Isl 6423
Isl 6423
Pinouts
ISL6423 (HTSSOP)
TOP VIEW
VCC 1 28 CPSWIN
NC 2 27 CPSWOUT
FLT 3 26 CPVOUT
NC 4 25 EXTM
SGND 5 24 SDA
TCAP 6 23 SCL
ADDR0 7 22 TDOUT
ADDR1 8 21 TDIN
BYPASS 9 20 VO
PGND 10 19 NC
GATE 11 18 NC
VSW 12 17 AGND
NC 13 16 SELVTOP
CS 14 15 TXT
ISL6423 (QFN)
TOP VIEW
CPSWOUT
CPVOUT
CPSWIN
VCC
FLT
NC
24 23 22 21 20 19
SGND 1 18 EXTM
TCAP 2 17 SDA
ADDR0 3 16 SCL
ADDR1 4 15 TDOUT
BYPASS 5 14 TDIN
PGND 6 13 VO
7 8 9 10 11 12
SELVTOP
AGND
GATE
VSW
TXT
CS
Block Diagram
ISL6423
11 17 16 3 4 23
OLF/BCF
OVERCURRENT
ADDR1
ADDR0
FLT
SDA
SCL
COUNTER
PROTECTION
SELVTOP
LOGIC SCHEME 1 DCL
OUVF
PWM OC1
LOGIC
7 GATE
Q CLK1
S
SDA SCL ADDR0 OUVF
ADDR1
PGND ISELL&H THERMAL
6 OLF/BCF OTF SHUTDOWN
EN
I2C
ENT TTH
INTERFACE
CS ILIM1 - DCL
+
AMP VTOP VBOT
CS
9
SLOPE CLK1
OSC.
COMPENSATION BAND GAP
REF VOLTAGE
TDOUT BGV
15 DIV &
WAVE SHAPING
TXT -
+
TONE REF
DECODER VOLTAGE
TTH ADJ1
VREF1 INT
TDIN
14 TONE
TONE
INJ
CKT
VSW
8
MSEL1
VO
13
+
-
AGND
12
EXT TONE CKT
VCC ON CHIP
22 LINEAR
UVLO
SGND POR ENT1
1 SOFT-START
CPSWOUT
INT 5V
BYPASS
CPSWIN
CHARGE PUMP
EXTM
Page 3 of 16
SOFT-START
TCAP
TXT
EN1/EN2 CPVOUT
NOTE: 5 10 2 18 20 21 19
ISL6423
VIN
RTN
0
FLT BAR
EXTM
C29 R11 100
1n C25 47n SDA
C24
R12 100
1µF 0 SCL
L4 220µH
1 2
0
24
23
22
21
20
19
C15 0.22µF
D6
CPVOUT
SGND
FLT
VCC
CPSWIN
CPSWOUT
CMS06 R7 15
VLNB
1 18 C28 R23
C27 0.22µF SGND EXTM 0.1µF 10k
2 17
TCAP SDA
3 16 M6
ADDR0 U2 SCL
4 15 NDS356AP
ADDR1 ISL6423ER TDOUT
C23 C26 1µF 5 14
0 BYPASS TDIN D8
R10 6 13 R24
56µF PGND VO 1.5KE24
SELVTOP
18 4.7k
AGND
GATE
0
VSW
TXT
R13 4.7k
CS
0 Q4
C16 RTN
1
2
3
10n 2N2222A
7
8
9
10
12
11
R22
2 TPC6002 47k
Q2 R9
L5 470
TXT
15µH
R8 C21 TDOUT
0.1 100pF
6
5
4
1
SELVTOP
D7 CMS06
0 0
D5 L6 4.7µH
1 2 NOTE : SDA and SCL require pull up to the required logic level.
CMS06 C22 C18 C19 C20
56µF
Page 4 of 16
0 0 0 0
ISL6423
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For JC, the "case temp" location is the center of the exposed metal pad on the package underside.
4. The device junction temperature should be kept below +150°C. Thermal shut-down circuitry turns off the device if junction temperature exceeds
+150°C typically.
Electrical Specifications VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
VBOT = L, ENT = L, DCL = L, Iout = 12mA, unless otherwise noted. See software description section for I2C
access to the system.
SOFT-START
Dynamic Output Current Limiting IMAX DCL = 0, ISEL H = 0, ISEL L = 0 (Note 8) 275 305 345 mA
Dynamic Overload Protection Off Time TOFF DCL = 0, Output Shorted (Note 8) - 900 - ms
Electrical Specifications VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
VBOT = L, ENT = L, DCL = L, Iout = 12mA, unless otherwise noted. See software description section for I2C
access to the system. (Continued)
TONE OSCILLATOR
TONE DECODER
Tone Decoder Rx Threshold VRXth TXT = L & TTH = 0 (Note 9) 100 150 200 mV
Tone Decoder Tx Threshold VTXth TXT = H & TTH = 0 (Note 9) 400 450 500 mV
LINEAR REGULATOR
Input Current - 25 - A
Overcurrent Threshold VCS Static current mode, DCL = H 325 450 500 mV
ERROR AMPLIFIER
Open Loop Voltage Gain AOL - 88 - dB
PWM
Maximum Duty Cycle 90 93 - %
OSCILLATOR
Electrical Specifications VCC = 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
VBOT = L, ENT = L, DCL = L, Iout = 12mA, unless otherwise noted. See software description section for I2C
access to the system. (Continued)
THERMAL SHUTDOWN
FLT (released) VO = 6V - - 10 A
NOTES:
5. Internal digital soft-start.
6. EXTM, TXT and SELVTOP and addr 0/1 pins have 200k internal pulldown resistors.
7. On exceeding this backward current limit threshold for a period of 100µs, the device enters the dynamic current limit mode and the BCF I2C bit
is set. The dynamic current limit duty ratio during a back current fault is ON = 100µs/OFF = 5ms.
8. In the Dynamic current limit mode the output is ON for 20ms and OFF for 900ms, but remains continuously ON in the Static mode. When tone
is ON, the minimum current limit is 50mA lower than the values indicated in the table. While in the dynamic mode of current limit the overload
trip level is momentarily increased to 990mA during the 20ms ON time to facilitate recovery from overload conditions.
Tone Waveform
ENT
I2C
MSEL
I2C
EXTM
PIN
VOUT
PIN
22kHz 22kHz 22kHz 22kHz 22kHz 22kHz
Internal Tone
Internal Tone Returns to nominal VOUT ~1 period
External Tone
Tr = 10µs typ after the last EXTM rising edge
Tr = 10µs typ
T > 55µs;
NOTES:
9. The signal pin TXT changes the decoder threshold during tone transmit and receive. TTH allows threshold control through I2C.
10. The tone rise and fall times are not shown due to resolution of graphics. It is 10µs typical for 22kHz.
11. The EXTM pins have input thresholds of Vil(max) = 0.8V and Vih(min) = 1.7V
0.90 0.90
0.80 0.80
0.70 0.70
IOUT_max IOUT_max
0.60 0.60
IOUT_max (A)
IOUT_max (A)
0.50 0.50
0.40 0.40
0.30 0.30
0.20 0.20
0.10 0.10
0.00 0.00
0 20 40 60 80 0 20 40 60 80
TEMPERATURE (°C) TEMPERATURE (°C)
FIGURE 2. OUTPUT CURRENT DERATING (HTSSOP) FIGURE 3. OUTPUT CURRENT DERATING (4x4 QFN)
CS Current sense input; connect the sense resistor Rsc at this pin for desired peak overcurrent value for the boost FET. The
set peak limit is effective in the static mode current limit only (i.e., DCL = HIGH).
TCAP Capacitor for setting rise and fall time of the output voltage. Typical value is 0.1µF.
GATE This output drives the boost FET gate. The output is held low when VCC is below the UVLO threshold.
ADDR0 and ADDR1 Logic combination at the ADDR0 and 1 can select four different chip select addresses.
EXTM This pin can be used in two ways:
1) As an input for externally modulated Diseqc tone signal which is transferred to the symmetrically onto Vout
2) Alternatively apply a Diseqc modulation envelope which modulates an internal tone and then transfers it symmetrically
onto Vout.
FLT This is an open drain output from the controller. when the flt goes low it indicates that an over temperature, over load fault,
back current fault, UVLO, or an I2C reset condition has occurred. The processor should then look at the I2C register to get
the actual cause of the error. A high on the FLT indicates that the device is functioning normally.
CPVOUT, CPSWIN A 47n charge pump decoupling capacitor is to be connected to CPVOUT. Connect a 1.5n capacitor between CPSWIN and
CPSWOUT CPSWOUT.
SELVTOP When this pin is low the Vout is in the 13V/14V range selected by the I2C bit VBOT.
When this pin is high the 18V/19V range selected by the I2C bit VTOP. The Voltage select pin enable VSPEN I2C bit must
be set low for the SELVTOP pins to be active. Setting VSPEN high disables this pins and voltage selection will be done
using the I2C bits VBOT and VTOP only.
TDIN, TDOUT TDIN is the tone decoder input and TDOUT is the tone detector output. TDOUT is an open drain output.
However, there could be some cases in which a highly I2C Bus Interface for ISL6423
capacitive load on the output may cause a difficult start-up
(Refer to Philips I2C Specification, Rev. 2.1)
when the dynamic protection is selected. This can be solved
by initiating any power start-up in static mode (DCL = HIGH) Data transmission from main microprocessor to the ISL6423
and then switching to the dynamic mode (DCL = LOW) after and vice versa takes place through the two wire I2C bus
a predetermined interval. When in static mode, the OLF bit interface, consisting of the two lines SDA and SCL. Both
goes HIGH when the current clamp limit is reached and SDA and SCL are bidirectional lines, connected to a positive
returns LOW when the overload condition is cleared. The supply voltage via a pull up resistor. (Pull-up resistors to
OLF/BCF bit will be LOW at the end of initial power-on soft- positive supply voltage must be externally connected). When
start. In the static mode the output current through the linears the bus is free, both lines are HIGH. The output stages of
is limited to a 990mA typical. ISL6423 will have an open drain/open collector in order to
perform the wired-AND function. Data on the I2C bus can be
When a 19.3V line is connected onto a VOUT1 or 2 that has
transferred up to 100kbps in the standard-mode or up to
been set to 13.3V the linear will then enter a back current
400kbps in the fast-mode. The level of logic “0” and logic “1”
limited state. When a back current of greater than 125mA
is dependent of associated value of VDD as per electrical
typical is sensed at the lower FET of the linear for a period
specification table. One clock pulse is generated for each
greater that 100µs, the output is disabled for a period of 5ms
data bit transferred.
and the BCF bit is set. If the 19.3V remains connected, the
output will cycle through the ON = 100µs/OFF = 5ms. The Data Validity
output will recover when the fault is removed. The data on the SDA line must be stable during the HIGH
period of the clock. The HIGH or LOW state of the data line
Thermal Protection
can only change when the clock signal on the SCL line is
This IC is protected against overheating. When the junction
LOW. Refer to Figure 4.
temperature exceeds 150°C (typical), the step-up converter
and the linear regulator are shut off and the OTF bit of the
SR is set HIGH. When the junction is cooled down to +130°C
SDA
(typical), normal operation is resumed and the OTF bit is
reset LOW.
In over temperature conditions, the OTF flag goes HIGH and SCL
the I2C data will be cleared. The user may need to monitor DATA LINE CHANGE
the I2C enable bits and OTF flag continuously and enable STABLE OF DATA
DATA VALID ALLOWED
the chip, if I2C data is cleared. OTF conditions may also
make the OLF flags go HIGH, when high capacitive loads
FIGURE 4. DATA VALIDITY
are present or self-heating conditions occur at higher loads.
0 x 0 0 13.3
0 x 1 0 14.3
SCL
0 0 x 1 18.3 S P
START STOP
0 1 x 1 19.3
CONDITION CONDITION
1 0 0 x 13.3
FIGURE 5. START AND STOP WAVEFORMS
1 0 1 x 14.3
1 1 0 x 18.3
1 1 1 x 19.3
R, W R, W R, W R, W R, W R, W R, W R, W
Transmission Without Acknowledge
Avoiding detection of the acknowledgement, the SR3H SR3M SR3L DCL VSPEN X ISELH ISELL
microprocessor can use a simpler transmission; it waits one
clock without checking the slave acknowledging, and sends TABLE 6. CONTROL REGISTER (SR4)
the new data. R, W R, W R, W R, W R, W R, W R, W R, W
This approach, though, is less protected from error and SR4H SR4M SR4L EN VTOP VBOT
decreases the noise immunity.
Transmitted Data (I2C bus WRITE mode)
When the R/W bit in the chip is set to 0, the main
microprocessor can write on the system registers (SR2 thru
SR4) of the ISL6423 via I2C bus. These will be written by the
microprocessor as shown below. The spare bits of registers
can be used for other functions.
0 0 0 X X X X X SR1 is selected
0 0 1 X X X X X SR2 is selected
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
0 1 0 X X X X X SR3 is selected
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
0 1 1 1 X X 0 0 SR4 is selected
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
Received Data (I2C bus READ MODE) ADDR0 and ADDR1 Pins
The ISL6423 can provide to the master a copy of the system Connecting these pin to GND the chip I2C interface address
register information via the I2C bus in read mode. The read is 0001000, but, it is possible to choose between four
mode is Master activated by sending the chip address with different addresses by setting these pins to the logic levels
R/W bit set to 1. At the following Master generated clock bits, indicated in Table 11.
the ISL6423 issues a byte on the SDA data bus line (MSB
TABLE 11. ADDRESS PIN CHARACTERISTICS
transmitted first).
VADDR ADDR1 ADDR0
At the ninth clock bit the MCU master can:
VADDR-1 “0001000” 0 0
• Acknowledge the reception, starting in this way the
transmission of another byte from the ISL6423. VADDR-2 “0001001” 0 1
VADDR-3 “0001010” 1 0
• Not acknowledge, stopping the read mode
communication. VADDR-4 “0001011” 1 1
The read only bits of the register SR1 convey diagnostic
information about the ISL6423, as indicated in the Table 7.
OUVF Over and Under Voltage Fault status bit Input Filter 50ns
Spike reject
OLF Over Load Fault status bit
4X 2.5
4.00 A
20X 0.50
B PIN #1 CORNER
19 24 (C 0 . 25)
PIN 1
INDEX AREA 18 1
2 . 50 ± 0 . 15
4.00
13
(4X) 0.15
12 7
24X 0 . 4 ± 0 . 1 0.10 M C A B
TOP VIEW
24X 0 . 23 +- 0
0 . 07
. 05 4
BOTTOM VIEW
0.10 C
0 . 90 ± 0 . 1 C
BASE PLANE
( 3 . 8 TYP )
SEATING PLANE
SIDE VIEW
0.08 C
( 2 . 50 )
( 20X 0 . 5 )
C 0 . 2 REF 5
( 24X 0 . 25 )
0 . 00 MIN.
( 24X 0 . 6 ) 0 . 05 MAX.
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
N M28.173B
INDEX 28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
E 0.25(0.010) M B M
AREA
E1 INCHES MILLIMETERS
GAUGE
-B- PLANE SYMBOL MIN MAX MIN MAX NOTES
A - 0.047 - 1.20 -
1 2 3 A1 0.002 0.006 0.05 0.15 -
TOP VIEW L A2 0.031 0.051 0.80 1.05 -
0.25
0.010 b 0.0075 0.0118 0.19 0.30 9
0.05(0.002) SEATING PLANE
c 0.0035 0.0079 0.09 0.20 -
-A-
D A D 0.378 0.386 9.60 9.80 3
E1 0.169 0.177 4.30 4.50 4
-C-
A2 e 0.026 BSC 0.65 BSC -
c E 0.246 0.256 6.25 6.50 -
e A1
L 0.0177 0.0295 0.45 0.75 6
b 0.10(0.004)
N 28 28 7
0.10(0.004) M C A M B S
0° 8° 0° 8° -
P - 0.138 - 5.50 11
1 2 3
P1 - 0.118 - 3.0 11
Rev. 0 6/05
NOTES:
P1
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AET, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
N
3. Dimension “D” does not include mold flash, protrusions or gate
P
burrs. Mold flash, protrusion and gate burrs shall not exceed
BOTTOM VIEW 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact. (Angles in degrees)
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count and body size.