SEC 306 PCB
SEC 306 PCB
41 Computer Aided
PCB Design
NOTE: The Aspect Ratio is the ratio of the Thickness of the Hole (or Depth) to be plated to
the Diameter of the Hole. If the aspect ratio is too large (i.e., deep & skinny holes), then the
copper plating will not reach the center of the hole and result in an open circuit.
PCB fab shops will specify the maximum aspect ratio they can achieve (typically ~4-6)
PCB: Pattern Plating
the copper deposited from the Electroless Plating step applies a thin layer of
copper on the entire surface of the CORE in addition to inside the drilled via
holes.
- the plating in the via barrels is typically not thick enough (i.e., <0.001") to
be reliable. To address this, a second Electrochemical plating is performed.
- pattern plating deposits a material over the copper circuitry that will
protect it during a subsequent etch stage. A material such as tin can be
used to cover the copper traces to protect them.
- - the copper is first thickened using an additional Electrochemical plating
process. - once applied, the tin is deposited on the pattern.
- - after the etch, the tin can be stripped off or left on depending on the
manufacturer.
PCB: Solder Mask
solder mask is a protective insulating layer that goes over the outer sides of the PCB. NOTE: this is typically the green material you see
on boards.
- copper is very susceptible to oxidation so if the pattern is going to be exposed to ambient air, they need to receive additional
plating to protect against oxidation.
- - oxidation is the reaction of oxygen with the copper. During this process, the copper is actually consumed. So a thin layer of
copper can actually be completely oxidized into an insulator.
- - solder mask is a layer of polymer that can be applied using either silk screening or a spray.
- - the solder mask covers all conducting circuits on the board with the exception of any pads that components will connect to.