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Understanding PCB 1

This document provides an overview of Printed Circuit Boards (PCBs), detailing their components, types, manufacturing processes, advantages, and disadvantages. It explains the roles of various layers and features in PCBs, including substrates, copper layers, and power supply components. The conclusion emphasizes the complexity and precision required in PCB manufacturing.

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aman
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3 views

Understanding PCB 1

This document provides an overview of Printed Circuit Boards (PCBs), detailing their components, types, manufacturing processes, advantages, and disadvantages. It explains the roles of various layers and features in PCBs, including substrates, copper layers, and power supply components. The conclusion emphasizes the complexity and precision required in PCB manufacturing.

Uploaded by

aman
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Understanding of Printed

Circuit Board(PCB)

Presented by:- Aman Singh


Designation:- DFT Trainee Engineer
Table OF Contents
• INTRODUCTION TO PCB
• COMPONENTS OF PCB
• TYPES OF PCB
• TYPES OF HOLES IN PCB
• POWER SUPPLY IN PCB
• MANUFACTURING PROCESS
• ADVANTAGES OF PCB
• DISADVANTAGES OF PCB
• CONCLUSION
01 Introduction To PCB
Electronics Components

• A Printed Circuit Board (PCB)


is a flat board made of
insulating material (like
fiberglass) that connects and
supports electronic
components through
conductive pathways and other
features.
02 COMPONENTS OF PCB
• Substrate: The base material (usually FR4, a fiberglass material).

"FR" stands for "flame retardant," and the "4" denotes a


specific grade of this type of material.

• Copper Layer: Thin layer of copper foil for signal routing.


• Solder Mask: Green layer that prevents short circuits.

• Silkscreen: White print on top for labels and symbols.


03 TYPES OF PCB
• Rigid PCB: Rigid PCBs are the most common type of PCB,
characterized by their inability to bend or flex after
manufacturing.
• Flexible PCB: Flexible PCBs use flexible materials like
polyimide or polyester film, allowing them to bend and
conform to various shapes.

• Rigid-Flex PCB: Rigid-flex PCBs, also known as hybrid


PCBs, combine the structural rigidity of traditional rigid PCBs
with the flexibility of flexible circuits.
04 TYPES OF PCB HOLES
• Plated Through-Hole (PTH):Holes
that are plated with copper to create
electrical connections between
different layers of a PCB.

• Non-Plated Through-Hole
(NPTH):Holes that do not have copper
plating. They are only used for
mechanical purposes.
• Vias: Very small holes used to
electrically connect different
layers in multi-layer PCBs.
Types of Vias:
1. Through Via: Connects top to
bottom layer.
2. Blind Via: Connects outer
layer to one or more inner
layers.
3. Buried Via: Connects only
inner layers, not visible from
outside.
4. Micro Via: Extremely small
vias, often made using lasers
(used in HDI boards).
05 POWER SUPPLY IN PCB

• Transformer: Steps down the high AC mains voltage to a lower


level, and provides isolation between the mains and the rest of
the power supply.
• Rectifier: Converts the AC voltage from the transformer to a
pulsating DC voltage using diodes.

• Smoothing: Smooths the pulsating DC voltage from the rectifier


into a continuous DC signal, reducing ripple.

• Regulator: Regulates and maintains a steady output DC


voltage, even with variations in load current or input voltage.
06 MANUFACTURING
PROCESS
1.Material Selection: The most common material used for the substrate in a PCB
is fiberglass-reinforced epoxy resin (FR4).

2.Imaging and Etching:


• Imaging is the process of transferring the circuit design onto the PCB.
• Etching is the process of removing the unwanted copper from the PCB to reveal the circuit
pattern.

3.Drilling and Plating:


• Drilling is the process of creating holes in the PCB for through-hole components and vias.
• Plating involves depositing a thin layer of metal, typically copper, onto the surface of the PCB
and inside the drilled holes.
4.Solder Mask and Silkscreen:
• Solder masks, the protective layers over the copper traces.
• The solder mask, imparting labels and markings for components.

PCB Assembly Process

•DFA: Verifies Gerber/ODB++ and BOM.


•SMT assembly process using pick and place machine.
•Through-hole assembly.
•Cleaning of assembled boards.
•Soldering of non-washable components.
•Final inspection and testing.
•Conformal coating.
•Procure components from a reliable supplier.
07 ADVANTAGES
• Compact Size
• Easy Maintenance
• Reliable
• Easy to Assemble
• Low Electronic
Noise
08 DISADVANTAGES
• Cost is High
• Risk of Short Circuit
• Difficult to Repair
09 CONCLUSION

• The manufacturing of printed circuit boards (PCBs) is a


complex process requiring high precision and quality control.

• From the initial design phase to the final inspection and


testing, each step of the process plays a crucial role.
THANK
YOU!

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