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Slide 4 Inverter Design

The document discusses the design and operation of CMOS inverters, focusing on key metrics such as propagation delay and power consumption. It covers design optimization techniques, including inverter chain sizing for optimal performance and noise margin considerations. Additionally, it provides insights into the voltage transfer characteristics and transistor sizing to achieve efficient inverter designs.

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0% found this document useful (0 votes)
12 views35 pages

Slide 4 Inverter Design

The document discusses the design and operation of CMOS inverters, focusing on key metrics such as propagation delay and power consumption. It covers design optimization techniques, including inverter chain sizing for optimal performance and noise margin considerations. Additionally, it provides insights into the voltage transfer characteristics and transistor sizing to achieve efficient inverter designs.

Uploaded by

s755369.eed03
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We take content rights seriously. If you suspect this is your content, claim it here.
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CMOS Inverter Design

Yu-Te Liao
Department of Electrical and Computer
Engineering
National Chiao Tung University

1
Outline
 Operation of Inverter
 Design Metrics:
− Propagation delay
− Power consumption
 Design optimization
− Inverter chain sizing for optimal propagation delay
− Power consumption reduction

2
Operation of an Inverter
 MOS transistors work as switches
 A fast gate is built either by keeping the output
capacitance small or by decreasing the on-
resistance of the transistor.

3
VTC of an Inverter

IDSP = −IDSN
VGSn = Vin VGSp = Vin -VDD
VDSn = Vout VDSp = Vout -VDD

Assume VDD = 2.5V

Introduction to VLSI Design 2012


4
Inverter VTC
 VTC: Voltage Transfer Characteristic

ID n
Vin = 0 Vin = 2.5

PMOS Vin = 0.5 Vin = 2 NMOS

Vin = 1 Vin = 1.5


Vin = 1.5 Vin = 1
Vin = 1.5 Vin = 1
Vin = 2 Vin = 0.5

Vin = 2.5 Vin = 0

Vout

5
Inverter VTC
 Five regions of NMOS and PMOS transistor operation
 The sharp transition zone results in the high gain during
transition
Vout
NMOS off
2.5 PMOS res
NMOS s at
PMOS res
VIH and VIL are the
2

operational points NMOS sat VM: Threshold Voltage


1.5

𝜕𝑉𝑜𝑢𝑡 PMOS sat (Slope = 1 or Vin= Vout)


where = −1
𝜕𝑉𝑖𝑛
1

NMOS res
PMOS sat NMOS res
0.5

PMOS off

0.5 1 1.5 2 2.5 Vin

Introduction to VLSI Design 2012


6
Switching Threshold
 The switching threshold is defined as the point
where Vin = Vout
 Velocity saturation region:
𝑉𝐷𝑆𝐴𝑇
𝐼𝐷𝑆 = 𝑘𝑛𝑉𝐷𝑆𝐴𝑇 𝑉𝐺𝑆 − 𝑉𝑡ℎ −
2
VDSATn VDSATp
I DS  k nVDSATn (VM  VTn  )  k pVDSATp (VM  VDD  VTp  )
2 2
𝑉𝐷𝑆𝐴𝑇𝑛 𝑉𝐷𝑆𝐴𝑇𝑝
𝑉𝑡𝑛 + + 𝑟(𝑉𝐷𝐷 + 𝑉𝑇𝑃 + ) 𝑟𝑉𝐷𝐷
𝑉𝑀 = 2 2 ≈
1+𝑟 1+𝑟
𝑘𝑝𝑉𝐷𝑆𝐴𝑇𝑝 𝜐𝑠𝑎𝑡𝑝𝑊𝑃
𝑟= =
𝑘𝑛𝑉𝐷𝐴𝑆𝑇𝑛 𝜐𝑠𝑎𝑡𝑛𝑊𝑁
7
Switching Threshold (cont.)

 Switching threshold set by the ratio r, which


compares the relative driving strengths of the
PMOS and NMOS transistors

W / L P '
k n' VDSATn (VM  VTn  VDSATn / 2)
(W / L) N k pVDSATp (VDD  VM  VTp  VDSATp / 2)

VTP and VDSATP are negative values

 To have comparable high and low noise margins,


VM = VDD/2 , resulting in r  1.
8
Quiz
 Which curve means PMOS has better driving
strength?

(3) (2)
(1)

9
Skewed Inverter
 A skewed inverter can be used to shape the noisy
signal.

10
Noise Margin
 In a digital circuit, the noise margin is the amount
by which the signal exceeds the threshold for a
proper '0' or '1'.
NMH = VDD - VIH
NML = VIL

VIH = VM - VM /g
VIL = VM + (VDD - VM )/g

So high gain in the transition


region is very desirable
A piece-wise linear approximation of VTC

11
Effective Resistor in Transition
 Short channel devices

𝑉𝐷𝐷 /2
1 𝑉 3 𝑉𝐷𝐷
𝑅𝑒𝑞 = 𝑑𝑉 =
−𝑉𝐷𝐷 /2 𝑉𝐷𝐷 𝐼𝐷𝑆𝐴𝑇 4 𝐼𝐷𝑆𝐴𝑇

𝑘′𝑊 𝑉2𝐷𝑆𝐴𝑇
𝐼𝐷𝑆𝐴𝑇 = ( 𝑉𝐷𝐷 − 𝑉𝑇 𝑉𝐷𝑆𝐴𝑇 − )
𝐿 2 12
Propagation delay
3 𝐶𝐿𝑉𝐷𝐷
 𝑇𝑝𝐻𝐿 = 𝑅𝐶 × ln 2 = 0.69 × =
4 𝐼𝐷𝑆𝐴𝑇
𝐶𝐿𝑉𝐷𝐷 𝐶𝐿
 0.52 𝑊 𝑉𝐷𝑆𝐴𝑇 ≈ 0.52 𝑊
𝑘′𝑉 𝐷𝑆𝐴𝑇
(𝑉𝐷𝐷−𝑉𝑡𝑛− ) ( )𝑘′𝑉𝐷𝑆𝐴𝑇
𝐿 2 𝐿

(Assume VDD >> Vtn + ½ VDSAT )

The delay is insensitive


to supply variations for
high value VDD

13
Capacitance of an Inverter Chain

C L  Cdb 2  Cdb1  Cw  C g 4  C g 3  2C gd 12
VDD VDD
Cgp
Cdbp

In Cgd Out

Cdbn
Cw
Cgn

14
Propagation Delay (cont.)
 Minimize propagation delay(PD)
− Reduce CL : reduce interconnection capacitance and
transistor intrinsic capacitance (minimize drain diffusion
areas)
− Reduce Ron: Increase W/L. however, the gate sizing
stops help when the gate capacitance dominates.(self-
loading)
− Increase VDD: trade off with power dissipation, oxide
breakdown, and hot electron effect

15
Transistor Sizing
Loaded by an identical inverter.
𝐶𝐿 = 𝐶𝑑𝑝1 + 𝐶𝑑𝑛1 + 2𝐶𝑔𝑑1 + 𝐶𝑔𝑝2 + 𝐶𝑔𝑛2 + 𝐶𝑤
= 1 + 𝛽 𝐶𝑑𝑛1 + 𝐶𝑔𝑛2 + 2𝐶𝑔𝑑1 + 𝐶𝑤

0.69 Reqp
𝑇𝑝 = ( 1 + 𝛽 𝐶𝑑𝑛1 + 𝐶𝑔𝑛2 + 2𝐶𝑔𝑑𝑛1 + 𝐶𝑤)(Reqn + )
2 β
γ
= 0.345( 1 + 𝛽 𝐶𝑑𝑛1 + 2𝐶𝑔𝑑𝑛1 + 𝐶𝑔𝑛2 + 𝐶𝑤)Reqn(1 + )
β
𝜇𝑛 𝑊𝑝 𝜕𝑇𝑝
𝛾= 𝛽= =0
𝑢𝑝 𝑊𝑛 𝜕𝛽

𝐶𝑤
𝛽𝑜𝑝𝑡 = 𝛾(1 + )
𝐶𝑑𝑛1 𝐶𝑔𝑛2
+

16
Transistor Sizing (cont.)
 PD of CMOS inverter is as a function of the PMOS-
to-NMOS ratio
x 10-11
5
Symmetric
4.5 design
Tp(sec)

3.5
Minimum Tp
3
1 1.5 2 2.5 3 3.5 4 4.5 5
b
17
Inverter Sizing for Different Loading
 S is the size ratio between designed inverter and
referenced inverter
𝐶𝑒𝑥𝑡
𝑇𝑝 = 0.69𝑅𝑖𝑛𝑡𝐶𝑖𝑛𝑡(1 + ) (Delay(intrinsic) + Delay(external))
𝐶𝑖𝑛𝑡
𝑅𝑟𝑒𝑓 𝐶𝑒𝑥𝑡
𝑇𝑝 = 0.69( )(𝑆𝐶𝑖𝑟𝑒𝑓 )(1 + )
𝑆 𝑆𝐶𝑖𝑟𝑒𝑓

𝐶𝑒𝑥𝑡 𝐶𝑒𝑥𝑡
𝑇𝑝 = 0.69𝑅𝑟𝑒𝑓 𝐶𝑖𝑟𝑒𝑓 1+ = 𝑇𝑝0(1 + )
𝑆𝐶𝑖𝑟𝑒𝑓 𝑆𝐶𝑖𝑟𝑒𝑓
 Tp0 is independent of the sizing of the gate
 S is sufficiently large Tp = Tp0

18
Sizing a Chain of Inverters

𝐶𝑖𝑛𝑡 = 𝛾𝐶𝑔

𝐶𝑒𝑥𝑡 𝑓
𝑇𝑝 = 𝑇𝑝0 1+ = 𝑇𝑝0(1 + )
𝛾𝐶𝑔 𝛾

 Only a function of the ratio between its external


load capacitance and its input capacitance
 f: effective fan-out

19
Sizing a Chain of Inverters
When each stage has the same size fN=F=CL/Cg,1 ,
the inverter chain achieves a minimum propagation
delay.
𝑁
𝐶𝑔, 𝑗 + 1 𝜕𝑇𝑝
𝑇𝑝 = 𝑇𝑝0 (1 + ) =0
𝛾𝐶𝑔, 𝑗 𝜕𝐶𝑔, 𝑗
𝑗=1

𝐶𝑔, 𝑗 + 1 𝐶𝑔 , 𝑗
= 𝐶𝑔, 𝑗 = 𝐶𝑔𝑗 + 1𝐶𝑔𝑗 − 1
𝐶𝑔, 𝑗 𝐶𝑔, 𝑗 − 1

𝑁
𝑁 𝐶𝐿 𝐹
𝑓= =
𝑁
𝐹 𝑇𝑝 = 𝑁𝑇𝑝0(1 + )
𝐶𝑔, 1 𝛾
20
Example

In Out
1 f f2 CL= 8 C1
C1

CL/C1 has to be evenly distributed across N = 3


stages: 3
f  82

21
Optimal Stages
 𝛾 = 0 Nopt = ln 𝐹
 𝛾 = 1 Nopt = 3.6 usually select optimum fan-out = 4
 Select fan-out less than 4 does not affect the Tp too
much.
𝑁
𝐹
𝜕𝑇𝑝 𝜕𝑁𝑇𝑝0(1 + 𝛾 )
= =0
𝜕𝑁 𝜕𝑁
𝑁 𝛾
𝑁 𝐹 𝑙𝑛𝐹 (1+ )
𝛾+ 𝐹−
𝑁
=0 𝑓= 𝑒 𝑓

22
Example
 Size inverter 2 and 3

2 3

2 3

2 3

1 2 3

Cg1 64Cg1

4𝐶𝑔2 4𝐶𝑔3 64𝐶𝑔1


= =
𝐶𝑔1 𝐶𝑔2 𝐶𝑔3 𝐶𝑔3 = 2.52𝐶𝑔2 = 6.35𝐶𝑔1

23
Sizing of an Inverter Chain

Cg1 1 f f2 fN-1 CL

𝐶𝑒𝑥𝑡 (Cascaded two


𝑇𝑝 = 0.69𝑅𝑒𝑞 𝐶𝑜𝑢𝑡 + 𝐶𝑒𝑥𝑡 = 0.69𝑅𝑒𝑞𝐶𝑜𝑢𝑡(1 + ) inverters)
𝐶𝑜𝑢𝑡
𝑁
𝐶 𝑓 𝐹 𝐶𝐿
𝑇𝑝 = 𝑇𝑝0 1 + 𝑒𝑥𝑡 = 𝑇𝑝0 1 + 𝑇𝑝 = 𝑁𝑇𝑝0 1 + ,𝐹 =
𝛾𝐶𝑔 𝛾 𝛾 𝐶𝑔1
−1 𝑓𝑁 − 1 𝐹−1
𝐴𝑑𝑟𝑖𝑣𝑒𝑟 = 1 + 𝑓 + 𝑓2 + ⋯ + 𝑓𝑁 𝐴𝑚𝑖𝑛 = 𝐴𝑚𝑖𝑛 = 𝐴𝑚𝑖𝑛
𝑓−1 𝑓−1
−1 𝐹−1 𝐶𝐿 2
𝐸𝑑𝑟𝑖𝑣𝑒𝑟 = 1 + 𝑓 + 𝑓2 + ⋯ + 𝑓𝑁 𝐶𝑖𝑉 𝐷𝐷 =
2 𝐶𝑖𝑉 𝐷𝐷 ≈
2 𝑉 𝐷𝐷
𝑓−1 𝑓−1
Large f can reduce power dissipation at the cost of large area!!
24
Power Dissipation in Static CMOS Logics
 Static CMOS logics are almost no power
consumption in steady-state operation mode
 Dynamic power consumption
− Charge and discharge capacitors
 Short circuit current
− Short circuit path between supply rails during switching
 Leakage current
− Leaking diode and transistor

25
Power Dissipation
 Dynamic power
  dvin v
E in   i in (t)vin (t)dt  V  C dt  CV  dvin  CV 2
0 0 dt 0
  dv out v 1
E C   i out (t)v out (t)dt   C vout dt  C  v out dv out  CVout
2
0 0 dt 0 2
2𝐸𝑑𝑦𝑛 Reducing Vdd has a quadratic effect on
𝑃𝑑𝑦𝑛 = = 𝐶𝐿𝑉2𝐷𝐷𝑓
𝑡𝑝𝐿𝐻 + 𝑡𝑝𝐻𝐿 dynamic power dissipation
Vout

iDD

Vout
iDD

Charge Discharge
26
Dissipation Due to Direct Path Current
 The finite slope of the input signal causes a direct
current path between VDD and gnd

ts

Vin VDD -VT


iSC Vout VT

Ishort

𝑉𝐷𝐷 − 2𝑉𝑇
𝑇𝑠ℎ𝑜𝑟𝑡 = 𝑡𝑠
𝑉𝐷𝐷
27
Reduce Short Circuit Current
 Making the output rise/fall time larger than input
rise/fall time (Increase CL)  cause the problems in
the following stages
 Lower supply voltage: VDD< Vtn+|Vtp|

Large CL

iSC Vout

Small CL

28
Static Power Consumption
 CMOS inverter has almost zero static power
dissipation except leakage current from diodes in
the CMOS process
 Leakage current degrades the noise margins since
logic levels are not equal to the supply rails

VDD

Vout =VDD
Ileakage

Isubthreshold
29
Supply Voltage Scaling
 Power consumption reduction
 Low Speed
 DC characteristic becomes sensitive to variation in the
device parameters.
 Reduce signal swing (signals become sensitive to noise)

2.5 0.2
high supply low supply
2
voltage (>Vth) 0.15 voltage (<Vth)
1.5
Vout (V)

Vout (V)
0.1
1

0.05
0.5

0 0
0 0.5 1 1.5 2 2.5 0 0.05 0.1 0.15 0.2
Vin (V) Vin (V)
30
Multiple Vth Design
 To reduce power consumption, we can turn off the
unused circuits.
 Use high Vt transistor in the standby switch, leading
to small leakage current.
VDD

Standby
High VT

Virtual VDD

Logic
device
Cbypass

31
Tristate Inverter
 Tristate inverter is used to control the signal path
and provide a high impedance when it is off.
 EN = 0 inverter
 EN = 1 floating output (High impedance )

EN

EN
Vin Vout Vin Vout

ENb

ENb

(a) (b)
32
Energy-delay Product
 Energy-delay product (EDP) = Power-delay
2
𝐶 𝑉
productor (PDP) x Tp = 𝑃𝑎𝑣 × 𝑇𝑝2 = 𝐿 𝐷𝐷 𝑇𝑝
2
𝛼𝐶𝐿𝑉𝐷𝐷
 𝑇𝑝 ≈
𝑉𝐷𝐷−𝑉𝑇𝐻 −𝑉𝐷𝑆𝐴𝑇/2

𝛼𝐶2𝐿𝑉3𝐷𝐷
 𝐸𝐷𝑃 =
2(𝑉𝐷𝐷−𝑉𝑇𝐻−𝑉𝐷𝑆𝐴𝑇/2)

𝜕𝐸𝐷𝑃 3 𝑉𝐷𝑆𝐴𝑇
 =0 𝑉𝐷𝐷𝑜𝑝𝑡 = (𝑉𝑇𝐻 + )
𝜕𝑉𝐷𝐷 2 2

33
Power Consumption Reduction
 Voltage reduction
 Reduce switching activity
 Reduce physical capacitance

34
Conclusion
 Review of the supply voltage scaling effect in
inverter design
 Propagation delay of inverter
 Sizing of inverter
 Power consumption of inverter
 Next lecture: wire and interconnection (Chap 4 and
9)

35

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