GE3271 - ENGINEERING PRACTICES LABORATORY (ELECTRONICS) [ R2021 ]

Loyola - ICAM
College of Engineering and Technology (LICET)
Loyola Campus, Nungambakkam, Chennai -600034
Tamil Nadu, India

Approved by AICTE and

Affiliated to Anna University, Chennai
A Christian Minority Institution
ISO 9001:2008 Certified Institution
All the departments are NBA Accredited

RECORD NOTE BOOK

Name of the Student :

Reg. No. :
Department : Mechanical Engineering
Year / Sem. : I / II
Subject Code : GE3271
Subject Name : Engineering Practices Laboratory (Electronics)

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Loyola - ICAM
College of Engineering and Technology (LICET)
Loyola Campus, Nungambakkam, Chennai -600034
Tamil Nadu, India

Certificate
Name : ___________________________
Register Number : ___________________________
Certified that this is a bonafide record of work done by the candidate in the

II Semester of B.E Mechnaical Engineering in the - Engineering Practices Laboratory

(Electronics) Laboratory during the year 2024.

Lab In-Charge Head of the Department

This record is submitted for Anna University Practical Examination held on

________________________________

Internal Examiner External Examiner

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General Instructions to students for Lab courses

 Be punctual to the lab class.

 Attend the laboratory classes wearing the prescribed uniform and shoes.
 Avoid wearing any metallic rings, straps or bangles as they are likely to prove dangerous at
times.
 Girls should put their plait inside their overcoat.
 Boys students should tuck in their uniform to avoid the loose cloth getting into contact with
rotating machines.
 Acquire a good knowledge of the surrounding of your worktable. Know where the various
live points are situated in your table.
 In case of any unwanted things happening, immediately switch off the mains in the
worktable.
 This must be done when there is a power break during the experiment being carried out.
 Before entering into the lab class, you must be well prepared for the experiment that you
are going to do on that day.
 Get the circuit diagram/experiment approved before commencing the lab exercise
 Prepare the list of equipments and components required for the experiment and get the
indent approved.
 Plan well the disposition of the various equipments on the worktable so that the experiment
can be carried out.
 Get the reading verified. Then inform the technician so that supply to the worktable can be
switched off.
 You must get the record note book corrected within two days from the date of completion of
experiment.
 If you miss any practical class due to unavoidable reasons, intimate the staff in charge and
do the missed experiment in the repetition class.
 Students without a minimum of 75% attendance in the laboratory class will run the risk of
not being allowed for the University Practical Examination. They will have to repeat the lab
course in subsequent semester after paying prescribed fee.

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Vision of the Institute

To form responsible engineers, who would engineer a just society.

Mission of the Institute

 To provide technical education in a Christian atmosphere to the deserving students who are
economically poor and socially marginalized.
 To train young men and women of quality, to be leaders in all walks of life and serve their
fellowmen with justice, truth and love.
 To implement teaching learning processes that ensures guidance and mentoring for
students throughout their period of study.
 To provide higher education through academic collaboration and pursue research in
international perspective of engineering.

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SYLLABUS

GE3271 ENGINEERING PRACTICES LABORATORY LTPC

00 42
COURSE OBJECTIVES:
The main learning objective of this course is to provide hands on training to the students in:
Soldering and testing simple electronic circuits; Assembling and testing simple electronic components on
PCB
PART IV ELECTRONIC ENGINEERING PRACTICES 15 PERIODS
SOLDERING WORK:
a) Soldering simple electronic circuits and checking continuity
ELECTRONIC ASSEMBLY AND TESTING WORK:
a) Assembling and testing electronic components on a small PCB
ELECTRONIC EQUIPMENT STUDY:
a) Study on elements of smart phone
b) Assembly and dismantle of LED TV
c) Assembly and dismantle of computer/ laptop
COURSE OUTCOMES:
Upon completion of this course, the students will be able to:
Solder and test simple electronic circuits; Assemble and test simple electronic components on PCB.
CONTENT BEYOND SYLLABUS – Generation of Clock Signal

S.No. Course Objectives Course Learning Outcomes

1 Soldering and testing simple electronic Able to Solder and test simple electronic
circuits circuits
2 Assembling and testing simple electronic Able to Assemble and test simple electronic
components on PCB components on PCB
3 Practicing dismantling and assembly of Able to dismantle and assemble electronic
electronic equipment equipment and explore the components
along with interconnections

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INDEX
S.
Date Name of the Experiment Marks Signature
No.
1.
2.
3.
4.
5.
6.

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Electronic Components

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Types of Resistors

Resistor Color Code Table

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Types of Capacitor

Value of Ceramic Capacitor

Transistor Pinouts IC Pin Identification

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SOLDERING WORK

(Soldering simple electronic circuits and checking continuity)

Ex.No.
Date:
AIM:
To practice soldering of plates and wires and to assemble electronic components on a PCB and test it.
TOOLS REQUIRED:
1. Soldering iron
2. Solder and
3. Flux
COMPONENTS REQUIRED:
1. PCB and
2. Electronic Components
THEORY:
Soldering:
Soldering is the process of joining thin metal plates or wires made of steel, copper or brass. It is very
commonly used to join wires in electrical work and mount electronic components on a circuit board. The
joining material used in soldering is called as solder or filler rod. An alloy of tin and lead is commonly used
as the solder. The flux is used to clean the surface of the plates/wires to be soldered. Aluminium chloride or
zinc chloride is commonly used as flux. A good soldering iron is a variable temperature setting type with
interchangeable irons and tips. The tip should be removed regularly to prevent oxidation scale from
accumulating between the heating element and the tip.
Soldering Simple Electronic Components:
A printed circuit board (PCB) consists of copper strips and pads bonded to a plastic board. The copper strip
is the network of interconnecting conductive path. Leads of components mounted on the board are inserted
through holes on the board and the conductive copper. These leads are soldered to the copper at the end of
the hole. If excessive heat is applied to copper, it may get lifted from the board or the components on the
board get damaged. Soldering pencil gun of about 30 Watts is used to heat the junction. The surface of
copper bonded to the board should be properly prepared and cleaned before soldering. Flux is applied on
circuits and component leads. Check the conductive strips and pads on the board before soldering. Avoid
excess solder to prevent two copper paths from bridging. When solder globules form on the junction area,
remove them by cleaning the soldering tip using a cloth.
Checking Continuity:
The continuity of a wire conductor without a break has practically zero ohms of resistance. Therefore, an
ohmmeter may be used to test continuity. To test continuity, select the lowest ohm range. A wire may have
an internal break, which is not visible due to insulation, or the wire may have a bad connection at the
terminals. Checking for zero ohms between any two points tests the continuity. A break in the conducting
path is evident from the reading of infinite resistance. In a cable of wires, individual wires are identified with

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colours. Consider the figure, where the individual wires are not seen, but you wish to find the wire that
connects to terminal A. This is done by, checking continuity of each wire to terminal A. The wire that has zero
ohms is the one connected to this terminal. Continuity of a long cable may be tested by temporarily short-
circuiting the other ends of the wires. The continuity of both wires may be checked for zero ohms. In a digital
multimeter, a beep mode is available to check continuity. The connectivity between the terminals is identified
by the beep sound.
Component Lead Preparation:
Components such as capacitors have leads and are bent carefully to mount on PCB. The lead bending radius
should be approximately two times the diameter of the lead. The bent leads should fit into the holes
perpendicular to the board, so that the stress on the component lead junction is minimized. Suitable bending
tools may be used for perfect bending. Leads are bent and assembled on board in such a way that the polarity
symbols are seen after mounting the component.
Component Mounting:
Components are mounted on one side of the board and leads are soldered on the other side of the board.
The components are oriented both horizontally and vertically but uniformity in reading directions must be
maintained. The uniformity in orientation of diodes, capacitors, transistors, IC’s etc. is determined at the time
of PCB design. Components dissipating more heat should be separated from the board surface.
Manual Assembly of Components:
The components to be assembled on a PCB are arranged conveniently. The board to be assembled is held
in a suitable frame and the components are kept in trays or bins. The insertion tools, if required, must be kept
in the easy reach of the worker. The work is divided depending on the number of parts to be assembled and
the size of each part.
Inspection and Testing:
The components assembled on the PCB are tested before they are soldered to the board. It is a common
practice to have the assembled boards checked prior to soldering. An assembly inspector is located at the
end of the assembly line for inspection. The inspection includes verifying component polarity, orientation,
value and physical mounting.
Soldering and Lead Cutting:
The components are soldered on the PCB. The excess lead is cut after soldering. The performance and
reliability of the solder joints are best if lead cutting is carried before soldering so that the lead end gets
protected. However, this is not practiced in hand soldering.
PCB Cleaning:
The soldered PCB may have contaminants that could cause trouble during the functioning of the circuit. The
contaminants include flux and chips of plastics, metals, and other materials. Hence, the PCB must be cleaned
before use. A wide range of cleaning media is available; usually chemicals such as acetone and alcohols are
used.

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PROCEDURE:
 The surface to be soldered is cleaned and flux applied.
 The soldering iron is heated to the required temperature.
 The soldering iron melts the solder rod and a thin film of solder spreads over the surface to join the
plates/wires.
 The electronic components are carefully assembled as per the circuit design. The assembling of
electronic components on a PCB involves the following steps.
CIRCUIT DIAGRAM:

VIVA QUESTIONS:
1. List the essential components / tools in a soldering kit.

2. Mention the purpose of desolder-wick/pump.

3. What is soldering flux? Enumerate its uses.

RESULT:
The electronic components are soldered and continuity of a circuit or wire is checked. The electronic
components are assembled on PCB and are tested.
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ELECTRONIC ASSEMBLY AND TESTING WORK

(Assembling and testing electronic components on a small PCB)

Ex.No.
Date:

AIM:
To assemble a full-wave rectifier with capacitor filter on a Printed Circuit Board (PCB) and test its
working.
TOOLS REQUIRED:
1. Soldering iron
2. Solder and
3. Flux
APPARATUS REQUIRED:

S.No Components Range Quantity

1 Diode IN4007 2
2 Transformer 230/(12-0-12)V 1

3 Resistance 1K Ohm 1

4 Capacitance 100 Microfarad 1

5 CRO 1

6 Breadboard & PCB Each 1

7 Connecting Wires As Required

THEORY:
The process of converting AC voltage and current to Direct current is called rectification. An electronic
device that offers a low resistance to current in one direction and a high resistance in the other direction
is capable of converting a sinusoidal waveform into a unidirectional waveform. Diodes have this
characteristic, which makes it a useful component in the design of rectifiers. In order to achieve a
constant/pure DC voltage at the output, filtering should be done to the pulsating DC output of the rectifier.
The output varies with the variation in AC mains. Hence a voltage regulator is used to maintain the
output voltage at the same value. Diodes are used in a rectifier circuit to convert AC into DC. When both
the half cycles are rectified, it is known as full-wave rectification.
PROCEDURE:
1. The components are soldered on the PCB as per the given circuit diagram
2. Connect the half wave rectifier with filter circuit as shown
3. Connect CRO across load
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4. Keep the CRO switch in ground mode and observe the horizontal line and adjust it to the X-axis
5. Switch the CRO into DC mode and observe the waveform
CIRCUIT DIAGRAM:

MODEL GRAPH:

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VIVA QUESTIONS:
1. Differentiate Half-wave and Full-wave rectification.

2. Write a short note on a Cathode Ray Oscilloscope.

3. List the operational features of a multimeter.

4. Write down the color band values of the following resistors - 47 Kohm with 10% tolerance,
15 Kohm with 5% tolerance and 68 ohm with 10% tolerance.

RESULT:
The circuit is soldered and the continuity of a circuit or wire checked. The electronic circuit of the full
wave rectifier is assembled on PCB and tested.

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ELECTRONIC EQUIPMENT STUDY

(Study on elements of smart phone)

Ex.No.
Date:
AIM:
To study about the elements of a smartphone and to explore the components and its functioning.
TOOLS REQUIRED:
Magnifying lens.
EQUIPMENT REQUIRED:
A Smart Phone
THEORY:
There are a lot of factors to keep in mind while buying a smartphone. Display, Battery Life, Fast
Charging, Speakers, Cameras, and Design of the phone matters. However, picking the right smartphone
has become more complex than ever due to the saturated market. However, apart from the outer factors,
the inner components also matter and may help you make a better purchase decision.
1. Display:
There are many display types used in smartphones: LCD, OLED, AMOLED, Super AMOLED, TFT,
IPS and a few others that are less frequently found on smartphones nowadays, like TFTLCD. One
of the most frequently found on mid-to-high range phones now is IPS-LCD. In short, there are two
kinds of technologies available in the market for smartphone displays: LCD and OLED. Each of them
has several variations and generations, which gives rise to more acronyms, similar to televisions
and their different ranges such as LED, QLED, miniLED - which are all actually variations of LCD
technology.
2. Battery
Batteries of phones typically use lithium-ion technology that is either removable or non-removable
in mobile devices. With these batteries, which are an essential component of a smartphone, you will
not have to worry about ‘calibration’ or ‘testing’ issues that were plagued with nickel-based cells.
Still, this does not mean that current-generation batteries are not filled with their issues, and users
have to be very careful when handling and using volatile components like these.
3. System-on-a-chip or SoC
The SoC is perhaps the most essential component present in a smartphone, and some users might
confuse it as the device’s processor. However, it is far more than that; the SoC not only comprises
the smartphone’s CPU, but GPU, LTE modem, display processor, video processor, and other bits of
silicon that turn it into a functional ‘system’ in a phone. While you might see phones touting different
SoCs from Qualcomm, MediaTek, Samsung, Huawei’s own Kirin, and Apple’s own developed
chipsets, they are using the same system architecture from ARM. ARM functions by producing their
own processors and GPUs and licensing their design and system architecture to other companies
so they can use their technology to make powerful and efficient SoCs.

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Fig: Exploded view of smartphone

4. Memory and storage
No smartphone can function without RAM and memory (system storage). First, let’s talk about RAM.
Most mobile devices of today ship with LPDDR4X RAM, while some high-end smartphones ship with
LPDDR5 RAM. ‘LP’ stands for ‘Low-Power,’ reducing the total voltage of these chips, making them
highly efficient, and giving mobile phones extended battery life.
LPDDR4X is more efficient and powerful than LPDDR4, while LPDDR5 is the holy grail of RAM,
resulting in unprecedented speeds and efficiency. LPDDR5 is more expensive to produce, though,
which is why you only see them in flagship smartphones. When newer generations of RAM such as
LPDDR6 are introduced, you will see the flourishing of LPDDR5 memory in midranged devices.
As for internal storage, it exists as flash memory, ranging from 32GB, and can go all the way up to
256GB on some phones. Naturally, as users’ requirements rapidly increase based on the amount of
storage that they use, phone manufacturers will exponentially increase the amount of RAM present
in smartphones. When you fire up your device for the very first time, one thing that you’ll notice is
that the advertised storage is not the same value as running on the phone.
5. Modems
Since smartphones are just phones at the end of the day, they need communication components to
receive and send text messages and calls. That’s where modems come in, and every SoC
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manufacturer has their own brand of modems, including Qualcomm, Samsung, Huawei, and several
others.
These manufacturers are also battling it out to release the fastest and most efficient category of LTE
chips, so if you have come across the term Cat. 9 LTE modem that is the fastest one out there.
However, if your cellular network does not support those levels of speeds, then there’s absolutely
no point in having such powerful chips present in smartphones.
6. Camera
All smartphones come with a rear-facing and front-shooting camera. A smartphone comprises of
three main parts:
 The sensor (which detects light)
 The lens (the component in which light comes through)
 The image processor
While the megapixels on the smartphone are still an essential part of the camera, it carries less
importance than they did a while back. Instead, the primary limiting factor is the phone’s camera
sensor and how sensitive it is when light passes through the lens.Each sensor behaves very
differently in different smartphones, so every image or video you capture will vary in contrast, color
accuracy, saturation, and several others compared to a different handset. Most camera apps have
manual settings to capture an image or video based on your settings, but most devices don’t have
such an extended list of controls.
7. Sensor
There are five primary sensors in a smartphone that allow it to give you the functionality of a ‘touch-
enabled smart device.’ The names of all these sensors and their importance have been detailed
below:
Accelerometer: Used by apps to detect the orientation of the device and its movements, as well as
allow features like shaking the phone to change music.
Gyroscope: Works with the Accelerometer to detect the rotation of your phone, for features like tilting
phone to play racing games or to watch a movie.
Digital Compass: Helps the phone to find the North direction, for map/navigation purposes.
Ambient Light Sensor: This sensor is automatically able to set the screen brightness based on the
surrounding light, and helps conserve battery life. This would also explain why your smartphone’s
brightness is reduced in low-light environments, so it helps to reduce the strain on your eyes.
Proximity Sensor: During a call, if the device is brought near your ears, it automatically locks the
screen to prevent unwanted touch commands.

VIVA QUESTIONS:
1. Write a note on AMOLED display?

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2. State the use of a proximity sensor?

3. What is a WLAN antenna?

4. What are the precautions to be taken to avoid smartphone burst?

RESULT:
The components of a smart phone were studied and their functionality was explored.

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ELECTRONIC EQUIPMENT STUDY

(Assembly and dismantle of LED TV)
Ex.No.
Date:

AIM:
To assemble and dismantle LED TV and to explore the components and its functioning.
TOOLS REQUIRED:
1. Screw Driver Set.
2. Spudger, Pry tools.
3. Multimeter.
EQUIPMENT REQUIRED:
A LED TV
THEORY:
The electronic system about to be explored is LED (Light Emitting Diode) Television. The most important
factor that helped televisions stay in the market is the upgrade in their technology. The evolution of
Televisions transition from CRT to LEDs, the LEDs being one of the most popular ones and used widely.
Components are like organs of the TV, and without the components, the TV is nothing but a box. To
better understand the functioning, one should be very well aware of the parts of a LED TV.

Fig.: Inside a LED TV

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Parts of LED TV

Fig: Parts of LED TV

Supply Board/SMPS Board

This board is the powerhouse of television. The power cable is connected to this component of the TV.
The AC power this board receives from the socket is converted to DC with the help of the switching
regulator, and that is because LED TVs run on DC power. And then that converted DC power is
transferred to the Logic/Motherboard.
Logic/Main/Mother Board
This board is basically the brain of the TV, as it does all the heavy lifting. The HDMI, i.e. the audio and
video ports and the RAM are connected to this board. And this is where the input received from the
cable or the set-top box is decoded and then amplified to finally get the output on the screen. In other
words, this board converts the analog audio and video signals into digital signals to show the result on
the screen. And that is why this is the most important and expensive component of the TV.
Infrared Rays(IR) Receiver
The infrared receiver has one basic function, which is to catch the IR signals that are sent from the TV
remote, like changing the channel or turning the volume up. After catching the signals, the IR receiver
converts them into digital signals to give the respective command to the Logic Board.
LED Screen
The LED screen is that part of the TV that is most familiar to all. But the structure of the screen is not
familiar. Basically, the structure of a LED Screen consists of the following components:

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Metal Frame:
The metal frame as the name suggests, is the frame, or the outer covering of the main screen. The size
of the metal frame depends on the size of the TV screen. The material and color of the frame may vary
with different TVs.
LED Panel:
The LED panel is the main screen of your TV, where the image is displayed. The structure of the LED
panel depends on the type of LED TV used.
Edge-Lit LEDs:
Edge-Lit LEDs usually have a line of LED lights spread around the corner of the LED panel. The LED
produces the light which is evenly distributed throughout the screen through the diffusion panel, which
is basically a layer of white sheets.
Direct LEDs Full Array:
In full-array LED TVs, the LED lights are systematically distributed at the back of the screen. Now, these
lights are independently controlled, resulting in better contrast ratio and clearer picture quality.
Principle of Image formation:
To create a bright colour image, the principles of additive colour mixing are used, whereby new colours
are created by mixing light in different colours. An LED display consists of red, green and blue LEDs
mounted in a fixed pattern. These three colours combine to form a pixel. By adjusting the intensity of
the diodes, billions of colours can be formed. When the LED screen is looked at from a certain distance,
the array of coloured pixels is seen as an image.
RGB is short for Red, Green and Blue. It is a colour scheme that exploits the fact that all visible colours
can be mixed from these three basic colours. It is used in almost all types of displays, including LED
displays.
In LED display technology, the SMD concept is used a little differently. An SMD display is an LED display
where the red, green and blue diodes are potted in a small plastic encapsulation which is surface
mounted on the printed circuit boards of the display. When the diodes are encapsulated in this way, they
take up a lot less space, making it possible to produce displays with less spacing between the diodes
and higher resolution.

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The structural design of a LED illuminated LCD TV can be divided into several layers as shown in the
following figure.

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PROCEDURE:
The following processes are used to dismantle or disassemble LED TVs or LCD Monitors.
1. Turn off the TV and unplug it.
2. Remove screws from the back panel and open the top. (Keep a note of the size, shape and
placement of the screws).
3. In the Motherboard and SMPS board disconnect the wires before dismantling it from the bottom
layer of TV.
4. Unscrew the boards from the panels and organize the screws and boards properly for
reassembly.

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5. Open the case with spudger or pry tool. Also, remove the front bezel from display.
6. Now, examine the LED strips and their arrangement.
7. Reverse the dismantling procedure for assembly of LED TV in order.
8. Plug in and switch on for checking the proper functioning.

VIVA QUESTIONS:
1. Difference between LED and LCD TV?

2. What is LVDS cable? Why is it used?

3. Name the ICs used in SMPS and Motherboard.

4. What is an OLED display and Plasma display?

RESULT:
Thus a LED TV was dismantled and assembled. The components and functioning was explored.

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ELECTRONIC EQUIPMENT STUDY

(Assembly and dismantle of computer/ laptop)
Ex.No.
Date:

AIM:
To have an overview of generic disassembly of a laptop and to explore the various components found
within a typical laptop and ways of their replacement.
TOOLS REQUIRED:
1. ScrewDriver Set.
2. Spudger, pry tools.
3. Multimeter.
EQUIPMENT REQUIRED:
A Laptop
THEORY:
Laptop computers, or laptops, are portable computers that allow users to keep their data and
applications readily available as they travel between destinations. Portable computers run off AC power
or batteries such as NiMH, NiCad, or Li-ion packs, for several hours. Today, most laptop computers are
becoming thinner and lighter to help compete with other devices, such as tablets. Some laptops,
especially those with smaller form factors, may also be called notebook computers. Intel also sells a line
of ultra-thin laptops under the name Ultrabook.
Motherboard, CPU, Graphics card, Hard drive, Network card, Monitor, Number of Interfaces are major
components in laptop. Modern laptop include various ports such as USB port, Express card slot,
Thunderbolt port, HDMI port, Firewire, Memory card reader, VGA connector, External SATA
ports/interfaces.

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INSIDE A LAPTOP:

Fig: Laptop Interior parts

Fig: Laptop Motherboard

PARTS OF LAPTOP:
1. Display: It functions similar to monitor used in desktop PC. It is known as output device as it is
used to display output to the user in desired format. The types include LCD, LED, VGA, XVGA,
CCFL etc.

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The display panel can be touch screen type or non touch screen type. Touch screen allows users to
choose from different options by simple touch with their fingers on desired menu or icon displayed
on the screen.
2. Keyboard: The common types are QWERTY, QWERTZ, AZERTY and HCESAR. Various keys
found on keyboards include standard typewriter keys, function keys (F1, F2, F3, ..., F12) special
purpose keys (Ctrl, Del, Ins, Alt) , cursor movement keys, numeric keys.
3. Base Panel: The base panel provides installation place for laptop parts which include mother
board, RAM, hard drive, cooling fan, battery, CD drive etc.
4. Top panel: The top panel provides installation place and support for laptop screen.
5. Cooling Fan: It cools down temperature of internal components such as CPU, GPU etc.
6. RAM: RAM is the short form of Random Access Memory. It is the type of memory which can be
accessed randomly. It is temporary memory which stores data and programs while they are being
used and requires power source to maintain its integrity. Laptop computers use DDR SDRAM types
which are double data rate synchronous dynamic random access memory (RAM) class of memory
ICs. The common types of SDRAM include DDR1, DDR2, DDR3 and DDR4.
7. Hard disk: The laptop hard disk drives are of two common types viz. IDE (or PATA) hard drive
or SATA hard drive. They can be identified based on interface available on them.
8. Battery: It is used to provide power backup in order to operate laptop when AC mains power is
not available. The common laptop battery voltages are 10.8V, 11.1V or 14.8V. All the laptop batteries
are rechargeable. The common laptop battery types include lithium ion (i.e. Li-ion), nickel cadmium
(i.e. NiCad) and nickel metal hydride (i.e. NiMH).
Along with the above parts, Palm rest assembly, Hinges, Speaker, Optical drive, Antennas are
included in the assembly.
PROCEDURE:
1. Remove the power supply and battery.
2. Use the magnet tipped screwdrivers to unscrew.
3. The number of covers will vary from laptop to laptop. For neatness and efficiency put the screws
back into their holes on the covers once removed from the laptop and consider putting some masking
tape over the hole.
4. Remove the accessible components like Hard drive, RAM, Wireless card etc.,
5. Hard drive: – Remove this by pulling it in the opposite direction to its data pins. There may be
screws or maybe not. The drive should pull out easily. Place it on top of its cover in the cleared area
of your desk.
6. RAM: – There are clips either side of the sticks of RAM that push outward. It is advisable to use
a plastic spudger tool whenever possible to prevent any static discharge from occurring. When
release the RAM will pop up at an angle of 30 degrees.
7. Wireless card: – There is a small gold tipped cover which you can prise off with minimum effort.
This is the wireless antennae. The wireless card itself can be removed in the same manner as the
sticks of RAM.

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8. Remove the Hinge plate cover (HPC), Keyboard bezel and keyboard.
9. Remove any other cables under the keyboard that you see. Be careful while pull up or inserting
the ribbon cables.
10. Remove the display unit.
11. Continue to remove any other screws from the case.
12. Pry case apart.
13. Remove the motherboard and motherboard peripherals.
14. For assembly simply reverse the process.

VIVA QUESTIONS:
1. How will you avoid damage due to Electrostatic discharge?

2. What are all the various interfaces available in a typical laptop?

3. List out features of a laptop which makes it advantageous over smartphones?

RESULT:
Thus an overview of generic disassembly of a laptop was had and the various components found within
a typical laptop were explored and ways of their replacement was learnt.

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Content beyond Syllabus

Ex.No :
Date :

Aim:
To design a circuit to measure the mechanical stress.
Apparatus Required:
 Piezo Electric Sensor
 IC 741
 Resistors
 LED
 Piezo Buzzer
 Connecting Wires
Theory:
Piezo Electric effect:
Piezoelectric effect is when compressing a piezoelectric material produces electricity. It occurs when
there is a conversion of kinetic or mechanical energy due to crystal deformation, into electrical energy.
Piezoelectric materials are materials that can produce electricity due to mechanical stress. When a
piezoelectric material is placed under mechanical stress, there is a shift of the positive and negative
charge centers in the material, which then results in an external electric field. Going the other direction,
with an inverse piezoelectric effect, an external electric field causes a physical deformation in a
piezoelectric material.

Ceramic type piezoelectric plate disc:

It is also a piezo element. Can be used as piezoelectric buzzer when powered with audio signal, work
as acoustic transducer when used to pick up sound waves, or work as vibration sensor when external
force is exerted onto it.
Design of amplifier:
Signal amplification performs two important functions: increases the resolution of the input signal, and
increases its signal-to-noise ratio. The output from the sensor is very low in millivolts that’s why we use
an amplifier, which amplifies the output signal.

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Viva Questions:
1. Differentiate piezo electric transducer and piezo electric buzzer.

2. Draw the pin diagram of IC 741 and write the gain equation.

3. Write down the applications of piezo electric transducer.

Result:

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