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Report 3 Ele Design

1. The document outlines the steps for manufacturing a printed circuit board (PCB), including designing the schematic, making a film, cutting the board, applying photoresist, exposing the board to UV light, developing and etching the board, and stripping off the photoresist. 2. It then explains that multilayer boards contain multiple insulating layers with conductor patterns laminated together to increase wiring density, with most boards containing 4-8 layers but some up to 100 layers. Blind and buried vias connect some inner layers without penetrating the whole board. 3. Power and ground layers are often dedicated whole layers in multilayer PCBs, with sometimes multiple power and ground planes used for components with different

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Mohd Azfar Hakim
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79 views

Report 3 Ele Design

1. The document outlines the steps for manufacturing a printed circuit board (PCB), including designing the schematic, making a film, cutting the board, applying photoresist, exposing the board to UV light, developing and etching the board, and stripping off the photoresist. 2. It then explains that multilayer boards contain multiple insulating layers with conductor patterns laminated together to increase wiring density, with most boards containing 4-8 layers but some up to 100 layers. Blind and buried vias connect some inner layers without penetrating the whole board. 3. Power and ground layers are often dedicated whole layers in multilayer PCBs, with sometimes multiple power and ground planes used for components with different

Uploaded by

Mohd Azfar Hakim
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
You are on page 1/ 8

1. Preparing the artwork by design schematics and layout using Orcad software or other software.

Schematic diagram





Routing

2. Make film processing using photoplotter to process a film.


Photoplotter machine


Film

3. Cutting the PCB depend on circuit design size using PCB shear cutter.


PCB shear cutter

4. After cutting process finished, take out PCB board and wash the board under tap with scotch brite.
Repeat process until PCB board clean and free from finger print.

PCB board

5. Apply dry film photoresist on copper PCB board surface by using laminator. Make sure there is no
bubble after laminated. This is because to avoid broken circuit.

Dry Film photoresist


Laminator

6. Transferring the layout or artwork onto copper board using UV exposure process.

PCB board prior to UV exposure process



Apply the film that we do before entering the UV machine


UV machine


PCB board after UV exposure process



7. Developer process-remove the exposed photoresist using Rota spray developer. the parts that are
to be etched should look like completely clean copper, no residue. A well developed board should have
solid traces and a clean copper background. Before process to next steps, ensure that the circuit is
connect properly. If not, connect the circuit using PCB maker.

Rota spray developer


PCB maker


8. Etching process-the board is placed in an etcher, which is a machine that washes warm ferric
chloride over the board, eating away any exposed copper.

Etching machine


PCB board in etching machine

9. Photoresist stripper- this process will remove all the photoresist from the etched circuit
board revealing the copper that makes the circuit on the board.

Photoresist stripper machine

10. DONE!!!!!!!!


PCB board
What is multilayer board
To increase the area available for the wiring even more these boards have one or more
conductor pattern inside the board. This is achieved by gluing (laminating) several
double-sided boards together with insulating layers in between. The number of layers is
referred to as the number of separate conductor patterns. It is usually even and
includes the two outer layers. Most main boards have between 4 and 8 layers, but PCBs
with almost 100 layers can be made. Large super computers often contain boards with
extremely many layers, but since it is becoming more efficient to replace such
computers with clusters of ordinary PCs, PCBs with a very high layer count are less and
less used. Since the layers in a PCB are laminated together it is often difficult to
actually tell how many there are, but if you inspect the side of the board closely you
might be able count them.
The vias described in the section about double-sided PCBs always penetrate the whole
board. When there are multiple layers of conductor patterns, and you only want to
connect some of them, such vias waste space that could be used to route other wires.
'Buried ' and 'Blind ' vias avoid this problem because they only penetrate as many
layers as necessary. Blind vias connect one or more of the inner layers with one of the
surface layers without penetrating the whole board. Buried vias only connect inner
layers. It is therefore not possible so see such vias by just looking at the surface of the
PCB.
In multi-layer PCBs whole layers are almost always dedicated to Ground and Power. We
therefore classify the layers as Signal, Power or Ground planes. Sometimes there is
more than one of both Power and Ground planes, especially if the different components
on the PCB require different supply voltages.

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