Marathwada Mitramandal’s

COLLEGE OF ENGINEERING
Karvenagar, Pune
Accredited with ‘A’ Grade by NAAC

Presentation
On
Topic: Electronic products, Overview of System Engineering
Unit 4: PCB Design

Subject: Electronic Product Design

by

Mrs. S. N. Deshmukh
Department of Electronics & Teclecommunication Engineering

1
 Electronic Product Design-Course Details
A.Y. 2022-23
Programme: UG Programme in E&TC Class: B.E. (E&TC)
Sem. I
Course Code: 404185 (Theory)
Credits : 3 Elective-IV

Teaching Scheme Examination Scheme

Theory Practical Tutorial Theory Lab
Online/ Term
(hrs/week) (hrs/week) (hrs/week) Endsem Sessional Practical Oral
Insem Work
3 hrs ---- ---- 30 70 ---- ---- ---- ----

Abstract: On completion of the course, learner will be able to -

Understand and explain design flow of design of electronics product, Associate with various circuit design issues and testing, Inferring
different software designing aspects and the Importance of product test & test specifications, Summarizing printed circuit boards and different
parameters, Estimating assorted product design aspects, Exemplifying special design considerations and importance of documentation
DEPARTMENT OF ELECTRONICS AND TELECOMMUNICATION ENGG2
 Electronic Product Design
COURSE OBJECTIVE: Unit 4

The course aims to:

1. To be acquainted with methods of PCB design and different tools used for PCB Design.

DEPARTMENT OF ELECTRONICS AND TELECOMMUNICATION ENGG 5

 Course Contents
Unit 4 : PCB Design

Circuit Boards, Component Placement, Routing Signal Traces, Grounds,

Returns And Shields, Connectors And Cables, Design For Manufacture,
Testing And Maintenance, Power Conversion Choices, Power
Distribution, Line Conditioning, Electromagnetic Interference, Heat
Transfer, Mechanisms For Cooling, Heat Sink Selection, Heat Pipes And
Thermal Pillows, Fans And Forced Cooling, Liquid Cooling, Evaporation
And Refrigeration, Trade-Offs In Design

Mapping of Course CO4: Summarizing printed circuit boards and different parameters
Outcomes for Unit 4
Lecture No. 1 Topic: Circuit Boards, Component Placement

Learning Objectives of topic:

● To study PCB basics

Learning Outcomes of the session:

On completion of this topic, students will be able to

● Understand PCB basics and placement of components

Books:
Robert J. Herrick, “Printed Circuit board design Techniques for EMC Compliance”, Second edition,
IEEE press.

1.1-1.7, 2.1, 2.2

MMCOE, E&TC Department, Electronics

* Circuits 7
PCB
► Printed circuit board is used to mechanically support
and electrically connect ,electronic components using
conductive pathways, tracks or traces etched from
copper sheets laminated on to a non conductive
substrate
► PCBs are the backbone of the electrical devices.
► They are non conductive board that holds all
electronic component through a circuit embossed over
it.
► It was a revolutionary idea because it could eliminate
complex wiring and provide consistent results.
► PCBs are built to last for a wide range of industrial,
commercial, and domestic applications.
► They can be customized to any specifications to users’
requirements.
 History of PCBs
► PCBs were first developed during the Second
World War.
► The revolutionary invention was made by an
Austrian Engineer, Paul Eisler.
► Since 1929, PCBs have been mass produced for
commercial applications.
► They were first used in transformers and
capacitors.
PCB Design Presentation
PCB
 What is PCB
► Printed circuit boards (PCBs) are by far the most common method
of assembling modern electronic circuits. Comprised of a sandwich
of one or more insulating layers and one or more copper layers
which contain the signal traces and the powers and grounds,
► The design of the layout of printed circuit boards can be as
demanding as the design of the electrical circuit.
► Electronic Board that connects circuit components
► PCB populated with electronic components is a printed circuit
assembly (PCA)
► PCBs are rugged, inexpensive, and can be highly reliable
► Mass manufacturing
► Professional
 Materials of PCB
► Laminate is an insulating base prepared using a layer of glass fabric
impregnated with resins, either with epoxy material
► Copper clad laminate is a thin conductive layer typically made of
thin copper foil
► Etching is a process in which unwanted copper material is removed
using a solution like ferric chloride.

► Conducting layers are typically made of thin copper foil.

► The board is typically coated with a solder mask that is green in
color. Other colors that are normally available are blue and red.
► Unwanted copper is removed from the substrate after etching
leaving only the desired copper traces or pathways
 Parts of a PCB

► Components
► Pads
► Traces
► Vias
► Top Metal Layer
► Bottom Metal Layer
Layout and Standards
 Components
► Components are the actual devices used in the circuit.
► This includes input/output connections.
► I/O ports, including power supply connections, which
are also important in the PCB design.
PAD
► A pad is a small surface of copper in a printed circuit board that
allows soldering the component to the board. You can think of a
pad as a piece of copper where the pins of the component are
mechanically supported and soldered. There are 2 types of pads;
thru-hole and smd (surface mount).
► Thru-hole pads are intended for introducing the pins of the
components, so they can be soldered from the opposite side from
which the component was inserted. With through hole technology,
each component has thin wires, or leads, which are pushed through
small holes in the substrate and soldered to connection pads in the
circuits on the opposite side. Gravity and friction between the leads
and the sides of the holes keeps the components in place until they
are soldered.
The smd pads are intended for surface mount devices, or in other
words, for soldering the component on the same surface where it
was placed.
TRACK
► A track is conductive path that is used to connect 2
points in the PCB. For example, for connecting 2 pads or
for connecting a pad and a via, or between vias. The
tracks can have different widths depending on the
currents that flow through them.
► It is important to highlight that in high frequencies is
necessary to calculate the tracks' width so that the
interconnect can be impedance matched along the path
created by the track. ( more on this in a future article )
► Plated Holes (Thru-hole Vias or Full Stack Vias)
► When an interconnect must be made from a component that is
located on the top layer of the printed circuit board with
another that is located at the bottom layer, a via (Vertical
Interconnect Access) is used. A via is a plated hole that allows
the current to pass through the board. Figure 6 depicts 2 tracks
that begin at the pads of a component on the top layer and end
at the pads of another component at the bottom layer. For
conducting the current from the top layer to the bottom layer,
a via is used for each track. The tracks and pads that belong to
the bottom layer are visually dimmed, so you can differentiate
them from the ones that are on the top layer.
 TRACES
► Traces connect pads together.
► Traces are essentially the wiring of the
PCB.
► Equivalent to wire for conducting signals
► Traces sometimes connect to vias.
► High current traces should be wide.
► Signal traces usually narrower than power
or ground traces
► If w is the width of signal, then 2w power
supply width,4w is ground trace width
 VIAS
► Vias are called vertical interconnect access
► It is vertical connection between different layers of
conductors Pad with a plated hole connecting traces
from one layer of board to other layers.
► The holes are made conductive by electroplating or are
filled with annular ring
► Attempt to minimize via use in your PCBs.
► You want to use pads in places where you will be
soldering a component lead. connect traces to the pad
on either layer. Vias are used where you just want to
pass a signal from one layer to the other. Vias are not
used to solder in components.
PCB Types
► Components are placed on single side of PCB by simply
drilling the holes
► In double sided PCB ,there are conducting tracks on
both the sides. Components and connectivity between
the upper and lower side tracks and components can be
established by appropriate plated through holes (PTH)
Type and specification of
board
► Standard FR4- Chemical resistance
► High performance FR4-High flexural strength
► FR2 Paper/phenolic-Flame resistant
► FR3 Paper/epoxy-High mechanical strength
► Paper/phenolic-moisture resistant
TYPES OF PCB
► A single-layer or single-sided PCB is one that is made out of a
single layer of base material or substrate.
► A single sided board is made from rigid laminate consisting of a
woven glass epoxy base material clad with copper on one side
of varying thickness. Once the copper base plating is applied, a
protective solder mask is usually applied, followed by the last
silk-screen to mark out all of the elements on the board.
► This is the least complex of the Printed Circuit Boards, since
there is only a single layer of substrate. All electrical parts and
components are fixed on one side and copper traces are on the
other side.
► Since single-layer/single-sided PCBs only have their various
circuits and electrical components soldered onto one side, they
are easy to design and manufacture. This popularity means that
they can be purchased at a low-cost, especially for high-volume
orders. The low-cost, high volume model means they are
commonly used for a variety of applications, including
calculators, cameras, radio and stereo equipment, solid state
drives, printers and power supplies.
TYPES OF PCB
TYPES OF PCB

► Double sided boards are made from the same type of

base material clad with copper on two sides of varying
thickness. This is the most common type of board,
where parts and components are attached to both sides
of the substrate. In such cases, double-sided PCBs that
have connecting traces on both the sides are used.
Double-sided Printed Circuit Boards usually use
through-hole construction for assembly of components.
TYPES OF PCB
TYPES OF PCB

► Double-sided PCBs are typically used in

applications which require an
intermediate level of circuit complexity,
such as:
• Industrial controls
• Power supplies
• Instrumentation
• HVAC systems
• LED lighting
• Automotive dashboards
• Amplifiers
• Vending machines
TYPES OF PCB
► Multi-layer PCBs consist of a series of three or more
double-layered PCBs. These boards are then secured
together with a specialized glue and sandwiched
between pieces of insulation to ensure that excess heat
doesn't melt any of the components. Multi-layer PCBs
come in a variety of sizes, going as small as four layers
or as large as ten or twelve. The largest multi-layer PCB
ever built was 50 layers thick.
► Multi-layer boards are made from the same base
material with copper foil on the top & bottom and one
or more “inner layer” cores. The number of “layers”
corresponds to the number of copper foil layers. Multi
layered PCB consists of several layers of substrate
separated by insulation. Most common multilayer boards
are: 4 layers, 6 layers, 8 layers, and 10 layers.
However, the total number of layers that can be
manufactured can exceed over 42 layers. These types of
boards are used in extremely complex electronic
circuits.
TYPES OF PCB
TYPES OF PCB
► With many layers of printed circuit boards, designers
can make very thick, complex designs which are
suitable for a broad range of complicated electrical
tasks. Applications where multi-layer PCBs would be
beneficial include:
• File servers
• Data storage
• GPS technology
• Satellite systems
• Weather analysis
• Medical equipment
Assignment for next session
Various PCB basics and placement of components

Wrap UP
Review of PCB basics and placement of components
Lecture No. 2 Topic: Routing Signal Traces, Grounds, Returns And Shields

Learning Objectives of topic:

● To study Routing Signal Traces, Grounds, Returns And Shields

Learning Outcomes of the session:

On completion of this topic, students will be able to

● Understand Routing Signal Traces, Grounds, Returns And Shields

Books:
Robert J. Herrick, “Printed Circuit board design Techniques for EMC Compliance”, Second edition,
IEEE press.

2.2- 2.8

MMCOE, E&TC Department, Electronics

* Circuits 34
 Bottom Metal Layer

► Few components on this layer.

► Many traces on this layer.
► Most soldering done on this layer.
 Top Metal Layer

► Most of the components reside

on the top layer
► Fewer traces on the top layer
► Higher circuit densities
 Jumpers

► Often, many signal wires need to exist in too small of a

space and must overlap.
► Running traces on different PCB layers is an option.
► Multilayer PCBs are often expensive.
► Solution: use jumpers
 Solder Mask
► Areas that should not be soldered may be covered with
polymer solder resists. It is a dark green coating
► It is used in such way that it covers entire board except
the solder contact to prevent from moisture.
► It avoid false bridging between two close tracks
► Areas that shouldn't be soldered may be covered with
polymer resist solder mask coating
► Designed to keep solder only in certain areas
► Prevents solder from binding between conductors and
thereby creating short circuits
 Silkscreen
► Printing on the solder mask to designate component locations
► Readable information about component part numbers and placement.
► Helpful in assembling, testing and servicing the circuit board.
 Multilayer PCBs
► More than a top and bottom layer.
► Typically there will be a power plane, ground plane, top layer, and bottom
layer.
► Sometimes signal layers are added as needed.
► Sometimes RF planes made of more expensive materials are added.
► FR4 is the most widely used starting point for PCBs • FR4 consists of
a woven glass fibre mesh soaked in organic polymer (epoxy) with
copper layers laminated – possibly with filler material (similar to
steel- enforced concrete)
► • FR means Flame Retardant
Assignment for next session
Various patterns of Grounds, Returns And Shields

Wrap UP
Review of Routing Signal Traces, Grounds, Returns And Shields
Lecture No. 3 Topic: Connectors And Cables, Design For
Manufacture,Testing And Maintenance

Learning Objectives of topic:

● To study Types of Connectors And Cables, Design For Manufacture,Testing And
Maintenance

Learning Outcomes of the session:

On completion of this topic, students will be able to

● Understand Connectors And Cables, Design For Manufacture,Testing And
Maintenance with examples

Books:
Robert J. Herrick, “Printed Circuit board design Techniques for EMC Compliance”, Second edition,
IEEE press.

4.1,4.2

MMCOE, E&TC Department, Electronics

* Circuits 52
 Physical Design Issues

► Component Size
► Heat Dissipation
► Input and Output
► Mounting Points
► No. of layers
► Board dimension
► Type of ckt. for which PCB to be design
 Component Size

► Make sure components will actually fit.

► This especially applies for circuits that require high
component densities.
► Some components come in multiple sizes.
► Sometimes you can get tall and narrow caps or short
and wide capacitors.
 Heat Dissipation-Heat Sinks
► Heat sink dissipates heat off the component
► Doesn’t remove the heat just moves it
► Some components may get hot. Make sure you get a large enough heat sink.
► Data sheets specify the size of the heat sink
► A short circuit may result when two devices share the same heat sink
 Mounting Points

► The PCB needs to be mechanically secured to

something.
► Could be the chassis-consist of metal frame on which
the circuit boards and other electronic components are
mounted.
► Could be socket on PCB.
► Could be attachments to a heatsink.
 Parasitics

High frequency circuits

► Series Inductance
► Shunt Capacitance
► Inductive Coupling
► Capacitive Coupling
 Series Inductance
► Not an issue for low frequency
circuits(<10 Mhz)
► The inductance of a trace may be
significant.
► For power connections, a shunt
capacitor is added to counter the
series inductance of a long trace.
► A capacitor has a low AC impedance
source
► 100 nF ceramic capacitor have very
low impedance at higher frequencies.
 Shunt Capacitance

► Result of using wide wires over a ground

plane.
► Limits speed of circuits, including digital
circuits
► Typically insignificant for low
performance circuits.
► Capacitor from voltage to ground will
minimize
Inductive Coupling
► Transfer of energy from one circuit
component to another through shared
magnetic field
► Change in current flow through one
device induces current flow in other
device
► Current flow in one trace induces current
in another trace
► Minimize the long parallel runs of traces
► Run traces perpendicular to each other
 Capacitive Coupling

► Transfer of energy in electrical n/w due

to capacitance between circuit nodes
► Minimizing long traces on adjacent layers
will reduce capacitive coupling
► Ground planes run between the signals
that might affect each other.
► Keep conductor width as small as possible
PCB Design Steps

► Apply photo resist on conductive material

► Place a negative image artwork of the signal
trace on photo resist
► Expose the artwork to UV light or use proper
etching technique, so as to remove unwanted
photo resist as well as conducting path
► Do appropriate drilling
► Place the component on PCB
► Do the soldering of component
► Do the environmental testing ,signal testing,
quality checking
Cost effective PCB design

► Considerations are
► Material of PCB
► Size of PCB
► No. of layers in PCB
► Special type of devices for ckt.
► No. of solder point
► Vias on PCB
► Types of plating material
► External connectivity through connectors
 Pre-work
► Thoroughly simulate your circuit-make
sure the circuit worked in simulations
► Thoroughly test the prototype-make
sure the circuit worked on the bread
board
► Have all the data sheets handy for
every components
► Play around with the placement of the
components
► Try various component configurations
 Simulations

► Important to simulate the circuits before

building them
► Allow margin for component tolerances
► Avoid using precise components. e.g a
PWM controller that requires exact 10 V
DC to work and will fail if there is 10.01V
► High performance circuits or SMT devices
require PCBs and should be simulated
extensively first.
 Steps in PCB design
1. Film Generation
2. Shear Raw Material

Industry standard
3. Drill Holes 0.059" thick, copper
clad, two sides
 Steps in PCB design
4. Electrolus copper 5. Apply Image

Apply copper in hole barrels Apply Photosensitive Material to

develop selected areas from
panel
Steps in PCB Design

6. Strip and Etch 7. Solder Mask

•Remove dryfilm, then Apply solder mask area to

etch exposed copper entire board with the exception
•Tin protects the copper of solder pads
circuitry from being
etched
Steps in PCB Design
8. Solder Coat 9. Silkscreen

Apply solder to pads Apply white letter marking

using screen printing
process
http://www.youtube.com/watch?v=Q6WJqjVleG0&feat
ure=related

http://www.advancedcircuits.com/
Assignment for next session
Various Types of Connectors And Cables, Design For
Manufacture,Testing And Maintenance

Wrap UP
Review of Connectors And Cables, Design For Manufacture,Testing And
Maintenance with examples
Lecture No. 4 Topic: Power Conversion Choices, Power Distribution, EMI

Learning Objectives of topic:

● To study Power Conversion Choices, Power Distribution, EMI

Learning Outcomes of the session:

On completion of this topic, students will be able to

● Understand Power Conversion Choices, Power Distribution, EMI

Books:
Robert J. Herrick, “Printed Circuit board design Techniques for EMC Compliance”, Second edition,
IEEE press.

3.1,3.7

MMCOE, E&TC Department, Electronics

* Circuits 72
Fundamental Definitions
► The following basic terms are used throughout
this unit.
► Containment - A process whereby RF
energy is prevented from exiting an
enclosure.

This is achieved by shielding a product by

metal enclosure or by using plastic
housing with RF conductive coating.
Electromagnetic compatibility (EMC) - The
capability of electrical and electronic systems,
equipment, and devices to operate in their intended
electromagnetic environment within a defined
margin of safety, and at design levels or
performance, without suffering or causing
unacceptable degradation.
► Electromagnetic interference (EMI) -
EMI is the process by which disruptive
electromagnetic energy is transmitted from one
electronic device to another via radiated or
conducted paths (or both).

► Electromagnetic Interference is disturbance that affects

an electrical circuit
► Caused by induction or outside radiation
► Can temporary and permanently disrupt circuit
components
► Big design issue for new products
► Causes
► Electric fields radiating from currents
► Switching circuits, clocks, natural fields,
ect.
► Coupling of electric fields into circuits and
components
► Unintentional and intentional
► Effects
► Causes problems for electronics
► Loss and disruption of data
► Growing problem with more advanced
devices
Radio Frequency (RF) - A frequency range
containing coherent electromagnetic radiation
of energy useful for communication purpose.

Roughly the range of frequency is from 10 kHz

to 100 GHz. This energy may be transmitted
as a by-product of an electronic device's
operation.
► RF is transmitted through two basic modes:

1. Radiated emissions - energy is transmitted

through a medium as an electromagnetic field.

2. Conducted emissions - energy is transmitted

through a medium as a propagating wave,
generally through a wire or interconnect
cables.
Line Conducted Interference (LCI) - Refers to RF
energy in a power cord or AC mains input cable.
Conducted signals do not propagate as fields but may
propagate as conducted waves.

Immunity - A relative measure of a device or a system's

ability to withstand EMI exposure while maintaining

a predefined performance level.

Immunity is of two types:
Radiated immunity - A product's relative ability to
withstand electromagnetic energy that arrives via
free-space propagation.

Conducted immunity - A product's relative ability to

withstand electromagnetic energy that penetrates it
through external cables, power cords, I/O
interconnects, or chassis.
Electrostatic discharge (ESD) - A transfer of
electric charge between bodies of different
electrostatic potential in proximity to each other
or through direct contact.
This electric charge transfer or high voltage pulse
may cause damage or loss of functionality to
susceptible receiver.
the term ESD is generally applied to events
of lesser amperage and more specifically
to events triggered by human beings.
Susceptibility - A relative measure of a device to be
disrupted or damaged by EMI exposure to an incident
field or signal. It is the lack of immunity.

Suppression - The process of reducing or eliminating RF

energy that exists without relying on a secondary
method, such as a metal housing or chassis.

Suppression may include shielding and filtering as well.

► A product must be designed for two levels of
performance:
► one to minimize RF energy exiting an enclosure
(emissions), and the other
► to minimize the amount of RF energy entering
(susceptibility or immunity).
► Both emissions and immunity are transmitted by
radiated or conductive means.
► The higher the frequency, the greater the efficiency of
a radiated coupling path;
► the lower the frequency, the greater the efficiency that
a conducted coupling path will cause EMI.
Assignment for next session
Various issues of Power Conversion Choices, Power Distribution, EMI

Wrap UP
Review of Power Conversion Choices, Power Distribution, EMI
Lecture No. 5 Topic: Heat Transfer, Mechanisms For Cooling, Heat Sink
Selection

Learning Objectives of topic:

● To study Heat Transfer, Mechanisms For Cooling, Heat Sink Selection

Learning Outcomes of the session:

On completion of this topic, students will be able to

● Understand Heat Transfer, Mechanisms For Cooling, Heat Sink Selection with
examples

Books:
Robert J. Herrick, “Printed Circuit board design Techniques for EMC Compliance”, Second edition,
IEEE press.

5.1,5.7

93
Standards

► Basic
► Generic
► Product Family
Basic Standard
► Standard include most IEC (international
electro technical commission)and
CISPR(international special committee on
radio interference) and are dedicated to
aspects of EMC that are of general
interest to what all committees are
working on, creating, or developing other
standards.
► This Standard is referred within generic
and product family standards as a basis
for performing a particular test
Generic Standards
► This standard is developed for industry sector for which no
product family standard is available
► For Industry
► These standards are divided into two basic requirements
1.emission 2. immunity
► For residential
► EN50081-1:Electromagnetic compatibility-generic emission
standard
► EN50082-1:Electromagnetic compatibility-generic immunity
standard
► For industry
► EN50081-2:Electromagnetic compatibility-generic emission
standard
► EN50082-2:Electromagnetic compatibility-generic immunity
standard
Product Family Standards

► Specifically designed to cover a perticular aspect of EMC

for perticular product or product family such as
ITE(information technology equipment) or
ISM(industrial,scientific,medical)
Product classification

► Class A:A digital device that is marketed for use in

commercial, industrial, or business environment. ITE
includes, for example, data processing equipment,
office machines, electronic business equipment, and
telecommunication equipment
► Class B: A digital device that is marketed for use in
residential environment Class B ITE is intended primarily
for use in the domestic environment and may include
.Eg. PC ,calculator
ROUTING TOPOLOGY
CONFIGURATIONS
Microstrip
► Microstrip refers to traces located on the top and
bottom, or outer layers of a PCB. Microstrip
provides minimal suppression of RF energy that
may be created within the PCB.
► The drawback of using microstrip is that the outer
layers of the PCB can occasionally radiate RF
energy to the environment, without the protection
of a plane on both sides of this outer circuit layer
► Faster clock and logic signal propagation exists
over that of the stripline configuration. These
faster signals are due to less capacitive coupling
and a lower unloaded propagation delay between
source and load.
Stripline

► Stripline refers to placement of a signal layer between

two solid planes: at either voltage or ground potential.
Stripline provides for enhanced noise immunity against
the propagation of radiated RF emissions, at the
expense of slower propagation speeds.
► The main benefit of using stripline is complete shielding
of RF energy generated from internal traces radiating
into free space.
Microstrip and stripline topology
configurations.
LAYER STACKUP
ASSIGNMENT
► When designing a printed circuit board, a primary
consideration is to determine how many routing layers and
power planes are required for functionality (within the
context of acceptable costs). The number of layers is
determined by functional specification, noise immunity
(use of power planes), signal category separations, number
of nets (traces) to be routed, impedance control,
component density of individual circuits, routing of buses,
and the like.
► Proper use of stripline and microstrip topology is required
not only for radio frequency (RF) suppression within the
PCB, but also for signal integrity purpose. If signal integrity
is ensured, no reflections and ringing will result. It is
desirable to suppress RF energy on the PCB rather than to
rely on containment by a metal chassis
► It is desirable to suppress RF energy on the
PCB rather than to rely on containment by a
metal chassis or conductive plastic enclosure.
► The use of planes (voltage and ground)
embedded in the PCB is one of the most
important methods of suppressing
common-mode RF energy developed internal
to the board.
► The advantage over most other design
techniques is that these planes intrinsically
contribute to reducing high-frequency power
distribution impedance.
► The following stackup assignments are provided only as
a guide to determining how to design a multilayer PCB
for optimal performance.
► Refer PDF for stack up assignment
Single-sided layout—"very
poor design concept."
► This is worst type of layout for single-sided designs and
should "never" be implemented. This is because
► excessive loop areas are present within the power and
ground distribution network. In addition, no provisions
exist for a RF return path for critical traces
► Route all power and ground traces in a radial
fashion from the power supply. Minimize total
routed length of traces.
► Route all ground and power traces adjacent
(parallel) to each other. This minimizes loop
currents that may be created by high-frequency
switching noise (internal to the components) from
corrupting other circuits and control signals.
► Ideally, these traces should be separated by a
distance greater than the width of any individual
trace.
► Prevent loop currents by not tying different
branches of a tree to another branch.
● Device Operating Temperature Range (Ambient Temperature)
● System IP Rating.
● Product Size.
● System Cost.
● Availability of Convection mode cooling options.
● Insulation/Isolation Requirements.
Importance of Using Heat Sinks

A heat sink is important in most electronic products due to its ability to prevent overheating
electrical components. Therefore, the device will be able to work at the specified
temperature. Below are other reasons why heat sinks are important.

● Maintenance of Thermal Energy

A heat sink maintains the electronic device’s controlled thermal energy by transferring heat
from the electronic circuit elements to the surroundings.

● Improves Electronic Reliability

A heat sink improves the reliability of electronic devices due to it preventing component
failure by its function.

● It Also Provides Heat

Heat sinks provide heat in cases of a drop in temperature within the electrical circuit.

Based on such importance, heat sinks are now essential components of many electronic
devices. For example, they are part of the central processing unit of computers.
General Types of Heat Transfer

In thermal engineering, the Heat is transferred from higher temperature to lower temperature by the
following 3 Ways-
Conduction: Heat Transfer happens because of the movement of molecules. Molecules at higher
temperatures vibrate at a higher amplitude and pass the energy to the lower temperature molecules.

Convection: Heat transfer happens due to the bulk movement of fluids (air or liquid) from the hot surface
to the cold surface.

Radiation: Heat transfer happens in the form of Electromagnetic radiation.

Most of the electronic device cooling systems use conduction and convection type heat transfer for
thermal management.
How to Select or Design a Heat Sink for Your Application

In general, the following are the major Heat Sink Design Consideration factors for good selection and
design of Heat Sinks.
● Device Operating Temperature Range (Ambient Temperature)

● System IP Rating

● Product Size

● System Cost

● Availability of Convection mode cooling options

● Insulation/Isolation Requirements

● Component Package
Shape and Arrangement of Fins
Thermal pads to a heat sink
Assignment for next session
Various issues of Heat Transfer, Mechanisms For Cooling, Heat Sink
Selection

Wrap UP
Review of Heat Transfer, Mechanisms For Cooling, Heat Sink Selection
Lecture No. 6 Topic: Evaporation And Refrigeration, Trade-Offs In Design

Learning Objectives of topic:

● To study Evaporation And Refrigeration, Trade-Offs In Design

Learning Outcomes of the session:

On completion of this topic, students will be able to

● Understand Evaporation And Refrigeration, Trade-Offs In design with examples

Books:
Robert J. Herrick, “Printed Circuit board design Techniques for EMC Compliance”, Second edition,
IEEE press.

7.1,7.6

MMCOE, E&TC Department, Electronics

* Circuits 118
Temperatures
Tc = condensing temperature
Ta = ambient temperature
te= evaporating temperature
tei = air inlet to the evaporator

TDc = Tc - Ta
TDe = tei - te

For air cooled condensers :

Hot climates ------- TDc = 6 to 8°C
Normal climates ------ TDc = 8 to 10 °C
cold climates ---------- TDc = 12 to 15 °C

For water cooled condenser :

TDc = 15°C

For cold room evaporator :

TDe = 5 to 6 °C for fruits and vegetables (high relative humidity)
TDe = 8 to 10 °C for frozen products (low relative humidity)

For air conditioning evaporator :

TDe = 15 to 20 °C

For water chiller evaporator :

TDe = 10°C
Thermal Analysis

● Performing a thermal analysis establishes how the components and

PCB will behave at different temperatures and conditions. The analysis
provides designers with an idea of the heat generation and transfer
within the circuit.
● Designers can then use analysis results and simulations to come up with
techniques that will help them better manage the heat.
Thermal image of PCB
How to Remove Heat from Circuit Boards

There are several techniques that designers can use to remove heat from
components and PCBs. The common mechanisms include heat sinks, cooling
fans, heat pipes, and thick copper. Most often, circuits generating more heat
require more than one technology. For example, cooling a laptop processor
and display chips requires a heat sink, heat pipe, and a fan.

Heat Sinks and Cooling Fans

A heat sink is a thermally conductive metallic part with a large surface area,
usually attached to components such as power transistors and switching
devices. A heat sink allows the component to dissipate its heat over a larger
area and transfer that heat to the surroundings. In some cases, such as high
current power supplies, adding a cooling fan aids in faster and better heat
removal.
Heat Pipes

Heat pipes are suitable for compact devices with limited space. The pipes
provide a reliable and cost-effective passive heat transfer. Benefits include a
vibration-free operation, good thermal conductivity, low maintenance, and
quiet operation since they have no moving parts.

A typical pipe contains small amounts of nitrogen, water, acetone, or

Ammonia. These fluids help to absorb the heat, upon which they release a
vapor that travels along the pipe. The pipe has a condenser where, as the
vapor passes through, it condenses back to its liquid form and the cycle
begins again.
Thermal Via Arrays

Thermal vias increase the mass and area of the copper, reducing the thermal
resistance and improving heat dissipation from the critical components
through conduction. As such, better performance is achieved when the vias
are placed closer to the heat source.

In some applications, heat from a device, such as a thermally optimized IC, is

conducted away through the combination of a thermal via array and pad. This
eliminates the need for a heat sink while improving the heat dissipation
through the PCB.

Thick Copper Traces

Using more copper provides a larger surface area that helps in heat
distribution and dissipation. Such PCBs are suitable for high power
applications.
Trade Off

● Tradeoffs are important in engineering.

● Negative feedback is used in amplifiers to trade gain for other
desirable properties, such as improved bandwidth, stability of the
gain and/or bias point, noise immunity, and reduction of nonlinear
distortion.
● Channel capacity and S/N ratio
● Filter capacitor value and delay
● Tradeoffs are used to maximize power efficiency in medical devices
whilst guaranteeing the required measurement quality.
 References

► PCB Design slides by Chris Stahl

► www.wikipedia.org
► www.pcbexpress.com
► A Practical Guide to high-speed printed circuit board
layout
Trade Off
 WEBSITE

► http://www.advancedcircuits.com
► How to download the software (EAGLE
Layout editor)
1. Go to http://www.cadsoftusa.com
2. Click ‘Freeware’
3. Click ‘Download’
4. Find the correct version
(Windows/Linux,English)
5. Also download Manual and Tutorial
 USEFUL LINKS

► http://www.pcbexpress.com
► http://www.freepcb.com
► http://www.4pcb.com
► http://www.pentalogix.com
Assignment for next session
Various issues of Evaporation And Refrigeration, Trade-Offs In Design
Selection

Wrap UP
Review of Evaporation And Refrigeration, Trade-Offs In Design with
examples