 port 2; they are functionally the same port.)

1-6 MVME162 Embedded Controller User’s Manual


General Description
1

VMEbus Interface
The optional VMEchip2 ASIC is the VMEbus interface for the MVME162.
(This option is a factory build and cannot be added in the field.) VMEchip2
features include:
❏ Two programmable 32-bit tick timers
❏ A programmable watchdog timer
❏ Programmable map decoders for the master and slave interfaces
❏ A VMEbus to/from local bus DMA controller
❏ A VMEbus to/from local bus non-DMA programmed access interface
❏ A VMEbus interrupter
❏ A VMEbus system controller
❏ A VMEbus interrupt handler
❏ A VMEbus requester
Processor-to-VMEbus transfers can be D8, D16, or D32. VMEchip2 DMA
transfers to the VMEbus, however, can be D16, D32, D16/BLT, D32/BLT, or
D64/MBLT.

No-VMEbus-Interface Option
If desired, the MVME162 can function as an embedded controller without a
VMEbus interface (i.e., without the optional VMEchip2). Contact your local
Motorola sales office for ordering information.

MCchip
The Memory Controller (MCchip) ASIC provides four 32-bit programmable
tick timers and an interface to the LAN chip, SCSI chip, serial port chip,
BBRAM, PROM/Flash, SRAM, DRAM, reset control, watchdog timers, access
timers, and interrupter logic.

Flash Memory and EPROM


The MVME162 is equipped with 1MB of Flash memory and an EPROM socket
ready for the installation of the EPROM, which may be ordered separately.
Flash memory is either a single device organized in a 1Mbit x 8 configuration
or four devices organized in a 256Kbit x 8 configuration. The EPROM location
is a standard JEDEC 32-pin PLCC capable of four Mbit densities (128 Kbit x 8;

MVME162/D2 1-7
General Information
1
256 Kbit x 8; 512 Kbit x 8; 1 Mbit x 8) organized as a 512Kbit x 8 device. A
jumper allows reset code to be fetched either from Flash memory or from the
EPROM.

IndustryPack Modules
Up to four IndustryPack (IP) modules may be installed on the MVME162. The
interface between the IPs and MVME162 is the IndustryPack Interface
Controller (IPIC) ASIC. Access to the IPs is provided by four 3M connectors
located behind the MVME162 front panel.

Optional SCSI Interface


An NCR 53C710 coprocessor provides the SCSI interface for the MVME162.

Optional LAN Ethernet Transceiver Interface


An Intel 82596CA controller provides the LAN Ethernet transceiver interface
for the MVME162.

Required Equipment
The following equipment is required to complete an MVME162 system:
❏ System console terminal
❏ Disk drives and controllers
❏ Operating system
❏ MVME712 series transition module (MVME712-12, MVME712-13,
MVME712A, MVME712AM, MVME712B, or MVME712M); P2 Adapter
Board or LCP2 Adapter Board; and cable

N ote The MVME712B is an optional device used with MVME712-


12, MVME712-13, MVME712A, and MVME712AM modules
only.

MVME162Bug Firmware
The 162Bug package, MVME162BUG, is a powerful evaluation and debugging
tool for systems built around the MVME162 CISC-based microcomputers.
Facilities are available for loading and executing user programs under
complete operator control for system evaluation. 162Bug includes commands
for display and modification of memory, breakpoint and tracing capabilities,
a powerful assembler/disassembler useful for patching programs, and a self-

1-8 MVME162 Embedded Controller User’s Manual


Required Equipment
1
test at power-up feature which verifies the integrity of the system. Various
162Bug routines that handle I/O, data conversion, and string functions are
available to user programs through the TRAP #15 system calls.

N ote MVME162Bug occupies the first half (512KB) of Flash


memory.

MVME712 Series Transition Modules


The MVME712 series transition modules provide an interface between the
MVME162 and peripheral devices such as EIA-232-D serial devices, SCSI
devices, and LAN Ethernet devices. A P2 Adapter Board or LCP2 Adapter
Board and cable are required.

C aution Connect peripheral devices to MVME712 serial ports 2 and


4 only. (Serial port 2 is the terminal or bug interface.) Do
not connect peripheral devices to serial ports 1 and 3, or to
the printer port.

An I/O device may be connected to serial port 1 (or 2) on the


MVME162 or to serial port 2 (or 4) on the MVME712, but not
to both ports. (That is, if an I/O device is connected to
MVME162 port 1, no other I/O device should be connected
to MVME712 port 2; they are functionally the same port.)

Available Software
Available software for the MVME162 includes the on-board
debugger/monitor firmware, VMEexec driver packages for various
IndustryPack modules, and numerous third-party applications for MC680x0-
based systems. Contact your local Motorola sales office for more information.

MVME162/D2 1-9
General Information
1

Related Documentation
The following publications are applicable to the MVME162 and may provide
additional helpful information. If not shipped with this product, they may be
purchased by contacting your local Motorola sales office. Non-Motorola
documents may be purchased from the sources listed.

Motorola
Document Title Publication
Number

M68040 Microprocessors User’s Manual M68040UM


MVME162 Embedded Controller Support Information (Refer to SIMVME162
the Support Information section in this chapter)
MVME162Bug Debugging Package User’s Manual MVME162BUG
Debugging Package for Motorola 68K CISC CPUs User’s 68KBUG1/2
Manual, Parts 1 and 2
Single Board Computers SCSI Software User’s Manual SBCSCSI
MVME162 Embedded Controller Programmer’s Reference MVME162PG
Guide
MVME712-12, MVME712-13, MVME712A, MVME712AM, and MVME712A
MVME712B Transition Modules and LCP2 Adapter Board
User’s Manual
MVME712M Transition Module and P2 Adapter Board User’s MVME712M
Manual
MVME1x7 Data Sheet Package (for use with the MVME162[LX] 68-1X7DS
and the MVME166/MVME167/MVME187)

N otes Although not shown in the above list, each Motorola


Computer Group manual publication number is suffixed
with characters which represent the revision level of the
document, such as "/D2" (the second revision of a manual);
a supplement bears the same number as a manual but has a
suffix such as "/D2A1" (the first supplement to the second
edition of the manual).

The MVME1x7 Data Sheet Package is composed of vendor-


supplied data sheets and manuals for the peripheral
controllers used on the MVME162 and other boards.

1-10 MVME162 Embedded Controller User’s Manual


Support Information
1
The following publications are available from the sources indicated.
Versatile Backplane Bus: VMEbus, ANSI/IEEE Std 1014-1987, The Institute of
Electrical and Electronics Engineers, Inc., 345 East 47th Street, New York, NY
10017 (VMEbus Specification). This is also available as Microprocessor system
bus for 1 to 4 byte data, IEC 821 BUS, Bureau Central de la Commission
Electrotechnique Internationale; 3, rue de Varembé, Geneva, Switzerland.
ANSI Small Computer System Interface-2 (SCSI-2), Draft Document X3.131-198X,
Revision 10c; Global Engineering Documents, P.O. Box 19539, Irvine, CA 92714.
IndustryPack Logic Interface Specification, Revision 1.0; GreenSpring Computers,
Inc., 1204 O’Brien Drive, Menlo Park, CA 94025.
82596CA Local Area Network Coprocessor data sheet, order number 290218; and
82596 User’s Manual, order number 296853; Intel Corporation, Literature
Sales, P.O. Box 58130, Santa Clara, CA 95052-8130.
NCR 53C710 SCSI I/O Processor Data Manual, order number NCR53C710DM;
and NCR 53C710 SCSI I/O Processor Programmer’s Guide, order number
NCR53C710PG; NCR Corporation, Microelectronics Products Division,
Colorado Springs, CO.
MK48T08(B) Timekeeper™ and 8Kx8 Zeropower™ RAM data sheet in Static
RAMs Databook, Order Code DBSRAM71; SGS-THOMPSON Microelectronics
Group; North & South American Marketing Headquarters, 1000 East Bell
Road, Phoenix, AZ 85022-2699.
Z85230 Serial Communications Controller data sheet, Zilog Inc., 210 Hacienda
Ave., Campbell, CA 95008-6609.
28F008SA Flash Memory Data Sheet, Order Number 290435-001; Intel Literature
Sales, P.O. Box 7641, Mt. Prospect, IL 60056-7641.
28F020 Flash Memory Data Sheet, Order Number 290245-003; Intel Literature
Sales, P.O. Box 7641, Mt. Prospect, IL 60056-7641.

Support Information
You can obtain connector interconnect signal information, parts lists, and
schematics for the MVME162 free of charge by contacting your local Motorola
sales office.

MVME162/D2 1-11
General Information
1

Manual Terminology
Throughout this manual, a convention is used which precedes data and
address parameters by a character identifying the numeric format as follows:
$ dollar specifies a hexadecimal character
% percent specifies a binary number
& ampersand specifies a decimal number
Unless otherwise specified, all address references are in hexadecimal.
An asterisk (*) following the signal name for signals which are level-significant
denotes that the signal is true or valid when the signal is low.
An asterisk (*) following the signal name for signals which are edge-significant
denotes that the actions initiated by that signal occur on high-to-low
transition.
In this manual, assertion and negation are used to specify forcing a signal to a
particular state. In particular, assertion and assert refer to a signal that is active
or true; negation and negate indicate a signal that is inactive or false. These
terms are used independently of the voltage level (high or low) that they
represent.
In this manual, MVME712 series transition module refers generically to the
MVME712-12, MVME712-13, MVME712A, MVME712AM, or MVME712M.
MVME712x transition module refers to the closely related MVME712-12,
MVME712-13, MVME712A, or MVME712AM (not to the MVME712M).
References to a specific module use the complete designation of that module.
Data and address sizes are defined as follows:
❏ A byte is eight bits, numbered 0 through 7, with bit 0 being the least
significant.
❏ A word is 16 bits, numbered 0 through 15, with bit 0 being the least
significant.
❏ A longword is 32 bits, numbered 0 through 31, with bit 0 being the least
significant.

1-12 MVME162 Embedded Controller User’s Manual


HARDWARE PREPARATION
AND INSTALLATION 2
Introduction
This chapter provides unpacking instructions, hardware preparation
guidelines, and installation instructions for the MVME162 Embedded
Controller. Hardware preparation for the MVME712 series transition
modules is described in separate manuals; refer to the Related Documentation
section in Chapter 1.

Unpacking Instructions

N ote If the shipping carton is damaged upon receipt, request that


the carrier’s agent be present during the unpacking and
inspection of the equipment.

Unpack the equipment from the shipping carton. Refer to the packing list and
verify that all items are present. Save the packing material for storing and
reshipping of equipment.

C aution Avoid touching areas of integrated circuitry; static discharge


can damage circuits.

Hardware Preparation
To produce the desired configuration and ensure proper operation of the
MVME162, you may need to carry out certain modifications before installing
the module.
The MVME162 provides software control over most options: by setting bits in
control registers after installing the MVME162 in a system, you can modify its
configuration. (The MVME162 registers are described in Chapter 4, and/or in
the MVME162 Embedded Controller Programmer’s Reference Guide as listed in
Related Documentation in Chapter 1.)
Some options, however, are not software-programmable. Such options are
controlled by manual installation or removal of header jumpers or interface
modules.

MVME162/D22-1
Hardware Preparation and Installation

Figure 2-1 illustrates the placement of the switches, jumper headers,


2 connectors, and LED indicators on the MVME162. Manually configurable
items include:
❏ SIM selection for serial port B configuration (J10)
❏ System controller selection (J1)
❏ Synchronous clock selection (J11) for Serial Port 1/Console
❏ Synchronous clock selection (J12) for Serial Port 2
❏ SRAM backup power source selection (J20)
❏ EPROM size selection (J21)
❏ General-purpose readable register configuration (J22)
The MVME162 has been factory tested and is shipped with the configurations
described in the following sections. The MVME162’s required and factory-
installed Debug Monitor, MVME162Bug (162Bug), operates with those factory
settings.

SIM Selection
Port B of the MVME162’s Z85230 serial communications controller is
configurable via a serial interface module (SIM) which is installed at connector
J10 on the MVME162 board. Four serial interface modules are available:
❏ EIA-232-D (DCE and DTE)
❏ EIA-530 (DCE and DTE)
You can change Port B from an EIA-232-D to an EIA-530 interface (or vice-
versa) by mounting the appropriate serial interface module. Port B is routed
(via the SIM at J10) to the 25-pin DB25 front panel connector marked SERIAL
PORT 2.

For the location of SIM connector J10 on the MVME162, refer to Figure 2-1.
Figure 2-2 illustrates the secondary side (bottom) of a serial interface module,
showing the J1 connector which plugs into SIM connector J10 on the
MVME162. Figure 2-3 (sheets 3-6), Figure 2-4 (sheets 3-4), and Figure 2-5
illustrate the configurations available for Port B.
For the part numbers of the serial interface modules, refer to Table 2-1. The
part numbers are ordinarily printed on the primary side (top) of the SIMs, but
may be found on the secondary side in some versions.
If you need to replace an existing serial interface module with a SIM of another
type, go to Removal of Existing SIM below. If there is no SIM on the main board,
skip to Installation of New SIM.

2-2 MVME162 Embedded Controller User’s Manual


2

2-3
Hardware Preparation

P1 P2

Figure 2-1. MVME162 Switch, Header, Connector, Fuse, and LED Locations
A1 A32 2 40 A1 A32
B1 B32 1
P4 39 B1 B32
C1 C32 C1 C32
1 2
1
F2

J20 J21
3
5 6
49 27 49 27 49 27 49 27
50 26 50 26 50 26 50 26
24 J3 2 24 J8 2 24 J14 2 24 J19 2
25 1 25 1 25 1 25 1
2 40
1
P3 39
49 27 49 27 49 27 49 27
50 26 50 26 50 26 50 26
24 J2 2 24 J7 2 24 J13 2 24 J18 2
25 1 25 1 25 1 25 1

2
1
49 1 49 1
50
J6 2
2
J12 4 50
J17 2
J1 1

J22
40 2
2
49 1 39
J10 1 2 49 1
50
J5 2 J11 4 50
J16 2
1

15

16
19 F1
1 13 1 13 1
20 J4 2 J9 J15
S1 S2

DS1

DS2

DS3

DS4
25 14 25 14
PRIMARY SIDE

MVME162/D2
RUN SCON

FUSE
STAT

SCSI VME
162-XX
MVME

ABORT

RESET
FAIL

LAN
SERIAL PORT 2 SERIAL PORT 1/ CONSOLE
cb232 9212
Hardware Preparation and Installation

2
Table 2-1. Serial Interface Module Part Numbers
EIA Model
Configuration Part Number
Standard Number

EIA-232-D DTE 01-W3846B SIM05


DCE 01-W3865B SIM06
EIA-530 DTE 01-W3868B SIM07
DCE 01-W3867B SIM08

39 1
J1
40 2

SECONDARY SIDE
10922.00 9403 (2-2)

Figure 2-2. Serial Interface Module, Connector Side

Removal of Existing SIM


1. Each serial interface module is retained by two 4-40 x 3/16 ” Phillips-head
screws in opposite corners. Remove the two screws and store them in a
safe place for later use.
2. Grasp opposite sides of the SIM and gently lift straight up.

C aution Avoid lifting the SIM by one side only, as the connector can
be damaged on the SIM or the main board.

3. Place the SIM in a static-safe container for possible reuse.

2-4 MVME162 Embedded Controller User’s Manual


Hardware Preparation

Installation of New SIM


2
1. Observe the orientation of the connector keys on SIM connector J1 and
MVME162 connector J10. Turn the SIM so that the keys line up and place
it gently on connector J10, aligning the mounting holes at the SIM corners
with the matching standoffs on the MVME162.
2. Gently press the top of the SIM to seat it on the connector. If the SIM does
not seat with gentle pressure, recheck the orientation. If the SIM connector
is oriented incorrectly, the mounting holes will not line up with the
standoffs.

C aution Do not attempt to force the SIM on if it is oriented incor-


rectly.

3. Place the two 4-40 x 3/16” Phillips-head screws that you previously
removed (or that were supplied with the new SIM) into the two opposite-
corner mounting holes. Screw them into the standoffs but do not
overtighten them.
The signal relationships and signal connections in the various serial
configurations available for ports A and B are illustrated in Figures 2-3, 2-4,
and 2-5.

System Controller Select Header (J1)


The MVME162 is factory-configured as a VMEbus system controller (i.e., a
jumper is installed across pins 1 and 2 of header J1). Remove the J1 jumper if
the MVME162 is not to be the system controller. Note that when the
MVME162 is functioning as system controller, the SCON LED is turned on.

N ote For MVME162s without the optional VMEbus interface (i.e.,


no VMEchip2), the jumper may be installed or removed
without affecting normal operation.

J1 J1
1 1

2 2

System Controller (factory configuration) Not System Controller

MVME162/D2 2-5
Hardware Preparation and Installation

Synchronous Clock Select Header (J11) for Serial Port 1/Console


2
The MVME162 is shipped from the factory with the SERIAL PORT 1/CONSOLE
header configured for asynchronous communications (i.e., jumpers removed).
To select synchronous communications for the SERIAL PORT 1/CONSOLE
connection, install jumpers across pins 1 and 2 and pins 3 and 4.

J11 J11
2 4 2 4

1 3 1 3
Internal Clock (factory configuration) External Clock

Clock Select Header (J12) for Serial Port 2


The MVME162 is shipped from the factory with the SERIAL PORT 2 header
configured for asynchronous communications (i.e., jumpers removed). To
select synchronous communications for the SERIAL PORT 2 connection, install
jumpers across pins 1 and 2 and pins 3 and 4.

J12 J12
2 4 2 4

1 3 1 3
Internal Clock (factory configuration) External Clock

2-6 MVME162 Embedded Controller User’s Manual


Hardware Preparation

SRAM Battery Backup Source Select Header (J20)


2
The MVME162 is factory-configured to use VMEbus +5V standby power as a
backup power source for the SRAM (i.e., jumpers are installed across pins 1
and 3 and 2 and 4). To select the onboard battery as the backup power source,
install the jumpers across pins 3 and 5 and 4 and 6.

N ote For MVME162s without the optional VMEbus interface (i.e.,


without the VMEchip2 ASIC), you must select the onboard
battery as the backup power source.

C aution Removing all jumpers may temporarily disable the SRAM.


Do not remove all jumpers from J20, except for storage.

J20 J20 J20

1 2 1 2 1 2

5 6 5 6 5 6

VMEbus +5V STBY Backup Power Disabled Onboard Battery


(Factory configuration) (For storage only)

EPROM Size Select Header (J21)


The MVME162 is factory-configured for a 4Mbit EPROM (i.e., a jumper is
installed across pins 2 and 3). This is the only size currently available; if a
larger EPROM becomes available, this jumper will allow it to be selected.

J21

4Mbit EPROM
(Factory configuration)

MVME162/D2 2-7
Hardware Preparation and Installation

General-Purpose Readable Jumpers Header (J22)


2
Header J22 provides eight readable jumpers. These jumpers can be read as a
register (at $FFF4202D) in the MCchip LCSR (local control/status register).
The bit values are read as a zero when the jumper is installed, and as a one
when the jumper is removed.
If the MVME162BUG firmware is installed, four jumpers are user-definable
(pins 1-2, 3-4, 5-6, 7-8). If the MVME162BUG firmware is not installed, seven
jumpers are user-definable (pins 1-2, 3-4, 5-6, 7-8, 11-12, 13-14, 15-16).

N ote Pins 9-10 (GPIO3) are reserved to select either the Flash
memory map (jumper installed) or the EPROM memory
map (jumper removed). They are not user-definable.

The MVME162 is shipped from the factory with J22 set to all zeros (jumpers on
all pins).

J22 162BUG INSTALLED USER CODE INSTALLED

GPIO7 1 2 USER-DEFINABLE USER-DEFINABLE

GPIO6 USER-DEFINABLE USER-DEFINABLE

GPIO5 USER-DEFINABLE USER-DEFINABLE

GPIO4 USER-DEFINABLE USER-DEFINABLE

GPIO3 9 10 IN=FLASH; OUT=EPROM IN=FLASH; OUT=EPROM

GPIO2 REFER TO 162BUG MANUAL USER-DEFINABLE

GPIO1 REFER TO 162BUG MANUAL USER-DEFINABLE

GPIO0 15 16 REFER TO 162BUG MANUAL USER-DEFINABLE

EPROMs Selected (factory configuration)

2-8 MVME162 Embedded Controller User’s Manual


Installation Instructions

Installation Instructions 2
The following sections discuss the installation of IndustryPacks (IPs) on the
MVME162, the installation of the MVME162 into a VME chassis, and the
system considerations relevant to the installation. Before installing
IndustryPacks, ensure that the serial ports and all header jumpers are
configured as desired.

IP Installation on the MVME162


Up to four IndustryPack (IP) modules may be installed on the MVME162.
Install the IPs on the MVME162 as follows:
1. Each IP has two 50-pin connectors that plug into two corresponding 50-
pin connectors on the MVME162: J2/J3, J7/J8, J13/J14, J18/J19. See Figure
2-1 for the MVME162 connector locations.
– Orient the IP(s) so that the tapered connector shells mate properly.
Plug IP_a into connectors J2 and J3; plug IP_b into J7 and J8. Plug IP_c
into J13 and J14; plug IP_d into J18 and J19. If a double-sized IP is
used, plug IP_ab into J2, J3, J7, and J8; plug IP_cd into J13, J14, J18, and
J19.
2. Four additional 50-pin connectors (J6, J5, J17, and J16) are provided behind
the MVME162 front panel for external cabling connections to the IP
modules. There is a one-to-one correspondence between the signals on the
cabling connectors and the signals on the associated IP connectors (i.e., J6
has the same IP_a signals as J2; J5 has the same IP_b signals as J7; J17 has
the same IP_c signals as J13; and J16 has the same IP_d signals as J18.
– Connect user-supplied 50-pin cables to J6, J5, J17, and J16 as needed.
Because of the varying requirements for each different kind of IP,
Motorola does not supply these cables.
– Bring the IP cables out the narrow slots in the MVME162 front panel
and attach them to the appropriate external equipment, depending on
the nature of the particular IP(s).

MVME162/D2 2-9
Hardware Preparation and Installation

MVME162 Module Installation


2
With EPROM and IndustryPacks installed and headers properly configured,
proceed as follows to install the MVME162 in the VME chassis:
1. Turn all equipment power OFF and disconnect the power cable from the
AC power source.

C aution Inserting or removing modules while power is applied


could result in damage to module components.

! Dangerous voltages, capable of causing death, are present in


WARNING this equipment. Use extreme caution when handling, test-
ing, and adjusting.

2. Remove the chassis cover as instructed in the user’s manual for the
equipment.
3. Remove the filler panel from the card slot where you are going to install
the MVME162.
– If you intend to use the MVME162 as system controller, it must occupy
the leftmost card slot (slot 1). The system controller must be in slot 1
to correctly initiate the bus-grant daisy-chain and to ensure proper
operation of the IACK daisy-chain driver.
– If you do not intend to use the MVME162 as system controller, it can
occupy any unused double-height card slot.
4. Slide the MVME162 into the selected card slot. Be sure the module is
seated properly in the P1 and P2 connectors on the backplane. Do not
damage or bend connector pins.
5. Secure the MVME162 in the chassis with the screws provided, making
good contact with the transverse mounting rails to minimize RF
emissions.
6. Install the MVME712 series transition module in the front or the rear of the
VME chassis. (To install an MVME712M, which has a double-wide front
panel, you may need to shift other modules in the chassis.)
7. On the chassis backplane, remove the INTERRUPT ACKNOWLEDGE
(IACK) and BUS GRANT (BG) jumpers from the header for the card slot
occupied by the MVME162.

2-10 MVME162 Embedded Controller User’s Manual


Installation Instructions

8. Connect the P2 Adapter Board or LCP2 Adapter Board and cable(s) to


MVME162 backplane connector P2. This provides a connection point for 2
terminals or other peripherals at the EIA-232-D serial ports, SCSI ports,
and LAN Ethernet port.
For information on installing the P2 or LCP2 Adapter Board and the
MVME712 series transition module(s), refer to the manuals listed in
Related Documentation in Chapter 1 (the MVME162 Embedded Controller
Programmer’s Reference Guide provides some connection diagrams).

N ote If you intend to use the MVME162 with Port B in an EIA-530


configuration, do not install the P2 or LCP2 Adapter Board
and the MVME712 series transition module. They are in-
compatible with the EIA-530 interface (refer to MVME162
Serial Port 2 in Chapter 4, Functional Description).

9. Connect the appropriate cable(s) to the panel connectors for the EIA-232-
D serial ports, SCSI port, and LAN Ethernet port.
– Note that some cables are not provided with the MVME712 series
module and must be made or purchased by the user. (Motorola
recommends shielded cable for all peripheral connections to minimize
radiation.)
10. Connect the peripheral(s) to the cable(s). Appendix A supplies detailed
information on the EIA-232-D signals supported. Appendix B describes
the Ethernet LAN (Local Area Network) port connections. Appendix C
describes the SCSI (Small Computer System Interface) I/O bus connections.
11. Install any other required VMEmodules in the system.
12. Replace the chassis cover.
13. Connect the power cable to the AC power source and turn the equipment
power ON.

MVME162/D2 2-11
Hardware Preparation and Installation

System Considerations
2
The MVME162 draws power from VMEbus backplane connectors P1 and P2.
P2 is also used for the upper 16 bits of data in 32-bit transfers, and for the upper
8 address lines in extended addressing mode. The MVME162 may not function
properly without its main board connected to VMEbus backplane connectors
P1 and P2.
Whether the MVME162 operates as a VMEbus master or as a VMEbus slave, it
is configured for 32 bits of address and 32 bits of data (A32/D32). However, it
handles A16 or A24 devices in the address ranges indicated in Chapter 3. D8
and/or D16 devices in the system must be handled by the MC68040/
MC68LC040 software. Refer to the memory maps in Chapter 3.
The MVME162 contains shared onboard DRAM whose base address is
software-selectable. Both the onboard processor and offboard VMEbus
devices see this local DRAM at base physical address $00000000, as
programmed by the MVME162Bug firmware. This may be changed via
software to any other base address. Refer to the MVME162 Embedded Controller
Programmer’s Reference Guide for more information.
If the MVME162 tries to access offboard resources in a nonexistent location and
is not system controller, and if the system does not have a global bus timeout,
the MVME162 waits forever for the VMEbus cycle to complete. This will cause
the system to lock up. There is only one situation in which the system might
lack this global bus timeout: when the MVME162 is not the system controller
and there is no global bus timeout elsewhere in the system.
Multiple MVME162s may be installed in a single VME chassis. In general,
hardware multiprocessor features are supported.

N ote If you are installing multiple MVME162s in an MVME945


chassis, do not install an MVME162 in slot 12. The height of
the IP modules may cause clearance difficulties in that slot
position.

Other MPUs on the VMEbus can interrupt, disable, communicate with, and
determine the operational status of the processor(s). One register of the GCSR
(global control/status register) set includes four bits that function as location
monitors to allow one MVME162 processor to broadcast a signal to any other
MVME162 processors. All eight registers are accessible from any local
processor as well as from the VMEbus.

2-12 MVME162 Embedded Controller User’s Manual


Installation Instructions

The MVME162 provides +5 Vdc power to the remote LED/switch connector


(J4) through a 1A fuse (F1) located near J4. Connector J4 is the interface for a 2
remote control and indicator panel. If none of the LEDs light and the ABORT
and RESET switches do not operate, check fuse F1.
The MVME162 provides +12 Vdc power to the Ethernet transceiver interface
through a 1A fuse (F2) located near diode CR1. The FUSE LED lights to indicate
that +12 Vdc is available. When the MVME712M module is used, the yellow
DS1 LED on the MVME712M illuminates when LAN power is available, which
indicates that the fuse is good. If the Ethernet transceiver fails to operate, check
fuse F2.
The MVME162 provides SCSI terminator power through a 1A fuse (F1) located
on the P2 Adapter Board or LCP2 Adapter Board. If the fuse is blown, the SCSI
device(s) may function erratically or not at all. When the P2 Adapter Board is
used with an MVME712M and the SCSI bus is connected to the MVME712M,
the green DS2 LED on the MVME712M front panel illuminates when SCSI
terminator power is available. If the green DS2 LED flickers during SCSI bus
operation, check P2 Adapter Board fuse F1.

MVME162/D2 2-13
Hardware Preparation and Installation

712M TRANSITION
MODULE
PORT 2

TO MODEM DB25
J17
RXD P2-C27 TXD2 TXD
PIN 2
TXD P2-C28 RXD2 RXD
PIN 3
CTS P2-C29 RTS2 RTS
PIN 4
RTS P2-C30 CTS2 CTS
PIN 5
DCD P2-C31 DTR2 DTR
PIN 20
DTR P2-C32 DCD2 DCD
PIN 8
DSR
PIN 6
P2 CABLE TXC
PIN 15
TO TERMINAL RXC
PIN 17
J16 TXCO
PIN 24

+12V PIN 7

1.5K

MVME 712M EIA- 232-D DTE CONFIGURATION (TO MODEM)

FRONT PANEL
Z85230 DB25
A PORT
TXD PORT 1
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME162 EIA-232-D DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
RXC D PIN 15
RXC
3 4 D PIN 17
1 2 TXCO
R PIN 24
J11
PIN 7

10970.00 (1-6) 9405

Figure 2-3. MVME162/MVME712M EIA-232-D Connection Diagram (Sheet 1 of 6)

2-14 MVME162 Embedded Controller User’s Manual


Installation Instructions

712M TRANSITION
MODULE
PORT 2

TO MODEM DB25
J17
RXD P2-C27 TXD2 TXD
PIN 2
TXD P2-C28 RXD2 RXD
PIN 3
CTS P2-C29 RTS2 RTS
PIN 4
RTS P2-C30 CTS2 CTS
PIN 5
DCD P2-C31 DTR2 DTR
PIN 20
DTR P2-C32 DCD2 DCD
PIN 8
DSR
PIN 6
P2 CABLE TXC
PIN 15
TO TERMINAL
RXC
J16 PIN 17
TXCO
PIN 24

+12V PIN 7

1.5K

MVME712M EIA-232-D DCE CONFIGURATION (TO TERMINAL)

FRONT PANEL
Z85230 DB25
A PORT
TXD PORT 1
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME162 EIA-232-D DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
RXC D PIN 15
RXC
3 4 D PIN 17
1 2 TXCO
R PIN 24
J11
PIN 7

10970.00 (2-6) 9405

Figure 2-3. MVME162/MVME712M EIA-232-D Connection Diagram (Sheet 2 of 6)

MVME162/D2 2-15
Hardware Preparation and Installation

712M TRANSITION
MODULE
PORT 4
TO MODEM DB25
J19
TXD P2-A25 TXD4 TXD
PIN 2
RXD P2-A26 RXD4 RXD
PIN 3
RTS P2-A27 RTS4 RTS
PIN 4
CTS P2-A29 CTS4 CTS
PIN 5
DTR P2-A30 DTR4 DTR
PIN 20
DCD P2-A31 DCD4 DCD
PIN 8
DSR
PIN 6
RTXC P2-A32 RTXC4 TXC
PIN 15
TRXC P2-A28 TRXC4 TO TERMINAL RXC
PIN 17
J18 TXCO
PIN 24

P2 CABLE PIN 7
+12V

1.5K

J15

MVME712M EIA-232-D DTE CONFIGURATION (TO MODEM)

NOTE: WITH DTE MODULE, THE RECEIVE CLOCK OF 85230 ON B INTERFACE


MUST BE PROGRAMMED AS INPUT TO PREVENT BUFFER CONTENTION

SIM05 FRONT PANEL


Z85230 EIA-232-D DTE DB25
B PORT
TXD PORT 2
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME 162 EIA-232-D DTE CONFIGURATION
TXC NC PIN 6
TXC
(TO MODEM)
3 4
RXC R PIN 15
1 2 +5V RXC
R PIN 17
J12 TXCO
D PIN 24

PIN 7

10970.00 (3-6) 9405

Figure 2-3. MVME162/MVME712M EIA-232-D Connection Diagram (Sheet 3 of 6)

2-16 MVME162 Embedded Controller User’s Manual


Installation Instructions

712M TRANSITION
MODULE
PORT 4
TO MODEM DB25
J19
TXD P2-A25 TXD4 TXD
PIN 2
RXD P2-A26 RXD4 RXD
PIN 3
RTS P2-A27 RTS4 RTS
PIN 4
CTS P2-A29 CTS4 CTS
PIN 5
DTR P2-A30 DTR4 DTR
PIN 20
DCD P2-A31 DCD4 DCD
PIN 8
DSR
PIN 6
RTXC P2-A32 RTXC4 TXC
PIN 15
TRXC P2-A28 TRXC4 TO TERMINAL RXC
PIN 17
J18 TXCO
PIN 24
P2 CABLE
+12V PIN 7

1.5K

J15

MVME712M EIA-232-D DCE CONFIGURATION (TO TERMINAL)

SIM06 FRONT PANEL


Z85230 EIA-232-D DCE DB25
B PORT
TXD PORT 2
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME 162 EIA-232-D DCE CONFIGURATION
TXC D PIN 6
TXC
(TO TERMINAL)
3 4 +5V
RXC D PIN 15
1 2 RXC
D PIN 17
J12 TXCO
R PIN 24

PIN 7

10970.00 (4-6) 9405

Figure 2-3. MVME162/MVME712M EIA-232-D Connection Diagram (Sheet 4 of 6)

MVME162/D2 2-17
Hardware Preparation and Installation

712M TRANSITION
MODULE
PORT 4

TO MODEM DB25
J19
TXD P2-A25 TXD4 TXD
PIN 2
RXD P2-A26 RXD4 RXD
PIN 3
RTS P2-A27 RTS4 RTS
PIN 4
CTS P2-A29 CTS4 CTS
PIN 5
DTR P2-A30 DTR4 DTR
PIN 20
DCD P2-A31 DCD4 DCD
PIN 8
DSR
PIN 6
RTXC P2-A32 RTXC4 TXC
PIN 15
TO TERMINAL
TRXC P2-A28 TRXC4 RXC
J18 PIN 17
TXCO
PIN 24

P2 CABLE PIN 7
+12V

1.5K

J15

MVME712M EIA-232-D CONFIGURATION (TO TERMINAL)

NOTES:
1. WITH DTE MODULE AND MVME 712 JUMPERED AS TO TERMINAL,
THE CLOCKS (TXC AND RXC) ARE THE WRONG DIRECTION.
THE CLOCKS ARE BOTH INPUTS. THEY SHOULD BOTH BE OUTPUTS.
2. WITH DTE MODULE, THE RECEIVE CLOCK OF 85230 ON B INTERFACE
MUST BE PROGRAMMED AS INPUT TO PREVENT BUFFER CONTENTION.

SIM05 FRONT PANEL


Z85230 EIA-232-D DTE DB25
B PORT
TXD PORT 2
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME 162 EIA-232-D DTE CONFIGURATION
TXC NC PIN 6
TXC (TO MODEM)
3 4
RXC R PIN 15
1 2 +5V RXC
R PIN 17
J12 TXCO
D PIN 24

PIN 7

10970.00 (5-6) 9405

Figure 2-3. MVME162/MVME712M EIA-232-D Connection Diagram (Sheet 5 of 6)

2-18 MVME162 Embedded Controller User’s Manual


Installation Instructions

712M TRANSITION
MODULE
PORT 4

TO MODEM DB25
J19
TXD P2-A25 TXD4 TXD
PIN 2
RXD P2-A26 RXD4 RXD
PIN 3
RTS P2-A27 RTS4 RTS
PIN 4
CTS P2-A29 CTS4 CTS
PIN 5
DTR P2-A30 DTR4 DTR
PIN 20
DCD P2-A31 DCD4 DCD
PIN 8
DSR
PIN 6
RTXC P2-A32 RTXC4 TXC
PIN 15
TO TERMINAL
TRXC P2-A28 TRXC4 RXC
J18 PIN 17
TXCO
PIN 24
P2 CABLE
+12V PIN 7

1.5K

J15

MVME712M EIA-232-D DTE CONFIGURATION (TO MODEM)

NOTE:
WITH DCE MODULE AND MVME 712 JUMPERED AS TO TERMINAL,
THE CLOCKS (TXC AND RXC) ARE THE WRONG DIRECTION.
THE CLOCKS ARE BOTH OUTPUTS. THEY SHOULD BOTH BE INPUTS.

SIM06 FRONT PANEL


Z85230 EIA-232-D DCE DB25
B PORT
TXD PORT 2
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME 162 EIA-232-D DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
3 4 +5V
RXC D PIN 15
1 2 RXC
D PIN 17
J12 TXCO
R PIN 24

PIN 7

10970.00 (6-6) 9405

Figure 2-3. MVME162/MVME712M EIA-232-D Connection Diagram (Sheet 6 of 6)

MVME162/D2 2-19
Hardware Preparation and Installation

2
712A/AM/12/13
TRANSITION MODULE
PORT 2

DCE DTE
1.5K J9 1.5K
+12V

SERIAL PORT 2
J16 DB9
RXD P2-C27 TXD2 TXD
PIN 3
TXD P2-C28 RXD2 RXD
PIN 2
CTS P2-C29 RTS2 RTS
PIN 7
RTS P2-C30 CTS2 CTS
PIN 8
DCD P2-C31 DTR2 DTR
PIN 4
DTR P2-C32 DCD2 DCD
PIN 1
DSR
P2 CABLE PIN 6

MODEM PORT 2
J17
MTXD
RJ11
MRXD
TIP
MCTS MODEM PIN 2
(712AM/712-13 RING
MDTR PIN 3
ONLY)
MDCD

MVME 712A/AM/-12/-13 PORT 2 CONFIGURED AS EIA-232-D SERIAL PORT

NOTES:

1. SERIAL PORT 2 IS HARD-WIRED DTE. USE NULL MODEM CABLE FOR DCE.
2. TO CONNECT TERMINAL, SET DSR LINE PULLUP SELECT J9 TO "DCE".

FRONT PANEL
Z85230 DB25
A PORT
TXD PORT 1
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME162 RS232 DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
RXC D PIN 15
RXC
3 4 D PIN 17
1 2 TXCO
R PIN 24
J11
PIN 7

11020.00 9406 (1-4)

Figure 2-4. MVME162/MVME712x EIA-232-D Connection Diagram (Sheet 1 of 4)

2-20 MVME162 Embedded Controller User’s Manual


Installation Instructions

2
712AM/13
TRANSITION MODULE
PORT 2

DCE DTE
1.5K J9 1.5K
+12V

SERIAL PORT 2
J16 DB9
RXD P2-C27 TXD2 TXD
PIN 3
TXD P2-C28 RXD2 RXD
PIN 2
CTS P2-C29 RTS2 RTS
PIN 7
RTS P2-C30 CTS2 CTS
PIN 8
DCD P2-C31 DTR2 DTR
PIN 4
DTR P2-C32 DCD2 DCD
PIN 1
DSR
P2 CABLE PIN 6

MODEM PORT 2
J17
MTXD
RJ11
MRXD
TIP
MCTS MODEM PIN 2
(712AM/712-13 RING
MDTR PIN 3
ONLY)
MDCD

MVME 712AM/-13 PORT 2 CONFIGURED AS MODEM

NOTE:
USING SERIAL PORT 2 AS A MODEM PORT REQUIRES CONNECTION TO
+5/+12/-12Vdc BACKPLANE POWER, A DATA CABLE AT THE DB9 CONNECTOR,
AND A TELCO CABLE AT THE RJ11 CONNECTOR. REFER TO THE USER’S
MANUAL FOR THIS MODULE (MVME712A) FOR SETUP INSTRUCTIONS.

FRONT PANEL
Z85230 DB25
A PORT
TXD PORT 1
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME162 RS232 DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
RXC D PIN 15
RXC
3 4 D PIN 17
1 2 TXCO
R PIN 24
J11
PIN 7

11020.00 9406 (2-4)

Figure 2-4. MVME162/MVME712x EIA-232-D Connection Diagram (Sheet 2 of 4)

MVME162/D2 2-21
Hardware Preparation and Installation

2
712A/AM/-12/-13
TRANSITION MODULE
PORT 4

DCE DTE
1.5K J14 1.5K
+12V

DB9
TXD P2-A25 TXD4 TXD
PIN 3
RXD P2-A26 RXD4 RXD
PIN 2
RTS P2-A27 RTS4 RTS
PIN 7
CTS P2-A29 CTS4 CTS
PIN 8
DTR P2-A30 DTR4 DTR
PIN 4
DCD P2-A31 DCD4 DCD
PIN 1
DSR
PIN 6
TXC P2-A32 RTXC4
NC
RXC P2-A28 TRXC4
NC

P2 CABLE
MVME 712A/AM/-12/-13 PORT 4 (DTE)

NOTES:

1. SERIAL PORT 4 IS HARD-WIRED DTE. USE NULL MODEM CABLE FOR DCE.
2. TO CONNECT TERMINAL, SET DSR LINE PULLUP SELECT J14 TO "DCE".

SIM05 FRONT PANEL


Z85230 EIA-232-D DTE DB25
B PORT
TXD PORT 2
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME 162 RS232 DTE CONFIGURATION
TXC NC PIN 6
TXC (TO MODEM)
3 4
RXC R PIN 15
1 2 +5V RXC
R PIN 17
J12 TXCO
D PIN 24

PIN 7

11020.00 9406 (3-4)

Figure 2-4. MVME162/MVME712x EIA-232-D Connection Diagram (Sheet 3 of 4)

2-22 MVME162 Embedded Controller User’s Manual


Installation Instructions

2
712A/AM/-12/-13
TRANSITION MODULE
PORT 4

DCE DTE
1.5K J14 1.5K
+12V

DB9
TXD P2-A25 TXD4 TXD
PIN 3
RXD P2-A26 RXD4 RXD
PIN 2
RTS P2-A27 RTS4 RTS
PIN 7
CTS P2-A29 CTS4 CTS
PIN 8
DTR P2-A30 DTR4 DTR
PIN 4
DCD P2-A31 DCD4 DCD
PIN 1
DSR
PIN 6
TXC P2-A32 RTXC4
NC
RXC P2-A28 TRXC4
NC

P2 CABLE
MVME 712A/AM/-12/-13 PORT 4 (DTE)

NOTES:

1. SERIAL PORT 4 IS HARD-WIRED DTE. USE NULL MODEM CABLE FOR DCE.
2. TO CONNECT TERMINAL, SET DSR LINE PULLUP SELECT J14 TO "DCE".

SIM06 FRONT PANEL


Z85230 EIA-232-D DCE DB25
B PORT
TXD PORT 2
TXD D PIN 2
RXD
RXD R PIN 3
RTS
RTS D PIN 4
CTS
CTS R PIN 5
DTR
DTR D PIN 20
DCD
DCD R PIN 8
DSR MVME 162 RS232 DCE CONFIGURATION
TXC D PIN 6
TXC (TO TERMINAL)
3 4 +5V
RXC D PIN 15
1 2 RXC
D PIN 17
J12 TXCO
R PIN 24

PIN 7

11020.00 9406 (4-4)

Figure 2-4. MVME162/MVME712x EIA-232-D Connection Diagram (Sheet 4 of 4)

MVME162/D2 2-23
Hardware Preparation and Installation

2 P2 CONNECTOR

TXD_B
P2-C18
TXD_A
P2-A25
RXD_B
P2-A19
RXD_A
P2-A26
RTS_B
P2-C19
RTS_A
P2-A27
CTS_B
P2-C26
CTS_A
P2-A29
DTR_B
P2-A23
DTR_A
P2-A30
DCD_B
P2-C22
DCD_A
P2-A31
DSR_B
P2-A22
DSR_A
P2-A20
MVME 162 EIA-530 DTE CONFIGURATION TXC_B
P2-C24
(TO MODEM) TXC_A
P2-A32
RXC_B
P2-C21
RXC_A
P2-A28
TXCO_B
P2-C23
TXCO_A
P2-A24
TM_A
P2-C25
LL_A
P2-C20
RL_A
P2-A21

SIM07 FRONT PANEL


EIA-530 DTE DB 25

Z85230 NC PIN 1

B PORT PORT
TXD_B
PIN 14 2
TXD D TXD_A
PIN 2
RXD_B
PIN 16
RXD R RXD_A
PIN 3
RTS_B
PIN 18
RTS D RTS_A
PIN 4
CTS_B
PIN 13
CTS R CTS_A
PIN 5
DTR_B
PIN 23
DTR D DTR_A
PIN 20
DCD_B
PIN 10
DCD R DCD_A
PIN 8
DSR_B
PIN 22
TXC NC R DSR_A
PIN 6

3 4 TXC_B
RXC PIN 12
R TXC_A
+5V PIN 15
RXC_B
1 2 PIN 9
R RXC_A
PIN 17
J12
TXCO_B
PIN 11
D TXCO_A
PIN 24

TM_A
NC PIN 25

+5V LL_A
D PIN 19

+5V RL_A
D PIN 21

PIN 7

NOTE: SUFFIX _A = THE + SIGNAL.


SUFFIX _B = THE - SIGNAL.

10971.00 (1-2) 9405

Figure 2-5. MVME162 EIA-530 Connection Diagram (Sheet 1 of 2)

2-24 MVME162 Embedded Controller User’s Manual


Installation Instructions

P2 CONNECTOR 2
TXD_B
P2-C18
TXD_A
P2-A25
RXD_B
P2-A19
RXD_A
P2-A26
RTS_B
P2-C19
RTS_A
P2-A27
CTS_B
P2-C26
CTS_A
P2-A29
DTR_B
P2-A23
DTR_A
P2-A30
DCD_B
P2-C22
DCD_A
P2-A31
DSR_B
P2-A22
MVME 162 EIA-530 DCE CONFIGURATION DSR_A
P2-A20
(TO TERMINAL) TXC_B
P2-C24
TXC_A
P2-A32
RXC_B
P2-C21
RXC_A
P2-A28
TXCO_B
P2-C23
TXCO_A
P2-A24
TM_A
P2-C25
LL_A
P2-C20
RL_A
P2-A21

SIM08 FRONT PANEL


EIA-530 DCE DB 25

Z85230 NC PIN 1

B PORT PORT
TXD_B
PIN 14 2
TXD D TXD_A
PIN 2
RXD_B
PIN 16
RXD R RXD_A
PIN 3
RTS_B
PIN 18
RTS D RTS_A
PIN 4
CTS_B
PIN 13
CTS R CTS_A
PIN 5
DTR_B
PIN 23
DTR D DTR_A
PIN 20
DCD_B
PIN 10
DCD R DCD_A
PIN 8
DSR_B
PIN 22
TXC D DSR_A
PIN 6

3 4 TXC_B
RXC PIN 12
D TXC_A
+5V PIN 15
RXC_B
1 2 PIN 9
D RXC_A
PIN 17
J12
TXCO_B
PIN 11
R TXCO_A
PIN 24
+5V TM_A
D PIN 25

LL_A
NC PIN 19

RL_A
NC PIN 21

PIN 7
PIN 7

NOTE: SUFFIX _A = THE + SIGNAL.


SUFFIX_-B = THE - SIGNAL.

10971.00 (2-2) 9405

Figure 2-5. MVME162 EIA-530 Connection Diagram (Sheet 2 of 2)

MVME162/D2 2-25
Hardware Preparation and Installation

2-26 MVME162 Embedded Controller User’s Manual


OPERATING
INSTRUCTIONS 3
Introduction
This chapter provides information necessary to use the MVME162 in a system
configuration. This includes a description of the switches and LEDs, memory
maps, and software initialization of the module.

Switches and LEDs


The MVME162 front panel has ABORT and RESET switches and eight LED
(light-emitting diode) indicators (FAIL, STAT, RUN, SCON, LAN, FUSE, SCSI,
VME).

ABORT Switch (S1)


When enabled by software, the ABORT switch generates an interrupt at a user-
programmable level. It is normally used to abort program execution and
return to the 162Bug debugger firmware located in the MVME162 EPROM
and Flash memory.
The ABORT switch interrupter in the MCchip ASIC is an edge-sensitive
interrupter connected to the ABORT switch. This interrupter is filtered to
remove switch bounce.

RESET Switch (S2)


The RESET switch resets all onboard devices; it also drives SYSRESET* if the
MVME162 is the system controller. The RESET switch may be disabled by
software.
The VMEchip2 includes both a global and a local reset driver. When the
VMEchip2 operates as the VMEbus system controller, the reset driver
provides a global system reset by asserting the VMEbus signal SYSRESET*. A
SYSRESET* may be generated by the RESET switch, a power-up reset, a
watchdog timeout, or by a control bit in the LCSR in the VMEchip2. SYSRESET*
remains asserted for at least 200 ms, as required by the VMEbus specification.
Similarly, the VMEchip2 provides an input signal and a control bit to initiate
a local reset operation. By setting a control bit, software can maintain a board
in a reset state, disabling a faulty board from participating in normal system
operation. The local reset driver is enabled even when the VMEchip2 is not the

MVME162/D23-1
Operating Instructions

system controller. A local reset may be generated by the RESET switch, a


power-up reset, a watchdog timeout, a VMEbus SYSRESET*, or a control bit in
the GCSR.

3
N ote For an MVME162 without the VMEbus option (i.e., with no
VMEchip2), the LCSR control bit is not available to reset the
module. In this case, the watchdog timer is allowed to time
out to reset the MVME162.

Front Panel Indicators (DS1 - DS4)


There are eight LEDs on the MVME162 front panel: FAIL, STAT, RUN, SCON,
LAN, FUSE, SCSI, and VME.
❏ FAIL LED (red). Lights when the BRDFAIL* signal line is active. Part of
DS1.
❏ STAT LED (yellow). Driven by the MC68040 status lines on the MVME162.
Lights when a halt condition from the processor is detected. Part of DS1.
❏ RUN LED (green). Lights when the local bus TIP* signal line is low. This
indicates one of the local bus masters is executing a local bus cycle. Part of
DS2.
❏ SCON LED (green). Lights when the VMEchip2 in the MVME162 is the
VMEbus system controller. Part of DS2.
❏ LAN LED (green). Lights when the LAN chip is local bus master. Part of
DS3.
❏ FUSE LED (green). Lights when power is available to the transceiver
interface (the MVME162 supplies +12V power to the LAN Ethernet
transceiver interface through a fuse). Part of DS3.
❏ SCSI LED (green). Lights when the SCSI chip is local bus master. Part of
DS4.
❏ VME LED (green). Lights when the board is using the VMEbus (VMEbus
AS* line asserted by the VMEchip2) or when the board is accessed by the
VMEbus (VMEchip2 is the local bus master). Part of DS4.

3-2 User’s Manual


Memory Maps

Memory Maps
There are two points of view for memory maps:
❏ The mapping of all resources as viewed by local bus masters (local bus
memory map)
3
❏ The mapping of onboard resources as viewed by VMEbus masters
(VMEbus memory map)

Local Bus Memory Map


The local bus memory map is split into different address spaces by the
Transfer Type (TT) signals. The local resources respond to the normal access
and interrupt acknowledge codes.
Normal Address Range
The memory map of devices that respond to the normal address range is
shown in the following tables. The normal address range is defined by the TT
signals on the local bus. For the MVME162, transfer types 0, 1, and 2 define the
normal address range. Table 3-1 defines the entire map ($00000000 to
$FFFFFFFF). Many areas of the map are user-programmable, and suggested
uses are shown in the table. The cache inhibit function is programmable in the
MC68xx040 MMU. The onboard I/O space must be marked ‘‘cache inhibit’’
and serialized in its page table. Table 3-2 further defines the map for the local
I/O devices.

MVME162/D2 3-3
Operating Instructions

Table 3-1. Local Bus Memory Map


Software
3 Address Range Devices Accessed Port Width Size Cache Notes
Inhibit

Programmable DRAM on Board D32 1MB-8MB N 2


Programmable SRAM D32 128KB-2MB N 2
Programmable VMEbus A32/A24 D32/D16 -- ? 4
Programmable IP_a Memory D32-D8 64 KB-8 MB ? 2, 4
Programmable IP_b Memory D32-D8 64 KB-8 MB ? 2, 4
Programmable IP_c Memory D32-D8 64 KB-8 MB ? 2, 4
Programmable IP_d Memory D32-D8 64 KB-8 MB ? 2, 4
$FF800000-$FF9FFFFF Flash/EPROM D32 2 MB N 1, 5
$FFA00000-$FFBFFFFF EPROM/Flash D32 2 MB N 6
$FFC00000-$FFCFFFFF Not Decoded D32 1 MB N 7
$FFD00000-$FFDFFFFF Not Decoded D32 1 MB N 7
$FFE00000-$FFE7FFFF SRAM default D32 512 KB N --
$FFE80000-$FFEFFFFF Not Decoded -- 512 KB N 7
$FFF00000-$FFFEFFFF Local I/O Devices D32-D8 878 KB Y 3
(Refer to next table)
$FFFF0000-$FFFFFFFF VMEbus A16 D32/D16 64 KB ? 2, 4

N otes 1. Reset enables the decoder for this space of the memory map so
that it will decode address spaces $FF800000 - $FF9FFFFF and
$00000000 - $003FFFFF. The decode at 0 must be disabled in
the MCchip before DRAM is enabled. DRAM is enabled with
the DRAM Control Register at address $FFF42048, bit 24.
PROM/Flash is disabled at the low address space with PROM
Control Register at address $FFF42040, bit 20.
2. This area is user-programmable. The DRAM and SRAM
decoder is programmed in the MCchip, the local-to-VMEbus
decoders are programmed in the VMEchip2, and the IP
memory space is programmed in the IPIC.
3. Size is approximate.
4. Cache inhibit depends on devices in area mapped.

3-4 User’s Manual


Memory Maps

5. The EPROM and Flash are sized by the MCchip ASIC from an
8-bit private bus to the 32-bit MPU local bus. Because the
device size is less than the allocated memory map for some
entries, the device contents repeat for those entries.
If jumper GPIO3 is installed, the Flash device is accessed. If 3
GPIO3 is not installed, the EPROM is accessed.
6. The Flash and EPROM are sized by the MCchip ASIC from an
8-bit private bus to the 32-bit MPU local bus. Because the
device size is less than the allocated memory map for some
entries, the device contents repeat for those entries.
If jumper GPIO3 is installed, the PROM device is accessed. If
GPIO3 is not installed, the Flash is accessed.
7. These areas are not decoded unless one of the programmable
decoders are initialized to decode this space. If they are not
decoded, an access to this address range will generate a local
bus timeout. The local bus timer must be enabled.
Table 3-2 focuses on the ‘‘Local I/O Devices’’ portion of the local bus main
memory map.

Table 3-2. Local I/O Devices Memory Map


Address Range Devices Accessed Port Width Size Notes

$FFF00000 - $FFF3FFFF Reserved -- 256 KB 4


$FFF40000 - $FFF400FF VMEchip2 (LCSR) D32 256 B 1, 3
$FFF40100 - $FFF401FF VMEchip2 (GCSR) D32-D8 256 B 1, 3
$FFF40200 - $FFF40FFF Reserved -- 3.5 KB 4, 5
$FFF41000 - $FFF41FFF Reserved -- 4 KB 4
$FFF42000 - $FFF42FFF MCchip D32-D8 4 KB 1
$FFF43000 - $FFF44FFF Reserved -- 8 KB 4
$FFF45000 - $FFF45800 SCC #1 (Z85230) D8 2 KB 1, 2
$FFF45801 - $FFF45FFF SCC #2 (Z85230) D8 2 KB 1, 2
$FFF46000 - $FFF46FFF LAN (82596CA) D32 4 KB 1, 6
$FFF47000 - $FFF47FFF SCSI (53C710) D32-D8 4 KB 1
$FFF48000 - $FFF57FFF Reserved -- 64 KB 4
$FFF58000 - $FFF5807F IPIC IP_a I/O D16 128 B 1
$FFF58080 - $FFF580FF IPIC IP_a ID D16 128 B 1
$FFF58100 - $FFF5817F IPIC IP_b I/O D16 128 B 1
$FFF58180 - $FFF581FF IPIC IP_b ID Read D16 128 B 1
$FFF58200 - $FFF5827F IPIC IP_c I/O D16 128 B 1

MVME162/D2 3-5
Operating Instructions

Table 3-2. Local I/O Devices Memory Map (Continued)


Address Range Devices Accessed Port Width Size Notes

$FFF58280 - $FFF582FF IPIC IP_c ID D16 128 B 1


3 $FFF58300 - $FFF5837F IPIC IP_d I/O D16 128 B 1
$FFF58380 - $FFF583FF IPIC IP_d ID Read D16 128 B 1
$FFF58400 - $FFF584FF IPIC IP_ab I/O D32-D16 256 B 1
$FFF58500 - $FFF585FF IPIC IP_cd I/O D32-D16 256 B 8
$FFF58600 - $FFF586FF IPIC IP_ab I/O Repeated D32-D16 256 B 1
$FFF58700 - $FFF587FF IPIC IP_cd I/O Repeated D32-D16 256 B 8
$FFF58800 - $FFF5887F Reserved -- 128 B 1
$FFF58880 - $FFF588FF Reserved -- 128 B 1
$FFF58900 - $FFF5897F Reserved -- 128 B 1
$FFF58980 - $FFF589FF Reserved -- 128 B 1
$FFF58A00 - $FFF58A7F Reserved -- 128 B 1
$FFF58A80 - $FFF58AFF Reserved -- 128 B 1
$FFF58B00 - $FFF58B7F Reserved -- 128 B 1

$FFF58B80 - $FFF58BFF Reserved -- 128 B 1


$FFF58C00 - $FFF58CFF Reserved -- 256 B 1
$FFF58D00 - $FFF58DFF Reserved -- 256 B 1
$FFF58E00 - $FFF58EFF Reserved -- 256 B 1
$FFF58F00 - $FFF58FFF Reserved -- 256 B 1
$FFFBC000 - $FFFBC01F IPIC Registers D32-D8 2 KB 1
$FFFBC800 - $FFFBC81F Reserved -- 2 KB 1
$FFFBD000 - $FFFBFFFF Reserved -- 12 KB 4
$FFFC0000 - $FFFC7FFF MK48T08 (BBRAM, TOD Clock) D32-D8 32 KB 1
$FFFC8000 - $FFFCBFFF MK48T08 & Disable Flash writes D32-D8 16 KB 1, 7
$FFFCC000 - $FFFCFFFF MK48T08 & Enable Flash writes D32-D8 16 KB 1, 7
$FFFD0000 - $FFFEFFFF Reserved -- 128 KB 4

N otes 1. For a complete description of the register bits, refer to the data
sheet for the specific chip. For a more detailed memory map,
refer to the following detailed peripheral device memory
maps.
2. The SCC is an 8-bit device located on an MCchip private data
bus. Byte access is required.

3-6 User’s Manual


Memory Maps

3. Writes to the LCSR in the VMEchip2 must be 32 bits. LCSR


writes of 8 or 16 bits terminate with a TEA signal. Writes to the
GCSR may be 8, 16 or 32 bits. Reads to the LCSR and GCSR
may be 8, 16 or 32 bits. Byte reads should be used to read the
interrupt vector. 3
4. This area does not return an acknowledge signal. If the local
bus timer is enabled, the access times out and is terminated by
a TEA signal.
5. Size is approximate.
6. Port commands to the 82596CA must be written as two 16-bit
writes: upper word first and lower word second.
7. Refer to the Flash and EPROM Interface section in the MCchip
description in Chapter 3.

Detailed I/O Memory Maps


Tables 3-3 through 3-12 provide detailed memory maps for the VMEchip2, the
MCchip, the Zilog Z85230 serial communications controller, the Intel 82596CA
LAN controller, the NCR 53C710 SCSI controller, the IPIC chip, and the
MK48T08 BBRAM/TOD Clock.

MVME162/D2 3-7
Operating Instructions

Table 3-3. VMEchip2 Memory Map (Sheet 1 of 3)


VMEchip2 LCSR Base Address = $FFF40000
OFFSET:
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
3
0 SLAVE ENDING ADDRESS 1

4 SLAVE ENDING ADDRESS 2

8 SLAVE ADDRESS TRANSLATION ADDRESS 1

C SLAVE ADDRESS TRANSLATION ADDRESS 2


BLK
ADDER SNP WP SUP USR A32 A24 BLK PRGM DATA
10 D64
2 2 2 2 2 2 2 2 2 2 2

31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16

14 MASTER ENDING ADDRESS 1

18 MASTER ENDING ADDRESS 2

1C MASTER ENDING ADDRESS 3

20 MASTER ENDING ADDRESS 4

24 MASTER ADDRESS TRANSLATION ADDRESS 4

MAST MAST MAST MAST


28 D16 WP MASTER AM 4 D16 WP MASTER AM 3
EN EN EN EN
GCSR MAST MAST MAST MAST
2C GCSR GROUP SELECT 4 3 2 1
BOARD SELECT EN EN EN EN
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
WAIT ROM DMA TB SRAM
30 RMW ZERO SNP MODE SPEED

34

38 DMA CONTROLLER

3C DMA CONTROLLER

40 DMA CONTROLLER

44 DMA CONTROLLER
TICK TICK CLR IRQ VMEBUS
48 2/1 IRQ 1 IRQ STAT INTERRUPT VMEBUS INTERRUPT VECTOR
EN LEVEL

This sheet continues on facing page.

3-8 User’s Manual


Memory Maps

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

SLAVE STARTING ADDRESS 1


3
SLAVE STARTING ADDRESS 2

SLAVE ADDRESS TRANSLATION SELECT 1

SLAVE ADDRESS TRANSLATION SELECT 2


BLK
ADDER SNP WP SUP USR A32 A24 BLK PRGM DATA
D64
1 1 1 1 1 1 1 1 1 1 1

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

MASTER STARTING ADDRESS 1

MASTER STARTING ADDRESS 2

MASTER STARTING ADDRESS 3

MASTER STARTING ADDRESS 4

MASTER ADDRESS TRANSLATION SELECT 4

MAST MAST MAST MAST


D16 WP MASTER AM 2 D16 WP MASTER AM 1
EN EN EN EN
IO2 IO2 IO2 IO2 IO1 IO1 IO1 IO1 ROM ROM BANK B ROM BANK A
EN WP S/U P/D EN D16 WP S/U SIZE SPEED SPEED
EN EN EN
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
ARB MAST MAST MST MST MASTER DMA DMA DMA DMA DM DMA
ROBN DHB DWB FAIR RWD VMEBUS HALT EN TBL FAIR RELM VMEBUS

DMA DMA LB DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA DMA
TBL SNP MODE INC INC WRT D16 D64 BLK AM AM AM AM AM AM
INT VME LB BLK 5 4 3 2 1 0

LOCAL BUS ADDRESS COUNTER

VMEBUS ADDRESS COUNTER

BYTE COUNTER

TABLE ADDRESS COUNTER


MPU MPU MPU MPU MPU DMA DMA DMA DMA DMA DMA DMA
DMA TABLE
CLR LBE LPE LOB LTO LBE LPE LOB LTO TBL VME DONE
INTERRUPT COUNT
STAT ERR ERR ERR ERR ERR ERR ERR ERR ERR ERR

1360 9403

This sheet begins on facing page.

MVME162/D2 3-9
Operating Instructions

Table 3-3. VMEchip2 Memory Map (Sheet 2 of 3)

3
VMEchip2 LCSR Base Address = $FFF40000
OFFSET:
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
ARB VME
DMA DMA
4C BGTO GLOBAL
EN TIME OFF TIME ON TIMER

50 TICK TIMER 1

54 TICK TIMER 1

58 TICK TIMER 2

5C TICK TIMER 2

SCON SYS BRD PURS CLR BRD RST SYS WD WD WD TO WD WD WD


60 FAIL FAIL STAT PURS FAIL SW RST CLR CLR TO BF SRST RST
STAT STAT OUT EN TO CNT STAT EN LRST EN EN

64 PRE

31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
AC AB SYS MWP PE IRQ1E TIC2 TIC1 VME DMA SIG3 SIG2 SIG1 SIG0 LM1 LM0
68 FAIL IRQ FAIL BERR IRQ IRQ IRQ IRQ IACK IRQ IRQ IRQ IRQ IRQ IRQ IRQ
IRQ IRQ IRQ IRQ
EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN
6C IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16

70

CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR CLR
74 IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16

AC FAIL ABORT SYS FAIL MST WP ERROR


78 IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL

VME IACK DMA SIG 3 SIG 2


7C IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL

SW7 SW6 SW5 SW4


80
IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL

SPARE VME IRQ 7 VME IRQ 6 VME IRQ 5


84 IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL

VECTOR BASE VECTOR BASE MST SYS AC ABORT


88 REGISTER 0 REGISTER 1
IRQ FAIL FAIL GPIOEN
EN LEVEL LEVEL LEVEL

8C

This sheet continues on facing page.

3-10 User’s Manual


Memory Maps

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
VME LOCAL WD
ACCESS BUS TIME OUT
PRESCALER
TIMER TIMER SELECT CLOCK ADJUST

COMPARE REGISTER

COUNTER

COMPARE REGISTER

COUNTER

CLR COC TIC CLR COC TIC


OVERFLOW OVF EN EN
OVERFLOW OVF EN EN
COUNTER 2 2 2 2 COUNTER 1 1 1 1

SCALER
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
SW7 SW6 SW5 SW4 SW3 SW2 SW1 SW0 SPARE VME VME VME VME VME VME VME
IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ7 IRQ6 IRQ5 IRQ4 IRQ3 IRQ2 IRQ1

EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN EN
IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
SET SET SET SET SET SET SET SET
IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
15 14 13 12 11 10 9 8
CLR CLR CLR CLR CLR CLR CLR CLR
IRQ IRQ IRQ IRQ IRQ IRQ IRQ IRQ
15 14 13 12 11 10 9 8

P ERROR IRQ1E TIC TIMER 2 TIC TIMER 1


IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL

SIG 1 SIG 0 LM 1 LM 0
IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL

SW3 SW2 SW1 SW0


IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL

VME IRQ 4 VMEB IRQ 3 VME IRQ 2 VME IRQ 1


IRQ LEVEL IRQ LEVEL IRQ LEVEL IRQ LEVEL

GPIOO GPIOI GPI

MP REV DIS DIS NO DIS EN DIS


IRQ EL
EROM SRAM MST BSYT INT BGN
EN BBSY

1361 9403

This sheet begins on facing page.

MVME162/D2 3-11
Operating Instructions

3
This page intentionally left blank.

3-12 User’s Manual


Memory Maps

Table 3-3. VMEchip2 Memory Map (Sheet 3 of 3)

VMEchip2 GCSR Base Address = $FFF40100


Offsets
3
VME- Local 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
bus Bus
0 0 CHIP REVISION CHIP ID

2 4 LM3 LM2 LM1 LM0 SIG3 SIG2 SIG1 SIG0 RST ISF BF SCON SYSFL X X X
4 8 GENERAL PURPOSE CONTROL AND STATUS REGISTER 0

6 C GENERAL PURPOSE CONTROL AND STATUS REGISTER 1

8 10 GENERAL PURPOSE CONTROL AND STATUS REGISTER 2

A 14 GENERAL PURPOSE CONTROL AND STATUS REGISTER 3

C 18 GENERAL PURPOSE CONTROL AND STATUS REGISTER 4

E 1C GENERAL PURPOSE CONTROL AND STATUS REGISTER 5

MVME162/D2 3-13
Operating Instructions

Table 3-4. MCchip Register Map


MCchip Base Address = $FFF42000

3 Offset D31-D24 D23-D16 D15-D8 D7-D0

$00 MCchip ID MCchip Revision General Control Interrupt Vector


Base Register
$04 Tick Timer 1 Compare Register
$08 Tick Timer 1 Counter Register
$0C Tick Timer 2 Compare Register
$10 Tick Timer 2 Counter Register
$14 LSB Prescaler Prescaler Clock Tick Timer 2 Tick Timer 1
Count Register Adjust Control Control
$18 Tick Timer 4 Tick Timer 3 Tick Timer 2 Tick Timer 1
Interrupt Control Interrupt Control Interrupt Control Interrupt Control
$1C DRAM Parity SCC Interrupt Tick Timer 4 Tick Timer 3
Error Interrupt Control Control Control
Control
$20 DRAM Space Base Address SRAM Space Base Address
Register Register
$24 DRAM Space DRAM/SRAM SRAM Space Size (Reserved)
Size Options
$28 LANC Error (Reserved) LANC Interrupt LANC Bus Error
Status Control Interrupt Control
$2C SCSI Error Status General Purpose MVME162 SCSI Interrupt
Inputs Version Control
$30 Tick Timer 3 Compare Register
$34 Tick Timer 3 Counter Register
$38 Tick Timer 4 Compare Register
$3C Tick Timer 4 Counter Register
$40 Bus Clock PROM Access Flash Access ABORT Switch
Time Control Time Control Interrupt Control
$44 RESET Switch Watchdog Timer Access & (Reserved)
Control Control Watchdog Time
Base Select
$48 DRAM Control (Reserved) MPU Status (Reserved)
$4C 32-bit Prescaler Count Register

3-14 User’s Manual


Memory Maps

Table 3-5. Z85230 SCC Register Addresses


SCC SCC Register Address
3
Port B Control $FFF45001
Port B Data $FFF45003
SCC #1
Port A Control $FFF45005
Port A Data $FFF45007
Port B Control $FFF45801
Port B Data $FFF45803
SCC #2
Port A Control $FFF45805
Port A Data $FFF45807

Table 3-6. 82596CA Ethernet LAN Memory Map


Data Bits

Address D31 D16 D15 D0

$FFF46000 Upper Command Word Lower Command Word


$FFF46004 MPU Channel Attention (CA)

N otes 1. Refer to the MPU Port and MPU Channel Attention registers
in the MVME162 Embedded Controller Programmer’s Reference
Guide.
2. After resetting, you must write the System Configuration
Pointer to the command registers before writing to the MPU
Channel Attention register. Writes to the System Configura-
tion Pointer must be upper word first, lower word second.

MVME162/D2 3-15
Operating Instructions

Table 3-7. 53C710 SCSI Memory Map


53C710 Register Address Map Base Address is $FFF47000
3
SCRIPTs and
Big Endian
Little Endian
Mode Mode

00 SIEN SDID SCNTL1 SCNTL0 00


04 SOCL SODL SXFER SCID 04
08 SBCL SBDL SIDL SFBR 08
0C SSTAT2 SSTAT1 SSTAT0 DSTAT 0C
10 DSA 10
14 CTEST3 CTEST2 CTEST1 CTEST0 14
18 CTEST7 CTEST6 CTEST5 CTEST4 18
1C TEMP 1C
20 LCRC CTEST8 ISTAT DFIFO 20
24 DCMD DBC 24
28 DNAD 28
2C DSP 2C
30 DSPS 30
34 SCRATCH 34
38 DCNTL DWT DIEN DMODE 38
3C ADDER 3C

N ote Accesses may be 8-bit or 32-bit, but not 16-bit.

3-16 User’s Manual


Memory Maps

IPIC Overall Memory Map


The following memory map table includes all devices selected by the IPIC map
decoder.

Table 3-8. IPIC Overall Memory Map


3
Address Range Selected Device Port Width Size

Programmable IP_a/IP_ab Memory Space D32-D8 64 KB-16 MB


Programmable IP_b Memory Space D16-D8 64 KB-8 MB
Programmable IP_c/IP_cd Memory Space D32-D8 64 KB-16 MB
Programmable IP_d Memory Space D16-D8 64 KB-8 MB
$FFF58000-$FFF5807F IP_a I/O Space D16 128 B
$FFF58080-$FFF580BF IP_a ID Space D16 64 B
$FFF580C0-$FFF580FF IP_a ID Space Repeated D16 64 B
$FFF58100-$FFF5817F IP_b I/O Space D16 128 B
$FFF58180-$FFF581BF IP_b ID Space D16 64 B
$FFF581C0-$FFF581FF IP_b ID Space Repeated D16 64 B
$FFF58200-$FFF5827F IP_c I/O Space D16 128 B
$FFF58280-$FFF582BF IP_c ID Space D16 64 B
$FFF582C0-$FFF582FF IP_c ID Space Repeated D16 64 B
$FFF58300-$FFF5837F IP_d I/O Space D16 128 B
$FFF58380-$FFF583BF IP_d ID Space D16 64 B
$FFF583C0-$FFF583FF IP_d ID Space Repeated D16 64 B
$FFF58400-$FFF584FF IP_ab I/O Space D32-D16 256 B
$FFF58500-$FFF585FF IP_cd I/O Space D32-D16 256 B
$FFF58600-$FFF586FF IP_ab I/O Space Repeated D32-D16 256 B
$FFF58700-$FFF587FF IP_cd I/O Space Repeated D32-D16 256 B
$FFFBC000-$FFFBC01F Control/Status Registers D32-D8 32 B

MVME162/D2 3-17
Operating Instructions

Table 3-9 contains a summary of the IPIC CSR registers. The CSR registers can
be accessed as bytes, words, or longwords; they should not be accessed as
lines. They are shown in the table as bytes.

3 Table 3-9. IPIC Memory Map—Control and Status Registers


IPIC Base Address = $FFFBC000

Register Register Register Bit Names


Offset Name D7 D6 D5 D4 D3 D2 D1 D0

$00 CHIP ID 0 0 1 0 0 0 1 1
$01 CHIP REVISION 0 0 0 0 0 0 0 0
$02 RESERVED 0 0 0 0 0 0 0 0
$03 RESERVED 0 0 0 0 0 0 0 0

$04 IP_a MEM BASE UPPER a_BASE31 a_BASE30 a_BASE29 a_BASE28 a_BASE27 a_BASE26 a_BASE25 a_BASE24

$05 IP_a MEM BASE LOWER a_BASE23 a_BASE22 a_BASE21 a_BASE20 a_BASE19 a_BASE18 a_BASE17 a_BASE16

$06 IP_b MEM BASE UPPER b_BASE31 b_BASE30 b_BASE29 b_BASE28 b_BASE27 b_BASE26 b_BASE25 b_BASE24

$07 IP_b MEM BASE LOWER b_BASE23 b_BASE22 b_BASE21 b_BASE20 b_BASE19 b_BASE18 b_BASE17 b_BASE16

$08 IP_c MEM BASE UPPER c_BASE31 c_BASE30 c_BASE29 c_BASE28 c_BASE27 c_BASE26 c_BASE25 c_BASE24

$09 IP_c MEM BASE LOWER c_BASE23 c_BASE22 c_BASE21 c_BASE20 c_BASE19 c_BASE18 c_BASE17 c_BASE16

$0A IP_d MEM BASE UPPER d_BASE31 d_BASE30 d_BASE29 d_BASE28 d_BASE27 d_BASE26 d_BASE25 d_BASE24

$0B IP_d MEM BASE LOWER d_BASE23 d_BASE22 d_BASE21 d_BASE20 d_BASE19 d_BASE18 d_BASE17 d_BASE16

$0C IP_a MEM SIZE a_SIZE23 a_SIZE22 a_SIZE21 a_SIZE20 a_SIZE19 a_SIZE18 a_SIZE17 a_SIZE16

$0D IP_b MEM SIZE b_SIZE23 b_SIZE22 b_SIZE21 b_SIZE20 b_SIZE19 b_SIZE18 b_SIZE17 b_SIZE16

$0E IP_c MEM SIZE c_SIZE23 c_SIZE22 c_SIZE21 c_SIZE20 c_SIZE19 c_SIZE18 c_SIZE17 c_SIZE16

$0F IP_d MEM SIZE d_SIZE23 d_SIZE22 d_SIZE21 d_SIZE20 d_SIZE19 d_SIZE18 d_SIZE17 d_SIZE16

$10 IP_a INT0 CONTROL a0_PLTY a0_E/L* a0_INT a0_IEN a0_ICLR a0_IL2 a0_IL1 a0_IL0

$11 IP_a INT1 CONTROL a1_PLTY a1_E/L* a1_INT a1_IEN a1_ICLR a1_IL2 a1_IL1 a1_IL0

$12 IP_b INT0 CONTROL b0_PLTY b0_E/L* b0_INT b0_IEN b0_ICLR b0_IL2 b0_IL1 b0_IL0

$13 IP_b INT1 CONTROL b1_PLTY b1_E/L* b1_INT b1_IEN b1_ICLR b1_IL2 b1_IL1 b1_IL0

$14 IP_c INT0 CONTROL c0_PLTY c0_E/L* c0_INT c0_IEN c0_ICLR c0_IL2 c0_IL1 c0_IL0

$15 IP_c INT1 CONTROL c1_PLTY c1_E/L* c1_INT c1_IEN c1_ICLR c1_IL2 c1_IL1 c1_IL0

$16 IP_d INT0 CONTROL d0_PLTY d0_E/L* d0_INT d0_IEN d0_ICLR d0_IL2 d0_IL1 d0_IL0

$17 IP_d INT1 CONTROL d1_PLTY d1_E/L* d1_INT d1_IEN d1_ICLR d1_IL2 d1_IL1 d1_IL0

$18 IP_a GENERAL a_ERR a_RT1 a_RT0 a_WIDTH1 a_WIDTH0 a_MEN


CONTROL
0 0

$19 IP_a GENERAL b_ERR 0 b_RT1 b_RT0 b_WIDTH1 b_WIDTH0 0 b_MEN


CONTROL

3-18 User’s Manual


Memory Maps

Table 3-9. IPIC Memory Map—Control and Status Registers (Continued)


IPIC Base Address = $FFFBC000

Register Register Register Bit Names


Offset Name
3
D7 D6 D5 D4 D3 D2 D1 D0

$1A IP_b GENERAL c_ERR 0 c_RT1 c_RT0 c_WIDTH1 c_WIDTH0 0 c_MEN


CONTROL

$1B IP_b GENERAL d_ERR 0 d_RT1 d_RT0 d_WIDTH1 d_WIDTH0 0 d_MEN


CONTROL

$1C RESERVED 0 0 0 0 0 0 0 0
$1D RESERVED 0 0 0 0 0 0 0 0
$1E RESERVED 0 0 0 0 0 0 0 0
$1F IP RESET 0 0 0 0 0 0 0 RES

Table 3-10. MK48T08 BBRAM/TOD Clock Memory Map


Address Range Description Size (Bytes)

$FFFC0000 - $FFFC0FFF User Area 4096


$FFFC1000 - $FFFC10FF Networking Area 256
$FFFC1100 - $FFFC16F7 Operating System Area 1528
$FFFC16F8 - $FFFC1EF7 Debugger Area 2048
$FFFC1EF8 - $FFFC1FF7 Configuration Area 256
$FFFC1FF8 - $FFFC1FFF TOD Clock 8

Table 3-11. BBRAM Configuration Area Memory Map


Address Range Description Size (Bytes)

$FFFC1EF8 - $FFFC1EFB Version 4


$FFFC1EFC - $FFFC1F07 Serial Number 12
$FFFC1F08 - $FFFC1F17 Board ID 16
$FFFC1F18 - $FFFC1F27 PWA 16
$FFFC1F28 - $FFFC1F2B Speed 4
$FFFC1F2C - $FFFC1F31 Ethernet Address 6
$FFFC1F32 - $FFFC1F33 Reserved 2
$FFFC1F34 - $FFFC1F35 Local SCSI ID 2
$FFFC1F36 - $FFFC1F3D Memory Mezzanine PWB 8

MVME162/D2 3-19
Operating Instructions

Table 3-11. BBRAM Configuration Area Memory Map (Continued)


Address Range Description Size (Bytes)

$FFFC1F3E - $FFFC1F45 Memory Mezzanine Serial Number 8


3 $FFFC1F46 - $FFFC1F4D Serial Port 2 Personality PWB 8
$FFFC1F4E - $FFFC1F55 Serial Port 2 Personality Serial No. 8
$FFFC1F56 - $FFFC1F5D IP_a Board ID 8
$FFFC1F5E - $FFFC1F65 IP_a Board Serial Number 8
$FFFC1F66 - $FFFC1F6D IP_a Board PWB 8
$FFFC1F6E - $FFFC1F75 IP_b Board ID 8
$FFFC1F76 - $FFFC1F7D IP_b Board Serial Number 8
$FFFC1F7E - $FFFC1F85 IP_b Board PWB 8
$FFFC1F86 - $FFFC1F8D IP_c Board ID 8
$FFFC1F8E - $FFFC1F95 IP_c Board Serial Number 8
$FFFC1F96 - $FFFC1F9D IP_c Board PWB 8
$FFFC1F9E - $FFFC1FA5 IP_d Board ID 8
$FFFC1FA6 - $FFFC1FAD IP_d Board Serial Number 8
$FFFC1FAE - $FFFC1FB5 IP_d Board PWB 8
$FFFC1FB6 - $FFFC1FF6 Reserved 65
$FFFC1FF7 Checksum 1

Table 3-12. TOD Clock Memory Map


Data Bits

Address D7 D6 D5 D4 D3 D2 D1 D0 Function

$FFFC1FF8 W R S -- -- -- -- -- CONTROL
$FFFC1FF9 ST -- -- -- -- -- -- -- SECONDS 00
$FFFC1FFA x -- -- -- -- -- -- -- MINUTES 00
$FFFC1FFB x x -- -- -- -- -- -- HOUR 00
$FFFC1FFC x FT x x x -- -- -- DAY 01
$FFFC1FFD x x -- -- -- -- -- -- DATE 01
$FFFC1FFE x x x -- -- -- -- -- MONTH 01
$FFFC1FFF -- -- -- -- -- -- -- -- YEAR 00

N ote W = Write Bit


ST = Stop Bit
R = Read Bit
FT = Frequency Test
S = Signbit
x = Unused

3-20 User’s Manual


Memory Maps

BBRAM, TOD Clock Memory Map


The MK48T08 BBRAM (also called Non-Volatile RAM or NVRAM) is divided
into six areas as shown in Table 3-10. The first five areas are defined by
software, while the sixth area, the time-of-day (TOD) clock, is defined by the 3
chip hardware. The first area is reserved for user data. The second area is used
by Motorola networking software. The third area is used by the operating
system. The fourth area is used by the MVME162 board debugger
(MVME162Bug). The fifth area, detailed in Table 3-11, is the configuration
area. The sixth area, the TOD clock, detailed in Table 3-12, is defined by the
chip hardware.
The data structure of the configuration bytes starts at $FFFC1EF8 and is as
follows.
struct brdi_cnfg {
char version[4];
char serial[12];
char id[16];
char pwa[16];
char speed[4];
char ethernet[6];
char fill[2];
char lscsiid[2];
char mem_pwb[8];
char mem_serial[8];
char port2_pwb[8];
char port2_serial[8];
char ipa_brdid[8];
char ipa_serial[8];
char ipa_pwb[8];
char ipb_brdid[8];
char ipb_serial[8];
char ipb_pwb[8];
char ipc_brdid[8];
char ipc_serial[8];
char ipc_pwb[8];
char ipd_brdid[8];
char ipd_serial[8];
char ipd_pwb[8];
char reserved[65];
char cksum[1];
}

MVME162/D2 3-21
Operating Instructions

The fields are defined as follows:


1. Four bytes are reserved for the revision or version of this structure. This
revision is stored in ASCII format, with the first two bytes being the major
3 version numbers and the last two bytes being the minor version numbers.
For example, if the version of this structure is 1.0, this field contains:
0100
2. Twelve bytes are reserved for the serial number of the board in ASCII
format. For example, this field could contain:
000000470476
3. Sixteen bytes are reserved for the board ID in ASCII format. For example,
for an MVME162 board with MC68040, SCSI, Ethernet, 4MB DRAM, and
512KB SRAM, this field contains:
MVME162-23 (The 10 characters are followed by six blanks.)
4. Sixteen bytes are reserved for the printed wiring assembly (PWA) number
assigned to this board in ASCII format. This includes the 01-W prefix. This
is for the main logic board if more than one board is required for a set.
Additional boards in a set are defined by a structure for that set. For
example, for an MVME162 board with MC68040, SCSI, Ethernet, 4MB
DRAM, and 512KB SRAM, at revision A, the PWA field contains:
01-W3814B01A (The 12 characters are followed by four blanks.)
5. Four bytes contain the speed of the board in MHz. The first two bytes are
the whole number of MHz and the second two bytes are fractions of MHz.
For example, for a 25.00 MHz board, this field contains:
2500
6. Six bytes are reserved for the Ethernet address. The address is stored in
hexadecimal format. (Refer to the detailed description in Chapter 4.) If the
board does not support Ethernet, this field is filled with zeros.
7. These two bytes are reserved.
8. Two bytes are reserved for the local SCSI ID. The SCSI ID is stored in
ASCII format.
9. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the memory mezzanine board in ASCII format. This does not
include the 01-W prefix. For example, for a 4MB parity mezzanine at
revision A, the PWB field contains:
3837B02A
10. Eight bytes are reserved for the serial number assigned to the memory
mezzanine board in ASCII format.

3-22 User’s Manual


Memory Maps

11. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the serial port 2 personality board in ASCII format.
12. Eight bytes are reserved for the serial number assigned to the serial port 2
personality board in ASCII format. 3
13. Eight bytes are reserved for the board identifier, in ASCII format, assigned
to the optional first IndustryPack a.
14. Eight bytes are reserved for the serial number, in ASCII format, assigned
to the optional first IndustryPack a.
15. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the optional first IndustryPack a.
16. Eight bytes are reserved for the board identifier, in ASCII format, assigned
to the optional second IndustryPack b.
17. Eight bytes are reserved for the serial number, in ASCII format, assigned
to the optional second IndustryPack b.
18. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the optional second IndustryPack b.
19. Eight bytes are reserved for the board identifier, in ASCII format, assigned
to the optional third IndustryPack c.
20. Eight bytes are reserved for the serial number, in ASCII format, assigned
to the optional third IndustryPack c.
21. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the optional third IndustryPack c.
22. Eight bytes are reserved for the board identifier, in ASCII format, assigned
to the optional fourth IndustryPack d.
23. Eight bytes are reserved for the serial number, in ASCII format, assigned
to the optional fourth IndustryPack d.
24. Eight bytes are reserved for the printed wiring board (PWB) number
assigned to the optional fourth IndustryPack d.
25. Growth space (65 bytes) is reserved. This pads the structure to an even 256
bytes.
26. The final one byte of the area is reserved for a checksum (as defined in the
MVME162Bug Debugging Package User’s Manual) for security and data
integrity of the configuration area of the NVRAM. This data is stored in
hexadecimal format.

MVME162/D2 3-23
Operating Instructions

Interrupt Acknowledge Map


The local bus distinguishes interrupt acknowledge cycles from other cycles by
placing the binary value %11 on TT1-TT0. It also specifies the level that is
3 being acknowledged using TM2-TM0. The interrupt handler selects which
device within that level is being acknowledged.

VMEbus Memory Map


This section describes the mapping of local resources as viewed by VMEbus
masters.
VMEbus Accesses to the Local Bus
The VMEchip2 includes a user-programmable map decoder for the VMEbus-
to-local-bus interface. The map decoder allows you to program the starting
and ending address and the modifiers the MVME162 responds to.
VMEbus Short I/O Memory Map
The VMEchip2 includes a user-programmable map decoder for the GCSR.
The GCSR map decoder allows you to program the starting address of the
GCSR in the VMEbus short I/O space.

Software Initialization
Most functions that have been done with switches or jumpers on other
modules are done by setting control registers on the MVME162. At powerup
or reset, the EPROMs that contain the 162Bug debugging package set up the
default values of many of these registers.
Specific programming details may be determined by study of the M68040
Microprocessor User’s Manual. Then check the details of all the MVME162
onboard registers as given in the MVME162 Embedded Controller Programmer’s
Reference Guide.

Multi-MPU Programming Considerations


Good programming practice dictates that only one MPU at a time have control
of the MVME162 control registers. Of particular note are:
❏ Registers that modify the address map
❏ Registers that require two cycles to access
❏ VMEbus interrupt request registers

3-24 User’s Manual


Software Initialization

Local Reset Operation


Local reset (LRST) is a subset of system reset (SRST). Local reset can be
generated five ways:
❏ Expiration of the watchdog timer 3
❏ Pressing the front panel RESET switch (if the system controller function is
disabled)
❏ By asserting a bit in the board control register in the GCSR
❏ By SYSRESET*
❏ By powerup reset.

N ote The GCSR allows a VMEbus master to reset the local bus.
This feature is very dangerous and should be used with
caution. The local reset feature is a partial system reset, not
a complete system reset such as powerup reset or
SYSRESET*. When the local bus reset signal is asserted, a
local bus cycle may be aborted. The VMEchip2 is connected
to both the local bus and the VMEbus and if the aborted
cycle is bound for the VMEbus, erratic operation may result.
Communications between the local processor and a
VMEbus master should use interrupts or mailbox locations;
reset should not be used in normal communications. Reset
should be used only when the local processor is halted or
the local bus is hung and reset is the last resort.

Any VMEbus access to the MVME162 while it is in the reset state is ignored. If
a global bus timer is enabled, a bus error is generated.

MVME162/D2 3-25
Operating Instructions

3-26 User’s Manual


FUNCTIONAL
DESCRIPTION 4
Introduction
This chapter describes the MVME162 Embedded Controller on a block
diagram level. The Functional Description provides an overview of the
MVME162, followed by a detailed description of several blocks of MVME162
circuitry. Figure 4-1 shows a block diagram of the MVME162 main module.
Figure 4-2 shows a block diagram of the parity DRAM mezzanine module.
Descriptions of other MVME162 blocks, including programmable registers in
the ASICs and peripheral chips, are given in the MVME162 Embedded
Controller Programmer’s Reference Guide. Refer to it for the rest of the functional
description of the MVME162.

MVME162 Functional Description


The MVME162 is a high-functionality VMEbus single board computer
designed around the MC68040/MC68LC040 chip. It has 1MB, 4MB, or 8MB of
DRAM, 512KB of SRAM, 1MB Flash memory, four MVIP IndustryPack
interfaces, and two serial ports (one EIA-232-D DCE; one EIA-232-D or EIA-
530 DCE/DTE). Options include an SCSI mass storage interface, a LAN
Ethernet transceiver interface, and a non-VMEbus version.

Data Bus Structure


The local data bus on the MVME162 is a 32-bit synchronous bus that is based
on the MC68040 bus, and which supports burst transfers and snooping. The
various local bus master and slave devices use the local bus to communicate.
The local bus is arbitrated by priority type arbiter and the priority of the local
bus masters from highest to lowest is: 82596CA LAN, NCR 53C710 SCSI,
VMEbus, and MPU. Generally speaking, any master can access any slave;
however, not all combinations pass the common sense test. Refer to the
MVME162 Embedded Controller Programmer’s Reference Guide and to the user’s
guide for each device to determine its port size, data bus connection, and any
restrictions that apply when accessing the device.

MVME162/D24-1
Functional Description

MC68040/MC68LC040 MPU
The MVME162 is equipped with an MC68040 or MC68LC040 microprocessor.
The MC68040/MC68LC040 have on-chip instruction and data caches; the
MC68040 also provides a floating-point coprocessor. Refer to the M68040
Microprocessor User’s Manual for more information.

4 EPROM and Flash Memory


The MVME162 implementation includes four 2-Mbit Flash devices organized
in a 256Kbit x 8 configuration. The EPROM location is a standard JEDEC 32-
pin PLCC capable of 4 Mbit densities (128 Kbit x 8; 256 Kbit X 8; 512 Kbit x 8;
1 Mbit x8) organized as a 512Kbit x 8 device. A jumper setting (GPIO3, pins 9-
10 on J22) allows reset code to be fetched either from Flash memory (GPIO3
installed) or from the EPROM (GPIO3 removed).

SRAM
The MVME162 provides 512KB of 32-bit-wide onboard static RAM in a single
non-interleaved architecture with onboard battery backup. The worst case
elapsed time for battery protection is 200 days. Specifics on SRAM
performance can be found in the section on the SRAM Memory Controller in
the MCchip Programming Model in the MVME162 Embedded Controller
Programmer’s Reference Guide. The SRAM arrays are not parity protected.
The battery backup function for the MVME162 SRAM is provided by a Dallas
DS1210S device that supports primary and secondary power sources. In the
event of a main board power failure, the DS1210S checks power sources and
switches to the source with the higher voltage.
If the voltage of the backup source is lower than two volts, the DS1210S blocks
the second memory cycle; this allows software to provide an early warning to
avoid data loss. Because the second access may be blocked during a power
failure, software should do at least two accesses before relying on the data.
The MVME162 provides jumpers (on J20) that allow either power source of the
DS1210S to be connected to the VMEbus +5V STDBY pin or to one cell of the
onboard battery. For example, the primary system backup source may be a
battery connected to the VMEbus +5V STDBY pin and the secondary source
may be the onboard battery. If the system source should fail or the board is
removed from the chassis, the onboard battery takes over.

4-2 User’s Manual


MVME162 Functional Description

C aution For proper operation of the onboard SRAM, some jumper


combination must be installed on the Backup Power Source
Select Header. If one of the jumpers is used to select the
battery, the battery must be installed on the MVME162. The
SRAM may malfunction if inputs to the DS1210S are left
unconnected.
4
The SRAM is controlled by the MCchip, and the access time is programmable.
Refer to the MCchip description in the MVME162 Embedded Controller
Programmer’s Reference Guide for more detail.
About the Battery
The power source for the onboard SRAM is a RAYOVAC FB1225 battery with
two BR1225 type lithium cells, socketed for easy removal and replacement. A
small capacitor is provided so that the batteries can be quickly replaced
without data loss.
The lifetime of the battery is very dependent on the ambient temperature of the
board and the power-on duty cycle. The lithium battery supplied on the
MVME162 should provide at least two years of backup time with the board
powered off and with an ambient temperature of 40° C. If the power-on duty
cycle is 50% (the board is powered on half of the time), the battery lifetime is
four years. At lower ambient temperatures the backup time is significantly
longer and may approach the shelf life of the battery.
When a board is stored, the battery should be disconnected to prolong battery
life. This is especially important at high ambient temperatures. The MVME162
is shipped with the battery disconnected (i.e., with VMEbus +5V standby
voltage selected as both primary and secondary power source). If you intend
to use the battery as a power source, whether primary or secondary, it is
necessary to reconfigure the jumpers on J20 before installing the module. Refer
to SRAM Backup Power Source Select Header J20 in Chapter 2 for available
jumper configurations.
The power leads from the battery are exposed on the solder side of the board.
The board should not be placed on a conductive surface or stored in a
conductive bag unless the battery is removed.

MVME162/D2 4-3
Functional Description

C aution Lithium batteries incorporate flammable materials such as


lithium and organic solvents. If lithium batteries are mis-
treated or handled incorrectly, they may burst open and
ignite, possible resulting in injury and/or fire.

When dealing with lithium batteries, carefully follow the precautions listed
4 below in order to prevent accidents.
❏ Do not short-circuit.
❏ Do not disassemble, deform, or apply excessive pressure.
❏ Do not heat or incinerate.
❏ Do not apply solder directly.
❏ Do not use different models, or mix new and old batteries together.
❏ Do not charge.
❏ Always check proper polarity.
To remove the battery from the module, carefully pull the battery from the
socket.
Before installing a new battery, ensure that the battery pins are clean. Note the
battery polarity and press the battery into the socket. When the battery is in
the socket, no soldering is required.

Onboard DRAM
The MVME162 offers a 1MB, a 4MB, and an 8MB DRAM option. The DRAM
architecture is non-interleaved for 1MB and interleaved for 4MB and 8MB.
Parity protection can be enabled with interrupts or bus exception when a
parity error is detected. DRAM performance is specified in the section on the
DRAM Memory Controller in the MCchip Programming Model in the
MVME162 Embedded Controller Programmer’s Reference Guide.
The DRAM map decoder can be programmed to accommodate different base
address(es) and sizes of mezzanine boards. The onboard DRAM is disabled
by a local bus reset and must be programmed before the DRAM can be
accessed. Refer to the MCchip description in the MVME162 Embedded
Controller Programmer’s Reference Guide for detailed programming information.
Most DRAM devices require some number of access cycles before the DRAMs
are fully operational. Normally this requirement is met by the onboard refresh
circuitry and normal DRAM initialization. However, software should insure
that a minimum of 10 initialization cycles are performed to each bank of RAM.

4-4 User’s Manual


MVME162 Functional Description

Battery Backed Up RAM and Clock


An MK48T08 RAM and clock chip is used on the MVME162. This chip
provides a time-of-day clock, oscillator, crystal, power fail detection, memory
write protection, 8KB of RAM, and a battery in one 28-pin package. The clock
provides seconds, minutes, hours, day, date, month, and year in BCD 24-hour
format. Corrections for 28-, 29- (leap year), and 30-day months are
automatically made. No interrupts are generated by the clock. Although the 4
MK48T08 is an 8- bit device, the interface furnished by the MCchip supports
8-, 16-, and 32-bit accesses to the MK48T08. Refer to the MCchip description
in Chapter 3 and to the MK48T08 data sheet for detailed programming and
battery life information.

VMEbus Interface and VMEchip2


The optional VMEchip2 provides the local-bus-to-VMEbus and VMEbus-to-
local-bus interfaces. The VMEchip2 can also provide the VMEbus system
controller functions. Refer to the MVME162 Embedded Controller Programmer’s
Reference Guide for detailed programming information. Refer to the MVME162
Embedded Controller Support Information manual for the pin assignments of
VMEbus backplane connectors P1 and P2.
Note that the ABORT switch logic in the VMEchip2 is not used. The GPI inputs
to the VMEchip2 which are located at $FFF40088 bits 7-0 are not used. The
ABORT switch interrupt is integrated into the MCchip ASIC at location
$FFF42043. The GPI inputs are integrated into the MCchip ASIC at location
$FFF4202C, bits 23-16.

I/O Interfaces
The MVME162 provides onboard I/O for many system applications. The I/O
functions include serial ports, IndustryPack (IP) interfaces, and optional
interfaces for LAN Ethernet transceivers and SCSI mass storage devices.
Serial Communications Interface
The MVME162 uses a Zilog Z85230 serial port controller to implement the two
serial communications interfaces. Each interface supports CTS, DCD, RTS,
and DTR control signals as well as the TxD and RxD transmit/receive data
signals, and TxC/RxC synchronous clock signals. The Z85230 supports
synchronous (SDLC/HDLC) and asynchronous protocols. The MVME162
hardware supports asynchronous serial baud rates of 110B/s to 38.4KB/s.

MVME162/D2 4-5
Functional Description

The Z85230 supplies an interrupt vector during interrupt acknowledge cycles.


The vector is modified within the Z85230 according to the interrupt source.
Interrupt request levels are programmed via the MCchip. Refer to the Z85230
data sheet listed in Chapter 1 and to the MCchip Programming Model in the
MVME162 Embedded Controller Programmer’s Reference Guide for further
information.

4 MVME162 Serial Port 1


Port A of the Z85230 is interfaced as EIA-232-D DCE (data circuit-terminating
equipment) and is routed to the 25-pin DB25 connector marked SERIAL PORT
1/CONSOLE on the MVME162 front panel. Port A is also routed to a DB9/RJ11
(on the MVME712x) or DB25 (on the MVME712M) connector on the
MVME712 series transition module. It is identified there as Port 2.
Although both ports are connected to the same Z85230 Port A, there are
several differences between them:
❏ On the MVME162 front panel, Port 1 can be connected to the TxC and RxC
clock signals which may be present on the DB25 connector. These
connections are made via header J11 on the MVME162 board (see Figures
2-3 and 2-4 in Chapter 2). The TxC and RxC clocks are not available at Port
2 on the MVME712 series transition modules.
❏ On MVME712x transition modules, Port 2 can be routed either through a
DB9 DTE serial interface or (if the module is so equipped1) through the
onboard modem and its standard RJ11 (Telco) jack. These connections are
made via jumper headers J16 and J17 on the MVME712x.
❏ On MVME712M transition modules, Port 2 can be configured as either a
DCE or a DTE serial port via jumper headers J16 and J17 on the
MVME712M.
Figures 2-3 (sheets 1 and 2) and 2-4 (sheets 1 and 2) in Chapter 2 illustrate the
configurations available for Port A.
MVME162 Serial Port 2
Port B of the Z85230 is configured via a serial interface module which is
installed at connector J10 on the MVME162 board. Four serial interface
modules are available:
❏ SIM05 and SIM06 (EIA-232-D DTE and DCE respectively)
❏ SIM07 and SIM08 (EIA-530 DTE and DCE respectively)

1. The MVME712AM and MVME712-13 are equipped with a modem.

4-6 User’s Manual


MVME162 Functional Description

Port B is routed (via the module at J10) to the 25-pin DB25 connector marked
SERIAL PORT 2 on the MVME162 front panel. Port B is also routed to a DB9 (on
the MVME712x) or DB25 (on the MVME712M) connector on the MVME712
series transition module. It is identified there as Port 4.
Although both ports are connected to the same Z85230 Port B, there are several
considerations to keep in mind:
❏ On the MVME162 front panel, Port 2 can be connected to the TxC and RxC 4
clock signals which may be present on the DB25 connector. These
connections are made via header J12 on the MVME162 board (see Figures
2-3, 2-4, and 2-5 in Chapter 2). The TxC and RxC clock lines are also
available at Port 4 on MVME712M transition modules.
❏ On MVME712x transition modules, Port 4 is hard-wired as an EIA-232-D
DB9 DTE serial port. A ‘‘null modem’’ cable is necessary to use it as a DCE
port.
❏ On MVME712M transition modules, Port 4 can be configured as either a
DTE or DCE EIA-232-D serial port via jumper headers J19 and J18 on the
MVME712M. Port 4 can also be connected to the TxC and RxC clock
signals which may be present on the DB25 connector. These connections
are made via header J15 on the MVME712M (see Figure 2-3, sheets 3-6 in
Chapter 2).
❏ When Port B is configured as an EIA-530 interface, EIA-530 data transfers
normally occur through serial port 2 on the MVME162 front panel. The
MVME712 series transition module should be disconnected from the
MVME162.
Although the signals are present at P2 (see Figure 2-5), the EIA-530
standard calls for a DB25 connector and balanced (not single-ended) lines;
these are not supported by the P2 adapter and MVME712 series transition
modules. System integrators who wish to use the EIA-530 signals at P2
must provide the appropriate connections.
Figure 2-3 (sheets 3-6), Figure 2-4 (sheets 3-4), and Figure 2-5 in Chapter 2
illustrate the factory configurations available for Port B. Note that the port
configurations shown in Figure 2-3, sheets 5 and 6 are not recommended for
synchronous applications because of the incorrect clock direction.

MVME162/D2 4-7
Functional Description

C aution Do not connect serial data devices to the equivalent ports on


the MVME712 series transition module and the MVME162
front panel at the same time. This could result in simul-
taneous transmission of conflicting data.

Do not connect peripheral devices to Port 1, Port 3, or the


4 Centronics printer port on the MVME712 series transition
module. In the EIA-232-D case, none of these ports are con-
nected to any MVME162 circuits. In the EIA-530 case,
attempting to use these ports would produce certain con-
nections with the potential to damage the MVME162 or the
peripherals.

IndustryPack (IP) Interfaces


The IPIC ASIC on the MVME162 supports four IndustryPack (IP) interfaces;
these are accessible from the front panel. Refer to the IPIC Programming
Model in the MVME162 Embedded Controller Programmer’s Reference Guide for
details of the IP interface. Refer to the MVME162 Embedded Controller Support
Information manual for the pin assignments of the IP connectors.
Ethernet Interface
The Intel 82596CA LAN controller is used to implement the Ethernet
transceiver interface. The 82596CA accesses local RAM using DMA
operations to perform its normal functions. Because the 82596CA has small
internal buffers and the VMEbus has an undefined latency period, buffer
overrun may occur if the DMA is programmed to access the VMEbus.
Therefore, the 82596CA should not be programmed to access the VMEbus.
Every MVME162 is assigned an Ethernet station address. The address is
$08003E2xxxxx, where xxxxx is the unique 5-nibble number assigned to the
board (i.e., every MVME162 has a different value for xxxxx).
Each MVME162 has an Ethernet station address displayed on a label attached
to backplane connector P2. In addition, the six bytes including the Ethernet
station address are stored in the BBRAM configuration area. That is,
08003E2xxxxx is stored in the BBRAM. At an address of $FFFC1F2C, the upper
four bytes (08003E2x) can be read. At an address of $FFFC1F30, the lower two
bytes (xxxx) can be read. Refer to the BBRAM/TOD Clock memory map
description in Chapter 3. The MVME162 debugger has the capability to
retrieve or set the Ethernet station address.

4-8 User’s Manual


MVME162 Functional Description

If the data in the BBRAM is lost, use the number on the label on backplane
connector P2 to restore it.
The Ethernet transceiver interface is located on the MVME162 main module.
An industry-standard DB15 connector is located on the MVME712 series
transition module.
The MCchip provides support functions for the 82596CA. Refer to the
82596CA user’s guide and to the MVME162 Embedded Controller Programmer’s 4
Reference Guide for detailed programming information. Refer to the
MVME712-12, MVME712-13, MVME712A, MVME712AM, and MVME712B
Transition Modules and LCP2 Adapter Board User’s Manual or the MVME712M
Transition Module and P2 Adapter Board User’s Manual for the pin assignments
of the transition module Ethernet connectors.
SCSI Interface
The MVME162 supports mass storage subsystems through the industry-
standard SCSI bus. These subsystems may include hard and floppy disk
drives, streaming tape drives, and other mass storage devices. The SCSI
interface is implemented using the NCR 53C710 SCSI I/O controller.
Support functions for the NCR 53C710 are provided by the MCchip. Refer to
the NCR 53C710 user’s guide and to the MVME162 Embedded Controller
Programmer’s Reference Guide for detailed programming information. Refer to
the MVME712-12, MVME712-13, MVME712A, MVME712AM, and
MVME712B Transition Modules and LCP2 Adapter Board User’s Manual or to the
MVME712M Transition Module and P2 Adapter Board User’s Manual for the pin
assignments of the transition module SCSI connectors.
SCSI Termination
The individual configuring the system must ensure that the SCSI bus is
properly terminated at both ends.
The MVME162 provides sockets for SCSI bus terminators on the P2 adapter
board or the LCP2 adapter board. If the SCSI bus ends at the adapter board,
then termination resistors must be installed on the adapter board. +5V power
to the SCSI bus TERMPWR signal and termination resistors is provided
through a fuse located on the adapter board.

Local Resources
The MVME162 includes many resources for the local processor. These include
tick timers, software programmable hardware interrupts, watchdog timer,
and local bus timeout.

MVME162/D2 4-9
Functional Description

Programmable Tick Timers


Four 32-bit programmable tick timers with 1 µs resolution are provided in the
MCchip and two 32-bit programmable tick timers are provided in the optional
VMEchip2. The tick timers can be programmed to generate periodic
interrupts to the processor. Refer to the MCchip and VMEchip2 descriptions
in the MVME162 Embedded Controller Programmer’s Reference Guide for detailed
4 programming information.
Watchdog Timer
A watchdog timer is provided in both the MCchip and the optional VMEchip2.
The timers operate independently but in parallel. When the watchdog timers
are enabled, they must be reset by software within the programmed time or
they will time out. The watchdog timers can be programmed to generate a
SYSRESET signal, local reset signal, or board fail signal if they time out. Refer
to the VMEchip2 and MCchip descriptions in the MVME162 Embedded
Controller Programmer’s Reference Guide for detailed programming information.
Software-Programmable Hardware Interrupts
Eight software-programmable hardware interrupts are provided by the
VMEchip2. These interrupts allow software to create a hardware interrupt.
Refer to the VMEchip2 desciption in the MVME162 Embedded Controller
Programmer’s Reference Guide for detailed programming information.
Local Bus Timeout
The MVME162 provides timeout functions in the VMEchip2 and the MCchip
for the local bus. When the timer is enabled and a local bus access times out,
a Transfer Error Acknowledge (TEA) signal is sent to the local bus master. The
timeout value is selectable by software for 8 µsec, 64 µsec, 256 µsec, or infinity.
The local bus timer does not operate during VMEbus bound cycles. VMEbus
bound cycles are timed by the VMEbus access timer and the VMEbus global
timer. Refer to the VMEchip2 and MCchip descriptions in the MVME162
Embedded Controller Programmer’s Reference Guide for detailed programming
information.
The MCchip also provides local bus timeout logic for MVME162s without the
optional VMEbus interface (i.e., without the VMEchip2).

Timing Performance
This section provides performance information for the MVME162. The
MVME162 is designed to operate at 25 MHz.

4-10 User’s Manual


MVME162 Functional Description

Local Bus to DRAM Cycle Times


The DRAM base address, array size, and device size are programmable. The
DRAM controller assumes an interleaved architecture if the DRAM size
requires eight physical devices (that is, when memory array size is 4MB and
DRAM technology is 4 Mbits per device; or when memory array size is 16MB
and DRAM technology is 16 Mbits per device.)
Parity checking and parity exception action is also programmable. The DRAM 4
array size and device size are initialized in the DRAM Space Size Register.
Table 4-1. DRAM Performance
Clock Budget Operating Conditions
4,2,2,2 Non-interleaved, read, 25 MHz, without TEA on parity error
4,1,1,1 Interleaved, read, 25 MHz, without TEA on parity error
5,3,3,3 Non-interleaved, read, 25 MHz, with TEA on parity error
5,2,2,2 Interleaved, read, 25 MHz, with TEA on parity error
3,2,2,2 Write, 25 MHz
5,3,3,3 Non-interleaved, read, 33 MHz, without TEA on parity error
5,2,2,2 Interleaved, read, 33 MHz, without TEA on parity error
6,4,4,4 Non-interleaved, read, 33 MHz, with TEA on parity error
6,3,3,3 Interleaved, read, 33 MHz, with TEA on parity error
4,2,2,2 Write, 33 MHz

N ote TEA is the MC68040 bus error transaction signal. "With TEA"
indicates that a bus error cycle occurs if a DRAM parity error was
detected.

EPROM/Flash Cycle Times


The EPROM/Flash cycle time is programmable from 3 to 10 bus clocks/byte
(4 bytes = 12 to 40). (The actual cycle time may vary depending on the device
speed.) The data transfers are 32 bits wide. Refer to the MVME162 Embedded
Controller Programmer’s Reference Guide.
SCSI Transfers
The MVME162 includes an SCSI mass storage bus interface with DMA
controller. The SCSI DMA controller uses a FIFO buffer to interface the 8-bit
SCSI bus to the 32-bit local bus. The FIFO buffer allows the SCSI DMA
controller to efficiently transfer data to the local bus in four longword bursts.

MVME162/D2 4-11
Functional Description

This reduces local bus usage by the SCSI device. Refer to the MCchip
Programming Model in the MVME162 Embedded Controller Programmer’s
Reference Guide.
The transfer rate of the DMA controller is 44MB/sec at 25 MHz with parity off
and interleaved DRAM and read cycles. Assuming a continuous transfer rate
of 5MB/sec on the SCSI bus, 12% of the local bus bandwidth is used by
4 transfers from the SCSI bus.
LAN DMA Transfers
The MVME162 includes a LAN interface with DMA controller. The LAN DMA
controller uses a FIFO buffer to interface the serial LAN bus to the 32-bit local
bus. The FIFO buffer allows the LAN DMA controller to efficiently transfer
data to the local bus.
The 82596CA does not execute MC68040 compatible burst cycles, therefore the
LAN DMA controller does not use burst transfers. Parity DRAM write cycles
require 3 clock cycles, and read cycles require 5 clock cycles with parity off and
6 clock cycles with parity on.
The transfer rate of the LAN DMA controller is 20MB/sec at 25 MHz with
parity off. Assuming a continuous transfer rate of 1MB/sec on the LAN bus,
5% of the local bus bandwidth is used by transfers from the LAN bus.

Remote Status and Control


The remote status and control connector, J4, is a 20-pin connector located
behind the front panel of the MVME162. It provides system designers with
flexibility in accessing critical indicator and reset functions. This allows a
system designer to construct a RESET/ABORT/LED panel that can be located
remotely from the MVME162.

4-12 User’s Manual


J4

P2

REMOTE LEDS AND SWITCHES MC68040 MPU IPL COMBINER CLOCKS GENERATOR
RESET/ABORT/LEDS

MVME162/D2
IPCHIP
SCSI INTERFACE SCSI

J5, J6, J16, J17 J2, J7, J13, J18 J3, J8, J14, J19

LANCE SIA LAN

IP MODULE
IP MODULES
PORTS

SERIAL
PORTS

P3, P4 VMECHIP2 VME BUFFERS VME

DRAM
MEZZANINE

J9, J15 P1
SRAM

SERIAL PORTS SERIAL PORTS MC CHIP VME

BBRAM AND TOD EPROM FLASH BATTERY BACKUP

10883.00 9401

4-13
MVME162 Functional Description

4
Functional Description

Figure 4-1. MVME162 Main Module Block Diagram

4-14 User’s Manual


MVME162/D2
J1 DATA 00 - 15 J1
RAM 00 - 15

WE LL

WE LM

CAS

RAS

OE

ADDRESS

PARITY

WE UM

WE UU

DATA 16 - 31
RAM 16 - 31

10685.00 9309

4-15
MVME162 Functional Description

4
Functional Description

Figure 4-2. Parity DRAM Mezzanine Module Block Diagram

4-16 User’s Manual


SERIAL
INTERCONNECTIONS A
Introduction
As described in previous chapters of this manual, one of the MVME162’s two
serial ports (port A internally, SERIAL PORT 1/CONSOLE on the front panel) is
an EIA-232-D DCE port exclusively. The second port (port B internally, SERIAL
PORT 2 on the front panel) can be configured via serial interface modules as an
EIA-232-D DCE/DTE or EIA-530 DCE/DTE port.
The MVME162 uses a Zilog Z85230 serial port controller to implement the two
serial communications interfaces. Each interface supports CTS, DCD, RTS,
and DTR control signals as well as the TxD and RxD transmit/receive data
signals, and TxC/RxC synchronous clock signals. The Z85230 supports
synchronous (SDLC/HDLC) and asynchronous protocols. The MVME162
hardware supports asynchronous serial baud rates of 110B/sec to 38.4KB/sec.

EIA-232-D Connections
The EIA-232-D standard defines the electrical and mechanical aspects of this
serial interface. The interface employs unbalanced (single-ended) signaling
and is generally used with DB25 connectors, although other connector styles
(e.g., DB9 and RJ45) are sometimes used as well.
Table A-1 lists the standard EIA-232-D interconnections. Not all pins listed in
the table are necessary in every application.
To interpret the information correctly, remember that the EIA-232-D serial
interface was developed to connect a terminal to a modem. Serial data leaves
the sending device on a Transmit Data (TxD) line and arrives at the receiving
device on a Receive Data (RxD) line. When computing equipment is
interconnected without modems, one of the units must be configured as a
terminal (data terminal equipment: DTE) and the other as a modem (data
circuit-terminating equipment: DCE). Since computers are normally
configured to work with terminals, they are said to be configured as a modem
in most cases.

MVME162/D2A-1
Serial Interconnections
A

Table A-1. EIA-232-D Interconnections


Pin Signal
Signal Name and Description
Number Mnemonic

1 Not used.
2 TxD Transmit Data. Data to be transmitted; input to modem from terminal.
3 RxD Receive Data. Data which is demodulated from the receive line; output
from modem to terminal.
4 RTS Request To Send. Input to modem from terminal when required to
transmit a message. With RTS off, the modem carrier remains off. When
RTS is turned on, the modem immediately turns on the carrier.
5 CTS Clear To Send. Output from modem to terminal to indicate that message
transmission can begin. When a modem is used, CTS follows the off-to-on
transition of RTS after a time delay.
6 DSR Data Set Ready. Output from modem to terminal to indicate that the
modem is ready to send or receive data.
7 SG Signal Ground. Common return line for all signals at the modem
interface.
8 DCD Data Carrier Detect. Output from modem to terminal to indicate that a
valid carrier is being received.
9-14 Not used.
15 TxC Transmit Clock (DCE). Output from modem to terminal; clocks data from
the terminal to the modem.
16 Not used.
17 RxC Receive Clock. Output from terminal to modem; clocks input data from
the terminal to the modem.
18, 19 Not used.
20 DTR Data Terminal Ready. Input to modem from terminal; indicates that the
terminal is ready to send or receive data.
21 Not used.
22 RI Ring Indicator. Output from modem to terminal; indicates that an
incoming call is present. The terminal causes the modem to answer the
phone by carrying DTR true while RI is active..
23 Not used.
24 TxC Transmit Clock (DTE). Input to modem from terminal; same function as
TxC on pin 15.
25 BSY Busy. Input to modem from terminal; a positive EIA signal applied to this
pin causes the modem to go off-hook and make the associated phone busy.

A-2 User’s Manual


EIA-232-D Connections
A

N otes 1. A high EIA-232-D signal level is +3 to +15 volts. A low level is


-3 to -15 volts. Connecting units in parallel may produce out-
of-range voltages and is contrary to specifications.

2. The EIA-232-D interface is intended to connect a terminal to a


modem. When computers are connected without modems,
one computer must be configured as a modem and the other
as a terminal.

Interface Characteristics
The EIA-232-D interface standard specifies all parameters for serial binary
data interchange between DTE and DCE devices using unbalanced lines. EIA-
232-D transmitter and receiver parameters applicable to the MVME162 are
listed in Tables A-2 and A-3.

Table A-2. EIA-232-D Interface Transmitter Characteristics


Value
Parameter Unit
Minimum Maximum

Output voltage (with load resistance of 3000Ω ±8.5 V


to 7000Ω)
Open circuit output voltage ±12 V
Short circuit output current (to ground or any ±100 mA
other interconnection cable conductor)
Power off output resistance 300 Ω
Output transition time (for a transition region 2 µs
of -3V to +3V and with total load capacitance,
including connection cable, of less than 2500pF)
Open circuit slew rate 30 V/µs

MVME162/D2 A-3
Serial Interconnections
A

Table A-3. EIA-232-D Interface Receiver Characteristics


Value
Parameter Unit
Minimum Maximum

Input signal voltage ±25 V


Input high threshold voltage 2.25 V
Input low threshold voltage 0.75 V
Input hysteresis 1.0 V
Input impedance (-15V < Vin < +15V) 3000 7000 Ω

The MVME162 conforms to EIA-232-D specifications. Note that although the


EIA-232-D standard recommends the use of short interconnection cables not
more than 50 feet (15m) in length, longer cables are permissible provided the
total load capacitance measured at the interface point and including signal
terminator does not exceed 2500pF.

EIA-530 Connections
The EIA-530 interface complements the EIA-232-D interface in function. The
EIA-530 standard defines the mechanical aspects of this interface, which is
used for transmission of serial binary data, both synchronous and
asynchronous. It is adaptable to balanced (double-ended) as well as
unbalanced (single-ended) signaling and offers the possibility of higher data
rates than EIA-232-D with the same DB25 connector.
Table A-4 lists the EIA-530 interconnections that are available at serial port B
(SERIAL PORT 2 on the front panel) when the port is configured via serial
interface modules as an EIA-530 DCE or DTE port.

Table A-4. Serial Port B EIA-530 Interconnect Signals


Pin Signal
Signal Name and Description
Number Mnemonic

1 Not used.
2 TxD_A Transmit Data (A). Data to be transmitted; output from DTE to DCE.
3 RxD_A Receive Data (A). Data which is demodulated from the receive line; input
from DCE to DTE.

A-4 User’s Manual


EIA-530 Connections
A
Table A-4. Serial Port B EIA-530 Interconnect Signals (Continued)
Pin Signal
Signal Name and Description
Number Mnemonic

4 RTS_A Request to Send (A). Output from DTE to DCE when required to transmit
a message.
5 CTS_A Clear to Send (A). Input to DTE from DCE to indicate that message
transmission can begin.
6 DSR_A Data Set Ready (A). Input to DTE from DCE to indicate that the DCE is
ready to send or receive data. In DCE configuration, always true.
7 SIG GND Signal Ground. Common return line for all signals.
8 DCD_A Data Carrier Detect (A). Receive line signal detector output from DCE to
DTE to indicate that valid data is being transferred to the DTE on the RxD
line.
9 RxC_B Receive Signal Element Timing—DCE (B). Control signal that clocks
input data.
10 DCD_B Data Carrier Detect (B). Receive line signal detector output from DCE to
DTE to indicate that valid data is being transferred to the DTE on the RxD
line.
11 TxCO_B Transmit Signal Element Timing—DTE (B). Control signal that clocks
output data.
12 TxC_B Transmit Signal Element Timing—DCE (B). Control signal that clocks
input data.
13 CTS_B Clear to Send (B). Input to DTE from DCE to indicate that message
transmission can begin.
14 TxD_B Transmit Data (B). Data to be transmitted; output from DTE to DCE.
15 TxC_A Transmit Signal Element Timing—DCE (A). Control signal that clocks
input data.
16 RxD_B Receive Data (B). Data which is demodulated from the receive line; input
from DCE to DTE.
17 RxC_A Receive Signal Element Timing—DCE (A). Control signal that clocks
input data.
18 RTS_B Request to Send (B). Output from DTE to DCE when required to transmit
a message.
19 LL_A Local Loopback (A). Reroutes signal within local DCE. In DTE
configuration, always tied inactive and driven false. In DCE
configuration, ignored
20 DTR_A Data Terminal Ready (A). Output from DTE to DCE indicating that the
DTE is ready to send or receive data.
21 RL_A Remote Loopback (A). Reroutes signal within remote DCE. In DTE
configuration, always tied inactive and driven false. In DCE
configuration, ignored.
22 DSR_B Data Set Ready (B). Input to DTE from DCE to indicate that the DCE is
ready to send or receive data. In DCE configuration, always true.

MVME162/D2 A-5
Serial Interconnections
A
Table A-4. Serial Port B EIA-530 Interconnect Signals (Continued)
Pin Signal
Signal Name and Description
Number Mnemonic

23 DTR_B Data Terminal Ready (B). Output from DTE to DCE indicating that the
DTE is ready to send or receive data.
24 TxCO_A Transmit Signal Element Timing—DTE (A). Control signal that clocks
output data.
25 TM_A Test Mode (A). Indicates whether the local DCE is under test. In DTE
configuration, ignored. In DCE configuration, always tied inactive and
driven false.

Interface Characteristics
In specifying parameters for serial binary data interchange between DTE and
DCE devices, the EIA-530 standard assumes the use of balanced lines, except
for the Remote Loopback, Local Loopback, and Test Mode lines, which are
single-ended. Balanced-line data interchange is generally employed in
preference to unbalanced-line data interchange where any of the following
conditions prevail:
❏ The interconnection cable is too long for effective unbalanced operation.
❏ The interconnection cable is exposed to extraneous noise sources that may
cause an unwanted voltage in excess of ±1V measured differentially
between the signal conductor and circuit ground at the load end of the
cable, with a 50Ω resistor substituted for the transmitter.
❏ It is necessary to minimize interference with other signals.
❏ Inversion of signals may be required (e.g., plus polarity MARK to minus
polarity MARK may be achieved by inverting the cable pair).
EIA-530 interface transmitter and receiver parameters applicable to the
MVME162 are listed in Tables A-5 and A-6.

A-6 User’s Manual


EIA-530 Connections
A

Table A-5. EIA-530 Interface Transmitter Characteristics


Value
Parameter Unit
Minimum Maximum

Differential output voltage (absolute, with 100Ω 2.0 V


load)
Open circuit differential voltage output (absolute) 6.0 V
Output offset voltage (with 100Ω load) 3.0 V
Short circuit output current (for any voltage between ±180 mA
-7V and +7V)
Power off output current (for any voltage between ±100 µA
-7V and +7V)
Output transition time (with 100Ω, 15pF load) 15 ns

Table A-6. EIA-530 Interface Receiver Characteristics


Value
Parameter Unit
Minimum Maximum

Differential input voltage ±12 V


Input offset voltage ±12 V
Differential input high threshold voltage 200 mV
Differential input low threshold voltage -200 mV
Differential input hysteresis 50 mV
Input impedance (without termination resistors) 10 KΩ

MVME162/D2 A-7
Serial Interconnections
A

Proper Grounding
An important subject to consider is the use of ground pins. There are two pins
labeled GND. Pin 7 is the signal ground and must be connected to the distant
device to complete the circuit. Pin 1 is the chassis ground, but it must be used
with care. The chassis is connected to the power ground through the green
wire in the power cord and must be connected to be in compliance with the
electrical code.
The problem is that when units are connected to different electrical outlets,
there may be several volts of difference in ground potential. If pin 1 of each
device is interconnected with the others via cable, several amperes of current
could result. This condition may not only be dangerous for the small wires in
a typical cable, but may also produce electrical noise that causes errors in data
transmission. That is why Tables A-1 and A-4 show no connection for pin 1.
Normally, pin 7 (signal ground) should only be connected to the chassis ground
at one point; if several terminals are used with one computer, the logical place
for that point is at the computer. The terminals should not have a connection
between the logic ground return and the chassis.

A-8 User’s Manual


Index

When using this index, keep in mind that a page number indicates only where
referenced material begins. It may extend to the page or pages following the page
referenced.

Numerics E
162Bug package 1-8 EIA-232-D
interconnections A-1
B SIM part numbers 2-4
backplane jumpers 2-10 EIA-530
battery interconnections A-4
backup 4-2 interface characteristics 4-7, A-6
precautions 4-4 signals A-4
BBRAM 4-4 SIM part numbers 2-4
configuration area memory map 3-19 EPROM
binary number 1-12 size selection 2-7
board socket 1-2, 1-7, 4-2
configuration 2-1 EPROM/Flash selection 2-8
layout 2-2 Ethernet
placement 2-10 address 4-8
serial number 3-21 interface 1-2, 1-8, 4-8
bus arbitration 4-1 Ethernet transceiver
bus priority levels 4-1 interface 2-13
power 2-13
C
configuration area 3-21 F
control/status register 2-12 FCC compliance 1-5
cooling requirements 1-4 features 1-2, 1-6
firmware 1-8
D Flash memory 1-2, 1-7, 2-8, 4-2
data circuit-terminating equipment floating-point coprocessor 1-6, 4-2
(DCE) A-1, 4-6 front panel controls 3-1
data terminal equipment (DTE) A-1, 4-6 fuses 2-13
debugging firmware 1-8
decimal number 1-12
DRAM
base address 2-12
options 4-4

MVME162LX/D1IN-1
Index

G memory maps 3-3


GCSR board control register 3-25 53C710 SCSI 3-16
general-purpose readable jumpers (J11) 82596CA Ethernet LAN 3-15
2-8 BBRAM configuration area 3-19
global bus timeout 2-12 IPIC control/status 3-18
IPIC overall 3-17
H local bus 3-4
hardware interrupts 4-10 local I/O devices 3-5
hardware preparation 2-1 MCchip registers 3-14
hexadecimal character 1-12 MK48T08 BBRAM/TOD clock 3-19
high-temperature operation 1-4 TOD clock 3-20
Z85230 SCC registers 3-15
I memory options 1-2
I/O MK48T08 RAM/clock chip 4-4
connections 1-6 model designations 1-1
interfaces 4-5
IndustryPack N
installation 2-9 normal address range 3-3
interface 1-2, 1-8 NVRAM 4-4
installation considerations 2-12
interconnections, serial A-1, A-4 O
interrupts 4-10 options 1-2, 1-6, 1-8
IPIC DRAM 4-4
interface 4-8
P
L P2 adapter board 4-9
LAN part numbers, SIM 2-2, 2-4
interface 1-8, 4-8 port B configuration 2-2
LAN FIFO buffer 4-12 publications 1-10
LCP2 adapter board 4-9
local bus memory map 3-3, 3-4 R
local bus priority levels 4-1 receivers, EIA-232-D A-4
local data bus 4-1 receivers, EIA-530 A-7
Local I/O Devices memory map 3-5 remote panel interface 2-13
local reset (LRST) 3-1 remote status and control 4-12
required equipment 1-8
I M RESET switch 3-25
N manual terminology 1-12 resetting the system 3-1, 3-25
D MCchip 1-7, 2-8, 4-3 RF emissions 1-5
E memory base addresses 4-11
X

IN-2 User’s Manual


S V
SCSI VMEbus
FIFO buffer 4-11 address/data configurations 2-12
interface 1-2, 1-8, 4-9 interface 1-2, 1-7, 4-5
termination 4-9 system controller functions 4-5
terminator power 2-13 VMEchip2 1-7
serial communications interface 4-5
serial interface modules (SIMs) 2-2 W
part numbers 2-4 watchdog timers 4-10
port B configuration 4-6
selection 2-2
serial interface parameters A-3
serial interface signals A-1
serial ports 1-2, 1-6, 1-9, 2-2, A-1
SIM selection 2-2
software 1-9
specifications 1-3
SRAM
backup 4-2
backup power selection 2-7
support information 1-11
synchronous
clock selection 2-6, 4-6
communications 2-6, 4-6
system controller 2-10
system controller selection (J1) 2-5
system reset (SRST) 3-1, 3-25

T
tick timers 4-9
Time of Day clock 1-2
timeout functions 4-10
timers 1-2
TOD clock memory map 3-20
transition modules 1-6, 1-9, 2-13, 4-6
installation 2-10 I
serial I/O connectors 4-6 N
transmitters, EIA-232-D A-3 D
transmitters, EIA-530 A-7 E
U X
user-definable jumpers 2-8

MVME162LX/D1 IN-3
Index

I
N
D
E
X

IN-4 User’s Manual


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