Slide 4 Inverter Design
Slide 4 Inverter Design
Yu-Te Liao
Department of Electrical and Computer
Engineering
National Chiao Tung University
1
Outline
Operation of Inverter
Design Metrics:
− Propagation delay
− Power consumption
Design optimization
− Inverter chain sizing for optimal propagation delay
− Power consumption reduction
2
Operation of an Inverter
MOS transistors work as switches
A fast gate is built either by keeping the output
capacitance small or by decreasing the on-
resistance of the transistor.
3
VTC of an Inverter
IDSP = −IDSN
VGSn = Vin VGSp = Vin -VDD
VDSn = Vout VDSp = Vout -VDD
ID n
Vin = 0 Vin = 2.5
Vout
5
Inverter VTC
Five regions of NMOS and PMOS transistor operation
The sharp transition zone results in the high gain during
transition
Vout
NMOS off
2.5 PMOS res
NMOS s at
PMOS res
VIH and VIL are the
2
NMOS res
PMOS sat NMOS res
0.5
PMOS off
W / L P '
k n' VDSATn (VM VTn VDSATn / 2)
(W / L) N k pVDSATp (VDD VM VTp VDSATp / 2)
(3) (2)
(1)
9
Skewed Inverter
A skewed inverter can be used to shape the noisy
signal.
10
Noise Margin
In a digital circuit, the noise margin is the amount
by which the signal exceeds the threshold for a
proper '0' or '1'.
NMH = VDD - VIH
NML = VIL
VIH = VM - VM /g
VIL = VM + (VDD - VM )/g
11
Effective Resistor in Transition
Short channel devices
𝑉𝐷𝐷 /2
1 𝑉 3 𝑉𝐷𝐷
𝑅𝑒𝑞 = 𝑑𝑉 =
−𝑉𝐷𝐷 /2 𝑉𝐷𝐷 𝐼𝐷𝑆𝐴𝑇 4 𝐼𝐷𝑆𝐴𝑇
𝑘′𝑊 𝑉2𝐷𝑆𝐴𝑇
𝐼𝐷𝑆𝐴𝑇 = ( 𝑉𝐷𝐷 − 𝑉𝑇 𝑉𝐷𝑆𝐴𝑇 − )
𝐿 2 12
Propagation delay
3 𝐶𝐿𝑉𝐷𝐷
𝑇𝑝𝐻𝐿 = 𝑅𝐶 × ln 2 = 0.69 × =
4 𝐼𝐷𝑆𝐴𝑇
𝐶𝐿𝑉𝐷𝐷 𝐶𝐿
0.52 𝑊 𝑉𝐷𝑆𝐴𝑇 ≈ 0.52 𝑊
𝑘′𝑉 𝐷𝑆𝐴𝑇
(𝑉𝐷𝐷−𝑉𝑡𝑛− ) ( )𝑘′𝑉𝐷𝑆𝐴𝑇
𝐿 2 𝐿
13
Capacitance of an Inverter Chain
C L Cdb 2 Cdb1 Cw C g 4 C g 3 2C gd 12
VDD VDD
Cgp
Cdbp
In Cgd Out
Cdbn
Cw
Cgn
14
Propagation Delay (cont.)
Minimize propagation delay(PD)
− Reduce CL : reduce interconnection capacitance and
transistor intrinsic capacitance (minimize drain diffusion
areas)
− Reduce Ron: Increase W/L. however, the gate sizing
stops help when the gate capacitance dominates.(self-
loading)
− Increase VDD: trade off with power dissipation, oxide
breakdown, and hot electron effect
15
Transistor Sizing
Loaded by an identical inverter.
𝐶𝐿 = 𝐶𝑑𝑝1 + 𝐶𝑑𝑛1 + 2𝐶𝑔𝑑1 + 𝐶𝑔𝑝2 + 𝐶𝑔𝑛2 + 𝐶𝑤
= 1 + 𝛽 𝐶𝑑𝑛1 + 𝐶𝑔𝑛2 + 2𝐶𝑔𝑑1 + 𝐶𝑤
0.69 Reqp
𝑇𝑝 = ( 1 + 𝛽 𝐶𝑑𝑛1 + 𝐶𝑔𝑛2 + 2𝐶𝑔𝑑𝑛1 + 𝐶𝑤)(Reqn + )
2 β
γ
= 0.345( 1 + 𝛽 𝐶𝑑𝑛1 + 2𝐶𝑔𝑑𝑛1 + 𝐶𝑔𝑛2 + 𝐶𝑤)Reqn(1 + )
β
𝜇𝑛 𝑊𝑝 𝜕𝑇𝑝
𝛾= 𝛽= =0
𝑢𝑝 𝑊𝑛 𝜕𝛽
𝐶𝑤
𝛽𝑜𝑝𝑡 = 𝛾(1 + )
𝐶𝑑𝑛1 𝐶𝑔𝑛2
+
16
Transistor Sizing (cont.)
PD of CMOS inverter is as a function of the PMOS-
to-NMOS ratio
x 10-11
5
Symmetric
4.5 design
Tp(sec)
3.5
Minimum Tp
3
1 1.5 2 2.5 3 3.5 4 4.5 5
b
17
Inverter Sizing for Different Loading
S is the size ratio between designed inverter and
referenced inverter
𝐶𝑒𝑥𝑡
𝑇𝑝 = 0.69𝑅𝑖𝑛𝑡𝐶𝑖𝑛𝑡(1 + ) (Delay(intrinsic) + Delay(external))
𝐶𝑖𝑛𝑡
𝑅𝑟𝑒𝑓 𝐶𝑒𝑥𝑡
𝑇𝑝 = 0.69( )(𝑆𝐶𝑖𝑟𝑒𝑓 )(1 + )
𝑆 𝑆𝐶𝑖𝑟𝑒𝑓
𝐶𝑒𝑥𝑡 𝐶𝑒𝑥𝑡
𝑇𝑝 = 0.69𝑅𝑟𝑒𝑓 𝐶𝑖𝑟𝑒𝑓 1+ = 𝑇𝑝0(1 + )
𝑆𝐶𝑖𝑟𝑒𝑓 𝑆𝐶𝑖𝑟𝑒𝑓
Tp0 is independent of the sizing of the gate
S is sufficiently large Tp = Tp0
18
Sizing a Chain of Inverters
𝐶𝑖𝑛𝑡 = 𝛾𝐶𝑔
𝐶𝑒𝑥𝑡 𝑓
𝑇𝑝 = 𝑇𝑝0 1+ = 𝑇𝑝0(1 + )
𝛾𝐶𝑔 𝛾
19
Sizing a Chain of Inverters
When each stage has the same size fN=F=CL/Cg,1 ,
the inverter chain achieves a minimum propagation
delay.
𝑁
𝐶𝑔, 𝑗 + 1 𝜕𝑇𝑝
𝑇𝑝 = 𝑇𝑝0 (1 + ) =0
𝛾𝐶𝑔, 𝑗 𝜕𝐶𝑔, 𝑗
𝑗=1
𝐶𝑔, 𝑗 + 1 𝐶𝑔 , 𝑗
= 𝐶𝑔, 𝑗 = 𝐶𝑔𝑗 + 1𝐶𝑔𝑗 − 1
𝐶𝑔, 𝑗 𝐶𝑔, 𝑗 − 1
𝑁
𝑁 𝐶𝐿 𝐹
𝑓= =
𝑁
𝐹 𝑇𝑝 = 𝑁𝑇𝑝0(1 + )
𝐶𝑔, 1 𝛾
20
Example
In Out
1 f f2 CL= 8 C1
C1
21
Optimal Stages
𝛾 = 0 Nopt = ln 𝐹
𝛾 = 1 Nopt = 3.6 usually select optimum fan-out = 4
Select fan-out less than 4 does not affect the Tp too
much.
𝑁
𝐹
𝜕𝑇𝑝 𝜕𝑁𝑇𝑝0(1 + 𝛾 )
= =0
𝜕𝑁 𝜕𝑁
𝑁 𝛾
𝑁 𝐹 𝑙𝑛𝐹 (1+ )
𝛾+ 𝐹−
𝑁
=0 𝑓= 𝑒 𝑓
22
Example
Size inverter 2 and 3
2 3
2 3
2 3
1 2 3
Cg1 64Cg1
23
Sizing of an Inverter Chain
Cg1 1 f f2 fN-1 CL
25
Power Dissipation
Dynamic power
dvin v
E in i in (t)vin (t)dt V C dt CV dvin CV 2
0 0 dt 0
dv out v 1
E C i out (t)v out (t)dt C vout dt C v out dv out CVout
2
0 0 dt 0 2
2𝐸𝑑𝑦𝑛 Reducing Vdd has a quadratic effect on
𝑃𝑑𝑦𝑛 = = 𝐶𝐿𝑉2𝐷𝐷𝑓
𝑡𝑝𝐿𝐻 + 𝑡𝑝𝐻𝐿 dynamic power dissipation
Vout
iDD
Vout
iDD
Charge Discharge
26
Dissipation Due to Direct Path Current
The finite slope of the input signal causes a direct
current path between VDD and gnd
ts
Ishort
𝑉𝐷𝐷 − 2𝑉𝑇
𝑇𝑠ℎ𝑜𝑟𝑡 = 𝑡𝑠
𝑉𝐷𝐷
27
Reduce Short Circuit Current
Making the output rise/fall time larger than input
rise/fall time (Increase CL) cause the problems in
the following stages
Lower supply voltage: VDD< Vtn+|Vtp|
Large CL
iSC Vout
Small CL
28
Static Power Consumption
CMOS inverter has almost zero static power
dissipation except leakage current from diodes in
the CMOS process
Leakage current degrades the noise margins since
logic levels are not equal to the supply rails
VDD
Vout =VDD
Ileakage
Isubthreshold
29
Supply Voltage Scaling
Power consumption reduction
Low Speed
DC characteristic becomes sensitive to variation in the
device parameters.
Reduce signal swing (signals become sensitive to noise)
2.5 0.2
high supply low supply
2
voltage (>Vth) 0.15 voltage (<Vth)
1.5
Vout (V)
Vout (V)
0.1
1
0.05
0.5
0 0
0 0.5 1 1.5 2 2.5 0 0.05 0.1 0.15 0.2
Vin (V) Vin (V)
30
Multiple Vth Design
To reduce power consumption, we can turn off the
unused circuits.
Use high Vt transistor in the standby switch, leading
to small leakage current.
VDD
Standby
High VT
Virtual VDD
Logic
device
Cbypass
31
Tristate Inverter
Tristate inverter is used to control the signal path
and provide a high impedance when it is off.
EN = 0 inverter
EN = 1 floating output (High impedance )
EN
EN
Vin Vout Vin Vout
ENb
ENb
(a) (b)
32
Energy-delay Product
Energy-delay product (EDP) = Power-delay
2
𝐶 𝑉
productor (PDP) x Tp = 𝑃𝑎𝑣 × 𝑇𝑝2 = 𝐿 𝐷𝐷 𝑇𝑝
2
𝛼𝐶𝐿𝑉𝐷𝐷
𝑇𝑝 ≈
𝑉𝐷𝐷−𝑉𝑇𝐻 −𝑉𝐷𝑆𝐴𝑇/2
𝛼𝐶2𝐿𝑉3𝐷𝐷
𝐸𝐷𝑃 =
2(𝑉𝐷𝐷−𝑉𝑇𝐻−𝑉𝐷𝑆𝐴𝑇/2)
𝜕𝐸𝐷𝑃 3 𝑉𝐷𝑆𝐴𝑇
=0 𝑉𝐷𝐷𝑜𝑝𝑡 = (𝑉𝑇𝐻 + )
𝜕𝑉𝐷𝐷 2 2
33
Power Consumption Reduction
Voltage reduction
Reduce switching activity
Reduce physical capacitance
34
Conclusion
Review of the supply voltage scaling effect in
inverter design
Propagation delay of inverter
Sizing of inverter
Power consumption of inverter
Next lecture: wire and interconnection (Chap 4 and
9)
35