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12 Chapter 06 Compression

This chapter discusses techniques for compressing test data to reduce test volume and time. It introduces stimulus compression, which encodes test vectors, and response compaction, which compresses output signatures. Stimulus compression techniques include code-based schemes that use dictionaries and Huffman/Golomb codes, linear-decompression-based schemes that use XOR networks and sequential decompressors, and broadcast-scan-based schemes. Response compaction uses space and time compaction as well as mixed approaches.

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0% found this document useful (0 votes)
281 views70 pages

12 Chapter 06 Compression

This chapter discusses techniques for compressing test data to reduce test volume and time. It introduces stimulus compression, which encodes test vectors, and response compaction, which compresses output signatures. Stimulus compression techniques include code-based schemes that use dictionaries and Huffman/Golomb codes, linear-decompression-based schemes that use XOR networks and sequential decompressors, and broadcast-scan-based schemes. Response compaction uses space and time compaction as well as mixed approaches.

Uploaded by

Tarun g
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Chapter 6

Test Compression

1
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 1
What is this chapter about?
 Introduce the basic concepts of test data
compression
 Focus on stimulus compression and response
compaction techniques
 Present and discuss commercial tools on test
compression

2
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 2
Test Compression
 Introduction
 Test Stimulus Compression
 Test Response Compaction
 Industry Practices
 Concluding Remarks

3
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 3
Introduction
 Why do we need test compression?
 Test data volume
 Test time
 Test pins
 Why can we compress test data?
 Deterministic test vector has “don’t care” (X’s)

4
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 4
Test data volume v.s. gate count
Volume of test data (Gb)

70
60
50
40
30
20 Test data volume
10 increases with circuit size
0
1 2 4 8 16 32 64
Gate count (Mg)
(Source: Blyler, Wireless System Design, 2001)
5
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 5
Test compression categories
 Test Stimulus Compression
 Code-based schemes
 Linear-decompression-based schemes
 Broadcast-scan-based schemes
 Test Response Compaction
 Space compaction
 Time compaction
 Mixed time and space compaction

6
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 6
Architecture for test compression

Stimulus Response

Decompressor Core Compacted

Compactor
Compressed
Stimulus Response

Low-Cost
ATE

7
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 7
Test stimulus compression
 Code-based schemes
 Linear-decompression-based schemes
 Broadcast-scan-based schemes

8
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 8
Test stimulus compression
 Code-based schemes
 Dictionary code (fixed-to-fixed)
 Huffman code (fixed-to-variable)
 Run-length code (variable-to-fixed)
 Golomb code (variable-to-variable)

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 9
Code-based schemes
 Dictionary code (fixed-to-fixed)

10
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 10
Code-based schemes
 Huffman code (fixed-to-variable)

11
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 11
Code-based schemes
 Huffman code (fixed-to-variable)

12
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 12
Code-based schemes
 Run-length code (variable-to-fixed)

13
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 13
Code-based schemes
 Golomb code (variable-to-variable)

14
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 14
Code-based schemes
 Golomb code (variable-to-variable)

15
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 15
Test stimulus compression
 Linear-decompression-based schemes
 Combinational linear decompressors
 Fixed-length sequential linear decompressors
 Variable-length sequential linear decompressors
 Combined linear and nonlinear decompressors

16
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 16
Linear-decompression-based schemes

17
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 17
Linear-decompression-based schemes

18
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 18
Linear-decompression-based schemes

19
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 19
Linear-decompression-based schemes

 Combinational linear decompressors

XOR XOR Network


Network

MISR

20
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 20
XOR network: a 3-to-5 example
s1 s2 s3

o1 o2 o3 o4 o5
21
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 21
Linear-decompression-based schemes
 Fixed-length sequential linear decompressors

22
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 22
Linear-decompression-based schemes
 Variable-length sequential linear decompressors
 Can vary the number of free variables
 Better encoding efficiency
 More control logic and control information

23
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 23
Linear-decompression-based schemes

 Combined linear and nonlinear decompressors


 Specified bits tend to be highly correlated
 Combine linear and nonlinear decompression together
can achieve greater compression than either alone

24
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 24
Test stimulus compression
 Broadcast-scan-based schemes
 Broadcast scan
 Illinois scan
 Multiple-input broadcast scan
 Reconfigurable broadcast scan
 Virtual scan

25
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 25
Broadcast-scan-based schemes
 Broadcast scan

26
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 26
Generate patterns for broadcast scan
 Force ATPG tool to generate patterns for
broadcast scan

27
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 27
Broadcast scan for a pipelined circuit
 Broadcast scan for a pipelined circuit

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 28
Broadcast-scan-based schemes
 Illinois scan architecture

(a) Broadcast mode

(b) Serial chain mode

29
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 29
Broadcast-scan-based schemes
 Reconfigurable broadcast scan
 Reduce the number of channels that are required
 Static reconfiguration
– The reconfiguration can only be done when a new
pattern is to be applied
 Dynamic reconfiguration
– The configuration can be changed while scanning in a
pattern

30
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 30
Broadcast-scan-based schemes
 First configuration is: 1->{2,3,6}, 2->{7}, 3->{5,8}, 4->{1,4}
 Other configuration is: 1->{1,6}, 2->{2,4}, 3->{3,5,7,8}

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 31
Broadcast-scan-based schemes
 Block diagram of MUX network

32
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 32
Broadcast-scan-based schemes
 Virtual scan
 Pure MUX and XOR networks are allowed
 No need to solve linear equations
 Dynamic compaction can be effectively utilized
during the ATPG process
 Very little or no fault coverage loss

33
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 33
Test response compaction
 Space compaction
 Time compaction
 Mixed time and space compaction

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 34
Test response compaction

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 35
Taxonomy of various response compaction schemes
I II III
Compaction Schemes
Space Time CFS CFI Linearity Nonlinearity
Zero-aliasing Compactor
  
[Chakrabarty 1998] [Pouya 1998]
Parity Tree [Karpovsky 1987]   
Enhanced Parity Tree [Sinanoglu 2003]    
X-Compact [Mitra 2004]   
q-Compactor [Han 2003]    
Convolutional Compactor [Rajski 2005]    
OPMISR [Barnhart 2002]    
Block Compactor [Wang 2003]    
i-Compact [Patel 2003]   
Compactor for SA [Wohl 2001]    
Scalable Selector [Wohl 2004]   

36
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 36
Test response compaction
 Space compaction
 Zero-aliasing linear compaction
 X-compact
 X-blocking
 X-masking
 X-impact

37
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 37
Space compaction
 Zero-aliasing linear compaction

38
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 38
An example of response graph

39
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 39
Space compaction
 X-compact
 X-tolerant response compaction technique
 X-compact matrix
 Error masking

40
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 40
Space compaction
 X-compact

41
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 41
Space compaction
 X-compactor with 8 inputs and 5 outputs

42
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 42
X-compact Matrix
SC1
SC2
SC3 O1
SC4 O2
S= SC5 O= O3
SC6 O4
SC7 O5
SC8

T
M X S = O

43
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 43
Space compaction
 X-blocking (or X-bounding)
 X’s can be blocked before reaching the response
compactor
 Can ensure that no X’s will be observed
 May result in fault coverage loss
 Add area overhead and may impact delay

44
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 44
Space compaction
 Illustration of the x-blocking scheme

45
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 45
Space compaction
 X-masking
 X’s can be masked off right before the response
compactor
 Mask data is required to indicate when the
masking should take place
 Mask date can be compressed
– Possible compression techniques are weighted pseudo-
random LFSR reseeding or run-length encoding

46
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 46
Space compaction
 An example of X-masking circuit

47
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 47
Space compaction
 X-impact
 Simply use ATPG to algorithmically handle the
impact of residual x’s on the space compactor
 Without adding any extra circuitry

48
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 48
Space compaction
 Handling of X-impact

49
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 49
Space compaction
 Handling of aliasing

50
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 50
Test response compaction
 Time compaction
 A time compactor uses sequential logic to
compact test responses
 MISR is most widely adopted
 n-stage MISR can be described by specifying a
characteristic polynomial of degree n

51
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 51
Multiple-input signature register (MISR)

52
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 52
Test response compaction
 Mixed time and space compaction

53
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 53
Industry practices
 OPMISR+
 Embedded Deterministic Test
 Virtual Scan and UltraScan
 Adaptive Scan
 ETCompression

54
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 54
Industry solutions categories
 Linear-decompression-based schemes
 Two steps
– ETCompression, LogicVision
– TestKompress, Mentor Graphics
– SOCBIST, Synopsys
 Broadcast-scan-based schemes
 Single step
– SPMISR+, Cadence
– VirtualScan and UltraScan, SynTest
– DFT MAX, Synopsys

55
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 55
Industry practices
 OPMISR+
 Cadence
 Roots in IBM ‘s logic BIST and ATPG technology

56
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 56
General scan architecture for OPMISR+

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 57
Industry practices
 Embedded Deterministic Test (TestKompress)
 Mentor Graphics
 First commercially available on-chip test
compression product

58
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 58
EDT (TestKompression) architecture

59
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 59
TestKompress stimuli compression

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 60
TestKompress response compaction

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 61
Industry practices
 Virtual Scan and UltraScan
 SynTest
 First commercial product based on the broadcast
scan scheme using combinational logic for pattern
decompression

62
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 62
VirtualScan architecture

63
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 63
UltraScan architecture

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 64
Industry practices
 Adaptive Scan
 Synopsys
 Designed to be the next generation scan
architecture

65
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 65
Adaptive scan architecture

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 66
Industry practices
 ETCompression
 LogicVision
 Built upon embedded logic test (ELT) technology

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 67
ETCompression architecture

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 68
Summary of industry practices

MISR: multiple-input signature register


MUX: multiplexers
PRPG: pseudo-random pattern generator
TDDM: time-division demultiplexer
TDM: time-division multiplexers
XOR: exclusive-OR

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VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 69
Concluding remarks
 Test compression is
 An effective method for reducing test data volume
and test application time with relatively small cost
 An effective test structure for embedded hard
cores
 Easy to implement and capable of producing
high-quality tests
 Successfully as part of design flow
 Need to unify different compression
architectures

70
VLSI Test Principles and Architectures
EE141 Ch. 6 - Test Compression – P. 70

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