BM20/BM23

Bluetooth® 4.1 Stereo Audio Module

Features:  Build-in four languages (Chinese/ English/ Spanish/
 Complete, Fully Certified, Embedded French) voice prompts and 20 events for each one
2.4 GHz Bluetooth® Version 4.1 (This function can be set up in “IS20XXS_UI” tool.)
Module  Support SCMS-T
 Bluetooth Classic (BDR/EDR)
 Bluetooth SIG Certified Audio Codec
 Onboard embedded Bluetooth Stack
 Transparent UART mode for seamless serial  20 bit DAC and 16 bit ADC codec
data over UART interface  98dB SNR DAC playback
 Easy to configure with Windows GUI or direct Peripherals
by MCU
 Built-in Lithium-ion battery charger (up to 350mA)
 Compact surface mount module: 29 x 15 x
2.5 mm
3  Integrate 3V, 1.8V configurable switching regulator and
 Castellated surface mount pads for easy LDO
and reliable host PCB mounting  Built-in ADC for battery monitor and voltage sense.
 Environmentally friendly, RoHS compliant  A line-in port for external audio input
 Perfect for Portable Battery Operated
 Two LED drivers
Devices
 Internal Battery Regulator Circuitry
 Worldwide regulatory certifications Flexible HCI interface
 Audio-In / Out  High speed HCI-UART (Universal Asynchronous
2
BM23 support digital audio I S format. Receiver Transmitter) interface (up to 921600bps)
BM20 support analog audio output. MAC/Baseband/Higher Layer:
Operational:  Secure AES128 encryption
 Operating voltage: 3.0V to 4.2V  Bluetooth profiles
 Temperature range: ‐20C to 70°C - HFP v1.6
- HSP v1.1
 Simple, UART interface
- A2DP v1.2
 Integrated crystal, internal voltage - AVRCP v1.5
regulator, and matching circuitry - SPP v1.0
 Multiple I/O pins for control and status - PBAP v1.0
RF/Analog:
 Frequency: 2.402 to 2.480 GHz Antenna:
 Receive Sensitivity: ‐91 dBm (π/4  Printed Antenna
DQPSK)
 Power Output: class 2 / +4dBm max. Compliance:
 Connection Distance: >10m  Bluetooth SIG QDID
(free space and no interference)  Module certified for the United States (FCC) and
Canada (IC), Korea (LCC), Taiwan (NCC), Japan
Audio processor (MIC) and China(SRRC)
 Support 64 kb/s A-Law or -Law PCM format, or
CVSD (Continuous Variable Slope Delta
Modulation) for SCO channel operation.
 Noise suppression
 Echo suppression
 SBC and optional AAC decoding
 Packet loss concealment

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Figure 1:

This stereo module built-in Li-Ion charger

General Description: and BM23 contain a digital audio interface. It
Stereo module is a fully-certified supports HSP, HFP, SPP, A2DP, and
Bluetooth® Version 4.1 (BDR/EDR) module AVRCP profiles. Both AAC and SBC codecs
for designers who want to add Bluetooth® are supported for A2DP. Note that the
wireless audio and voice applications to their customer must connect their own external
products. analog CODEC/DSP/amplifier and MCU for
audio output.
This Bluetooth SIG certified module
provides a complete wireless solution with Applications:
Bluetooth stack, integrated antenna, and  Bluetooth sound bar
worldwide radio certifications in a compact  Bluetooth stereo speaker phone
3
surface mount package, 29x15x2.5 mm .

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Table of Contents

1. DEVICE OVERVIEW .........................................................................................................6

2. APPLICATION INFORMATION .....................................................................................12
3. ELECTRICAL CHARACTERISTICS...............................................................................20
4. PRINTED ANTENNA INFORMATION ..........................................................................25
4.1. MODULE RADIATION PATTERN..............................................................................25
4.2. MODULE PLACEMENT RULE ..................................................................................26
5. REFERENCE CIRCUIT ....................................................................................................27
5.1. BM20 REFERENCE CIRCUIT ................................................................................27
5.2. BM23 REFERENCE CIRCUIT ....................................................................................28
6. MODULE OUTLINE AND REFLOW PROFILE ............................................................29
7. PACKAGING AND STORAGE INFORMATION ..........................................................34
APPENDIX A: CERTIFICATION NOTICES ..........................................................................36
A.1 REGULATORY APPROVAL .......................................................................................36
A.2 United States .................................................................................................................36
A.2.1 LABELING AND USER INFORMATION REQUIREMENTS .............................37
A.2.2 RF EXPOSURE .............................................................................................................38
A.2.3 HELPFUL WEB SITES ...................................................................................................38
A.3 Canada ...........................................................................................................................39
A.3.1 LABELING AND USER INFORMATION REQUIREMENTS .............................................39
A.3.2 RF EXPOSURE.............................................................................................................40
A.3.3 WEB SITES .................................................................................................................40
A.4 Europe ............................................................................................................................40
A.4.1 ABELING AND USER INFORMATION REQUIREMENTS ...............................41
A.4.2 ANTENNA REQUIREMENTS ...............................................................................41
A.4.3 HELPFUL WEB SITES ...........................................................................................42
A.5 Japan ..............................................................................................................................43
A.5.1 LABELING AND USER INFORMATION REQUIREMENTS .............................43
A.5.2 HELPFUL WEB SITES ...........................................................................................44
A.6 Korea ..............................................................................................................................44
A.6.1 LABELING AND USER INFORMATION REQUIREMENTS .............................44
A.6.2 HELPFUL WEB SITES ...........................................................................................44
A.7 Taiwan ............................................................................................................................45
A.7.1 LABELING AND USER INFORMATION REQUIREMENTS .............................45
A.7.2 HELPFUL WEB SITES ...........................................................................................45

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A.8 China .............................................................................................................................46
A.8.1 LABELING AND USER INFORMATION REQUIREMENTS .............................46
A.9 Other Regulatory Jurisdictions ..................................................................................46

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TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your
Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications
will be refined and enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications
Department via E-mail at docerrors@microchip.com. We welcome your feedback.

Most Current Data Sheet

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http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for
current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will
specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number)
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Abbreviations List:
HFP: Hands-free Profile
AVRCP: Audio Video Remote Control Profile
A2DP: Advanced Audio Distribution Profile
PBAP: Phone Book Access Profile
HSP: Headset Profile
SPP: Serial Port Profile

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1. DEVICE OVERVIEW
The stereo module series include BM20 and BM23. The chip integrates Bluetooth 4.1 radio
transceiver, PMU and DSP. Figure 1-1and 1-2 shows the application block diagram.

FIGURE 1‐1: BM20 Typical Application

The following depicts an example of BM20 module operate as an independent system or connected
to an MCU.

Audio Output

16M Hz
IS2020S
Crystal
Microphone
I2C

EEPROM
IC UART MCU
Aux_In
BM20
Option

FIGURE 1‐2: BM23 Typical Application

The following depicts an example of BM23 module connected to an MCU, external DSP/CODEC.

16M Hz I2S DSP

IS2023S
Crystal
Microphone
I2C

EEPROM
IC UART MCU
Aux_In
BM23

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1.1. INTERFACE DESCRIPTION
BM20 pin diagram is shown in Figure 1-3. The pin descriptions are shown in Table 1-1

FIGURE 1-3: BM20 PIN DIAGRAM

TABLE 1‐1: BM20 PIN DESCRIPTION

Pin No. Pin type Name Description
IO pin, default pull-high input (Note 1)
1 I/O P0_0 1. Slide Switch Detector, active low.
2. UART TX_IND, active low.
Embedded ROM/External Flash enable
2 I EAN
H: Embedded; L: External Flash
IO pin, default pull-high input (Note 1)
3 I P3_0
Line-in Detector (default), active low.
IO pin, default pull-high input
4 I P2_0 System Configuration,
H: Application L: Baseband(IBDK Mode)
IO pin, default pull-high input (Note 1)
1. NFC detection pin, active low.
5 I/O P1_5 2. Out_Ind_0
3. Slide Switch Detector, active low.
4. Buzzer Signal Output
IO pin, default pull-high input. (Note 1)
6 I/O P0_4 1. NFC detection pin, active low.
2. Out_Ind_0
7 O SPKR R-channel analog headphone output
8 O AOHPM Headphone common mode output/sense input.

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Pin No. Pin type Name Description
9 O SPKL L-channel analog headphone output
Positive power supply/reference voltage for CODEC, no need to add power
10 P VDDA
to this pin.
11 I MIC1_P Mic 1 mono differential analog positive input
12 I MIC1_N Mic 1 mono differential analog negative input
13 P MIC_BIAS Electric microphone biasing voltage
14 I AIR R-channel single-ended analog inputs
15 I AIL L-channel single-ended analog inputs
16 I RST System Reset Pin, Low: reset
17 P VCC_RF 1.28V RF LDO output, no need to add power to this pin.
IO pin, default pull-high input (Note 1)
18 I/O P0_1 1. FWD key when class 2 RF (default), active low.
2. Class1 TX Control signal of external RF T/R switch, active high.
19 P VDD_IO Power output , no need to add power to this pin
20 P ADAP_IN 5V Power adaptor input
21 P BAT_IN 3.0V~4.2V Li-Ion battery input
22 - NC No Connection
23 P GND Ground Pin
System Power Output
24 P SYS_PWR BAT mode: 3.0~4.2V
Adapter mode: 4.0V
25 P BK_OUT 1.8V buck output, no need to add power to this pin
1. Power key when in off mode
26 I MFB
2. UART_RX_IND: MCU use to wakeup BT (Note 1)
27 I LED1 LED Driver 1
28 I LED2 LED Driver 2
IO pin, default pull-high input
29 I P2_4 System Configuration,
L: Boot Mode with P2_0 low combination
IO pin, default pull-high input (Note 1)
30 I P0_2
Play/Pause key (default), active low.
IO pin, default pull-high input (Note 1)
1. REV key (default), active low.
31 I/O P0_3 2. Buzzer Signal Output
3. Out_Ind_1
4. Class1 RX Control signal of external RF T/R switch, active high.
32 O HCI_TXD HCI-UART TX data
33 I HCI_RXD HCI-UART RX data
IO pin, default pull-high input (Note 1)
34 I P0_5
Volume down (default), active low.
IO pin, default pull-high input (Note 1)
35 I P2_7
Volume up key (default), active low.

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Pin No. Pin type Name Description
IO pin, default pull-high input
36 I P2_4 System Configuration,
L: Boot Mode with P2_0 low combination
37 P GND Ground Pin
38 - NC No Connection
39 - NC No Connection
40 - NC No Connection

* I: signal input pin

* O: signal output pin
* I/O: signal input/output pin
* P: power pin

Note 1: These button or functions can be setup by “IS20XXS_UI” tool.

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BM23 pin diagram is shown in Figure 1-4. The pin descriptions are shown in Table 1-2

FIGURE 1-4: BM23 PIN DIAGRAM

TABLE 1‐2: BM23 PIN DESCRIPTION

Pin No. Pin Type Name Description
IO pin, default pull-high input (Note 1)
1 I/O P0_0
UART TX_IND
2
2 I/O RFS0 I S interface: DAC Left/Right Clock
2
3 I/O TFS0 I S interface: ADC Left/Right Clock
2
4 I/O SLK0 I S interface: Bit Clock
2
5 I DR0 I S interface: DAC Digital Left/Right Data
2
6 O DT0 I S interface: ADC Digital Left/Right Data
7 I/O P0_4 IO pin, default pull-high input
Embedded ROM/External Flash enable
8 I EAN High: ROM mode;
Low: External Flash mode
9 I MIC1_P Mic 1 mono differential analog positive input
10 I MIC1_N Mic 1 mono differential analog negative input
11 P MIC_BIAS Power output, microphone biasing voltage
12 P VDDA Power output, reserve for external cap to fine tune audio frequency
13 I AIR response, no need
Stereo analog to R-channel
line in, add power to this pin
14 I AIL Stereo analog line in, L-channel

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Pin No. I/O Name Description
15 P GND Ground
16 I RST_N System Reset Pin, active when rising edge.
17 -- NC --
18 -- NC --
19 P VDDIO Power output, VDDIO pin, no need to add power to this pin
20 I/O P1_5 IO pin, default pull-high input
21 I/O P0_1 IO pin, default pull-high input
22 P ADAP_IN 5V power adaptor input
23 P BAT_IN 3.3~4.2V Li-ion battery input
24 -- NC --
System Power Output
25 P SYS_PWR BAT mode: 3.3~4.2V
Adapter mode: 4.0V
26 P BK_OUT Power output, 1v8 pin, no need to add power to this pin
1. Power key when in off mode
27 P MFB
2. UART_RX_IND: MCU use to wakeup BT
28 P LED1 LED Driver 1, 4mA max
29 P LED2 LED Driver 2, 4mA max
IO pin, default pull-high input
30 I P2_4 System Configuration,
L: Boot Mode with P2_0 low combination
31 I/O P0_2 IO pin, default pull-high input
32 I/O P0_3 IO pin, default pull-high input
33 O HCI_TXD HCI-UART TX data
34 I HCI_RXD HCI-UART RX data
35 I/O P0_5 IO pin, default pull-high input
36 I/O P2_7 IO pin, default pull-high input
37 I/O P2_0 IO pin, default pull-high input
38 I/O P3_0 IO pin, default pull-high input
IO pin, default pull-high input
39 I P2_0 System Configuration,
H: Application L: Baseband(IBDK Mode)
40 P GND Ground.
41 -- NC --
42 -- NC --
43 -- NC --

* I: signal input pin

* O: signal output pin
* I/O: signal input/output pin
* P: power pin

Note 1: These button or functions can be setup by “IS20XXS_UI” tool.

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2. APPLICATION INFORMATION
2.1. OPERATION WITH EXTERNAL MCU
Stereo module support UART command set to make an external MCU to control module.
Here is the connection interface between BMXX and MCU.

FIGURE 2-1: INTERFACE BETWEEN MCU AND BMXX MODULE

MCU_
P0_0
WAKEUP

UART interface
UART_RX HCI_TXD
MCU BMXX
UART interface
UART_TX HCI_RXD

BT_
MFB
WAKEUP

MCU can control module by UART interface and wakeup module by PWR pin. Stereo module
provide wakeup MCU function by connect to P0_0 pin of module.

“UART Command Set” document provide all function which module support and UI tool will help
you to set up your system support UART command.

For more detail description, please reference “UART_CommandSet_v154” document and

“IS20XXS_UI” tool.

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Here are some suggestions of UART control signal timing sequence:
FIGURE 2-2: POWER ON/OFF SEQUENCE

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FIGURE 2-3: TIMING SEQUENCE OF RX INDICATION AFTER POWER ON

FIGURE 2-4: TIMING SEQUENCE OF POWER OFF

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FIGURE 2-5: TIMING SEQUENCE OF POWER ON (NACK)

FIGURE 2-6: RESET TIMING SEQUENCE IF MODULE HANGS UP

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FIGURE 2-7: TIMING SEQUENCE OF POWER DROP PROTECTION

Power

2.9V ~
BAT_IN +4V

RST_N from Reset IC

If BT’s BAT use adaptor translates voltage by LDO, we recommend use “Reset IC” to avoid power
off suddenly. Rest IC spec output pin must be “Open Drain”、delay time ≦ 10ms
Recommend part: TCM809SVNB713 or G691L263T73

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2.2. I2S Signal Application for BM23
2
BM23 support I S digital audio signal interface to connect your external CODEC/DSP. It provide 8k
2
Hz, 44.1k Hz and 48k Hz sampling rate; it also support 16 bits and 24bits data format. The I S setting
can be set up by UI and DSP tools.
.
The external CODEC/DSP needs to be connected to SLK0, RFS0, TFS0, DR0, and DT0 (pins 4, 2, 3,
2
5, and 6 respectively). The I S signal connection between BM23 and external DSP as below:

FIGURE 2-9: MASTER MODE REFERENCE CONNECTION

BCLK SCLK0

DACLRC RFS0

EXTERNAL
DSP/CODEC
TFS0 BM23

ADCDAT DR0

DACDAT DT0

FIGURE 2-10: SLAVE MODE REFERENCE CONNECTION

BCLK SCLK0

DACLRC RFS0

EXTERNAL (*1)
DSP/CODEC
TFS0 BM23
(*2)
ADCDAT DR0

DACDAT DT0

Note 1: For 002 version chip or module, system should connect line 1 in slave mode figure.
And, system not support ADC signal from external DSP/CODEC.
Note 2: For other version chip or module, system should connect line 2 in slave mode figure.

About “Mast” or “Slave” mode setting, you can use “DSP Configuration Tool” to set up system.

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The clock and data timing as below:
2
FIGURE 2-11: TIMING FOR I S MODES (both master and slave)

1/fs

SCLKn

RFSn/TFSn Left Channel Right Channel

DRn/DTn
Bn-1 Bn-2 B1 B0 Bn-1 Bn-2 B1 B0

Word Length

FIGURE 2-12: TIMING FOR PCM MODES (both master and slave)

1/fs

SCLK0

RFS0/TFS0

Left Channel Right Channel

DR0/DT0
Bn-1 Bn-2 B1 B0 Bn-1 Bn-2 B1 B0

Word Length

2.3. RESET (RST_N)

RST is module reset pin which is active LOW. To reset the module, the RST_N must hold LOW for at
least 63ns.

2.4. STATUS LED (LED1, LED2)

The status LED provide below status indication:
 Standby
 Inquiry
 Link
 Link Back
 Low Battery
 Page
 Battery Charging
Each status indication LED flashing sequence and brightness is configurable by UI tool.

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2.5. EXTERNAL CONFIGURATION
Stereo module can be configured and firmware programmed using an external configuration and
programming tool available from Microchip. Figure 2‐7 shows the configuration and firmware
programming interface on BM23. It is recommended to include a pin header on the main PCB for
development.

Configuration and firmware programming modes are entered accordingly to the system
configuration I/O pins as shown in Table 2-1. Pin P20, P24 and EAN pin have internal pull‐up.

FIGURE 2-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS

(Here is the interface connect example of the BM23)

TABLE 2-1: SYSTEM CONFIGURATION SETTINGS

P20 P24 EAN Operational Mode
High High High APP mode (Normal operation)
Low High High Test mode (Write EEPROM)
Low Low High Write Flash (Firmware programming if flash build-in in chip)

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3. ELECTRICAL CHARACTERISTICS
Table 3-1: ABSOLUTE MAXIMUM SPECIFICATION
Symbol Parameter Min Max Unit
BAT_IN Input voltage for battery 0 4.3 V
ADAP_IN Input voltage for adaptor 0 7.0 V
TSTORE Storage temperature -65 +150 ºC
TOPERATION Operation temperature -20 +70 ºC

Table 3-2: RECOMMENDED OPERATING CONDITION

Symbol Parameter Min Typical Max Unit
BAT_IN Input voltage for battery 3 3.7 4.2 V
ADAP_IN Input voltage for adaptor 4.5 5 5.5 V
TOPERATION Operation temperature -20 +25 +70 ºC
Note:
Absolute and Recommended operating condition tables reflect typical usage for device.

TABLE 3-3: I/O AND RESET LEVEL

Parameter Min. Typ. Max. Units
I/O Supply Voltage (VDD_IO) 2.7 3.0 3.3 V
I/O Voltage Levels
VIL input logic levels low ‐0.3 0.8 V
VIH input logic levels high 2.0 3.6 V
VOL output logic levels low 0.4 V
VOH output logic levels high 2.4 V
RESET
VTH,RES threshold voltage 1.6 V
Note:
(1) VDD_IO voltage is programmable by EEPROM parameters.
(2) These parameters are characterized but not tested in manufacturing.

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Table 3-4: BATTERY CHARGER
Parameter Min Typical Max Unit
ADAP_IN Input Voltage 4.5 5.0 5.5 V
Supply current to charger only 3 4.5 mA
Headroom > 0.7V
Maximum Battery 170 200 240 mA
(ADAP_IN=5V)
Fast Charge Current
Note: ENX2=0 Headroom = 0.3V
160 180 240 mA
(ADAP_IN=4.5V)
Headroom > 0.7V
Maximum Battery 330 350 420 mA
(ADAP_IN=5V)
Fast Charge Current
Note: ENX2=1 Headroom = 0.3V
180 220 270 mA
(ADAP_IN=4.5V)
Trickle Charge Voltage Threshold 3 V
Battery Charge Termination Current,
10 %
(% of Fast Charge Current)
Note:
(1) Headroom = VADAP_IN – VBAT
(2) ENX2 is not allowed to be enabled when VADAP_IN – VBAT > 2V
(3) These parameters are characterized but not tested in manufacturing.

Table 3-5: LED DRIVER

Parameter Min Typical Max Unit
Open-drain Voltage 3.6 V
Programmable Current Range 0 5.25 mA
Intensity Control 16 step
Current Step 0.35 mA
Power Down Open-drain Current 1 μA
Shutdown Current 1 μA
Note:
(1) Test condition: SAR_VDD=1.8V, temperature=25 ºC.
(2) These parameters are characterized but not tested in manufacturing.

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Table 3-6: AUDIO CODEC ANALOGUE TO DIGITAL CONVERTER
T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz
Parameter (Condition) Min. Typ. Max. Unit
Resolution 16 Bits
Output Sample Rate 8 48 KHz
Signal to Noise Ratio Note: 1
88 dB
(SNR @MIC or Line-in mode)
Digital Gain -54 4.85 dB
Digital Gain Resolution 2~6 dB
MIC Boost Gain 20 dB

Analog Gain 60 dB
Analog Gain Resolution 2.0 dB
mV
Input full-scale at maximum gain (differential) 4
rms
mV
Input full-scale at minimum gain (differential) 800
rms
3dB bandwidth 20 KHz
Microphone mode (input impedance) 24 KΩ
THD+N (microphone input) @30mVrms input 0.02 %
Note:
(1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 1%, 150mVpp input
(2) These parameters are characterized but not tested in manufacturing.

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Table 3-7: AUDIO CODEC DIGITAL TO ANALOGUE CONVERTER
T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz
Parameter (Condition) Min. Typ. Max. Unit
Over-sampling rate 128 fs
Resolution 16 20 Bits
Output Sample Rate 8 48 KHz
Signal to Noise Ratio Note: 1
96 dB
(SNR @cap-less mode) for 48kHz
Signal to Noise Ratio Note: 1
98 dB
(SNR @single-end mode) for 48kHz
Digital Gain -54 4.85 dB
Digital Gain Resolution 2~6 dB
Analog Gain -28 3 dB
Analog Gain Resolution 1 dB

Output Voltage Full-scale Swing (AVDD=2.8V) Note:3 742.5 mV rms

Maximum Output Power (16Ω load) 34.5 mW

Maximum Output Power (32Ω load) 17.2 mW
Resistive 8 16 O.C. Ω
Allowed Load
Capacitive 500 pF
THD+N (16Ω load) 0.05 %
Signal to Noise Ratio (SNR @ 16Ωload) 96 dB
Note:
(1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load=100KΩ
(2) These parameters are characterized but not tested in manufacturing.
(3) Vdd, AVDD are generated by internal LDO

Table 3-8: TRANSMITTER SECTION FOR BDR AND EDR

Bluetooth
Parameter Min Typ Max Unit
specification
Maximum RF transmit
-6 to 4 dBm
power(BM20)
Maximum RF transmit
2 -6 to 4
power(BM23)
EDR/BDR
-4 -1.2 1 -4 to 1 dB
Relative transmit power
Note:
The RF Transmit power is calibrated during production using MP Tool software and MT8852 Bluetooth Test
equipment.
Test condition: VCC_RF= 1.28V, temperature=25 ºC.

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Table 3-9: RECEIVER SECTION FOR BDR AND EDR

Bluetooth
Modulation Min Typ Max Unit
specification
Sensitivity at
GFSK -90 ≤-70 dBm
0.1% BER
π/4 DQPSK -91 ≤-70 dBm
Sensitivity at
0.01% BER 8DPSK -82 ≤-70 dBm
Note:
(1) Test condition: VCC_RF= 1.28V, temperature=25 ºC.
(2) These parameters are characterized but not tested in manufacturing.

Table 3-10: SYSTEM CURRENT CONSUMPTION OF ANALOG AUDIO OUTPUT

System Status Typ. Max. Unit

System Off Mode 2 5 uA

Standby Mode 0.8 mA
Linked Mode 0.4 mA
SCO Link 7.8 mA
A2DP Link (V p-p=200mV; 1k tone signal) 10.7 mA
Note: Use BM20 EVB as test platform.
Test condition: BAT_IN= 3.8V, link with HTC EYE cell phone; distance between cell phone and EVB: 30cm.

2
Table 3-11: SYSTEM CURRENT CONSUMPTION OF DIGITAL AUDIO OUTPUT(I S)
System Status Typ. Max. Unit

System Off Mode 2 5 uA

Standby Mode 0.4 mA
Linked Mode 0.4 mA
SCO Link 9.3 mA
A2DP Link (1k tone signal) 11.7 mA
Note: Use BM23 EVB as test platform
Test condition: BAT_IN= 3.8V, link with HTC M8 cell phone; distance between cell phone and EVB: 30cm;
2
I S signal link with YAMAHA YDA174 EVB

 2015 Microchip Technology Inc. Preliminary Edition Page 24

 Stereo Module
4. PRINTED ANTENNA INFORMATION
4.1. MODULE RADIATION PATTERN
The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is
shown in Figure 4-2.

FIGURE 4-1: ANTENNA KEEP OUT AREA EXAMPLES

FIGURE 4-2: ANTENNA 3D RADIATION PATTERN @2441 MHz

 2015 Microchip Technology Inc. Preliminary Edition Page 25

 Stereo Module
4.2. MODULE PLACEMENT RULE
On the main PCB, the areas under the antenna should not contain any top, inner layer, or
bottom copper as shown in Figure 4‐1. A low‐impedance ground plane will ensure the best radio
performance (best range, lowest noise). The ground plane can be extended beyond the minimum
recommended as need for the main PCB EMC noise reduction. For the best range performance,
keep all external metal away from the ceramic chip antenna at least 15 mm.

Here are some examples of good and poor placement on a carrier board with GND plane.

FIGURE 4-3: MODULE PLACEMENT EXAMPLES

Good Case
Poor Case

Acceptable Case

Worse Case
System GND Plane

FIGURE 4-4: GND PLANE ON MAIN APPLICATION BOARD

 2015 Microchip Technology Inc. Preliminary Edition Page 26

 RESET
PCB1 BUTTON
BM20
MFB
Stereo 3 4 1 2 RST_N
38 SYS_PWR

2
Jack 39 ANT1 1 2 MFB 3 4
C92 40 ANT2 DP1

1
P7 NP-0603 ANT3 SW1 SW2 DP-4
PJ-2001-5K SW-TACT R1 SW-TACT
3 1
3 SPKL 1K/1%
5 P0_0 1 37 Q1
4 EAN 2 P0_0 GND 36 P2_4 C3

2
2 SPKR P3_0 3 EAN P2_4 35 P2_7 1u/16V MMBT3904
1 AOHPM P2_0 4 P3_0 P2_7 34 P0_5
1
2

5 P2_0 P0_5 33 5V
C93 AMP_EN HCI_RXD
1

NP-0603 JP6 1 NFC 6 P1_5 HCI_RXD 32 HCI_TXD

SPKR 7 P0_4 HCI_TXD 31 P0_3
PLAY/PAUSE P0_2
JP 1x1 R2
AOHPM 8 SPKR P0_3 30 P0_2 2K
SPKL 9 AOHPM P0_2 29 P2_4 SW3
10 SPKL P2_4 28 LED2 4 3 C4
2

MIC_P1 11 VDDA LED2 27 LED1 15p/50V

MIC_N1 12 MIC1_P LED1 26 MFB 2 1

 2015 Microchip Technology Inc.

C13 C72 MIC_BIAS13 MIC1_N MFB 25 Backup Plug-In Reset Circuit
R3 2.2u/6.3V 2.2u/6.3V AIR 14 MIC_BIAS BK_OUT 24 SW-TACT
1K AIR SYS_PWR SYS_PWR
1 2 1 2 MIC_BIAS C9
5. REFERENCE CIRCUIT

1u/16V
R75 REV P0_3 FWD P0_1

AIL
RST
VCC_RF
P0_1
VDD_IO
ADAP_IN
BAT_IN
NC
GND
P1 MIC_P1 1K
PJ-2001-5K SW4 SW5

15
16
17
18
19
20
21
22
23
3 C10 4 3 C7 4 3 C8
5 1u/16V 15p/50V 15p/50V
4 2 1 2 1
MIC1 2

AIL
RST_N
P0_1
1 C14 SW-TACT SW-TACT
1u/16V
MIC_N1
P0_5 P2_7

5V
VOL- VOL+

BAT_IN
5.1. BM20 REFERENCE CIRCUIT

VDD_IO
1 2 SW6 SW7
4 3 C11 4 3 C12
R4 15p/50V 15p/50V
2K 2 1 2 1

SW-TACT SW-TACT

R5
NP-0603
C15 R6
TSH-3865D 0.1u/16V 0
P2 1 2 AIL
4 P3_0
2 LINE_L C16 LED-B LED1 UART CONTROL RESERVE For
LINE 10 1u/16V LED1 2 1
INPUT 3
(by MCU) BLUETOOTH DEBUG
LINE_R

Preliminary Edition
C17 JP2 JP3
1 1u/16V
1 2 AIR LED-HR LED2 1 P2_0 1
LED2 2 1 SYS_PWR 2 2
3 BAT_IN 3
R7 UART_RXD HCI_RXD EAN
0 UART_TXD HCI_TXD 4 4
5 5V 5
R8 RESET_n RST_N HCI_RXD
NP-0603 Audio AMP Enable AMP_EN 6 HCI_TXD 6
MFB/RX_IND MFB 7 7
TX_IND P0_0 8 P2_4 8

JP 1x8 JP 1x8

Slide Switch Circuit

Q3

7
6
P3 STS2301

2
Li Battery BAT_IN S2
USBM3121-051-1-BN-R SW8
1 Connector R10 SW-1BIT
VBUS 2 5V 2
MFB 3 SLIDE_SW 1
ON

100K SYS_PWR
D- 3 1 1
D+ 4 2 D G
C18 1
ID 5 5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
10u/16V Q4
GND 2
C19 Hsinchu City 30078, Taiwan
JP5 10u/16V 3 P0_0 TEL. 886-3-5778385
1

JP 1x2 1

8
9
Board Name P/N
C26 R12 STS2306 R13 BM20 Reference Circuit XXXX
1u/10V 100K 10K
1 2 Title Rev
2

VDD_IO Size
B MAIN CIRCUIT 1.1

Date: Thursday , April 16, 2015 Sheet 1 of 1

Page 27
Stereo Module
 I2S INTERFACE
R2 33
R3 33 JP1 UART CONTROL
R1 33
R5 33 1 (by MCU)
R4 33 2 JP2
3
PCB1 RFS0 1 2 4 1
Receive frame synchronization
FP-BM23 Transmit frame synchronization TFS0 1 2 5 2
Serial clock SLK0 1 2 6 UART_RXD HCI_RXD 3
Serial data receive DR0 1 2 7 UART_TXD HCI_TXD 4
Serial data transmit DT0 1 2 8 RESET_n RST_N 5
Audio AMP Enable AMP_EN 6
MFB/RX_IND MFB 7
JP 1x8 TX_IND P0_0 8
P0_0 1 40
RFS0 2 P0_0 GND 39 P2_0
TFS0 3 RFS0 P2_0 38 P3_0 P0_4 1 2 JP 1x8
SLK0 4 TFS0 P3_0 37
DR0 5 SLK0 P2_0 36 C1 DP1 DP-4

 2015 Microchip Technology Inc.

DT0 6 DR0 P2_7 35 MIC INPUT 2.2u/6.3V C2
P0_4 7 DT0 P0_5 34 HCI_RXD R6 1K R7 1K 2.2u/6.3V
EAN 8 P0_4 HCI_RXD 33 HCI_TXD 1 2 1 2
MIC_P1 9 EAN HCI_TXD 32 MIC_BIAS
CODEC_VO MIC_N1 10 MIC1_P P0_3 31 C3 0.047u/25V
11 MIC1_N P0_2 30 P2_4 MIC_P1
MIC_BIAS 12 MIC_BIAS P2_4 29 1
LED2 TP1
AIR 13 VDDA LED2 28 LED1 TP-4
AIL 14 AIR LED1 27 MFB C4
15 AIL MFB 26 TP2 220p/50V RESERVE For
C5 GND BK_OUT TP-4 TP3 1 C6 0.047u/25V

1
10u/16V TP-4 MIC_N1 BLUETOOTH DEBUG
5.2. BM23 REFERENCE CIRCUIT

R8 2K
1 2 JP3
MIC_BIAS

RST
NC
NC
VDD_IO
P1_5
P0_1
ADAP_IN
BAT_IN
AMB_DET
SYS_PWR
P2_0 1
2
BAT_IN

16
17
18
19
20
21
22
23
24
25
EAN 3
C7 RST_N SYS_PWR 4
ADAP_IN 5
4.7u/10V HCI_RXD
TP4 1 HCI_TXD 6
BAT_IN 7
TP-4 ADAP_IN
P2_4 8

JP 1x8

STEREO AUX LINE INPUT

Preliminary Edition
GPIO Description
LED
2
SYS_PWR D1
1

LED1 LED-B
P0_0 UART_TX_IND(Flash)
LED1 2 1 SPE0572 R9 C8
BLUE *P30 Low Active
10K 470p/50V P0_4 Audio AMP Enable(ROM)
LED2 LED-HR C13 Line In Detect R10 C9
LED2 2 1 0.1u/16V 1 1K 10u/16V
1
2

RED 3 1 2 AIR
P2_0 System Configuration
4 1 2 AIL
2 P3_0
P2_4 System Configuration
2
1

R11 C10
2

P1 D3 1K R12 10u/16V P3_0 LINE IN Detection

PJ-3894D-S125 C11 10K C12
D2 0.1u/16V SPE0572 470p/50V
DC POWER SOURCE BATTERY CONNECTOR SPE0572
2

MFB PWR/MFB/UART_RX_IND
BAT_IN
1

P2 DC-JACK ADAP_IN EAN System Configuration

1

2 C16 C17 5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
C20 C18 0.1u/16V 1u/16V Hsinchu City 30078, Taiwan

2
1
3 0.1u/16V 1u/16V TEL. 886-3-5778385
4 3
Board Name P/N
JP4 SJP 1x2 Reference Circuit of BM23 XXXX

Size Title Rev

B Reference Circuit of BM23 1.0

Date: Friday , March 13, 2015 Sheet 2 of 2

Page 28
Stereo Module
 Stereo Module
6. MODULE OUTLINE AND REFLOW PROFILE
6.1. MODULE DIMENSION AND PCB FOOT PRINT

FIGURE 6-1: BM20 Outline Dimension

PCB dimension:
X : 15.0 mm
Y : 29.0 mm
Tolerances: 0.25 mm

 2015 Microchip Technology Inc. Preliminary Edition Page 29

 Stereo Module
FIGURE 6-2: BM23 Outline Dimension

PCB dimension:
X : 15.0 mm
Y : 29.0 mm
Tolerances: 0.25 mm

 2015 Microchip Technology Inc. Preliminary Edition Page 30

 Stereo Module
FIGURE 6-3: BM20 PCB FOOT PRINT

Note: The “Keep Out Area” is reserved for RF performance check.

 2015 Microchip Technology Inc. Preliminary Edition Page 31

 Stereo Module
FIGURE 6-4: BM23 PCB FOOT PRINT

Note: The “Keep Out Area” is reserved for RF performance check.

 2015 Microchip Technology Inc. Preliminary Edition Page 32

 Stereo Module
6.2 REFLOW PROFILE
FIGURE 6-5: REFLOW PROFILE

peak: 260 +5/-0℃

Slope: 1~2℃/sec max.
(217℃ to peak)

Ramp down rate :

217℃ Max. 3℃/sec.

Preheat: 150~200℃

20~40 sec.

60 ~ 180 sec. 60 ~150sec

Time (sec)
25℃

Soldering Recommendations
Stereo module was assembled using standard lead‐free reflow profile IPC/JEDEC J‐STD‐020. The
module can be soldered to the main PCB using standard leaded and lead‐free solder reflow
profiles. To avoid damaging of the module, the recommendations are listed as follows:
• Refer to Microchip Technology Application Note AN233 Solder Reflow
Recommendation (DS00233) for the soldering reflow recommendations
• Do not exceed peak temperature (TP) of 250 degree C
• Refer to the solder paste data sheet for specific reflow profile recommendations
• Use no‐clean flux solder paste
• Do not wash as moisture can be trapped under the shield
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

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 Stereo Module
7. PACKAGING AND STORAGE INFORMATION
The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format.
These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a
3
dimension of 36 * 16 * 9.5 cm .
The shelf life of each module in a sealed bag is 12 months at <40°C and <90% relative humidity.
After a bag is opened, devices that will be subjected to reflow solder or other high temperature
processes must be mounted within 168 hours (7 days) at factory conditions of <30°C and <60% relative
humidity.

7.1. ORDERING INFORMATION

 2015 Microchip Technology Inc. Preliminary Edition Page 34

 Stereo Module
TABLE 7-1: Module Ordering Information

Part Number Description

BM20SPKS1NBC Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module

with integrated antenna and shield

BM23SPKS1NB9 Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module

with integrated antenna and shield

Note: The module can only be purchased through a Microchip representative.

Go to http://www.microchip.com/ for current pricing and a list of distributors carrying
Microchip products.

 2015 Microchip Technology Inc. Preliminary Edition Page 35

 Stereo Module
APPENDIX A: CERTIFICATION NOTICES
BM20 module (BM20SPKS1NBC) has received the regulatory approval for the following:
 BT SIG/QDID: 58996
 United States: FCC ID: A8TBM20SPKXYNBZ
 Canada
o IC ID: 12246A-BM20SPKS1
o HVIN: BM20SPKS1
 Europe/CE
 Japan/MIC: 202-SMD048
 Korea/KCC: MSIP-CRM-mcp-BM20SPKS1NBC
 Taiwan/NCC No.: CCAN15LP0460T2
 China/SRRC: CMIIT ID: 2015DJ7134

BM23 module (BM23SPKS1NB9) has received the regulatory approval for the following:
 BT SIG/QDID: 58996
 United States/ FCC ID: A8TBM23SPKXYC2A
 Canada
o IC ID: 12246A-BM23SPKXYC2
o HVIN: BM23SPKXY
 Europe/CE
 Japan/MIC: 202-SMC067
 Korea/KCC: MSIP-CRM-S9S-BM23SPKXY
 Taiwan
o NCC No.: CCAL15LP0270T3
o M/N: BM23SPK
 China/SRRC: CMIIT ID: 2016DJ3553

A.1 REGULATORY APPROVAL

This section outlines the regulatory information for the BM20/BM23 module for the following
countries:
 United States
 Canada
 Europe
 Japan
 Korea
 Taiwan
 China
 Other Regulatory Jurisdictions

A.2 United States

The BM20/BM23 module has received Federal Communications Commission (FCC)
CFR47 Telecommunications, Part 15 Subpart C "Intentional Radiators" modular approval in
accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the
end user to integrate the BM20/BM23 module into a finished product without obtaining
subsequent and separate FCC approvals for intentional radiation, provided no changes or
modifications are made to the module circuitry. Changes or modifications could void the
user's authority to operate the equipment. The end user must comply with all of the

 2015 Microchip Technology Inc. Preliminary Edition Page 36

 Stereo Module
instructions provided by the Grantee, which indicate installation and/or operating conditions
necessary for compliance.
The finished product is required to comply with all applicable FCC equipment
authorizations regulations, requirements and equipment functions not associated with the
transmitter module portion. For example, compliance must be demonstrated to regulations
for other transmitter components within the host product; to requirements for unintentional
radiators (Part 15 Subpart B “Unintentional Radiators”), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional authorization requirements for the non‐
transmitter functions on the transmitter module (i.e., Verification, or Declaration of
Conformity) (e.g., transmitter modules may also contain digital logic functions) as
appropriate.

A.2.1 LABELING AND USER INFORMATION REQUIREMENTS

The BM20/BM23 module has been labeled with its own FCC ID number, and if the FCC ID is
not visible when the module is installed inside another device, then the outside of the
finished product into which the module is installed must also display a label referring to the
enclosed module. This exterior label can use wording as follows:
For BM20 Module:

Contains Transmitter Module FCC ID:

A8TBM20SPKXYNBZ
or
Contains FCC ID:
A8TBM20SPKXYNBZ

This device complies with Part 15 of the FCC Rules. Operation

is subject to the following two conditions: (1) this device may
not cause harmful interference, and (2) this device must accept
any interference received, including interference that may
cause undesired operation

For BM23 Module:

Contains Transmitter Module FCC ID:

A8TBM23SPKXYC2A
or
Contains FCC ID:
A8TBM23SPKXYC2A

This device complies with Part 15 of the FCC Rules. Operation

is subject to the following two conditions: (1) this device may
not cause harmful interference, and (2) this device must accept
any interference received, including interference that may
cause undesired operation

A user’s manual for the finished product should include the following statement:

 2015 Microchip Technology Inc. Preliminary Edition Page 37

 Stereo Module
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy, and if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from
that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Additional information on labeling and user information requirements for Part 15 devices can be
found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET)
Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm.

A.2.2 RF EXPOSURE
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498
General RF Exposure Guidance provides guidance in determining whether proposed or existing
transmitting facilities, operations or devices comply with limits for human exposure to Radio
Frequency (RF) fields adopted by the Federal Communications Commission (FCC).

From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is
sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is
restricted for use with the specific antenna(s) tested in this application for Certification and must
not be co‐located or operating in conjunction with any other antenna or transmitters within a host
device, except in accordance with FCC multi‐transmitter product procedures.
A.2.3 HELPFUL WEB SITES

Federal Communications Commission (FCC): http://www.fcc.gov

FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm

 2015 Microchip Technology Inc. Preliminary Edition Page 38

 Stereo Module
A.3 Canada
The BM20/BM23 module has been certified for use in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS-247 and RSS-Gen. Modular approval permits the installation of a
module in a host device without the need to recertify the device.
A.3.1 LABELING AND USER INFORMATION REQUIREMENTS

Labeling Requirements for the Host Device (from Section 3.1, RSS-Gen, Issue 4, November 2014):
The host device shall be properly labeled to identify the module within the host device.
The Industry Canada certification label of a module shall be clearly visible at all times when installed in
the host device, otherwise the host device must be labeled to display the Industry Canada certification
number of the module, preceded by the words "Contains transmitter module", or the word
"Contains", or similar wording expressing the same meaning, as follows:
For BM20 Module:

Contains transmitter module IC: 12246A-BM20SPKS1

For BM23 Module:

Contains transmitter module IC: 12246A-BM23SPKXYC2

User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 4,
November 2014): User manuals for license-exempt radio apparatus shall contain the following or
equivalent notice in a conspicuous location in the user manual or alternatively on the device or
both:

This device complies with Industry Canada license‐exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause
undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter
tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.

Transmitter Antenna (from Section 7.1.2 RSS‐Gen, Issue 3, December 2010): User
manuals for transmitters shall display the following notice in a conspicuous location:

 2015 Microchip Technology Inc. Preliminary Edition Page 39

 Stereo Module
Under Industry Canada regulations, this radio transmitter may only operate using an
antenna of a type and maximum (or lesser) gain approved for the transmitter by
Industry Canada. To reduce potential radio interference to other users, the antenna
type and its gain should be so chosen that the equivalent isotropically radiated power
(e.i.r.p.) is not more than that necessary for successful communication.

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé
pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et
son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse
pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

The above notice may be affixed to the device instead of displayed in the user manual.
A.3.2 RF EXPOSURE
All transmitters regulated by IC must comply with RF exposure requirements listed in RSS‐102 ‐ Radio
Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands).

A.3.3 WEB SITES

Industry Canada: http://www.ic.gc.ca/

A.4 Europe
The BM20/BM23 module is an R&TTE Directive assessed radio module that is CE
marked and has been manufactured and tested with the intention of being integrated
into a final product.

The BM20/BM23 module has been tested to R&TTE Directive 1999/5/EC Essential
Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC)
(Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table A‐1/Table A-2:
European Compliance Testing. A Notified Body Opinion has also been issued.

The R&TTE Compliance Association provides guidance on modular devices in

document Technical Guidance Note 01 available at
http://www.rtteca.com/html/download_area.htm.
Note: To maintain conformance to the testing listed in Table A‐1/ Table A-2: European
Compliance Testing, the module shall be installed in accordance with the installation instructions
in this data sheet and shall not be modified.

When integrating a radio module into a completed product the integrator becomes the
manufacturerof the final product and is therefore responsible for demonstrating
compliance of the final product with the essential requirements of the R&TTE Directive.

 2015 Microchip Technology Inc. Preliminary Edition Page 40

 Stereo Module
A.4.1 ABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM23 module must follow CE
marking requirements. The R&TTE Compliance Association Technical Guidance Note 01
provides guidance on final product CE marking.

A.4.2 ANTENNA REQUIREMENTS

From R&TTE Compliance Association document Technical Guidance Note 01:
Provided the integrator installing an assessed radio module with an integral or specific
antenna and installed in conformance with the radio module manufacturer’s installation
instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and
does not require further involvement of an R&TTE Directive Notified Body for the final
product. [Section 2.2.4]

The European Compliance Testing listed in Table A‐1 and Table A-2 was performed
using the integral PCB antenna.

TABLE A‐1: EUROPEAN COMPLIANCE TESTING (BM20)

Certification Standards Article Laboratory Report Number
EN 60950-1:2006 / A11:2009 /
Safety 10050720 002
A1:2010 / A12:2011 / A2:2013
(3.1(a))
EN 300 328 V1.9.1 / EN
Health 10050932 002
62479:2010
TUV Rheinland,
EN 301 489-1 V1.9.2 Taiwan 10050691 002
EMC (3.1(b))
EN 301 489-17 V2.2.1
Radio EN 300 328 V1.9.1 (3.2) 10050932 002
Notified Body
Opinion 10048933 001

TABLE A‐2: EUROPEAN COMPLIANCE TESTING (BM23)

Certification Standards Article Laboratory Report Number
EN 60950-1:2006 / A11:2009 /
Safety 10047732 001
A1:2010 / A12:2011
(3.1(a))
EN 300 328 V1.9.1 / EN 10048076 001 &
Health
62479:2010 10048076 002
TUV Rheinland,
EN 301 489-1 V1.9.2 10047659 001
EMC (3.1(b)) Taiwan
EN 301 489-17 V2.2.1
10048076 001 &
Radio EN 300 328 V1.9.1 (3.2)
10048076 002
Notified Body
Opinion 10048934 001

 2015 Microchip Technology Inc. Preliminary Edition Page 41

 Stereo Module
A.4.3 HELPFUL WEB SITES
A document that can be used as a starting point in understanding the use of Short Range
Devices (SRD) in Europe is the European Radio Communications Committee (ERC)
Recommendation 70-03 E, which can be downloaded from the European Radio
Communications Office (ERO) at: http://www.ero.dk/.

Additional helpful web sites are:

• Radio and Telecommunications Terminal Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm

• European Conference of Postal and Telecommunications Administrations (CEPT):

http://www.cept.org

• European Telecommunications Standards Institute (ETSI):

http://www.etsi.org

• European Radio Communications Office (ERO):

http://www.ero.dk

• The Radio and Telecommunications Terminal Equipment Compliance Association

(R&TTE CA):
http://www.rtteca.com/

 2015 Microchip Technology Inc. Preliminary Edition Page 42

 Stereo Module
A.5 Japan
The BM20/BM23 module has received type certification and is labeled with its own
technical conformity mark and certification number as required to conform to the technical
standards regulated by the Ministry of Internal Affairs and Communications (MIC) of
Japan pursuant to the Radio Act of Japan.

Integration of this module into a final product does not require additional radio certification
provided installation instructions are followed and no modifications of the module are
allowed. Additional testing may be required:

• If the host product is subject to electrical appliance safety (for example, powered
from an AC mains), the host product may require Product Safety Electrical
Appliance and Material (PSE) testing. The integrator should contact their
conformance laboratory to determine if this testing is required.
• There is an voluntary Electromagnetic Compatibility (EMC) test for the
host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html

A.5.1 LABELING AND USER INFORMATION REQUIREMENTS

The label on the final product which contains the BM20/BM23 module must follow
Japan marking requirements. The integrator of the module should refer to the
labeling requirements for Japan available at the Ministry of Internal Affairs and
Communications (MIC) website.

The BM20/BM23 module is labeled with its own technical conformity mark and certification
number. The final product in which this module is being used must have a label referring to
the type certified module inside:

For BM20 Module:

Contains transmitter module with certificate number:

For BM23 Module:

Contains transmitter module with certificate number:

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 Stereo Module
A.5.2 HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/

A.6 Korea
The BM20/ BM23 module has received certification of conformity in accordance with the
Radio Waves Act. Integration of this module into a final product does not require additional
radio certification provided installation instructions are followed and no modifications of the
module are allowed.

A.6.1 LABELING AND USER INFORMATION REQUIREMENTS

The label on the final product which contains the BM20/ BM23 module must follow KC
marking requirements.
The integrator of the module should refer to the labeling requirements for Korea available on
the Korea Communications Commission (KCC) website.

The BM20/ BM23 module is labeled with its own KC mark. The final product requires the
KC mark and certificate number of the module:

For BM20 Module:

MSIP-CRM-mcp-BM20SPKS1NBC

For BM23 Module:

MSIP-CRM-S9S-BM23SPKXY

A.6.2 HELPFUL WEB SITES

Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research
Agency (RRA): http://rra.go.kr

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 Stereo Module
A.7 Taiwan
The BM20/BM23 module has received compliance approval in accordance with the
Telecommunications Act. Customers seeking to use the compliance approval in their product
should contact Microchip Technology sales or distribution partners to obtain a Letter of
Authority.

Integration of this module into a final product does not require additional radio certification
provided installation instructions are followed and no modifications of the module are
allowed.

A.7.1 LABELING AND USER INFORMATION REQUIREMENTS

The BM20/BM23 module is labeled with its own NCC mark and certificate number as below:

For BM20 Module:

CCAN15LP0460T2

For BM23 Module:

CCAL15LP0270T3

The user’s manual should contain below warning (for RF device) in traditional Chinese:

注意!
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許可， 公司
、商號或使用者均不得擅自變更頻率、加大功率或變更原設計 之
特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信； 經發現有干擾現象時，應立
即停用，並改善至無干擾時方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低
功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性
電機設備之干擾。

A.7.2 HELPFUL WEB SITES

National Communications Commission (NCC): http://www.ncc.gov.tw

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 Stereo Module
A.8 China
The BM20 module has received certification of conformity in accordance with the China MIIT
Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme.
Integration of this module into a final product does not require additional radio certification,
provided installation instructions are followed and no modifications of the module are allowed.
The BM23 module has received certification of conformity in accordance with the China MIIT
Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme.
Integration of this module into a final product does not require additional radio certification,
provided installation instructions are followed and no modifications of the module are allowed.

A.8.1 LABELING AND USER INFORMATION REQUIREMENTS

The BM20 module is labeled with its own CMIIT ID as follows:

CMIIT ID: 2015DJ7134

When Host system is using an approved Full Modular Approval (FMA) radio: The host should
bear a label containing the statement “This device contains SRRC approved Radio module
CMIIT ID XXXXYYZZZZ”.

The BM23 module is labeled with its own CMIIT ID as follows:

CMIIT ID: 2016DJ3553

When Host system is using an approved Full Modular Approval (FMA) radio: The host
should bear a label containing the statement “This device contains SRRC approved
Radio module CMIIT ID XXXXYYZZZZ”.
A.9 Other Regulatory Jurisdictions

Should other regulatory jurisdiction certification be required by the customer, or

the customer need to recertify the module for other reasons, contact Microchip
for the required utilities and documentation.

 2015 Microchip Technology Inc. Preliminary Edition Page 46

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Page 46 2015 Microchip Technology Inc.