Analog VLSI
Analog VLSI
by
Dr.Dibyendu Roy
Ph.D (IIT Kharagpur)
Transistor Types
Bipolar transistors
npn or pnp silicon structure
Small current into very thin base layer controls large
currents between emitter and collector
Base currents limit integration density
n+ n+
p+ p+
p bulk Si
n bulk Si
NMOS PMOS
NMOS Operation
• Body is commonly tied to ground (0 V)
• Drain is at a higher voltage than Source
• When the gate is at a low voltage:
– P-type body is at low voltage
– Source-body and drain-body “diodes” are OFF
– No current flows, transistor is OFF
Source Gate Drain
Polysilicon
SiO2
0
n+ n+
S D
p bulk Si
NMOS Operation Cont.
• When the gate is at a high voltage: Positive charge on gate
of MOS capacitor
– Negative charge is attracted to body under the gate
– Inverts a channel under gate to “n-type” (N-channel, hence
called the NMOS) if the gate voltage is above a threshold voltage
(VT)
– Now current can flow through “n-type” silicon from source
through channel to drain, transistor is ON
Source Gate Drain
Polysilicon
SiO2
1
n+ n+
S D
p bulk Si
PMOS Transistor
• Similar, but doping and voltages reversed
– Body tied to high voltage (VDD)
– Drain is at a lower voltage than the Source
– Gate low: transistor ON
– Gate high: transistor OFF
– Bubble indicates inverted behavior
Source Gate Drain
Polysilicon
SiO 2
p+ p+
n bulk Si
Power Supply Voltage
• GND = 0 V
• In 1980’s, VDD = 5V
• VDD has decreased in modern processes
– High VDD would damage modern tiny transistors
– Lower VDD saves power
• VDD = 3.3, 2.5, 1.8, 1.5, 1.2, 1.0,
• Effective power supply voltage can be lower
due
to IR drop across the power grid.
Digression: Silicon Semiconductors
Si Si Si
Si Si Si
Si Si Si
http://onlineheavytheory.net/silicon.html
Dopants
• Silicon is a semiconductor at room temperature
• Pure silicon has few free carriers and conducts poorly
• Adding dopants increases the conductivity drastically
• Dopant from Group V (e.g. As, P): extra electron (n-type)
• Dopant from Group III (e.g. B, Al): missing electron, called
hole (p-type)
Si Si Si Si Si Si
- +
+ -
Si As Si Si B Si
Si Si Si Si Si Si
p-n Junctions
• First semiconductor (two terminal) devices
• A junction between p-type and n-type
semiconductor forms a diode.
• Current flows only in one direction
p-type n-type
anode cathode
VLSI DESIGN
Functional specification
Functional verification
Logic design
Logic verification
Circuit design
Circuit verification
Physical design
Physical verification
Fabrication
Packaging and Testing
VLSI DESIGN
Source Drain
Metal
Oxide
n+ + + + + + + + n+
+ + + + + +
+ +
Substrate (P –type)
Accumulation [VGS<0]
VGS-Ve -
Gate
Source Drain
Metal
Oxide
n+ n+
+ + +
Depletion [0<VGS<Vt]
VGS-Ve +
Inversion
Gate
Source Drain
Metal
Oxide
n+ - - - - - - - n+
- - - - - -
[VGS>Vt]
- -
VGS-Ve ++
MOSFET I-Vs
ECE 663
Operation of a transistor
VSG > 0
n type operation
VSG
Gate VSD
Insulator
Source Drain
More Channel
electrons
Substrate
B B
G G
S S
The output characteristics plotted for few fixed values of for p-MOSFET and
n-MOSFET are shown next :
W VDS2
I DS n COx (VGS VT )VDS
L W 2 (VGS VDS )
2
2
I DS ( sat) n COx (VGS VT )
L 2
n W
COx VGS VT
2
2 L
constant
What’s Pinch off?
V0G V0G VG VG
0 0 0 VD
Now add in the drain voltage to drive a current. Initially you get an
increasing current with increasing drain bias
When you reach VDsat = VG – VT, inversion is disabled at the drain end
(pinch-off), but the source end is still inverted
The charges still flow, just that you can’t draw more current
with higher drain bias, and the current saturates
V0G V0G
0 0
VC (Y=0) = Vs=
0
VC (Y=L) = VDs
Getting the inverter output
ON
Gain
OFF
ECE 663
ID
gD 0
VD V
G
I D
nCi VG VT
w
gm
VG V L
D
ECE 663
Resistive load inverter
Resistive load inverter
Resistive load inverter
Resistive load inverter
Resistive load inverter
Resistive load inverter
Resistive load inverter
CMOS INVERTER
CMOS INVERTER
CMOS INVERTER
CMOS INVERTER
CMOS INVERTER
CMOS INVERTER
CMOS INVERTER
CMOS INVERTER
CMOS INVERTER
2
CMOS INVERTER
Also calculate the power rating of the MOS Transistor with load
resistance.