An Industrial Internship Report

submitted by

Induja S

21BEC0316

in partial fulfillment for the award of the degree of

B.TECH
in

ELECTRONICS AND COMMUNICATIONS ENGINEERING

Acknowlegdement:

I Induja.S would like to express my sincere gratitude to all those who have contributed
to the successful completion of my internship and the preparation of this report.
First and foremost, I would like to thank VIT for helping me showcase what I’ve learnt
during my internship. I would like to thank Karthikeyan Kannan (Director) for referring
me and Raj C(HR) for providing me with the opportunity to work at Flextronics India
Private Limited and for their valuable guidance and support throughout the internship.
I am also deeply grateful to the entire team at Flextronics for welcoming me into their
workplace and for their constant support and encouragement. I have learned a great
deal from the dedicated and talented professionals I had the privilege to work with.
I would like to acknowledge the support and encouragement of my professors and the
staff at Vellore Institute of Technology. Their valuable insights and feedback during the
internship planning process were invaluable.
Lastly, I would like to express my appreciation to all the individuals and resources that I
have consulted, whether directly or indirectly, in the course of my internship and report
writing.
Thank you all for your support, guidance, and encouragement.

21.04.2024 Induja S
21BEC0316
Certificate:
Page 4: Table of Contents

S.No Topic

1 Introduction

2 Recent ongoing work methodology in the industry and

challenges in the relevant field Recent ongoing work
methodology in the industry and challenges in the relevant field
3 Persons interacted with, machinery or equipment’s observed,
and learnings

4 Detailed description of the internship work carried out

5 Software or Hardware learnt/observed

6 Summary

7 Conclusion
Introduction:

Objective of the internship

• Professional Development
• Application of Academic Learning
• Exposure to Industry Trends
• Team Collaboration and Communication
• Contributing to Flextronics' Success

Organizational structure

Various domains in which the company operates

• Automotives
• Cloud Computing
• Communication Technology
• Healthcare
• Industrial Manufacturing
• Lifestyle Products
• Cross-Industry Technology
Domain/department to which you have been assigned
• During my internship at Flextronics, I had the invaluable opportunity to visit and
explore various departments within the company especially the manufacturing
sector, where we spent most of our time. These visits provided me with a
comprehensive understanding of the diverse range of electronic materials and
products that Flextronics manufactures. From PC motherboards and server
boards to charger motherboards, the intricate processes involved in their
production became clear as I witnessed them firsthand.
• PCB Assembly and Production:
• Server Boards and High-Performance Computing:
• Charger Motherboards and Power Electronics:
• Entertainment Electronics and Set-Top Boxes:
• Automotive Electronics and Car Headlight Motherboards:

Recent ongoing work methodology in the industry and challenges in

the relevant field:

The basic work flow for all components were:

• SMT (Surface Mount Technology),
• Testing
• Debugging (if necessary)
• Quality assurance
• FATP (Final Assembly, Test, and Packaging).
• Warehouse
Challenges:
Surface Mount Technology (SMT):
- Miniaturization: Components are becoming smaller, making placement and soldering
challenging.
- Component Variability: Ensuring consistent quality with a wide range of components.
- Soldering Defects: Issues like solder bridges and tombstoning can affect functionality.
- Machine Maintenance: Regular upkeep of SMT machines is crucial for accuracy.

Testing:
- Complexity: Testing intricate products requires sophisticated equipment and methods.
- Time and Cost: Comprehensive testing can be time-consuming and costly.
- Fault Isolation: Identifying faults in complex circuitry can be challenging.
- Automation: Implementing and maintaining automated testing systems requires
expertise.
Debugging:
- Resource Intensive: Debugging complex PCBs can be time-consuming.
- Root Cause Analysis: Identifying the root cause of issues can be elusive.
- Equipment Limitations: Tools may not catch intermittent faults.
- Communication: Clear communication between teams is crucial for effective
debugging.

Quality Assurance:
- Component Variability: Ensuring consistent quality with diverse suppliers.
- Process Control: Maintaining consistency in manufacturing processes.
- Traceability: Tracking components for quality control and compliance.
- Compliance: Meeting industry standards and regulations for product safety.

FATP (Final Assembly, Test, and Packaging):

- Efficiency: Balancing speed and efficiency without compromising quality.
- Packaging: Ensuring secure and eco-friendly packaging for transit.
- Integration Testing: Ensuring all components work together in the final product.
- Scalability: Adapting assembly lines for various product models and volumes.

Warehouse:
- Inventory Management: Preventing shortages or excess stock to avoid production
impacts.
- Space Optimization: Efficiently utilizing warehouse space for storage.
- Supply Chain Disruptions: Dealing with delays or shortages in shipments.
- Obsolete Inventory: Managing and disposing of obsolete components to avoid
obsolescence.

Persons interacted with, machinery or equipment’s observed, and

learnings
People Interacted with:
• I had the chance to meet with HR Director Raj C and Karthikeyan Kannan, an HR
team member who guided me through the early stages of my internship until I
transitioned to the manufacturing unit. Upon entering the manufacturing unit, I was
introduced to the HR representative of the manufacturing sector at the SEZ Area.
Here, I formed connections with the workers, establishing meaningful
relationships. Later, I visited the DTA Area where I met more workers. These
experiences enabled me to build strong connections with the workers across
various areas of the company.
Machinery:
SEZ (Social Economic Zone)
• Hallmark: they are deeply engaged in the Hallmark Project, with their primary
emphasis placed on crafting two distinct products: the 820 and 402 charger
models, both proudly showcasing the Hallmark brand. Within the Flextronics
facility, these products undergo a comprehensive manufacturing process,
encompassing everything from Surface Mount Technology (SMT) to Final
Assembly, Test, and Packaging (FATP).
• Lenovo: the design phase includes Lenovo PC motherboard development, and
these motherboards do not undergo the Final Assembly, Test, and Packaging
(FATP) stage. This is because the focus of production is solely on manufacturing
the motherboards, which are then shipped directly to customers without the need
for additional assembly and testing processes. This streamlined approach allows
for efficient delivery of high-quality motherboard components to Lenovo for
integration into their computer systems.
• Dell: the design process encompasses Dell Laptop motherboards and server
boards, sharing a similar manufacturing workflow, and neither of them proceeds
through the FATP process because only the motherboards are produced and
delivered to Customer(dell).
DTA (Domestic Tariff Area)
• HP PC motherboard
• Automotives
1. Titan Smart Watch
2. Automobile Headlight Motherboard
• Lifestyle Products
1. Jio Set-Top Box
2. Airtel Set-Top Box
3. Tataplay Set-Top Box
4. Tatasky Set-Top Box
We observed all machineries related to the manufacturing of the above-mentioned
electronics

Detailed description of the internship work carried out:

• Day1: I completed administrative tasks, signing documents for my entry. These *

outlined roles and responsibilities, validating my skills for the journey ahead.
• Day2: Delved into the company's infrastructure, exploring departments with
peers. Enriched understanding through discussions and research.
• Day3: Met with HR and fellow interns, gaining deeper insights into the company.
Engaged in discussions for comprehensive understanding.
• Day4: Split into groups for SEZ and DTA areas. Deployed to DTA with a friend,
beginning our exploration and work there.
• Day5: Introduced to SEZ's production unit, donning ESD coats and sandals. Led
by Bharadhwaj, we familiarized ourselves with operations.
• Day6: Introduced to the FATP section, learning about final assembly and testing
processes. Explored HALLMARK 402A's production line intricacies.
• Day7: Sunday was a non-working day, allowing us interns to rest and recharge
for the upcoming week.
• Day8: Completed remaining areas of HALLMARK 402A line. Transitioned to
exploring HALLMARK B820 production line, marveling at precision machinery.
• Day9: Delved into Surface Mount Technology (SMT) fundamentals, then focused
on HALLMARK 402A's SMT line intricacies.
• Day10: Immersed in HALLMARK B820's SMT line, understanding its processes
and automated machinery efficiency.
• Day11: Shifted to Dell CPU, laptop, and server boards' SMT line, witnessing
motherboard manufacturing for these devices. Marveling at precision and
specialized production processes with Dell.
• Day12: Shifted focus to Lenovo laptop PCB production line, similar to Dell line.
Limited hands-on experience provided insights into operational intricacies.
• Day13: Transitioned to Quality and Testing from SMT lines. Workers rigorously
tested PCB boards, upholding strict quality standards.
• Day14: Sunday break to rest and rejuvenate before continuing our journey the
following week.
• Day15: Quality phase involved rigorous tests like waterproof and pressure tests
to ensure durability and reliability before further processing.
• Day16: Vinaygar Chathurthi, an official holiday.
• Day17: Final day at SEZ focused on the debugging phase. Manual workers
meticulously checked error-prone boards, addressing errors manually or through
machine correction.
• Day18: Intern placements swapped, moved to Domestic Tariff Area (DTA) via
cab. Explored DTA, familiarizing ourselves with production zones.
• Day19: Started Set-top box production journey, examining Jio Set-top box line
intricacies from assembly to quality assurance.
• Day20: Continued exploration with Airtel Set-top box line.
• Day21: Sunday break for interns to rest and recharge.
• Day22: Explored Tata Sky set-top box line within the entertainment sector,
delving into production intricacies.\
 • Day23: Continued immersion in the set-top box section, focusing on the Tata
Play set-top box line. Meticulously examined each step of production, delving into
manufacturing intricacies.
• Day24: Visited the automotive section, a highly secured area due to critical
nature of automotive production. Emphasized precision and strict protocols.
• Day25: Explored Titan Fastrack smartwatch line and MMM (YSD-Stop) lines in
the automotive section. Meticulously examined production steps, gaining insights
into automotive manufacturing.
• Day26: Transitioned to gaining theoretical knowledge from automotive workers,
focusing on the Work-in-Progress (WIP) process. Discussions deepened
understanding of production efficiency.
• Day27: Explored Material Received Acknowledged by Scanning (MVS) process
for inventory management in the automotive section.
• Day28: Sunday break for interns to rest and rejuvenate.
• Day29: Continued learning with further exploration of Material Received
Acknowledged by Scanning (MVS) process in the automotive section.
• Day30: Focused on Scrap (TML-Total Material Lost) and Scrap Transition
processes in automotive production. Explored effective waste management
strategies and resource optimization.
• Day31: Internship concluded with expressions of gratitude to workers who guided
us. Farewells exchanged, final reports submitted, and coats and sandals
returned. Carried with us valuable knowledge and experiences for future
endeavors.

Software or Hardware learnt/observed

The basic work flow for all components were:
• SMT (Surface Mount Technology),
• Testing
• Debugging (if necessary)
• Quality assurance
• FATP (Final Assembly, Test, and Packaging).
• Warehouse
Surface Mount Technology:
SMT stands for "Surface Mount Technology”. It is a method of electronic component
assembly in which the components are mounted directly onto the surface of a printed
circuit board (PCB) or other substrate. Unlike through-hole technology (THT), where
component leads are inserted into holes on the PCB, SMT components have small, flat
leads or pads that are soldered directly to the surface of the board. SMT has become
the dominant method for electronic component placement in modern electronics
manufacturing due to its smaller component sizes, higher component density, and
improved automated assembly capabilities.
Testing:
After the components are assembled on the bare PCB the board is subjected to testing.
• ICT (In-Circuit Test)
• FCT (Functional Circuit Test)
In-circuit Test: In-circuit testing (ICT) is a white-box test where an electrical probe
checks a populated PCB for shorts, opens, resistance, capacitance, and other critical
parameters to verify correct assembly. This can be done with a "bed of nails" fixture and
specialized equipment or a fixtureless ICT setup.
Functional Circuit Test: Functional Circuit Test (FCT) is a testing method employed to
assess the operational performance and integrity of printed circuit boards. Typically, this
test is conducted by test operators as part of the PCB production process, typically
following the assembly phase.
Debug:
Debugging in the manufacturing of electronic gadgets involves systematically identifying
and correcting flaws, mistakes, or operational problems in the devices, whether it occurs
during the production process or afterward. This process aims to precisely locate and
address issues that could impact the electronic gadgets’ functionality, efficiency, or
overall quality.
FATP:
FATP, short for "Final Assembly, Test, and Packaging," is a vital manufacturing phase,
encompassing various products, including electronics. It unites previously made
components and subsystems to craft the final product.
Concise breakdown of FATP:
• Final Assembly: This step merges all components, be they electronic,
mechanical, or others, to create the end product. Tasks include connecting
circuitry, installing components, and enclosing the product.
• Testing: Following assembly, the product undergoes rigorous testing to ensure
proper function and performance compliance. Varied tests, such as functional,
electrical, performance, and environmental, are conducted as necessary.
• Packaging: Products that pass tests are packaged for distribution or sale,
involving final packaging, labeling, and preparation for shipment or retail display.
FATP is pivotal in manufacturing, ensuring correct assembly, intended functionality, and
quality standards. It's especially vital for intricate products like electronics, where
multiple components converge to form a functional end product.
Warehouse:
Warehouses within the electronic manufacturing industry serve as central focal points
that enable the seamless and effective functioning of the production process through
the oversight of electronic components, materials, and finished products' storage,
arrangement, and distribution. Their significance lies in upholding quality standards,
minimizing production delays, and enhancing supply chain efficiency.

Processes involved in each phase:

SMT:
• Laser Printing: In SMT (Surface Mount Technology), laser printing is often used
for precise labeling and marking of electronic components and circuit boards.
• Board Scanning: Scanning boards ensures accurate, high-quality laser
markings, verifying compliance with design specs and enabling proper traceability
and component identification on the circuit board.
• Solder Paste Printing: Solder paste is applied to circuit boards through a stencil
to prepare for component placement and soldering.
• Red Glue dispenser: Red glue dispenser is used for precisely applying adhesive
to secure components on circuit boards during assembly.
• Solder Paste inspection: Solder paste inspection involves automated checks to
verify the quality and accuracy of solder paste deposits on circuit boards before
component placement and soldering.
• Pick and Place: Pick and place is an automated process where machines pick up
electronic components and accurately position them on circuit boards for
assembly.
• Pre- AOI: Pre-AOI (Automated Optical Inspection) refers to visual inspections and
quality checks conducted on circuit boards before the automated optical
inspection process to identify potential defects or issues.
• Reflow Oven: In the reflow oven, the crucial machine melts solder paste, creating
strong electrical connections between components and circuit boards during the
soldering process.
• AOI: AOI (Automated Optical Inspection) is a technology used for automated
visual inspection of printed circuit boards to detect defects and ensure quality
during the manufacturing process.
• Post AOI: Post-AOI refers to additional inspections or corrective measures taken
after automated optical inspection to address and rectify any identified defects or
issues on printed circuit boards.
• UV Glue Dispenser: UV glue dispenser is used to precisely apply ultraviolet-
curable adhesive for component bonding and securement during assembly.
• UV Curing Oven: UV curing oven is utilized to rapidly cure or harden ultraviolet-
curable materials, such as adhesives and coatings, for component bonding and
protection on printed circuit boards.
Testing:
After the components are assembled on the bare PCB the board is subjected to testing.
• ICT (In-Circuit Test)
• FCT (Functional Circuit Test)
Debugging: Debugging in the manufacturing of electronic gadgets involves
systematically identifying and correcting flaws, mistakes, or operational problems in the
devices, whether it occurs during the production process or afterward. This process
aims to precisely locate and address issues that could impact the electronic gadgets’
functionality, efficiency, or overall quality.

Quality Assurance: Which involves the process of testing the physical durability of the
product manufactured.
FATP:
• IC Programming: IC programming involves the customization of integrated
circuits by writing specific instructions or data onto them, typically as part of the
manufacturing process for electronic products.
• PCB panel to heat fixture: The PCB panel is loaded to heat fixture to protect the
PCB from heat when it is subjected to processes involving heat.
• Fix Main header on PCB
• Main header heat stake
• Unload PCB from heat stake pallet: The PCB is unloaded from the
• Link wave pallet to PCB panel: A "link wave pallet" is a tool or fixture used in
soldering processes like wave soldering to secure and transport printed circuit
boards (PCBs) through the soldering machine, ensuring proper soldering of
components on the PCB.
• API-L101: The L101 Resistor is preformed based on the customer’s requirement
and is inserted in the PCB through the holes.
• VI: The Board is visually inspected
• API-CY100: The CY100 capacitor is preformed based on the customer’s
requirement and is inserted in the PCB through the holes.
• RTV Glue: RTV glueing refers to the use of Room Temperature Vulcanizing
(RTV) adhesive for securing components or providing environmental protection in
electronic assemblies or modules.
• MI-C103: The C103 capacitor is manually inserted into the PCB board by a
worker.
• Pick and Place-CMC101: The CMC101 Choke is picked and placed by the
machine on the PCB.
• Pick and Place-T101: The T101 Transformer is picked and placed by the
machine on the PCB.
• MI-C104: The C104 capacitor is manually inserted into the PCB board by a
worker.
• MI-C204: The C204 capacitor is manually inserted into the PCB board by a
worker.
• VI: A visual inspection is conducted to ensure the correct placement of
components on the panels.
• Link Top Hat with Panel SN: The top hat is associated or correlated with the
panel's serial number for identification and tracking purposes.
• Flux Spray: The process of spraying flux involves applying a flux substance onto
the circuit boards to facilitate soldering during component attachment.
• Wave Soldering: Is used to solder electronic components on a circuit board by
passing it over a wave of molten solder.
• AOI: AOI (Automated Optical Inspection) is commonly conducted after wave
soldering to check for defects and soldering quality on the assembled circuit
boards.
• INT Test: INT (Intermediate) testing is carried out to assess the functionality and
quality of electronic assemblies during the manufacturing process, typically before
final assembly and packaging.
• De-panel: the depaneling process is performed after the INT (Intermediate) test
to separate individual circuit boards from a panel, preparing them for final
assembly and packaging.
• Inspection: The depaneled units are inspected.
• USW Cap: The USW (Ultrasonic Welding) caps are placed on the USB are to
protect it during the USW process.
• Place housing and Scan: Now the Housing is placed on the and scanned.
• RTV Glue to Housing: Now the glue is placed in the housing.
• Place PCBA inside Housing: Placing the housing and scanning typically
involves the assembly of housing or scanning process for traceability
• RTV (white) Glue: White RTV glue is a type of Room Temperature Vulcanizing
adhesive used for bonding or sealing electronic components and modules, often
chosen for its neutral color and electrical insulation properties.
• Cap is placed: Now the Top Cap is placed
• USW: In Final Assembly, Test, and Packaging (FATP), "Ultrasonic Welding" is a
joining process that uses high-frequency vibrations to bond or assemble
components in electronic devices, ensuring secure and precise connections.
• Testing: Testing is a quality assurance step to verify the integrity and functionality
of components or connections joined through ultrasonic welding.
• Auto load UTF: Unit to Fixture typically refers to the process of connecting and
securing a unit or device to a test fixture for the purpose of conducting various
tests, inspections, or measurements. This step is commonly seen in electronics
manufacturing and quality control processes to assess the performance and
functionality of electronic components or products.
• Pre-ATE: Pre-ATE refers to testing or inspection activities conducted before
Automated Test Equipment (ATE) is used to ensure that electronic units or
components meet initial quality and functionality requirements.
• Burning: The charger is burnt at 35 – 40 degrees Celsius for about 2 hours.
 • Hi-Pot Test: Hi-Pot test applies high voltage to electronic components to detect
insulation failures or electrical weaknesses, ensuring product safety, reliability,
and identifying potential issues.
• Final ATE: Final ATE refers to the last stage of Automated Test Equipment (ATE)
testing before a product is packaged, ensuring it meets quality and functional
criteria before shipping.
• SN Programming: SN Programming refers to the process of programming or
assigning unique Serial Numbers (SN) to electronic units or devices before they
are packaged and shipped to track and identify each product individually.
• Verification: Verification after Serial Number (SN) programming involves
confirming that the assigned SNs are accurate, correctly aligned with the product,
and properly recorded to ensure traceability and accurate identification of each
unit.
• Laser Marking: Laser marking is the process of using a laser beam to etch or
mark product identification information, such as serial numbers or barcodes, onto
the surface of electronic components or devices for tracking and traceability
purposes.
• CCD Inspection: CCD inspection refers to using Charge-Coupled Device
cameras to visually inspect electronic components or products for defects,
ensuring quality and adherence to specifications.
• Unloading: The chargers are unloaded
• Checking: They are checked and subjected to packing.
• Packing: Packing involves the final stage of preparing electronic products for
shipment by securely packaging them, often including labeling and
documentation, to ensure safe and efficient distribution to customers or end-
users. Then they are sent to the Warehouse.
Warehouse: Warehouses within the electronic manufacturing industry serve as central
focal points that enable the seamless and effective functioning of the production
process through the oversight of electronic components, materials, and finished
products' storage, arrangement, and distribution. Their significance lies in upholding
quality standards, minimizing production delays, and enhancing supply chain efficiency.
These were the software and the hardware we viewed. Most of the hardware part was
the SMT and FATP related which was common for most of lines.

Summary

Briefly describe your experience internship experience helped you in upgrading

your technical and behavioral skills

Exposure to Industry Equipment and Processes:

Understanding Manufacturing Processes: Observing and participating in the assembly
and testing of products like motherboards, set-top boxes, and smartwatches provided a
deep understanding of manufacturing processes.
Quality Control: Learning about quality testing procedures ensured you understood the
importance of product reliability and quality assurance.

Specialized Knowledge:
Specific Product Lines: Exploring specific product lines like Dell, Lenovo, Tata Sky, and
Jio set-top boxes gave you in-depth knowledge of their production requirements and
standards.
Automotive Manufacturing: Exploring the automotive section exposed you to the
intricacies of smartwatch and automotive component production, broadening your
understanding of these specialized fields.
Scrap and Inventory Management: Learning about scrap management and Material
Received Acknowledged by Scanning (MVS) processes provided insights into inventory
control and waste reduction strategies.

Technical Discussions and Training:

Interactions with Workers: Engaging in discussions with experienced workers and
supervisors likely provided valuable insights into real-world applications of technical
knowledge.
Theoretical Knowledge: Transitioning to theoretical learning about processes like Work-
in-Progress (WIP) and Scrap Transition further deepened your understanding of
production efficiency and waste management.
Troubleshooting: In the debugging phase, examining error-prone boards and
understanding how errors are addressed helped sharpen your troubleshooting skills.

Practical Applications:
Problem-Solving: Tackling real-world challenges, such as ensuring product quality and
efficiency, required problem-solving skills.
Precision and Accuracy: Witnessing the precision and accuracy of automated
machinery in action emphasized the importance of attention to detail.
Adherence to Protocols: Understanding the critical nature of automotive production
highlighted the importance of adhering to strict protocols and safety measures.

Soft Skills Enhancement:

Teamwork: Collaborating with fellow interns, discussing findings, and working on
projects likely improved your teamwork skills.
Communication: Interacting with various departments, from HR to manufacturing units,
honed your communication skills.
Adaptability: Navigating through different production areas, from electronics to
automotive, showcased your adaptability to diverse environments.

Comments for improvement:

Workplace Exposure: Experienced a professional environment, learning workplace

etiquette and norms.
Teamwork Understanding: Collaborated on projects, improving communication and
conflict resolution skills.
Technical Knowledge: Hands-on experience in SMT, testing, and assembly enhanced
technical skills.
Product Understanding: Explored laptop, set-top box, and smartwatch assembly,
deepening product knowledge.
Communication Skills: Enhanced professional communication through presentations
and discussions.
Adaptability: Navigated SEZ and DTA areas, showing flexibility in different work
environments.
Problem-Solving: Developed troubleshooting skills in debugging and process
improvements.
Process Familiarity: Learned industry-standard processes and machinery, improving
technical repertoire.
Professionalism: Gained insight into workplace culture, norms, and effective team
dynamics.
Career Readiness: These experiences provide a strong foundation for future education
or career pursuits in electronics manufacturing.