PCB DESIGN PROCESS

WHAT IS PCB?
• Printed Circuit Board
• It is a thick board circuit that
allows electrical components
to rest on it with electrical
connections with other
components.
WHY USE OF PCB?
• Compact Size and Saving of Wire
WHY USE OF PCB?
• Easy to Repair and Diagnosis
• Firm connections
• Less Electric Noise
• Reliable
• Can work for years
TYPES OF PCB

• Single Sided PCB

TYPES OF PCB

• Double Sided PCB

TYPES OF PCB

• Multilayer PCB
PCB LAYERS
Silkscreen Layer - The silkscreen layer is a non-conductive layer that is used to print
markings onto the PCB. These markings can include component identifiers,
reference designators, and other important information.
Soldermask Layer - The solder mask layer is a non-conductive layer that is used to
protect the copper traces from oxidation and solder bridges. Solder bridges are
small unintentional connections between two or more copper traces.
Copper Layer - The copper layer is the conductive layer that is used to connect the
different components on the PCB together
Core Layer - The core layer is a non-conductive layer that is used to insulate the
copper layers from each other. The core layer is typically made of fiberglass or other
insulating material.
 PCB DESIGN PROCESS

• Printed circuit boards (PCBs) are the building blocks of modern

electronic devices. They provide the physical structure and electrical
connections for electronic components, allowing them to function as a
cohesive system. The design of PCBs is a complex and intricate process
that requires careful consideration of various factors to ensure the
proper functioning and reliability of the electronic device.
PCB DESIGN PROCESS STAGES

1. Selecting the Components

2. Drawing the Schematic
3. Laying Out the Board
4. Preparing for Manufacturing
1. SELECTING THE COMPONENTS

• The first stage of the PCB design process is arguably also the most important.
Your choice of components directly affects the board layout, manufacturing,
circuit performance, and reliability. With the many choices of parts available,
and the supply chain challenges such as delays, obsolescence, and
counterfeits, it is imperative that you follow best practices for sourcing and
proofing the component models used for your design.
2. DRAWING THE SCHEMATIC

• The complexity of the schematic is directly proportional to that of your design.

Often, a good schematic can consist of a single well-organized page that
includes the circuit drawing, references, and pertinent information, like the title
block that identifies when the schematic was created and reviewed and by
whom.
3. LAYING OUT THE BOARD

• Set up the constraints for your PCB layout

• Can be divided into four stages:
a. Specifying Your PCB
• This stage of laying out your board is where you specify
physical attributes and dimensions.
3. LAYING OUT THE BOARD

b. Placing Components
Consider component clearance, spacing, and board edge clearance.
3. LAYING OUT THE BOARD

c. Routing Traces
Although traces connect your board’s components, the process is quite
different from creating the nets. In fact, the nets are typically used to create
ratlines (guidelines that show what the interconnections should be) which are
helpful for manually routing your board. Fortunately, most PCB design tools
include some type of auto-routing. It does not eliminate all manual routing but
can save significant time at this stage.
3. LAYING OUT THE BOARD

d. Proofing the PCB Layout

Once the board is laid out, it must be proofed as well. The most
significant testing is for DFM, DFA, and other constraint compliance. This is known
as design rule checking and virtually all design tools include a checker that
performs this vital evaluation.
4. PREPARING FOR MANUFACTURING

• The last stage of PCB design processing is to compile all data, information,
and imagery that is needed by your CM to build your board. It must reflect
your design intent, and meet your performance objectives. These are
encapsulated in the bill of materials (BOM), which provides data and
information about the components selected, and the design file(s) that include
the schematic drawing, netlist, drilling requirements, board layout, and all
other important text and imagery to be used for the board build.
PCB DESIGN ISSUES
Some of the most common PCB design issues include:
1. Signal Integrity
2. Noise
3. Electromagnetic Interference (EMI)
4. Thermal Management
5. Manufacturability
SIGNAL INTEGRITY

• Signal integrity refers to the ability of a signal to travel from one point on the
PCB to another without distortion or interference. Poor signal integrity can
lead to data errors, noise, and other performance problems.
NOISE

• Noise is unwanted electrical signals that can interfere with the desired signals
on the PCB. Noise can be caused by various factors, such as crosstalk between
traces, ground bounce, and power supply noise.
ELECTROMAGNETIC INTERFERENCE (EMI)

• EMI is the emission of electromagnetic waves from the PCB that can interfere
with other electronic devices. Proper shielding and grounding techniques are
essential to minimize EMI.
THERMAL MANAGEMENT

• Heat dissipation is a critical consideration for PCBs with high-power

components. Proper heat sinking and airflow are necessary to prevent
overheating and component damage.
MANUFACTURABILITY

• ThePCB design should be manufacturable within the constraints of the PCB

manufacturer's capabilities. This includes factors such as trace width and
spacing, minimum via size, and board size limitations.
PCB ETCHING
 WHAT IS PCB ETCHING?
• PCB etching is the chemical process of removing copper from a copper-clad
board to create circuit patterns. The etching process involves applying an
etchant solution to the board, which selectively dissolves the exposed copper
while leaving the protected areas intact.
TYPES OF PCB ETCHANTS
• Ferric Chloride
Ferric chloride is one of the most commonly used etchants in PCB
fabrication.
• Ammonium Persulfate
Ammonium persulfate is an alternative to ferric chloride, offering
faster etching speeds and a longer shelf life.
• Sodium Persulfate
Sodium persulfate is another popular etchant, known for its versatility
and low cost. It offers a fast etching rate, making it ideal for large-
scale PCB production.
TYPES OF PCB ETCHANTS
• Cupric Chloride
Cupric chloride is known for its fast etching capabilities. It offers high
etch rates, making it suitable for large production runs.
• Hydrogen Peroxide
Hydrogen peroxide-based etchants are eco-friendly alternatives to
traditional etchants. They are less aggressive but still effective for
etching PCBs.
CHOOSING THE RIGHT PCB ETCHANT
When selecting a PCB etchant, consider the following
factors:

Etching speed
Safety precautions
Environmental impact
Cost
 COMMON ETCHING ISSUES
• Under Etching
•
Under etching occurs when the etchant does not remove enough
copper, leading to incomplete circuit patterns. To avoid under
etching, ensure sufficient etching time and agitation of the solution.
Check the concentration of the etchant as well. If the etching is
insufficient and the desired traces are not fully formed, consider
increasing the etching time, temperature, or using a more
concentrated etchant solution.
 COMMON ETCHING ISSUES
Over Etching
•
Over etching occurs when the etching process continues beyond the
desired point, resulting in the removal of excess copper. To avoid
over etching, carefully monitor the process and promptly remove the
PCB from the etchant solution once the desired traces are achieved.
 COMMON ETCHING ISSUES
Uneven Etching

Uneven etching may occur due to factors such as poor agitation or

temperature fluctuations. Ensure proper agitation of the etchant
solution and maintain a consistent temperature throughout the
etching process for uniform results.