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Chapter 5: Carrier Transport Phenomena: Transport The Process by Which Charged Particles (Electrons

Carrier transport in semiconductors involves carrier drift and diffusion. Carrier drift is the movement of carriers due to an electric field, while diffusion is the flow of carriers from high concentration regions to low concentration regions. Carrier mobility is affected by scattering from phonons and ionized impurities, and decreases with increasing temperature or impurity concentration. The conductivity of a semiconductor depends on the carrier concentration and mobility. Designing resistors with specified resistance and current handling requires determining the appropriate doping concentration based on conductivity calculations.
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0% found this document useful (0 votes)
203 views32 pages

Chapter 5: Carrier Transport Phenomena: Transport The Process by Which Charged Particles (Electrons

Carrier transport in semiconductors involves carrier drift and diffusion. Carrier drift is the movement of carriers due to an electric field, while diffusion is the flow of carriers from high concentration regions to low concentration regions. Carrier mobility is affected by scattering from phonons and ionized impurities, and decreases with increasing temperature or impurity concentration. The conductivity of a semiconductor depends on the carrier concentration and mobility. Designing resistors with specified resistance and current handling requires determining the appropriate doping concentration based on conductivity calculations.
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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Microelectronics I

Chapter 5: Carrier Transport


Phenomena

Transport; the process by which charged particles (electrons


and holes) move
Microelectronics I

Understanding of electrical properties ( I-V characteristics)

Basic current equation;

I ∝ e⋅ µ ⋅ n⋅ E
e; electronic charged (constant, 1.6 x 10-19 C)
u; mobility ( figure of merit that reflect the speed)
n; carrier concentration
E; Electric field

Carrier concentration (electron, no and hole, po)


Chapter 4

Carrier transport (current)


 This chapter
Microelectronics I

Carrier Transport

“Drift” “Diffusion”
The movement of carrier due The flow of carrier due to density
to electric field (E) gradients (dn/dx)

electron divider
E
+ -

electron

V
Microelectronics I

5.1 Carrier Drift


Drift current density

Consider a positively charged hole,

When electric field, E, is applied, the hole accelerates

F = m*p a = eE
m*p; effective mass of hole, a; acceleration, e; electronic charge

However, hole collides with ionized impurity atoms and with thermally vibrating
lattice atom
Lattice atom

hole
E
Ionized impurity atom
Microelectronics I

Lattice atom

hole
E
Ionized impurity atom

Gain average drift velocity, vdp


Holes accelerates
due to E vdp = µ p E

µp; Hole mobility (unit; cm2/Vs)


Involves in collision
(“Scattering Process”) Describes how well a carrier move due to E
 Loses most of energy
Microelectronics I

Drift current density, Jdrf (unit; A/cm2) due to hole

J p|drf = epvdp
J p|drf = eµ p pE

Drift current density due to electron

J n|drf = eµ n nE

Total drift current;

J drf = e( µ n n + µ p p ) E

The sum of the individual electron and hole drift current densities
Microelectronics I

Mobility is important parameter to determine the conductivity of material

Mobility effects

eτ cp eτ cn
µp = µn =
m*p mn*

τ; mean time between collisions


If τ=10-15 s, in average, every 10-15 s, carrier involves in collision @ scattering

Two dominant scattering mechanism


1.Phonon or lattice scattering

2.Ionized scattering
Microelectronics I

1. Lattice scattering or phonon scattering

At temperature, T > 0 K, atoms randomly vibrate. This thermal vibrations cause a


disruption of the periodic potential function. This resulting in an interaction
between carrier and the vibrating lattice atoms.

Mobility due to lattice scattering, µL

µ L ∝ T −3 / 2

As temperature decreases, the probability of a scattering event decreases. Thus,


mobility increases
Microelectronics I

electron hole
Microelectronics I

2. Ionized Ion scattering

Coulomb interaction between carriers and ionized impurities produces scattering


or collusion. This alter the velocity characteristics of the carriers.

Mobility due to ionized ion scattering, µI

T 3/ 2
µL ∝
NI Total ionized impurity concentration

If temperature increases, the random thermal velocity of a carrier increases,


reducing the time the carrier spends in the vicinity of the ionized impurity center.
This causes the scattering effect decreases and mobility increases.
If the number of ionized impurity centers increases, then the probability of a
carrier encountering an ionized impurity centers increases, thus reducing
mobility
Microelectronics I
Microelectronics I

The net mobility is given by

1 1 1
= +
µ µL µI

Due to phonon scattering Due to ionized ion scattering


Microelectronics I

Conductivity

Drift current
electron
J drf = e( µ n n + µ p p) E = σE
hole
σ; conductivity [(Ω.cm)-1 ]

σ = e( µ n n + µ p p )
Function of electron and hole concentrations and mobolities

Ρ; resistivity [Ω.cm]

1 1
ρ= =
σ e( µ n n + µ p p )
Microelectronics I
Microelectronics I

Bar of semiconductor

L I
+
- V

Area, A

I V
Current density, J = Electric field, E =
A L

J = σE
Resistance, R is a function of resistivity, or
I V conductivity, as well as the geometry of the
=σ semiconductor
A L
 L   ρL 
V =  I =   I = IR
 σA   A 
Microelectronics I

Consider p-type semiconductor with an acceptor doping Na (Nd=0) in which Na>>ni

σ = e( µ n n + µ p p ) ≈ eµ n p
Assume complete ionization
1
σ ≈ eµ n N a ≈
ρ

Function of the majority carrier


Microelectronics I

ex.;
Consider compensated n-type Silicon at T=300 K with a conductivity of σ=16
(Ωcm)-1 and an acceptor doping concentration of 1017 cm-3 . Determine the donor
concentration and the electron mobility.

Solution;

At T=300 K, we can assume complete ionization. (Nd-Na >>ni)

σ ≈ eµ n n = eµ n ( N d − N a )
16 = (1.6 × 10 −19 ) µ n ( N d − 1017 )

To determine µn and Nd, we can use figure mobility vs. impurity concentration
with trial and error
10 20 = µ n ( N d − 1017 )
Microelectronics I

If Nd=2 x 1017 cm-3 , impurity


concentration, NI= Nd++Na-=3 x 1017
cm-3 . from the figure, µn= 510
cm2/Vs. so σ=8.16 (Ωcm)-1 .

If Nd=5 x 1017 cm-3 , impurity


concentration, NI= Nd++Na-=6x 1017
cm-3 . from the figure, µn= 325
cm2/Vs. so σ=20.8 (Ωcm)-1 .
Nd should be between 2 x 1017 and 5 x
1017 cm-3 . after trial and error.

Nd= 3.5 x 1017 cm-3


µn=400 cm2/Vs
σ= 16 (Ωcm)-1
Microelectronics I

Ex 2.; designing a semiconductor resistor with a specified resistance to


handle a given current density

A Si semiconductor at T=300 K is initially doped with donors at a concentration of


Nd=5 x 1015 cm-3 . Acceptors are to be added to form a compensated p-type
material. The resistor is to have a resistance of 10 kΩ and handle a current
density of 50 A/cm2 when 5 V is applied.

Solution;

When 5 V is applied to 10 kΩ resistor, the current, I

V 5
I= = 4 = 0.5mA
R 10
If the current density, J is limited to 50 A/cm2, the cross-sectional area, A is

I 0.5 ×10 −3
A= = = 10 −5 cm 2
J 50
Microelectronics I

Consider that electric field, E is limited to 100 V/cm. Then the length of the
resistor, L is
V 5
L= = = 5 × 10 − 2 cm
E 100
The conductivity, σ of the semiconductor is

L 5 × 10 −2
σ= = 4 = 0 .5( Ωcm ) −1

RA 10 × 10 −5
The conductivity of the compensated p-type semiconductor is

σ ≈ eµ p p = eµ p ( N a − N d )

Here, the mobility is function of total ionized impurity concentration Na+Nd


Microelectronics I

Using trial and error, if Na=1.25x1016 cm-3 , then Na+Nd=1.75x1016 cm-3 , and the
hole mobility, from figure mobility versus impurity concentration, is approximately
µp=410 cm2/Vs. The conductivity is then,

σ = eµ p ( N a − N d ) = 1.6 ×10 −19 × 410 × ((12.5 − 5) × 1015 ) = 0.492

This is very close to the value we need. From the calculation

L=5x10-2 cm
A=10-5 cm2
Na=1.25x1016 cm-3
Microelectronics I

Velocity Saturation

vd = µE
Drift velocity increase linearly with applied electric field.

At low electric field,


vd increase linearly
with applied E.
slope=mobility

At high electric field,


vd saturates
 Constant value
Microelectronics I

Carrier diffusion

Diffusion; process whereby particles from a region of high concentration toward


a region of low concentration.

Carrier divider
Electron concentration, n

Electron flux
 dn 
J nx|dif = (−e) Dn  − 
 dx 
Electron diffusion dn
current density J nx|dif = eDn
dx

Position x
Dn; electron diffusion coefficient
Microelectronics I

 dp 
J px|dif = eD p  − 
Hole centration, p

 dx 
Hole flux
dp
J px|dif = −eD p
dx
Hole diffusion
current density
Dp; hole diffusion coefficient
Position x

Diffusion coefficient; indicates how well carrier move as a result of


density gradient.
Microelectronics I

Total Current Density

Total Current
Density

Electron drift hole drift Electron diffusion hole diffusion


current current current current

1-D
J = J n|drf + J nx|dif + J p|drf + J px|dif
dn dp
J = enµ n E x + epµ p E x + eDn − eD p
dx dx
3-D

J = enµ n E + epµ p E + eDn ∇n − eD p ∇p


Microelectronics I

Mobility,µ; indicates how well carrier moves due to electrical field


Diffusion coefficient, D; how well carrier moves due to density gradient

Here, we derive relationship between mobility and diffusion


coefficient using nonuniformly doped semiconductor model

“Einstein relation”

Graded impurity distribution

EC
electron Energy-band diagram
EF

x Ev
nonuniformly doped semiconductor
x
Microelectronics I

EC Doping concentration decreases as x increases


Electron diffuse in +x direction
EF The flow of electron leaves behind positively
charged donor
Ev

Induce electrical field, Ex, given by


x
 kT  1 dN d ( x)
E x = −  …eq.1
 e  N d ( x) dx

Since there are no electrical connections, there is no current(J=0)

dN d ( x)
Electron current J = eµ n N d ( x) E x + eDn =0 …eq.2
dx
Microelectronics I

From eq.1 and 2,


Dn kT
=
µn e

Hole current must also be zero. We can show that

Dp kT
=
µp e

Dn D p kT
= =
µn µ p e

Diffusion coefficient and mobility are not independent parameters.


The relationship between this 2 parameter “Einstein relation”
Microelectronics I

The Hall effect

Using the effect, we can determine


The type of semiconductor
Carrier concentration
mobility
Magnetic field

Force on charged particle


in magnetic field (“Lorentz
force”)

F = qv × B

Applied electrical field


Microelectronics I

the Lorentz force on electron


and hole is in –y direction
There will be buildup of negative
charge (n-type) or positive charge
(p-type) at y=0
As a results, an electrical field
called “Hall field, EH” is induced.
Hall field produces “Hall voltage,
VH”

Polarity of VH is used to determine the type of semiconductor

In y-direction, Lorentz force will be balanced by force due to Hall field

VH
qv x × Bz = q (p-type)
W
VH = v xWBz
Microelectronics I

For p-type Ix
vx =
(ep)(Wd )

I x Bz
VH =
epd
I B
p= x z Can calculate the hole concentration in p-type
eVH d

For n-type I x Bz
VH = −
end Note that VH is negative for n-type
I B
n=− x z
eVH d
Microelectronics I

When we know the carrier concentration, we can calculate carrier mobility

Ix epµ p E x
=
J x = epµ p E x Wd L
IxL
µp =
epVxWd

Similar with n-type, mobility is determined from

IxL
µn =
enVxWd

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