GoPV-SummerSchool Session2 EPFL 2
GoPV-SummerSchool Session2 EPFL 2
(11:30-12:30)
PV Modules: Market Trends, Materials &
Manufacturing Processes
Session Contents
1. PV Module Fabrication Steps
2. PV Technology Market and Costs
3. Crystalline Silicon Solar Cells
4. Solar Cell Interconnections
5. Lamination Process & PV Module Materials
6. Some Degradation Mechanisms
7. Manufacturing of Reliable Silicon Heterojunction Glass/Glass Modules
GoPV Project | SUMMER SCHOOL
PV SYSTEMS TECHNOLOGIES AND DESIGN
1. PV Module Fabrication Steps
R&D stages
Concentrator PV Other
Perovskites technologies
Failed market
entrance (+ tandems) Organic, DSSC,
quantum dots…
Wafer based (bulk semiconductor) • Deposition on large area substrate • Grown epitaxially on crystalline wafers
• Processing of wafers • “Monolithic series integration” of • Developed for space applications → very costly
• Series connection of individual solar the cells • Used in concentrated PV (CPV)
cells GoPV Project | SUMMER SCHOOL
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PV SYSTEMS TECHNOLOGIES AND DESIGN
2. PV Technology Market and Costs
(n) c-Si
𝐩𝐩-𝐧𝐧 junction
c-Sic-Si
(p)
i/p a-Si:H
(p) c-Si
BSF High Temperature Process
SiO2 or Al2O3
Al
High Temperature Passivating Contact
SiNx
(HTPC)
Front metal grid
ARC (SiNx)
SiOx
n+ emitter
SiOx
n+ emitter
(p) c-Si
i/p a-Si:H
i/p a-Si:H
(n) c-Si
i/n a-Si:H
Advantages:
• Better passivation
• ↓ Processing temperature
• ↓ Thickness, ↓ cost
• ↑ Open-circuit voltage (VOC)
Aluminium Back Surface Field Challenges: • ↓ Temperature coefficient
(Al-BSF) • Optical losses → reflection of
Front metal grid photons at rear surface Challenges:
ARC (SiNx)
SiOx
• Recombination losses → at • Need of ECA for soldering
n+ emitter metallic contact • ↓ adhesion fingers/TCO
(p) c-Si • Ohmic losses → high series
resistance at interfaces GoPV Project | SUMMER SCHOOL
Al
BSF 11
PV SYSTEMS TECHNOLOGIES AND DESIGN
(p) c-Si
(n) c-Si Novel solar cell concepts promote the
BSF
i/n a-Si:H development of bifacial technology
SiO2 or Al2O3
Al GoPV Project | SUMMER SCHOOL
SiNx 12
Rear TCO Rear metal grid PV SYSTEMS TECHNOLOGIES AND DESIGN
1. PV Module Fabrication Steps
Frame
Glass
Encapsulant
Encapsulant
Backsheet
Junction Box
Cell interconnections
Commercial c-Si modules have 60/72
series-connected solar cells
A. Shah, Solar cells and modules (2020) GoPV Project | SUMMER SCHOOL
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Chapter 9, A. Virtuani PV SYSTEMS TECHNOLOGIES AND DESIGN
4. Solar Cell Interconnections
Busbar technology
ITRPV (2022)
Advantages:
• More aesthetically appealing.
• Ideal candidate for Building Integrated PV (BIPV)
Challenges:
Y. Lee et al., Israel Journal of Chemistry (2015)
• Cost GoPV Project | SUMMER SCHOOL
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PV SYSTEMS TECHNOLOGIES AND DESIGN
4. Solar Cell Interconnections
Challenges:
• Use of more silver.
• More expensive.
• Need to adapt stringers in commercial manufacturing processes.
Frame
Glass
Encapsulant
Encapsulant
Backsheet
Junction Box
Lamination parameters:
• Temperature (T)
• Pressure (P)
• Time (t)
• Poor lamination process → occurrence of failure modes in the field (e.g. delamination).
*In a good laminator the temperature uniformity of the heating plate is well controlled below ≤ 2°C.
GoPV Project | SUMMER SCHOOL
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PV SYSTEMS TECHNOLOGIES AND DESIGN
5. Lamination Process & PV Module Materials
1. Pre-heating step (100s to 500s) → the upper and the
lower chambers are evacuated.
• Removal of the air (de-gas) to minimize the risk
of voids formation.
The softening encapsulant temperature (60-70 °C) is
reached.
Open the Black Box: Understanding the Encapsulation Process of Photovoltaic Modules, 2013
5. Lamination Process & PV Module Materials
Module structure
«Sandwich» or module stack: Fragile silicon solar cells need to be protected in
order to operate outdoors for 25 years (at least).
Encapsulant
Encapsulant
1.50 100
3.2 mm glass
Front Glass
1.25 80
Transmittance (%)
Irradiance (W/m2)
1.00 60
Encapsulant
0.75
Stringed cells 40
0.50
Encapsulant Xenon lamp 20
0.25
0.00 0
Backsheet or Rear glass
300 320 340 360 380 400
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Wavelength (nm) 26
PV SYSTEMS TECHNOLOGIES AND DESIGN
5. Lamination Process & PV Module Materials
Encapsulant
Main functions:
• Provide adhesion between components (cells-front glass, cells-
backsheet, front glass-backsheet).
Front Glass
ITRPV (2022)
International Technology Roadmap for Photovoltaic – ITRPV 2018 and G. Oreski, “Encapsulant Innovations for replacement of EVA”, EUPVSEC 2019.
5. Lamination Process & PV Module Materials
Polymeric Backsheet
Most PV modules → composite polymer sheet as backsheet.
• Multi-stack structure of three layers with an overall thickness of 280-400 µm.
T-P-T backsheet
PVF (polyvinyl-fluoride) - Tedlar®
Front Glass → protects the internal circuit
(and PET layer) from weathering
agents
Encapsulant
PET (Polyethylene terephthalate)
Stringed cells → isolates the module
electrically and provides
Encapsulant
mechanical stability.
A. Shah, Solar cells and modules (2020) GoPV Project | SUMMER SCHOOL
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Chapter 9, A. Virtuani PV SYSTEMS TECHNOLOGIES AND DESIGN
5. Lamination Process & PV Module Materials
0%
2021 2022 2024 2026 2029 2032
ITRPV (2022)
G-BS G-G
H2 O H2 O
AA
others
H2O, O2,
AA &
pollutants
Breathable
Back-sheet & others
UV radiation
Metal ions
G-BS
Multiple interactions between different components and outdoor stresses may lead to unwanted degradation reactions.
GoPV Project | SUMMER SCHOOL
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PV SYSTEMS TECHNOLOGIES AND DESIGN
6. Some Degradation Mechanisms
EVA degradation mechanism
• Temperature, UV radiation and humidity ⇒ acetic acid generation.
Sensitivity to Prevention
Impermeable module structure →
Water ingress & diffusion
edge sealant (ES)
High voltages – Potential High-volume resistivity encapsulants →
Induced Degradation (PID) POEs, ionomer
Non UV-transparent encapsulants or
UV exposure
with cut-off > 353 nm
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