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92 views3 pages

Ipc-6012ea Toc

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John
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© © All Rights Reserved
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Association Connecting Electronics Industries

IPC-6012EA
®

Automotive Applications
Addendum to IPC-6012E
Qualification and
Performance Specification
for Rigid Printed Boards

Developed by the IPC-6012 Automotive Addendum Task Group (D-33AA)


of the Rigid Printed Board Committee (D-30) of IPC

Supersedes: Users of this publication are encouraged to participate in the


IPC-6012DA-wAM1 – development of future revisions.
December 2018
IPC-6012DA – Contact:

April 2016
IPC

Tel 847 615.7100


Fax 847 615.7105
October 2021 IPC-6012EA

Automotive Applications Addendum to IPC-6012E, Qualification and


Performance Specification for Rigid Printed Boards

0.1 Scope This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in
IPC-6012E to ensure the reliability of printed boards that must survive the environments of electronic interconnects within the
automotive industry.

0.1.1 Purpose When required by procurement documentation/drawings, this addendum replaces specifically identified requirements
of IPC-6012E.

0.1.2 Precedence The procurement documentation takes precedence over this addendum and referenced standards. In the event of
a conflict between this addendum and the applicable documents cited herein, this addendum takes precedence. Where referenced
criteria of this addendum differ from the published IPC-6012E, this addendum takes precedence.

0.1.3 Existing or Previously Approved Designs This addendum shall not constitute the sole cause for the redesign of previously
approved designs. When drawings for existing or previously approved designs undergo revision, they should be reviewed and
changes made that allow for compliance with the requirements of this addendum.

0.1.4 Use of this Addendum This addendum shall not be used as a stand-alone document but shall be recognized as automotive
electronic specific requirements that are in addition to or in place of IPC-6012E Class 3 requirements.
Where criteria are not supplemented, the Class 3 requirements of IPC-6012E shall apply. Where IPC-6012E criteria are supplemented
or new criteria are added by this addendum, the clause is listed in IPC-6012EA, Table 1, Automotive Applications Requirements,
and the entire IPC-6012E clause and its associated Table 4-3 entry is replaced by this addendum except as specifically noted.
The clauses modified by this addendum do not include subordinate clauses unless specifically stated (i.e., changes made to 3.5 do
not affect 3.5.1 unless 3.5.1 is also addressed in this addendum).

1
IPC-6012EA October 2021

Table 1 IPC-6012EA Automotive Application Requirements


IPC-6012E Automotive Applications Requirement Inspection/ Sample Test Frequency
Reference (as changed by this Addendum) Test Method Remarks Frequency
Visual Examination Finished printed boards shall be examined in
accordance with the following procedure. They shall be of uniform
quality and shall conform to 3.3 of IPC-6012E.
Visual examination for applicable attributes shall be conducted at
3 diopters (approx.1.75X). A 100% Automated Visual Inspection is
recommended for mass production.
Visual +
Visual examination of microvia structures for applicable dimensional or Automated Printed
3.3 workmanship attributes shall be conducted at 30X minimum. 100%
Visual Board
If confirmation of a suspected defect cannot be made at 3 diopters, it Inspection (AVI)
should be verified at progressively higher magnifications (up to 40X) to
confirm that it is a defect. Dimensional requirements such as spacing or
conductor width measurements may require other magnifications and
devices with reticules or scales in the instrument, which allow accurate
measurements of the specified dimensions. Contract or specification
may require other magnifications.

Lifted Lands When visually examined in accordance with 3.3 of One for
IPC-6012E, there shall be no lifted lands on the delivered qualification
(non-stressed) printed board. If observed after thermal stress when and one for
visually examined in accordance with 3.3 of IPC-6012E, separation production
between conductor or PTH land and laminate surface shall not be lot. The
Visual + Printed 2 samples
3.3.4 greater than one pad thickness. If press-fit pins are used, the printed examination
Microsection Board per lot
boards shall be visually examined for lifted lands in accordance with shall be done
3.3 of IPC-6012E prior to the insertion of press-fit pins. after thermal
stress before
insertion of
press-fit pins.

Hole Size, Hole Pattern Accuracy and Pattern Feature Accuracy


The minimum hole and copper pattern feature location accuracy shall
be as follows:
Up to 300 mm [11.8 in]: ± 0.075 mm [0.0029 in]
Up to 450 mm [17.7 in]: ± 0.112 mm [0.0044 in]
Up to 600 mm [23.6 in]: ± 0.150 mm [0.0059 in] Supplier
Visual, Optical Printed Sample
3.4.1 Certification
The finished hole size tolerance shall be ± 100 μm [3.937 μin]. Via Measurement Board (4.0)
Allowed
holes shall be specified as minimum drilled size to secure a sufficient
aspect ratio.
Nodules or rough plating in PTHs shall not reduce the hole diameter
below the minimum limits defined in the procurement document.
Critical hole and pattern location tolerances shall be AABUS.

Bow and Twist Unless otherwise specified in the procurement


documentation, when designed in accordance with IPC-2221, the
printed board shall have a maximum bow and twist of 0.75%. For any
product grouped in pallet arrays for assembly purposes, bow and twist
requirements of the array shall be AABUS.
Bow, twist, or any combination thereof, shall be determined by physical One for 2 Samples
measurement and percentage calculation in accordance with IPC-TM-650
Printed qualification Per
3.4.3 IPC-TM-650, Method 2.4.22, Coordinate Measurement Machine (CMM) Method 2.6.27
Board and one for Production
or equivalent method. Table 5-1
shipment Lot
A preconditioning shall be performed prior to the assessment for bow
and twist in accordance with IPC-TM-650, Method 2.6.27, 260 °C
reflow profile, at 2X Reflow.
Bow and twist that may result from unbalanced construction shall
be AABUS.

Conductor Definition All conductive areas on printed boards including


conductors, lands and planes shall meet the visual and dimensional
requirements of the following sections. The conductor pattern shall
be as specified in the procurement documentation. Verification of
dimensional attributes shall be performed in accordance with 3.3
of IPC-6012E. AOI inspection methods are allowed, but conductor Printed All Conductive
3.5 AOI 100%
dimensional assessments by AOI shall be AABUS. Board Layers
Internal conductors are examined during internal layer processing prior
to multilayer lamination.
To secure conductor definition, all layers shall be tested 100% by AOI
in accordance with 3.5.1 through 3.5.4 of IPC-6012E.

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